Heat dissipation device

Abstract

The invention discloses a heat dissipation device which comprises a bearing part, a first heat conduction part and a second heat conduction part. The bearing part is provided with first and second liquid flow channels which are communicated with each other, and a liquid inlet and a liquid outlet which are respectively communicated with the first and second liquid flow channels, the first heat conduction part is arranged in the two liquid flow channels, and the second heat conduction part is connected with one side, far away from the first liquid flow channel, of the first heat conduction part. The end, close to the liquid inlet, of the first liquid flow channel is oppositely provided with a flaring slope and a necking slope, and the circulation section width L of the first liquid flow channel is larger than the circulation section width S of the joint of the first liquid flow channel and the second liquid flow channel. The flaring inclined plane can increase the contact area of the cooling liquid and the first heat conduction piece, the necking inclined plane and the section width change can improve the flow speed of the cooling liquid, the heat taking-out efficiency of the cooling liquid is improved through cooperation of the two, and the heat dissipation effect of the heat dissipation device is enhanced.

Description

Technical Field

[0001] This invention relates to the field of radiator technology, and more specifically, to a heat dissipation device. Background Technology

[0002] With the development of the electronics and new energy fields, the integration and power of high-power devices are increasing, making heat dissipation increasingly urgent. Liquid cooling is widely used in high-power (e.g., 2500KW) scenarios due to its high efficiency and uniform temperature control, and existing solutions mostly adopt direct current flow.

[0003] This method uses multiple direct-flow channels on the surface of the heat source, allowing coolant to enter from one end of the channel, flow through it, and exit from the other end, thus removing heat through heat exchange. However, this method has limited heat dissipation and is difficult to adapt to products with higher power (e.g., 4500KW). Summary of the Invention

[0004] To address the shortcomings of existing technologies, this invention provides a heat dissipation device.

[0005] The present invention discloses a heat dissipation device, comprising: a support member, a first heat-conducting member and a second heat-conducting member. The support member has a first liquid flow channel, a second liquid flow channel, a liquid inlet and a liquid outlet. The first liquid flow channel is connected to the second liquid flow channel, the liquid inlet is connected to the first liquid flow channel, and the liquid outlet is connected to the second liquid flow channel. The first heat-conducting member is disposed in the first liquid flow channel and the second liquid flow channel, and the second heat-conducting member is connected to the side of the first heat-conducting member away from the first liquid flow channel. The first liquid flow channel is provided with a flared slope and a constricted slope. The flared slope and the constricted slope are both distributed at the end of the first liquid flow channel near the liquid inlet, and the flared slope and the constricted slope are arranged opposite to each other. The width of the flow section of the first liquid flow channel is L, and the width of the flow section at the connection between the first liquid flow channel and the second liquid flow channel is S, where L > S.

[0006] According to one embodiment of the present invention, a first angle exists between the flared inclined surface and the vertical wall surface in the first liquid flow channel, wherein the first angle is 106°-110°.

[0007] According to one embodiment of the present invention, a second angle exists between the constricted inclined surface and the vertical wall surface in the first liquid flow channel, wherein the second angle is 193°-197°.

[0008] According to one embodiment of the present invention, the first liquid flow channel is further provided with an arc surface at one end near the liquid inlet, and the arc surface is connected to the constricted inclined surface.

[0009] According to one embodiment of the present invention, a guide slope is further provided at one end of the first liquid flow channel near the second liquid flow channel.

[0010] According to one embodiment of the present invention, a third angle exists between the guide slope and the vertical wall surface in the first liquid flow channel, wherein the third angle is 193°-197°.

[0011] According to one embodiment of the present invention, L = 55mm-59mm; S = 7mm-11mm.

[0012] According to one embodiment of the present invention, the first heat-conducting element has a plurality of spaced heat dissipation channels, which are connected to a first liquid channel or a second liquid channel.

[0013] According to one embodiment of the present invention, the first liquid flow channel and the second liquid flow channel have a symmetrical structure.

[0014] According to one embodiment of the present invention, the carrier further has a third liquid flow channel and a fourth liquid flow channel that are connected to each other. The first liquid flow channel and the second liquid flow channel are located on one side of the carrier, and the third liquid flow channel and the fourth liquid flow channel are located on the other side of the carrier. The third liquid flow channel is connected to the liquid inlet, and the fourth liquid flow channel is connected to the liquid outlet. It also includes a third heat-conducting component and a fourth heat-conducting component. The third heat-conducting component is disposed in the third liquid flow channel and the fourth liquid flow channel, and the fourth heat-conducting component is disposed on the side of the third heat-conducting component away from the third liquid flow channel.

