Detection device for chip fault

By designing an automated chip inspection device, the problems of solder cooling and metal debris residue were solved, enabling an efficient, safe, and accurate chip inspection process.

CN121878419APending Publication Date: 2026-04-17SHENZHEN FENGXIANG OPTOELECTRONIC CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
SHENZHEN FENGXIANG OPTOELECTRONIC CO LTD
Filing Date
2023-12-26
Publication Date
2026-04-17

AI Technical Summary

Technical Problem

During chip fault detection, the solder may cause circuit continuity after cooling, and residual metal debris may affect chip use. Traditional shaking operations may cause the solder structure to separate from the chip board, posing a safety hazard.

Method used

A detection device is designed, comprising a fixed plate, a slide bar, a U-shaped frame, a vertical rod, a rotating frame, a chip clamp, a detection table, a cleaning plate, and a collection box. The device achieves automated chip detection and cleaning through a rotary motor and a lifting mechanism. The chip clamp holds chips of different sizes, the rotating frame moves the chips to the detection or cleaning position, and the collection box collects debris and molten solder.

Benefits of technology

It improves the accuracy and efficiency of chip testing, avoids the risk of short circuits, and ensures the cleanliness and safety of the testing environment.

✦ Generated by Eureka AI based on patent content.

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Abstract

A chip fault detection device disclosed by the present invention comprises a fixed plate, the upper end of the fixed plate is connected with a plate frame, the plate frame is connected with sliding strips, a U-shaped frame is connected between the sliding strips, the sliding strips are connected with a moving shaft, the plate frame is connected with a vertical rod, a bending frame is connected between the vertical rod and the moving shaft, and the lower end of the vertical rod is connected with a rotating frame. One end of the rotating frame is rotatably connected with a chip clamp, one side of the fixing plate is connected with a T-shaped frame and a shaft frame, the shaft frame is connected with a motor cover, the motor cover is connected with a rotating motor, the fixing plate is connected with a detection meter, the detection meter is connected with a detection pen through a cable, and the lower end of the fixing plate is connected with a first fixing frame and a second fixing frame. According to the chip detection device, chips are moved to the structure through the collection box, residual scraps and molten soldering tin on the chips can be recycled, the cleanliness of the surfaces of the chips is improved, the chip detection step and the chip cleaning step are sequentially carried out, and the chip detection accuracy is improved.
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Description

Technical Field

[0001] This invention relates to the field of chip testing technology, and in particular to a device for detecting chip faults. Background Technology

[0002] In electronics, a chip is a way to miniaturize circuits (mainly semiconductor devices, but also passive components, etc.) and is often manufactured on the surface of a semiconductor wafer.

[0003] When performing chip fault detection, it is necessary to use a test meter to measure the voltage of different lines on the chip. When facing a chip fault, it is necessary to remove different components on the chip for detailed inspection. Since the components on the chip are connected to the chip body by solder, the solder needs to be cleaned after melting to prevent the solder from cooling and causing different lines on the chip to become connected, affecting the normal use of the chip. In addition, during chip fault detection, metal debris will remain on the surface of the chip. If it is not cleaned in time, it will affect the subsequent use of the chip. Furthermore, the traditional operation of shaking the chip board by the tester can cause the circuit connections to loosen due to shaking. In severe cases, it can cause the solder structure to separate from the chip board surface, resulting in a short circuit and posing a safety hazard.

[0004] Based on this, a chip fault detection device is proposed. Summary of the Invention

[0005] The purpose of this invention is to provide a chip fault detection device in order to solve the above-mentioned problems.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] A chip fault detection device includes a fixed plate, a plate frame connected to the upper end of the fixed plate, slide bars connected to the plate frame, a U-shaped frame connected between the slide bars, a moving shaft connected to the slide bars, a vertical rod connected to the plate frame, a bending frame connected between the vertical rod and the moving shaft, a rotating frame connected to the lower end of the vertical rod, a chip clamp rotatably connected to one end of the rotating frame, a T-shaped frame and a shaft frame connected to one side of the fixed plate, a motor cover connected to the shaft frame, and a rotary motor connected to the motor cover.

[0008] A test gauge is connected to the fixed plate, and a test pen is connected to the test gauge via a cable.

