High-temperature integrated circuit in-situ test system and method

Abstract

The invention discloses an in-situ test system and method for a high-temperature integrated circuit, relates to the technical field of integrated circuit test, and aims to solve the problem that an existing high-temperature test method for the integrated circuit cannot accurately test electrical parameter performance at a target temperature. The system at least comprises a test socket, a constant temperature source, a heat insulation device, a test daughter board, a test mother board and automatic test equipment, an integrated circuit to be tested is mounted on the test daughter board through the test socket, and the heat insulation device is in contact connection with one surface, where the test socket is mounted, of the test daughter board and at least covers the test daughter board except the test socket; the constant-temperature source comprises a heat flow cover, the heat flow cover is buckled on the outer side of the test socket, and a closed space is formed by the heat flow cover and the heat insulation device; the test daughter board is plugged on the test mother board, and the test mother board is assembled on the automatic test equipment. The high-temperature integrated circuit in-situ test system provided by the invention is used for improving the accuracy of testing the electrical parameter performance of the integrated circuit in a high-temperature environment.

Description

Technical Field

[0001] This invention relates to the field of integrated circuit testing technology, and in particular to a high-temperature integrated circuit in-situ testing system and method. Background Technology

[0002] With the rapid development of fields such as aerospace exploration and crustal drilling, electronic systems are facing increasingly harsh high-temperature operating environments. Therefore, effective and reliable high-temperature testing during chip research and development and production is a crucial step in ensuring the safe operation of electronic systems in extreme environments. Current methods for high-temperature testing of integrated circuits include displacement testing and remote testing.

[0003] One method, the displacement test, involves placing batches of integrated circuit chips under test in a high-temperature environment, such as a high-temperature oven, for static baking at temperatures above 175°C. During testing, the oven is opened, and the heated chips are removed manually or by a robotic arm and quickly transferred to a test socket in an automated testing device at room temperature. Because the test is conducted during the cooling process after the chips have left the high-temperature environment, their temperature is in a continuous decline, causing the measured electrical performance parameters to fail to accurately reflect their characteristics under stable high-temperature conditions. Furthermore, manual operation involves unpredictable chip removal and transfer times, and the rapid process carries the risk of misplacement or chip drop.

[0004] Remote testing methods involve placing the integrated circuit chip under test (ICD) into a test socket, and then placing the entire assembly, including the test socket or test matching board, in a high-temperature environment such as a high-temperature oven for heating. The automated testing equipment is then placed in a room-temperature environment. The chip and testing equipment are connected inside and outside the oven via cables and ribbon cables, enabling the measurement of the chip's electrical performance parameters under high-temperature stable conditions. Traditional oven heating and cooling processes are very slow, severely limiting test throughput and increasing the testing cost per chip. The long cables and ribbon cables connecting the test chip and the testing system introduce significant parasitic capacitance, inductance, and resistance, leading to distortion of the test excitation signal and attenuation and reflection of the chip's output response signal. Consequently, the test results cannot accurately reflect the chip's performance under high-temperature conditions. Summary of the Invention

[0005] The purpose of this invention is to provide a high-temperature integrated circuit in-situ testing system and method to solve the problem that existing high-temperature testing methods for integrated circuits cannot accurately test the electrical parameter performance at the target temperature.

[0006] To achieve the above objectives, the present invention provides the following technical solution: In a first aspect, the present invention provides a high-temperature integrated circuit in-situ testing system, comprising at least: a test socket, a constant temperature source, a heat insulation device, a test daughter board, a test mother board, and an automatic testing device; The integrated circuit under test (ICD) is mounted on the test sub-board via the test socket. The heat insulation device is in contact with the side of the test sub-board where the test socket is mounted and at least covers the test sub-board except for the test socket. The constant temperature source includes a heat flow hood, which is fastened to the outside of the test socket, and the heat flow hood and the heat insulation device form a closed space. The test sub-board is inserted into the test motherboard, and the test motherboard is assembled on the automatic testing equipment. The constant temperature source provides a high-temperature environment with a target temperature for the enclosed space, and the automatic testing equipment performs electrical performance testing on the integrated circuit under test located in the high-temperature environment through the test motherboard and the test daughterboard.

