Desorption control method, desorption control system, and transfer method

Abstract

A desorption control method, a desorption control system, and a delivery method are provided herein. The desorption control method may include: providing a substrate and a carrier coupled to each other by an adhesive chuck; pushing the substrate by a desorption needle comprising a pressure sensor and acquiring, by the pressure sensor, pressure data associated with pushing the substrate by the desorption needle; and controlling operation of the desorption needle based on the pressure data.

Description

[0001] Cross-references to related applications

[0002] This application claims priority to and all benefits derived therefrom of Korean Patent Application No. 10-2024-0139683, filed on October 14, 2024, the contents of which are incorporated herein by reference in their entirety. Technical Field

[0003] Various embodiments of this disclosure relate to desorption control methods, desorption control systems, and transport methods (specifically, methods for transporting substrates). Background Technology

[0004] Multiple process steps are performed to manufacture an electronic device, such as a display device. At least some of the process steps are performed in spatially separable process sections. It is necessary to properly transfer the target object (e.g., a substrate) from previous process sections to subsequent process sections. For example, it may be necessary to sufficiently secure the target object to a carrier to prevent damage during transfer between process sections. Furthermore, after the process, techniques are needed to separate the target object from the carrier without damaging it. Summary of the Invention

[0005] Various embodiments of this disclosure relate to desorption control methods, desorption control systems, and methods for transporting substrates, which can improve the reliability of the desorption process relative to the substrate and carrier, thereby preventing damage to the substrate or the like.

[0006] Various embodiments of this disclosure relate to desorption control methods, desorption control systems, and methods for transporting substrates, which can reduce process costs and enable process monitoring with improved user convenience.

[0007] Various embodiments of this disclosure relate to desorption control methods, desorption control systems, and methods for transporting substrates, which can quantitatively analyze whether individual steps of the desorption process have been performed correctly.

[0008] Embodiments of this disclosure may provide a desorption control method, comprising: providing a substrate and a carrier coupled to each other by an adhesive suction cup; pushing the substrate by a desorption needle including a pressure sensor and acquiring pressure data associated with pushing the substrate by the desorption needle by the pressure sensor; and controlling the operation of the desorption needle based on the pressure data.

[0009] In an embodiment, the adhesive suction cup may include a first adhesive suction cup, a second adhesive suction cup, and a third adhesive suction cup arranged sequentially along the desorption direction. The desorption needle may include: a first desorption needle positioned between the first and second adhesive suction cups; and a second desorption needle positioned between the second and third adhesive suction cups. Acquiring pressure data may include acquiring pressure data via a pressure sensor on the second desorption needle while the second desorption needle pushes the substrate. The pressure data acquired by the pressure sensor on the second desorption needle may be expressed as a first curve and a second curve, each representing a pressure value over time. The first curve may indicate the pressure value over time in a first time period, and the second curve may indicate the pressure value over time in a second time period following the first time period. The first curve may have a first peak value of the pressure value, and the second curve may have an initial value and a second peak value of the pressure value, with the first peak value and the initial value differing from each other by a gap value.

[0010] In an embodiment, when the first adhesive suction cup, the second adhesive suction cup, and the third adhesive suction cup are sequentially separated from the substrate along the desorption direction, the time points at which the first time period and the second time period are distinguished from each other can correspond to the time points at which the second adhesive suction cup and the substrate are separated from each other.

[0011] In an embodiment, if the first adhesive suction cup, the second adhesive suction cup, and the third adhesive suction cup do not separate from the substrate sequentially along the desorption direction, the time points at which the first time period and the second time period are distinguished from each other can correspond to the time points at which the third adhesive suction cup and the substrate separate from each other.

[0012] In an embodiment, controlling the operation of the desorption needle may include: in response to determining that the pressure data meets a preset standard, continuing to push the substrate through the second desorption needle.

[0013] In an embodiment, controlling the operation of the desorption needle may include: determining whether a pressure value in a first time period as indicated by the first curve is equal to or greater than a first reference value; in response to determining that the pressure value as indicated by the first curve is equal to or greater than the first reference value, continuing to push the substrate through the desorption needle; and in response to determining that the pressure value as indicated by the first curve is less than the first reference value, determining whether a gap value is equal to or greater than a reference gap value.

[0014] In an embodiment, the desorption control method may further include: in response to determining that the gap value is equal to or greater than a reference gap value, continuing to push the substrate through the desorption needle; and in response to determining that the gap value is less than the reference gap value, determining whether the pressure value in a second time period as indicated by the second curve is equal to or greater than a second reference value.

[0015] In an embodiment, the desorption control method may further include: in response to determining that the pressure value indicated by the second curve is equal to or greater than the second reference value, continuing to push the substrate through the desorption needle; and in response to determining that the pressure value indicated by the second curve is less than the second reference value, providing a warning signal.

[0016] In an embodiment, controlling the operation of the desorption needle may further include: providing an initial value for the re-entry quantity when the second desorption needle initially pushes the substrate; and after providing a warning signal, controlling the second desorption needle to space itself from the substrate, pausing the acquisition of pressure data through the pressure sensor of the second desorption needle, and increasing the re-entry quantity by 1.

[0017] In an embodiment, controlling the operation of the desorption needle may further include: determining whether the re-entry quantity is greater than a set count.

[0018] In an embodiment, the desorption control method may further include: providing an alarm signal in response to determining that the number of re-entries is greater than a set count.

[0019] In an embodiment, the desorption control method may further include: in response to determining that the re-entry quantity is equal to or less than a set count: pushing the substrate through the second desorption needle at a reduced pushing speed; and reacquiring pressure data through a pressure sensor of the second desorption needle.

[0020] Various embodiments of this disclosure relate to a desorption control system, which includes: an adhesive suction cup for attaching a carrier including a pinhole to a substrate; a desorption needle for pushing the substrate in a direction through the pinhole, and the desorption needle includes a pressure sensor for acquiring pressure data; and a controller for receiving the pressure data and controlling the operation of the desorption needle based on the pressure data.

