Conducting hole copper thickness processing device for circuit board manufacturing

Abstract

The invention discloses a via hole copper thickness processing device for circuit board manufacturing in the technical field of circuit board manufacturing, and the via hole copper thickness processing device comprises an electroplating pool and two groups of mounting plates, and one group of mounting plates comprises two mounting plates which are arranged in parallel; when copper plating is carried out on the circuit board, electroplating liquid in an electroplating pool is drained into a via hole in the surface of the circuit board through a telescopic cylinder, a drainage cylinder, an arc-shaped drainage blade and a spiral drainage blade, contact between the electroplating liquid and the surface of the inner wall of the via hole is increased, and it is guaranteed that the electroplating liquid in the via hole can circulate; a copper layer in the via hole is gradually thickened, the thicker copper layers at the two ends of the via hole are polished through a polishing ring, when the copper layer in the middle of the interior of the via hole reaches a certain thickness, an electric air cylinder shrinks under the action of a detection block, and a drainage cylinder moves out of the via hole; and a copper layer electroplated in the via hole can be kept uniform and can meet the standard.

Description

Technical Field

[0001] This invention relates to the field of circuit board manufacturing technology, specifically to a device for processing thick copper vias in circuit board manufacturing. Background Technology

[0002] Printed circuit boards, also known as PCBs, are carriers that enable electrical connections between electronic components. The production of PCBs is inseparable from copper-clad laminates, which are the core upstream raw materials for PCBs. After a series of processing steps, copper-clad laminates are made into PCBs. Through-hole electroplating is a very important step in the PCB manufacturing process. In order to provide electrical connections between conductive metals at different levels, copper with good conductivity needs to be plated on the walls of the through holes. The thickness of the through-hole electroplating layer has become one of the items for measuring the reliability of PCBs.

[0003] In the current process of manufacturing circuit boards, copper plating and electroplating are required to coat the surface of the circuit board and the interior of the vias. During electroplating, the plating solution is usually stored in an electroplating bath, and the circuit board is placed in the bath for plating. Only a small portion of the plating solution enters the vias, resulting in a thin copper layer forming inside the vias. Furthermore, during electroplating, more electric field lines accumulate at the edges of the vias (edge ​​effect during electroplating), making the copper layer plated at the edges of the vias thicker than that in the middle, thus preventing the formation of a uniform copper layer inside the vias. Summary of the Invention

[0004] The purpose of this invention is to provide a copper thickness processing apparatus for vias in circuit board manufacturing, so as to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a copper thickness processing device for vias in circuit board manufacturing, comprising an electroplating tank and two sets of mounting plates, one set of mounting plates comprising two parallel mounting plates, the electroplating tank being located between the two sets of mounting plates, a conveying mechanism for conveying the circuit board being provided between the two sets of mounting plates, the circuit board having multiple vias and multiple mounting holes on its surface, the electroplating tank having multiple drainage mechanisms inside, the drainage mechanisms being used to drain the electroplating solution in the electroplating tank into the vias, the drainage mechanism having a detection mechanism on its surface, the detection mechanism being used to detect the copper layer thickness at the middle position of the via, and the drainage mechanism having a polishing mechanism on its surface, the polishing mechanism being used to polish the thicker copper layer plated at both ends of the via.

[0006] As a further embodiment of the present invention, the conveying mechanism includes multiple conveying rollers and multiple sets of conveying wheels. The multiple conveying rollers are rotatably connected between two sets of mounting plates, and the multiple sets of conveying wheels are rotatably connected to the front and rear inner wall surfaces of the electroplating tank. The side of the electroplating tank closest to the two sets of mounting plates is inclined. The surfaces of the conveying rollers and conveying wheels are connected to a conveyor belt for transmission. The conveyor belt passes through the interior of the electroplating tank. The surface of the conveyor belt has multiple equally spaced square openings, and a receiving plate is fixedly connected to the four corners of the inner wall of each square opening.

