Photovoltaic cell packaging structure and manufacturing method thereof

Abstract

The invention relates to a photovoltaic cell packaging structure and a manufacturing method of the photovoltaic cell packaging structure. The photovoltaic cell packaging structure comprises a first transparent cover plate; the first lower conductive layer is arranged on the side surface of the first transparent cover plate; the first photovoltaic unit is arranged on the side surface of the first lower conductive layer; the first upper conductive layer is arranged on the side surface of the first photovoltaic unit; the packaging layer is arranged around the first transparent cover plate; the adhesion layer is arranged on the periphery of the first transparent cover plate and is adjacent to the packaging layer; and the second transparent cover plate is arranged on the encapsulation layer and the adhesion layer and is in contact with the first upper conductive layer. The first transparent cover plate, the second transparent cover plate and the packaging layer form a packaging area.

Description

[0001] This application claims priority to Taiwan Patent Application No. 113138792, filed on October 11, 2024, the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to a photovoltaic cell packaging structure, and more particularly to a photovoltaic cell packaging structure that is easy to package and has a robust structure. Background Technology

[0003] With increasing public awareness of green energy and environmental protection, solar energy technology continues to develop. Solar cells can be integrated with everyday consumer goods to provide them with electricity. For example, solar cells can be combined with computers and their peripherals, communication and consumer electronics products, or, for instance, with buildings to fully utilize solar energy and achieve the goals of green energy and environmental protection.

[0004] Thin-film solar cells are significantly thinner and lighter than monocrystalline or polycrystalline silicon solar cells. Examples of thin-film solar cells include organic solar cells, copper indium gallium diselenide (CIGS) solar cells, and perovskite solar cells (PSC). They can be manufactured using techniques such as vapor deposition and coating, resulting in superior flatness and uniformity. Thin-film solar cells can be manufactured using roll-to-roll (R2R) processes. Because roll-to-roll processes allow for large-area fabrication of thin-film solar cells, they can be produced at a lower cost, resulting in flexible, lightweight, and impact-resistant solar cells.

[0005] Generally, the encapsulation steps for thin-film solar cells are as follows: Step 1, applying glass adhesive to the second transparent cover plate of the thin-film solar cell; Step 2, placing the first transparent cover plate and the second transparent cover plate into a vacuum environment; Step 3, aligning and temporarily attaching the first transparent cover plate and the second transparent cover plate using a fixing fixture; and Step 4, heating the glass adhesive in a vacuum environment to form an encapsulation area with the first transparent cover plate, the second transparent cover plate, and the glass adhesive.

[0006] However, during these steps, the first and second transparent cover plates are prone to displacement, causing misalignment. Furthermore, since step 4 involves heating the silicone sealant in a vacuum environment, the laser heating process is complex. Moreover, the encapsulated thin-film solar cell is supported only by the silicone sealant, and because the encapsulation area is a vacuum, the first and second transparent cover plates may deform due to pressure differences. If a filler layer material is used to support the first and second transparent cover plates in the encapsulation area, besides increasing costs, the filler layer material is more likely to damage the photovoltaic layer.

[0007] In view of this, how to improve the photovoltaic cell encapsulation structure and its manufacturing method, so as to reduce the alignment misalignment of the first and second transparent cover plates, eliminate the need for heating the glass glue in a vacuum environment, ensure that the first and second transparent cover plates are structurally stable and not easily deformed, and eliminate the need for additional filler material, is one of the problems that urgently need to be solved. Summary of the Invention

[0008] This application provides a photovoltaic cell encapsulation structure and its manufacturing method, which enables accurate alignment of the first transparent cover plate and the second transparent cover plate, allows the glass glue to be heated in an ambient pressure environment, and ensures that the first transparent cover plate and the second transparent cover plate have a stable structure that is not easily deformed and does not require additional filler material.

[0009] This application provides a photovoltaic cell encapsulation structure including a first transparent cover plate; a first lower conductive layer disposed on the side of the first transparent cover plate; a first photovoltaic unit disposed on the side of the first lower conductive layer; a first upper conductive layer disposed on the side of the first photovoltaic unit; an encapsulation layer disposed around the first transparent cover plate; an adhesive layer disposed around the first transparent cover plate and adjacent to the encapsulation layer; and a second transparent cover plate disposed on the encapsulation layer and the adhesive layer and in contact with the first upper conductive layer; the first transparent cover plate, the second transparent cover plate, and the encapsulation layer form an encapsulation area.

[0010] In some embodiments, the adhesive layer is disposed inside the encapsulation layer and located within the encapsulation area.

[0011] In some embodiments, the adhesive layer is disposed outside the encapsulation layer and located outside the encapsulation area.

[0012] In some embodiments, the thickness of the adhesive layer is 10-500 μm.

[0013] In some embodiments, the thickness of the encapsulation layer is 10-500 μm.

[0014] In some embodiments, the thickness of the first upper conductive layer is 0.1-500 μm.

[0015] In some embodiments, the thickness of the first lower conductive layer is 0.05-10 μm.

[0016] In some embodiments, the thickness of the first photovoltaic unit is 0.1-10 μm.

[0017] In some embodiments, the photovoltaic cell encapsulation structure further includes a second lower conductive layer disposed on the side of the first transparent cover plate, adjacent to the first lower conductive layer and electrically connected to the first upper conductive layer; a second photovoltaic unit disposed on the side of the second lower conductive layer; and an insulating layer disposed between the first photovoltaic unit and the second photovoltaic unit; wherein the thickness of the insulating layer is 10-500μm.