[0007] Optionally, the system further includes a heat dissipation device integrated into the test motherboard. The heat dissipation device is in contact with the lower surface of the test daughterboard through a thermally conductive material. The heat dissipation device includes a metal heat sink, a heat sink fin, and a cooling fan. The first surface of the metal heat sink is in contact with the thermally conductive material, the heat sink fin is fixed to the second surface of the metal heat sink, the first surface and the second surface are arranged opposite to each other, and the cooling fan is fixed to the side of the heat sink away from the metal heat sink, with the air outlet of the cooling fan facing the test daughterboard.

[0008] Optionally, the system further includes a temperature control device, which includes a first thermocouple, a second thermocouple, a temperature control circuit, and a digital display screen. The temperature control circuit is connected to the first thermocouple, the second thermocouple, the digital display screen, and the cooling fan. The first thermocouple is attached to a target surface of the test socket, which is the surface of the test socket located in the enclosed space. The second thermocouple is attached to the bottom of the test sub-board. The first and second thermocouples are used for temperature acquisition, and the digital display screen is used to display the temperatures acquired by the first and second thermocouples. The temperature control circuit compares the temperature acquired by the second thermocouple with a temperature threshold, and when the temperature acquired by the second thermocouple is higher than the temperature threshold, it controls the cooling fan to turn on.

[0009] Optionally, the test socket, the test sub-board, and the test motherboard are all made of high-temperature resistant materials.

[0010] Optionally, the test socket is provided with a contact element for fixing the integrated circuit under test. The contact element is an alloy spring, and the body of the test socket is made of ceramic, thermosetting plastic, or high-performance engineering plastic.

[0011] Optionally, the heat insulation device is a fiberglass plastic board, an aerogel heat insulation pad, or a ceramic heat insulation block.

[0012] Compared with existing technologies, the present invention provides a high-temperature integrated circuit in-situ testing system, comprising at least: a test socket, a constant temperature source, a heat insulation device, a test daughter board, a test mother board, and an automatic testing device; the integrated circuit under test is mounted on the test daughter board via the test socket, the heat insulation device is in contact with the side of the test daughter board on which the test socket is mounted, and at least covers the test daughter board excluding the test socket; the constant temperature source includes a heat flow hood, which is fastened to the outside of the test socket, and the heat flow hood and the heat insulation device form a closed space. This closed space is small in size and can be rapidly heated to 175 degrees Celsius or above and maintained by the constant temperature source; the test daughter board is inserted into the test mother board, and the test mother board is assembled on the automatic testing device; the constant temperature source provides a high-temperature environment with a target temperature for the closed space, and the automatic testing device performs electrical performance testing on the integrated circuit under test located in the high-temperature environment through the test mother board and the test daughter board. This solution utilizes a constant temperature source to provide a heat flow hood and a heat insulation device to form a closed space. The constant temperature source can rapidly heat the integrated circuit under test (ICD) to the target temperature, achieving a heating efficiency far exceeding that of traditional temperature chambers, thus improving testing efficiency. Furthermore, the ICD is mounted on a test daughterboard via a test socket, which is then plugged into a test motherboard. The test motherboard is then assembled onto the ICD. This system eliminates the need for long cables and ribbon cables, avoiding interference from cable and ribbon cable lengths and improving the accuracy of test data. The heat insulation device isolates the ICD from the high-temperature environment, the test daughterboard, the test motherboard, and other testing equipment, preventing the equipment from being affected by high temperatures. This allows for in-situ testing of the ICD at the target temperature for extended periods, avoiding temperature loss during ICD testing and further improving the accuracy of test data.

[0013] This invention also provides a high-temperature integrated circuit in-situ testing method, applied to the aforementioned high-temperature integrated circuit in-situ testing system, the method comprising: To obtain the target temperature required for the integrated circuit under test; Based on the target temperature, a high-temperature integrated circuit in-situ testing system is run to perform electrical performance testing on the integrated circuit under test.

