Photoelectric device packaging structure with multiband multi-window collaborative partition heat dissipation

Abstract

The invention relates to a multi-band multi-window collaborative partitioned heat dissipation photoelectric device packaging structure, and belongs to the technical field of photoelectric device packaging. The structure comprises a partition heat dissipation substrate assembly, a sub-band multi-window cover plate assembly and a tube shell. The partition heat dissipation substrate assembly comprises a circuit board, a heat dissipation module and a photoelectric detection chip. The circuit board is divided into N independent areas, and each area is provided with a photoelectric detection chip mounting groove; independent heat dissipation modules are mounted at the bottoms of the independent areas respectively; the sub-band multi-window cover plate assembly comprises a cover plate and a sub-band light window element; the cover plate is provided with N light window hole sites corresponding to the mounting positions of the photoelectric detection chips; the sub-band light window element is used for transmitting light of different bands; the sub-band multi-window cover plate assembly and the tube shell are fixed to form a sealed cavity, and the sub-band heat dissipation substrate assembly is arranged in the cavity. According to the invention, high light transmission, partitioned uniform heat dissipation, high air tightness and accurate light path alignment of the multiband photoelectric device are realized, and the working stability of the multiband photoelectric device in a complex environment is improved.

Description

Technical Field

[0001] This invention belongs to the field of optoelectronic device packaging technology, and relates to an optoelectronic device packaging structure with multi-band, multi-window, collaborative partitioned heat dissipation. Background Technology

[0002] With the widespread application of photoelectric detection technology in aerospace, security monitoring, industrial inspection, and autonomous driving, the performance requirements for photoelectric detection devices are increasing. In order to adapt to complex and ever-changing environments and acquire richer information, multispectral fusion sensing (i.e., simultaneously acquiring information from multiple bands such as visible light and infrared in the same system) has become an important trend in industry development.

[0003] However, most existing mainstream optoelectronic devices adopt a single-band, single-window packaging structure, meaning that a single package contains only one specific spectral window for packaging a single type of optoelectronic chip. This structure cannot achieve simultaneous photoelectric sensing and detection of multiple spectral bands (such as visible light, short-wave infrared, and long-wave infrared) on a single device, making it difficult to meet the demands of modern systems for miniaturization, integration, and multi-dimensional information acquisition.

[0004] Although some attempts have been made to implement multi-band integrated optoelectronic device packaging technologies, there are still many technical bottlenecks that are difficult to overcome in practical applications, specifically in the following four aspects: (1) The window material has poor band adaptability and low spectral transmittance.

[0005] Existing technologies typically attempt to use optical windows made of a single material to cover all operating wavelengths. However, different wavelengths have drastically different requirements for the transmittance characteristics of optical materials. Existing single-material optical windows cannot simultaneously meet the high transmittance requirements of short-wave infrared (spectral range: 900nm–1700nm), visible light (spectral range: 450nm–900nm), and long-wave infrared (spectral range: 8μm–14μm). This results in signal transmittance of less than 95% in some wavelengths, and even signal attenuation exceeding 20% ​​in certain wavelengths, severely impacting the sensitivity and signal-to-noise ratio of multi-wavelength detection.

[0006] (2) Uneven heat dissipation in chip integration makes thermal management difficult.

[0007] In multi-band integrated packaging, different types of optoelectronic chips are typically integrated onto the same substrate. Due to the different operating mechanisms of chips in different bands, their heat generation power varies significantly (for example, the heat generation of long-wave infrared chips is typically much higher than that of visible light chips). Existing centralized heat dissipation designs cannot cope with this differentiated heat flux density, easily leading to localized high temperatures in high-power areas such as long-wave chips. This uneven heat dissipation not only causes chip performance drift but also leads to thermal stress concentration within the device, thereby significantly shortening its lifespan.

[0008] (3) Traditional sealing processes have low reliability and are difficult to adapt to harsh environments.

[0009] Existing multi-band device packaging often employs traditional adhesive sealing processes. Under harsh environments such as high and low temperature cycling, high humidity, or drastic pressure changes, the adhesive material is prone to aging, embrittlement, or cracking, leading to hermeticity failure. The leakage rate of existing packaging technologies is typically greater than 1×10⁻⁶. -6 Pa.m 3 / s, which cannot meet the stringent requirements for airtightness of high-reliability optoelectronic devices, limiting their application in extreme environments.

[0010] (4) The optical path alignment accuracy is low and the signal synchronization is poor.

[0011] In existing packaging structures, the relative positioning of the optical window and the internal chip mainly relies on manual assembly or low-precision tooling. This method is prone to optical path misalignment, with deviations often exceeding 0.5 mm. This alignment error causes the detection fields of view (FOV) of different bands to not coincide, severely affecting the synchronization of cross-band signals and the accuracy of fusion processing.