[0018] In some embodiments, the adhesive layer is a polyolefin elastomer (POE), an ionomer, ethylene vinyl acetate (EVA), polyurethane (PU), polyvinyl butyral (PVB), or polyisobutylene (PIB).

[0019] In some embodiments, the photovoltaic cell encapsulation structure further includes a reflective layer disposed on the first photovoltaic unit.

[0020] In some embodiments, the photovoltaic cell encapsulation structure further includes an air intake unit disposed within the encapsulation area.

[0021] This application provides a method for manufacturing a photovoltaic cell encapsulation structure, including coating an encapsulation layer on the side of a first transparent cover plate or a second transparent cover plate; baking the encapsulation layer to bond the encapsulation layer to the first transparent cover plate or the second transparent cover plate; attaching an adhesive layer to the side of the first transparent cover plate or the side of the second transparent cover plate; aligning the first transparent cover plate and the second transparent cover plate; placing the first transparent cover plate, the second transparent cover plate, the encapsulation layer, and the adhesive layer into a vacuum environment; heating and pressing the first transparent cover plate and the second transparent cover plate to bond the adhesive layer to the first transparent cover plate and the second transparent cover plate; and heating the encapsulation layer to bond the encapsulation layer to the first transparent cover plate and the second transparent cover plate.

[0022] In some embodiments, the process of heating and pressing the first transparent cover and the second transparent cover together, so that the adhesive layer bonds the first transparent cover and the second transparent cover together with the heating and sealing layer, so that the sealing layer bonds the first transparent cover and the second transparent cover together, further includes placing the first transparent cover, the second transparent cover, the sealing layer and the adhesive layer into an atmospheric pressure environment.

[0023] In some embodiments, coating the encapsulation layer on the side of the first transparent cover or the side of the second transparent cover further includes coating the side of the first transparent cover or the side of the second transparent cover with an encapsulation layer having a thickness of 15-25 μm; baking the encapsulation layer to bond the encapsulation layer to the first transparent cover or the second transparent cover further includes baking the encapsulation layer to a thickness of about 20 μm to bond the encapsulation layer to the first transparent cover or the second transparent cover.

[0024] In some embodiments, baking the encapsulation layer to bond the encapsulation layer to the first transparent cover or the second transparent cover further includes baking the encapsulation layer at 200-500°C for 90-120 minutes to bond the encapsulation layer to the first transparent cover or the second transparent cover.

[0025] In some embodiments, the process of baking the encapsulation layer to bond the encapsulation layer to the first transparent cover or the second transparent cover and the adhesive layer attached to the side of the first transparent cover or the side of the second transparent cover also includes placing the first transparent cover or the second transparent cover and the encapsulation layer in a room temperature environment.

[0026] In some embodiments, attaching an adhesive layer to the side of the first transparent cover or the side of the second transparent cover further includes attaching an adhesive layer to the side of the first transparent cover or the side of the second transparent cover, wherein the thickness of the adhesive layer is 1.0-2.0 times the thickness of the encapsulation layer.

[0027] In some embodiments, placing the first transparent cover, the second transparent cover, the encapsulation layer, and the adhesive layer into a vacuum environment further includes placing the first transparent cover, the second transparent cover, the encapsulation layer, and the adhesive layer into an environment with a pressure of less than or equal to 10. -1 The vacuum environment of the Tor.

[0028] In some embodiments, the process of heating and pressing the first transparent cover and the second transparent cover to bond the adhesive layer to the first transparent cover and the second transparent cover further includes heating and pressing the first transparent cover and the second transparent cover at 80-150°C for 5-10 minutes to make the thickness of the adhesive layer the same as the thickness of the encapsulation layer, and to bond the adhesive layer to the first transparent cover and the second transparent cover.

[0029] As described above, the first transparent cover, second transparent cover, adhesive layer, and encapsulation layer of the photovoltaic cell encapsulation structure of this application can maintain the vacuum in the encapsulation area, achieving the effect of blocking water and gas. The first upper conductive layer or insulating layer can uniformly support the first and second transparent cover within the encapsulation area, making the photovoltaic cell encapsulation structure stable and not easily deformed, improving the thickness uniformity, ensuring accurate alignment of the first and second transparent cover, and eliminating the need for additional filler material.

[0030] Furthermore, the adhesive layer of the photovoltaic cell encapsulation structure in this application has a thickness of 10μm-500μm, which allows the vacuum in the encapsulation area to be temporarily maintained during manufacturing, enabling the encapsulation layer to be heated in an atmospheric pressure environment. The 10-500μm thickness of the encapsulation layer supports the first and second transparent cover plates. The thickness of the first upper conductive layer (0.1-500μm) and the thickness of the insulating layer (10-500μm) uniformly support the first and second transparent cover plates. The thickness of the first lower conductive layer (0.05-10μm) allows it to be disposed within the encapsulation area and is easy to manufacture. The thickness of the first photovoltaic unit (0.1-10μm) allows it to be disposed within the encapsulation area and is easy to manufacture.

[0031] The photovoltaic cell encapsulation structure manufacturing method of this application uses an adhesive layer to temporarily adhere a first transparent cover plate and a second transparent cover plate while maintaining an internal vacuum. The encapsulation layer can be heated in an atmospheric pressure environment, simplifying the laser heating operation. The encapsulation area can maintain at least 10 -1 The vacuum created by the torrent achieves the effect of blocking water and gas. The error between the first and second transparent covers can be controlled to below 5μm.

