Infrared detector chip lossless carrier and use method thereof

Abstract

The invention provides an infrared detector chip lossless carrier and a use method thereof, and the carrier comprises a chip carrier plate which is arranged between an upper cover and a lower cover, and the upper cover and the lower cover are connected through a buckle locking mechanism; the surface of the chip carrier plate is provided with a chip position groove, and the width of the position groove is matched with the width of a chip. A positioning pin is arranged in the position groove and is used for preventing the chip from moving along the position groove; and a groove is arranged in the position groove, so that a space is formed between the placed chip and the bottom of the groove. According to the carrier provided by the invention, the accommodating cavities can be customized according to infrared detector chips of different sizes, and the carrier is flexible in application and high in universality; due to the oriented accommodating cavity and the precise positioning design, the chip can be quickly and accurately taken and placed, and the working efficiency is high; and the chip taking, placing and transferring difficulty is obviously reduced, and the manual operation risk is greatly reduced.

Description

Technical Field

[0001] This application relates to the field of infrared detector technology, and in particular to a non-destructive carrier for an infrared detector chip and a method for using it. Background Technology

[0002] Infrared detector chips are typically made of semiconductor materials such as mercury cadmium telluride and indium antimonide. The surfaces of these materials are extremely sensitive to contamination, and the materials themselves are brittle and easily broken. Even minor damage or contamination can cause chip malfunction, resulting in unnecessary economic losses. Furthermore, the manufacturing process for infrared detector chips involves numerous steps, including processing, testing, and transportation. During this process, technicians use tweezers to handle the chips, and manual handling and transfer can easily lead to errors, causing the chips to slip or be damaged due to uneven stress, thus increasing production costs. In addition, because infrared detector chips come in various sizes and there is a lack of universally compatible carriers, the chips can easily come into hard contact with the carrier during transportation, causing chipping or chipping of edges / corners. Summary of the Invention

[0003] In view of this, the present invention provides a non-destructive carrier for infrared detector chips and a method for using the same.

[0004] The present invention provides a non-destructive carrier for an infrared detector chip, comprising: A chip carrier board is disposed between an upper cover and a lower cover, which are connected by a snap-locking mechanism.

[0005] In one embodiment, the chip carrier surface is provided with a chip positioning slot, the width of which matches the width of the chip.

[0006] In one embodiment, a positioning pin is arranged in the position slot to prevent the chip from moving along the position slot.

[0007] In one embodiment, the positioning slot is provided with a recess so that there is space between the placed chip and the bottom of the recess.

[0008] Another aspect of the present invention provides a method for using a non-destructive carrier for an infrared detector chip, comprising: Step 1: Open the top cover of the infrared detector chip non-destructive carrier, determine the chip size, and select a chip carrier board with a high degree of matching with the size of the chip to be placed. Step 2: Take the chip to be transported into the position slot of the chip carrier and align it with the positioning pin; Step 3: After the chip is placed stably, close the top cover and lock the latching mechanism between the top and bottom covers; Step 4: Transport to the next process point, open the top cover, take out the chip, and repeat steps 2 to 3 after processing is completed until the chip is fully fabricated.

[0009] In one embodiment, the placement and removal of the chip are accomplished using a polytetrafluoroethylene (PTFE) spatula.

[0010] By adopting the above technical solution, the present invention has at least the following advantages: The device provided by this invention can customize the receiving cavity according to infrared detector chips of different sizes, making it flexible and versatile. The directional receiving cavity and precise positioning design enable the chip to be picked up and placed quickly and accurately, resulting in high work efficiency. Furthermore, the difficulty of picking up, placing, and transferring chips when using this application is significantly reduced, greatly reducing the risk of human operation. Attached Figure Description

[0011] Various other advantages and benefits will become apparent to those skilled in the art upon reading the following detailed description of preferred embodiments. The accompanying drawings are for illustrative purposes only and are not intended to limit the scope of this application. Furthermore, the same reference numerals denote the same parts throughout the drawings. In the drawings: Figure 1 This is a schematic diagram of the upper cover structure of the non-destructive carrier for infrared detector chips according to an embodiment of the present invention; Figure 2 This is a schematic diagram of the lower cover structure of a non-destructive carrier for an infrared detector chip according to an embodiment of the present invention; Figure 3 This is a schematic diagram of the latching and locking mechanism of the non-destructive carrier for the infrared detector chip according to an embodiment of the present invention; Figure 4 This is a schematic diagram of the chip carrier of the infrared detector chip non-destructive carrier according to an embodiment of the present invention; Figure 5 According to Figure 4 Cross-sectional view of the longitudinal section; Figure 6 This is a schematic diagram of the placement and removal of infrared detector chips in a non-destructive carrier for infrared detector chips according to an embodiment of the present invention. Detailed Implementation

[0012] To further illustrate the technical means and effects of the present invention in achieving its intended purpose, the present invention will be described in detail below with reference to the accompanying drawings and preferred embodiments.