[0014] Optionally, the step of running a high-temperature integrated circuit in-situ testing system based on the target temperature to perform electrical performance testing on the integrated circuit under test includes: The constant temperature source is used to heat the enclosed space to the target temperature. The operating temperature control device monitors and adjusts the temperature of the test socket and the bottom temperature of the test sub-board; The test program of the automated test equipment is used to test the integrated circuit under test and output the test results.

[0015] Optionally, the operating temperature control device monitors and adjusts the temperature of the test socket and the bottom temperature of the test sub-board, including: The temperature of the test socket is collected by the first thermocouple, and the bottom temperature of the test sub-board is collected by the second thermocouple. The temperature of the test socket is compared with the target temperature. When the temperature of the test socket is lower than the target temperature, the constant temperature source is controlled to heat until the temperature of the test socket reaches the target temperature. The bottom temperature of the test sub-board is compared with a temperature threshold. When the bottom temperature of the test sub-board is higher than the temperature threshold, the cooling fan is started or the fan power of the cooling fan is adjusted to dissipate heat from the test sub-board until the bottom temperature is less than or equal to the temperature threshold, at which point the cooling fan is turned off.

[0016] Optionally, the test program for running the automated test equipment tests the integrated circuit under test and outputs test results, and further includes the following steps beforehand: The connection voltage of the integrated circuit under test is monitored using automated testing equipment. When the connection voltage is stable, record the heating time, run the test program of the automatic test equipment to test the integrated circuit under test, and output the test results.

[0017] Compared with the prior art, the beneficial effects of the high-temperature integrated circuit in-situ testing method provided by the present invention are the same as the beneficial effects of the high-temperature integrated circuit in-situ testing system described in the above technical solution, and will not be repeated here. Attached Figure Description

[0018] The accompanying drawings, which are included to provide a further understanding of the invention and form part of this invention, illustrate exemplary embodiments of the invention and are used to explain the invention, but do not constitute an undue limitation of the invention. In the drawings: Figure 1 A side view of a high-temperature integrated circuit in-situ testing system provided by the present invention; Figure 2 A top view of the system provided by the present invention, excluding the automatic testing equipment; Figure 3 A bottom view of the system provided by this invention, excluding the automatic testing equipment; Figure 4The flowchart illustrates a high-temperature integrated circuit in-situ testing method provided by this invention.

[0019] Figure label: 100-Constant temperature source, 101-Heat flow hood, 102-Heater, 110-Test socket, 111-Insulation device, 112-Test daughterboard, 113-Test motherboard, 114-Thermal conductive material, 120-Automatic testing equipment, 130-Temperature control device, 131-First thermocouple, 132-Second thermocouple, 133-Temperature control circuit, 140-Heat dissipation device, 141-Cooling fan, 142-Heat sink. Detailed Implementation

[0020] To make the technical problems to be solved, the technical solutions, and the beneficial effects of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and are not intended to limit the present invention.

[0021] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0022] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified. "Several" means one or more, unless otherwise explicitly specified.

[0023] In the description of this invention, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0024] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0025] Before introducing the embodiments of the present invention, the relevant terms involved in the embodiments of the present invention are first defined as follows: ATE, or Automatic Test Equipment, is a standardized testing system controlled by a computer that can automatically generate, transmit, acquire, analyze, and determine the results of signals from electronic devices and systems. It is primarily used to address the needs for efficient, accurate, and repeatable testing during the mass production phase of the electronics industry and is a core piece of equipment in the semiconductor and electronics manufacturing fields.

[0026] The current mainstream methods for high-temperature testing of integrated circuits are displacement testing and remote testing, which have the following problems: 1. Significant temperature loss occurs during integrated circuit chip testing, making it impossible to accurately test electrical parameters at target temperatures, such as above 175 degrees Celsius. 2. Signal transmission is easily interfered with by factors such as cable and ribbon cable length during testing, resulting in low accuracy of test data. 3. The heating time for the integrated circuit chip under test is long, leading to low testing efficiency. 4. High-performance automatic testing equipment, its test boards, and test sockets cannot operate at target temperatures of 175°C and above for extended periods, making in-situ testing impossible.

