Dispensing method and dispensing system
By measuring and fitting the three-dimensional dimensions of the dispensing area on the workpiece, and dynamically adjusting the height and width of the adhesive path, the problems of adhesive overflow and insufficient adhesive during the dispensing process are solved, achieving a high-precision dispensing effect.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- SHENZHENSHI YUZHAN PRECISION TECH CO LTD
- Filing Date
- 2025-12-17
- Publication Date
- 2026-04-17
AI Technical Summary
In the existing technology, due to the processing errors and volume differences between the dispensing areas of the workpiece, glue overflow and glue shortage often occur during the dispensing process, which reduces the dispensing accuracy.
By measuring the three-dimensional coordinates of the dispensing area of the workpiece, a color point cloud map is generated. The three-dimensional spatial plane is flexibly fitted, the height and width of the glue path are calculated, and the glue weight and dispensing speed are dynamically adjusted to achieve precise dispensing of areas with different volumes.
It effectively avoids glue overflow and insufficient glue after dispensing, improves dispensing accuracy, and achieves precise control of the amount of glue for each workpiece.
Smart Images
Figure CN121869671A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of dispensing technology, specifically to a dispensing method and a dispensing system. Background Technology
[0002] Currently, a fixed glue dispensing rate is often used to dispense glue onto the designated areas of the workpiece to form a glue layer. Then, the workpiece to be bonded is pressed onto the glue layer, thus completing the assembly of the workpiece and the workpiece. However, there are processing errors between the glue dispensing areas of the workpiece, and the volume of the glue dispensing areas varies between different workpieces. A fixed glue weight cannot accommodate glue dispensing areas with different volumes, resulting in glue overflow and insufficient glue during the dispensing process, leading to low dispensing accuracy. Summary of the Invention
[0003] In view of the above, it is necessary to provide a dispensing method and dispensing system to improve dispensing accuracy.
[0004] One embodiment of this application provides a dispensing method, including: Determine the dispensing area on the workpiece; Measure the three-dimensional coordinates of the dispensing area and generate a color point cloud map of the dispensing area; Based on the three-dimensional size coordinates and color point cloud map of the dispensing area, the three-dimensional spatial plane of the dispensing area is flexibly fitted. Based on the three-dimensional spatial plane of the dispensing area, calculate the three-dimensional fitted average size of the dispensing area; Based on the average dimension of the three-dimensional fitting of the dispensing area, determine the glue path height of the dispensing area and calculate the glue path width of the dispensing area. Determine the glue weight and dispensing speed based on the glue path height and width of the dispensing area; The dispensing area of the workpiece is dispensing based on the glue weight and dispensing speed.
[0005] In the above dispensing method, for different workpieces, the color point cloud map, the three-dimensional spatial plane of the dispensing area, and the three-dimensional fitted average size of the dispensing area are obtained sequentially. Based on the three-dimensional fitted average size of the dispensing area, the glue path height and the glue path width of the dispensing area are determined. Based on the glue path height and width of the dispensing area, the glue weight and dispensing speed of the corresponding dispensing area are obtained. Using this dispensing method, different glue path heights and widths can be obtained for dispensing areas with different volumes, thereby determining the glue weight and dispensing speed of the dispensing area. This enables dynamic adjustment of the glue weight after dispensing, avoiding glue overflow and insufficient glue in the dispensing area of the workpiece, thus improving dispensing accuracy.
[0006] In some embodiments, measuring the three-dimensional dimensional coordinates of the dispensing area and generating a color point cloud map of the dispensing area includes: The measuring beam is projected onto the surface of the workpiece near the dispensing area; Displace the focal point of the measuring beam from the workpiece surface along the dispensing area; Receive the reflected light from the dispensing area and acquire the interference information of the reflected light; Based on interference information, the three-dimensional coordinates of the dispensing area are determined. The reflected light from the dispensing area is fused with the three-dimensional coordinates to obtain a color point cloud map of the dispensing area.
[0007] In some embodiments, determining the three-dimensional dimensional coordinates of the dispensing area based on interference information includes: Based on interference information, determine the size information of the dispensing area; The size information of the dispensing area is converted into three-dimensional coordinates of the dispensing area.
[0008] In some embodiments, the dispensing area is a groove structure with a hollow center. The dispensing area includes an inner contour and an outer contour. Based on the three-dimensional dimensional coordinates and color point cloud map of the dispensing area, a three-dimensional spatial plane of the dispensing area is flexibly fitted, including: Select the first feature point cloud cluster located on the outer contour boundary of the dispensing area and the second feature point cloud cluster located on the inner contour boundary of the dispensing area from the color point cloud image; Obtain the three-dimensional size coordinates of the first feature point cloud cluster, and flexibly fit the X-plane where the dispensing area is located based on the three-dimensional size coordinates of the first feature point cloud cluster. Obtain the three-dimensional size coordinates of the second feature point cloud cluster, and flexibly fit the Y-plane where the dispensing area is located based on the three-dimensional size coordinates of the second feature point cloud cluster.
