Light-emitting device and light-emitting module

Abstract

A high-output light-emitting device having excellent manufacturing stability is achieved. The light-emitting device includes: a plurality of light-emitting elements including a first light-emitting element, a plurality of second light-emitting elements, and a plurality of third light-emitting elements; a base having first to fourth wiring portions, and a mounting surface provided between two of the first to fourth wiring portions in plan view; and a plurality of wirings electrically connecting the plurality of light-emitting elements and the base, the plurality of light-emitting elements being disposed on the mounting surface such that the first light-emitting element is positioned between the plurality of second light-emitting elements and the plurality of third light-emitting elements in plan view, the first wiring portion being electrically connected to the first light-emitting element on one electrode side of the two electrodes, and the second wiring portion being electrically connected to the second light-emitting element on the other electrode side of the two electrodes. The second wiring portion is electrically connected to the plurality of second light-emitting elements on one electrode side of the two electrodes, and the third wiring portion is electrically connected to the plurality of third light-emitting elements on one electrode side of the two electrodes. The fourth wiring portion is electrically connected to the first light-emitting element, the plurality of second light-emitting elements, and the plurality of third light-emitting elements on the other electrode side of the two electrodes.

Description

Technical Field

[0001] This invention relates to light-emitting devices and light-emitting modules. Background Technology

[0002] Japanese Patent Application Publication No. 2022-145467 discloses a light-emitting device in which light-emitting elements emitting red light, blue light, and green light are arranged on the mounting surface of a base component, and these light-emitting elements are electrically connected to the base component through multiple wirings.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: (Japan) Japanese Patent Application Publication No. 2022-145467 Summary of the Invention

[0006] This invention discloses a solution to the problem of achieving high-output light-emitting devices with excellent manufacturing stability.

[0007] Alternatively, instead of addressing the aforementioned issues, an invention that solves the problem of miniaturizing light-emitting devices may be disclosed.

[0008] Alternatively, instead of the above-mentioned issues, an invention that solves the problem of high output of light-emitting devices may be disclosed.

[0009] It should be noted that this specification also discloses an invention that addresses multiple issues among the aforementioned problems in a combined manner.

[0010] The disclosed light-emitting device includes: a plurality of light-emitting elements, comprising a first light-emitting element, a plurality of second light-emitting elements, and a plurality of third light-emitting elements, each having an anode electrode and a cathode electrode; a substrate having a first wiring portion, a second wiring portion, a third wiring portion, and a fourth wiring portion, and a mounting surface disposed between two of the first wiring portions, the second wiring portion, the third wiring portion, and the fourth wiring portion in a top view; and a plurality of wirings electrically connecting the plurality of light-emitting elements to the substrate. In a top view, the plurality of light-emitting elements are arranged on the mounting surface such that the first light-emitting element is located between the plurality of second light-emitting elements and the plurality of third light-emitting elements. The first wiring portion is electrically connected to the first light-emitting element on one of the two electrodes, the second wiring portion is electrically connected to the plurality of second light-emitting elements on one of the two electrodes, and the third wiring portion... The first light-emitting element is electrically connected to one of the two electrodes, and the second light-emitting element, the third light-emitting element, and the fourth wiring portion are electrically connected to the first light-emitting element, the second light-emitting element, and the third light-emitting element on the other electrode side of the two electrodes. A first current path is formed between the first wiring portion and the fourth wiring portion, through which the first light-emitting element passes and none of the second and third light-emitting elements passes. A second current path is formed between the second and fourth wiring portions, through which the second and third light-emitting elements pass and none of the first and third light-emitting elements passes. A third current path is formed between the third and fourth wiring portions, through which the third light-emitting elements pass and none of the first and second light-emitting elements passes.

[0011] The light-emitting module disclosed in the embodiment includes the above-described light-emitting device and a wiring board on which the light-emitting device is mounted.

[0012] In at least one of the inventions disclosed in the embodiments, it is possible to manufacture a high-output light-emitting device with excellent manufacturing stability. Attached Figure Description

[0013] Figure 1 This is a perspective view of the light-emitting device according to the first and second embodiments.

[0014] Figure 2 This is a top view of the light-emitting device according to the first and second embodiments.

[0015] Figure 3 yes Figure 2 Cross-sectional views of the light-emitting devices of the first and second embodiments at section line III-III.

[0016] Figure 4 This is a perspective view showing the internal structure of the package of the light-emitting device according to the first embodiment.

[0017] Figure 5 This is a top view showing the internal structure of the package of the light-emitting device according to the first embodiment.

[0018] Figure 6 This is a top view showing the wiring connection method in the light-emitting device of the first embodiment.

[0019] Figure 7 This is a top view of the package of the first and second embodiments.

[0020] Figure 8 yes Figure 7 Cross-sectional views of the first and second embodiments of the package at section line VIII-VIII.

[0021] Figure 9 Is with Figure 8 The cross-sectional view of the package corresponds to the cross-sectional view of the base.

[0022] Figure 10 This is a top view of the base of the first and second embodiments.

[0023] Figure 11 This is a bottom view of the base of the first and second embodiments.

[0024] Figure 12 This is a top view of the base with light-emitting elements and protective elements installed according to the first and second embodiments.

[0025] Figure 13 This is a side view showing the base on which the light-emitting element and the protective element are mounted, according to the first and second embodiments.

[0026] Figure 14A This is a top view of a light-emitting device that is used as a comparison object for the light-emitting devices of the first and second embodiments.

[0027] Figure 14B This is a top view of the wiring connection method in a light-emitting device that is used as a comparison object of the first and second embodiments of the light-emitting device.

[0028] Figure 15 This is a top view showing the wiring connection method in the light-emitting device of the second embodiment.

[0029] Figure 16 This is a perspective view of the light-emitting module according to the third embodiment.

[0030] Figure 17 This is a top view of the light-emitting module according to the third embodiment.

[0031] Figure 18 This is a top view of the wiring board according to the third embodiment.

[0032] Explanation of reference numerals in the attached figures

[0033] 1, 2: Light-emitting device

[0034] 10: Packaging

[0035] 11: Matrix

[0036] 11A: First upper surface

[0037] 11B: Lower surface

[0038] 11C: Second upper surface

[0039] 11D: Outer surface

[0040] 11E: Inner surface

[0041] 11F: Staircase

[0042] 11F1: First step

[0043] 11F2: Second Step

[0044] 11G: Upper surface

[0045] 11H: Side view

[0046] 11M: Base

[0047] 11N: Frame

[0048] 12A: Wiring section

[0049] 12A1: First wiring section

[0050] 12A2: Second wiring section

[0051] 12A3: Third Wiring Section

[0052] 12A4: Fourth Wiring Section

[0053] 14: Cover

[0054] 14A: Upper surface

[0055] 14B: Lower surface

[0056] 14C: Side view

[0057] 20: Light-emitting element

[0058] 20A: First light-emitting element

[0059] 20B: Second light-emitting element

[0060] 20C: Third light-emitting element

[0061] 21A: Upper surface

[0062] 21B: Lower surface

[0063] 21C: Side view

[0064] 22: Light exit surface

[0065] 30: Base

[0066] 30A: First base

[0067] 30B: Second base

[0068] 30C: Third base

[0069] 31A: Upper surface

[0070] 31B: Lower surface

[0071] 31C: Side view

[0072] 32A: Substrate

[0073] 32B: Upper metal component

[0074] 32C: Lower metal component

[0075] 33: Wiring layer

[0076] 40: Reflective component

[0077] 41A: Lower surface

[0078] 41B: Light reflecting surface

[0079] 50: Protective components

[0080] 51A: Upper surface

[0081] 51B: Lower surface

[0082] 51C: Side View

[0083] 60: Wiring

[0084] 60A: First wiring

[0085] 60B: Second wiring

[0086] 60C: Third wiring

[0087] 60D: Fourth wiring

[0088] 70: Optical components (lens components)

[0089] 71A: Upper surface

[0090] 71B: Lower surface

[0091] 71C: Side View

[0092] 71D: Lens surface (optical working surface)

[0093] 72A: Lens section

[0094] 72B: Non-lens section

[0095] 101: Wiring board

[0096] 101A: Upper surface

[0097] 101B: Lower surface

[0098] 101C: Side View

[0099] 101D: Heat dissipation unit

[0100] 101E: Electrode section

[0101] 101F: Insulation section

[0102] 101H: Through hole

[0103] 901: Light-emitting module Detailed Implementation

[0104] Within the scope of this specification or claims, polygons, including triangles, quadrilaterals, and other polygons, are all referred to as polygons, including shapes formed by rounding, chamfering, cutting, or rounding the corners of polygons. Furthermore, shapes formed by processing not only the corners (ends of sides) but also the middle portions of the sides are also called polygons. In other words, shapes that retain a polygonal shape on a base and undergo partial processing are included in the interpretation of "polygon" as described in this specification and claims.

