Substrate curing device

Abstract

The invention provides a substrate curing device. The substrate curing device comprises a curing structure and a control system. The curing structure is used for curing the substrate; the number of the curing structures is set to be at least two, and at least two curing structures are overlapped with each other; or the at least two curing structures are arranged in sequence; the control system is connected with the curing structures so as to independently control the curing environments of the curing structures. The substrate curing device can effectively load and cure a plurality of substrates at the same time.

Description

Technical Field

[0001] This application relates to the technical field of substrate curing apparatus, specifically to a substrate curing apparatus. Background Technology

[0002] Currently, display substrates refer to the substrates for flat panel displays such as LCD, OLED, and PDP. These display substrates are typically manufactured by bonding two substrates together using pre-fabrication processes. For example, in an LCD substrate, one substrate can be a color filter substrate, and the other can be an array substrate. Therefore, a bonding process is required to bond the two substrates together during the manufacturing of the display substrate. The bonding process involves coating lines on the surface of either of the two substrates, arranging the other substrates on top, and then bonding them together. Following this bonding process, a curing process is performed to solidify the lines. The curing process involves applying heat and pressure to the substrate to solidify the lines.

[0003] However, existing curing devices load and cure multiple bonded substrates at once, meaning that multiple substrates are loaded and cured simultaneously within the same curing structure. This can lead to some substrates not being able to be loaded and cured under appropriate adjustment.

[0004] Therefore, how to provide a substrate curing apparatus that can effectively load and cure multiple substrates simultaneously has become an urgent problem for those skilled in the art. Summary of the Invention

[0005] Therefore, the technical problem to be solved by this application is to provide a substrate curing apparatus that can simultaneously and effectively load and cure multiple substrates.

[0006] To address the aforementioned problems, this application provides a substrate curing apparatus, comprising:

[0007] Curing structure; the curing structure is used to cure the substrate; the number of each curing structure is set to at least two, and the at least two curing structures are stacked on top of each other; or, the at least two curing structures are arranged sequentially.

[0008] The control system is connected to each curing structure to individually control the curing environment of each curing structure.

[0009] Furthermore, the control system includes an electrically connected controller and a substrate conveying device, which is used to convey substrates to each curing unit.

[0010] Furthermore, the substrate curing device also includes a heating structure for heating the substrate; each curing structure is provided with a corresponding heating structure; each heating structure is connected to a control system so that the heating structure corresponding to each curing structure can be controlled independently.

[0011] Furthermore, the substrate curing apparatus also includes a hot air supply unit, and a controller is connected to the hot air supply unit, which is used to control the curing temperature of the curing structure.

[0012] Furthermore, the curing structure includes a curing chamber, within which a pressure plate and a lifting structure are provided. The lifting structure is located at the bottom of the pressure plate and is used to lift the pressure plate, which in turn supports the substrate. Each lifting structure corresponding to the curing structure is connected to the control system, enabling the control system to independently control the lifting of each lifting structure.

[0013] Furthermore, the lifting structure includes an expansion and contraction structure; the substrate curing device also includes a pressure supply unit, which is used to provide pressure to the expansion and contraction structure, and the pressure supply unit corresponding to each curing structure is connected to the control system.

[0014] Furthermore, the lifting structure includes an outer lifting structure and an inner lifting structure; the outer lifting structure is located at the edge of the pressure plate, and the inner lifting structure is located at the remaining positions of the pressure plate; the outer lifting structure is used to lift the pressure plate to a first position; the inner lifting structure is used to lift the pressure plate to a second position.

[0015] Furthermore, the curing structure also includes a guide structure and a stop structure. The guide structure is retractably disposed above the pressure plate, and the stop structure is retractably disposed below the pressure plate.

[0016] Furthermore, the curing chamber includes a base; the curing structure also includes a support pin and a substrate mounting structure that are interconnected; the substrate mounting structure is disposed above the pressure plate; the support pin is disposed on the base and extends upward and penetrates the pressure plate to connect with the substrate mounting structure.

[0017] Furthermore, the curing chamber includes a top, on which an elastic pad is provided; and / or, a heat insulation structure is provided inside the pressure plate.