[0007] As a further embodiment of the present invention, the diversion mechanism includes a telescopic cylinder and an underwater motor. The telescopic cylinder is rotatably connected to the bottom of the inner wall of the electroplating tank. Multiple water inlets are opened on the surface of the telescopic cylinder. Multiple arc-shaped diversion blades are fixedly connected to the surface of the telescopic cylinder. Multiple spiral diversion blades are fixedly connected to the inner wall surface of the telescopic cylinder. A diversion tube is fixedly connected to the upper end of the telescopic cylinder. The upper end of the diversion tube is sealed and the upper end of the diversion tube is conical. A heating rod is fixedly connected to the top of the inner wall of the diversion tube. Multiple water outlet holes are opened on the surface of the diversion tube. The underwater motor is fixedly connected to the bottom of the inner wall of the electroplating tank. The output shaft surface of the underwater motor and the surface of the telescopic cylinder are connected together by a drive belt.

[0008] As a further embodiment of the present invention, the detection mechanism includes multiple detection blocks, all of which are fixedly connected to the surface of the drainage tube. When the drainage tube is inside the through hole, the detection block is located in the middle of the through hole. When the detection block is squeezed, it emits an electrical signal. An electric cylinder for driving the drainage tube to move up and down is fixedly connected to the surface of the telescopic tube. The detection block is electrically connected to the electric cylinder, and the electric cylinder is electrically connected to an external controller.

[0009] As a further embodiment of the present invention, the grinding mechanism includes two grinding rings, both of which are fixedly connected to the surface of the guide tube. When the guide tube is inside the through hole, the two grinding rings are located at the edges of both ends of the through hole.

[0010] As a further embodiment of the present invention, a plurality of positioning flexible plates are fixedly connected to the bottom of the conveyor belt, and a guide groove is formed on the surface of each of the plurality of positioning flexible plates. The guide groove is recessed towards the position of the guide hole corresponding to the position of the guide hole. The two sides of the recessed position of the guide groove are inclined surfaces. A rotating ring is rotatably connected to the surface of the diversion cylinder, and the rotating ring is located in the guide groove.

[0011] As a further embodiment of the present invention, a plurality of drainage fan blades are fixedly connected to the surface of the drainage cylinder, and an annular filter cylinder is fixedly connected to the surface of the rotating ring, the filter cylinder being located below the drainage fan blades.

[0012] As a further embodiment of the present invention, a plurality of limiting blocks are elastically slidably connected inside the square opening. The limiting blocks are used to limit the perimeter of the circuit board, and the side of the limiting block closest to the circuit board is inclined.

[0013] As a further embodiment of the present invention, an L-shaped positioning rod is rotatably connected to the surface of the limiting block near the mounting hole.

[0014] As a further embodiment of the present invention, an L-shaped lifting plate is fixedly connected to the bottom of the limiting block, and the lifting plate is located below the circuit board.

[0015] Compared with the prior art, the beneficial effects of the present invention are:

[0016] 1. In the copper plating process of a circuit board, this invention utilizes a telescopic cylinder, a guide cylinder, an arc-shaped guide vane, and a spiral guide vane to guide the electroplating solution from the electroplating tank into the through-holes on the circuit board surface. This increases the contact between the electroplating solution and the inner wall surface of the through-holes, ensuring the flow of the electroplating solution inside the through-holes and enhancing the electroplating effect on the inner wall of the through-holes. It also prevents the electroplating solution inside the through-holes from remaining stagnant. During the electroplating process, the electroplating solution inside the through-holes contains fewer ions, making it difficult to achieve the required copper layer standard. Furthermore, the copper layer inside the through-holes may... The copper layer is gradually thickened. A polishing ring is used to polish the thicker copper layer at both ends of the via. When the copper layer in the middle of the via reaches a certain thickness, a detection block is used. When the detection block is squeezed by the copper layer to a certain extent, the detection block will be compressed by an electric cylinder, and the drain cylinder will be moved out of the via. This helps to ensure that the copper layer plated inside the via remains uniform and meets the standards. It avoids the situation where a uniform copper layer cannot be formed inside the via during the electroplating process, or the copper layer plated inside the via does not meet the production standards, thus affecting the subsequent use of the circuit board.

