Quartz resonator

Abstract

A quartz resonator comprises a shell, a connecting pad, an oscillator crystal and a thermistor. The shell comprises a first shell and a second shell. The connecting pad is arranged on the outer surface of the second shell. The oscillator crystal comprises two thick parts and a thin part of which the two ends are respectively connected with the two thick parts. The two thick parts are clamped between the first shell and the second shell. A closed first space is formed between the inner surface of the first shell and the thin part of the oscillator crystal, and a closed second space is formed between the inner surface of the second shell and the thin part of the oscillator crystal. The thermistor is arranged in the first space or the second space and is electrically connected with the connecting pad. The quartz resonator provided by the invention can accurately measure the temperature.

Description

Technical Field

[0001] This invention relates to a resonator, and more particularly to a quartz resonator. Background Technology

[0002] Modern resonators consist of a housing, a crystal oscillator, and a thermistor. The crystal oscillator is housed in the housing, while the thermistor is located outside the housing. This makes it difficult for the thermistor to accurately measure the temperature of the crystal oscillator and also results in an excessively large resonator size. Summary of the Invention

[0003] This invention provides a quartz resonator that can accurately measure temperature.

[0004] According to an embodiment of the present invention, a quartz resonator includes a housing, pads, a crystal oscillator, and a thermistor. The housing includes a first housing and a second housing. The pads are disposed on the outer surface of the second housing. The crystal oscillator includes two thick portions and a thin portion connected to the two thick portions at both ends. The two thick portions are sandwiched between the first housing and the second housing. A sealed first space is formed between the inner surface of the first housing and the thin portion of the crystal oscillator, and a sealed second space is formed between the inner surface of the second housing and the thin portion of the crystal oscillator. The thermistor is disposed within the first space or the second space and is electrically connected to the pads.

[0005] The quartz resonator according to an embodiment of the present invention also includes a circuit structure, the two ends of which are respectively connected to a pad and a thermistor.

[0006] In a quartz resonator according to an embodiment of the present invention, a thermistor is disposed in a first space, and the middle section between the two ends of the circuit structure penetrates at least one of the two thick parts of the oscillator crystal and the second housing.

[0007] In a quartz resonator according to an embodiment of the present invention, a thermistor is disposed on the inner surface of a first housing.

[0008] In a quartz resonator according to an embodiment of the present invention, the inner surface of the first housing includes a groove recessed toward the interior of the first housing and away from the oscillator crystal, and a thermistor is disposed in the groove.

[0009] In the quartz resonator according to an embodiment of the present invention, the thermistor is disposed in the second space, and the middle section between the two ends of the circuit structure penetrates the second housing.

[0010] In a quartz resonator according to an embodiment of the present invention, a thermistor is disposed on the inner surface of the second housing.

[0011] In a quartz resonator according to an embodiment of the present invention, the inner surface of the second housing includes a groove recessed toward the interior of the second housing and away from the oscillator crystal, and a thermistor is disposed in the groove.

[0012] In the quartz resonator according to an embodiment of the present invention, the housing and the oscillator crystal are made of quartz.

[0013] In the quartz resonator according to an embodiment of the present invention, two encapsulation rings are further included, one of which is disposed between the first housing and the two thick parts of the oscillator crystal, and the other of which is disposed between the second housing and the two thick parts of the oscillator crystal.

[0014] Based on the above, the thermistor of the quartz resonator of the present invention is disposed inside the housing, and is relatively close to the oscillator crystal inside the housing, so as to accurately measure the temperature of the oscillator crystal. By disposing of the thermistor inside the housing, the size of the quartz resonator can also be reduced. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of a quartz resonator according to an embodiment of the present invention;

[0016] Figure 2 This is a schematic diagram of a quartz resonator according to another embodiment of the present invention;

[0017] Figure 3 This is a schematic diagram of a quartz resonator according to another embodiment of the present invention;

[0018] Figure 4 This is a schematic diagram of a quartz resonator according to another embodiment of the present invention. Detailed Implementation

[0019] Reference will now be made in detail to exemplary embodiments of the invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same element symbols are used in the drawings and description to denote the same or similar parts.

