IC carrier disc appearance detection device and use method thereof

Abstract

The invention discloses an IC carrier disc appearance detection device and a use method thereof, and the IC carrier disc appearance detection device comprises a placement table, a support, a detection mechanism and a purging mechanism. The support can slide on the placing table, and a mounting base is arranged on the support in a sliding mode. And the detection mechanism is mounted on the mounting seat. The blowing mechanism comprises a pair of power mechanisms and a blowing mechanism, the power mechanisms are symmetrically installed on the installation base and arranged on the two sides of the detection mechanism respectively, the blowing mechanism is installed on the power mechanisms, and when the IC carrying disc is detected to be wrong, the blowing mechanism can move to the lower side of the detection mechanism under the action of the power mechanisms and can blow the IC carrying disc. The device is used for eliminating the interference of dust or other impurities on the reinspection of the IC carrying disc. Compared with the prior art, the cleaning device is additionally arranged, so that the IC carrying disc can be cleaned when errors are reported during detection of the IC carrying disc, then reinspection is carried out, interference of dust or other impurities on detection of the IC carrying disc is avoided, and the detection precision and accuracy of the IC carrying disc are guaranteed.

Description

Technical Field

[0001] This invention belongs to the field of IC carrier tray inspection technology, specifically relating to an IC carrier tray appearance inspection device and its usage method. Background Technology

[0002] IC carrier trays, also known as electronic chip trays, are plastic packaging trays specially designed for semiconductor packaging and testing companies. They are used throughout the entire process of chip packaging, testing, transportation, and storage, and are a core auxiliary component to ensure chip safety and production efficiency. IC carrier trays have functions such as anti-static properties, chip protection, and support for automated testing, and are widely used in many fields such as semiconductor packaging, consumer electronics, automotive electronics, and communication equipment.

[0003] After IC carriers are manufactured, their appearance needs to be inspected to determine if there are any problems such as damage, scratches, contamination, burrs, breaks, mixed materials, or indentations, thereby improving the production quality of IC carriers. For example, Chinese patent CN209156463U discloses a highly efficient IC appearance inspection and sorting device. This device uses left and right guide rails with left and right motors, front and rear guide rails with front and rear motors, guide columns with lifting motors, and vacuum nozzles to facilitate the movement and placement of ICs. It also uses a camera to photograph and compare the ICs, avoiding the visual fatigue that can easily occur when inspecting manually due to the large production volume and small solder joints, which can lead to misidentification and missed inspections. This device effectively improves inspection and sorting efficiency by preventing subjective human interference in the quality assurance system. However, in actual use, this device lacks a cleaning device for the IC carriers. Dust or other impurities inside the IC carriers can affect normal inspection, increasing the inspection error and leading to misidentification.

[0004] Therefore, in order to address the above-mentioned technical problems, it is necessary to provide an IC carrier disk appearance inspection device and its usage method.

[0005] The information disclosed in this background section is intended only to enhance the understanding of the overall background of the invention and should not be construed as an admission or in any way implying that the information constitutes prior art known to those skilled in the art. Summary of the Invention

[0006] The purpose of this invention is to provide an IC carrier disk appearance inspection device and its usage method, which can solve the problem of large inspection error in the above-mentioned IC carrier disk inspection equipment.

[0007] To achieve the above objectives, a specific embodiment of the present invention provides the following technical solution:

[0008] An IC tray appearance inspection device includes a placement stage, a support, an inspection mechanism, and a blowing mechanism. The support is slidable on the placement stage, and a mounting base is slidably mounted on the support. The inspection mechanism is mounted on the mounting base. The blowing mechanism includes a pair of power mechanisms and a blowing mechanism. The pair of power mechanisms are symmetrically mounted on the mounting base and respectively located on both sides of the inspection mechanism. The blowing mechanism is mounted on the pair of power mechanisms. When an IC tray inspection error occurs, the blowing mechanism can move to the underside of the inspection mechanism under the action of the power mechanisms and blow away the IC tray to remove interference caused by dust or other impurities to the IC tray re-inspection.