[0012] In summary, in order to overcome the shortcomings of existing technologies in terms of band adaptability, heat dissipation management, sealing reliability and optical path alignment accuracy, it is particularly important to develop a novel multi-band, multi-window, collaborative partitioned heat dissipation packaging structure for optoelectronic devices. Summary of the Invention

[0013] In view of this, the purpose of the present invention is to provide a photoelectric device packaging structure of "wavelength-segmented optical window matching + partitioned heat dissipation + high airtight (vacuum) welding and sealing", so as to achieve high light transmittance, partitioned uniform heat dissipation, high airtightness and precise optical path alignment of multi-wavelength photoelectric devices, and improve their working stability in complex environments.

[0014] To achieve the above objectives, the present invention provides the following technical solution: A multi-band, multi-window, collaborative partitioned heat dissipation optoelectronic device packaging structure includes a partitioned heat dissipation substrate assembly, a multi-band, multi-window cover plate assembly, and a housing. The partitioned heat dissipation substrate assembly includes a circuit board, a heat dissipation module, and a photoelectric detection chip; the circuit board is divided into N independent regions, and each region has a photoelectric detection chip mounting slot; independent heat dissipation modules are installed at the bottom of the multiple independent regions; N is an integer greater than 2; The multi-wavelength band cover plate assembly includes a cover plate and a multi-wavelength band optical window element; the cover plate has N optical window positions, corresponding to the installation positions of the photoelectric detection chip; the multi-wavelength band optical window element is used to transmit light of different wavelengths. The multi-window cover plate assembly with different wavelengths is fixed to the tube shell to form a sealed cavity, and the partitioned heat dissipation substrate assembly is disposed in the cavity.

[0015] Preferably, the N independent regions include the short-wavelength region, the visible light region, and the long-wavelength region, i.e., N=3.

[0016] Preferably, the photoelectric detection chip includes short-wave, visible light and long-wave detection chips, which are installed in an equilateral triangle in each area.

[0017] Preferably, each chip is independently mounted with a cold shield to prevent thermal radiation from flowing across the circuit.

[0018] Preferably, conductive silver paste is used to bond each chip to the heat dissipation module.

[0019] Preferably, each heat dissipation module uses a TEC temperature controller.

[0020] Preferably, the edges of the holes on the cover plate are set with steps for mounting the light window glass.

[0021] Preferably, the wavelength-division optical window element includes short-wavelength and visible light optical windows, which employ sapphire glass and anti-reflection coatings; and long-wavelength optical windows, which employ zinc sulfide crystals and Ge anti-reflection coatings.

[0022] Preferably, both the cover plate and the tube shell are made of silicon carbide aluminum (SiC / Al).

[0023] Preferably, the assembly and sealing process of the optoelectronic device packaging structure of the present invention is as follows: after the multi-window cover plate assembly is fixed to the tube shell, the cover plate is precisely fastened, that is, the optical path of the multi-window optical element and the photoelectric detection chip are aligned, and the solder ring is melted by laser welding to form a continuous weld. After welding, a vacuum is drawn and the exhaust hole is sealed.

[0024] The beneficial effects of this invention are as follows: (1) Band-specific optical window matching design: Customized optical window materials and anti-reflection films for different bands to ensure high transmittance for each band.

[0025] (2) Precise optical path positioning: Cover plate positioning steps + partition layout to ensure the optical path alignment accuracy between the optical window and the chip.

[0026] (3) High heat dissipation efficiency: The heat dissipation power of sensing chips in different bands is uneven. A partitioned heat dissipation design is carried out, and the TEC controls the temperature separately. The heat conduction between chips does not interfere with each other, achieving efficient heat dissipation and extending the device life by more than 3 times compared with conventional design.

[0027] (4) High airtight welding seal: Solder ring + laser welding replaces traditional bonding, greatly improving the airtightness of the package; (5) Good mass production capability: Standardized packaging assembly + welding can be matched with automated production lines, and the production efficiency is more than 3 times higher than that of manual assembly; In summary, the multi-band, multi-window design of this invention is highly adaptable and can meet the requirements for efficient operation of multiple band spectra within the same device. Furthermore, it can be customized according to the specific needs of optoelectronic devices based on different band spectra. It can be used in fields such as optical communication, photoelectric detection, and lidar. Specifically, it is suitable for high-airtightness, zoned heat dissipation integrated packaging scenarios of multi-band (shortwave, visible light, longwave) optoelectronic devices and can be directly applied to the packaging and manufacturing of multispectral detectors and composite band signal acquisition devices.