[0021] In an embodiment, the carrier may include a central region and a peripheral region, with the peripheral region formed around the central region and forming a dummy region. The suction cup area, where the pinhole and adhesive suction cup are positioned, may be formed in the central region. The suction cup area may include multiple portions, each extending in one direction.

[0022] In one embodiment, pinholes and adhesive suction cups may be arranged alternately in the suction cup area.

[0023] In an embodiment, the desorption needle may include: a body component including a first end and a second end; a tip provided on the first end and capable of actuating the substrate; and a pressure sensor provided on the second end.

[0024] In an embodiment, the desorption control system may further include: a needle plate, including plate holes, wherein a pressure sensor is located in the plate holes.

[0025] In an embodiment, the desorption control system may further include: a signal amplifier connected to a pressure sensor; and a controller that provides an initial pressure measurement signal to the signal amplifier, receives pressure information from the signal amplifier, and provides an operation control signal to the pressure sensor.

[0026] Various embodiments of this disclosure relate to a transfer method, including: providing a substrate on a carrier; transferring the substrate; coupling the substrate and the carrier via an adhesive suction cup; performing a specific process on the substrate; and performing a desorption process relative to the substrate and the carrier. Performing a desorption process may include performing a plurality of unit desorption processes. Each of the plurality of unit desorption processes may include: providing the substrate and the carrier in a state where the substrate and the carrier are attached to each other via an adhesive suction cup; pushing the substrate with a desorption needle and acquiring pressure data associated with pushing the substrate with the desorption needle via a pressure sensor; and controlling the operation of the desorption needle based on the pressure data.

[0027] In an embodiment, a particular process may include a deposition process. Performing a desorption process may include: performing a first desorption process using a first desorption needle; and performing a second desorption process using a second desorption needle, as operations corresponding to a plurality of unit desorption processes respectively. Attached Figure Description

[0028] Figure 1 This is a schematic diagram illustrating a structure for transferring a substrate and a carrier between process sections according to an embodiment.

[0029] Figure 2 This is a schematic flowchart illustrating a method for transmitting a substrate according to an embodiment.

[0030] Figure 3 , Figure 4 , Figure 7 and Figure 8 This is a schematic cross-sectional view illustrating a method for transferring a substrate for a corresponding process step according to an embodiment.

[0031] Figure 5 and Figure 6 This is a schematic plan view showing a vehicle and a portion of the area overlapping the vehicle according to an embodiment.

[0032] Figure 9 This is a schematic diagram illustrating the desorption control system according to an embodiment.

[0033] Figure 10 This is a flowchart illustrating the steps of performing a desorption process relative to a substrate and a carrier according to an embodiment.

[0034] Figure 11 This is a flowchart illustrating a unit desorption process according to an embodiment.

[0035] Figure 12 The flowchart illustrates in further detail the unit desorption process according to the embodiment.

[0036] Figure 13 This is a graph showing the pressure data measured during the desorption process steps under the condition that the substrate and carrier are normally separated from each other, according to an embodiment.

[0037] Figures 14 to 17 This is a schematic cross-sectional view illustrating the desorption process steps according to an embodiment, where the substrate and carrier are normally separated from each other.

[0038] Figure 18 This is a graph showing the pressure data measured during the desorption process step in the case of abnormal separation between the substrate and the carrier according to an embodiment.

[0039] Figures 19 to 22 This is a schematic cross-sectional view illustrating the desorption process steps according to an embodiment in the case where the substrate and carrier are abnormally separated from each other. Detailed Implementation

[0040] Because this disclosure allows for various changes and numerous embodiments, specific embodiments will be shown in the accompanying drawings and described in detail in the written description. However, this is not intended to limit this disclosure to a particular mode of practice, and it will be understood that all changes, equivalents, and alternatives are included in this disclosure without departing from the spirit and technical scope thereof.

[0041] It will be understood that although the terms “first” and “second” are used herein to describe various elements, these elements should not be limited by these terms. These terms are used to distinguish one element from another. For example, without departing from the teachings of this disclosure, a first element discussed below may be referred to as a second element. Similarly, a second element may be referred to as a first element. In this disclosure, unless the context clearly indicates otherwise, the singular form is intended to include the plural form as well.

[0042] It will also be understood that, when used in this disclosure, the terms "comprising," "including," and "having," etc., indicate the presence of the stated features, integrals, steps, operations, elements, components, and / or combinations thereof, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components, and / or combinations thereof. Furthermore, in cases where a first component, such as a layer, film, region, or plate, is disposed on a second component, the first component may be directly on the second component, or a third component may be located between the first and second components. In some aspects, where a first component, such as a layer, film, region, or plate, is described as being formed on a second component, the surface of the second component on which the first component is formed is not limited to the upper surface of the second component, but may include other surfaces such as the side surface or lower surface of the second component. Conversely, in cases where a first component, such as a layer, film, region, or plate, is below a second component, the first component may be directly below the second component, or a third component may be located between the first and second components.

[0043] Various embodiments of this disclosure relate to desorption control methods, desorption control systems, and methods for transporting substrates. Hereinafter, the desorption control methods, desorption control systems, and methods for transporting substrates according to embodiments will be described with reference to the accompanying drawings.

[0044] Figure 1 This is a schematic diagram illustrating a structure for transferring a substrate SUB and a carrier CR between process sections according to an embodiment.

[0045] Reference Figure 1 The substrate SUB, together with the carrier CR, can be transferred between process sections PS1 and PS2 located at different positions. In an embodiment, the substrate SUB and the carrier CR can be coupled to each other. For example, the substrate SUB and the carrier CR can be physically attached to each other and transferred together.

[0046] The substrate SUB and carrier CR, which are coupled to each other, can be transferred between a first process segment PS1, in which a first process is performed during a first time period, and a second process segment PS2, in which a second process (e.g., a deposition process) is performed during a second time period. The first process and the second process are not limited to a specific example and can refer to different processes performed in the first process segment PS1 and the second process segment PS2, respectively.

