Temperature measuring structure for detecting internal temperature of semiconductor refrigeration chip

Abstract

The utility model discloses a temperature measuring structure for detecting the internal temperature of a semiconductor refrigeration chip, which comprises a semiconductor refrigeration chip body, a plurality of thermistors which are arranged in parallel are arranged in the semiconductor refrigeration chip body, and the plurality of thermistors which are arranged in parallel form a detection unit. The detection unit is connected with a fixed resistor in series through a wire, the ends, away from the fixed resistor, of the thermistors are connected with a power source negative electrode connector through wires, and the end, away from the detection unit, of the fixed resistor is connected with a power source positive electrode connector through a wire. According to the temperature measurement structure for detecting the internal temperature of the semiconductor refrigeration chip, an embedded temperature measurement network and a partial pressure type direct reading circuit detection framework are adopted, the temperatures of different areas in the semiconductor refrigeration chip can be directly detected, the detection effect is good, the internal temperature of the semiconductor refrigeration chip can be detected after an individual thermistor is damaged, and the detection accuracy is high. The service life is long.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor refrigeration technology, specifically a temperature measuring structure for detecting the internal temperature of a semiconductor refrigeration chip. Background Technology

[0002] A thermoelectric cooler, also known as a semiconductor cooler, is a type of heat pump. Its advantages include the absence of sliding parts, making it suitable for applications where space is limited, reliability is critical, and refrigerant contamination is undesirable. Utilizing the Peltier effect of semiconductor materials, when direct current passes through a coupler composed of two different semiconductor materials connected in series, heat is absorbed and released at the two ends of the coupler, achieving the purpose of cooling.

[0003] During operation, thermoelectric coolers require a heat dissipation system (typically including heat sink fins and forced air cooling) at the hot-end interface, and this system directly determines the cooling effect of the thermoelectric cooler. When the cooling fan power is insufficient or the cooling system efficiency deteriorates, the hot-end temperature will rise exponentially. According to the Thomson effect, when the hot-end temperature is >80°C, the thermoelectric figure of merit (ZT value) of the cooler decreases by more than 40%, and the cooling efficiency is significantly reduced. In addition, sustained high temperatures can also cause cracking of the ceramic substrate and semiconductor lattice decay, ultimately leading to permanent device failure.

[0004] Currently, temperature monitoring solutions for thermoelectric coolers mainly detect the temperature on the outside of the thermoelectric cooler, but cannot detect its internal temperature; moreover, a single sensor is difficult to capture the temperature of different parts, resulting in poor detection performance. Utility Model Content

[0005] The technical problem to be solved by this utility model is to overcome the existing defects and provide a temperature measurement structure for detecting the internal temperature of a semiconductor refrigeration chip. It adopts an embedded temperature measurement network and a voltage divider direct reading circuit detection framework, which can directly detect the temperature of different areas inside the semiconductor refrigeration chip. The detection effect is good, and it can still detect the internal temperature of the semiconductor refrigeration chip even after individual thermistors are damaged. It has a long service life and can effectively solve the problems in the background technology.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a temperature measuring structure for detecting the internal temperature of a semiconductor refrigeration chip, comprising a semiconductor refrigeration chip body, wherein the semiconductor refrigeration chip body is provided with a plurality of thermistors connected in parallel, and the plurality of thermistors connected in parallel constitute a detection unit, wherein the detection unit is connected in series with a fixed resistor via a wire, and the ends of the plurality of thermistors away from the fixed resistor are all connected to a negative power supply terminal via wires, and the end of the fixed resistor away from the detection unit is connected to a positive power supply terminal via a wire.

[0007] As a preferred embodiment of this utility model, there are five thermistors, which are arranged in an array in the PN junction gap inside the semiconductor refrigeration chip body. One thermistor is located in the center of the core area, and the other four thermistors are respectively arranged in the four right-angled areas at the corners inside the semiconductor refrigeration chip body.

[0008] As a preferred technical solution of this utility model, a number of thermistors are linearly and uniformly distributed in the PN junction gap inside the semiconductor cooling chip body.

[0009] As a preferred embodiment of this utility model, the outer side of the semiconductor cooling chip body is provided with a fixing plate for fixing the negative terminal connector of the power supply.

[0010] As a preferred embodiment of this utility model, both ends of the fixed resistor are provided with external voltmeter connectors for connecting an external voltmeter via wires.

[0011] Compared with the prior art, the beneficial effects of this utility model are:

[0012] The temperature measurement structure for detecting the internal temperature of a semiconductor refrigeration chip, as exemplified by this utility model, adopts an embedded temperature measurement network and a voltage divider direct reading circuit detection framework. It can directly detect the temperature of different regions inside the semiconductor refrigeration chip, with good detection effect. Furthermore, it can still detect the internal temperature of the semiconductor refrigeration chip even after individual thermistors are damaged, and has a long service life. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the structure of this utility model;

[0014] Figure 2 This is a cross-sectional structural diagram of the present invention;

[0015] Figure 3 This is the circuit diagram of this utility model;

[0016] Figure 4 This is a schematic diagram of the distribution structure of the thermistors in Example 1;

[0017] Figure 5 This is a schematic diagram of the distribution structure of the thermistors in Example 2.