[0009] The lower end of the fixed plate is connected to a first fixed frame and a second fixed frame. A cleaning plate is connected to the first fixed frame. A collection box is connected to the lower end of the cleaning plate via a rod. A hinge frame is connected to the lower end of the cleaning plate. A dumbbell is rotatably connected to the hinge frame. A testing platform is connected to the lower end of the second fixed frame. A button is connected to the testing platform. A rotating mechanism for driving the vertical rod to rotate and a lifting mechanism for driving the vertical rod to rise and fall are provided on one side of the rotary motor.

[0010] Preferably, the plate frame has a groove, and the slide bar is slidably connected to the groove of the plate frame.

[0011] Preferably, the vertical rod has a toothed structure, one end of the bending frame is engaged with the toothed structure of the vertical rod, and the bending frame is a two-section structure.

[0012] Preferably, the chip holder has slots, and the chip can be connected between the slots of the chip holder.

[0013] Preferably, a placement clip is connected to the fixing plate.

[0014] Preferably, the rotating mechanism includes an upper turntable connected to the output end of a rotary motor, a rod-shaped structure connected to the upper turntable, and the U-shaped frame connected to the rod-shaped structure of the upper turntable via a second traction bar. A synchronous pulley is connected to the output end of the rotary motor.

[0015] Preferably, the lifting mechanism includes a sliding block with a Z-shaped rail. A slide rail is connected to the lower end of the fixed plate. A traction frame is connected to one side of the sliding block. A rotating shaft is connected to the T-shaped frame. A lower turntable and a synchronous pulley are connected to the rotating shaft. A transmission belt is connected between the synchronous pulleys. A rod-shaped structure is connected to the lower turntable. A traction bar is connected between the traction frame and the rod-shaped structure of the lower turntable. A vertical rail is connected to the lower end of the fixed plate. A slider is connected to the vertical rail. A lifting clamp and a sliding rod are connected to the slider.

[0016] Preferably, a ring structure is connected to the vertical rod, and the lifting clamp is held in place by the ring structure on the vertical rod.

[0017] In summary, due to the adoption of the above technical solution, the beneficial effects of the present invention are:

[0018] 1. This application adopts a collection box structure, which allows residual debris and molten solder on the chip to be recovered when the chip is moved onto the structure, thereby improving the cleanliness of the chip surface. This enables the chip inspection and chip cleaning steps to be performed sequentially, improving the accuracy of chip inspection.

[0019] 2. This application adopts a chip clamp structure to hold the chip. By changing the chip clamp of different sizes, different chips can be clamped for testing. With the help of the rotating frame, the chip can be transported to the testing position or the cleaning position, which improves the chip testing efficiency. Attached Figure Description

[0020] Figure 1 A schematic diagram of the overall structure of the detection device provided according to an embodiment of the present invention is shown;

[0021] Figure 2 A schematic diagram of the structure of the other side of the detection device provided according to an embodiment of the present invention is shown;

[0022] Figure 3 An exploded structural diagram of a connection point of a traction bar provided according to an embodiment of the present invention is shown;

[0023] Figure 4 An exploded structural diagram of the slider connection provided according to an embodiment of the present invention is shown;

[0024] Figure 5 An exploded structural diagram of the bending frame connection provided according to an embodiment of the present invention is shown;

[0025] Figure 6 An exploded structural diagram of the T-shaped frame connection provided according to an embodiment of the present invention is shown;

[0026] Figure 7 An exploded structural diagram of the articulated frame connection provided according to an embodiment of the present invention is shown.

[0027] Legend:

[0028] 1. Fixed plate; 2. Plate frame; 3. Sliding bar; 4. U-shaped frame; 5. Bending frame; 6. Vertical rod; 7. T-shaped frame; 8. Upper turntable; 9. Lower turntable; 10. Motor cover; 11. Rotary motor; 12. Transmission belt; 13. Fixed frame one; 14. Cleaning plate; 15. Collection box; 16. Test gauge; 17. Test table; 18. Test pen; 19. Chip holder; 20. Sliding block; 21. Rotating shaft; 22. Traction bar one; 23. Z-shaped rail; 24. Traction frame; 25. Moving shaft; 26. Vertical rail; 27. Sliding rail; 28. Slider; 29. ​​Sliding rod; 30. Lifting clamp; 31. Placement clamp; 32. Rotating frame; 33. Traction bar two; 34. Shaft frame; 35. Synchronous pulley; 36. Fixed frame two; 37. Button; 38. Dumbbell component; 39. Hinge frame. Detailed Implementation