[0009] In some embodiments, based on the three-dimensional dimensional coordinates of the dispensing area and the color point cloud map, the three-dimensional spatial plane of the dispensing area is flexibly fitted, further comprising: Spatial planar features are extracted from the outer contour boundary of the dispensing area to obtain a third feature point cloud cluster located on the outer side of the outer contour boundary and a fourth feature point cloud cluster located on the inner side of the outer contour boundary. Obtain the three-dimensional size coordinates of the third feature point cloud cluster and the fourth feature point cloud cluster. Based on the three-dimensional size coordinates of the third feature point cloud cluster, flexibly fit the first Z-plane where the dispensing area is located. Based on the three-dimensional size coordinates of the fourth feature point cloud cluster, flexibly fit the second Z-plane where the dispensing area is located. The second Z-plane is set concentrically with the first Z-plane.
[0010] In some embodiments, the three-dimensional fitting average size of the dispensing area includes the X-axis fitting average size and the Y-axis fitting average size, and the calculation methods for the X-axis fitting average size and the Y-axis fitting average size include: The X-plane and Y-plane are divided using the first and second axes of a cross; Obtain the X-coordinate value of the intersection point of the first axis with the X-plane and the Y-plane, and the Y-coordinate value of the intersection point of the second axis with the X-plane and the Y-plane; Based on the X-coordinate values of the intersection points of the first axis with the X-plane and the Y-plane, the X-axis fitted average size of the dispensing area is calculated. ; Based on the Y-coordinate values of the intersection points of the second axis with the X-plane and the Y-plane, the Y-axis fitted average size of the dispensing area is calculated. ,in, < .
[0011] In some embodiments, the three-dimensional fitting average size of the dispensing area further includes a first Z-axis fitting average size and a second Z-axis fitting average size, and the calculation method for the first Z-axis fitting average size and the second Z-axis fitting average size includes: According to a preset angle, the first Z-plane and the second Z-plane are divided, and multiple first Z-intersection points located on the first Z-plane and second Z-intersection points located on the second Z-plane that correspond to the multiple first Z-intersection points are selected. Obtain the Z-coordinate values of multiple first Z-intersection points and multiple second Z-intersection points; Based on the Z-coordinate values of multiple first Z-intersection points and multiple second Z-intersection points, the first Z-fitted average size and the second Z-fitted average size of the dispensing area are calculated.
[0012] In some embodiments, the three-dimensional fitting average size of the dispensing area includes the X-axis fitting average size, the Y-axis fitting average size, the first Z-axis fitting average size, and the second Z-axis fitting average size. Calculating the adhesive path width of the dispensing area includes: The difference between the first Z-axis fitted average size and the second Z-axis fitted average size is used to obtain the glue path height of the dispensing area; Obtain the identification information of the workpiece, and based on the identification information of the workpiece, obtain the thickness of the part to be bonded and the standard capacity of the glue dispensing area; The adhesive path width of the dispensing area is calculated based on the average Y-axis fitted size of the dispensing area, the adhesive path height of the dispensing area, the standard capacity of the dispensing area, and the thickness of the part to be bonded.
[0013] In some embodiments, the dispensing method further includes: Based on the X-axis fitted average size and Y-axis fitted average size of the dispensing area, a first threshold for the glue path width of the dispensing area in the X-axis and a second threshold for the glue path width in the Y-axis are determined. Based on the first threshold and the second threshold, it is determined whether the glue path width of the dispensing area meets the requirements. Only when the glue path width of the dispensing area is greater than the first threshold and less than the second threshold does the glue path width of the dispensing area meet the requirements; otherwise, it does not meet the requirements.
[0014] An embodiment of this application also provides a dispensing system employing the dispensing method of the above embodiment. The dispensing system includes a measuring device, a processor, and a dispensing apparatus. The measuring unit measures the three-dimensional coordinates of the dispensing area of the workpiece and generates a color point cloud map of the dispensing area. It also transmits the three-dimensional coordinates and the color point cloud map of the dispensing area to the processor. The processing unit flexibly fits a three-dimensional spatial plane of the dispensing area based on the three-dimensional coordinates and the color point cloud map. It calculates the average three-dimensional fitted size of the dispensing area based on the three-dimensional spatial plane of the dispensing area. It determines the glue path height of the dispensing area and calculates the glue path width based on the average three-dimensional fitted size of the dispensing area. It also determines the glue weight and dispensing speed based on the glue path height and the glue path width of the dispensing area. The dispensing unit dispenses glue onto the dispensing area of the workpiece based on the glue weight and the dispensing speed.