[0009] In one or more embodiments of the present invention, the power mechanism includes a first fixed plate, an L-shaped bracket, a first lead screw, a first motor, and a slider. The first fixed plate is fixedly connected to the side wall of the mounting base. The L-shaped bracket is fixedly connected to the mounting base and is coplanar with the detection mechanism. The first lead screw is rotatable between the first fixed plate and the L-shaped bracket. The first motor is mounted on the first fixed plate, and the first lead screw is connected to the output end of the first motor. The slider is threadedly connected to the first motor and is disposed between the first fixed plate and the L-shaped bracket.

[0010] In one or more embodiments of the present invention, the length of the first lead screw is greater than the maximum distance between the mounting base and the detection mechanism.

[0011] In one or more embodiments of the present invention, the air blowing mechanism includes a movable base, an air pump, a straight pipe, and a plurality of evenly distributed nozzles. The movable base is fixedly connected between a pair of sliders. The air pump is mounted on the side wall of the movable base. The straight pipe is mounted on the lower side of the movable base and is connected to the output end of the air pump. The nozzles are fixedly connected to the straight pipes, and control valves are mounted on the nozzles.

[0012] In one or more embodiments of the present invention, the width of the movable seat is greater than the diameter of the lens of the detection mechanism.

[0013] In one or more embodiments of the present invention, the movable seat is hollow inside and coated with a paint.

[0014] In one or more embodiments of the present invention, a displacement sensor is installed at the bottom of the movable seat.

[0015] In one or more embodiments of the present invention, the side wall of the movable seat is provided with an observation plate and a supplementary tube.

[0016] In one or more embodiments of the present invention, a marking mechanism is installed at the bottom of the movable seat. The marking mechanism includes a pair of second fixed plates, a second lead screw, a third motor, a marking tube, and a liquid pump. The pair of second fixed plates are fixedly connected to the bottom wall of the movable seat and are located on one side of the straight tube. The second lead screw is rotatable between the pair of second fixed plates. The third motor is mounted on one of the second fixed plates, and its output end is connected to the second lead screw. The marking tube is threaded onto the second lead screw and is located between the pair of second fixed plates; a marking head is mounted on the marking tube. The liquid pump is installed inside the coating material, and its output end is connected to a delivery pipe, which is connected to the marking tube.

[0017] A method of using an IC carrier disk appearance inspection device includes the following steps:

[0018] S1. Place the IC carrier to be tested on the placement stage. The bracket slides on the placement stage and the mounting base slides on the bracket. The position of the testing mechanism can be adjusted so that the testing mechanism can perform visual inspection on the IC carrier.

[0019] S2. During the operation of the testing facility, the testing facility can acquire overall images and local detail images of the IC carrier disk, and segment, process and analyze the acquired images to determine whether there are defects in the IC carrier disk;

[0020] S3. When a defect is found in a certain area of ​​the IC carrier during the initial inspection, the first motor runs and drives the first lead screw to rotate in the forward direction. Since the slider is threadedly connected to the first lead screw, the slider can drive the moving seat to move towards the lower side of the inspection mechanism.

[0021] S4. When the moving base moves to the lower side of the inspection mechanism, the moving base can cover the lens of the inspection mechanism. The air pump runs and draws in the outside gas. The gas enters the straight pipe and opens the control valve corresponding to the defective area of ​​the initial inspection. The gas in the straight pipe is discharged through the nozzle and blown towards the defective area of ​​the IC carrier in the initial inspection, in order to eliminate the interference caused by dust or other impurities to the re-inspection of the IC carrier.

[0022] S5. After the purging is completed, the first motor runs and drives the first lead screw to rotate in the opposite direction, so that the moving seat moves and no longer blocks the lens of the detection mechanism. The detection mechanism then re-inspects the defective areas of the IC carrier disk that were initially inspected.