[0018] In the diagram: 1. Semiconductor cooling chip body, 2. Fixed resistor, 2.1 External voltmeter connector, 3. Power supply positive connector, 4. Thermistor, 5. Power supply negative connector, 6. Fixing plate. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0020] Example 1: Please refer to Figure 1-4 This utility model provides a technical solution: a temperature measuring structure for detecting the internal temperature of a semiconductor refrigeration chip, including a semiconductor refrigeration chip body 1. The semiconductor refrigeration chip body 1 contains several thermistors 4 connected in parallel, and these thermistors 4 form a detection unit. The detection unit is connected in series with a fixed resistor 2 via wires. The ends of the thermistors 4 furthest from the fixed resistor 2 are each connected to a negative power supply terminal 5 via wires. The end of the fixed resistor 2 furthest from the detection unit is connected to a positive power supply terminal 3 via wires. An external power supply is connected through the positive and negative power supply terminals 3 and 5. The voltage across the fixed resistor 2 is then detected, and the resistance value of the thermistors 4 is determined using a voltage divider circuit method, thereby determining the internal temperature of the semiconductor refrigeration chip body 1.

[0021] Furthermore, several thermistors 4 are linearly and uniformly distributed in the PN junction gap inside the semiconductor cooling chip body 1 to detect the temperature at different locations.

[0022] Furthermore, a fixing plate 6 for fixing the negative power connector 5 is provided on the outer side of the semiconductor cooling chip body 1. The fixing plate 6 is used to fix multiple negative power connectors 5 in a group.

[0023] Furthermore, both ends of the fixed resistor 2 are equipped with external voltmeter connectors 21 for connecting an external voltmeter via wires. Before testing, a resistance-temperature reference table for testing the thermistor needs to be set up, so that at room temperature: RT=xΩ-m℃ and at high temperature: RT=yΩ-n℃. With a constant power supply voltage, when the voltage across the fixed resistor 2 is detected, the voltage across the thermistor 4 and the resistance value of the thermistor 4 can be calculated. Then, the corresponding temperature can be found in the reference table according to the resistance value.

[0024] Example 2: Please refer to Figure 5 The difference from Embodiment 1 is that there are five thermistors 4, and the five thermistors 4 are arranged in an array in the PN junction gap inside the semiconductor cooling chip body 1. One thermistor 4 is located in the center of the core area, and the other four thermistors 4 are respectively arranged in the four right-angle areas at the corners inside the semiconductor cooling chip body 1, which facilitates the detection of the temperature in different areas.

[0025] The thermistor 4 and fixed resistor 2 used in this invention are both commonly used electronic components in the prior art.

[0026] This invention employs an embedded temperature measurement network and a voltage divider direct-reading circuit detection framework, which can directly detect the temperature of different regions inside the semiconductor refrigeration chip. It has good detection effect and can still detect the internal temperature of the semiconductor refrigeration chip even after individual thermistors 4 are damaged, resulting in a long service life.

[0027] The parts not disclosed in this utility model are all prior art, and their specific structures, materials, and working principles will not be described in detail. Although embodiments of this utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of this utility model, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A temperature measuring structure for detecting the internal temperature of a semiconductor refrigeration chip, comprising a semiconductor refrigeration chip body (1), characterized in that: The semiconductor cooling chip body (1) is provided with a number of parallel thermistors (4), and the number of parallel thermistors (4) constitutes a detection unit. The detection unit is connected in series with a fixed resistor (2) through a wire, and the ends of the number of thermistors (4) away from the fixed resistor (2) are all connected to the negative terminal of the power supply (5) through a wire. The end of the fixed resistor (2) away from the detection unit is connected to the positive terminal of the power supply (3) through a wire.

2. The temperature measuring structure for detecting the internal temperature of a semiconductor cooling chip according to claim 1, characterized in that: There are five thermistors (4), and the five thermistors (4) are arranged in an array in the PN junction gap inside the semiconductor cooling chip body (1). One thermistor (4) is located in the center of the core area, and the other four thermistors (4) are respectively arranged in the four right-angle areas of the inside corner of the semiconductor cooling chip body (1).

3. The temperature measuring structure for detecting the internal temperature of a semiconductor cooling chip according to claim 1, characterized in that: Several thermistors (4) are linearly and uniformly distributed in the PN junction gap inside the semiconductor cooling chip body (1).

4. The temperature measuring structure for detecting the internal temperature of a semiconductor cooling chip according to claim 1, characterized in that: The outer side of the semiconductor cooling chip body (1) is provided with a fixing plate (6) for fixing the negative terminal connector (5) of the power supply.

5. The temperature measuring structure for detecting the internal temperature of a semiconductor cooling chip according to claim 1, characterized in that: Both ends of the fixed resistor (2) are provided with external voltmeter connectors (21) for connecting an external voltmeter via wires.

Images