[0013] While exemplary embodiments of the invention are shown in the accompanying drawings, it should be understood that the invention can be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided to enable a more thorough understanding of the invention and to fully convey its scope to those skilled in the art. The invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0014] In the first embodiment of the present invention, a non-destructive carrier for an infrared detector chip is provided, such as... Figures 1 to 6 As shown, it includes: Top cover; bottom cover; snap-locking mechanism; chip carrier board (can be replaced according to the actual chip size).

[0015] The chip carrier board consists of four parts: the chip carrier board body; the chip positioning slot; the positioning pin; and the chip body.

[0016] The dimensions of the chip carrier can be changed according to the actual use, selecting a carrier with a high degree of matching to the size of the chip to be placed. To prevent the chip from moving freely during transportation and making hard contact with the carrier, positioning pins are added to the chip carrier; for easy chip placement and removal, the chip carrier has grooves, which are used to pick up and place the chips using a PTFE spatula of the matching size.

[0017] The infrared focal plane array chip provided in this embodiment of the invention. The overall structure of the carrier of the present invention in the embodiment includes: (1) a top cover, the structure of which is as follows: Figure 1 As shown; (2) the lower cover, its structure is as follows Figure 2 As shown; (3) the buckle locking mechanism, the structure of which is as follows: Figure 3 As shown; (4) Chip carrier board. The chip carrier board can be replaced according to the actual chip size. The structure of the chip carrier board is as follows: Figure 4 (Top view) and Figure 5 As shown in the AA cross-sectional view, the chip carrier has grooves to facilitate the placement and removal of chips using a PTFE spatula of matching size; positioning pins are added to the chip carrier to prevent the chips from moving freely during transportation and making hard contact with the carrier. Figure 4 In the chip carrier, the length M of the position slot and the spacing N of the positioning pin can be selected and replaced according to the actual use.

[0018] The second embodiment of the present invention provides a method for using a non-destructive carrier for an infrared detector chip, which is a possible application of the first embodiment described above. (See also...) Figure 4 Specifically, it includes: Open the top cover of the carrier box, determine the chip size, and select a carrier board with a high degree of matching with the size of the chip to be placed and place it into the carrier box; Use a polytetrafluoroethylene shovel to pick up the chip to be transported and place it into the positioning slot of the chip carrier, aligning it with the positioning pin; After the chip is placed stably, close the top cover of the carrier box and lock the latch between the top and bottom covers; Transport the chip to the next process point, open the top cover of the carrier box, and use a polytetrafluoroethylene spatula to remove the chip for processing. After processing is completed, repeat steps 2)-3) until the chip is fully fabricated.

[0019] Compared with the prior art, this embodiment has at least the following advantages: 1) The embodiments of the present invention can customize the receiving cavity according to infrared detector chips of different sizes, which is flexible and versatile. 2) The guiding cavity and precise positioning design of this invention enable fast and accurate chip placement and removal, resulting in high work efficiency; 3) The chip handling and transfer in this embodiment of the invention are significantly reduced, greatly reducing the risk of human error.

[0020] The embodiments of this application have been described above with reference to the accompanying drawings. However, this application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims. All of these forms are within the protection scope of this application.

Claims

1. An infrared detector chip lossless carrier, characterized in that, include: A chip carrier board is disposed between an upper cover and a lower cover, which are connected by a snap-locking mechanism.

2. The non-destructive carrier for an infrared detector chip of claim 1, wherein, The chip carrier board has a chip positioning slot on its surface, and the width of the positioning slot matches the width of the chip.

3. The non-destructive carrier for infrared detector chips according to claim 2, characterized in that, The position slot is provided with a positioning pin to prevent the chip from moving along the position slot.

4. The non-destructive carrier for infrared detector chips according to claim 3, characterized in that, The location slot has a groove so that there is space between the placed chip and the bottom of the groove.

5. A method for using a non-destructive carrier for an infrared detector chip, characterized in that, include: Step 1: Open the top cover of the infrared detector chip non-destructive carrier, determine the chip size, and select a chip carrier board with a high degree of matching with the size of the chip to be placed. Step 2: Take the chip to be transported into the position slot of the chip carrier and align it with the positioning pin; Step 3: After the chip is placed stably, close the top cover and lock the latching mechanism between the upper and lower covers; Step 4: Transport to the next process point, open the top cover, take out the chip, and repeat steps 2 to 3 after processing is completed until the chip is fully fabricated.

6. The method of using the non-destructive carrier for the infrared detector chip according to claim 5, characterized in that, The placement and removal of the chip are accomplished using a polytetrafluoroethylene spatula.

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