[0047] Figure 2 This is a schematic flowchart illustrating a method for transmitting a base SUB according to an embodiment. Figure 3 , Figure 4 , Figure 7 and Figure 8 This is a schematic cross-sectional view illustrating a method for transferring a substrate SUB for a corresponding process step according to an embodiment. Figure 5and Figure 6 This is a schematic plan view showing a vehicle CR and a portion of the area overlapping the vehicle CR according to an embodiment.

[0048] In the description of methods and processes herein, operations may be performed in a different order than those shown and / or described, or in a different order or at different times. Specific operations may also be omitted in the flowchart, one or more operations may be repeated, or additional operations may be added. Based on the example aspects described herein, descriptions such as "can be moved," "can be set," and "can be formed" include methods, processes, and techniques for moving, setting, forming, positioning, and modifying the component.

[0049] Reference Figures 2 to 8 The method for transferring a substrate SUB according to an embodiment may include a process procedure that includes moving the substrate SUB using a carrier CR, performing a process (e.g., a deposition process) on the substrate SUB, and then separating the substrate SUB from the carrier CR. For example, the method for transferring a substrate SUB may include a process procedure in which a substrate SUB provided separately from the carrier CR is moved using a carrier CR and then the substrate SUB is separated from the carrier CR.

[0050] In an embodiment, the method of transferring the substrate SUB may include step S200 of providing the substrate SUB on the carrier CR, step S400 of transferring the substrate SUB, step S600 of performing a specific process on the substrate SUB, and step S800 of performing a desorption process relative to the substrate SUB and the carrier CR.

[0051] Reference Figures 2 to 6 In step S200, where the substrate SUB is provided on the carrier CR, the substrate SUB and the carrier CR can be coupled to each other via adhesive suction cup PSC.

[0052] In an embodiment, the delivery device for delivering the substrate SUB may include a carrier CR, an adhesive suction cup PSC, a needle substrate PBS, and an adhesive needle PPN.

[0053] The substrate SUB can be a component provided for manufacturing electronic devices (e.g., display devices, etc.). The substrate SUB can be a substrate provided for placing (e.g., forming) multiple layers thereon. In embodiments, the substrate SUB can be a rigid substrate or a flexible substrate. For example, the substrate SUB can include glass, silicon, sapphire, gallium arsenide (GaAs), or silicon carbide (SiC), etc. However, this disclosure is not limited to the foregoing examples.

[0054] The carrier CR can be an assembly coupled to the base SUB to transport the base SUB. The carrier CR can include rigid materials such as various metals and plastics, and can have a relatively flat surface. However, this disclosure is not limited to the specific examples.

[0055] The carrier CR may include pinhole pH. Multiple pinhole pH can be provided. The pinhole pH may extend through the carrier CR in the thickness direction (e.g., on the third-direction DR3). The pinhole pH may be a region that provides desorption needle PN in subsequent processes.

[0056] The carrier CR may include an intermediate region MA and an outer region PA. The intermediate region MA may be an inner region, and the outer region PA may be formed around the intermediate region MA. In an embodiment, the outer region PA may be a dummy region and may be a region that does not overlap with the substrate SUB.

[0057] The suction cup region PSA can be formed in the intermediate region MA. The suction cup region PSA formed in the intermediate region MA can be the region in which the adhesive suction cup PSC and the pinhole PH are formed (e.g., positioned). In an embodiment, the suction cup region PSA can be partially formed in the intermediate region MA. For example, the suction cup region PSA can include multiple portions, each extending in one direction. The intermediate region MA can include multiple regions separated by the suction cup region PSA. For example, a portion of the suction cup region PSA can extend in a first direction DR1, and another portion of the suction cup region PSA can extend in a second direction DR2. The intermediate region MA can include multiple regions separated by portions of the suction cup region PSA. Here, the extent of the portion where the suction cup region PSA is positioned is not limited to the foregoing example.

[0058] In the suction cup area PSA, adhesive suction cups PSC and pinholes PH can be arranged alternately. For example, each adhesive suction cup PSC can be positioned between adjacent pinholes PH, and each pinhole PH can be positioned between adjacent adhesive suction cup PSC.

[0059] The term "adjacent" as used herein can refer to elements that are relatively close to each other (e.g., within a target distance). In other cases, the term "adjacent" as used herein can refer to elements that are in contact with each other. In some cases, the term "adjacent" as used herein can refer to multiple elements of the same type, wherein another element of the same type is not disposed between the multiple elements. For example, for a pinhole PH described as adjacent to another pinhole PH, the other pinhole PH is not between the adjacent pinhole PHs.

[0060] The adhesive suction cup PSC can be attached to or detached from the substrate SUB using physical adhesive force. The adhesive suction cup PSC can be placed on a carrier CR and can be formed (or positioned) in an area adjacent to the pinhole PH. For example, the adhesive suction cup PSC can be positioned between adjacent pinhole PHs.

[0061] The needle substrate PBS and adhesive needle PPN can push the upper surface of the substrate SUB, so that the substrate SUB and adhesive suction cup PSC can be tightly coupled to each other.

[0062] The needle matrix PBS can extend in the direction of the plane on which the carrier CR is placed. The needle matrix PBS can form the area (e.g., matrix) where the adhesive needle PPN is located.

[0063] Adhesive pins (PPNs) can be provided on the surface of a needle substrate PBS. Multiple adhesive pin PPNs can be provided. The adhesive pin PPNs can extend in the thickness direction of the needle substrate PBS (e.g., in the third direction DR3). The free end FE of each of the adhesive pin PPNs can be oriented towards the substrate SUB. In an embodiment, the adhesive pin PPNs are formed at positions corresponding to the respective adhesive chucks (PSCs).

[0064] In step S200, a base SUB can be placed to contact the adhesive suction cup PSC on the carrier CR. For example, the rear surface of the base SUB can be directly adjacent to the adhesive suction cup PSC.