[0029] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0030] Please see Figure 1-7 The present invention provides a technical solution:

[0031] A chip fault detection device includes a fixed plate 1, a plate frame 2 connected to the upper end of the fixed plate 1, the plate frame 2 consisting of two side plates and a horizontal plate, the two side plates having a hollow structure to reduce the overall weight of the device, and the hollow structure also facilitates the observation of data on the test table 16, a slide bar 3 connected to the plate frame 2, two slide bars 3 having a U-shaped frame 4 connected between the slide bars 3, a moving shaft 25 connected to the slide bar 3, the moving shaft 25 being connected to only one of the slide bar 3 structures, a vertical rod 6 connected to the plate frame 2, a bending frame 5 connected between the vertical rod 6 and the moving shaft 25, a rotating frame 32 connected to the lower end of the vertical rod 6, a chip clamp 19 rotatably connected to one end of the rotating frame 32, the chip clamp 19 being rotatably connected to the vertical rod 6, a T-shaped frame 7 and a shaft frame 34 connected to one side of the fixed plate 1, a motor cover 10 connected to the shaft frame 34, a rotary motor 11 connected to the motor cover 10, the motor cover 10 ensuring the secure connection of the rotary motor 11;

[0032] A test gauge 16 is connected to the fixed plate 1. The test gauge 16 is connected to a test pen 18 via a cable. The test pen 18 is used to contact the chip circuit to observe the path of different circuits of the chip and achieve the test effect.

[0033] The lower end of the fixed plate 1 is connected to a fixed frame 13 and a fixed frame 2 36. A cleaning plate 14 is connected to the fixed frame 13. The lower end of the cleaning plate 14 is connected to a collection box 15 via a rod. The collection box 15 is used to collect impurities on the chip, improving the quality of the working environment around the detection device. The lower end of the cleaning plate 14 is connected to a hinge frame 39. A dumbbell component 38 is rotatably connected to the hinge frame 39. The dumbbell component 38 adopts a dumbbell-like structure, allowing impurities to fall into the collection box 15 between the dumbbells, avoiding obstruction of impurities by the structure. The lower end of the fixed frame 2 36 is connected to a detection table 17. A button 37 is connected to the detection table 17. The button 37 has the function of controlling the rotary motor 11 to stop rotating. A rotating mechanism for driving the vertical rod 6 to rotate and a lifting mechanism for driving the vertical rod 6 to rise and fall are provided on one side of the rotary motor 11.

[0034] Specifically, such as Figure 1As shown, a groove is provided on the plate frame 2, and the slide bar 3 is slidably connected to the groove of the plate frame 2. The groove and the slide bar 3 slide and cooperate with each other, and the slide bar 3 and the groove cannot be separated vertically, which improves the sliding stability of the slide bar 3.

[0035] Specifically, such as Figure 1 and Figure 4 As shown, a toothed structure is provided on the vertical rod 6. One end of the bending frame 5 is engaged with the toothed structure of the vertical rod 6. The bending frame 5 is a two-section structure. Due to the engagement structure, the end of the bending frame 5 connected to the vertical rod 6 cannot rotate relative to the vertical rod 6.

[0036] Specifically, such as Figure 5 As shown, the chip holder 19 has slots, and the chip can be connected between the slots of the chip holder 19. This structure makes the installation and removal of the chip convenient and quick.

[0037] Specifically, such as Figure 5 As shown, a placement clip 31 is connected to the fixing plate 1. The placement clip 31 can be used to store the detection pen 18, avoiding the vertical setting of the detection pen 18 from stretching the connecting cable and increasing the cable burden.

[0038] Specifically, such as Figure 6 As shown, the rotating mechanism includes an upper turntable 8, which is connected to the output end of the rotary motor 11. A rod-shaped structure is connected to the upper turntable 8. The U-shaped frame 4 is connected to the rod-shaped structure of the upper turntable 8 through a traction bar 33. A synchronous pulley 35 is connected to the output end of the rotary motor 11. There are two synchronous pulleys 35, which are respectively connected to the output shaft of the rotary motor 11 and the rotating shaft 21. The two synchronous pulleys 35 are driven by a transmission belt 12.