[0028] Other advantages, objectives, and features of the invention will be set forth in part in the description which follows, and in part will be apparent to those skilled in the art from the following examination, or may be learned from practice of the invention. The objectives and other advantages of the invention can be realized and obtained through the following description. Attached Figure Description

[0029] To make the objectives, technical solutions, and advantages of the present invention clearer, the preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings, wherein: Figure 1 This is a layout diagram of the multi-band photodetector chip and circuit board assembly. Figure 2 A schematic diagram of the assembly of the light window element and the cover plate; Figure 3 This is a schematic diagram of the overall packaging structure; Figure 4 For the simulation analysis of the overall structure; Figure 5 This is a schematic diagram of the system's heat dissipation. Detailed Implementation

[0030] The following specific examples illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and various details in this specification can be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention. It should be noted that the illustrations provided in the following embodiments are only schematic representations of the basic concept of the present invention. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0031] The accompanying drawings are for illustrative purposes only and are schematic diagrams, not actual pictures, and should not be construed as limiting the invention. To better illustrate the embodiments of the invention, some parts in the drawings may be omitted, enlarged, or reduced, and do not represent the actual product dimensions. It is understandable to those skilled in the art that some well-known structures and their descriptions may be omitted in the drawings.

[0032] In the accompanying drawings of the embodiments of the present invention, the same or similar reference numerals correspond to the same or similar components. In the description of the present invention, it should be understood that if terms such as "upper," "lower," "left," "right," "front," and "rear" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, they are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, the terms used to describe positional relationships in the drawings are only for illustrative purposes and should not be construed as limiting the present invention. For those skilled in the art, the specific meaning of the above terms can be understood according to the specific circumstances.

[0033] Please see Figures 1-5 This embodiment provides a multi-band, multi-window, collaboratively partitioned heat dissipation optoelectronic device packaging structure, including the following structure: (1) Partitioned heat dissipation substrate assembly Circuit board: It adopts aluminum nitride (AlN) substrate and is divided into three independent areas: "short wave zone, visible light zone and long wave zone". Each area has a photoelectric detection chip mounting slot.

[0034] Zoned heat dissipation module: Each of the three independent zones has an independent TEC temperature controller installed at the bottom, and three photoelectric detection chips are independently mounted with a cold shield to prevent heat radiation from flowing across.

[0035] Photoelectric detection chips: Short-wave (such as ultraviolet detectors), visible light (such as silicon-based detectors), and long-wave (such as infrared detectors) detection chips are arranged in an equilateral triangle and installed in corresponding areas (see...). Figure 1 , Figure 2 Conductive silver paste is used to bond the chip and the heat dissipation module. Figure 1 The diagram shown is an assembly layout diagram of the multi-band photodetector chip and its mounting circuit board. Figure 1 The data records the mounting relationships of short-wave, visible light, and long-wave optoelectronic chips on the substrate, arranged in an equilateral triangle layout, indicating the partitioned assembly form of the multi-band chips. Figure 2 The diagram shown is a layout of the cover plate and the wavelength division window. Figure 2 The data shows the equilateral triangular layout of short-wave, visible light, and long-wave optical windows on the cover plate, indicating the multi-window band matching structure.

[0036] (2) Multi-window cover plate assembly for different wavelengths Cover plate: Made of SiC / Al material, with 3 light window holes (corresponding to the three areas of the photoelectric detection chip, also forming an equilateral triangle layout), and light window glass mounting steps set at the edge of the holes.

[0037] Wavelength-division optical window element: ① Short-wave and visible light windows are made of sapphire glass with an anti-reflective coating; ② Long-wavelength optical window, using zinc sulfide crystal + Ge antireflection film.

[0038] Each light window is engaged with the hole in the cover plate via a positioning step, and the gap is filled with solder to seal the gap.

[0039] (3) High-tightness welded packaging structure Tube shell: made of SiC / Al material, with an annular welding groove and an internal solder ring on the sealing edge.

[0040] Assembly and sealing: After the cover plate assembly is fixed to the tube shell, the cover plate is precisely snapped together (the optical window and the chip optical path are aligned). The solder ring is melted by laser welding to form a continuous weld. After welding, a vacuum is drawn and the exhaust hole is sealed.

[0041] Figure 3 The entire record documented the connection relationships of the multi-window element, cover plate, multi-band photoelectric detection chip, and partitioned heat dissipation module. It also recorded the hierarchical relationship of the multi-band photoelectric chip, multiple windows, light windows, and heat dissipation module, indicating the overall welded and sealed structural form.

[0042] Figure 4 This demonstrates that the overall structural components utilize SiC / Al material as the base material for the shell and cover. SiC / Al material is lightweight, strong, has high bending resistance, and good shock resistance, giving it unique advantages as an encapsulation material. Simulation analysis using Ansys finite element software yielded a maximum directional deformation of 0.87 mm, located at the external finned portion of the cavity, which has been successfully tested. This indicates that the overall structural design can be used in harsh environments.