[0065] In step S200, the adhesive pin PPN and the substrate SUB can be adjacent to each other, and the adhesive pin PPN can push the upper surface of the substrate SUB. For example, the free end FE of the adhesive pin PPN can contact the upper surface of the substrate SUB. Therefore, the substrate SUB and the adhesive suction cup PSC can be tightly bonded to each other, and the substrate SUB can be coupled to the carrier CR. The rear surface of the substrate SUB can be coupled to each of the adhesive suction cups PSC.

[0066] Together Figure 1 Reference Figure 2 and Figure 7 At step S400, when transferring the substrate SUB, the method may include transferring the substrate SUB and the carrier CR from the first process section PS1 to the second process section PS2.

[0067] At step S400, the method may include maintaining the substrate SUB and the carrier CR in a coupled state using an adhesive suction cup PSC. The carrier CR can sufficiently fix the position of the substrate SUB.

[0068] Reference Figure 2 and Figure 7At step S600, where a specific process is performed on the substrate SUB, the method may include performing a specific process on the substrate SUB that has been transferred to the second process segment PS2.

[0069] At step S600, the method may include performing various processes on the substrate SUB. For example, a deposition process may be performed on the substrate SUB that has already been transferred to the second process segment PS2. However, this disclosure is not limited to the foregoing examples.

[0070] At step S600, the method may include maintaining the substrate SUB and the carrier CR in a coupled state by using an adhesive suction cup PSC.

[0071] Reference Figure 2 and Figure 8 At step S800, in which the desorption process is performed relative to the substrate SUB and the carrier CR, the method may include pushing the rear surface of the substrate SUB by the desorption needle PN, and the substrate SUB and the carrier CR may be spaced apart from each other (e.g., separated from each other).

[0072] In an embodiment, the conveying device may include a needle plate PP and a desorption needle PN.

[0073] The needle plate PP can extend in the direction of the plane on which the carrier CR is placed. The needle plate PP can form the region (e.g., the matrix) where the desorption needle PN is located. The needle plate PP can include a relatively rigid material. However, this disclosure is not limited to the foregoing examples.

[0074] The needle plate PP may be provided with a plate hole TH that extends through the needle plate PP. Multiple plate holes TH may be provided. The plate hole TH may extend through the needle plate PP in the thickness direction (e.g., in the third direction DR3). The description herein of an element (e.g., the needle plate PP) "may be provided with" another element (e.g., an opening, a plate hole TH) includes a description of said other element being formed in or on said element.

[0075] In an embodiment, the plate aperture TH can form a region in which at least a portion of the desorption needle PN (e.g., pressure sensor FS) is positioned. In an embodiment, the pressure sensor FS can be housed within the plate aperture TH. The pressure sensor TS can obtain relatively clear information about the pressure transmitted to the desorption needle PN.

[0076] Embodiments of this disclosure may include controlling the desorption needle PN to push the rear surface of the substrate SUB such that the adhesion between the substrate SUB and the adhesive suction cup PSC can be released. For example, the desorption needle PN (e.g., the body component BD and the tip TP) may be movable in an upward and downward direction (e.g., third-direction DR3).

[0077] The description of the movement or being moved of the desorption needle PN in one direction in this document may include the control of the movement of the desorption needle PN in the process described herein by using equipment (e.g., a controller).

[0078] The desorption needle PN may include a main body component BD, a tip TP, a pressure sensor FS, and a support component SP.

[0079] The main component BD can support the entire structure of the desorption needle PN. The main component BD can extend in the thickness direction of the carrier CR (e.g., third-direction DR3). The main component BD can include polyetheretherketone (PEEK). However, this disclosure is not limited to the foregoing examples. The main component BD can include a first end EP1 oriented toward the substrate SUB and a second end EP2 oriented toward the pressure sensor FS.

[0080] A tip TP may be provided on a first end EP1 of the body component BD. The tip TP may abut the rear surface of the substrate SUB. The tip TP may be moved such that the tip TP is directly adjacent to (e.g., in contact with) the substrate SUB. Depending on the operation of the desorption needle PN, the tip TP may extend (or move) toward (or move toward) the substrate SUB and abut the substrate SUB, or move away from the substrate SUB. The tip TP may comprise a synthetic rubber (e.g., a fluoropolymer elastomer). However, this disclosure is not limited to the foregoing examples.

[0081] A pressure sensor FS can be provided on a second end EP2 of the body component BD. The pressure sensor FS can acquire pressure data generated from the substrate SUB and the region adjacent to the substrate SUB (e.g., the region connected to the substrate SUB). In an embodiment, the pressure sensor FS can be connected to the body component BD via the second end EP2. For example, pressure generated on the substrate SUB (or pressure generated on the substrate) can be transmitted to the pressure sensor FS via the tip TP and the body component BD. The pressure sensor FS can acquire information (e.g., data) about the pressure generated on the substrate SUB. The pressure sensor FS can be formed using a quartz material. However, this disclosure is not limited to the foregoing examples.

[0082] In this embodiment, at least a portion of the pressure sensor FS may be positioned within the plate aperture TH. Therefore, as described herein, the risk of pressure data acquired by the pressure sensor FS being altered by external influences can be reduced, and the reliability of the acquired pressure data can be enhanced.

[0083] The support member SP can support the lower part of the pressure sensor FS and the lower part of the main body component BD. For example, the support member SP can include a rigid material. The support member SP can extend to have a relatively large surface area and can cover the entirety of a single plate hole TH.

[0084] The desorption needle PN can move in both upward and downward directions (e.g., third-direction DR3). In an example where the desorption needle PN moves upward, the tip TP can push against one surface of the substrate SUB. In an example where the desorption needle PN moves downward, the tip TP can move away from the substrate SUB, or the amount by which the tip TP pushes against the substrate SUB can be reduced.

[0085] At step S800, the desorption needle PN can sequentially push the surface of the substrate SUB. Therefore, the adhesive suction cup PSC can be sequentially spaced apart from the substrate SUB. For example, the desorption needle PN can sequentially push the substrate SUB in the desorption direction DR_D, such that the adhesive state between the substrate SUB and the adhesive suction cup PSC arranged in the desorption direction DR_D can be sequentially released.