[0018] The substrate curing apparatus provided in this application is capable of simultaneously and effectively loading and curing multiple substrates. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the substrate curing apparatus according to an embodiment of this application;

[0020] Figure 2 This is a schematic diagram of the stacked state of the first curing chamber and the second curing chamber of the substrate curing apparatus according to an embodiment of this application;

[0021] Figure 3 This is a schematic diagram of one embodiment of the stop member of the substrate curing apparatus according to an embodiment of this application;

[0022] Figure 4 This is a partial enlarged view of the substrate curing apparatus according to an embodiment of this application;

[0023] Figure 5 This is a schematic plan view of the pressure plate of the substrate curing apparatus according to an embodiment of this application;

[0024] Figure 6 This is a schematic diagram of the bonding state of the pressure plate of the substrate curing apparatus according to an embodiment of this application.

[0025] Figure 7 This is a schematic diagram of the internal plane of the substrate curing apparatus according to an embodiment of this application.

[0026] Figure 8 This is a schematic diagram of the substrate curing apparatus of this application before substrate pressing.

[0027] Figure 9 This is a schematic diagram of the substrate pressing state of the substrate curing apparatus according to an embodiment of this application;

[0028] Figure 10 This is a schematic diagram of the internal plane of the substrate curing apparatus according to an embodiment of this application. Detailed Implementation

[0029] See also Figure 1-9 As shown, a substrate curing apparatus includes a curing structure and a control system. The curing structure is used to cure the substrate. The number of curing structures is set to at least two, with the at least two curing structures stacked on top of each other; or, the at least two curing structures are arranged sequentially. The control system is connected to each curing structure to individually control the curing environment of each curing structure. This substrate curing apparatus is used to manufacture display substrates. Specifically, this application stacks multiple curing chambers into multiple layers, and in each curing chamber, multiple substrates are simultaneously or individually cured by heating and pressing. This effectively performs large-scale substrate curing operations, prevents damage to the lifting structure during pressing operations due to curing, and maintains the internal environment of the curing chamber at a high temperature, resulting in a more efficient and faster substrate curing process.

[0030] This application also discloses some embodiments in which the control system includes an electrically connected controller and a substrate conveying device, the substrate conveying device being used to convey substrates to various curing devices.

[0031] This application also discloses some embodiments, in which the curing substrate apparatus further includes a heating structure for heating the substrate; each curing structure is provided with a corresponding heating structure; each heating structure is connected to a control system so that the heating structure corresponding to each curing structure can be controlled independently.

[0032] This application also discloses some embodiments, in which the substrate curing apparatus further includes a hot air supply unit, a controller is connected to the hot air supply unit, and the hot air supply unit is used to control the curing temperature of the curing structure.

[0033] This application also discloses some embodiments, wherein the curing structure includes a curing cavity, a pressure plate and a lifting structure are disposed in the curing cavity, the lifting structure is disposed at the bottom of the pressure plate, the lifting structure is used to lift the pressure plate, and the pressure plate is used to support the substrate; the lifting structure corresponding to each curing structure is connected to the control system so that the control system can control the lifting of each lifting structure individually.

[0034] This application also discloses some embodiments, in which the lifting structure includes an expansion and telescopic structure; the substrate curing device also includes a pressure supply unit, which is used to provide pressure to the expansion and telescopic structure, and the pressure supply unit corresponding to each curing structure is connected to the control system.

[0035] This application also discloses some embodiments, wherein the lifting structure includes an outer lifting structure and an inner lifting structure; the outer lifting structure is disposed at the edge of the pressure plate, and the inner lifting structure is disposed at the remaining position of the pressure plate; the outer lifting structure is used to lift the pressure plate to a first position; and the inner lifting structure is used to lift the pressure plate to a second position.

[0036] This application also discloses some embodiments, in which the curing structure further includes a guide structure and a stop structure. The guide structure is retractably disposed above the pressure plate, and the stop structure is retractably disposed below the pressure plate. The stop structure can be a stop post or other stop device.

[0037] This application also discloses some embodiments, wherein the curing cavity includes a base; the curing structure further includes a support pin and a substrate mounting structure connected to each other; the substrate mounting structure is disposed above the pressure plate; the support pin is disposed on the base and extends upward and penetrates the pressure plate to connect with the substrate mounting structure.

[0038] This application also discloses some embodiments in which the curing chamber includes a top, and an elastic pad is provided on the top; and / or, a heat insulation structure is provided inside the pressure plate.

[0039] like Figure 1 As shown, according to this application, a curing apparatus for manufacturing a display substrate includes a plurality of curing chambers 100 and 200 stacked vertically. The stacking number of the curing chambers 100 and 200 can be varied. If necessary, one to dozens of curing chambers 100 and 200 can be stacked vertically, or multiple curing chambers 100 and 200 can be stacked horizontally.