[0020] Figure 1 This is a schematic diagram of a quartz resonator according to an embodiment of the present invention. Please refer to [link / reference]. Figure 1 The quartz resonator 100 includes a housing 110, a pad 120, a crystal oscillator 130, and a thermistor 140. The housing 110 includes a first housing 111 and a second housing 112. The pad 120 is disposed on the outer surface 115 of the second housing 112. The crystal oscillator 130 includes two thick portions 132 and a thin portion 133, with both ends of the thin portion 133 connected to the two thick portions 132. The two thick portions 132 are sandwiched between the first housing 111 and the second housing 112.

[0021] A sealed first space P1 is formed between the inner surface 113 of the first housing 111 and the thin portion 133 of the oscillator crystal 130, and a sealed second space P2 is formed between the inner surface 114 of the second housing 112 and the thin portion 133 of the oscillator crystal 130. The inner surface 114 of the second housing 112 corresponds to the outer surface 115. A thermistor 140 is disposed within the first space P1 or the second space P2 and is electrically connected to a pad 120. The pad 120 is located outside the second space P2.

[0022] Because the thermistor 140 is located inside the housing 110 and close to the oscillator crystal 130, the temperature of the oscillator crystal 130 can be measured more accurately. The thermistor 140 is, for example, a thin-film thermistor, which reduces the size of the quartz resonator 100. The number of pads 120 is, for example, two, but is not limited thereto.

[0023] The quartz resonator 100 also includes a circuit structure 150, with its two ends 151 and 152 connected to a pad 120 and a thermistor 140, respectively. The circuit structure 150 penetrates the housing 110. The thermistor 140 is electrically connected to the pad 120 via the circuit structure 150. In this embodiment, the thermistor 140 is disposed within the first space P1, located between the first housing 111 and the oscillator crystal 130. The housing 110 includes an inner plane 117. Here, the inner plane 117 is the inner surface 113 of the first housing 111. The thermistor 140 is disposed on the inner plane 117 (inner surface 113) of the first housing 111 and faces the oscillator crystal 130. The thermistor 140 is closer to the oscillator crystal 130, thus allowing for more accurate measurement of the temperature of the oscillator crystal 130. The middle section 153 between the two ends 151 and 152 of the circuit structure 150 penetrates at least one of the two thick portions 132 of the oscillator crystal 130 and the second housing 112. In this embodiment, the middle section 153 penetrates the two thick portions 132.

[0024] A groove 131 is formed between the two thick portions 132 and the thin portion 133 of the oscillator crystal 130, forming a necked structure. The thermistor 140 corresponds to the groove 131. The housing 110 and the oscillator crystal 130 are made of quartz, thereby allowing the housing 110 and the oscillator crystal 130 to have the same coefficient of thermal expansion.

[0025] Conventional quartz resonators use different materials for their housing and crystal, resulting in different coefficients of thermal expansion. This causes inconsistencies in frequency changes between the housing and crystal during heating and cooling, leading to hysteresis and affecting the accuracy of the conventional quartz resonator. In this embodiment, because the housing 110 and crystal 130 of the quartz resonator 100 have the same coefficient of thermal expansion (i.e., the same material), the frequency changes of the housing 110 and crystal 130 are consistent during heating and cooling, resulting in better accuracy for the quartz resonator 100.

[0026] In addition, the quartz resonator 100 also includes two encapsulation rings 160. One encapsulation ring 160 is disposed between the first housing 111 and the two thick portions 132 of the oscillator crystal 130, and the other encapsulation ring 160 is disposed between the second housing 112 and the two thick portions 132 of the oscillator crystal 130, thereby enabling a seal between the housing 110 and the oscillator crystal 130.