[0023] S6. If defects are still found during the re-inspection of the IC carrier, the first motor is run again to move the moving seat to the lower side of the lens of the inspection mechanism, and then the third motor is run to rotate the second lead screw. Since the marking tube is threadedly connected to the second lead screw, the second lead screw can drive the third motor to move. The moving position is located by the displacement sensor, so that the marking tube moves to the upper side of the defective area of ​​the IC carrier during re-inspection.

[0024] S7. The pump operates and extracts the paint from the moving seat. The extracted paint enters the marking tube through the delivery pipe and is sprayed onto the defective areas of the IC carrier tray through the marking head to mark the defective areas of the IC carrier tray for easy subsequent inspection.

[0025] S8. If no defects are found during the re-inspection of the IC carrier, the initial defect signal of the IC carrier is eliminated, and the IC carrier can undergo other subsequent tests.

[0026] Compared with the prior art, the IC carrier appearance inspection device and its usage method of the present invention are equipped with a cleaning device. When the IC carrier inspection reports an error, the IC carrier can be cleaned and then re-inspected to avoid interference from dust or other impurities on the IC carrier inspection and to ensure the inspection accuracy and precision of the IC carrier. Attached Figure Description

[0027] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0028] Figure 1 This is a perspective view of an IC carrier disk appearance inspection device according to an embodiment of the present invention;

[0029] Figure 2 for Figure 1 Schematic diagram of the structure at point A in the middle;

[0030] Figure 3 This is a schematic diagram of the detection state section of an IC carrier disk appearance inspection device according to an embodiment of the present invention;

[0031] Figure 4 for Figure 3 Schematic diagram of the structure at point B;

[0032] Figure 5 for Figure 3 Schematic diagram of the structure at point C;

[0033] Figure 6 for Figure 3 Schematic diagram of the structure at point D;

[0034] Figure 7 This is a cross-sectional view of the purging mechanism in one embodiment of the present invention;

[0035] Figure 8 This is a schematic diagram of the blow-off state section of an IC carrier disk appearance inspection device according to an embodiment of the present invention;

[0036] Figure 9 for Figure 8 Schematic diagram of the structure at point E in the middle.

[0037] Explanation of key figure labels:

[0038] 1-Placement platform, 2-Bracket, 201-Mounting base, 3-Detection mechanism, 4-Purge mechanism, 401-Power mechanism, 4011-First fixed plate, 4012-L-shaped bracket, 4013-First lead screw, 4014-First motor, 4015-Slider, 402-Blowing mechanism, 4021-Moving seat, 40211-Paint, 40212-Displacement sensor, 4022-Air pump, 4023-Straight pipe, 4024-Spray head, 4025-Control valve, 5-Marking mechanism, 501-Second fixed plate, 502-Second lead screw, 503-Third motor, 504-Marking tube, 505-Marking head, 506-Liquid pump, 507-Transfer pipe. Detailed Implementation

[0039] To enable those skilled in the art to better understand the technical solutions in this disclosure, the technical solutions in the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this disclosure, and not all embodiments. Based on the embodiments in this disclosure, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of this disclosure.

[0040] like Figures 1 to 9 As shown, an IC tray appearance inspection device according to an embodiment of the present invention includes a placement platform 1, a support 2, an inspection mechanism 3, and a blowing mechanism 4. The support 2 is slidable on the placement platform 1, and a mounting base 201 is slidably provided on the support 2. The inspection mechanism 3 is mounted on the mounting base 201. The blowing mechanism 4 includes a pair of power mechanisms 401 and a blowing mechanism 402. The pair of power mechanisms 401 are symmetrically mounted on the mounting base 201 and respectively located on both sides of the inspection mechanism 3. The blowing mechanism 402 is mounted on the pair of power mechanisms 401. When the IC tray has defects in the initial inspection, the blowing mechanism 402 can move to the lower side of the inspection mechanism 3 under the action of the power mechanisms 401 and can blow away the IC tray to remove the interference caused by dust or other impurities to the re-inspection of the IC tray.