[0032] It should be noted that in this instruction manual, the "-" symbol indicates the range of values ​​including the values ​​before and after it. Attached Figure Description

[0033] Details of one or more embodiments of the subject matter described herein are set forth in the following drawings and description. Further features, embodiments, and advantages of the subject matter of this specification will become apparent from the description, drawings, and claims, wherein:

[0034] Figure 1 This is a cross-sectional schematic diagram of a photovoltaic cell packaging structure according to an embodiment of this application.

[0035] Figure 2 This is a partial cross-sectional schematic diagram of a photovoltaic cell packaging structure according to an embodiment of this application.

[0036] Figure 3 This is a cross-sectional schematic diagram of a photovoltaic cell packaging structure according to an embodiment of this application.

[0037] Figure 4A This is a schematic diagram of the manufacturing state of a photovoltaic cell packaging structure according to an embodiment of this application.

[0038] Figure 4B This is a schematic diagram of the manufacturing state of a photovoltaic cell packaging structure according to an embodiment of this application.

[0039] Figure 5 This is a step diagram illustrating a method for manufacturing a photovoltaic cell encapsulation structure according to an embodiment of this application.

[0040] Figure 6 This is a step diagram illustrating a method for manufacturing a photovoltaic cell encapsulation structure according to another embodiment of this application.

[0041] Explanation of reference numerals in the attached figures:

[0042] 1: Photovoltaic cell packaging structure;

[0043] 11: First transparent cover;

[0044] 11S: Side view;

[0045] 12: Second transparent cover;

[0046] 12S: Side view;

[0047] 21: First lower conductive layer;

[0048] 21S: Side view;

[0049] 21D: Thickness;

[0050] 22: Second lower conductive layer;

[0051] 22S: Side view;

[0052] 31: First photovoltaic unit;

[0053] 31S: Side view;

[0054] 31D: Thickness;

[0055] 32: Second photovoltaic unit;

[0056] 32S: Side view;

[0057] 41: First upper conductive layer;

[0058] 41D: Thickness;

[0059] 42: Second upper conductive layer;

[0060] 50: Encapsulation layer;

[0061] 50D: Thickness;

[0062] 51: Package area;

[0063] 60: Adhesive layer;

[0064] 60D: Thickness;

[0065] 70: Electrode wire;

[0066] S01-S07: Manufacturing method steps;

[0067] S11-S19: Manufacturing method steps. Detailed Implementation

[0068] The detailed description and technical content of this application are explained below with reference to the accompanying drawings. However, the accompanying drawings are provided for reference and illustration only and are not intended to limit this application.

[0069] As used herein, terms such as “first” and “second” describe various components, parts, regions, layers, and / or portions, which should not be limited by these terms. These terms are used only to distinguish one element, component, region, layer, or portion from another. Unless the context clearly indicates otherwise, the use of terms such as “first” and “second” herein does not imply order or sequence.

[0070] Figure 1 This is a cross-sectional schematic diagram of a photovoltaic cell packaging structure according to an embodiment of this application. Figure 2 This is a partial cross-sectional schematic diagram of a photovoltaic cell packaging structure according to an embodiment of this application. Figure 3 This is a cross-sectional schematic diagram from another perspective of a photovoltaic cell packaging structure according to an embodiment of this application. Please refer to... Figure 1 , Figure 2 and Figure 3 As shown, the photovoltaic cell encapsulation structure 1 of this embodiment includes a first transparent cover plate 11, a first lower conductive layer 21, a first photovoltaic unit 31, a first upper conductive layer 41, an encapsulation layer 50, an adhesive layer 60, and a second transparent cover plate 12.

[0071] The first transparent cover plate 11 is a light-transmitting plastic substrate or a light-transmitting glass substrate. The light-transmitting plastic can be, for example, polyimide (PI), a hybrid PI mixture, polyethylene terephthalate (PET), polyethersulfone (PES), polyethylene naphthalate (PEN), cycloolefin polymer (COP), or a fiberglass reinforced plastic substrate.

[0072] The first lower conductive layer 21 is disposed on the side surface 11S of the first transparent cover plate 11. The first lower conductive layer 21 can be formed on the side surface 11S of the first transparent cover plate 11 using indium tin oxide (ITO), silver paste, or other inorganic conductive materials, and transparent electrode lines can be formed on the side surface 11S of the first transparent cover plate 11 by etching technology. The first lower conductive layer 21 can also be formed on the side surface 11S of the first transparent cover plate 11 by coating, sputtering, or evaporation technology. The material of the first lower conductive layer 21 can be a conductive polymer, metal oxide, or a multilayer combination of metal and metal oxide. In some embodiments, the light transmittance of the first lower conductive layer 21 can be 70%-95%, allowing sunlight to pass through the first lower conductive layer 21. In some embodiments, the thickness 21D of the first lower conductive layer 21 is 0.05-10 μm. In some embodiments, the first lower conductive layer 21 can extend through the encapsulation layer 50 and the adhesive layer 60, serving as an external pin of the photovoltaic cell encapsulation structure 1.