[0105] Furthermore, this applies not only to polygons, but also to terms describing specific shapes such as trapezoids, circles, and concave / convex shapes. Moreover, the same applies when dealing with the sides that form the shape. That is, even if a side has been modified at its diagonal or in the middle, the interpretation of "side" includes the modified portion. It should be noted that when it is necessary to distinguish between an unmodified "polygon" or "side" and a modified shape, the phrase "strictly defined" should be added, for example, written as "a quadrilateral in the strict sense."

[0106] Furthermore, within the scope of this specification or the claims, descriptions such as up and down (above / below), left and right, inside and outside, front and back (front / rear), next to and inside are merely descriptions of relative positions, orientations, directions, etc., and may not necessarily correspond to the actual relationship in use.

[0107] Additionally, arrows are sometimes used in the accompanying drawings to indicate directions such as the X, Y, and Z directions. The directions of these arrows are integrated across multiple drawings of the same embodiment. Furthermore, in the drawings, the arrows labeled X, Y, and Z represent positive directions, and the opposite directions represent negative directions. For example, the arrowhead with the tip marked X represents the X direction, and is a positive direction. It should be noted that in this specification, the direction that is both X and positive is referred to as the "positive X direction," and the opposite direction is referred to as the "negative X direction." When referring to the "X direction," it includes both positive and negative directions. The same applies to the Y and Z directions.

[0108] Furthermore, in this specification, when an object is specifically described as "one or more," the description of a single object and the description of multiple objects are summarized separately. Therefore, by specifying it as "one or more," implementations having one or more objects, implementations having at least one object, and implementations having multiple objects are all supported.

[0109] Furthermore, in this specification, the description of "one or each" objects is a summary of the description of one object in an embodiment having one object, the description of one object in an embodiment having multiple objects, and the summary of the descriptions of multiple objects in an embodiment having multiple objects. Therefore, by describing "one or each" objects, it is possible to support the following scenarios: in an embodiment having one object, at least one of these objects has description content; in an embodiment having multiple objects, each of these multiple objects has description content; and in an embodiment having one or more objects, all objects have description content.

[0110] Furthermore, in this specification, for example when describing constituent elements, the term "component" or "part" may be used. "Component" refers to an object that is physically treated as a single unit. An object that is physically treated as a single unit can also be described as an object treated as a component in the manufacturing process. On the other hand, "part" refers to an object that does not necessarily need to be physically treated as a single unit. For example, "part" is used when partially capturing a part of a component, or when multiple components are grouped together into one object.

[0111] It should be noted that the distinction between "component" and "part" mentioned above does not imply an intention to limit the scope of the claims in the interpretation of equivalence theory. In other words, even if there are constituent elements described as "components" within the scope of the claims, this alone cannot lead to the conclusion that the applicant considers treating such constituent elements as physical entities essential to the application of the present invention.

[0112] Furthermore, in this specification or the scope of the claims, when multiple elements of a particular element exist and need to be described separately, terms such as "first" or "second" are sometimes added before the element for distinction. Additionally, the objects distinguished in this specification and the scope of the claims may differ. Therefore, even if an element with the same designation as that in this specification is described in the scope of the claims, the object that element refers to may not be the same in this specification and the scope of the claims.

[0113] For example, if this specification contains constituent elements distinguished by the designations "first," "second," and "third," and the scope of the claims includes constituent elements designated as "first" and "third" in this specification, for ease of reading, the scope of the claims may use "first" and "second" to distinguish the constituent elements. In this case, the constituent elements designated as "first" and "second" in the scope of the claims refer to the constituent elements designated as "first" and "third" in this specification, respectively. It should be noted that this rule is not limited to constituent elements and can be reasonably and flexibly applied to other objects as well.

[0114] The following describes a method for implementing the present invention. Furthermore, specific methods for implementing the present invention will be described with reference to the accompanying drawings. It should be noted that the methods for implementing the present invention are not limited to these specific methods. That is, the illustrated embodiments are not the only ways in which the present invention can be implemented. It should also be noted that the size and positional relationships of the components shown in the accompanying drawings may have been exaggerated for ease of understanding.

[0115] <First Implementation>

[0116] The light-emitting device 1 of the first embodiment will be described. Figures 1 to 13 The accompanying drawing illustrates an exemplary manner of the light-emitting device 1. Figure 1 This is a three-dimensional view of the light-emitting device 1. Figure 2 This is a top view of the light-emitting device 1. Figure 3 yes Figure 2 A cross-sectional view of the light-emitting device 1 at section line III-III. Figure 4 This is a perspective view showing the internal structure of the package of the light-emitting device 1. Figure 5This is a top view showing the internal structure of the package 10 of the light-emitting device 1. Figure 6 This is a top view showing the connection method of the wiring 60 in the light-emitting device 1. Figure 7 This is a top view of package 10. Figure 8 yes Figure 7 A cross-sectional view of package 10 at section line VIII-VIII. Figure 9 Is with Figure 8 The cross-sectional view of the package 10 corresponds to the cross-sectional view of the base 11. Figure 10 This is a top view of base 11. Figure 11 This is a bottom view of base 11. Figure 12 This is a top view showing the base 30 on which the light-emitting element 20 and the protective element 50 are installed. Figure 13 This is a side view of the base 30 on which the light-emitting element 20 and the protective element 50 are mounted.

[0117] The light-emitting device 1 comprises multiple components. These multiple components include a package 10, multiple light-emitting elements 20, one or more bases 30, one or more reflective components 40, one or more protective components 50, multiple wirings 60, and optical components 70.

[0118] It should be noted that the light-emitting device 1 may also include other constituent elements. For example, in addition to one or more light-emitting elements 20, the light-emitting device 1 may further include light-emitting elements. Alternatively, the light-emitting device 1 may not include some of the constituent elements listed herein.

[0119] First, let’s explain each of the constituent elements.

[0120] (Package 10)

[0121] Package 10 includes a base 11 and a cover 14. The cover 14 is joined to the base 11 to form package 10. An internal space is defined within package 10 for configuring other constituent elements. This internal space is a closed space surrounded by the base 11 and the cover 14. Furthermore, this internal space can be a space sealed under vacuum or hermetic conditions.

[0122] Viewed from above, the outer edge of package 10 is rectangular. This rectangle can be a rectangle with a long side and a short side. In the illustrated package 10, the long side of the rectangle is in the same direction as the X-direction, and the short side is in the same direction as the Y-direction. It should be noted that the outer edge shape of package 10 may not be rectangular when viewed from above.

[0123] Within package 10, an internal space is formed for configuring other constituent elements. The first upper surface 11A of package 10 is part of the area defining the internal space. Furthermore, the various inner surfaces 11E and the lower surface 14B of package 10 are also part of the area defining the internal space.

[0124] The substrate 11 has a first upper surface 11A and a lower surface 11B. The substrate 11 has a second upper surface 11C. The substrate 11 has one or more outer surfaces 11D. The substrate 11 has one or more inner surfaces 11E. One or more outer surfaces 11D intersect with the second upper surface 11C. One or more outer surfaces 11D intersect with the lower surface 11B. One or more inner surfaces 11E intersect with the second upper surface 11C.

[0125] Viewed from above, the outer edge of the substrate 11 is rectangular. Viewed from above, the outer edge of the substrate 11 is the same as the outer edge of the package 10. Viewed from above, the outer edge of the first upper surface 11A is rectangular. This rectangle can be a rectangle with a long side and a short side. The direction of the long side of the first upper surface 11A is parallel to the direction of the long side of the outer edge of the substrate 11. It should be noted that, viewed from above, the outer edge of the first upper surface 11A may not be rectangular.

[0126] Viewed from above, the first upper surface 11A is surrounded by the second upper surface 11C. The second upper surface 11C is an annular surface that surrounds the first upper surface 11A when viewed from above. The second upper surface 11C is a rectangular annular surface. Here, the frame defined by the inner edge of the second upper surface 11C is referred to as the inner frame of the second upper surface 11C, and the frame defined by the outer edge of the second upper surface 11C is referred to as the outer frame of the second upper surface 11C.

[0127] The substrate 11 has a recess surrounded by a frame formed by a second upper surface 11C. The recess defines a portion in the substrate 11 that is recessed downwards from the second upper surface 11C. A first upper surface 11A is part of the recess. One or more inner side surfaces 11E are part of the recess. The second upper surface 11C is located above the first upper surface 11A.

[0128] The base 11 has one or more stepped portions 11F. Each stepped portion 11F has an upper surface 11G and a side surface 11H that intersects with and extends downward from the upper surface 11G. Here, a stepped portion 11F has only one upper surface 11G and one side surface 11H. The upper surface 11G intersects with the inner side surface 11E. The side surface 11H intersects with the first upper surface 11A.

[0129] One or more step portions 11F, viewed from above, are located inside the inner frame of the second upper surface 11C. One or more step portions 11F, viewed from above, are formed along part or all of the inner side surface 11E. In the base 11, the side surface 11H is the inner side surface, but the side surface 11H and the inner side surface 11E are different surfaces. One or more inner side surfaces 11E and one or more side surfaces 11H are perpendicular to the first upper surface 11A. This perpendicularity is allowed to have a deviation of ±3 degrees.