[0017] 2. In this invention, when the conveyor belt moves the circuit board, the conveyor belt will drive the positioning flexible plate to move together. When the guide cylinder moves into the guide hole, the guide cylinder will drive the rotating ring to move upward together. The rotating ring will move into the guide groove. Then the guide cylinder continues to move upward. The rotating ring will move upward under the guidance of the concave position of the guide groove. This is beneficial to ensure that the position of the guide cylinder inside the square opening is the same each time under the action of the guide groove. It avoids the position of the guide cylinder shifting when it moves, or the position of the conveyor belt shifting when it moves, which would affect the guide cylinder's inability to move into the guide hole.

[0018] 3. In this invention, when the copper layer inside the through hole reaches a certain thickness, the rotation of the flow guide cylinder will drive the grinding ring to rotate as well. The grinding ring will grind the thicker copper layer at both ends inside the through hole. During the rotation of the flow guide cylinder, the flow guide fan blades will also rotate, and the flow guide fan blades will guide the electroplating solution in the through hole downwards. The electroplating solution in the through hole and the grinding debris will move together into the filter cartridge. The filter cartridge will filter the debris in the electroplating solution into the filter cartridge, where it can be filtered and collected. This prevents the grinding debris from flowing with the electroplating solution and clogging the outlet hole, affecting the flow of the electroplating solution and the electroplating effect. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0020] Figure 2 This is a schematic diagram of the connection between the conveyor belt and the circuit board in this invention;

[0021] Figure 3 for Figure 2 Schematic diagram of the structure at point A in the middle;

[0022] Figure 4 This is a schematic diagram showing the connection relationship between the limiting block, the positioning rod, and the lifting plate in this invention;

[0023] Figure 5 This is a schematic diagram of the internal structure of the electroplating tank in this invention;

[0024] Figure 6 This is a schematic diagram of the electroplating tank and conveyor belt after being cut apart in this invention;

[0025] Figure 7 for Figure 6 Schematic diagram of the structure at point B;

[0026] Figure 8 This is a schematic diagram of the drainage mechanism in this invention;

[0027] Figure 9 for Figure 8 Schematic diagram of the structure at point C;

[0028] Figure 10 This is a schematic diagram of the drainage mechanism after it has been cut open in this invention.

[0029] The attached diagram lists the components represented by each number as follows:

[0030] 1. Electroplating tank; 2. Mounting plate; 3. Circuit board; 4. Through hole; 5. Mounting hole; 6. Conveying roller; 7. Conveying wheel; 8. Conveying belt; 9. Square opening; 10. Receiving plate; 11. Telescopic cylinder; 12. Underwater motor; 13. Water inlet; 14. Arc-shaped guide vane; 15. Spiral guide vane; 16. Guide cylinder; 17. Heating rod; 18. Water outlet; 19. Drive belt; 20. Detection block; 21. Electric cylinder; 22. Grinding ring; 23. Positioning flexible plate; 24. Guide groove; 25. Rotating ring; 26. Guide fan blade; 27. Filter cartridge; 28. Limiting block; 29. ​​Positioning rod; 30. Lifting plate. Detailed Implementation

[0031] Please see Figures 1-10 The present invention provides a technical solution: a copper thickness processing device for through holes in circuit board manufacturing, comprising an electroplating tank 1 and two sets of mounting plates 2. Each set of mounting plates 2 includes two parallel mounting plates 2. The electroplating tank 1 is located between the two sets of mounting plates 2. A conveying mechanism for conveying circuit boards 3 is provided between the two sets of mounting plates 2. The surface of the circuit board 3 is provided with multiple through holes 4 and multiple mounting holes 5. The electroplating tank 1 is provided with multiple diversion mechanisms, which are used to divert the electroplating solution in the electroplating tank 1 into the through holes 4. The surface of the diversion mechanism is provided with a detection mechanism, which is used to detect the copper layer thickness at the middle position of the through hole 4. The surface of the diversion mechanism is provided with a polishing mechanism, which is used to polish the thicker copper layer at both ends of the through hole 4.