[0015] The beneficial effects of the present invention are as follows: by setting the flared slope, more area of ​​the coolant can flow into the first liquid flow channel, which is conducive to improving the contact between the coolant and the first heat-conducting component, thereby improving the efficiency of the coolant in carrying away heat; in addition, by setting the constricted slope and changing the flow cross section, it helps to increase the flow speed of the coolant so as to carry away heat more quickly, thereby enhancing the heat dissipation effect. Attached Figure Description

[0016] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings: Figure 1 This is a three-dimensional structural diagram of the heat dissipation device; Figure 2 This is a breakdown diagram of the heat dissipation device; Figure 3 This is a three-dimensional structural diagram of the support component 1; Figure 4 This is a front view of the support component 1; Figure 5 for Figure 2 Enlarged view of section A in the middle; Figure 6 This is a cross-sectional schematic diagram of the support component 1.

[0017] Explanation of reference numerals in the attached figures 1. Supporting component; 11. First liquid flow channel; 101. First angle; 102. Second angle; 103. Third angle; 111. Flaring bevel; 112. Narrowing bevel; 113. Vertical wall surface; 114. Arc surface; 115. Guide bevel; 12. Second liquid flow channel; 13. Liquid inlet; 14. Liquid outlet; 15. Third liquid flow channel; 16. Fourth liquid flow channel; 2. First heat-conducting component; 21. Heat dissipation channel; 3. Second heat-conducting component; 4. Third heat-conducting component; 5. Fourth heat-conducting component. Detailed Implementation

[0018] The following drawings disclose several embodiments of the present invention. For clarity, many practical details will be described in the following description. However, it should be understood that these practical details are not intended to limit the invention. That is, in some embodiments of the invention, these practical details are not essential. Furthermore, for the sake of simplicity, some conventional structures and components will be shown in the drawings in a simple schematic manner.

[0019] Furthermore, in this invention, the use of terms such as "first" and "second" is for descriptive purposes only and does not specifically refer to any order or sequence, nor is it intended to limit the invention. They are merely used to distinguish components or operations described using the same technical terms, and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the technical solutions of various embodiments can be combined with each other, but only if they are feasible for those skilled in the art. If a combination of technical solutions is contradictory or impossible to implement, such a combination should be considered nonexistent and not within the scope of protection claimed by this invention.

[0020] like Figures 1-4 As shown, Figure 1 This is a three-dimensional structural diagram of the heat dissipation device; Figure 2 This is a breakdown diagram of the heat dissipation device; Figure 3 This is a three-dimensional structural diagram of the support component 1; Figure 4This is a front view of the support component 1. The heat dissipation device includes the support component 1, a first heat-conducting component 2, and a second heat-conducting component 3. The first heat-conducting component 2 is disposed within the support component 1, and the second heat-conducting component 3 is connected to the first heat-conducting component 2. Coolant flows within the support component 1. The product is placed on the second heat-conducting component 3. The heat generated by the product during operation is transferred to the second heat-conducting component 3, which then transfers the heat to the first heat-conducting component 2. As the coolant flows through the first heat-conducting component 2, it carries away the heat, thereby achieving a cooling effect on the product.

[0021] The carrier 1 has a first liquid flow channel 11, a second liquid flow channel 12, an inlet 13, and an outlet 14. The first liquid flow channel 11 and the second liquid flow channel 12 are connected. The inlet 13 is connected to the first liquid flow channel 11, and the outlet 14 is connected to the second liquid flow channel 12. A first heat-conducting element 2 is located inside the first liquid flow channel 11 and the second liquid flow channel 12. A second heat-conducting element 3 is connected to the side of the carrier 1 and covers the outer surface of the first liquid flow channel 11 and the second liquid flow channel 12. In this way, the first liquid flow channel 11 and the second liquid flow channel 12 form a cavity structure, and the coolant flows only within the first liquid flow channel 11 and the second liquid flow channel 12, without easily overflowing to the outside. In specific applications, the inlet 13 and the outlet 14 are arranged side by side on one side of the carrier 1. The coolant is input through the inlet 13, flows through the first liquid flow channel 11 and the second liquid flow channel 12, and finally flows out through the outlet 14. In this embodiment, the cross-sections of the first liquid flow channel 11 and the second liquid flow channel 12 are U-shaped, thereby improving the heat dissipation effect by extending the flow path of the coolant.