[0130] One or more stepped portions 11F may include a first stepped portion 11F1 and a second stepped portion 11F2. The first stepped portion 11F1 and the second stepped portion 11F2 are disposed at opposite positions on their respective side surfaces 11H. The first stepped portion 11F1 and the second stepped portion 11F2 are disposed on the short side side of the inner frame of the second upper surface 11C.

[0131] The base 11 has a base portion 11M and a frame portion 11N. The base portion 11M and the frame portion 11N can be components made of different materials. The base 11 can be constructed by including a base component corresponding to the base portion 11M and a frame component corresponding to the frame portion 11N.

[0132] The base 11M includes a first upper surface 11A. The frame portion 11N includes a second upper surface 11C. The frame portion 11N includes one or more outer side surfaces 11D and one or more inner side surfaces 11E. The frame portion 11N includes one or more stepped portions 11F.

[0133] The lower surface of the base 11M constitutes part or all of the lower surface 11B of the base 11. When the lower surface of the base 11M constitutes part of the lower surface 11B of the base 11, the lower surface of the frame 11N constitutes the remaining area of ​​the lower surface 11B of the base.

[0134] The substrate 11 has a plurality of wiring portions 12A. The plurality of wiring portions 12A include one or more wiring portions 12A (inner wiring portions) disposed in the internal space of the package 10 and one or more wiring portions 12A (outer wiring portions) disposed on the outer surface of the package 10.

[0135] One or more inner wiring portions are provided on the upper surface 11G of the stepped portion 11F. The base 11 has one or more inner wiring portions provided on the upper surface 11G of the first stepped portion 11F1. The base 11 has one or more inner wiring portions provided on the upper surface 11G of the second stepped portion 11F2.

[0136] The plurality of wiring sections 12A include a first wiring section 12A1, a second wiring section 12A2, a third wiring section 12A3, and a fourth wiring section 12A4. The first wiring section 12A1, the second wiring section 12A2, the third wiring section 12A3, and the fourth wiring section 12A4 are all inner wiring sections. The first wiring section 12A1, the second wiring section 12A2, the third wiring section 12A3, and the fourth wiring section 12A4 are all disposed on the upper surface 11G of one or more stepped sections 11F.

[0137] The first wiring section 12A1 and the second wiring section 12A2 are arranged in one direction. The first wiring section 12A1 and the second wiring section 12A2 are provided on the upper surface 11G of the first step section 11F1. In the illustrated light-emitting device 1, the first wiring section 12A1 and the second wiring section 12A2 are arranged in the same direction as the Y direction.

[0138] The third wiring section 12A3 and the fourth wiring section 12A4 are arranged in one direction. The third wiring section 12A3 and the fourth wiring section 12A4 are provided on the upper surface 11G of the second step section 11F2. In the illustrated light-emitting device 1, the third wiring section 12A3 and the fourth wiring section 12A4 are arranged in the same direction as the Y direction.

[0139] From a top view, the first upper surface 11A is positioned between the first stepped portion 11F1 and the second stepped portion 11F2. From a top view, it can be said that the first upper surface 11A is positioned between two of the following wiring portions 12A: the first wiring portion 12A1, the second wiring portion 12A2, the third wiring portion 12A3, and the fourth wiring portion 12A4. Alternatively, it can be said that the first upper surface 11A is positioned between the first wiring portions 12A1 and the second wiring portions 12A2 arranged in one direction, and between the third wiring portions 12A3 and the fourth wiring portions 12A4 arranged in one direction.

[0140] One or more external wiring portions are provided on the lower surface 11B of the package 10. One or more external wiring portions are provided on the lower surface of the frame portion 11N. It should be noted that the external wiring portions may also be provided on an outer surface different from the lower surface 11B of the package 10.

[0141] In the substrate 11, one or more inner wiring sections are electrically connected to outer wiring sections. One or more inner wiring sections are electrically connected to outer wiring sections that are different from each other.

[0142] The substrate 11 can be formed using ceramic as the main material, for example. Examples of ceramics that can be used as the main material of the substrate 11 include aluminum nitride, silicon nitride, aluminum oxide, or silicon carbide.

[0143] Here, the main material refers to the material that accounts for the largest proportion of mass or volume in the target formed object. It should be noted that when the target formed object is formed from a single material, that material is the main material. That is to say, a material being the main material includes situations where the proportion of that material can reach 100%.

[0144] The substrate 11 can also be formed using base components and frame components made of different main materials. For example, the base component can be formed using a metal or a metal-containing composite, graphite, diamond, or other materials with excellent heat dissipation as the main material. Examples of metals used as the main material for the base component include copper, aluminum, or iron. Examples of metal-containing composites used as the main material for the base component include copper-molybdenum or copper-tungsten. For example, the frame component can be formed using ceramics, as listed above as the main material for the substrate 11, as the main material.

[0145] The wiring section 12A can be formed using a metallic material as the main material, for example. Examples of metallic materials used as the main material for the wiring section 12A include elemental metals such as Cu, Ag, Ni, Au, Ti, Pt, Pd, Cr, and W, or alloys containing these metals. For example, the wiring section 12A can be composed of one or more metal layers.

[0146] The cover 14 has an upper surface 14A and a lower surface 14B. Furthermore, the cover 14 has one or more side surfaces 14C. The cover 14 is constructed in the shape of a rectangular parallelepiped. It should be noted that the shape of the cover 14 may not be rectangular parallelepiped.

[0147] The cover 14 is bonded to the base 11. The lower surface 14B of the cover 14 is bonded to the second upper surface 11C of the base 11. The cover 14 is bonded to the base 11 via an adhesive.

[0148] The cover 14 is translucent, allowing light to pass through. Translucentness here refers to a transmittance of 80% or more relative to the light incident on the cover 14. It should be noted that the cover 14 may also have partially opaque areas (areas that do not transmit light).

[0149] For example, the cover 14 can be formed using glass as the main material. Alternatively, the cover 14 can also be formed using sapphire as the main material.

[0150] (Light-emitting element 20)

[0151] The light-emitting element 20 has an upper surface 21A, a lower surface 21B, and multiple side surfaces 21C. The upper surface 21A is rectangular in shape. Furthermore, this rectangle has a long side and a short side. The light-emitting element 20 appears rectangular when viewed from above. It should be noted that the shape of the upper surface 21A and the shape of the light-emitting element 20 when viewed from above are not limited to these.

[0152] The light-emitting element 20 has a light-emitting surface 22. For example, a side surface 21C can serve as the light-emitting surface 22. The side surface 21C that serves as the light-emitting surface 22 intersects with the short side of the upper surface 21A. Alternatively, for example, the upper surface 21A can serve as the light-emitting surface 22. The light-emitting element 20 has one or more light-emitting surfaces 22.

[0153] The light-emitting element 20 has two electrodes: an anode electrode and a cathode electrode. For example, the two electrodes can be disposed on two surfaces in opposite positions. For instance, one electrode can be disposed on the upper surface 21A, and the other on the lower surface 21B. It should be noted that the two electrodes can also be disposed on a single surface.

[0154] For example, the light-emitting element 20 can be a light-emitting element that emits blue light. Alternatively, for example, the light-emitting element 20 can be a light-emitting element that emits green light. Additionally, for example, the light-emitting element 20 can be a light-emitting element that emits red light. It should be noted that the light-emitting element 20 can also be a light-emitting element that emits light of other colors or wavelengths.

[0155] Here, blue light refers to light with a peak emission wavelength in the range of 420nm to 494nm. Green light refers to light with a peak emission wavelength in the range of 495nm to 570nm. Red light refers to light with a peak emission wavelength in the range of 605nm to 750nm.

[0156] Light-emitting element 20 that emits blue light or green light can include light-emitting elements comprising nitride semiconductors. Examples of GaN-based semiconductors include GaN, InGaN, and AlGaN. Light-emitting element 20 that emits red light can include light-emitting elements comprising InAlGaP, GaInP, and GaAs-based semiconductors such as GaAs and AlGaAs.

[0157] For example, the light-emitting element 20 can be a semiconductor laser element. Furthermore, the light-emitting element 20 can be a single-emitter semiconductor laser element with one emitter. Alternatively, the light-emitting element 20 can be a multi-emitter semiconductor laser element with multiple emitters. It should be noted that the light-emitting element 20 is not limited to a semiconductor laser element; it can also be a light-emitting diode, etc.

[0158] Here, a semiconductor laser element, which is one example of a light-emitting element 20, will be described.

[0159] A semiconductor laser element emits directional laser light. Divergent light is emitted from the light-emitting surface 22 of the semiconductor laser element. The light emitted from the semiconductor laser element forms an elliptical far-field pattern (hereinafter referred to as "FFP") on a surface parallel to the light-emitting surface 22. FFP refers to the shape and intensity distribution of the emitted light at a position far from the light-emitting surface of the semiconductor laser element.