[0032] The conveying mechanism includes multiple conveying rollers 6 and multiple sets of conveying wheels 7. The multiple conveying rollers 6 are rotatably connected between two sets of mounting plates 2. The multiple sets of conveying wheels 7 are rotatably connected to the front and rear inner wall surfaces of the electroplating tank 1. The side of the electroplating tank 1 closest to the two sets of mounting plates 2 is inclined. The conveying rollers 6 and the conveying wheels 7 are connected to a conveyor belt 8 for transmission. The conveyor belt 8 passes through the interior of the electroplating tank 1. The surface of the conveyor belt 8 has multiple equally spaced square openings 9. The four corners of the inner wall of the square openings 9 are fixedly connected to receiving plates 10.

[0033] The diversion mechanism includes a telescopic cylinder 11 and an underwater motor 12. The telescopic cylinder 11 is rotatably connected to the bottom of the inner wall of the electroplating tank 1. Multiple water inlets 13 are opened on the surface of the telescopic cylinder 11. Multiple arc-shaped diversion blades 14 are fixedly connected to the surface of the telescopic cylinder 11. Multiple spiral diversion blades 15 are fixedly connected to the inner wall surface of the telescopic cylinder 11. A diversion cylinder 16 is fixedly connected to the upper end of the telescopic cylinder 11. The upper end of the diversion cylinder 16 is sealed and the upper end of the diversion cylinder 16 is conical. A heating rod 17 is fixedly connected to the top of the inner wall of the diversion cylinder 16. Multiple water outlet holes 18 are opened on the surface of the diversion cylinder 16. The underwater motor 12 is fixedly connected to the bottom of the inner wall of the electroplating tank 1. The output shaft surface of the underwater motor 12 and the surface of the telescopic cylinder 11 are connected together by a drive belt 19.

[0034] The detection mechanism includes multiple detection blocks 20, which are fixedly connected to the surface of the drainage tube 16. When the drainage tube 16 is inside the through hole 4, the detection block 20 will be located in the middle of the through hole 4. When the detection block 20 is squeezed, it will emit an electrical signal. An electric cylinder 21 for driving the drainage tube 16 to move up and down is fixedly connected to the surface of the telescopic tube 11. The detection block 20 is electrically connected to the electric cylinder 21, and the electric cylinder 21 is electrically connected to an external controller.

[0035] The grinding mechanism includes two grinding rings 22, both of which are fixedly connected to the surface of the guide tube 16. When the guide tube 16 is inside the through hole 4, the two grinding rings 22 will be located at the two ends of the through hole 4.