[0041] The placement stage 1 is used to place IC trays for visual inspection. The bracket 2 slides on the placement stage 1 to adjust the position of the inspection mechanism 3. The mounting base 201 is used to mount the inspection mechanism 3 and also to adjust its position. The inspection mechanism 3 is used to perform visual inspection on the IC trays placed on the placement stage 1. The power mechanism 401 drives the air blowing mechanism 402 to move. The air blowing mechanism 402 is used to blow away any dust or other impurities that may be present on the IC trays.

[0042] The IC tray to be inspected is placed on the placement stage 1. The position of the inspection mechanism 3 is adjusted by the cooperation of the bracket 2 and the mounting base 201 so that the inspection mechanism 3 can fully perform visual inspection of the IC tray. If the IC tray is found to be defective during the visual inspection of the inspection mechanism 3, the blowing mechanism 4 will be triggered. The blowing mechanism 402 can be moved to the lower side of the lens of the inspection mechanism 3 under the action of the power mechanism 401. This not only facilitates the blowing of the defective area of ​​the IC tray, but also protects the lens of the inspection mechanism 3 from dust or other impurities.

[0043] In this embodiment, the detection mechanism 3 includes a CCD camera, an infrared camera, an ultraviolet camera, and a ring-shaped LED light source. The CCD camera is used for high-definition texture and size detection. The infrared camera, with a wavelength of 3-5 μm, is used to detect surface temperature differences and can identify minute cracks or internal structural anomalies. The ultraviolet camera, with a wavelength of 365 nm, can detect contaminants invisible to the naked eye when used with a fluorescent coating. The ring-shaped LED light source supports independent control of four colors (RGBW), with brightness adjustable from 0-100%. The detection mechanism 3 can acquire overall images and detailed images of the IC carrier disk and automatically select the optimal light source combination based on the IC carrier disk material, such as conductive / antistatic plastic, increasing overall flexibility of use.

[0044] In addition, a control unit is installed on the mounting base 201. The control unit is equipped with a lightweight convolutional neural network, whose training dataset contains more than 100,000 labeled images, covering a variety of common defects such as scratches, stains, burrs, and deformations. The control unit can segment the images acquired by the detection mechanism 3 into multiple regions, such as dividing the IC carrier into a 10×10 grid area, imaging each region individually, and processing and analyzing each region separately to determine whether there are defects on the IC carrier.

[0045] like Figures 1 to 9As shown, the power mechanism 401 includes a first fixed plate 4011, an L-shaped bracket 4012, a first lead screw 4013, a first motor 4014, and a slider 4015. The first fixed plate 4011 is fixedly connected to the side wall of the mounting base 201. The L-shaped bracket 4012 is fixedly connected to the mounting base 201 and is coplanar with the detection mechanism 3. The first lead screw 4013 is rotatable between the first fixed plate 4011 and the L-shaped bracket 4012. The first motor 4014 is mounted on the first fixed plate 4011, and the first lead screw 4013 is connected to the output end of the first motor 4014. The slider 4015 is threadedly connected to the first motor 4014 and is located between the first fixed plate 4011 and the L-shaped bracket 4012. The first lead screw 4013 is fixed to the side wall of the mounting base 201 through the cooperation of the first fixed plate 4011 and the L-shaped bracket 4012. Figure 2 and Figure 4 As shown. The first motor 4014 drives the first lead screw 4013 to rotate, thereby adjusting the position of the slider 4015. The slider 4015 is used to mount the air blowing mechanism 402.

[0046] When the inspection mechanism 3 detects a defect in the initial inspection of the IC carrier, the first motor 4014 runs to rotate the first lead screw 4013. Since the slider 4015 is threadedly connected to the first lead screw 4013, the slider 4015 can move on the first lead screw 4013 to adjust the position of the air blowing mechanism 402.