[0040] Furthermore, each curing chamber 100, 200 includes gate valves 120, 220 for individual operation in each curing chamber 100, 200. In front of the gate valves 120, 220 of each curing chamber 100, 200, a substrate conveying device 800 for inputting the substrate 10 into the interior of each curing chamber 100, 200 is provided.

[0041] In this application, the substrate conveying device 800 includes a lifting belt 820 that provides up-and-down power, and a robotic arm 810 that is shaft-connected to a lifting shaft 830 and moves up and down through the lifting belt 820.

[0042] Furthermore, the substrate 10 conveyed by the robotic arm 810 is a display panel that can be cured after two substrates are bonded together. These two substrates, such as an LCD substrate, can have one substrate being a color filter substrate and the other an array substrate. Alternatively, one substrate can be a touch panel and the other a display panel, or one substrate can be an OLED TFT substrate and the other a polarizing substrate, a sealing substrate, or a sealing film. That is, the curing apparatus according to this application can be used for curing two substrates or films bonded together in all flat panel display devices.

[0043] Near the curing chambers 100 and 200, there is a hot air supply unit 400 that supplies hot air to each curing chamber 100 and 200, and a hot air supply pipe 410 that guides the hot air supplied by the hot air supply unit 400 to each curing chamber 100 and 200. The hot air supply unit 400 can supply temperature-controlled hot air to each curing chamber 100 and 200 according to the internal temperature of the curing chamber 100 and 200, or it can be controlled by the control unit 600 to provide hot air of uniform temperature to all curing chambers 100 and 200, or it can supply temperature-controlled hot air to each curing chamber 200 according to the internal temperature of the curing chamber 200.

[0044] The hot air supply unit 400 supplies preheated air to above room temperature into each curing chamber 100, 200, allowing external air to flow into the curing chambers 100, 200 between curing processes of the substrate 10, or minimizing temperature drop inside the curing chamber 100 through heat transfer from the walls of the curing chambers 100, 200. In other words, the hot air supply unit 400 effectively shortens the curing process time (TACT TIME) of the substrate 10 by maintaining the process temperature at an optimal level. This hot air supply unit 400 may include electrically operated devices such as heaters and a blower that heats the air via heaters.

[0045] Furthermore, a pressure supply unit 500 is provided near the curing chambers 100 and 200 to provide pressure to the interior of the curing chambers 100 and 200. The pressure supply unit 500 can be a pneumatic or hydraulic device. The pressure provided from the pressure supply unit 500 via the pressure supply pipe 510 is arranged in a matrix within each curing chamber 100 and 200 for operation. Figure 2 The multiple lifting components 180280 shown are described. The pressure supply unit 500 is controlled by the control unit 600 and is capable of providing pressure to the lifting components 180280 inside each curing chamber 100, 200 individually or as a whole.

[0046] Furthermore, according to this application, the control unit 600 for the curing apparatus used to manufacture display substrates can independently control the substrate conveying device 800, the hot air supply unit 400, the pressure supply unit 500, and the gate valve 120 of each curing chamber 100, 200. Figure 2 The operation of the lifting member 180 and heaters 110 and 210 shown is described below. The configuration of the curing chambers 100 and 200 will be described in more detail below. Figure 2 This is a schematic diagram showing the stacked state of the first curing chamber and the second curing chamber of a curing apparatus for manufacturing a display substrate according to an embodiment of the present invention.

[0047] Figure 2 The illustration shows a stacked state of two curing cavities. To make the embodiment easier to understand, the location is... Figure 2 The lower curing chamber is referred to as the first curing chamber 100, and the curing chambers stacked on top of the first curing chamber 100 are referred to as the second curing chamber 200. The first curing chamber 100 includes a first pressure plate 140 located inside the first curing chamber 100. The edge portion of the first pressure plate 140 is supported by a vertical guide portion 150 provided inside the first curing chamber 100, thereby allowing the first pressure plate 140 to move vertically. In addition, a stopper 160 is provided on the lower part of the first pressure plate 140 below the guide portion 150 to limit the downward position of the first pressure plate 140.

[0048] Figure 3 This is a schematic diagram illustrating an embodiment of a curing apparatus for manufacturing a display substrate according to this application, including a guide portion and a stop.

[0049] like Figure 3 As shown, the guide portion 150 is formed in a cylindrical shape. However, as another embodiment, the guide portion 150 can be formed as a polygonal column. If the guide portion 150 is implemented with a polygonal column, the slight positional distortion of the first pressure plate 140 during the lifting and lowering operation can be minimized.