[0086] In this embodiment, the distance that the desorption needle PN pushes the substrate SUB at a previous time point can be greater than the distance that another desorption needle PN pushes the substrate SUB at a subsequent time point. Therefore, within a specific time period, the tip TP of the desorption needle PN that pushes the substrate SUB at the previous time point can be formed at a higher position than the tip TP of the other desorption needle PN that pushes the substrate SUB at a subsequent time point. In this case, the substrate SUB can form a step difference ST with varying heights across different regions.

[0087] Experimentally, the desorption needle PN can sequentially push the substrate SUB along the desorption direction DR_D, and a step difference ST can form as the process progresses. To prevent the risk of damage to the substrate SUB due to the step difference ST, it may be necessary to move the adhesive chuck PSC sequentially away from the substrate SUB along the desorption direction DR_D. For example, if, based on the desorption direction DR_D, the adhesive chuck PSC at a later position moves away from the substrate SUB earlier than the adhesive chuck PSC at a previous position, excessive stress may be applied to the substrate SUB.

[0088] In an embodiment, a desorption control system SYS (see [reference]) can be provided to prevent the aforementioned risks. Figure 9 Details will be described later.

[0089] Figure 9 This is a schematic diagram illustrating the desorption control system SYS according to an embodiment.

[0090] Reference Figure 9 The desorption control system SYS according to the embodiment may include the aforementioned transfer device (e.g., carrier CR, adhesive suction cup PSC, and desorption needle PN), and may also include controller CON and signal amplifier AMP.

[0091] In this embodiment, the carrier CR can be coupled to the substrate SUB via each of the adhesive suction cups PSC. A desorption needle PN, including a pressure sensor FS, can be configured to apply pressure to a portion of the substrate SUB not connected to the adhesive suction cups PSC. The desorption needle PN can push the substrate SUB in a region located between adjacent adhesive suction cups PSC. Therefore, the pressure sensor FS can acquire pressure data generated from the region adjacent to the corresponding desorption needle PN.

[0092] For example, the pressure sensor FS can acquire pressure data generated due to the adhesion and release between the substrate SUB and the adhesive suction cup PSC adjacent to the corresponding desorption needle PN. In an embodiment, based on the pressure data acquired by the pressure sensor FS, the adhesion and release states between the substrate SUB and the adjacent adhesive suction cup PSC can be analyzed.

[0093] In this embodiment, each of the pressure sensors FS can be connected to a corresponding signal amplifier AMP. The signal amplifier AMP can receive pressure data acquired by the pressure sensors FS and can transmit pressure information PI to the controller CON based on the received pressure data. For example, the signal amplifier AMP can amplify the received pressure data to obtain the pressure information PI.

[0094] In embodiments, the signal amplifier AMP can receive pressure data (e.g., analog signals) from the pressure sensor FS via various connection methods. For example, the signal amplifier AMP can receive pressure data via a serial communication method (e.g., RS-232C method). However, this disclosure is not limited to the foregoing examples.

[0095] The controller CON can be configured to control the overall operation of the desorption control system SYS. For example, the controller CON can be implemented as hardware, software, or a combination thereof. Unless otherwise stated, the overall operation of the desorption control system SYS can be understood as being controlled by the controller CON.

[0096] The controller CON may include a first controller CON1, a second controller CON2, and a third controller CON3. In embodiments, the first controller CON1, the second controller CON2, and the third controller CON3 may be electrically connected to each other and provide electrical signals to each other or other components. For example, the first controller CON1, the second controller CON2, and the third controller CON3 may be connected to each other based on an Ethernet method, but this disclosure is not limited thereto.

[0097] The first controller CON1 can provide a pressure measurement initial signal IS (e.g., a digital signal) to the pressure sensor FS via a signal amplifier AMP. When the pressure measurement initial signal IS is applied to the pressure sensor FS, the pressure sensor FS can acquire pressure data including information about the pressure generated on the substrate SUB.

[0098] The first controller CPN1 can be a programmable logic controller (PLC). For example, the first controller CON1 relates to a process automation control device and can control the operation of components.

[0099] The second controller CON2 can receive pressure information PI from the signal amplifier AMP, and can receive general information SI from the first controller CON1 regarding the operating status of the substrate SUB and the components surrounding the substrate SUB. For example, the general information SI may include the operating status and height of the desorption needle PN, and the status of the substrate SUB and the carrier CR, etc. This disclosure is not limited to specific examples. The second controller CON2 can synthesize the received information and transmit the synthesized information GI to the third controller CON3.

[0100] The second controller CON2 can be a modular controller. For example, the second controller CON2 can be a controller that includes multiple modules.

[0101] The third controller CON3 can receive synthesis information GI and control the operation of components based on data such as process data. The third controller CON3 can be a manufacturing execution system (MES). However, this disclosure is not limited to the foregoing example.

[0102] In this embodiment, the controller CON can control the operation of the desorption needle PN based on pressure data acquired by the pressure sensor FS. For example, the controller CON can provide an operation control signal CS to the desorption needle PN, and the operating state of the desorption needle PN can be changed based on the operation control signal CS. For the foregoing, refer to... Figure 10 And the accompanying diagrams provide further details.

[0103] Reference Figures 10 to 22 A desorption control method according to an embodiment is described. For ease of explanation, descriptions that are repeated herein will be simplified or omitted.

[0104] Figures 10 to 22 The step S800 of performing the above desorption process relative to the substrate SUB and the carrier CR is shown.

[0105] Figure 10 This is a flowchart illustrating the steps of performing a desorption process relative to a substrate SUB and a carrier CR according to an embodiment. Figure 10 Multiple unit desorption processes (DC) are shown. Figure 11 This is a flowchart illustrating the unit desorption process DC according to an embodiment. Figure 12 The flowchart of the unit desorption process DC according to the embodiment is shown in further detail.