[0047] Preferably, the first motor 4014 is a forward and reverse servo motor, which can make the first lead screw 4013 rotate in both directions.

[0048] In this embodiment, the length of the first lead screw 4013 is greater than the maximum distance between the mounting base 201 and the detection mechanism 3. When the detection mechanism 3 performs visual inspection, the air blowing mechanism 402 moves to the underside of the mounting base 201, which will not affect the normal use of the detection mechanism 3. When it is necessary to blow away any dust or other impurities that may be present in the IC tray, the air blowing mechanism 402 can move to the underside of the lens of the detection mechanism 3 to clean the IC tray.

[0049] like Figures 1 to 9 As shown, the air blowing mechanism 402 includes a movable base 4021, an air pump 4022, a straight pipe 4023, and several evenly distributed nozzles 4024. The movable base 4021 is fixedly connected between a pair of sliders 4015. The air pump 4022 is mounted on the side wall of the movable base 4021. The straight pipe 4023 is mounted on the lower side of the movable base 4021 and is connected to the output end of the air pump 4022. The nozzles 4024 are fixedly connected to the straight pipe 4023, and a control valve 4025 is mounted on the nozzle 4024.

[0050] The movable base 4021 is used to install the air pump 4022 and the straight pipe 4023. When the air pump 4022 is running, it draws in external gas and delivers it to the straight pipe 4023. The gas in the straight pipe 4023 can be sprayed onto the IC carrier through the nozzle 4024 to purge the IC carrier and remove any dust or other impurities that may be present within it. The control valve 4025 controls the opening and closing of the nozzle 4024. The control valve 4025 is opened based on the inspection results from the inspection mechanism 3. For example, if the inspection mechanism 3 initially detects a defect in a certain area of ​​the IC carrier, it will open the corresponding control valve 4025, allowing the nozzle 4024 to spray high-pressure gas into that area to remove any dust or impurities that may be present in that area of ​​the IC carrier, thus avoiding interference with the re-inspection by the inspection mechanism 3.

[0051] When the IC tray needs to be purged, the vacuum pump 4022 is activated. The vacuum pump 4022 draws in outside gas and delivers it to the straight pipe 4023. The control valve 4025 opens according to the detection results of the testing mechanism 3. The gas in the straight pipe 4023 is sprayed onto the IC tray through the nozzle 4024. The high-pressure gas is used to blow away any dust or other impurities that may be present in the IC tray, thus eliminating interference from dust or other impurities on the re-inspection by the testing mechanism 3.

[0052] The straight tube 4023 is equipped with an electric heating module, such as a heating wire, with a heating range of 40-80℃. When the detection mechanism 3 detects suspected oil-like contaminants on the IC carrier, the electric heating module activates to increase the gas temperature inside the straight tube 4023, thereby increasing the temperature of the gas ejected from the nozzle 4024 to heat and purge the oil-like contaminants from the IC carrier. When the detection mechanism 3 detects adhering particles on the IC carrier, the vacuum pump 4022 uses pulse purging at a frequency of 5-20Hz to remove the adhering particles.

[0053] In this embodiment, the air pump 4022 has a power greater than 500W, a maximum flow rate of 60L / min, and an adjustable pressure range of 0.1-0.8MPa. The straight pipe 4023 is made of 316 stainless steel with a polished surface to prevent dust adhesion.

[0054] Optionally, the nozzle 4024 is a reversible fan-shaped nozzle driven by a micro stepper motor, with a coverage angle of 30°, 60°, or 90° selectable.

[0055] Preferably, the width of the movable base 4021 is greater than the diameter of the lens of the detection mechanism 3. This ensures that the movable base 4021 can cover the detection mechanism 3, thereby protecting the lens of the detection mechanism 3.

[0056] like Figure 7 As shown, the movable base 4021 is hollow inside and is coated with paint 40211. Paint 40211 is used to mark defective areas on the IC carrier for easy inspection later.