[0160] Here, light passing through the center of the FFP ellipse, in other words, light with peak intensity in the FFP's intensity distribution, is referred to as light propagating along the optical axis, or light crossing the optical axis. Furthermore, in the FFP's intensity distribution, light with an intensity greater than 1 / e² of the peak intensity value is referred to as the principal component of the light.

[0161] The FFP shape of the light emitted from the semiconductor laser element, on the plane parallel to the light exit surface 22, is an ellipse with the stacking direction longer than the direction perpendicular to the stacking direction. The stacking direction refers to the direction in which the multiple semiconductor layers containing the active layer are stacked within the semiconductor laser element. The direction perpendicular to the stacking direction can also be considered the planar direction of the semiconductor layer. Furthermore, the major axis of the FFP ellipse shape can be called the fast axis direction of the semiconductor laser element, and the minor axis direction can be called the slow axis direction.

[0162] Based on the light intensity distribution of the FFP (Fiber-Factor-Pack), the diffusion angle of light with an intensity of 1 / e² of the peak light intensity is used as the light diffusion angle of the semiconductor laser element. Here, the light diffusion angle is expressed as the angle between the light with the peak light intensity (the light passing through the optical axis) and the light with an intensity of 1 / e² of the peak light intensity. It should be noted that the light diffusion angle can be obtained not only from the light intensity of 1 / e² of the peak light intensity, but also, for example, from the light intensity of half the peak light intensity. In this specification, when "light diffusion angle" is mentioned only, it refers to the light diffusion angle when the light intensity is 1 / e² of the peak light intensity.

[0163] The spread angle of light emitted from a semiconductor laser element along the fast axis can be greater than 15 degrees and less than 40 degrees. Furthermore, the spread angle along the slow axis can exceed 0 degrees and be less than 10 degrees. Moreover, the spread angle along the fast axis is larger than the spread angle along the slow axis.

[0164] For example, blue light emitted from a semiconductor laser element can have a spread angle of 15 degrees or more and less than 30 degrees along the fast axis, and a spread angle of 0 degrees or more and less than 10 degrees along the slow axis. Similarly, green light emitted from a semiconductor laser element can have a spread angle of 15 degrees or more and less than 30 degrees along the fast axis, and a spread angle of 0 degrees or more and less than 10 degrees along the slow axis. Furthermore, red light emitted from a semiconductor laser element can have a spread angle of 20 degrees or more and less than 40 degrees along the fast axis, and a spread angle of 0 degrees or more and less than 10 degrees along the slow axis.

[0165] (Base 30)

[0166] The base 30 has an upper surface 31A, a lower surface 31B, and one or more side surfaces 31C. The upper surface 31A can be considered a mounting surface for other components. The upper surface 31A is rectangular in shape. This rectangle of the upper surface 31A may have a short side and a long side. It should be noted that the shape of the upper surface 31A may not be rectangular.

[0167] The base 30, viewed from above, is rectangular in shape. This rectangle may have a short side and a long side. It should be noted that the base 30 may not be rectangular in shape when viewed from above. When viewed from above, the base 30 may have a shape in which the length of one direction (hereinafter referred to as the short side direction of the base 30) is shorter than the length of the direction perpendicular to it (hereinafter referred to as the long side direction of the base 30). In the illustrated base 30, the short side direction is the same as the X-direction, and the long side direction is the same as the Y-direction.

[0168] The base 30 may be constructed by having a substrate 32A and an upper metal component 32B. Furthermore, the base 30 may also be constructed by having a lower metal component 32C. The upper metal component 32B is disposed on the upper surface side of the substrate 32A. The lower metal component 32C is disposed on the lower surface side of the substrate 32A. The base 30 also has a wiring layer 33. The wiring layer 33 is disposed above the upper metal component 32B.

[0169] The substrate 32A is insulating. For example, the substrate 32A is formed of silicon nitride, aluminum nitride, or silicon carbide. The main material of the substrate 32A should preferably be a ceramic with good heat dissipation (high thermal conductivity).

[0170] The upper metal component 32B is primarily made of metals such as copper or aluminum. The upper metal component 32B has one or more metal layers. The upper metal component 32B may have multiple metal layers with different metals as the main material.

[0171] The lower metal component 32C is primarily made of metals such as copper or aluminum. The lower metal component 32C has one or more metal layers. The lower metal component 32C may have multiple metal layers with different metals as the primary material.

[0172] The wiring layer 33 can be formed using metal. For example, AuSn solder (AuSn metal layer) can be used to form the wiring layer 33.

[0173] For example, the length of the base 30 in the short side direction or the short axis direction is 500 μm or more and 1000 μm or less. Furthermore, the length of the base 30 in the long side direction or the long axis direction is 1500 μm or more and 2500 μm or less. Additionally, the difference between the length in the long axis direction and the length in the short axis direction of the base 30 is 500 μm or more and 1000 μm or less.

[0174] For example, the thickness of the base 30 (its width in the direction perpendicular to the upper surface 31A) is 200 μm or more and 400 μm or less. Additionally, for example, the thickness of the substrate 32A is 100 μm or more and 300 μm or less. Furthermore, for example, the thickness of the upper metal component 32B is 30 μm or more and 100 μm or less. Also, for example, the thickness of the lower metal component 32C is 30 μm or more and 100 μm or less. And, for example, the thickness of the wiring layer 33 is 1 μm or more and 10 μm or less.

[0175] (Reflective component 40)

[0176] The reflecting component 40 has a lower surface 41A and a light-reflecting surface 41B. Furthermore, the light-reflecting surface 41B is inclined relative to the lower surface 41A. The straight line connecting the lower and upper ends of the light-reflecting surface 41B is inclined relative to the lower surface 41A. The angle at which the light-reflecting surface 41B is inclined relative to the lower surface 41A is called the tilt angle of the light-reflecting surface 41B.

[0177] The light reflecting surface 41B is a plane. It should be noted that the light reflecting surface 41B can also be a curved surface. The tilt angle of the light reflecting surface 41B is 45 degrees. It should be noted that the tilt angle of the light reflecting surface 41B can also be other than 45 degrees.

[0178] The main material of the reflective component 40 can be glass, metal, etc. It is preferable to use a heat-resistant material as the main material. For example, quartz or BK7 (borosilicate glass) glass, or metals such as Al can be used as the main material. The reflective component 40 can also be formed using Si as the main material.

[0179] If the main material is a reflective material such as Al, the light-reflecting surface 41B can be formed from the main material. Alternatively, instead of forming the light-reflecting surface 41B from the main material, the main material can be used to form the approximate shape of the reflective component 40, and the light-reflecting surface 41B can be formed on the surface of that approximate shape. In this case, the light-reflecting surface 41B can be formed, for example, using a metal layer such as Ag or Al, or a dielectric multilayer film such as Ta2O5 / SiO2, TiO2 / SiO2, or Nb2O5 / SiO2.

[0180] The light-reflecting surface 41B has a reflectivity of 90% or more for the peak wavelength of light incident on it. Alternatively, the reflectivity may be 95% or more. Furthermore, the reflectivity may be 99% or more. A reflectivity of 100% or less is also acceptable.

[0181] (Protective Component 50)

[0182] The protective element 50 has an upper surface 51A, a lower surface 51B, and one or more side surfaces 51C. The protective element 50 is rectangular in shape. It should be noted that the protective element 50 may not be rectangular in shape.

[0183] The protection element 50 is designed to prevent damage to specific components (such as semiconductor laser components) due to excessive current flow. A Zener diode is an example of a protection element 50. Alternatively, a diode formed of silicon can be used as the Zener diode.

[0184] (Wiring 60)

[0185] Wiring 60 is a linear conductive material with joints at both ends. These joints form the connection points with other components. Wiring 60 is used for electrical connection between two components. Wiring 60 is, for example, a metal wire. Examples of metals that can be used include gold, aluminum, silver, and copper.

[0186] (Optical component 70)

[0187] The optical component 70 has an upper surface 71A, a lower surface 71B, and one or more side surfaces 71C.

[0188] The optical component 70 applies optical effects to light incident upon it. The optical effects applied by the optical component 70 to the light include, for example, focusing, collimation, diffusion, polarization, diffraction, wave combining, light guiding, reflection, and wavelength conversion.

[0189] The optical component 70 has an optical surface for applying optical action. The upper surface 71A, the lower surface 71B, or the side surface 71C may serve as the optical surface. Alternatively, the optical surface may be located at a different position than the upper surface 71A, the lower surface 71B, and the side surface 71C. For example, the optical surface may also be formed inside the optical component 70 rather than on its surface.

[0190] Optical component 70 may have one or more lens surfaces 71D. Lens surface 71D is the optical working surface of optical component 70. It should be noted that optical component 70 with lens surface 71D can also be called a lens component. Light transmitted through lens surface 71D and emitted from optical component 70 is subjected to focusing, diffusion, or collimation optical effects by optical component 70. For example, optical component 70 is a collimating lens that converts light incident into collimated light and emits it.