[0015] In the above dispensing system, different glue path heights and widths can be obtained for dispensing areas with different volumes, thereby determining the glue weight and dispensing speed of the dispensing area. This enables dynamic adjustment of the glue weight to avoid glue overflow and insufficient glue in the dispensing area of the workpiece after dispensing, thus improving dispensing accuracy. Attached Figure Description
[0016] Figure 1 This is a schematic flowchart of the dispensing method according to an embodiment of this application.
[0017] Figure 2 This is a schematic diagram of the structure of the workpiece in an embodiment of this application.
[0018] Figure 3 for Figure 1 The flowchart of step S200 is shown.
[0019] Figure 4 for Figure 3 The flowchart of step S240 is shown.
[0020] Figure 5 for Figure 1 The flowchart of step S300 is shown.
[0021] Figure 6 Figure 2 The top view of the workpiece shown.
[0022] Figure 7 Figure 2 The top view of the workpiece shown.
[0023] Figure 8 for Figure 1 The flowchart of step S400 is shown.
[0024] Figure 9 for Figure 1 The flowchart of step S500 is shown.
[0025] Figure 10 This is a schematic diagram of the composition of the dispensing system in an embodiment of this application.
[0026] Key component symbols: dispensing system 100, measuring device 110, light source emitter 111, reference mirror 112, color-coded sensor 113, spectral analyzer 114, processor 120, dispensing equipment 130, workpiece 200, dispensing area 200a, inner contour 200b, outer contour 200c, first axis L1, second axis L2, first Z-plane P1, second Z-plane P2. Detailed Implementation
[0027] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.
[0028] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the term "connection" should be interpreted broadly. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be the internal communication of two elements or the interaction between two elements. In the description of this application, it should be noted that "multiple" means two or more, unless otherwise expressly and specifically limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.
[0029] The embodiments of this application will be described in detail below with reference to the accompanying drawings.
[0030] Please see Figure 1 One embodiment of this application provides a dispensing method for dispensing adhesive to dispensing areas of different workpieces. The required amount of adhesive for each dispensing area varies. This dispensing method allows for adjustment of the dispensing speed and amount for different dispensing areas, preventing adhesive overflow and insufficient adhesive after dispensing. The dispensing method in this application includes: S100, determine the dispensing area on the workpiece.
[0031] Please see Figure 2 For example, the dispensing area 200a of the workpiece 200 is a groove structure with a hollow center. The dispensing area 200a includes an inner contour 200b and an outer contour 200c. Dispensing is performed between the inner contour 200b and the outer contour 200c using a dispensing method. The aforementioned glue shortage phenomenon refers to the phenomenon that there is no glue in the area between the inner contour 200b and the outer contour 200c after dispensing. The aforementioned glue overflow phenomenon refers to the phenomenon that glue flows into at least one of the inner contour 200b or the outer contour 200c after dispensing.
[0032] S200 measures the three-dimensional coordinates of the dispensing area 200a and generates a color point cloud map of the dispensing area 200a.
[0033] The color point cloud map of the dispensing area 200a can clearly show the dispensing area 200a of the workpiece 200, which is convenient for subsequent measurement.
[0034] Please see Figure 3 In some embodiments, step S200, which measures the three-dimensional dimensional coordinates of the dispensing region 200a and generates a color point cloud map of the dispensing region 200a, includes: S210, the measuring beam is projected onto the surface of the workpiece 200 near the dispensing area 200a.
[0035] For example, the measuring beam can be projected outside the outer contour 200c of the dispensing area 200a.
[0036] S220 causes the focal point of the measuring beam to be displaced along the dispensing area 200a from the surface of the workpiece 200.
[0037] For example, when the focal point of the measuring beam is displaced along the dispensing area 200a, the measuring beam light will be reflected by the surface of the workpiece 200 to form reflected light. Since the depth of the dispensing area 200a is different, the time for the measuring beam to form reflected light will also be different.
[0038] For example, please see Figure 10 In this embodiment, a measuring device is used to implement step S220. The measuring device 110 includes a light source emitter 111 and a reference reflector 112. The light source emitter 111 generates a white measuring beam. The reference reflector 112 scatters the white measuring beam into colored measuring beams of different wavelengths and projects them onto the surface of the workpiece 200 near the dispensing area 200a. The reference reflector 112 is driven to move relative to the workpiece 200, so that the focal point of the measuring beam is displaced from the surface of the workpiece 200 along the dispensing area 200a.
[0039] S230 receives the reflected light from the dispensing area 200a and acquires the interference information of the reflected light.
[0040] It should be noted that the measurement beam can be decomposed into light of different wavelengths. There is a time difference in the time when light of different wavelengths produces reflected light at different depths. The reflected beams can be received by the same sensor and form interference information.