[0057] The movable base 4021 has an observation plate and a replenishment pipe on its side wall. The capacity of the paint 40211 can be viewed through the observation plate so that it can be replenished in a timely manner through the replenishment pipe.

[0058] like Figures 1 to 9 As shown, a marking mechanism 5 is installed at the bottom of the movable base 4021. The marking mechanism 5 is used to mark the defective areas of the IC carrier during re-inspection, so that the staff can check them later.

[0059] The marking mechanism 5 includes a pair of second fixed plates 501, a second lead screw 502, a third motor 503, a marking tube 504, and a pump 506. The pair of second fixed plates 501 are fixedly connected to the lower bottom wall of the movable seat 4021 and are located on one side of the straight tube 4023. The second lead screw 502 is rotatable between the pair of second fixed plates 501. The third motor 503 is mounted on one of the second fixed plates 501, and its output end is connected to the second lead screw 502. The marking tube 504 is threaded onto the second lead screw 502 and is located between the pair of second fixed plates 501; a marking head 505 is mounted on the marking tube 504. The pump 506 is installed inside the coating 40211, and its output end is connected to a delivery tube 507, which is connected to the marking tube 504.

[0060] The second fixing plate 501 is used to fix the second lead screw 502. The second lead screw 502 and the third motor 503 are used to drive the marking tube 504 to move. Through the cooperation of the liquid pump 506, the delivery tube 507, the marking tube 504 and the marking head 505, the defective areas of the IC carrier tray can be marked during re-inspection.

[0061] If the IC carrier still has defects after the inspection agency 3 conducts a re-inspection, the third motor 503 is activated. The third motor 503 rotates the second lead screw 502. Since the marking tube 504 is threadedly connected to the second lead screw 502, the marking tube 504 can move under the moving seat 4021. When the marking tube 504 moves to the correct position, the liquid pump 506 is activated. The liquid pump 506 draws paint 40211 from the moving seat 4021 and delivers it to the marking tube 504 through the delivery tube 507. The paint 40211 in the marking tube 504 marks the defective areas of the IC carrier after re-inspection through the marking head 505, facilitating subsequent inspection by staff.

[0062] In this embodiment, the pump 506 is a piezoelectric ceramic micro-metering pump with a controllable single injection volume of 0.1 μl. The marking head 505 is a stainless steel needle with an inner diameter of 0.1 mm, capable of making dotted or linear markings.

[0063] To further identify IC carrier defects, the movable base 4021 may be equipped with two liquid storage chambers, each containing a liquid level sensor. The two chambers can store red paint 40211 and yellow paint 40211, respectively. Red paint 40211 indicates a fatal defect in the IC carrier, such as structural cracking. Yellow paint 40211 indicates a major defect in the IC carrier, such as deep scratches.

[0064] Specifically, Coating 40211 is a fast-drying UV ink, which can significantly shorten the curing time after marking with Coating 40211 and ensure the marking effect of defects.

[0065] like Figures 8 to 9 As shown, a displacement sensor 40212 is installed at the bottom of the movable base 4021. The displacement sensor 40212 is used to detect the movement of the marking tube 504 to ensure that the marking tube 504 can move to the correct position, which facilitates marking of defective areas in the IC carrier tray during re-inspection.

[0066] Preferably, the displacement sensor 40212 is electrically connected to the control unit. The control unit can send the coordinates of the defective area to the displacement sensor 40212. When the marking tube 504 moves to the corresponding position, the displacement sensor 40212 will send a signal to the control unit, and then the control unit will control the marking tube 504 to stop running.

[0067] A method of using an IC carrier disk appearance inspection device includes the following steps:

[0068] S1. Place the IC carrier to be tested on the placement stage 1. The bracket 2 slides on the placement stage 1, and the mounting base 201 slides on the bracket 2. The position of the testing mechanism 3 can be adjusted so that the testing mechanism 3 can perform appearance inspection on the IC carrier.