[0073] The first photovoltaic unit 31 is disposed on a side 21S of the first lower conductive layer 21, for example, on one or more side 21S of the first lower conductive layer 21. The first photovoltaic unit 31 can be disposed on the side 21S of the first lower conductive layer 21, for example, by laser etching. The first photovoltaic unit 31 sequentially has an electron transport layer, an active layer, and a hole. The first photovoltaic unit 31 can be, for example, an organic solar cell, a copper indium gallium selenide (CIGS) thin-film solar cell, a cadmium nitride (CdTe) thin-film solar cell, an amorphous silicon (α-Si) thin-film solar cell, a perovskite thin-film solar cell, or a dye-sensitized solar cell (DSSC). In some embodiments, the thickness 31D of the first photovoltaic unit 31 is 0.1-10 μm.

[0074] The first upper conductive layer 41 is disposed on the side surface 31S of the first photovoltaic unit 31, for example, on one or more side surfaces 31S of the first photovoltaic unit 31. The first upper conductive layer 41 can be formed into electrode lines on the side surface 31S of the first photovoltaic unit 31 by screen printing silver paste and laser etching. The first upper conductive layer 41 can also be formed into electrode lines on the side surface 31S of the first photovoltaic unit 31 by coating, sputtering or vapor deposition techniques. The material of the first upper conductive layer 41 can be a conductive polymer, a metal oxide, or a multilayer combination of metal and metal oxide. In some embodiments, the silver paste thickness can be 10-20 μm to support the second transparent cover plate 12. In some embodiments, the thickness 41D of the first upper conductive layer 41 is 0.1-500 μm to support the second transparent cover plate 12.

[0075] An encapsulation layer 50 is disposed around the first transparent cover plate 11. The cross-sectional shape of the encapsulation layer 50 is, for example, a closed ring such as a square, rectangle, or circle, to be disposed around the first transparent cover plate 11. The material of the encapsulation layer 50 is, for example, glass glue, polyurethane (PU), ethylene-vinyl acetate (EVA), polyvinyl butyral (PVB), or polyisobutylene (PIB). In some embodiments, the thickness 50D of the encapsulation layer 50 is 10-500 μm to support the first transparent cover plate 11 and the second transparent cover plate 12.

[0076] An adhesive layer 60 is disposed around the first transparent cover plate 11 and adjacent to the encapsulation layer 50. The cross-sectional shape of the adhesive layer 60 is, for example, a closed ring such as a square, rectangle, or circle, to be disposed around the first transparent cover plate 11. The adhesive layer 60 may or may not contact the encapsulation layer 50. In some embodiments, the adhesive layer 60 is disposed inside the encapsulation layer 50 and located within the encapsulation area 51; in other words, the encapsulation layer 50 covers the adhesive layer 60. In some embodiments, the adhesive layer 60 is disposed outside the encapsulation layer 50 and located outside the encapsulation area 51; in other words, the adhesive layer 60 covers the encapsulation layer 50. The adhesive layer 60 can change shape during heat pressing so that its thickness 60D is the same as that of the encapsulation layer 50. In some embodiments, the thickness 60D of the adhesive layer 60 is 10-500 μm to temporarily adhere the first transparent cover plate 11 and the second transparent cover plate 12 and maintain the vacuum in the encapsulation area 51. In some embodiments, the adhesive layer 60 is a polyolefin elastomer (POE), an ionomer, ethylene vinyl acetate (EVA), polyurethane (PU), polyvinyl butyral (PVB), or polyisobutylene (PIB). In some embodiments, the adhesive layer 60 is a polyolefin elastomer (POE). Since it is a dry film, it can be cut and placed around the first transparent cover plate 11.

[0077] The second transparent cover plate 12 is disposed on the encapsulation layer 50 and the adhesive layer 60, and contacts the first upper conductive layer 41. In other words, the second transparent cover plate 12 contacts the encapsulation layer 50, the adhesive layer 60, and the first upper conductive layer 41, thereby providing support for the first transparent cover plate 11 and the second transparent cover plate 12. Since the encapsulation layer 50 surrounds and contacts the first transparent cover plate 11 and the second transparent cover plate 12, the first transparent cover plate 11, the second transparent cover plate 12, and the encapsulation layer 50 form an encapsulation region 51. The material of the second transparent cover plate 12 is similar to that of the first transparent cover plate 11, and will not be described in detail here.

[0078] In some embodiments, the photovoltaic cell encapsulation structure 1 may further include a second lower conductive layer 22, a second photovoltaic unit 32, a second upper conductive layer 42, an insulating layer (not shown), a reflective layer (not shown), an air-absorbing unit (not shown), and an electrode wire 70.

[0079] The second lower conductive layer 22 is disposed on the side 11S of the first transparent cover plate 11, adjacent to the first lower conductive layer 21 and electrically connected to the first upper conductive layer 41; the second photovoltaic unit 32 is disposed on the side 22S of the second lower conductive layer 22; the second upper conductive layer 42 is disposed on the side 32S of the second photovoltaic unit 32. The components and arrangement of the second lower conductive layer 22, the second photovoltaic unit 32 and the second upper conductive layer 42 are similar to those of the first lower conductive layer 21, the first photovoltaic unit 31 and the first upper conductive layer 41, except that the second lower conductive layer 22 is located next to the first lower conductive layer 21 and electrically connected to the first upper conductive layer 41 to form a series connection of batteries.

[0080] An insulating layer is disposed between the first photovoltaic unit 31 and the second photovoltaic unit 32. The insulating layer may or may not be in contact with the first photovoltaic unit 31 and the second photovoltaic unit 32 to prevent short circuits between the first photovoltaic unit 31 and the second photovoltaic unit 32. The thickness of the insulating layer may be, for example, 10-500 μm, to support the first transparent cover plate 11 and the second transparent cover plate 12.