[0041] For example, the measuring device 110 used in this embodiment also includes a color-coded sensor 113. Different wavelength measuring beams generate reflected beams at different depths on the surface of the workpiece 200. The color-coded sensor 113 receives the reflected beams of different wavelengths after being reflected by the workpiece 200 and outputs the interference information of the reflected beams.
[0042] S240, based on interference information, determines the three-dimensional coordinates of the dispensing area 200a.
[0043] For example, the measuring device 110 used in this embodiment also includes a spectral analyzer 114, which determines the three-dimensional size coordinates of the dispensing area 200a based on interference information.
[0044] Please see Figure 4 In some embodiments, step S240, based on interference information, determines the three-dimensional coordinates of the dispensing region 200a, including: S241, Based on the interference information, determine the size information of the dispensing area 200a.
[0045] For example, the dimensions of the dispensing area 200a are planar information.
[0046] S242, convert the size information of the dispensing area 200a into three-dimensional coordinates of the dispensing area 200a.
[0047] S250, the reflected light from the dispensing area 200a is fused with the three-dimensional size coordinates to obtain a color point cloud map of the dispensing area 200a.
[0048] For example, the spectral analyzer 114 calculates displacement information based on interference information and according to the wavelength-displacement conversion curve. Based on the displacement information, the size information of the dispensing area 200a is determined. The size information of the dispensing area 200a is converted into three-dimensional size coordinates of the dispensing area 200a. The reflected light of the dispensing area 200a is fused with the three-dimensional size coordinates to obtain a color point cloud map of the dispensing area 200a.
[0049] S300, based on the three-dimensional size coordinates and color point cloud map of the dispensing area 200a, flexibly fits the three-dimensional spatial plane of the dispensing area 200a.
[0050] For example, the three-dimensional spatial plane of the dispensing area 200a includes an X-plane, a Y-plane, and a Z-plane. The X-plane is the plane containing the outer contour 200c, the Y-plane is the plane containing the inner contour 200b, and the Z-plane includes a first Z-plane P1 located outside the outer contour 200c and a second Z-plane P2 located between the outer contour 200c and the inner contour 200b.
[0051] Please see Figure 5 In some embodiments, step S300, based on the three-dimensional size coordinates and color point cloud map of the dispensing region 200a, flexibly fitting the three-dimensional spatial plane of the dispensing region 200a includes: S310, Select a first feature point cloud cluster located on the boundary of the outer contour 200c of the dispensing region 200a and a second feature point cloud cluster located on the boundary of the inner contour 200b of the dispensing region 200a from the color point cloud image.
[0052] Please see Figure 6 For example, the first feature point cluster includes first feature points X1, Y1, X4, and Y4 that are equally spaced circumferentially along the boundary of the outer contour 200c. In other embodiments, the first feature points may be three, five, or more, and the spacing between the multiple first feature points can be adjusted as needed. The second feature point cluster includes second feature points X2, Y2, X3, and Y3 that are equally spaced circumferentially along the boundary of the inner contour 200b. In other embodiments, the second feature points may be three, five, or more, and the spacing between the multiple second feature points can be adjusted as needed.
[0053] S320, obtain the three-dimensional size coordinates of the first feature point cloud cluster, and flexibly fit the X-plane where the dispensing region 200a is located based on the three-dimensional size coordinates of the first feature point cloud cluster.
[0054] For example, the three-dimensional coordinates of the first feature point cloud cluster are obtained based on the first feature points X1, Y1, X4, Y4 and the three-dimensional size coordinates of the dispensing area 200a obtained in step S240.
[0055] S330, obtain the three-dimensional size coordinates of the second feature point cloud cluster, and flexibly fit the Y-plane where the dispensing region 200a is located based on the three-dimensional size coordinates of the second feature point cloud cluster.
[0056] For example, the three-dimensional coordinates of the second feature point cloud cluster are obtained based on the second feature points X2, Y2, X3, Y3 and the three-dimensional size coordinates of the dispensing area 200a obtained in step S240.
[0057] S340, Spatial planar features are extracted from the boundary of the outer contour 200c of the dispensing area 200a to obtain the third feature point cloud cluster located on the outer side of the boundary of the outer contour 200c in the circumferential direction and the fourth feature point cloud cluster located on the inner side of the boundary of the outer contour 200c in the circumferential direction.
[0058] Please see Figure 7 For example, the third feature point cluster includes third feature points A1, A2, A3, A4, A5, A6, A7, and A8 located outside the outer contour 200c and evenly spaced along the outer contour 200c, and the fourth feature point cluster includes fourth feature points B1, B2, B3, B4, B5, B6, B7, and B8 located inside the outer contour 200c and evenly spaced along the outer contour 200c. In other embodiments, the number of third and fourth feature points can be other than the number of third and fourth feature points, and the spacing between the multiple third feature points and the spacing between the multiple fourth feature points can be adjusted as needed.