[0069] S2. When the testing mechanism 3 is running, the testing mechanism 3 can acquire overall images and local detail images of the IC carrier, and segment, process and analyze the acquired images to determine whether there are defects in the IC carrier;

[0070] S3. When a defect is found in a certain area of ​​the IC carrier during the initial inspection, the first motor 4014 runs and drives the first lead screw 4013 to rotate in the forward direction. Since the slider 4015 is threadedly connected to the first lead screw 4013, the slider 4015 can drive the moving seat 4021 to move towards the lower side of the inspection mechanism 3.

[0071] S4. When the movable seat 4021 moves to the lower side of the inspection mechanism 3, the movable seat 4021 can cover the lens of the inspection mechanism 3. The air pump 4022 runs and draws in the outside gas. The gas enters the straight pipe 4023 and opens the control valve 4025 corresponding to the defective area of ​​the initial inspection. The gas in the straight pipe 4023 is discharged through the nozzle 4024 and blown towards the defective area of ​​the IC tray in the initial inspection, so as to eliminate the interference caused by dust or other impurities to the re-inspection of the IC tray.

[0072] S5. After the purging is completed, the first motor 4014 runs and drives the first lead screw 4013 to rotate in the opposite direction, so that the moving seat 4021 moves and no longer blocks the lens of the detection mechanism 3. The detection mechanism 3 re-inspects the defective areas of the IC tray in the initial inspection.

[0073] S6. If defects are still found during the re-inspection of the IC carrier, the first motor 4014 is run again to move the moving seat 4021 to the lower side of the lens of the inspection mechanism 3. Then the third motor 503 is run to rotate the second lead screw 502. Since the marking tube 504 is threadedly connected to the second lead screw 502, the second lead screw 502 can drive the third motor 503 to move. The moving position is located by the displacement sensor 40212, so that the marking tube 504 moves to the upper side of the defective area of ​​the IC carrier during re-inspection.

[0074] S7. The pump 506 operates and extracts the paint 40211 from the moving seat 4021. The extracted paint 40211 enters the marking tube 504 through the delivery pipe 507 and is sprayed onto the defective area of ​​the IC carrier tray through the marking head 505 to mark the defective area of ​​the IC carrier tray for easy subsequent inspection. At the same time, since the moving seat 4021 covers the lens of the inspection mechanism 3, it can prevent the paint 40211 droplets from adhering to the lens of the inspection mechanism 3.

[0075] S8. If no defects are found during the re-inspection of the IC carrier, the initial defect signal of the IC carrier is eliminated, and the IC carrier can undergo other subsequent tests.

[0076] It will be apparent to those skilled in the art that this disclosure is not limited to the details of the exemplary embodiments described above, and that this disclosure can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of this disclosure is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within this disclosure. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0077] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. An IC boat appearance inspection apparatus characterized by comprising: include: Placement platform; A bracket is slidable on the placement platform, and a mounting base is slidably provided on the bracket; The testing mechanism is installed on the mounting base; The purging mechanism includes a pair of power mechanisms and a blowing mechanism. The pair of power mechanisms are symmetrically mounted on the mounting base and respectively located on both sides of the detection mechanism. The blowing mechanism is mounted on the pair of power mechanisms. When the IC tray detection reports an error, the blowing mechanism can move to the lower side of the detection mechanism under the action of the power mechanisms and can purge the IC tray.

2. The IC carrier disk appearance inspection device according to claim 1, characterized in that, The power mechanism includes: The first fixing plate is fixedly connected to the side wall of the mounting base; The L-shaped bracket is fixedly connected to the mounting base and is coplanar with the detection mechanism; The first lead screw is rotatable between the first fixed plate and the L-shaped bracket; A first motor is mounted on the first fixed plate, and the first lead screw is connected to the output end of the first motor. The slider is threadedly connected to the first motor and is located between the first fixed plate and the L-shaped bracket.

3. The IC carrier disk appearance inspection device according to claim 2, characterized in that, The length of the first lead screw is greater than the maximum distance between the mounting base and the detection mechanism.