[0191] One or more lens surfaces 71D are disposed on the upper surface 71A side. It should be noted that lens surfaces 71D can also be disposed on the lower surface 71B side. The upper surface 71A and the lower surface 71B are planar. One or more lens surfaces 71D intersect with the upper surface 71A. When viewed from above, one or more lens surfaces 71D are surrounded by the upper surface 71A.

[0192] Viewed from above, the optical component 70 has a rectangular shape. It should be noted that the shape of the optical component 70 may not be rectangular when viewed from above. The lower surface 71B is flat. No lens surface 71D is formed on the lower surface 71B side of the optical component 70. The lower surface 71B has a rectangular shape. It should be noted that the shape of the lower surface 71B may not be rectangular.

[0193] In the optical component 70, the portion overlapping with the lens surface 71D when viewed from above is designated as the lens portion 72A. In the optical component 70, the portion overlapping with the upper surface 71A when viewed from above is designated as the non-lens portion 72B. The lower surface 71B has a region constituting the lower surface of one or more lens portions 72A and a region constituting the lower surface of the non-lens portion 72B.

[0194] The optical component 70 may have a plurality of lens surfaces 71D continuously formed in one direction. When viewed from above, the direction in which the plurality of lens surfaces 71D are arranged is called the lens connection direction. In the illustrated optical component 70, the connection direction is the same as the X-direction.

[0195] Multiple lens surfaces 71D are formed with their vertices aligned on a straight line. This imaginary straight line connecting the vertices is parallel to the lower surface 71B of the optical component 70. It should be noted that this parallelism includes a deviation within ±5 degrees.

[0196] The curvature of some or all of the multiple lens surfaces 71D, and more than two lens surfaces 71D, can be the same. The curvature of the multiple lens surfaces 71D can all be the same.

[0197] The optical component 70 is transparent. The transmittance of the optical component 70 to the peak wavelength of light incident upon it is 80% or more. The optical component 70 may have transparent areas and non-transparent areas (hereinafter referred to as opaque areas). In the opaque areas, the transmittance of light incident upon the optical component 70 relative to the peak wavelength is 50% or less. The optical component 70 may be formed using, for example, glass such as BK7.

[0198] Next, the light-emitting device 1 will be described.

[0199] (Light-emitting device 1)

[0200] In the light-emitting device 1, a plurality of light-emitting elements 20 are disposed within the internal space of the package 10. The plurality of light-emitting elements 20 are disposed on the substrate 11. The plurality of light-emitting elements 20 are disposed on a first upper surface 11A. It can be said that the first upper surface 11A is a mounting surface on which the plurality of light-emitting elements 20 are disposed.

[0201] The plurality of light-emitting elements 20 includes a first light-emitting element 20A, a plurality of second light-emitting elements 20B, and a plurality of third light-emitting elements 20C. All light-emitting elements mounted on the light-emitting device 1 may be composed of a first light-emitting element 20A, a plurality of second light-emitting elements 20B, and a plurality of third light-emitting elements 20C. Alternatively, all light-emitting elements mounted on the light-emitting device 1 may be composed of a first light-emitting element 20A, two second light-emitting elements 20B, and two third light-emitting elements 20C.

[0202] The first light-emitting element 20A, the second light-emitting element 20B, and the third light-emitting element 20C emit light with different peak wavelengths. They also emit light of different colors from red, green, and blue. In the example of the illustrated light-emitting device 1, the first light-emitting element 20A emits blue light, the second light-emitting element 20B emits green light, and the third light-emitting element 20C emits red light.

[0203] By using a light-emitting device 1 equipped with multiple light-emitting elements 20 that emit red, green, and blue light, an RGB light source can be realized without the use of phosphor excitation technology. It should be noted that the disclosure of this application does not preclude the use of phosphor excitation technology.

[0204] At the time of this application, among the semiconductor laser elements that serve as light-emitting elements 20, the semiconductor laser element that emits blue light has the highest light output efficiency. When using RGB light sources in image displays such as projectors, it is more ideal to increase the output of each of the RGB colors, rather than simply increasing the output of a single color.

[0205] For example, when an additional semiconductor laser element is added to a light-emitting device consisting of four semiconductor laser elements (one blue laser element, one green laser element, and two red laser elements), the light-emitting device consisting of five semiconductor laser elements (one blue laser element, one green laser element, and three red laser elements) can sometimes achieve higher performance (e.g., higher luminous flux [lm]) as a projector compared to a device consisting of five semiconductor laser elements (one blue laser element, one green laser element, and three red laser elements).

[0206] In the light-emitting device 1, among the multiple light-emitting elements 20 mounted thereon, the number of second light-emitting elements 20B is greater than the number of first light-emitting elements 20A. Furthermore, the number of third light-emitting elements 20C is greater than the number of first light-emitting elements 20A. By configuring multiple light-emitting elements 20 in this way, for example, the overall light output of the light-emitting device 1, which is used as an RGB light source, is improved. In other words, a high-output light-emitting device 1 is substantially achieved.

[0207] From a top-down view, multiple light-emitting elements 20 are arranged in a first direction. This top-down view can also be described as a planar view of the mounting surface from a direction perpendicular to it. In the illustrated light-emitting device 1, the first direction is the same as the X-direction. Multiple light-emitting elements 20 are arranged between a first wiring segment 12A1 and a second wiring segment 12A2 arranged along one direction, and a third wiring segment 12A3 and a fourth wiring segment 12A4 arranged along the same direction.

[0208] Viewed from above, the multiple light-emitting elements 20 are arranged such that a first light-emitting element 20A is located between multiple second light-emitting elements 20B and multiple third light-emitting elements 20C. This allows for the manufacture of a light-emitting device 1 with excellent stability, as will be described in detail later. Of the first light-emitting element 20A and the multiple second light-emitting elements 20B, the multiple second light-emitting elements 20B are closer to the first wiring section 12A1. Of the first light-emitting element 20A and the multiple third light-emitting elements 20C, the multiple third light-emitting elements 20C are closer to the fourth wiring section 12A4.

[0209] Multiple light-emitting elements 20 emit light in a second direction. This second direction is perpendicular to the first direction. Furthermore, the second direction is parallel to the first upper surface 11A. In the illustrated light-emitting device 1, the second direction is the same as the positive Y direction. When the light-emitting element 20 is a semiconductor laser element, the multiple light-emitting elements 20 emit FFP light from the light-emitting surface 22, with the first direction as the slow axis and the direction perpendicular to the first upper surface 11A as the fast axis.

[0210] Multiple light-emitting elements 20 are disposed on one or more bases 30. The multiple light-emitting elements 20 are respectively disposed on different bases 30. The one or more bases 30 may consist of a first base 30A disposed on a first light-emitting element 20A, multiple second bases 30B respectively disposed on second light-emitting elements 20B, and third bases 30C respectively disposed on third light-emitting elements 20C. By disposing the light-emitting elements 20 on the base 11 via the bases 30, the height of the light-emitting elements 20 can be adjusted.

[0211] In the first direction, the distance from the first base 30A to the third base 30C, which is located adjacent to the first base 30A, is greater than the distance from the first base 30A to the second base 30B, which is located adjacent to the first base 30A. Furthermore, the second light-emitting element 20B, which is a semiconductor laser element, exhibits superior temperature characteristics at 45°C compared to the third light-emitting element 20C, which is also a semiconductor laser element. This configuration of the bases 30 contributes to achieving substantially high output in the light-emitting device 1. It should be noted that 45°C is a temperature within the typical operating temperature range of the light-emitting device 1.

[0212] The width of the third light-emitting element 20C in the first direction is larger than the width of the first light-emitting element 20A in the first direction. Furthermore, the difference between the width of the first base 30A and the width of the third base 30C in the first direction is smaller than the difference between the width of the first light-emitting element 20A and the width of the third light-emitting element 20C in the first direction. Moreover, when viewed from above, the width of the third base 30C is larger than the width of the first base 30A in the direction perpendicular to the first direction. Therefore, by increasing the number of light-emitting elements 20 arranged in the first direction, and by extending the relatively narrow third base 30C in the direction perpendicular to the first direction, heat dissipation balance can be achieved, contributing to high output from the light-emitting device 1.

[0213] In the light-emitting device 1, the plurality of light-emitting elements 20 include two light-emitting elements 20 with different widths in a first direction. In the illustrated light-emitting device 1, the first light-emitting element 20A and the third light-emitting element 20C have different widths in the first direction.

[0214] The width of the first light-emitting element 20A in the first direction is smaller than the width of the third light-emitting element 20C in the first direction. The width of the third light-emitting element 20C in the first direction is 50 μm or more, or 100 μm or more, larger than the width of the first light-emitting element 20C in the first direction. The width of the third light-emitting element 20C in the first direction can be more than 1.5 times the width of the first light-emitting element 20C in the first direction.