[0036] When copper plating circuit board 3, it needs to be placed into the square opening 9 on the surface of conveyor belt 8. Circuit board 3 will be on the surface of receiving plate 10. Then, conveyor belt 8 will transport circuit board 3 into electroplating tank 1, where circuit board 3 will be immersed in electroplating solution. When conveyor belt 8 has transported circuit board 3 to the bottom of electroplating tank 1, conveyor belt 8 stops moving. External controller will activate electric cylinder 21 to extend, which will cause the guide tube 16 to move upward. Telescopic cylinder 11 will extend and move into through hole 4. Then, underwater motor 12 will drive telescopic cylinder 11 and guide tube 16 to rotate. The telescopic cylinder 11 drives the arc-shaped guide vane 14 and the spiral guide vane 15 to rotate together. The arc-shaped guide vane 14 guides the electroplating solution outside the telescopic cylinder 11 to the inlet 13. The electroplating solution enters the telescopic cylinder 11 through the inlet 13. The spiral guide vane 15 guides the electroplating solution inside the telescopic cylinder 11 upward, allowing the electroplating solution to flow upward into the guide cylinder 16 and be sprayed out through the outlet 18. This increases the contact between the electroplating solution and the inner wall surface of the through hole 4, ensuring the electroplating solution can flow inside the through hole 4, enhancing the electroplating effect on the inner wall of the through hole 4, and preventing the electroplating solution inside the through hole 4 from overflowing. During the electroplating process, the electroplating solution inside the via 4 contains relatively few ions, making it difficult for the copper layer inside the via 4 to meet the standard. The heating rod 17 can heat the electroplating solution during the flow process, increasing the electroplating efficiency. After a period of electroplating, the copper layer inside the via 4 will gradually thicken, with the copper layer near the edges at both ends of the via 4 being thicker. When the copper layer thickness at both ends of the via 4 reaches a certain level, the copper layer at both ends of the via 4 will gradually come into contact with the grinding ring 22. The grinding ring 22 will grind the thicker copper layer at both ends of the via 4, and then the copper layer inside the via 4 will be thickened. When the copper layer at the intermediate position reaches a certain thickness, the copper layer at the intermediate position of the via 4 will contact the detection block 20. When the detection block 20 is squeezed by the copper layer to a certain extent, the detection block 20 will send an electrical signal to activate the electric cylinder 21 to contract. The contraction of the electric cylinder 21 will drive the guide tube 16 to move downward. The guide tube 16 will move out of the via 4, which helps to ensure that the copper layer electroplated inside the via 4 can remain uniform and meet the standards. This avoids the situation where a uniform copper layer cannot be formed inside the via 4 or the copper layer electroplated inside the via 4 cannot meet the production standards during the electroplating process, thus affecting the subsequent use of the circuit board 3.

[0037] When the diversion cylinder 16 moves inside the guide hole 4, it is difficult for the diversion cylinder 16 to move accurately into the guide hole 4. As a further solution of the present invention, a plurality of positioning soft plates 23 are fixedly connected to the bottom of the conveyor belt 8. Each of the multiple positioning soft plates 23 has a guide groove 24 on its surface. The guide groove 24 is recessed towards the position of the guide hole 4 corresponding to the position of the guide hole 4. The two sides of the recessed position of the guide groove 24 are inclined. A rotating ring 25 is rotatably connected to the surface of the diversion cylinder 16. The rotating ring 25 is located in the guide groove 24.

[0038] When the conveyor belt 8 moves the circuit board 3, the conveyor belt 8 will drive the positioning flexible plate 23 to move together. When the diversion cylinder 16 moves into the guide hole 4, the diversion cylinder 16 will drive the rotating ring 25 to move upward together. The rotating ring 25 will move into the guide groove 24. Then the diversion cylinder 16 continues to move upward. The rotating ring 25 will move upward under the guidance of the recessed position of the guide groove 24. This is beneficial to ensure that the position of the diversion cylinder 16 inside the square opening 9 is the same each time under the action of the guide groove 24. This avoids the position of the diversion cylinder 16 shifting when it moves, or the position of the conveyor belt 8 shifting when it moves, which would affect the diversion cylinder 16 from moving into the guide hole 4.

[0039] When the polishing ring 22 polishes the copper layer inside the through hole 4, the polishing debris will accumulate at the bottom of the telescopic cylinder 11, affecting the flow of the electroplating solution into the telescopic cylinder 11. As a further solution of the present invention, a plurality of flow guide fan blades 26 are fixedly connected to the surface of the flow guide cylinder 16, and an annular filter cylinder 27 is fixedly connected to the surface of the rotating ring 25. The filter cylinder 27 is located below the flow guide fan blades 26.