[0027] To address the aforementioned problems, this invention provides a high-temperature integrated circuit in-situ testing system and method, which will be described below with reference to the accompanying drawings.

[0028] Please see Figures 1-2This invention provides a high-temperature integrated circuit in-situ testing system, comprising: a constant temperature source 100, a test socket 110, a heat insulation device 111, a test daughter board 112, a test mother board 113, an automatic testing device 120, a temperature control device 130, and a heat dissipation device 140. The integrated circuit under test (ICP-T) is mounted on the test daughter board 112 via the test socket 110. The heat insulation device 111 is in contact with the side of the test daughter board 112 where the test socket is mounted, and at least covers the test daughter board 112 except for the test socket. The heat insulation device 111 is used to isolate the heat generated by the constant temperature source, protecting the test daughter board 112, the test mother board 113, and the automatic testing device 120 from high-temperature effects during the high-temperature in-situ testing of the IC-T. The heat dissipation device 140 is used to heat the test daughter board 112. Heat dissipation; the constant temperature source 100 can be a heat flow hood type air heating device or a closed contact heating device. When the constant temperature source 100 is a heat flow hood type air heating device, the constant temperature source 100 includes a heat flow hood 101 and a heater 102. The heater 102 is set inside the heat flow hood 101. The heat flow hood 101 is a cylindrical hollow shell. The bottom of the heat flow hood 101 is provided with an opening. The size of the opening is adapted to the test socket. The heat flow hood 101 is fastened to the outside of the test socket 110, and the heat flow hood 101 and the heat insulation device 111 form a closed space. The heat flow hood of the constant temperature source of different sizes can be replaced according to the packaging form of the integrated circuit under test and the shape of the test socket. The test daughter board 112 is inserted into the test mother board 113. The test mother board 113 is assembled on the automatic test equipment 120.

[0029] In practical work, the heater 102 of the constant temperature source 100 provides a stable high-temperature environment with the target temperature for the enclosed space, and the automatic test equipment 120 performs electrical performance tests on the integrated circuit under test located in the high-temperature environment through the test motherboard and the test daughterboard.

[0030] The test socket, test daughter board, and test mother board in the above structure are all made of high-temperature resistant materials. Specifically, the test daughter board can be made of high-temperature resistant material, such as high-performance epoxy resin; the test socket is equipped with contacts for fixing the integrated circuit under test, and the contacts are alloy springs; the body of the test socket is made of ceramic, thermosetting plastic, or high-performance engineering plastic, capable of withstanding temperatures up to 300℃; the test mother board can also be made of high-temperature resistant material, such as high-performance epoxy resin.

[0031] The heat insulation device in the above structure can be a fiberglass plastic board, an aerogel heat insulation pad, or a ceramic heat insulation block.

[0032] The thermally conductive material in the above structure is the connecting material between the test sub-board and the heat dissipation device, and thermally conductive silicone or thermally conductive grease can be selected.

[0033] The test motherboard in the above structure is a general-purpose core carrier and resource allocation hub. It is used to distribute the excitation signals, power supply voltages, and feedback signals to be collected from the ATE host to the test daughterboard interfaces according to a preset route. Simultaneously, it enables communication with the ATE main control unit, receiving test commands and transmitting test data. The test motherboard integrates standardized daughterboard slots, providing a unified mechanical fixing and electrical connection benchmark for different models of test daughterboards, ensuring quick plug-and-play replacement and improving the versatility of the test system. The test sockets installed on the test daughterboards are designed according to the package form, pin definition, and pin number of the integrated circuit under test (ICD). They enable precise electrical connection with the ICD and, based on the operating characteristics of the ICD, perform signal level conversion, signal type conversion, and signal driving capability enhancement, ensuring that the ICD can normally receive excitation signals and feed back valid signals.