[0059] S350, obtain the three-dimensional size coordinates of the third feature point cloud cluster and the four feature point cloud cluster, flexibly fit the first Z-plane P1 where the dispensing area 200a is located based on the three-dimensional size coordinates of the third feature point cloud cluster, flexibly fit the second Z-plane P2 where the dispensing area 200a is located based on the three-dimensional size coordinates of the fourth feature point cloud cluster, and set the second Z-plane P2 and the first Z-plane P1 concentrically.
[0060] For example, the three-dimensional coordinates of the third feature point cloud cluster are obtained based on the third feature points A1, A2, A3, A4, A5, A6, A7, and A8 and in combination with the three-dimensional coordinates of the dispensing area 200a obtained in step S240. Similarly, the three-dimensional coordinates of the fourth feature point cloud cluster are obtained based on the fourth feature points B1, B2, B3, B4, B5, B6, B7, and B8 and in combination with the three-dimensional coordinates of the dispensing area 200a obtained in step S240.
[0061] S400, based on the three-dimensional spatial plane of the dispensing region 200a, calculates the three-dimensional fitted average size of the dispensing region 200a.
[0062] Please see Figure 6 and Figure 8 In some embodiments, the three-dimensional fitting average size of the dispensing region 200a includes the X-axis fitting average size, the Y-axis fitting average size, the first Z-axis fitting average size, and the second Z-axis fitting average size. Step S400, based on the three-dimensional spatial plane of the dispensing region 200a, calculates the three-dimensional fitting average size of the dispensing region 200a, including: S410 uses the first axis L1 and the second axis L2 of the cross intersection to divide the X-plane and the Y-plane.
[0063] For example, the outer contour 200c is circular, and the inner contour 200b is a rounded rectangle. The outer contour 200c and the inner contour 200b are concentric and centrally symmetrical. The first axis L1 and the second axis L2 are the two axes of symmetry of the inner contour 200b. The first axis L1 is horizontal, and the second axis L2 is vertical.
[0064] S420, obtain the X coordinate value of the intersection point of the first axis L1 with the X-plane and the Y-plane, and the Y coordinate value of the intersection point of the second axis L2 with the X-plane and the Y-plane.
[0065] For example, the first axis L1 has four intersection points with the X-plane and the Y-plane, namely X1, X2, X3, and X4. The first axis L2 also has four intersection points with the X-plane and the Y-plane, namely Y1, Y2, Y3, and Y4.
[0066] S430, based on the X-coordinate values of the intersection points (X1, X2, X3, X4) of the first axis L1 with the X-plane and the Y-plane, the X-axis fitted average size of the dispensing area 200a is calculated. .
[0067] For example, the X-axis fitted average size Satisfying the relation: = (X2 + X4 - X1 - X3) / 2.
[0068] Where (X1, X2, X3, X4) are the X coordinates of the intersection points X1, X2, X3, X4.
[0069] S440, based on the Y-coordinate values of the intersection points (Y1, Y2, Y3, Y4) of the second axis L2 with the X-plane and the Y-plane, the Y-axis fitted average size of the dispensing area 200a is calculated. ,in, < .
[0070] For example, the Y-axis fitted average size Satisfying the relation: (Y1+Y3-Y2-Y4) / 2.
[0071] Where (Y1, Y2, Y3, Y4) are the Y coordinates of the intersection points Y1, Y2, Y3, Y4.
[0072] S450, according to a preset angle, divide the first Z-plane P1 and the second Z-plane P2, and select multiple first Z-intersection points (A1-A8) located on the first Z-plane P1 and second Z-intersection points (B1-B8) located on the second Z-plane P2 and corresponding to the multiple first Z-intersection points.
[0073] Please see Figure 7 For example, the preset angle is the time-minute angle. The first Z-plane P1 and the second Z-plane P2 are divided into 8 parts according to the time-minute angle. Eight first Z-intersection points on the first Z-plane P1 and eight second Z-intersection points on the second Z-plane P2 are selected. The eight first Z-intersection points are A1, A2, A3, A4, A5, A6, A7, and A8, which are equally spaced along the outer contour 200c. The eight second Z-intersection points are B1, B2, B3, B4, B5, B6, B7, and B8, which are equally spaced along the outer contour 200c.
[0074] S460, obtain the Z-coordinate values of multiple first Z-intersection points and multiple second Z-intersection points.
[0075] For example, based on the first Z-direction intersection points A1, A2, A3, A4, A5, A6, A7, and A8 and combined with the three-dimensional size coordinates of the dispensing area 200a obtained in step S240, the Z-direction coordinate values of multiple first Z-direction intersection points are obtained; and based on the second Z-direction intersection points B1, B2, B3, B4, B5, B6, B7, and B8 and combined with the three-dimensional size coordinates of the dispensing area 200a obtained in step S240, the Z-direction coordinate values of multiple second Z-direction points are obtained.