[0050] In addition, the stopper 160 prevents the first pressure plate 140 from descending excessively, causing unnecessary pressure and damage to the first lifting member 180 described later, and minimizes the rise of the first pressure plate 140, thereby performing the lifting operation more effectively.

[0051] Figure 4 This is an enlarged view showing the short section of a curing apparatus for manufacturing a display substrate according to an embodiment of the present invention, with an elastic pad mounted thereon. A plurality of support pins 170 are mounted, extending upward from the bottom of the first curing chamber 100 and passing through the first pressure plate 140. A plurality of first lifting members 180 are disposed between these support pins 170. Each first lifting member 180 includes a body 181 for final pressure transmission from the pressure supply unit 500 and a frame coupled to the body 181 and inflated to the supply pressure. Alternatively, the first lifting member 180 may include a bellows cylinder. Furthermore, the first lifting member 180 may employ a mechanical component such as a piston.

[0052] Furthermore, the first lifting member 180 has multiple layers, such that the lower lifting member functions to lift the first pressure plate 140, and the upper lifting member functions to provide pressurization. Additionally, the number and layout of the first lifting member 180 can be implemented in various ways. Next, the aforementioned gate valve 120 is provided in front of the first curing chamber 100, and a hot air inlet 130 connected to the hot air supply pipe 410 is formed at the rear. A heater 110 is embedded in the upper wall of the upper part of the first curing chamber 100, and a lower heater 141 is provided on the first pressure plate 140. A first heat insulation plate 143 is provided between the first pressure plate 140 and the lower heater 141. The first heat insulation plate 143 is embedded in the lower surface of the first pressure plate 140. The first heat insulation plate 143 can be installed in one or more separate shapes. This first heat insulation plate 143 prevents heat from the lower heater 141 from being transferred to the first pressure plate 140, thereby minimizing thermal damage to the substrate 10. In addition, a first substrate 142 is provided on the lower surface of the lower heater 141.

[0053] In addition, elastic pads 300 can be installed on the top surface of the first curing cavity 100 and the upper surface of the first pressure plate 140 to stabilize the second substrate 12 when pressure is applied.

[0054] like Figure 4 As shown, the elastic pad 300 has the function of minimizing surface damage to the first substrate 11 by applying pressure, and can be made of a material that can withstand the high temperatures of the polymer series. In addition, the elastic pad 300 is coated with Teflon on the first pressure plate 140, which reduces the probability that the substrate will adhere to the first pressure plate 140 due to heat melting.

[0055] Secondly, the second curing chamber 200 is equipped with a second pressure plate 240. The edge portion of the second pressure plate 240 is supported by a vertically oriented guide portion 250 disposed inside the second curing chamber 200, thereby allowing it to move vertically. Furthermore, a stop 260 is provided at the lower part of the second pressure plate 240 on the lower side of the guide portion 250 to limit the downward position of the second pressure plate 240. The embodiment of the guide portion 250 and the stop 260 can be the same as that of the guide portion 150 and the stop 160 disposed in the first curing chamber 100.

[0056] Additionally, a plurality of support pins 270 are provided extending upward from the bottom of the second curing chamber 200 and passing through the second pressure plate 240, and a plurality of second lifting members 280 are provided between these support pins 270. Each second lifting member 280 includes a main body 281 for final pressure transmission from the pressure supply section 500 and a diaphragm 282 connected to the main body 281 and expanded to the supply pressure. The second lifting member 280 can be implemented in the same manner as the first lifting member 180. The aforementioned gate valve 120 is provided at the front of the second curing chamber 200, and a hot air inlet 230 connected to the hot air supply pipe 410 is formed at the rear. A heater 210 is embedded in the upper wall of the ceiling of the second curing chamber 200, and a lower heater 241 is provided on the second pressure plate 240. A second heat insulation plate 243 is provided between the second pressure plate 240 and the lower heater 241. The second heat insulation plate 243 is embedded in the lower surface of the second pressure plate 240.

[0057] The second heat insulation plate 243 can be installed in one or more separate shapes. This second heat insulation plate 243 prevents heat from the lower heater 241 from being transferred to the second pressure plate 240, thereby minimizing thermal damage to the substrate 10. Additionally, a second substrate 242 is provided on the lower surface of the lower heater 241.