[0034] As an alternative, the heat dissipation device 140 is integrated into the test motherboard 113 and extends through the test motherboard 113 along its thickness direction. The heat dissipation device 140 is in contact with the lower surface of the test daughterboard 112 through a thermally conductive material 114. The lower surface of the test daughterboard 112 is the side opposite to the side where the test socket is installed. The heat dissipation device 140 includes a metal heat sink (not shown in the figure), a heat sink 142, and a cooling fan 141. The first surface of the metal heat sink is in contact with the thermally conductive material. The heat sink 142 is fixed to the second surface of the metal heat sink. The first and second surfaces are arranged opposite to each other. The cooling fan 141 is fixed to the side of the heat sink 142 away from the metal heat sink, and the air outlet of the cooling fan 141 faces the test daughterboard 112.

[0035] Among them, the metal heat sink is made of copper plate with good heat dissipation performance, and the heat sink is made of copper heat sink; the cooling fan is a high-power fan to improve the heat dissipation efficiency of the structure outside the heating area of ​​the integrated circuit under test, and ensure the long-term efficient and stable operation of the system.

[0036] As an optional approach, the temperature control device 130 includes a first thermocouple 131, a second thermocouple 132, a temperature control circuit 133, and a digital display screen. The temperature control circuit 133 is disposed on the upper surface of the test motherboard. Both the first thermocouple 131 and the second thermocouple 132 may include multiple thermocouples. The temperature control circuit 133 is connected to the first thermocouple 131, the second thermocouple 132, the digital display screen, and the cooling fan 141. The digital display screen and the temperature control circuit are integrated on the same circuit board. The contact point of the first thermocouple 131 is located on the target surface of the test socket 110, which is the surface of the test socket 110 located in the enclosed space. The contact point of the second thermocouple 132 is located at the bottom of the test daughterboard 112, which can be the lower surface of the test daughterboard or a position within a preset distance from the lower surface, such as... Figure 1As shown, the second thermocouple 132 can be placed on the surface of the heat dissipation device; the first thermocouple 131 and the second thermocouple 132 are used for temperature acquisition, and the digital display screen is used to display the temperature acquired by the first thermocouple 131 and the second thermocouple 132; the temperature control circuit 133 is used to compare the temperature acquired by the second thermocouple with a temperature threshold, and when the temperature acquired by the second thermocouple is higher than the temperature threshold, the cooling fan 141 is controlled to turn on.

[0037] like Figure 3 As shown, the temperature control device monitors the temperature of the test socket through a first thermocouple and the bottom temperature of the test sub-board through a second thermocouple. Simultaneously, it displays the temperature of the test socket and the bottom temperature of the test sub-board digitally. Furthermore, by setting a temperature threshold, it determines the bottom temperature of the test sub-board. If the temperature at the bottom of the test sub-board exceeds the temperature threshold, a temperature alarm is triggered. Additionally, the temperature control device can control the cooling fan by starting, stopping, and adjusting its power based on the actual monitored temperature.

[0038] Figure 1 The aforementioned system utilizes a heat flow hood provided by a constant temperature source and a closed space formed by a heat insulation device. This constant temperature source allows for rapid heating of the integrated circuit under test (ICD) to the target temperature, achieving a heating efficiency far exceeding that of traditional temperature chambers, thus improving testing efficiency. Furthermore, the ICD is mounted on a test daughterboard via a test socket, which is then plugged into a test motherboard. The test motherboard is then assembled onto the ICD. This system eliminates the need for long cables and ribbon cables, avoiding interference from cable and ribbon cable lengths and improving the accuracy of test data. The heat insulation device isolates the ICD from the high-temperature environment, test daughterboard, test motherboard, and automated testing equipment, preventing the testing equipment from being affected by high temperatures. This allows for long-term in-situ testing of the ICD in a high-temperature environment, avoiding temperature loss during ICD testing and further improving the accuracy of test data.

[0039] See Figure 4 This invention also provides a high-temperature integrated circuit in-situ testing method, applied to a high-temperature integrated circuit in-situ testing system, such as... Figure 4 As shown, the method includes the following steps: Step 410: Obtain the target temperature required for the integrated circuit under test; Before conducting the test, the following tasks need to be completed: S1: System assembly, assembling the high-temperature integrated circuit in-situ testing system according to... Figure 1 It is assembled and connected to the automated testing equipment in a certain way.