[0215] The difference between the width of the first base 30A and the width of the first light-emitting element 20A in the first direction is greater than the difference between the width of the third base 30C and the width of the third light-emitting element 20C in the first direction. For the third light-emitting element 20C, whose width in the first direction is larger than that of the first light-emitting element 20A, by reducing the blank space of the base 30 in the first direction, the number of light-emitting elements 20 arranged in the first direction can be increased, which helps to increase the output of the light-emitting device 1.

[0216] In the light-emitting device 1, the first light-emitting element 20A can be a single-emitter semiconductor laser element, and the third light-emitting element 20C can be a multi-emitter semiconductor laser element. The difference in the number of emitters may affect the difference in the width of the light-emitting element 20 in the first direction. The third light-emitting element 20C can be a multi-emitter semiconductor laser element composed of two emitters. The second light-emitting element 20B can be a single-emitter semiconductor laser element.

[0217] Multiple wirings 60 electrically connect multiple light-emitting elements 20 to the substrate 11. Multiple wirings 60 are connected to the light-emitting elements 20, the base 30, or the substrate 11, thereby electrically connecting the multiple light-emitting elements 20 to the substrate 11.

[0218] A first current path for current to flow to the first light-emitting element 20A is formed by multiple wirings 60. Furthermore, a second current path for current to flow to the second light-emitting element 20B is also formed by the multiple wirings 60. Additionally, a third current path for current to flow to the third light-emitting element 20C is also formed by the multiple wirings 60.

[0219] The first current path is a current path through which the first light-emitting element 20A passes and through which none of the multiple second light-emitting elements 20B and multiple third light-emitting elements 20C pass. Here, "light-emitting element passes through current path" means that when current flows in the current path, there is current flowing in the light-emitting element and it is driven; "light-emitting element does not pass through current path" means that even if current flows in the current path, there is no current flowing in the light-emitting element and it is not driven.

[0220] The second current path is a current path through which multiple second light-emitting elements 20B pass, but none of the first light-emitting element 20A and multiple third light-emitting elements 20C pass. The third current path is a current path through which multiple third light-emitting elements 20C pass, but none of the first light-emitting element 20A and multiple second light-emitting elements 20B pass. By forming the first current path, the second current path, and the third current path, the first light-emitting element 20A, the multiple second light-emitting elements 20B, and the multiple third light-emitting elements 20C can be driven independently.

[0221] The first light-emitting element 20A, the second light-emitting element 20B, and the third light-emitting element 20C are electrically connected to a common wiring section 12A for one of the two electrodes. Thus, the first light-emitting element 20A, the second light-emitting element 20B, and the third light-emitting element 20C can be driven independently through the four wiring sections 12A.

[0222] In the light-emitting device 1, the first wiring portion 12A1 is electrically connected to one of the two electrodes of the first light-emitting element 20A. Furthermore, the fourth wiring portion 12A4 is electrically connected to the other electrode of the first light-emitting element 20A. Here, "electrically connected to one / the other electrode" means that, in the current path, one / the other electrode is closer than the other / one electrode.

[0223] In the light-emitting device 1, the second wiring section 12A2 is electrically connected to one of the two electrodes of the second light-emitting element 20B on one electrode side. Furthermore, the fourth wiring section 12A4 is electrically connected to the other electrode of the two electrodes of the second light-emitting element 20B on the other electrode side.

[0224] In the light-emitting device 1, the third wiring section 12A3 is electrically connected to one of the two electrodes of the third light-emitting element 20C on one electrode side. Furthermore, the fourth wiring section 1A4 is electrically connected to the other electrode of the three electrodes of the third light-emitting element 20C on the other electrode side.

[0225] A first current path is formed between the first wiring section 12A1 and the fourth wiring section 12A4. A second current path is formed between the second wiring section 12A2 and the fourth wiring section 12A4. A third current path is formed between the third wiring section 12A3 and the fourth wiring section 12A4. The fourth wiring section 12A4 is a common wiring section 12A that is electrically connected to another electrode of the first light-emitting element 20A, the second light-emitting element 20B, and the third light-emitting element 20C.

[0226] The multiple wiring 60 includes a first wiring 60A that is connected to the first wiring section 12A1. The multiple wiring 60 includes a second wiring 60B that is connected to the second wiring section 12A2. The multiple wiring 60 includes a third wiring 60C that is connected to the third wiring section 12A3. The multiple wiring 60 includes a fourth wiring 60D that is connected to the fourth wiring section 12A4.

[0227] The first wiring 60A is connected to the first light-emitting element 20A or the first base 30A. The second wiring 60B is connected to the second light-emitting element 20B or the second base 30B. The third wiring 60C is connected to the third light-emitting element 20C or the third base 30C. The fourth wiring 60D is connected to the base 30.

[0228] In the light-emitting device 1, the first base 30A is closer to the fourth wiring portion 12A4 than the second base 30B, and the third base 30C is closer to the fourth wiring portion 12A4 than the first base 30A. The fourth wiring 60D is connected to either the adjacent first base 30A or the third base 30C.

[0229] In the light-emitting device 1, the width difference between the first base 30A and the first light-emitting element 20A in the second direction is 200 μm or more. The width difference between the third base 30C and the third light-emitting element 20C in the second direction is 300 μm or more. The width difference between the second base 30B and the second light-emitting element 20B in the second direction is less than 100 μm.

[0230] The multiple wirings 60 include wirings 60 that engage with the fourth wiring section 12A4 and the third base 30C, and wirings 60 that engage with the third base 30C and the first base 30A. These wirings 60 engage with the base 30 at positions on the side 21C opposite to the light emitting surface 22 of the light-emitting element 20 disposed on the base 30, in a second direction opposite to the second direction. By selecting the first base 30A and the third base 30C, it is easy to ensure excellent installation stability of the wirings 60 in the area on the base 30 used for such engagement.

[0231] The wiring 60 that connects to the fourth wiring section 12A4 and the third base 30C does not connect to the third base 30C located closest to the fourth wiring section 12A4. That is, its other end connects to all third bases 30C except the one located closest to the fourth wiring section 12A4. This reduces the number of wiring 60s used.

[0232] On the first base 30A, in a first direction, areas for bonding wiring 60 are defined on both sides of the first light-emitting element 20A. Within these two areas, in the area defined closer to the second light-emitting element 20B than the first light-emitting element 20A, wiring 60 is bonded to the second base 30B, which is positioned adjacent to the first base 30A. Furthermore, within these two areas, in the area defined closer to the third light-emitting element 20C than the first light-emitting element 20A, wiring 60 is bonded to the third base 30C, which is positioned adjacent to the first base 30A. To ensure these areas for bonding wiring 60, the arrangement position of the first light-emitting element 20A is adjusted.

[0233] On the third base 30C, a region for connecting the wiring 60 is secured at a position further away from the third light-emitting element 20C in the opposite direction to the second direction. A wiring 60 that connects to the first base 30A disposed adjacent to the third base 30C is connected in this region. Furthermore, a wiring 60 that connects to the fourth wiring section 12A4 is connected in this region. On the third base 30C, in the first direction, a region for connecting the wiring 60 is secured only on one side, not on both sides of the third light-emitting element 20C. Therefore, since the width of the third base 30C in the first direction can be reduced, the number of light-emitting elements 20 arranged in the first direction can be increased, enabling a high-output light-emitting device 1.

[0234] On the upper surface 31A of the first base 30A, one or more wirings 60 are joined in the region between the imaginary plane containing the light emitting surface 22 of the first light-emitting element 20A and the imaginary plane containing the side surface 21C opposite to the light emitting surface 22. On the upper surface 31A of the third base 30C, there are no wirings 60 joined in the region between the imaginary plane containing the light emitting surface 22 of the third light-emitting element 20C and the imaginary plane containing the side surface 21C opposite to the light emitting surface 22.

[0235] To achieve high output, the width of the base 30 in the first direction is adjusted. In the third base 30C, the wiring 60 is not provided at a position away from the third light-emitting element 20C in the first direction, but at least at a position away from the third light-emitting element 20C in the direction opposite to the second direction. This reduces the risk of contact with the third light-emitting element 20C and enables stable connection of the wiring 60.

[0236] In the light-emitting device 1, the shape of the wiring layer 33 of the first base 30A, viewed from above, is the same as the shape of the wiring layer 33 of the second base 30B. Furthermore, the external shape of the first base 30A is the same as the external shape of the second base 30B when viewed from above. In the light-emitting device 1, the first base 30A and the second base 30B are bases 30 with the same material, shape, and structure. Thus, by designing the wiring layer 33, etc., in a manner that utilizes the same base 30 in both the mounting of the first light-emitting element 20A and the mounting of the second light-emitting element 20B, the light-emitting device 1 can be manufactured efficiently.

[0237] In the light-emitting device 1, the second wiring portion 12A2 is provided at a position away from the first wiring portion 12A1 along a second direction. This avoids interference with the wiring 60 connected to the second light-emitting element 20B and the wiring 60 connected to the second base 30B, and facilitates the connection process of connecting the wiring 60 to the first light-emitting element 20A or the first base 30A.