[0058] Additionally, on the upper surface of the second curing chamber 200 and the upper surface of the second pressure plate 240, elastic pads 300 can be individually installed to stabilize the second substrate 12 under pressure. These elastic pads 300 can be referenced from... Figure 4 The structure is shown. On the other hand, as shown in the figure, the above-mentioned lifting components 180 and 280 can transmit power to the diaphragms 182 and 282. However, as in other embodiments, it can be implemented by a device that provides lifting power through a bellows cylinder, a piston device, or an electrically operated electric motor and an appliance connected to the electric motor. In addition, one of the lifting components 180 and 280 can be installed in a single curing chamber 100 and 200, but multiple components can be installed adjacent to each other.

[0059] Figure 5 This is a plan view of the pressing plate of a curing apparatus for manufacturing a display substrate according to an embodiment of the present invention. Figure 5As shown, at least one first heat insulation plate 143 is embedded in the lower surface of the first pressure plate 140. The reason for embedding the first heat insulation plate 143 in the first pressure plate 140 is that the lower heater 141 located below may damage the first heat insulation plate 143. The first heat insulation plate 143 can be in the form of graphite. Furthermore, one or more protrusions 140a are formed on the frame of the first pressure plate 140, and the first pressure plate 140 and the lower heater 141 are connected through the protrusions 140a.

[0060] Figure 6 This is a schematic diagram illustrating the bonding state of the pressing plates in a curing apparatus for manufacturing a display substrate according to an embodiment of the present invention. Figure 6 As shown, the positions of the first pressure plate 140, the first heat insulation plate 143, the lower heater 141, and the first substrate 142 are arranged in sequence from the upper part. The first heat insulation plate 143 is embedded in the first pressure plate 140. Protrusions 140a are formed on the frames of the lower heater 141 and the first substrate 142 of the first pressure plate 140, and they are joined together through these parts.

[0061] When the first pressure plate 140 and the lower heater 141 are joined by the protrusions 140a formed on the edge, the heat of the lower heater 141 is transferred to the first pressure plate 140. Even if thermal deformation occurs, the edge portions will be joined together, so that it can be used stably without deformation.

[0062] Additionally, a connecting shaft 140b is inserted into the protruding portion 140a formed by the frame portion of the first pressure plate 140 and the lower heater 140, and the first pressure plate 140 and the lower heater 141 are connected. The connecting shaft 140b of the first substrate 142 portion has an elastic member 140c, which buffers the pressure brought by the pressurization of the first lifting member 180.

[0063] Figure 7 This is an internal plan view of a curing apparatus for manufacturing a display substrate according to an embodiment of the present invention. In this embodiment, the installation state of the lifting members 180280 is as follows: Figure 7 As shown, multiple lifting components 180280 are arranged adjacent to each other, and each lifting component 180280 operates simultaneously, so that the pressure plate is raised or lowered.

[0064] The function and effect of the curing apparatus for manufacturing a display substrate will be explained below based on the present application constructed as described above.

[0065] Figure 8 This is a schematic diagram illustrating the state of the substrate before pressing in a curing apparatus for manufacturing a display substrate according to an embodiment of the present invention. Figure 9 This is a schematic diagram illustrating the substrate pressing state of a curing apparatus for manufacturing a display substrate according to an embodiment of the present invention. Figure 8 and Figure 9 The operation of the curing chamber is exemplified by the second curing chamber.

[0066] like Figure 8 As shown, when the gate valve 220 of the curing chamber 200 is opened, the substrate 12 is moved into the curing chamber 200 by the substrate transfer device 800. At this time, the internal temperature of the curing chamber 200 is maintained above constant temperature, approximately 30 to 150°C, by the hot air supplied by the hot air supply unit 400.

[0067] Then, when the substrate transport device 800 places the substrate 12 on the support pin 270, the substrate transport device 800 enters the outside of the curing chamber 200, and the gate valve 120 is closed. Curing of the substrate 12 then begins. However, in reality, curing of the substrate 12 begins the instant the substrate 12 is transported into the curing chamber 200. That is, curing has already occurred according to the temperature environment inside the curing chamber 200. Next, as... Figure 9 As shown, when the substrate 12 is supported by the support pin 270, the pressure plate 240 rises. The pressure plate 240 has been heated to a fairly high temperature by the lower heater 141. Generally, the pressure plate 240 can be heated to a temperature of about 60 to 200°C.

[0068] Then, the raised pressure plate 240 lifts the substrate 10, pushing the substrate 12 to the top surface inside the curing chamber 200, and finally pressurizes the substrate 12 between the pressure plate 240 and the top surface. At this time, the temperature of the top surface can also be heated to 60-200°C. In addition, the pressure can be applied at about 0.01-0.6 MPa.