[0022] Specifically, the first liquid flow channel 11 is provided with a flared inclined surface 111, which is located at one end of the first liquid flow channel 11 near the inlet 13. In use, when the coolant flows into the first liquid flow channel 11 from the inlet 13, the coolant flows along the flared inclined surface 111, increasing the flow area of ​​the coolant in the first liquid flow channel 11. This facilitates full contact between the coolant and the first heat-conducting element 2, allowing more heat to be carried away from the first heat-conducting element 2. In this embodiment, the first liquid flow channel 11 is also provided with a vertical wall 113 opened in the vertical direction. There is a first angle 101 between the flared inclined surface 111 and the vertical wall 113, wherein the first angle 101 is 106°-110°.

[0023] Furthermore, the first liquid flow channel 11 also has a constricted inclined surface 112, which is located at one end of the first liquid flow channel 11 near the inlet 13. The constricted inclined surface 112 is positioned opposite the flared inclined surface 111, meaning the flared inclined surface 111 and the constricted inclined surface 112 are distributed on opposite sides of the first liquid flow channel 11. When coolant flows in from the inlet 13, the flow surface of the coolant expands outwards upon entering the first liquid flow channel 11, and then, under the action of the constricted inclined surface 112, flows towards the central region. Because the coolant expands outwards to a wider area upon entering the first liquid flow channel 11, the flow rate of the coolant is reduced. Then, through the constricted inclined surface 112, the coolant flows from a wider area to a narrower area, increasing the flow rate of the coolant. By increasing the flow rate, more heat can be carried away by the coolant, thereby improving the heat dissipation effect. In addition, the constricted slope 112 can also serve as a guide and transition, guiding the high-speed flowing coolant to smoothly conform to the wall surface, avoiding impact and energy loss caused by sudden changes in direction, maintaining the continuity of flow velocity, reducing local flow resistance, and reducing flow velocity decay.

[0024] In a specific application, there is a second angle 102 between the constricted inclined surface 112 and the vertical wall surface 113 inside the first liquid flow channel 11, wherein the second angle 102 is 193°-197°.

[0025] Furthermore, the first liquid flow channel 11 also has an arc surface 114, located at the end of the first liquid flow channel 11 near the inlet 13. Simultaneously, the arc surface 114 is connected to the constricted inclined surface 112. During operation, after the coolant enters the first liquid flow channel 11, a portion of the coolant flows towards the arc surface 114, and after passing through the arc surface 114, it flows towards the constricted inclined surface 112. Through the design of the arc surface 114, at the coolant turning point, the smooth curved surface reduces local resistance and eddies, allowing the coolant to smoothly change direction, avoiding the formation of dead zones at corners, and reducing pressure loss. In addition, the combined effect of the arc surface 114 and the constricted inclined surface 112 reduces resistance and eddy current losses within the flow channel, allowing the pump's output power to be more efficiently converted into coolant flow velocity, thereby improving the overall heat dissipation capacity.

[0026] In practical applications, the flow cross-sectional width of the first liquid flow channel 11 is L, and the flow cross-sectional width at the connection between the first liquid flow channel 11 and the second liquid flow channel 12 is S, where L > S. It should be noted that the flow cross-sectional width refers to the width of the area through which the coolant flows. During use, the coolant flows into the first liquid flow channel 11 from the inlet 13. While flowing within the first liquid flow channel 11, the flow area of ​​the coolant is relatively large. When the coolant reaches the connection between the first liquid flow channel 11 and the second liquid flow channel 12, the flow area decreases. With the continuous input of coolant, the coolant is propelled to flow faster from the first liquid flow channel 11 to the second liquid flow channel 12, thereby increasing the flow velocity of the coolant within both the first and second liquid flow channels 11 and 12. This allows for more efficient removal of heat from the first heat-conducting element 2, achieving a more efficient heat dissipation effect. To further explain, when coolant flows from a wider flow cross-section to a narrower flow cross-section, the flow velocity increases significantly. This increased velocity lowers the pressure in that area, creating a pressure difference. This pressure difference drives the coolant to flow more efficiently, improving overall heat dissipation efficiency. In this embodiment, L = 55mm-59mm, and S = 7mm-11mm.

[0027] Furthermore, the first liquid flow channel 11 also has a guide slope 115, which is located at one end of the first liquid flow channel 11 near the second liquid flow channel 12, and is formed towards the connection between the first liquid flow channel 11 and the second liquid flow channel 12. The guide slope 115 allows for a smooth transition of the coolant, avoiding eddies and dead zones caused by right angles or stepped structures, thereby reducing overall pressure loss and achieving the effect of reducing flow resistance. In specific applications, a third angle 103 exists between the guide slope 115 and the vertical wall 113 within the first liquid flow channel 11, wherein the third angle 103 is 193°-197°.