[0238] In the light-emitting device 1, the third wiring section 12A3 is provided at a position away from the fourth wiring section 12A4 in the second direction. This avoids interference with the wiring 60 connected to the third light-emitting element 20C and the wiring 60 connected to the third base 30C, and facilitates the connection process of connecting the wiring 60 to the first light-emitting element 20A or the first base 30A.

[0239] Viewed from above, the distance from the center of the second base 30B to the second wiring section 12A2 is shorter than the distance from that center to the first wiring section 12A1. This simplifies the connection process of the second wiring 60B. Viewed from above, the distance from the center of the third base 30C to the third wiring section 12A3 is shorter than the distance from that center to the fourth wiring section 12A4. This simplifies the connection process of the third wiring 60C.

[0240] When multiple light-emitting elements 20, including a first light-emitting element 20A, multiple second light-emitting elements 20B, and multiple third light-emitting elements 20C, are disposed on a substrate 11 and electrically connected to the substrate 11, by arranging the first light-emitting element 20A between the multiple second light-emitting elements 20B and the multiple third light-emitting elements 20C, it is possible to manufacture a light-emitting device 1 with excellent stability. For example, a light-emitting device 1 with excellent stability when multiple wirings 60 are joined can be achieved. This will be explained in detail.

[0241] Figure 14A and Figure 14BThis is an example of a wiring connection method when multiple second light-emitting elements 20B are arranged between a first light-emitting element 20A and multiple third light-emitting elements 20C. In the light-emitting device 99 with this wiring connection method, in order to form a current path through which the second light-emitting elements 20B and the third light-emitting elements 20C do not pass through a current path while the first light-emitting element 20A passes through, there is a wiring 60X that is connected to two bases 30 with one or more bases 30 sandwiched between them. On the other hand, in the light-emitting device 1, there is no wiring 60 that is connected to two bases 30 with one or more bases 30 sandwiched between them, so the stability of the wiring connection is excellent.

[0242] In addition, these two bases 30 ( Figure 14A Since the wiring 60X passes directly above the second base 30B, the area where the wiring 60 is joined is limited to avoid contact with the wiring 60X. Therefore, there is a wiring 60Y close to other wiring 60. From a top-down view, if the wiring 60s are too close to each other, measures such as ensuring sufficient height difference between the wiring 60s for joining are needed to avoid the risk of contact. Therefore, the risk of contact between other components, such as the light-emitting device 99 and the cover 14, is relatively higher than that of the light-emitting device 1, negatively impacting installation stability. Alternatively, it may lead to a larger light-emitting device. In other words, it can be said that miniaturization of the light-emitting device can be achieved through the light-emitting device 1.

[0243] In addition, the base 30 of the wiring 60X connection ( Figure 14A The first base 30A in the laser element can also be joined with a wiring 60Z that is joined to a base 30 located in an adjacent position. However, to avoid this wiring 60Z also contacting the wiring 60X, the area that can be joined is limited. When multiple wirings 60 are joined to the upper surface 21A of the semiconductor laser element 20, which serves as the light-emitting element, it is best to join the wirings 60 uniformly in the resonator direction (Y direction in the figure) considering the current distribution. In addition, the joining position of the wiring 60 closest to the light emitting surface 22 is preferably not too far from the light emitting surface 22. Therefore, in Figure 14B In the wiring connection shown, when viewed from above, wiring 60Z is closer to wiring 60X, and the contact risk of light-emitting device 99 is relatively higher than that of light-emitting device 1, which negatively impacts installation stability. Alternatively, it may also lead to an increase in the size of the light-emitting device. In other words, it can be said that light-emitting device 1 enables miniaturization of the light-emitting device.

[0244] In the light-emitting device 1, three or more wirings 60 are connected to the light-emitting element 20. Although each light-emitting element 20 can be connected to three or more wirings 60, not all light-emitting elements 20 are connected to three or more wirings 60 due to differences in performance and characteristics among them.

[0245] In the light-emitting device 1, one or more reflective elements 40 are disposed within the internal space of the package 10. One or more reflective elements 40 are disposed on the substrate 11. One or more reflective elements 40 are disposed on the first upper surface 11A. One or more reflective elements 40 are disposed at a position separated from the plurality of light-emitting elements 20 in a second direction.

[0246] One or more reflective elements 40 reflect light emitted from the plurality of light-emitting elements 20. One or more light-reflecting surfaces 41B reflect light emitted from the light-emitting surfaces 22 of the plurality of light-emitting elements 20. The light reflected by the one or more reflective elements 40 propagates upward. The light reflected by the one or more reflective elements 40 passes through the cover 14 and exits from its upper surface 14A.

[0247] In the light-emitting device 1, one or more protective elements 50 are disposed within the internal space of the package 10. The one or more protective elements 50 are engaged with the substrate 11 or the base 30. One or more protective elements 50 are provided to protect the light-emitting element 20.

[0248] In the light-emitting device 1, an optical component 70 is fixed to a package 10. The optical component 70 is positioned where light emitted from the plurality of light-emitting elements 20 illuminates the optical surface. The optical component 70 is bonded to the package 10 by an adhesive. The optical component 70 applies an optical effect to the light illuminating the optical surface, causing the light to exit outside the optical component 70. In the illustrated light-emitting device 1, light emitted from the plurality of light-emitting elements 20 passes through a plurality of lens surfaces 71D. The light passing through the lens surfaces 71D becomes collimated light and exits from the optical component 70.

[0249] <Second Implementation>

[0250] The light-emitting device 2 involved in the second embodiment will be explained. Figures 1 to 3 , Figures 7 to 13 as well as Figure 15 The accompanying drawing illustrates an exemplary manner of the light-emitting device 2. Figure 1 This is a three-dimensional view of the light-emitting device 2. Figure 2 This is a top view of the light-emitting device 2. Figure 3 yes Figure 2 A cross-sectional view of the light-emitting device 2 at section line III-III. Figure 7 This is a top view of package 10. Figure 8 yes Figure 7 A cross-sectional view of package 10 at section line VIII-VIII. Figure 9 Is with Figure 8 The cross-sectional view of the package 10 corresponds to the cross-sectional view of the base 11. Figure 10 This is a top view of base 11. Figure 11 This is a bottom view of base 11. Figure 12This is a top view showing the base 30 on which the light-emitting element 20 and the protective element 50 are installed. Figure 13 This is a side view of the base 30 on which the light-emitting element 20 and the protective element 50 are mounted. Figure 15 This is a top view showing the connection method of the wiring 60 in the light-emitting device 2.

[0251] In the description of the light-emitting device 1 and its constituent elements in the first embodiment described above, items related to the light-emitting device 2 are excluded. Figures 1 to 3 , Figures 7 to 13 as well as Figure 15 All content except for the contradictory information in the accompanying drawings also applies to the description of the light-emitting device 2. To avoid repetition, all non-contradictory content will not be repeated here.

[0252] (Light-emitting device 2)

[0253] Light-emitting device 2 is an example of a light-emitting device in which the arrangement of multiple second light-emitting elements 20B and multiple third light-emitting elements 20C is opposite to that of light-emitting device 1. In light-emitting device 2, when viewed from above, multiple third light-emitting elements 20C are arranged between the first wiring section 12A1 and the second wiring section 12A2 and the first light-emitting element 20A, and multiple second light-emitting elements 20B are arranged between the third wiring section 12A3 and the fourth wiring section 12A4 and the first light-emitting element 20A. Although the connection method of the wiring 60 is different from that of light-emitting device 1, even with this arrangement of multiple light-emitting elements 20, a high-output light-emitting device with excellent manufacturing stability can be achieved, just like light-emitting device 1.

[0254] In the light-emitting device 2, the fourth wiring 60D is connected to the fourth wiring section 12A4 and the first base 30A. By connecting the fourth wiring section 12A4 and the first base 30A with a single wiring 60, the number of wirings 60 can be reduced.

[0255] <Third Implementation Method>

[0256] The light-emitting module 901 of the third embodiment is described. Figures 1 to 13 as well as Figures 15 to 18 This is an accompanying drawing illustrating an exemplary embodiment of the light-emitting module 901. Figures 1 to 13 as well as Figure 15 This is a diagram illustrating the light-emitting device of the light-emitting module 901. Figure 16 This is a 3D view of the light-emitting module 901. Figure 17 This is a top view of the light-emitting module 901. Figure 18 This is a top view of the wiring board 101.

[0257] The light-emitting module 901 comprises several components. These components include a light-emitting device and a wiring board 101. It should be noted that the light-emitting module 901 may also include other components. For example, the light-emitting module 901 may also include a temperature measuring element such as a thermistor.

[0258] The light-emitting device included in the light-emitting module 901 can be either the light-emitting device 1 of the first embodiment or the light-emitting device 2 of the second embodiment. Therefore, the description of the light-emitting devices 1 and 2 included in the light-emitting module 901 applies to the description of the first embodiment and the description of the second embodiment.