[0106] Figure 13 It is a graph showing the pressure data measured during the desorption process step under the condition that the substrate SUB and the carrier CR are normally moved away from each other (normally separated from each other) according to the embodiment. Figures 14 to 17 This is a schematic cross-sectional view illustrating the desorption process steps according to an embodiment, where the substrate SUB and the carrier CR are normally moving away from each other.

[0107] Figure 18 This is a graph showing the pressure data measured during the desorption process step when the substrate SUB and the carrier CR are abnormally moved away from each other (abnormally separated from each other) according to an embodiment. Figures 19 to 22 This is a schematic cross-sectional view illustrating the desorption process steps according to an embodiment, where the substrate SUB and the carrier CR are abnormally far apart from each other.

[0108] Reference Figure 10 The step S800, which involves performing a desorption process relative to the substrate SUB and the carrier CR, may include multiple unit desorption processes DC.

[0109] In one embodiment, the substrate SUB and the carrier CR can be coupled to each other via multiple adhesive suction cups PSC. To perform a desorption process relative to the substrate SUB and the carrier CR, the method may include controlling multiple desorption needles PN such that the multiple desorption needles PN push against the substrate SUB.

[0110] In embodiments, the method may include using each of the desorption needles PN associated with performing a corresponding desorption process. For example, any one of the desorption needles PN may perform a single desorption process, and another of the desorption needles PN may perform a different desorption process. While each of the desorption needles PN performs a desorption process, multiple unit desorption processes DC may be performed sequentially.

[0111] For example, step S800, which performs a desorption process relative to the substrate SUB and the carrier CR, may include step S820, which performs a first desorption process using a first desorption needle, and step S840, which performs a second desorption process using a second desorption needle. Step S800, which performs a desorption process relative to the substrate SUB and the carrier CR, may also include additional multiple unit desorption processes DC. The number of unit desorption processes DC may vary depending on the number of desorption needles PN, and is not limited to a specific example.

[0112] During the unit desorption process DC, the method may include using a desorption needle PN associated with pushing a substrate SUB such that at least a portion of the substrate SUB moves away from the adhesive chuck PSC, and the method may include controlling the operation of the desorption needle PN based on pressure data acquired by a pressure sensor FS.

[0113] For example, refer to Figure 11 The unit desorption process DC may include step S8000 of providing a substrate SUB and a carrier CR that are attached to each other by an adhesive suction cup PSC, step S8200 of pushing the substrate SUB by a desorption needle PN and acquiring pressure data by a pressure sensor FS, and step S8300 of controlling the operation of the desorption needle PN based on the pressure data.

[0114] In an embodiment, the method may include using a desorption needle PN to release the adhesive state between the adhesive suction cup PSC and the substrate SUB, and the method may include determining whether excessive stress is generated on the substrate SUB based on pressure data acquired by a pressure sensor FS according to a preset standard.

[0115] In one embodiment, based on pressure data, the method may include controlling the actuation speed of the desorption needle PN. For example, based on pressure data, the method may include reducing the actuation speed.

[0116] In an embodiment, based on pressure data, if the method determines that there is a possibility that the desorption process has abnormally occurred, the method may include providing a warning signal to the user.

[0117] In one embodiment, based on pressure data, the method may include pausing the pushing operation of the desorption needle PN.

[0118] In an embodiment, if the method determines, based on pressure data, that there is a possibility that the desorption process has abnormally occurred, the method may include providing a warning signal to the user.

[0119] Therefore, the method may include controlling the operation of the desorption needle PN based on the acquired pressure data, thereby reducing the process risks that may arise if the desorption process proceeds abnormally.

[0120] For example, the method may include controlling the driving speed of the desorption needle PN to reduce the risk of damage to the substrate SUB.

[0121] In addition, warning and alarm signals can be provided to users to provide notifications, based on which users can clearly understand whether they need to check the current progress of the desorption process.

[0122] In some respects, the driving operation of the desorption needle PN can be paused as the desorption process proceeds, thereby reducing the risk of damage to the substrate SUB due to abnormal execution of the desorption process.

[0123] Therefore, the reliability of the desorption process relative to the substrate SUB and the carrier CR can be enhanced, and the process yield can be improved, thereby reducing the process cost.

[0124] Reference Figure 12 The unit desorption process DC according to the embodiments is described in more detail with the accompanying drawings.

[0125] Reference Figure 12 The unit desorption process DC may include: step S8000 of providing a substrate SUB and a carrier CR attached to each other by an adhesive suction cup PSC; step S8200 of pushing the substrate SUB by a desorption needle PN and acquiring pressure data by a pressure sensor FS; and step S8300 of controlling the operation of the desorption needle PN based on the pressure data, and may also include step S8100 of providing an initial value for the re-entry quantity.

[0126] Step S8300, which controls the operation of the desorption needle PN based on pressure data, may include: step S8310, determining whether a first pressure value is equal to or greater than a first reference value; step S8320, determining whether a gap value is equal to or greater than a reference gap value; step S8330, determining whether a second pressure value is equal to or greater than a second reference value; step S8340, continuing to push the substrate SUB using the desorption needle PN and performing the desorption process; step S8350, providing a warning signal; step S8360, separating the desorption needle PN from the substrate SUB, pausing the acquisition of pressure data through the pressure sensor FS, and increasing the re-entry number by 1; step S8370, determining whether the re-entry number is greater than a set count; and step S8380, providing an alarm signal.

[0127] In an embodiment, during the unit desorption process DC, the desorption needle PN can sequentially push the substrate SUB along the desorption direction DR_D.

[0128] Here, assuming the desorption process is performed normally (e.g., refer to...), Figures 13 to 17 The adhesive suction cup PSC can sequentially separate from the substrate SUB along the desorption direction DR_D (e.g., spaced apart). However, in cases where the desorption process is performed abnormally (e.g., refer to...), Figures 18 to 22 At least some of the adhesive suction cups PSC may not be able to separate from the substrate SUB sequentially along the desorption direction DR_D (e.g., spaced apart).