[0076] S470, based on the Z-coordinate values of multiple first Z-direction intersection points and multiple second Z-direction intersection points, the first Z-direction fitted average size of the dispensing region 200a is calculated. Second Z-axis fitted average size .
[0077] For example, = (A1 + A2... + A8) / 8, = (B1 + B2 ... + B8) / 8.
[0078] Among them, (A1, A) 2、 ..., A8) are the Z-coordinates of the first Z-axis intersection points A1, A2, A3, A4, A5, A6, A7, A8, (B1, B... 2、 ..., B8) are the Z-coordinates of the second Z-direction intersection points B1, B2, B3, B4, B5, B6, B7, and B8.
[0079] S500, based on the average dimension of the three-dimensional fitting of the dispensing area 200a, determine the glue path height of the dispensing area 200a, and calculate the glue path width W of the dispensing area 200a.
[0080] Please see Figure 9 In some embodiments, step S500, which calculates the adhesive path width of the dispensing region 200a based on the three-dimensional fitted average size of the dispensing region 200a, includes: S510, Calculate the first Z-axis fitted average size of the dispensing area 200a. Second Z-axis fitted average size The difference is used to obtain the glue path height of the dispensing area 200a. .
[0081] In this embodiment, the adhesive path height of the dispensing area 200a is... It is the first Z-axis fitted average size of the first Z-axis plane P1. The average size of the second Z-axis fitting plane P2 with the second Z-axis plane. The difference, i.e. = - .
[0082] S520: Obtain the identification information of workpiece 200. Based on the identification information of workpiece 200, obtain the thickness H of the part to be bonded and the standard capacity S of the dispensing area 200a.
[0083] It should be noted that the standard capacity S of the dispensing area 200a for each workpiece 200 and the corresponding thickness H of the part to be bonded are parameters preset based on production standards.
[0084] S530, based on the Y-axis fitted average size of the dispensing region 200a , Adhesive path height in dispensing area 200a Given the standard capacity S of the dispensing area 200a and the thickness H of the part to be bonded, calculate the adhesive path width W of the dispensing area 200a.
[0085] For example, the adhesive path width W satisfies the relationship: π × W × / 2=S+π× ×( -H) / 2.
[0086] in, For the height of the adhesive path, S is the Y-axis fitted average size of the dispensing area 200a, S is the standard capacity of the dispensing area 200a, and H is the thickness of the part to be bonded.
[0087] S600 determines the glue weight and dispensing speed based on the glue path height and glue path width of the dispensing area 200a.
[0088] For example, the glue weight and dispensing speed satisfy the following relationship: ; .
[0089] Where W is the glue path width, Q is the glue output per unit time, and v is the dispensing speed. ρ is the height of the adhesive path, ρ is the density of the adhesive, and G is the weight of the adhesive.
[0090] Based on the glue path height of dispensing area 200a Given the glue path width W of the dispensing area 200a, the set glue dispensing volume per unit time, and the known glue density, calculate the glue weight and dispensing speed respectively.
[0091] S700 performs dispensing on the dispensing area 200a of workpiece 200 based on glue weight and dispensing speed.
[0092] In the above dispensing method, for dispensing areas 200a of different workpieces, the color point cloud map of dispensing area 200a, the three-dimensional spatial plane of dispensing area 200a, and the three-dimensional fitted average size of dispensing area 200a are obtained sequentially. Based on the three-dimensional fitted average size of dispensing area 200a, the glue path height of dispensing area 200a is determined and the glue path width of dispensing area 200a is calculated. Based on the glue path height and glue path width of dispensing area 200a, the required glue weight and dispensing speed of dispensing area 200a are accurately calculated. Based on the glue weight and dispensing speed, dispensing is performed on the dispensing area 200a of workpiece 200, thereby realizing dynamic adjustment of dispensing glue weight, reducing glue overflow or insufficient glue problems, and improving dispensing accuracy.
[0093] Please see Figure 1 In some embodiments, the dispensing method further includes: S800, the average size fitted in the X direction based on the dispensing area 200a. and Y-axis fitted average size Determine the first threshold value of the glue path width W in the X direction and the second threshold value in the Y direction for the glue dispensing area 200a.
[0094] Please see Figure 6 For example, the first threshold can be - The second threshold can be The width W of the adhesive path satisfies the following relationship: ( - ) <W < By satisfying the above relationship, the glue will not overflow the outer contour 200c and inner contour 200b during the dispensing process, thus avoiding glue overflow. Moreover, the cured glue can basically fill the X direction, thus avoiding glue shortage.
[0095] S900, based on the first threshold and the second threshold, determines whether the adhesive path width of the dispensing area 200a meets the requirements.