[0040] S2: Temperature control settings, such as setting the cooling fan to start when the temperature at the bottom of the test board exceeds the temperature threshold by 100°C, and automatically adjusting the cooling fan speed according to the deviation between the temperature at the bottom of the test board and the temperature threshold.

[0041] Step 420: Based on the target temperature, run the high-temperature integrated circuit in-situ testing system to perform electrical performance testing on the integrated circuit under test.

[0042] Specifically, first, the constant temperature source is controlled to heat the enclosed space to the target temperature; then, the temperature control device is run to monitor and adjust the temperature of the test socket and the bottom temperature of the test sub-board; finally, the test program of the automatic test equipment is run to test the integrated circuit under test and output the test results.

[0043] To ensure stable heating temperature, the connection voltage of the integrated circuit under test can be monitored by an automatic testing device. When the connection voltage remains stable for 30 seconds, the test program of the automatic testing device is run to test the integrated circuit under test, output the test results, and record the heating time. By editing the test program of the automatic testing device, a heating time waiting period can be added before the start of subsequent test processes. The heating time can be appropriately increased as needed to balance the time deviation of personnel operating the constant temperature source.

[0044] As an optional approach, the operating temperature control device monitors and adjusts the temperature of the test socket and the bottom temperature of the test sub-board, specifically including the following steps: S21: The temperature of the test socket is collected by the first thermocouple, and the bottom temperature of the test sub-board is collected by the second thermocouple; S22: Compare the temperature of the test socket with the target temperature. When the temperature of the test socket is lower than the target temperature, control the constant temperature source to heat until the temperature of the test socket reaches the target temperature. S23: Compare the bottom temperature of the test sub-board with the temperature threshold. When the bottom temperature of the test sub-board is higher than the temperature threshold, start the cooling fan or adjust the fan power of the cooling fan to dissipate heat from the test sub-board until the bottom temperature is less than or equal to the temperature threshold, then control the cooling fan to turn off.

[0045] As an optional approach, this method can perform batch testing of integrated circuits under test. Specifically, the integrated circuits under test are loaded sequentially, the constant temperature source is started, and the test program of the automatic test equipment is run. After the test program is completed, the constant temperature source is operated to cool down the integrated circuits under test. The temperature can be lowered to the test temperature required for the next integrated circuit under test according to the actual situation, and then the next integrated circuit under test is replaced. The cooling time can be recorded during the process, which is convenient for batch testing.

[0046] The core of this method lies in improving the efficiency of high-temperature integrated circuit testing and reducing the complexity of manual operation. A constant temperature source can rapidly heat the integrated circuit under test to the target temperature, with a heating efficiency far exceeding that of traditional temperature chambers. By determining the temperature stabilization time of the integrated circuit under test within the system, the program waiting time of the automated testing equipment can be set, enabling automatic timed testing. By setting the temperature monitoring threshold of the temperature control module, automatic programmable adjustment of heat dissipation and over-temperature alarms are achieved, simplifying manual operation and improving testing efficiency.

[0047] In the description of the above embodiments, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0048] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A high-temperature integrated circuit in-situ testing system, characterized in that, At least include: testing Sockets, constant temperature sources, heat insulation devices, test daughter boards, test mother boards, and automatic testing equipment; The integrated circuit under test (ICD) is mounted on the test sub-board via the test socket. The heat insulation device is in contact with the side of the test sub-board where the test socket is mounted and at least covers the test sub-board except for the test socket. The constant temperature source includes a heat flow hood, which is fastened to the outside of the test socket, and the heat flow hood and the heat insulation device form a closed space. The test sub-board is inserted into the test motherboard, and the test motherboard is assembled on the automatic testing equipment. The constant temperature source provides a high-temperature environment with a target temperature for the enclosed space, and the automatic testing equipment performs electrical performance testing on the integrated circuit under test located in the high-temperature environment through the test motherboard and the test daughterboard.