[0027] Figure 2 This is a schematic diagram of a quartz resonator according to another embodiment of the present invention. Please also refer to... Figure 1 and Figure 2 The quartz resonator 100a of this embodiment is similar to that of the previous embodiment, except that the inner surface 113a of the first housing 111a in this embodiment includes a groove 116 recessed into the interior of the first housing 111a, away from the oscillator crystal 130. A thermistor 140 is disposed within the groove 116. Through the groove 116, the housing 110a can have a larger space to facilitate the assembly of the quartz resonator 100a by engineers. The circuit structure 150a located in the first space P1 extends along the surface of the groove 116 and is connected to the thermistor 140. The quartz resonator 100a of this embodiment has similar effects to that of the previous embodiment, and will not be described again here.

[0028] Figure 3 This is a schematic diagram of a quartz resonator according to another embodiment of the present invention. Please also refer to... Figure 1 and Figure 3 The quartz resonator 100b of this embodiment is similar to that of the previous embodiment, except that the thermistor 140 of this embodiment is disposed within the second space P2. Here, the inner plane 117 of the housing 110 is the inner surface 114 of the second housing 112. The thermistor 140 is disposed on the inner surface 114 (inner plane 117) of the second housing 112. The middle section 153 between the two ends 151 and 152 of the circuit structure 150b only penetrates the second housing 112. The quartz resonator 100b of this embodiment has similar effects to those of the previous embodiment, and will not be described again here.

[0029] Figure 4This is a schematic diagram of a quartz resonator according to another embodiment of the present invention. Please also refer to... Figure 3 and Figure 4 The quartz resonator 100c of this embodiment is similar to that of the previous embodiment, except that the inner surface 114c of the second housing 112c in this embodiment includes a groove 116c recessed into the interior of the second housing 112c, away from the oscillator crystal 130. A thermistor 140 is disposed within the groove 116c. A circuit structure 150c located in the second space P2 extends along the surface of the groove 116c and is connected to the thermistor 140. The quartz resonator 100c of this embodiment has similar effects to that of the previous embodiment, and will not be described again here.

[0030] In summary, the thermistor of the quartz resonator of the present invention is disposed inside the housing, close to the oscillating crystal inside the housing, to accurately measure the temperature of the oscillating crystal. The thermistor's placement within the housing also reduces the size of the quartz resonator.

[0031] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A quartz resonator, characterized in that, include: The housing includes a first housing and a second housing; A contact pad is disposed on the outer surface of the second housing; An oscillator crystal includes two thick portions and two thin portions connected to the two thick portions at their respective ends. The two thick portions are sandwiched between a first housing and a second housing. A first sealed space is formed between the inner surface of the first housing and the thin portion of the oscillator crystal, and a second sealed space is formed between the inner surface of the second housing and the thin portion of the oscillator crystal. A thermistor is disposed within the first space or the second space and is electrically connected to the pad.

2. The quartz resonator according to claim 1, characterized in that, It also includes a circuit structure, the two ends of which are respectively connected to the pad and the thermistor.

3. The quartz resonator according to claim 2, characterized in that, The thermistor is disposed in the first space, and the middle section between the two ends of the circuit structure penetrates at least one of the two thick parts of the oscillator crystal and the second housing.

4. The quartz resonator according to claim 3, characterized in that, The thermistor is disposed on the inner surface of the first housing.

5. The quartz resonator according to claim 4, characterized in that, The inner surface of the first housing includes a groove recessed into the interior of the first housing, away from the oscillator crystal, and the thermistor is disposed in the groove.

6. The quartz resonator according to claim 2, characterized in that, The thermistor is disposed in the second space, and the middle section between the two ends of the circuit structure penetrates the second housing.

7. The quartz resonator according to claim 6, characterized in that, The thermistor is disposed on the inner surface of the second housing.

8. The quartz resonator according to claim 7, characterized in that, The inner surface of the second housing includes a groove recessed into the interior of the second housing, away from the oscillator crystal, and the thermistor is disposed in the groove.

9. The quartz resonator according to claim 1, characterized in that, The shell and the oscillator crystal are made of quartz.

10. The quartz resonator according to claim 1, characterized in that, It also includes two encapsulation rings, one of which is disposed between the first housing and the two thick portions of the oscillator crystal, and the other of which is disposed between the second housing and the two thick portions of the oscillator crystal.

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