[0028] To further clarify, the vertical wall 113 in this embodiment is only used as a reference surface. In other words, when the first liquid flow channel 11 does not have a designed vertical wall 113, it can be replaced by an imaginary vertical surface. That is to say, the vertical wall 113 referred to in the attached drawings can be a curved surface or a bent structure in actual use. The structure of the vertical wall 113 referred to in the attached drawings is not limited here.

[0029] In this embodiment, the first liquid flow channel 11 and the second liquid flow channel 12 are symmetrical structures. The flared slope 111, narrowing slope 112, arc surface 114 and guide slope 115 designed in the first liquid flow channel 11 are also present in the second liquid flow channel 12, so they will not be described in detail here.

[0030] Please refer to the following: Figure 2 and Figure 5 As shown, Figure 5 for Figure 2 Enlarged view of section A. The first heat-conducting component 2 has multiple heat dissipation channels 21, which are spaced apart and located within either the first liquid channel 11 or the second liquid channel 12. In use, the coolant in the first liquid channel 11 flows through the multiple heat dissipation channels 21, carrying away heat from the walls of the channels 21. In specific applications, the first heat-conducting component 2 can be divided into two groups: one group is placed within the first liquid channel 11, where the heat dissipation channels 21 are connected to the first liquid channel 11; the other group is placed within the second liquid channel 12, where the heat dissipation channels 21 are connected to the second liquid channel 12. In this embodiment, the width of the heat dissipation channels 21 is 0.5 mm.

[0031] Please refer to the following: Figure 6 As shown, Figure 6 This is a cross-sectional schematic diagram of the support member 1. Preferably, the support member 1 further includes a third liquid flow channel 15 and a fourth liquid flow channel 16. The third liquid flow channel 15 and the first liquid flow channel 11 are respectively disposed on opposite sides of the support member 1, and the fourth liquid flow channel 16 and the second liquid flow channel 12 are respectively disposed on opposite sides of the support member 1. The third liquid flow channel 15 and the fourth liquid flow channel 16 are connected. The third liquid flow channel 15 is also connected to the liquid inlet 13, and the fourth liquid flow channel 16 is connected to the liquid outlet 14. The heat dissipation device further includes a third heat-conducting element 4 and a fourth heat-conducting element 5. The third heat-conducting element 4 is disposed within the third liquid flow channel 15 and the fourth liquid flow channel 16, and the fourth heat-conducting element 5 is connected to the side of the third heat-conducting element 4 away from the third liquid flow channel 15. In use, the coolant input through the inlet 13 flows to the first liquid flow channel 11 and the third liquid flow channel 15. After passing through the second liquid flow channel 12 and the fourth liquid flow channel 16, the coolant will flow out through the outlet 14. In this way, the products on the second heat-conducting component 3 and the fourth heat-conducting component 5 can be cooled simultaneously, which not only saves space but also reduces costs.

[0032] Specifically, the third liquid flow channel 15 has a similar structure to the first liquid flow channel 11, the fourth liquid flow channel 16 has a similar structure to the second liquid flow channel 12, the third heat-conducting element 4 has a similar structure to the first heat-conducting element 2, and the fourth heat-conducting element 5 has a similar structure to the second heat-conducting element 3.

[0033] In this embodiment, the support component 1, the first heat-conducting component 2, the second heat-conducting component 3, the third heat-conducting component 4, and the fourth heat-conducting component 5 are all made of copper.

[0034] As shown in Table 1, Table 1 is a table of experimental parameters for the heat dissipation device. The experimental conditions are as follows: Under normal temperature conditions, the 4500KW product is in normal operation, the heat dissipation device is in contact with the product, and coolant that meets the temperature requirements (e.g., coolant at room temperature) is introduced into the heat dissipation device. Then, three detection areas are randomly selected for temperature collection. Based on the collected temperature information, it is determined whether the product temperature has been reduced to the required 70℃. #1-#7 are multiple heat dissipation devices with the same structure.