4. The IC carrier disk appearance inspection device according to claim 2, characterized in that, The air blowing mechanism includes: A movable base is fixedly connected between the pair of sliders; An air pump is installed on the side wall of the movable seat; A straight pipe is installed on the lower side of the movable base and is connected to the output end of the air pump; Several evenly distributed nozzles are fixedly connected to a straight pipe, and control valves are installed on the nozzles.

5. The IC carrier disk appearance inspection device according to claim 4, characterized in that, The width of the movable seat is greater than the diameter of the lens of the detection mechanism.

6. The IC carrier disk appearance inspection device according to claim 4, characterized in that, The movable seat is hollow inside and coated with paint.

7. The IC carrier disk appearance inspection device according to claim 1, characterized in that, A displacement sensor is installed at the bottom of the movable seat.

8. The IC carrier disk appearance inspection device according to claim 6, characterized in that, The side wall of the movable seat is equipped with an observation plate and a replenishment tube.

9. The IC carrier disk appearance inspection device according to claim 6, characterized in that, A marking mechanism is installed at the bottom of the movable seat, the marking mechanism comprising: A pair of second fixing plates are fixedly connected to the lower bottom wall of the movable seat and are located on one side of the straight tube; The second lead screw is rotatable between a pair of second fixed plates; A third motor is mounted on one of the second fixing plates, and the output end of the third motor is connected to the second lead screw. A marking tube is threaded onto the second lead screw and positioned between a pair of second fixing plates, and a marking head is mounted on the marking tube; A liquid pump is installed inside the coating material, and the output end of the liquid pump is connected to a delivery pipe, which is connected to the marking pipe.

10. A method of using the IC tray appearance inspection device as described in any one of claims 1-9, characterized in that, Includes the following steps: S1. Place the IC carrier to be tested on the placement stage. The bracket slides on the placement stage and the mounting base slides on the bracket. The position of the testing mechanism can be adjusted so that the testing mechanism can perform visual inspection on the IC carrier. S2. During the operation of the testing facility, the testing facility can acquire overall images and local detail images of the IC carrier disk, and segment, process and analyze the acquired images to determine whether there are defects in the IC carrier disk; S3. When a defect is found in a certain area of ​​the IC carrier during the initial inspection, the first motor runs and drives the first lead screw to rotate in the forward direction. Since the slider is threadedly connected to the first lead screw, the slider can drive the moving seat to move towards the lower side of the inspection mechanism. S4. When the moving seat moves to the lower side of the inspection mechanism, the moving seat can cover the lens of the inspection mechanism, the air pump runs and draws in the outside gas, the gas enters the straight pipe and opens the control valve corresponding to the defective area of ​​the initial inspection, the gas in the straight pipe is discharged through the nozzle and blown towards the defective area of ​​the IC carrier in the initial inspection. S5. After the purging is completed, the first motor runs and drives the first lead screw to rotate in the opposite direction, so that the moving seat moves and no longer blocks the lens of the detection mechanism. The detection mechanism then re-inspects the defective areas of the IC carrier disk in the initial inspection. S6. If defects are still found during the re-inspection of the IC carrier, the first motor is run again to move the moving seat to the lower side of the lens of the inspection mechanism. Then the third motor is run to rotate the second lead screw. Since the marking tube is threadedly connected to the second lead screw, the second lead screw can drive the third motor to move. The moving position is located by the displacement sensor, so that the marking tube moves to the upper side of the defective area of ​​the IC carrier during re-inspection. S7. The pump operates and extracts the paint from the moving seat. The extracted paint enters the marking tube through the delivery pipe and is sprayed onto the defective areas of the IC carrier tray through the marking head to mark the defective areas of the IC carrier tray. S8. If no defects are found during the re-inspection of the IC carrier, the initial defect signal of the IC carrier is eliminated, and the IC carrier can undergo other subsequent tests.

Images