[0043] Figure 5 This is a schematic diagram of the system's heat dissipation, showing that the heat generation power of the sensing chips in different wavelength bands is different (1.5W for visible light, 0.4W for short wavelength, and 0.7W for long wavelength). To avoid mutual interference between different chips, a zoned heat dissipation design is adopted, with TECs controlling the temperature separately. The heat is then conducted to the housing, and the housing is then air-cooled to achieve the goal of ensuring stable chip operation.

[0044] Through the packaging structure experiment of this embodiment, the following good performance can be obtained: (1) High light transmittance: The wavelength-division optical window increases the transmittance of short-wave (spectral range: 900nm~1700nm), visible light (spectral range: 450nm~900nm), and long-wave (spectral range: 8μm~14μm) from <95% to ≥97%, and the signal attenuation rate is reduced by 45% compared with the traditional structure.

[0045] (2) High optical path accuracy: The positioning structure improves the optical path deviation between the optical window and the chip from 0.5mm to ≤0.1mm.

[0046] (3) High heat dissipation efficiency: The heat dissipation power of sensing chips in different bands is uneven. A partitioned heat dissipation design is carried out, and the TEC controls the temperature separately. The heat conduction between chips does not interfere with each other, achieving efficient heat dissipation and extending the device life by more than 3 times compared with conventional design.

[0047] (4) Strong sealing reliability: Welded sealing + vacuum design improves the leakage rate by 3 orders of magnitude to ≤1×10-9Pa.m3 / s, and there is no airtightness failure after 1000h high and low temperature test.

[0048] (5) Good mass production capability: Standardized packaging assembly + welding can be matched with automated production lines, and the production efficiency is more than 3 times higher than that of manual assembly.

[0049] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit it. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of the present invention without departing from the spirit and scope of the present invention, and all such modifications or substitutions should be covered within the scope of the claims of the present invention.

Claims

1. A packaging structure for optoelectronic devices with multi-band, multi-window, collaborative partitioned heat dissipation, characterized in that, This includes a partitioned heat dissipation substrate assembly, a multi-window cover plate assembly with different wavelengths, and a housing; The partitioned heat dissipation substrate assembly includes a circuit board, a heat dissipation module, and a photoelectric detection chip; the circuit board is divided into N independent regions, and each region has a photoelectric detection chip mounting slot; independent heat dissipation modules are installed at the bottom of the multiple independent regions; N is an integer greater than 2; The wavelength division multi-window cover plate assembly includes a cover plate and a wavelength division optical window element; the cover plate has N optical window holes, corresponding to the installation positions of the photoelectric detection chip; the wavelength division optical window element is used to transmit light of different wavelengths. The multi-window cover plate assembly with the wavelength division is fixed to the tube shell to form a sealed cavity, and the partitioned heat dissipation substrate assembly is disposed in the cavity.

2. The optoelectronic device packaging structure according to claim 1, characterized in that, The N independent regions include the short-wavelength region, the visible light region, and the long-wavelength region, i.e., N=3.

3. The optoelectronic device packaging structure according to claim 2, characterized in that, The photoelectric detection chip includes short-wave, visible light, and long-wave detection chips, which are installed in an equilateral triangle in each region.

4. The optoelectronic device packaging structure according to claim 1, characterized in that, Each chip is installed with a cold screen independently.

5. The optoelectronic device packaging structure according to claim 1, 3, or 4, characterized in that, Each chip is bonded to the heat dissipation module using conductive silver paste.

6. The optoelectronic device packaging structure according to claim 1, characterized in that, Each heat dissipation module uses a TEC temperature controller.

7. The optoelectronic device packaging structure according to claim 1, characterized in that, The edges of the holes on the cover plate are provided with steps for installing the light window glass.

8. The optoelectronic device packaging structure according to claim 1, characterized in that, The wavelength division optical window element includes short-wave and visible light optical windows, which use sapphire glass and anti-reflection coatings; and long-wave optical windows, which use zinc sulfide crystals and Ge anti-reflection coatings.

9. The optoelectronic device packaging structure according to claim 1, characterized in that, Both the cover plate and the tube shell are made of silicon carbide aluminum.

10. The optoelectronic device packaging structure according to claim 1, characterized in that, The assembly and sealing process of this structure is as follows: after the multi-window cover plate assembly is fixed to the tube shell, the cover plate is precisely snapped together, that is, the optical path of the multi-window optical element and the photoelectric detection chip are aligned. The solder ring is melted by laser welding to form a continuous weld. After welding, a vacuum is drawn and the exhaust hole is sealed.

Images