[0259] (Wireline board 101)

[0260] Wiring substrate 101 has an upper surface 101A, a lower surface 101B, and one or more side surfaces 101C. Wiring substrate 101 has a plate-like shape. Viewed from above, the outer edge of wiring substrate 101 is rectangular. This rectangle can be a rectangle with a long side and a short side. In the illustrated package 10, the short side of this rectangle is oriented in the same direction as the X-direction, and the long side is oriented in the same direction as the Y-direction.

[0261] The wiring board 101 has a heat dissipation section 101D, an electrode section 101E, and an insulation section 101F. The heat dissipation section 101D functions as a heat dissipation path for heat emitted from other components mounted on the wiring board 101. The electrode section 101E is electrically connected to the other components mounted on the wiring board 101.

[0262] The insulating portion 101F insulates the heat dissipation portion 101D and the electrode portion 101E. The insulating portion 101F is provided to insulate the electrical connection between the heat dissipation portion 101D and the electrode portion 101E in the wiring board 101.

[0263] One or more through holes 101H are provided on the wiring board 101. Among the one or more through holes 101H is a through hole 101H for securing the wiring board 101 to other components (constituents). For example, a screw is inserted into the through hole 101H to secure the wiring board 101 to the other component. Among the one or more through holes 101H is a through hole 101H for determining the position when the wiring board 101 is secured to the other component.

[0264] (Light-emitting module 901)

[0265] In the light-emitting module 901, light-emitting devices 1 and 2 are mounted on the wiring board 101. Light-emitting devices 1 and 2 are mounted on the upper surface 101A of the wiring board 101. The wiring portion 12A provided on the lower surface 11B of the light-emitting devices 1 and 2 is connected to the electrode portion 101E of the wiring board 101, thereby electrically connecting the light-emitting devices 1 and 2 to the wiring board 101.

[0266] Viewed from above, the light-emitting devices 1 and 2 are arranged on the wiring substrate 101 such that the long side of the package 10 is aligned with the long side of the wiring substrate 101. This allows for the realization of a small light-emitting module 901. By incorporating this small light-emitting module 901, a small projector can be implemented, for example.

[0267] The light-emitting devices 1 and 2 can be, for example, light-emitting devices that emit red, green, and blue light. For example, the first light-emitting element 20A is a semiconductor laser element that emits blue light, the second light-emitting element 20B is a semiconductor laser element that emits red or green light, and the third light-emitting element 20C is a semiconductor laser element that emits red or green light of a different color than the second light-emitting element 20B.

[0268] In this way, the light-emitting module 901 can function as an RGB light source on its own, and can become a suitable light source for RGB light source projectors, especially small projectors such as micro projectors.

[0269] In particular, by employing a semiconductor laser element in the light-emitting element 20 that is generally brighter and has a higher output power than a light-emitting diode (LED), and by increasing the number of light-emitting elements 20 that emit green light and red light to more than the number of light-emitting elements 20 that emit blue light, the light-emitting module 901, which achieves substantial high output as an RGB light source, can greatly contribute to realizing an ideal micro projector that is small, high-output, and energy-saving.

[0270] This light-emitting module 901 uses an RGB light source and can be installed in projectors with a light output [lm] of 350lm or more. Furthermore, this light-emitting module 901 enables projectors to have only one light-emitting module 901 as the light source, with a light output [lm] of 350lm or more but less than 600lm.

[0271] The various embodiments of the present invention have been described above, but the light-emitting device and light-emitting module of the present invention are not strictly limited to the light-emitting device and light-emitting module in each embodiment. That is to say, the present invention is not limited to the shape and structure of the light-emitting device and light-emitting module disclosed in each embodiment. The present invention does not necessarily require all constituent elements to be applicable. For example, when some constituent elements of the light-emitting device disclosed in the embodiments are not described in the scope of the claims, those skilled in the art are allowed the freedom to substitute, omit, modify the shape, change the material, etc., for those constituent elements, and on this basis, the invention described in the scope of the claims is applicable.

[0272] Industrial availability

[0273] The light-emitting device and light-emitting module described in the embodiments can be applied to projectors. That is to say, a projector can be considered one application of the present invention. It should be noted that the present invention is not limited thereto, and can also be applied to various applications such as lighting, exposure, vehicle headlights, head-mounted displays, and backlights for other displays.

Claims

1. A light-emitting device, characterized in that, have: Multiple light-emitting elements, including a first light-emitting element, multiple second light-emitting elements and multiple third light-emitting elements, each having an anode electrode and a cathode electrode; The substrate has a first wiring section, a second wiring section, a third wiring section and a fourth wiring section, and a mounting surface located between two of the first wiring section, the second wiring section, the third wiring section and the fourth wiring section when viewed from above; Multiple wirings electrically connect the multiple light-emitting elements to the substrate; From the top view, the plurality of light-emitting elements are arranged on the mounting surface such that the first light-emitting element is located between the plurality of second light-emitting elements and the plurality of third light-emitting elements. The first wiring section is electrically connected to the first light-emitting element on one of the two electrodes. The second wiring section is electrically connected to one of the two electrodes on one electrode side of the plurality of second light-emitting elements. The third wiring section is electrically connected to one of the two electrodes on one electrode side of the plurality of third light-emitting elements. The fourth wiring section is electrically connected to the first light-emitting element, the plurality of second light-emitting elements, and the plurality of third light-emitting elements on the other electrode side of the two electrodes. A first current path is formed between the first wiring section and the fourth wiring section, through which the first light-emitting element passes and through which none of the plurality of second light-emitting elements and the plurality of third light-emitting elements passes. A second current path is formed between the second wiring section and the fourth wiring section, through which the plurality of second light-emitting elements pass and through which neither the first light-emitting element nor any of the plurality of third light-emitting elements passes. A third current path is formed between the third wiring section and the fourth wiring section, through which the plurality of third light-emitting elements pass and through which neither the first light-emitting element nor any of the plurality of second light-emitting elements passes.

2. The light-emitting device according to claim 1, characterized in that, The first light-emitting element, the second light-emitting element, and the third light-emitting element emit light with different peak wavelengths.

3. The light-emitting device according to claim 1 or 2, characterized in that, The first light-emitting element, the second light-emitting element, and the third light-emitting element emit light of any one of the colors red, green, and blue, and the colors are different from each other.

4. The light-emitting device according to any one of claims 1 to 3, characterized in that, All of the light-emitting elements are semiconductor laser elements.

5. The light-emitting device according to any one of claims 1 to 4, characterized in that, It also has multiple bases, including a first base on which the first light-emitting element is disposed, multiple second bases on which the second light-emitting element is disposed respectively, and multiple third bases on which the third light-emitting element is disposed respectively, each having a wiring layer.

6. The light-emitting device according to claim 5, characterized in that, Under the top-down view, the shape of the wiring layer of the first base is the same as the shape of the wiring layer of the second base.

7. The light-emitting device according to claim 5 or 6, characterized in that, The multiple wirings include: The first wiring is connected to the first wiring portion and to the first light-emitting element or the first base; The second wiring is connected to the second wiring portion and to the second light-emitting element or the second base; The third wiring is connected to the third wiring portion and to the third light-emitting element or the third base; The fourth wiring is connected to the fourth wiring section and the base.

8. The light-emitting device according to any one of claims 5 to 7, characterized in that, From the top-down view, the plurality of light-emitting elements are arranged in a first direction. The width of the first light-emitting element in the first direction is smaller than the width of the third light-emitting element in the first direction. The difference between the width of the first base in the first direction and the width of the third base in the first direction is smaller than the difference between the width of the first light-emitting element in the first direction and the width of the third light-emitting element in the first direction.

9. The light-emitting device according to any one of claims 1 to 8, characterized in that, From the top-down view, the plurality of light-emitting devices are arranged in a first direction. The first wiring section and the second wiring section are arranged in a second direction perpendicular to the first direction. The third wiring section and the fourth wiring section are arranged in the second direction. The plurality of light-emitting elements are disposed between the first wiring portion and the second wiring portion arranged in the second direction and between the first wiring portion and the second wiring portion arranged in the second direction.

10. The light-emitting device according to claim 9, characterized in that, The second wiring section is disposed at a position separate from the first wiring section in the second direction. The third wiring section is disposed at a position separate from the fourth wiring section in the second direction.

11. The light-emitting device according to claim 10, characterized in that, The plurality of light-emitting elements emit light in the second direction respectively.

12. A light-emitting module, characterized in that, have: The light-emitting device according to any one of claims 1 to 11; The wiring board on which the light-emitting device is mounted.

13. The light-emitting module according to claim 12, characterized in that, The first light-emitting element is a semiconductor laser element that emits blue light. The second light-emitting element is a semiconductor laser element that emits red or green light. The third light-emitting element is a semiconductor laser element that emits red or green light, that is, light of a different color than the second light-emitting element.

14. The light-emitting module according to claim 12 or 13, characterized in that, It uses RGB light source as the light source and is used in projectors with a light output of 350lm or more.

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