[0040] When the copper layer inside the through hole 4 reaches a certain thickness, the rotation of the flow guide cylinder 16 will drive the grinding ring 22 to rotate as well. The grinding ring 22 will grind the thicker copper layer at both ends inside the through hole 4. During the rotation of the flow guide cylinder 16, the flow guide fan blade 26 will rotate as well. The flow guide fan blade 26 will guide the electroplating solution in the through hole 4 downward. The electroplating solution in the through hole 4 and the grinding debris will move together into the filter cartridge 27. The filter cartridge 27 will filter the debris in the electroplating solution inside the filter cartridge 27, and then it can be filtered and collected to prevent the grinding debris from flowing with the electroplating solution. The debris will block the water outlet 18, affecting the flow of the electroplating solution and the electroplating effect.

[0041] When the conveyor belt 8 transports the circuit board 3, the position of the circuit board 3 will shift during the movement. As a further solution of the present invention, a plurality of limiting blocks 28 are elastically slidably connected in the square opening 9. The limiting blocks 28 are used to limit the circuit board 3 around its perimeter. The side of the limiting block 28 near the circuit board 3 is inclined.

[0042] Before electroplating the circuit board 3, the limiting block 28 needs to be lifted upwards first, and then the circuit board 3 is placed between the limiting blocks 28. The limiting blocks 28 will limit the circuit board 3 around its perimeter, ensuring that the circuit board 3 is in the same position in the square through-hole 9 each time, thereby ensuring that the drain tube 16 can move into the through hole 4.

[0043] When the circuit board 3 is limited, the limiting block 28 can only limit and fix the circuit board 3. The circuit board 3 may still be slightly deflected. As a further solution of the present invention, an L-shaped positioning rod 29 is rotatably connected to the surface of the limiting block 28 near the mounting hole 5.

[0044] When limiting the circuit board 3, the positioning rod 29 is moved into the mounting hole 5, and then the limiting block 28 is used to limit the circuit board 3 to ensure that the through hole 4 on the surface of the circuit board 3 can be kept in the same position before each electroplating, thereby ensuring that the detection block 20 can be in the middle position of the through hole 4, avoiding slight displacement of the circuit board 3, which would cause uneven thickness of the copper layer produced by electroplating in the through hole 4, affecting subsequent use.

[0045] After the circuit board 3 is electroplated, it is not convenient to remove the circuit board 3 from the surface of the conveyor belt 8. As a further solution of the present invention, an L-shaped lifting plate 30 is fixedly connected to the bottom of the limiting block 28, and the lifting plate 30 is located below the circuit board 3.

[0046] After the electroplating of circuit board 3 is completed, the limiting block 28 is moved upward. The limiting block 28 will drive the positioning rod 29 and the lifting plate 30 to move upward together. After the positioning rod 29 moves out of the mounting hole 5, the limiting block 28 continues to move upward, and the lifting plate 30 will lift one side of the circuit board 3 to facilitate the removal of the circuit board 3.

Claims

1. A copper thickness processing apparatus for through holes in circuit board manufacturing, comprising an electroplating tank (1) and two sets of mounting plates (2), characterized in that: A set of mounting plates (2) includes two parallel mounting plates (2), the electroplating tank (1) is located between the two sets of mounting plates (2), and a conveying mechanism for conveying circuit boards (3) is provided between the two sets of mounting plates (2). The surface of the circuit board (3) is provided with multiple through holes (4) and multiple mounting holes (5). The electroplating tank (1) is provided with multiple diversion mechanisms, which are used to divert the electroplating liquid in the electroplating tank (1) to the inside of the through holes (4). The surface of the diversion mechanism is provided with a detection mechanism, which is used to detect the copper layer thickness at the middle position of the through hole (4). The surface of the diversion mechanism is provided with a polishing mechanism, which is used to polish the thicker copper layer at both ends of the through hole (4).

2. The via copper thickness processing device for circuit board manufacturing according to claim 1, characterized in that: The conveying mechanism includes multiple conveying rollers (6) and multiple sets of conveying wheels (7). The multiple conveying rollers (6) are rotatably connected between the two sets of mounting plates (2). The multiple sets of conveying wheels (7) are rotatably connected to the front and rear inner wall surfaces of the electroplating tank (1). The side of the electroplating tank (1) closest to the two sets of mounting plates (2) is inclined. The surfaces of the conveying rollers (6) and the conveying wheels (7) are connected to a conveyor belt (8) for transmission. The conveyor belt (8) passes through the interior of the electroplating tank (1). The surface of the conveyor belt (8) has multiple square openings (9) arranged at equal intervals. The four corners of the inner wall of the square openings (9) are fixedly connected to receiving plates (10).