[0129] In the embodiments, when the desorption process is executed normally, the unit desorption process DC can be performed according to the appropriate corresponding process steps. When the desorption process is executed abnormally, the unit desorption process DC can also be performed according to the appropriate corresponding process steps.

[0130] In the embodiments, the detailed steps of the unit desorption process DC can be performed. Certain steps can be performed when the desorption process is executed normally, and certain other steps can be performed when the desorption process is executed abnormally.

[0131] Figures 13 to 22 An embodiment is shown in which, along the desorption direction DR_D, a first desorption needle PN1 performs a desorption process (e.g., a unit desorption process DC), and thereafter, a second desorption needle PN2 performs a desorption process (e.g., a unit desorption process DC).

[0132] Figure 13 and Figure 18 This is a graph showing the pressure values ​​over time obtained by the pressure sensor FS formed in the second desorption needle PN2. Figure 13 and Figure 18 The trend of pressure data measured by pressure sensor FS over time is schematically shown.

[0133] Under normal desorption conditions, the first adhesive chuck PSC1 separates from the substrate SUB, followed by the second adhesive chuck PSC2, and then the third adhesive chuck PSC3. However, if the desorption process is executed abnormally, the order of separation operations between at least some of the adhesive chucks and the substrate SUB may be reversed relative to the desorption direction DR_D. For example, the first adhesive chuck PSC1 may separate from the substrate SUB, and subsequently, the third adhesive chuck PSC3 may separate from the substrate SUB before the second adhesive chuck PSC2 separates from it. In this case, it can be determined that the desorption process has been executed abnormally, and appropriate control of the operation of the desorption needle PN is required.

[0134] The description of the separation of the adhesive suction cup (e.g., the first adhesive suction cup PSC1 or the second adhesive suction cup PSC2, etc.) from the substrate SUB in this document can refer to the description of an associated desorption needle PN (e.g., the first desorption needle PN1 or the second desorption needle PN2, etc.) pressing a portion of the substrate SUB so that said portion of the substrate SUB does not come into contact with the adhesive suction cup.

[0135] Reference Figures 12 to 17 This section will describe the detailed steps of the unit desorption process DC assuming the desorption process is executed normally.

[0136] Reference Figure 12 , Figure 14 and Figure 15 At step S8000, where a base SUB and a carrier CR are attached to each other by an adhesive suction cup PSC, the method may include providing a base SUB and a carrier CR coupled to each other.

[0137] In an embodiment, the unit desorption process DC based on the first desorption needle PN1 can be performed before the unit desorption process DC based on the second desorption needle PN2 is performed. For example, the first desorption needle PN1 can push the rear surface of the substrate SUB through the pinhole PH located between the first adhesive chuck PSC1 and the second adhesive chuck PSC2, thereby separating the first adhesive chuck PSC1 from the substrate SUB.

[0138] In this embodiment, the first adhesive suction cup PSC1, the second adhesive suction cup PSC2, and the third adhesive suction cup PSC3 can be arranged sequentially along the desorption direction DR_D. The first desorption needle PN1 can be placed between the first adhesive suction cup PSC1 and the second adhesive suction cup PSC2. The second desorption needle PN2 can be placed between the second adhesive suction cup PSC2 and the third adhesive suction cup PSC3.

[0139] Reference Figure 12 , Figure 14 and Figure 15 At step S8100, where an initial value is provided for the reentry quantity, the method may include providing an initial value of 0 for the reentry quantity, the reentry quantity indicating information about the number of operations of the second desorption needle PN2.

[0140] In this embodiment, with the number of re-entries of the second desorption needle PN2 provided as an initial value, the second desorption needle PN2 can contact a portion of the rear surface of the substrate SUB through the pinhole PH located between the second adhesive chuck PSC2 and the third adhesive chuck PSC3. Therefore, the pressure sensor FS of the second desorption needle PN2 can obtain information about the pressure generated on the substrate SUB through the pinhole PH located between the second adhesive chuck PSC2 and the third adhesive chuck PSC3.

[0141] In an embodiment, the method may include step S8100, which provides an initial value for the re-entry quantity, when the operation of the substrate SUB is initiated (e.g., a first initiation) by pushing it through the second desorption needle PN2.

[0142] Reference Figures 12 to 16In step S8200, where the substrate SUB is pushed by the desorption needle PN and pressure data is acquired by the pressure sensor FS, the method may include controlling the second desorption needle PN2 such that the second desorption needle PN2 contacts a portion of the substrate SUB and pushes the substrate SUB, and (e.g., using the pressure sensor FS) acquiring pressure data generated on the substrate SUB.

[0143] The description of pushing the substrate SUB by the desorption needle PN in this article may include moving or extending the desorption needle PN such that the desorption needle PN pushes the substrate SUB (i.e., applying force to the substrate SUB).

[0144] In this embodiment, after the first desorption needle PN1 pushes the substrate SUB, the pressure sensor FS of the second desorption needle PN2 can continue to acquire pressure data. For example, the pressure sensor FS of the second desorption needle PN2 can measure the pressure data generated on the substrate SUB after the first desorption needle PN1 pushes the substrate SUB.

[0145] For example, refer to Figure 13 The pressure sensor FS of the second desorption needle PN2 can measure the pressure data generated on the substrate SUB during a first time period TS1, and can also measure the pressure data generated on the substrate SUB during a second time period TS2 following the first time period TS1. In an embodiment, the pressure data measured by the pressure sensor FS during the first time period TS1 and the second time period TS2 can be used to control the operation of the second desorption needle PN2.

[0146] Here, the first curve 1200 and the second curve 1400 can indicate the pressure values ​​over time obtained by the desorption needle PN (e.g., the pressure sensor FS of the second desorption needle PN2). Figure 13 In the diagram, the first curve 1200 shows the pressure data measured over time by the second desorption needle PN2 during the first time period TS1. The second curve 1400 shows the pressure data measured over time by the second desorption needle PN2 during the second time period TS2. The first peak value 1240 can be the peak value of the first curve 1200, and the first peak value 1240 can be the pressure value measured at a time point directly adjacent to the second time period TS2 within the first time period TS1. The second peak value 1440 can be the peak value of the second curve 1400, and can be the pressure value measured at the final time point within the second time period TS2. The initial value 1420 can be the initial data of the second curve 1400, and can be the pressure value measured at a time point directly adjacent to the first time period TS1 within the second time period TS2.