2. The high-temperature integrated circuit in-situ testing system according to claim 1, characterized in that, The system also includes a heat dissipation device integrated into the test motherboard. The heat dissipation device is in contact with the lower surface of the test daughterboard through a thermally conductive material. The heat dissipation device includes a metal heat sink, a heat sink fin, and a cooling fan. The first surface of the metal heat sink is in contact with the thermally conductive material, the heat sink fin is fixed to the second surface of the metal heat sink, the first surface and the second surface are arranged opposite to each other, and the cooling fan is fixed to the side of the heat sink away from the metal heat sink, with the air outlet of the cooling fan facing the test daughterboard.

3. The high-temperature integrated circuit in-situ testing system according to claim 2, characterized in that, The system also includes a temperature control device, which comprises a first thermocouple, a second thermocouple, a temperature control circuit, and a digital display screen. The temperature control circuit is connected to the first thermocouple, the second thermocouple, the digital display screen, and the cooling fan. The first thermocouple is attached to a target surface of the test socket, which is the surface of the test socket located in the enclosed space. The second thermocouple is attached to the bottom of the test sub-board. The first and second thermocouples are used for temperature acquisition, and the digital display screen is used to display the temperatures acquired by the first and second thermocouples. The temperature control circuit is used to compare the temperature collected by the second thermocouple with a temperature threshold. When the temperature collected by the second thermocouple is higher than the temperature threshold, the cooling fan is controlled to turn on.

4. The high-temperature integrated circuit in-situ testing system according to claim 2, characterized in that, The test socket, the test sub-board, and the test motherboard are all made of high-temperature resistant materials.

5. The high-temperature integrated circuit in-situ testing system according to claim 1, characterized in that, The test socket is provided with a contact element for fixing the integrated circuit under test. The contact element is an alloy spring, and the body of the test socket is made of ceramic, thermosetting plastic or high-performance engineering plastic.

6. The high-temperature integrated circuit in-situ testing system according to claim 1, characterized in that, The heat insulation device is a fiberglass plastic board, an aerogel heat insulation pad, or a ceramic heat insulation block.

7. A method for in-situ testing of high-temperature integrated circuits, characterized in that, The method, applied to the high-temperature integrated circuit in-situ testing system according to any one of claims 1-6, comprises: To obtain the target temperature required for the integrated circuit under test; Based on the target temperature, a high-temperature integrated circuit in-situ testing system is run to perform electrical performance testing on the integrated circuit under test.

8. The high-temperature integrated circuit in-situ testing method according to claim 7, characterized in that, The step of running the high-temperature integrated circuit in-situ testing system based on the target temperature to perform electrical performance testing on the integrated circuit under test includes: The constant temperature source is used to heat the enclosed space to the target temperature. The operating temperature control device monitors and adjusts the temperature of the test socket and the bottom temperature of the test sub-board; The test program of the automated test equipment is used to test the integrated circuit under test and output the test results.

9. The high-temperature integrated circuit in-situ testing method according to claim 8, characterized in that, The operating temperature control device monitors and adjusts the temperature of the test socket and the bottom temperature of the test sub-board, including: The temperature of the test socket is collected by the first thermocouple, and the bottom temperature of the test sub-board is collected by the second thermocouple. The temperature of the test socket is compared with the target temperature. When the temperature of the test socket is lower than the target temperature, the constant temperature source is controlled to heat the socket until the temperature of the test socket reaches the target temperature. The bottom temperature of the test sub-board is compared with a temperature threshold. When the bottom temperature of the test sub-board is higher than the temperature threshold, the cooling fan is started or the fan power of the cooling fan is adjusted to dissipate heat from the test sub-board until the bottom temperature is less than or equal to the temperature threshold, at which point the cooling fan is turned off.

10. The high-temperature integrated circuit in-situ testing method according to claim 7, characterized in that, The test program for the automated test equipment tests the integrated circuit under test and outputs the test results. Prior to this, it also includes: The connection voltage of the integrated circuit under test is monitored using automated testing equipment. When the connection voltage is stable, record the heating time, run the test program of the automatic test equipment to test the integrated circuit under test, and output the test results.

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