[0081] A reflective layer is disposed on the first photovoltaic unit 31. The reflective layer can be formed on the first photovoltaic unit 31, for example, by evaporation of aluminum or silver. In this way, sunlight that is not absorbed by the first photovoltaic unit 31 is reflected back onto the first photovoltaic unit 31, thereby increasing the light utilization rate.

[0082] A suction unit is disposed within the encapsulation area 51. The suction unit may be, for example, a gas gatter or a gas collector. The material of the suction unit may be, for example, a metal, alloy, or other adsorbent material capable of absorbing air, moisture, or other gases. This prevents gases generated during the heating of the encapsulation layer 50, such as volatile gases from laser-sintered silicone sealant, from damaging other components within the encapsulation area 51.

[0083] The electrode wire 70 may be disposed on, for example, the first transparent cover plate 11 or the first lower conductive layer 21, electrically connected to the first lower conductive layer 21, and includes a flat cable connection area. In some embodiments, the electrode wire 70 may be electrically connected to the first lower conductive layer 21 outside the encapsulation area 51 by adhesive or bonding. In some embodiments, the material of the electrode wire 70 may be a flexible flat cable (FPC) or printed copper foil, printed copper wire, or printed silver paste.

[0084] As described above, the first transparent cover plate 11, the second transparent cover plate 12, the adhesive layer 60, and the encapsulation layer 50 of the photovoltaic cell encapsulation structure 1 of this application can maintain the vacuum in the encapsulation area 51, achieving the effect of blocking water and gas. The first upper conductive layer 41 or insulating layer can uniformly support the first transparent cover plate 11 and the second transparent cover plate 12 within the encapsulation area 51, making the structure of the photovoltaic cell encapsulation structure 1 stable and not easily deformed, improving the thickness uniformity, ensuring accurate alignment of the first transparent cover plate 11 and the second transparent cover plate 12, and eliminating the need for additional filler material.

[0085] Furthermore, the thickness 60D of the adhesive layer 60 in the photovoltaic cell encapsulation structure 1 of this application is 10-500μm, which allows the encapsulation area 51 to be temporarily maintained during the manufacturing process, enabling the encapsulation layer 50 to be heated in an atmospheric pressure environment. The thickness 50D of the encapsulation layer 50, being 10-500μm, can support the first transparent cover plate 11 and the second transparent cover plate 12. The thickness 41D of the first upper conductive layer 41 is 0.1-500μm, and the thickness of the insulating layer is 10-500μm, which can uniformly support the first transparent cover plate 11 and the second transparent cover plate 12. The thickness 21D of the first lower conductive layer 21 is 0.05-10μm, which can be disposed within the encapsulation area 51 and is easy to manufacture. The thickness 31D of the first photovoltaic unit 31 is 0.1-10μm, which can be disposed within the encapsulation area 51 and is easy to manufacture.

[0086] Figure 4A This is a schematic diagram of the manufacturing state of a photovoltaic cell packaging structure according to an embodiment of this application. Figure 4B This is a schematic diagram of the manufacturing state of a photovoltaic cell packaging structure according to an embodiment of this application. Figure 5 This is a step diagram illustrating a method for manufacturing a photovoltaic cell encapsulation structure according to an embodiment of this application. Please refer to... Figure 1 , Figure 2 , Figure 4A , Figure 4B and Figure 5As shown, the manufacturing method of the photovoltaic cell encapsulation structure in this embodiment includes steps S01 to S07. Step S01 involves coating an encapsulation layer on the side of the first transparent cover or the side of the second transparent cover. Step S02 involves baking the encapsulation layer to bond it to the first or second transparent cover. Step S03 involves attaching an adhesive layer to the side of the first or second transparent cover. Step S04 involves aligning the first and second transparent covers. Step S05 involves placing the first transparent cover, the second transparent cover, the encapsulation layer, and the adhesive layer into a vacuum environment. Step S06 involves heating and pressing the first and second transparent covers together, causing the adhesive layer to bond the first and second transparent covers. Step S07 involves heating the encapsulation layer, causing it to bond the first and second transparent covers. The manufacturing method of this embodiment can manufacture the photovoltaic cell encapsulation structure 1 as described in any of the above embodiments, but it is not limiting. The manufacturing method of this embodiment can also manufacture other different photovoltaic cell encapsulation structures.

[0087] In step S01, an encapsulation layer 50 is applied to the side 11S of the first transparent cover plate 11 or the side 12S of the second transparent cover plate 12. The encapsulation layer 50 may be, for example, silicone sealant. The encapsulation layer 50 can be applied to the side 11S of the first transparent cover plate 11 or the side 12S of the second transparent cover plate 12 using a dispensing machine (applied adhesive). In some embodiments, an encapsulation layer 50 with a thickness 50D of 15-25 μm may be applied to the side 11S of the first transparent cover plate 11 or the side 12S of the second transparent cover plate 12.

[0088] In step S02, the encapsulation layer 50 is baked to bond the encapsulation layer 50 to the first transparent cover plate 11 or the second transparent cover plate 12. In some embodiments, the encapsulation layer 50 can be baked at 200-500°C for 90-120 minutes to make the thickness 50D of the encapsulation layer 50 20±2μm to bond the encapsulation layer 50 to the first transparent cover plate 11 or the second transparent cover plate 12.

[0089] In some embodiments, the first transparent cover plate 11 or the second transparent cover plate 12 and the encapsulation layer 50 can be placed in a room temperature environment to cool the first transparent cover plate 11 or the second transparent cover plate 12 and the encapsulation layer 50 to room temperature.