[0039] Specifically, such as Figure 3 and Figure 4 As shown, the lifting mechanism includes a sliding block 20, on which a Z-shaped rail 23 is provided. A slide rail 27 is connected to the lower end of the fixed plate 1. A traction frame 24 is connected to one side of the sliding block 20. A rotating shaft 21 is connected to the T-shaped frame 7. A lower turntable 9 and a synchronous pulley 35 are connected to the rotating shaft 21. A transmission belt 12 is connected between the synchronous pulleys 35. A rod-shaped structure is connected to the lower turntable 9. A traction bar 22 is connected between the traction frame 24 and the rod-shaped structure of the lower turntable 9. A vertical rail 26 is connected to the lower end of the fixed plate 1. A slider 28 is connected to the vertical rail 26. A lifting clamp 30 and a sliding rod 29 are connected to the slider 28. A ring structure is connected to the vertical rod 6. The lifting clamp 30 is clamped on the ring structure. When the lifting clamp 30 is raised or lowered, it can drive the ring structure to rise or fall, thereby driving the vertical rod 6 to rise or fall.

[0040] Specifically, such as Figure 2As shown, a ring structure is connected to the vertical rod 6, and the lifting clamp 30 is clamped on the ring structure of the vertical rod 6.

[0041] In summary, the chip fault detection device provided in this embodiment allows for chip fault detection by inserting the chip into the chip clamp 19. Since the chip clamp 19 is replaceable, it can clamp chips of different sizes. The chip clamp 19 is rotatably connected to one end of the rotating frame 32 on both sides, facilitating subsequent chip cleaning. By starting the rotary motor 11, the upper turntable 8 rotates. The upper turntable 8, in conjunction with the traction bar 33, pulls the U-shaped frame 4. Since the two ends of the U-shaped frame 4 are fixedly connected to sliding bars 3, the rotation of the upper turntable 8 pulls the sliding bars 3 onto the plate frame 2. One of the sliding bars 3 is connected to a moving shaft 25, which moves the device. The bending frame 5 pulls the vertical rod 6 to rotate. The bending frame 5 is a structure consisting of two rod-shaped sections connected to each other. The two sections are rotatably connected. One end of the bending frame 5 is rotatably connected to the moving shaft 25, while the other end of the bending frame 5 is engaged with the vertical rod 6. This prevents relative rotation at the end of the bending frame 5 connected to the vertical rod 6, and this end can move up and down along the direction of the vertical rod 6. Through structural transmission, the vertical rod 6 can be rotated, moving the chip at the lower end of the vertical rod 6 to the corresponding detection table 17 or cleaning plate 14. The transmission belt 12 drives the rotating shaft 21 to rotate, and the rotating shaft 21, in conjunction with the traction bar 22, pulls the sliding block 20 to move on the slide rail 27. The slide bar 29 can slide on the Z-shaped rail 23, where the middle part of the Z-shaped rail 23 is inclined and the two ends are horizontal. When the slide bar 29 slides on the inclined part, it can drive the slider 28 connected to one end of the slide bar 29 to slide up and down along the vertical rail 26. This, in conjunction with the lifting clamp 30 connected to one side of the slider 28, drives the vertical rod 6 to move up and down. The up-and-down movement and rotation of the vertical rod 6 work together to allow the chip connected to the chip holder 19 to move between the detection table 17 and the cleaning plate 14. When the chip holder 19 moves onto the detection table 17, because one end of the Z-shaped rail 23 is horizontal, the chip holder 19 provides a vertical press to the button 37 when it moves onto the detection table 17. Pressure, button 37 can control the rotary motor 11 to stop rotating. At this time, the chip clamp 19, supported by the testing table 17, ensures the chip structure is fixed. The testing personnel can hold the testing pen 18 to test the chip. After the test is completed, the operator needs to control the rotary motor 11 to continue rotating, so that the chip clamp 19 moves the chip away from the testing table 17 and moves it below the cleaning plate 14. When the chip clamp 19 rises in height, the hinge bracket 39 and dumbbell component 38 limit one end of the chip clamp 19, so that the side of the chip clamp 19 that contacts the dumbbell component 38 stops moving upward, while the other side of the chip clamp 19 continues to move upward, so that the chip clamp 19 is in a tilted state at this time. Since the upper end of the Z-shaped rail 23 is a horizontal structure, the chip will maintain the tilted state for a period of time.The tilting motion in this state allows debris and solder generated during chip testing to fall into the collection box 15, effectively cleaning the chip surface and preventing liquid solder from re-solidifying at the chip circuitry, thus avoiding short circuits. This improves chip testing efficiency and reduces the failure rate after testing.