[0035] Table 1: Experimental Parameters of the Heat Dissipation Device

[0036] The data above shows that: ① The overall pressure difference is controlled between 0.1114 and 0.1343 bar, with minimal fluctuations, indicating a smooth flow channel design in the heat dissipation device, resulting in low resistance and low energy loss for the coolant during internal circulation. ② Under the combined effects of a constant flow rate (0.25 L / s) and low pressure difference, the actual flow velocity of the coolant inside the heat dissipation device is faster, enabling more efficient removal of heat generated by the 4500 kW high load. Furthermore, the rapidly flowing coolant enhances convective heat transfer, providing a crucial guarantee for rapid cooling.

[0037] In summary, by setting the flared slope 111, more area of ​​the coolant can flow into the first liquid flow channel 11, which is beneficial to improve the contact between the coolant and the first heat-conducting component 2, thereby improving the efficiency of the coolant in carrying away heat. In addition, by setting the constricted slope 112 and changing the flow cross section, it is helpful to increase the flow speed of the coolant so as to carry away heat more quickly, thereby enhancing the heat dissipation effect.

[0038] The above description is merely an embodiment of the present invention and is not intended to limit the invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principle of the present invention should be included within the scope of the claims of the present invention.

Claims

1. A heat dissipation device, characterized in that, include: The carrier (1), the first heat-conducting component (2) and the second heat-conducting component (3) are provided. The carrier (1) has a first liquid flow channel (11), a second liquid flow channel (12), an inlet (13) and an outlet (14). The first liquid flow channel (11) is connected to the second liquid flow channel (12), the inlet (13) is connected to the first liquid flow channel (11), and the outlet (14) is connected to the second liquid flow channel (12). The first heat-conducting component (2) is disposed in the first liquid flow channel (11) and the second liquid flow channel (12). The second heat-conducting component (3) is connected to the side of the first heat-conducting component (2) away from the first liquid flow channel (11). The first liquid flow channel (11) is provided with a flared inclined surface (111) and a constricted inclined surface (112). The flared inclined surface (111) and the constricted inclined surface (112) are both distributed at one end of the first liquid flow channel (11) near the liquid inlet (13), and the flared inclined surface (111) and the constricted inclined surface (112) are arranged opposite to each other. The width of the flow section of the first liquid flow channel (11) is L, and the width of the flow section at the connection between the first liquid flow channel (11) and the second liquid flow channel (12) is S, where L > S.

2. The heat dissipation device according to claim 1, characterized in that, There is a first angle (101) between the flared inclined surface (111) and the vertical wall (113) inside the first liquid flow channel (11), wherein the first angle (101) is 106°-110°.

3. The heat dissipation device according to claim 1, characterized in that, There is a second angle (102) between the constricted inclined surface (112) and the vertical wall (113) in the first liquid flow channel (11), wherein the second angle (102) is 193°-197°.

4. The heat dissipation device according to claim 1, characterized in that, The first liquid flow channel (11) is also provided with an arc surface (114) at one end near the liquid inlet (13), and the arc surface (114) is connected to the constricted inclined surface (112).

5. The heat dissipation device according to claim 1, characterized in that, The first liquid flow channel (11) is also provided with a guide slope (115) at one end near the second liquid flow channel (12).

6. The heat dissipation device according to claim 5, characterized in that, There is a third angle (103) between the guide slope (115) and the vertical wall (113) in the first liquid flow channel (11), wherein the third angle (103) is 193°-197°.

7. The heat dissipation device according to any one of claims 1-6, characterized in that, L=55mm-59mm; S=7mm-11mm.

8. The heat dissipation device according to any one of claims 1-6, characterized in that, The first heat-conducting component (2) has multiple spaced heat dissipation channels (21), which are connected to the first liquid channel (11) or the second liquid channel (12).

9. The heat dissipation device according to any one of claims 1-6, characterized in that, The first liquid flow channel (11) and the second liquid flow channel (12) are symmetrical structures.

10. The heat dissipation device according to any one of claims 1-6, characterized in that, The carrier (1) also has a third liquid flow channel (15) and a fourth liquid flow channel (16) that are connected. The first liquid flow channel (11) and the second liquid flow channel (12) are located on one side of the carrier (1), and the third liquid flow channel (15) and the fourth liquid flow channel (16) are located on the other side of the carrier (1). The third liquid flow channel (15) is connected to the liquid inlet (13), and the fourth liquid flow channel (16) is connected to the liquid outlet (14). It also includes a third heat-conducting element (4) and a fourth heat-conducting element (5). The third heat-conducting element (4) is disposed in the third liquid flow channel (15) and the fourth liquid flow channel (16), and the fourth heat-conducting element (5) is disposed on the side of the third heat-conducting element (4) away from the third liquid flow channel (15).

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