[0096] For example, when the glue path width is greater than the first threshold and less than the second threshold, it indicates that the glue path width of the dispensing area 200a meets the requirements; when the glue path width is less than the first threshold, it indicates that the glue path width of the dispensing area 200a does not meet the requirements, and glue will overflow the inner contour 200b during the dispensing process; when the glue path width is greater than the second threshold, it indicates that the glue path width of the dispensing area 200a does not meet the requirements, and glue will overflow the outer contour 200c during the dispensing process.
[0097] By using the above dispensing method, different glue path heights and widths can be obtained for dispensing areas 200a with different volumes, thereby determining the glue weight and dispensing speed of dispensing area 200a. This avoids glue overflow and glue shortage after dispensing in dispensing area 200a of workpiece 200, thereby improving dispensing accuracy and enabling precise control of the amount of glue used for each workpiece 200.
[0098] Please see Figure 10 An embodiment of this application also provides a dispensing system 100, including a measuring device 110, a processor 120, and a dispensing apparatus 130. The measuring device 110 is used to execute step S200 in the dispensing method, the processor 120 is used to execute steps S300, S400, S500, S600, S800, and S900 in the dispensing method, and the dispensing apparatus 130 is used to execute step S700 in the dispensing method.
[0099] In some embodiments, the measuring device 110 includes a light source emitter 111, a reference mirror 112, a color encoder sensor 113, and a spectral analyzer 114. The light source emitter 111 and the reference mirror 112 cooperate to perform steps S210 and S220 in the dispensing method, the color encoder 113 is used to perform step S230 in the dispensing method, and the spectral analyzer 114 is used to perform steps S240 and S250 in the dispensing method.
[0100] In the above-mentioned dispensing system 100, different glue path heights and widths can be obtained for dispensing areas 200a with different volumes, thereby determining the glue weight and dispensing speed of the dispensing area 200a, so as to avoid glue overflow and glue shortage after dispensing in the dispensing area 200a of the workpiece 200, thereby improving the dispensing accuracy.
[0101] It will be apparent to those skilled in the art that this application is not limited to the details of the exemplary embodiments described above, and that this application can be implemented in other specific forms without departing from the spirit or essential characteristics of this application. Therefore, the embodiments should be regarded as exemplary and non-limiting in all respects, and the scope of this application is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be embraced within this application.
[0102] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application and are not intended to limit it. Although this application has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of this application without departing from the spirit and scope of the technical solutions of this application.
Claims
1. A dispensing method, characterized in that, include: Determine the dispensing area on the workpiece; Measure the three-dimensional coordinates of the dispensing area and generate a color point cloud map of the dispensing area; Based on the three-dimensional size coordinates and color point cloud map of the dispensing area, the three-dimensional spatial plane of the dispensing area is flexibly fitted. Based on the three-dimensional spatial plane of the dispensing area, calculate the three-dimensional fitted average size of the dispensing area; Based on the average dimension of the three-dimensional fitting of the dispensing area, the glue path height of the dispensing area is determined, and the glue path width of the dispensing area is calculated. Based on the glue path height and glue path width of the dispensing area, determine the glue weight and dispensing speed; The adhesive is applied to the dispensing area of the workpiece based on the adhesive weight and the dispensing speed.
2. The dispensing method as described in claim 1, characterized in that, The step of measuring the three-dimensional coordinates of the dispensing area and generating a color point cloud map of the dispensing area includes: The measuring beam is projected onto the surface of the workpiece near the dispensing area; The focal point of the measuring beam is displaced from the surface of the workpiece along the dispensing area; Receive the reflected light from the dispensing area and obtain the interference information of the reflected light; Based on the interference information, the three-dimensional coordinates of the dispensing area are determined; The reflected light from the dispensing area is fused with the three-dimensional coordinates to obtain a color point cloud map of the dispensing area.
3. The dispensing method as described in claim 2, characterized in that, Determining the three-dimensional coordinates of the dispensing area based on the interference information includes: Based on the interference information, the size information of the dispensing area is determined; The size information of the dispensing area is converted into three-dimensional coordinates of the dispensing area.
4. The dispensing method as described in claim 1, characterized in that, The dispensing area is a hollowed-out groove structure, comprising an inner contour and an outer contour. The process of flexibly fitting the three-dimensional spatial plane of the dispensing area based on its three-dimensional coordinates and color point cloud image includes: Select a first feature point cloud cluster located on the outer contour boundary of the dispensing area and a second feature point cloud cluster located on the inner contour boundary of the dispensing area from the color point cloud image; Obtain the three-dimensional size coordinates of the first feature point cloud cluster, and flexibly fit the X-plane where the dispensing area is located based on the three-dimensional size coordinates of the first feature point cloud cluster. Obtain the three-dimensional size coordinates of the second feature point cloud cluster, and flexibly fit the Y-plane where the dispensing area is located based on the three-dimensional size coordinates of the second feature point cloud cluster.