[0042] The above description of the embodiments enables those skilled in the art to make or use the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A device for detecting a fault of a chip, comprising a fixing plate (1), characterized in that, The upper end of the fixed plate (1) is connected to the plate frame (2), the plate frame (2) is connected to the slide bar (3), the slide bar (3) is connected to the U-shaped frame (4), the slide bar (3) is connected to the moving shaft (25), the plate frame (2) is connected to the vertical rod (6), the vertical rod (6) and the moving shaft (25) are connected to the bending frame (5), the lower end of the vertical rod (6) is connected to the rotating frame (32), one end of the rotating frame (32) is rotatably connected to the chip clip (19), the fixed plate (1) is connected to the T-shaped frame (7) and the shaft frame (34) on one side, the shaft frame (34) is connected to the motor cover (10), and the motor cover (10) is connected to the rotary motor (11); A test gauge (16) is connected to the fixing plate (1), and the test gauge (16) is connected to a test pen (18) via a cable; The lower end of the fixed plate (1) is connected to a first fixed frame (13) and a second fixed frame (36). The first fixed frame (13) is connected to a cleaning plate (14). The lower end of the cleaning plate (14) is connected to a collection box (15) via a rod. The lower end of the cleaning plate (14) is connected to a hinge frame (39). A dumbbell component (38) is rotatably connected to the hinge frame (39). The lower end of the second fixed frame (36) is connected to a testing platform (17). A button (37) is connected to the testing platform (17). A rotating mechanism for driving the vertical rod (6) to rotate and a lifting mechanism for driving the vertical rod (6) to rise and fall are provided on one side of the rotary motor (11).

2. The apparatus for detecting a failure of a chip according to claim 1, wherein The plate frame (2) has a groove, and the slide bar (3) is slidably connected to the groove of the plate frame (2).

3. The apparatus for detecting a failure of a chip according to claim 1, wherein The vertical rod (6) has a toothed structure, and one end of the bending frame (5) fits into the toothed structure of the vertical rod (6). The bending frame (5) is a two-section structure.

4. The apparatus for detecting a failure of a chip according to claim 1, wherein The chip holder (19) has slots, and chips can be connected between the slots of the chip holder (19).

5. The chip fault detection device according to claim 1, characterized in that, A placement clip (31) is connected to the fixing plate (1).

6. The chip fault detection device according to claim 1, characterized in that, The rotating mechanism includes an upper turntable (8), which is connected to the output end of a rotary motor (11). A rod-shaped structure is connected to the upper turntable (8), and the U-shaped frame (4) is connected to the rod-shaped structure of the upper turntable (8) via a traction bar (33). A synchronous pulley (35) is connected to the output end of the rotary motor (11).

7. The chip fault detection device according to claim 1, characterized in that, The lifting mechanism includes a sliding block (20), on which a Z-shaped rail (23) is provided. A slide rail (27) is connected to the lower end of the fixed plate (1). A traction frame (24) is connected to one side of the sliding block (20). A rotating shaft (21) is connected to the T-shaped frame (7). A lower turntable (9) and a synchronous pulley (35) are connected to the rotating shaft (21). A transmission belt (12) is connected between the synchronous pulleys (35). A rod-shaped structure is connected to the lower turntable (9). A traction bar (22) is connected between the traction frame (24) and the rod-shaped structure of the lower turntable (9). A vertical rail (26) is connected to the lower end of the fixed plate (1). A slider (28) is connected to the vertical rail (26). A lifting clamp (30) and a slide rod (29) are connected to the slider (28).

8. The chip fault detection device according to claim 7, characterized in that, A ring structure is connected to the vertical rod (6), and the lifting clamp (30) is clamped on the ring structure of the vertical rod (6).