[0090] In step S03, an adhesive layer 60 is attached to the side 11S of the first transparent cover plate 11 or the side 12S of the second transparent cover plate 12. In some embodiments, the adhesive layer 60 is a polyolefin elastomer (POE) disposed around the first transparent cover plate 11 or the second transparent cover plate 12. The polyolefin elastomer is a dry film, which can be cut and used, and its thickness can be uniformly controlled, which is beneficial for subsequent heating operations.

[0091] It is worth noting that the encapsulation layer 50 can be coated on either the first transparent cover 11 or the second transparent cover 12, and the adhesive layer 60 can also be coated on either the first transparent cover 11 or the second transparent cover 12. Therefore, there are at least four combinations as follows: both the encapsulation layer 50 and the adhesive layer 60 are coated on the first transparent cover 11; both the encapsulation layer 50 and the adhesive layer 60 are coated on the second transparent cover 12; the encapsulation layer 50 is coated on the first transparent cover 11 and the adhesive layer 60 is coated on the second transparent cover 12; and the encapsulation layer 50 is coated on the second transparent cover 12 and the adhesive layer 60 is coated on the first transparent cover 11.

[0092] In some embodiments, the thickness 60D of the adhesive layer 60 is 1.0-2.0 times the thickness 50D of the encapsulation layer 50, for example, it can be 40±5μm, but this is not limiting. When the thickness 60D of the adhesive layer 60 is 1.0-2.0 times the thickness 50D of the encapsulation layer 50, the overflow area of ​​the adhesive layer 60 during lamination is smaller, the amount of adhesive layer 60 used is less, and the adhesive layer 60 will not affect or cover the glass glue of the encapsulation layer 50, thus affecting the future sintering effect with the upper and lower cover plates. If the thickness 60D of the adhesive layer 60 is less than the thickness 50D of the encapsulation layer 50, the adhesive layer 60 cannot adhere to the first transparent cover plate 11 and the second transparent cover plate 12, and the adhesive layer 60 cannot temporarily adhere to the first transparent cover plate 11 and the second transparent cover plate 12 and maintain the vacuum of the encapsulation area 51.

[0093] In step S04, the first transparent cover plate 11 and the second transparent cover plate 12 are aligned. The first transparent cover plate 11 and the second transparent cover plate 12 can be aligned, for example, by using a fixing fixture. In some embodiments, the second transparent cover plate 12 can contact the first upper conductive layer 41 to facilitate alignment.

[0094] In step S05, the first transparent cover plate 11, the second transparent cover plate 12, the encapsulation layer 50, and the adhesive layer 60 are placed in a vacuum environment. The first transparent cover plate 11, the second transparent cover plate 12, the encapsulation layer 50, and the adhesive layer 60 can be placed inside a vacuum pressing mechanism first, and then a vacuum is drawn to reduce the air pressure inside the cavity of the vacuum pressing mechanism to below 10. -1 Entrust.

[0095] In step S06, the first transparent cover plate 11 and the second transparent cover plate 12 are heated and pressed together, so that the adhesive layer 60 adheres to the first transparent cover plate 11 and the second transparent cover plate 12. In some embodiments, the first transparent cover plate 11 and the second transparent cover plate 12 can be heated and pressed together at 80-150°C for 5-10 minutes, so that the thickness 60D of the adhesive layer 60 is the same as the thickness 50D of the encapsulation layer 50, for example, 20μm, and the adhesive layer 60 adheres to the first transparent cover plate 11 and the second transparent cover plate 12.

[0096] In some embodiments, the first transparent cover 11, the second transparent cover 12, the encapsulation layer 50, and the adhesive layer 60 can be placed in an atmospheric pressure environment. Since the adhesive layer 60 temporarily adheres to the first transparent cover 11 and the second transparent cover 12 and maintains the vacuum in the encapsulation area 51, subsequent steps can be performed in an atmospheric pressure environment to reduce the complexity of the process.

[0097] In step S07, the encapsulation layer 50 is heated to bond the encapsulation layer 50 to the first transparent cover plate 11 and the second transparent cover plate 12. The heating method can be, for example, laser heating, which will not damage the first photovoltaic unit 31 and fuse the encapsulation layer 50 with the first transparent cover plate 11 and the second transparent cover plate 12.

[0098] Figure 6 This is a step diagram illustrating a method for manufacturing a photovoltaic cell encapsulation structure according to another embodiment of this application. Please refer to... Figure 6 As shown, the manufacturing method of the photovoltaic cell encapsulation structure in this embodiment includes steps S11 to S19. Step S11 involves coating an encapsulation layer with a thickness of 15-25 μm onto the side of the first transparent cover or the side of the second transparent cover. Step S12 involves baking the encapsulation layer at 200-500°C for 90-120 minutes to reduce the thickness of the encapsulation layer to approximately 20 μm to bond the encapsulation layer to the first or second transparent cover. Step S13 involves placing the first or second transparent cover and the encapsulation layer in a room temperature environment. Step S14 involves attaching an adhesive layer to the side of the first or second transparent cover, wherein the thickness of the adhesive layer is 1.0-2.0 times the thickness of the encapsulation layer. Step S15 involves aligning the first and second transparent cover. Step S16 involves placing the first transparent cover, the second transparent cover, the encapsulation layer, and the adhesive layer in an environment with a pressure less than or equal to 10... -1 The process involves creating a vacuum environment. Step S17 involves heating and pressing the first and second transparent cover plates at 80-150°C for 5-10 minutes to make the thickness of the adhesive layer the same as the thickness of the encapsulation layer, and to bond the adhesive layer to the first and second transparent cover plates. Step S18 involves placing the first transparent cover plate, the second transparent cover plate, the encapsulation layer, and the adhesive layer into a normal pressure environment. Step S19 involves heating the encapsulation layer to bond it to the first and second transparent cover plates. The manufacturing method of this embodiment can manufacture the photovoltaic cell encapsulation structure 1 as described in any of the above embodiments, but it is not limiting. The manufacturing method of this embodiment can also manufacture other different photovoltaic cell encapsulation structures. The main differences between the manufacturing method of this embodiment and the aforementioned embodiments are as follows.