5. The dispensing method as described in claim 4, characterized in that, The method of flexibly fitting the three-dimensional spatial plane of the dispensing area based on the three-dimensional size coordinates and color point cloud map of the dispensing area further includes: Spatial planar features are extracted from the outer contour boundary of the dispensing area to obtain a third feature point cloud cluster located on the outer side of the outer contour boundary and a fourth feature point cloud cluster located on the inner side of the outer contour boundary. The three-dimensional size coordinates of the third feature point cloud cluster and the fourth feature point cloud cluster are obtained. Based on the three-dimensional size coordinates of the third feature point cloud cluster, a first Z-plane in which the dispensing area is located is flexibly fitted. Based on the three-dimensional size coordinates of the fourth feature point cloud cluster, a second Z-plane in which the dispensing area is located is flexibly fitted. The second Z-plane is concentric with the first Z-plane.
6. The dispensing method as described in claim 4, characterized in that, The three-dimensional fitting average size of the dispensing area includes the X-axis fitting average size and the Y-axis fitting average size, and the calculation methods for the X-axis fitting average size and the Y-axis fitting average size include: The X-plane and the Y-plane are divided using a cross-shaped first and second axis; Obtain the X-coordinate value of the intersection point of the first axis with the X-plane and the Y-plane, and the Y-coordinate value of the intersection point of the second axis with the X-plane and the Y-plane; Based on the X-coordinate value of the intersection point of the first axis with the X-plane and the Y-plane, the X-axis fitted average size of the dispensing area is calculated. ; Based on the Y-coordinate value of the intersection point of the second axis with the X-plane and the Y-plane, the Y-axis fitted average size of the dispensing area is calculated. ,in, < .
7. The dispensing method as described in claim 5, characterized in that, The three-dimensional fitting average size of the dispensing area also includes a first Z-axis fitting average size and a second Z-axis fitting average size. The calculation methods for the first Z-axis fitting average size and the second Z-axis fitting average size include: According to a preset angle, the first Z-plane and the second Z-plane are divided, and multiple first Z-intersection points located on the first Z-plane and second Z-intersection points located on the second Z-plane that correspond to the multiple first Z-intersection points are selected. Obtain the Z-coordinate values of multiple first Z-direction intersection points and multiple second Z-direction intersection points; Based on the Z-coordinate values of multiple first Z-intersection points and multiple second Z-intersection points, the first Z-fitted average size and the second Z-fitted average size of the dispensing area are calculated.
8. The dispensing method as described in claim 1, characterized in that, The three-dimensional fitting average size of the dispensing area includes the X-axis fitting average size, the Y-axis fitting average size, the first Z-axis fitting average size, and the second Z-axis fitting average size. The calculation of the adhesive path width of the dispensing area includes: The difference between the first Z-axis fitted average size and the second Z-axis fitted average size is calculated to obtain the glue path height of the dispensing area; Obtain the identification information of the workpiece, and based on the identification information of the workpiece, obtain the thickness of the part to be bonded and the standard capacity of the adhesive dispensing area; The adhesive path width of the dispensing area is calculated based on the Y-axis fitted average size of the dispensing area, the adhesive path height of the dispensing area, the standard capacity of the dispensing area, and the thickness of the part to be bonded.
9. The dispensing method as described in claim 8, characterized in that, The dispensing method further includes: Based on the X-axis fitted average size and Y-axis fitted average size of the dispensing area, a first threshold for the glue path width of the dispensing area in the X-axis and a second threshold for the glue path width in the Y-axis are determined. Based on the first threshold and the second threshold, it is determined whether the glue path width of the dispensing area meets the requirements. The glue path width of the dispensing area meets the requirements only when it is greater than the first threshold and less than the second threshold; otherwise, it does not meet the requirements.
10. A dispensing system employing the dispensing method as described in claim 1, characterized in that, The dispensing system includes a measuring device, a processor, and dispensing equipment; The measuring device is used to measure the three-dimensional coordinates of the dispensing area of the workpiece and generate a color point cloud map of the dispensing area. It is also used to transmit the three-dimensional coordinates of the dispensing area and the color point cloud map to the processor. The processor is used to flexibly fit a three-dimensional spatial plane of the dispensing area based on the three-dimensional size coordinates and color point cloud map of the dispensing area; it is also used to calculate the average three-dimensional fitted size of the dispensing area based on the three-dimensional spatial plane of the dispensing area; it is also used to determine the glue path height of the dispensing area and calculate the glue path width of the dispensing area based on the average three-dimensional fitted size of the dispensing area; it is also used to determine the glue weight and dispensing speed based on the glue path height and glue path width of the dispensing area, and send the glue weight and the dispensing speed to the dispensing equipment. The dispensing equipment is used to dispense adhesive to the dispensing area of the workpiece based on the adhesive weight and the dispensing speed.