[0069] Through this operation, the lines applied to the substrate 12 are cured, and the two substrates 12 are completely bonded together. Then, as the substrates 12 are bonded, the pressure plate 240 descends again, and the substrates 12 are placed on the support pins 270. At this time, the downward stroke of the pressure plate 240 is limited by the stop 160.

[0070] Therefore, the overpressure of the heated pressing plate 240 on the lifting member 280 and the resulting state of the diaphragm 282 are prevented, thereby minimizing damage to the lifting member 280. Afterwards, the gate valve 220 is opened, and the substrate conveying device 800 is introduced into the curing chamber 200, lifting the substrate 12 from the support pin 270 and then conveying it to the outside of the curing chamber 200.

[0071] On the other hand, multiple curing cavities 200 for the curing apparatus used to manufacture such display substrates can be provided. Therefore, dozens of substrates can be cured simultaneously by controlling their respective curing cavities.

[0072] As described above, according to this application, the curing apparatus for manufacturing display substrates stacks multiple curing chambers in multiple layers, and simultaneously or individually heats and presses multiple substrates in each curing chamber to cure them, thereby effectively performing large-scale substrate curing operations, preventing damage to the lifting components due to the operation of the pressing plate, and maintaining the environment inside the curing chamber by high temperature, thereby performing the substrate curing process more effectively and quickly.

[0073] It will be readily understood by those skilled in the art that the aforementioned advantageous methods can be freely combined and superimposed without conflict.

[0074] The above are merely preferred embodiments of this application and are not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application. The above are merely preferred embodiments of this application. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the technical principles of this application, and these improvements and modifications should also be considered within the protection scope of this application.

Claims

1. A substrate curing apparatus, characterized in that, include: Solidified structure; The curing structure is used to cure the substrate; The number of each of the cured structures is set to at least two, with each of the cured structures stacked on top of the other; Alternatively, at least two of the solidified structures may be arranged sequentially; A control system is connected to each of the curing structures to individually control the curing environment of each curing structure.

2. The substrate curing apparatus according to claim 1, characterized in that, The control system includes an electrically connected controller and a substrate conveying device, the substrate conveying device being used to convey substrates to each of the curing devices.

3. The substrate curing apparatus according to claim 2, characterized in that, The curing substrate apparatus further includes a heating structure for heating the substrate; each curing structure is provided with a corresponding heating structure; each heating structure is connected to the control system so that the heating structure corresponding to each curing structure can be controlled independently.

4. The substrate curing apparatus according to claim 2, characterized in that, The substrate curing apparatus further includes a hot air supply unit, and the controller is connected to the hot air supply unit, which is used to control the curing temperature of the curing structure.

5. The substrate curing apparatus according to claim 2, characterized in that, The curing structure includes a curing chamber, in which a pressure plate and a lifting structure are disposed. The lifting structure is disposed at the bottom of the pressure plate and is used to lift the pressure plate. The pressure plate is used to support the substrate. Each lifting structure corresponding to the curing structure is connected to the control system, so that the control system can control the lifting of each lifting structure individually.

6. The substrate curing apparatus according to claim 5, characterized in that, The lifting structure includes an expansion and contraction structure; the substrate curing device further includes a pressure supply unit, which is used to provide pressure to the expansion and contraction structure, and the pressure supply unit corresponding to each curing structure is connected to the control system.

7. The substrate curing apparatus according to claim 5, characterized in that, The lifting structure includes an outer lifting structure and an inner lifting structure; the outer lifting structure is located at the edge of the pressure plate, and the inner lifting structure is located at the remaining positions of the pressure plate; the outer lifting structure is used to lift the pressure plate to a first position; the inner lifting structure is used to lift the pressure plate to a second position.

8. The substrate curing apparatus according to claim 1, characterized in that, The curing structure further includes a guide structure and a stop structure. The guide structure is retractably disposed above the pressure plate, and the stop structure is retractably disposed below the pressure plate.

9. The substrate curing apparatus according to claim 1, characterized in that, The curing chamber includes a base; the curing structure also includes a support pin and a substrate mounting structure connected to each other; the substrate mounting structure is disposed above the pressure plate; the support pin is disposed on the base, and the support pin extends upward and passes through the pressure plate to connect with the substrate mounting structure.

10. The substrate curing apparatus according to claim 1, characterized in that, The curing chamber includes a top, on which an elastic pad is provided; and / or, the pressure plate is provided with a heat insulation structure.

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