3. The via copper thickness processing device for circuit board manufacturing according to claim 2, characterized in that: The diversion mechanism includes a telescopic cylinder (11) and an underwater motor (12). The telescopic cylinder (11) is rotatably connected to the bottom of the inner wall of the electroplating tank (1). The surface of the telescopic cylinder (11) is provided with multiple water inlets (13). Multiple arc-shaped diversion blades (14) are fixedly connected to the surface of the telescopic cylinder (11). Multiple spiral diversion blades (15) are fixedly connected to the inner wall surface of the telescopic cylinder (11). A diversion cylinder (16) is fixedly connected to the upper end of the telescopic cylinder (11). The upper end of the diversion cylinder (16) is sealed and the upper end of the diversion cylinder (16) is conical. A heating rod (17) is fixedly connected to the top of the inner wall of the diversion cylinder (16). Multiple water outlet holes (18) are provided on the surface of the diversion cylinder (16). The underwater motor (12) is fixedly connected to the bottom of the inner wall of the electroplating tank (1). The output shaft surface of the underwater motor (12) and the surface of the telescopic cylinder (11) are connected together by a drive belt (19).

4. The via copper thickness processing device for circuit board manufacturing according to claim 3, characterized in that: The detection mechanism includes multiple detection blocks (20), all of which are fixedly connected to the surface of the drainage tube (16). When the drainage tube (16) is inside the through hole (4), the detection block (20) will be located in the middle of the through hole (4). When the detection block (20) is squeezed, it will emit an electrical signal. An electric cylinder (21) for driving the drainage tube (16) to move up and down is fixedly connected to the surface of the telescopic tube (11). The detection block (20) is electrically connected to the electric cylinder (21), and the electric cylinder (21) is electrically connected to an external controller.

5. The via copper thickness processing device for circuit board manufacturing according to claim 3, characterized in that: The polishing mechanism includes two polishing rings (22), both of which are fixedly connected to the surface of the guide tube (16). When the guide tube (16) is inside the guide hole (4), the two polishing rings (22) will be located at the edges of both ends of the guide hole (4).

6. The via copper thickness processing device for circuit board manufacturing according to claim 5, characterized in that: The bottom of the conveyor belt (8) is fixedly connected to multiple positioning soft plates (23). Each of the multiple positioning soft plates (23) has a guide groove (24) on its surface. The guide groove (24) is recessed towards the position of the through hole (4) and the two sides of the recessed position of the guide groove (24) are inclined. The surface of the diversion tube (16) is rotatably connected to a rotating ring (25) and the rotating ring (25) is located in the guide groove (24).

7. The via copper thickness processing device for circuit board manufacturing according to claim 6, characterized in that: The surface of the drainage tube (16) is fixedly connected with a plurality of drainage fan blades (26), and the surface of the rotating ring (25) is fixedly connected with an annular filter cylinder (27), which is located below the drainage fan blades (26).

8. The via copper thickness processing device for circuit board manufacturing according to claim 2, characterized in that: Multiple limiting blocks (28) are elastically slidably connected inside the square opening (9). The limiting blocks (28) are used to limit the perimeter of the circuit board (3). The side of the limiting block (28) closest to the circuit board (3) is inclined.

9. A device for processing thick copper vias in circuit board manufacturing according to claim 8, characterized in that: An L-shaped positioning rod (29) is rotatably connected to the surface of the limiting block (28) near the mounting hole (5).

10. A device for processing thick copper vias in circuit board manufacturing according to claim 8, characterized in that: The bottom of the limiting block (28) is fixedly connected to an L-shaped lifting plate (30), which is located below the circuit board (3).

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