[0099] Step S11 additionally requests that the thickness 50D of the encapsulation layer 50 before baking be 15-25 μm. Step S12 additionally requests that the baking conditions be 200-500℃ for 90-120 minutes for the encapsulation layer 50, resulting in a thickness 50D of 20±2 μm after baking. Step S13 additionally requests that the first transparent cover plate 11 or the second transparent cover plate 12 and the encapsulation layer 50 be placed in a room temperature environment to facilitate the subsequent application of the adhesive layer 60. Step S14 additionally requests that the thickness 60D of the adhesive layer 60 be 1.0-2.0 times the thickness 50D of the encapsulation layer 50, allowing for the use of less adhesive layer 60 while achieving better results. Step S15 is similar to step S04. Step S16 additionally requests that the vacuum environment pressure be less than or equal to 10. -1 Step S17 additionally applies the condition of heat pressing, which involves heating and pressing the first transparent cover plate 11 and the second transparent cover plate 12 at 80-150°C for 5-10 minutes, so that the thickness 60D of the adhesive layer 60 is the same as the thickness 50D of the encapsulation layer 50. Step S18 additionally applies the placement of the first transparent cover plate 11, the second transparent cover plate 12, the encapsulation layer 50, and the adhesive layer 60 in an atmospheric pressure environment to reduce the complexity of the process. Step S19 is similar to step S07.

[0100] In summary, the first transparent cover, second transparent cover, adhesive layer, and encapsulation layer of the photovoltaic cell encapsulation structure of this application can maintain the vacuum in the encapsulation area, achieving the effect of blocking water and gas. The first upper conductive layer or insulating layer can uniformly support the first and second transparent cover within the encapsulation area, making the photovoltaic cell encapsulation structure stable and not easily deformed, improving the thickness uniformity, ensuring accurate alignment of the first and second transparent cover, and eliminating the need for additional filler material.

[0101] Furthermore, the adhesive layer thickness of the photovoltaic cell encapsulation structure in this application is 10-500 μm, which allows the vacuum in the encapsulation area to be temporarily maintained during manufacturing, enabling the encapsulation layer to be heated in an atmospheric pressure environment. The 10-500 μm thickness of the encapsulation layer supports the first and second transparent cover plates. The thickness of the first upper conductive layer (0.1-500 μm) and the thickness of the insulating layer (10-500 μm) uniformly support the first and second transparent cover plates. The thickness of the first lower conductive layer (0.05-10 μm) allows it to be disposed within the encapsulation area and is easy to manufacture. The thickness of the first photovoltaic unit (0.1-10 μm) allows it to be disposed within the encapsulation area and is easy to manufacture.

[0102] The photovoltaic cell encapsulation structure manufacturing method of this application uses an adhesive layer to temporarily adhere a first transparent cover plate and a second transparent cover plate while maintaining an internal vacuum. The encapsulation layer can be heated in an atmospheric pressure environment, simplifying the laser heating operation. The encapsulation area can maintain at least 10 -1The vacuum is created to achieve water and gas barrier effects. The error between the first and second transparent covers can be controlled to below 5μm.

[0103] Unless otherwise defined herein, terms such as "substantially" and "approximately" are used to describe and narrate small changes. When used in the context of an event or situation, these terms may include the exact moment the event or situation occurred, or an approximate point in time. For example, when used in the context of numerical values, these terms may include a range of variation less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%.

[0104] The foregoing outlines components of several embodiments to enable those skilled in the art to better understand the concepts of the embodiments described herein. Those skilled in the art should understand that the embodiments described herein can be used as a basis to design or modify other processes and structures to achieve the same purpose and / or benefits as the embodiments described herein. Those skilled in the art should also understand that these equivalent structures do not depart from the spirit and scope of this application, and various changes, substitutions, and other options can be made therein without departing from the spirit and scope of this application. Therefore, the scope of protection of this application shall be determined by the appended claims.

Claims

1. A photovoltaic cell packaging structure, characterized in that, include: First transparent cover; The first lower conductive layer is disposed on the side of the first transparent cover plate; The first photovoltaic unit is disposed on the side of the first lower conductive layer; A first upper conductive layer is disposed on the side of the first photovoltaic unit; An encapsulation layer is disposed around the first transparent cover plate; An adhesive layer is disposed around the first transparent cover plate and adjacent to the encapsulation layer; and A second transparent cover plate is disposed on the encapsulation layer and the adhesive layer, and is in contact with the first upper conductive layer; The first transparent cover, the second transparent cover, and the encapsulation layer form an encapsulation area.

2. The photovoltaic cell packaging structure as described in claim 1, characterized in that, The adhesive layer is disposed inside the encapsulation layer and located within the encapsulation area.

3. The photovoltaic cell packaging structure as described in claim 1, characterized in that, The adhesive layer is disposed on the outside of the encapsulation layer and located outside the encapsulation area.

4. The photovoltaic cell packaging structure as described in claim 1, characterized in that, The thickness of the adhesive layer is 10-500 μm.

5. The photovoltaic cell packaging structure as described in claim 4, characterized in that, The thickness of the encapsulation layer is 10-500 μm.

6. The photovoltaic cell packaging structure as described in claim 1, characterized in that, The thickness of the first upper conductive layer is 0.1-500 μm.

7. The photovoltaic cell packaging structure as described in claim 1, characterized in that, The thickness of the first lower conductive layer is 0.05-10 μm.

8. The photovoltaic cell packaging structure as described in claim 1, characterized in that, The thickness of the first photovoltaic unit is 0.1-10 μm.

9. The photovoltaic cell packaging structure as described in claim 1, characterized in that, Also includes: The second lower conductive layer is disposed on the side of the first transparent cover plate, adjacent to the first lower conductive layer and electrically connected to the first upper conductive layer; and The second photovoltaic unit is disposed on the side of the second lower conductive layer; and An insulating layer is disposed between the first photovoltaic unit and the second photovoltaic unit; The thickness of the insulating layer is 10-500 μm.

10. The photovoltaic cell packaging structure as described in claim 1, characterized in that, The adhesive layer is a polyolefin elastomer (POE), ionomer, ethylene vinyl acetate (EVA), polyurethane (PU), polyvinyl butyral (PVB), or polyisobutylene (PIB).

11. The photovoltaic cell packaging structure as described in claim 1, characterized in that, Also includes: A reflective layer is disposed on the first photovoltaic unit.

12. The photovoltaic cell packaging structure as described in claim 1, characterized in that, Also includes: An air intake unit is disposed within the encapsulation area.

13. A method for manufacturing a photovoltaic cell encapsulation structure, characterized in that, include: An encapsulation layer is coated on the side of the first transparent cover or the side of the second transparent cover; The encapsulation layer is baked to bond the encapsulation layer to the first transparent cover or the second transparent cover; An adhesive layer is attached to the side of the first transparent cover or the side of the second transparent cover; Align the first transparent cover plate and the second transparent cover plate; The first transparent cover, the second transparent cover, the encapsulation layer and the adhesive layer are placed in a vacuum environment; The first transparent cover plate and the second transparent cover plate are heated and pressed together, so that the adhesive layer adheres to the first transparent cover plate and the second transparent cover plate; and The encapsulation layer is heated to bond the encapsulation layer to the first transparent cover and the second transparent cover.

14. The manufacturing method as described in claim 13, characterized in that, The process of heating and pressing the first transparent cover plate and the second transparent cover plate together, so that the adhesive layer bonds the first transparent cover plate and the second transparent cover plate, and heating the encapsulation layer to bond the encapsulation layer to the first transparent cover plate and the second transparent cover plate, further includes: The first transparent cover, the second transparent cover, the encapsulation layer, and the adhesive layer are placed in an atmospheric pressure environment.

15. The manufacturing method as described in claim 13, characterized in that, Coating the encapsulation layer on the side of the first transparent cover or the side of the second transparent cover further includes: A packaging layer with a thickness of 15-25 μm is coated on the side of the first transparent cover or the side of the second transparent cover; Baking the encapsulation layer to bond the encapsulation layer to the first transparent cover or the second transparent cover further includes: The encapsulation layer is baked to a thickness of approximately 20 μm to bond the encapsulation layer to the first transparent cover or the second transparent cover.

16. The manufacturing method as described in claim 13, characterized in that, Baking the encapsulation layer to bond the encapsulation layer to the first transparent cover or the second transparent cover further includes: The encapsulation layer is baked at 200-500°C for 90-120 minutes to bond the encapsulation layer to the first transparent cover or the second transparent cover.

17. The manufacturing method as described in claim 13, characterized in that, The process of baking the encapsulation layer to bond the encapsulation layer to the first transparent cover or the second transparent cover and the adhesive layer attached to the side of the first transparent cover or the side of the second transparent cover further includes: Place the first transparent cover or the second transparent cover and the encapsulation layer into a room temperature environment.

18. The manufacturing method as described in claim 13, characterized in that, The adhesive layer is further attached to the side of the first transparent cover or the side of the second transparent cover, including: The adhesive layer is attached to the side of the first transparent cover or the side of the second transparent cover, wherein the thickness of the adhesive layer is 1.0-2.0 times the thickness of the encapsulation layer.

19. The manufacturing method as described in claim 13, characterized in that, Placing the first transparent cover, the second transparent cover, the encapsulation layer, and the adhesive layer into the vacuum environment further includes: The first transparent cover, the second transparent cover, the encapsulation layer, and the adhesive layer are placed in an atmosphere with a pressure of less than or equal to 10. -1 The vacuum environment described by Tor.

20. The manufacturing method as described in claim 13, characterized in that, The process of heating and pressing the first transparent cover plate and the second transparent cover plate together, so that the adhesive layer bonds the first transparent cover plate and the second transparent cover plate, further includes: The first transparent cover and the second transparent cover are heated and pressed at 80-150℃ for 5-10 minutes to make the thickness of the adhesive layer the same as the thickness of the encapsulation layer, and to make the adhesive layer bond the first transparent cover and the second transparent cover.

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