[0147] In this embodiment, during the first time period TS1, the second desorption needle PN2 can push the rear surface of the substrate SUB, and the pressure sensor FS of the second desorption needle PN2 can acquire pressure data. During the first time period TS1, the second desorption needle PN2 can contact and push the rear surface of the substrate SUB, and the first desorption needle PN1 can push the rear surface of the substrate SUB, causing the first adhesive suction cup PSC1 and the second adhesive suction cup PSC2 to separate from the substrate SUB. Therefore, in the first curve 1200, the pressure value can increase over time during the first time period TS1. For example, when the first desorption needle PN1 pushes the substrate SUB while the second adhesive suction cup PSC2 remains coupled to the substrate SUB, the magnitude of the stress generated on the substrate SUB can increase, thereby increasing the magnitude of the pressure data measured by the pressure sensor FS of the second desorption needle PN2.

[0148] In one embodiment, while the first desorption needle PN1 supports a portion of the rear surface of the substrate SUB, the second desorption needle PN2 can push the substrate SUB, thereby spacing the second adhesive suction cup PSC2 from the substrate SUB. In one embodiment, immediately before the substrate SUB and the second adhesive suction cup PSC2 separate from each other, the first curve 1200 may have a first peak value 1240. Immediately after the substrate SUB and the second adhesive suction cup PSC2 separate from each other, the stress generated between the second adhesive suction cup PSC2 and the substrate SUB is removed, thereby allowing the initial value 1420 of the second curve 1400 to have a relatively low value. For example, the first peak value 1240 and the initial value 1420 may have a difference of the gap value G. Therefore, when the first adhesive suction cup PSC1, the second adhesive suction cup PSC2, and the third adhesive suction cup PSC3 separate from the substrate SUB sequentially along the desorption direction DR_D, the time point at which the second adhesive suction cup PSC2 and the substrate SUB separate from each other may be the time point at which the first time period TS1 and the second time period TS2 are distinguished from each other.

[0149] In this embodiment, during the second time period TS2, the pressure sensor FS of the second desorption needle PN2 can acquire pressure data, and the second desorption needle PN2 can push the rear surface of the substrate SUB. During the second time period TS2, the second desorption needle PN2 can contact and push the rear surface of the substrate SUB, and the first desorption needle PN1 can support the rear surface of the substrate SUB between the first adhesive suction cup PSC1 and the second adhesive suction cup PSC2. Therefore, in the second curve 1400, the pressure value can increase over time during the second time period TS2. For example, when the second desorption needle PN2 pushes the substrate SUB while the third adhesive suction cup PSC3 remains coupled to the substrate SUB, the magnitude of the stress generated on the substrate SUB can increase, thereby increasing the magnitude of the pressure data measured by the pressure sensor FS of the second desorption needle PN2.

[0150] Reference Figure 12 After the start of the second time period TS2, if the pressure data obtained by the pressure sensor FS of the second desorption needle PN2 meets the preset standard, the method may include step S8340 of continuing to push the substrate SUB with the desorption needle PN and performing the desorption process.

[0151] For example, the step of determining whether the pressure data acquired by the pressure sensor FS meets the preset standard may include step S8310 of determining whether the first pressure value is equal to or greater than the first reference value, step S8320 of determining whether the gap value is equal to or greater than the reference gap value, and step S8330 of determining whether the second pressure value is equal to or greater than the second reference value.

[0152] In an embodiment, at step S8310 of determining whether the first pressure value is equal to or greater than the first reference value, the method may include determining whether the pressure value obtained by the pressure sensor FS of the second desorption needle PN2 during the first time period TS1 is equal to or greater than the first reference value.

[0153] The first reference value can be a preset reference value, and is not limited to a specific value. The first reference value can be experimentally obtained data, and can be determined based on the pressure value obtained by the pressure sensor FS of the second desorption needle PN2 in the event that the desorption process proceeds abnormally.

[0154] If the pressure value obtained by the pressure sensor FS of the second desorption needle PN2 during the first time period TS1 (e.g., the pressure value at the selected time point in the first time period TS1 of the first curve 1200) is less than the first reference value, the second desorption needle PN2 can continue to push the substrate SUB and perform the desorption process (i.e., step S8340).

[0155] If the pressure value obtained by the pressure sensor FS of the second desorption needle PN2 during the first time period TS1 is equal to or greater than the first reference value, the step S8320 of determining whether the gap value is equal to or greater than the reference gap value can be performed.

[0156] In an embodiment, at step S8320 of determining whether the gap value is equal to or greater than the reference gap value, the method may include determining that the gap value G is equal to or greater than the reference gap value.

[0157] The reference gap value can be a preset reference value, and is not limited to a specific value. The reference gap value can be experimentally obtained data, and can be determined based on the pressure value that can be obtained by the pressure sensor FS of the second desorption needle PN2 under abnormal desorption process conditions.

[0158] If the gap value G is less than the reference gap value, the second desorption needle PN2 can continue to push the substrate SUB and carry out the desorption process (i.e., step S8340).

[0159] If the clearance value G is equal to or greater than the reference clearance value, step S8330 of determining whether the second pressure value is equal to or greater than the second reference value can be performed.

[0160] In an embodiment, at step S8330 of determining whether the second pressure value is equal to or greater than the second reference value, the method may include determining whether the pressure value obtained by the pressure sensor FS of the second desorption needle PN2 during the second time period TS2 is equal to or greater than the second reference value.

[0161] The second reference value can be a preset reference value, and is not limited to a specific value. The second reference value can be experimentally obtained data, and can be determined based on the pressure value obtained by the pressure sensor FS of the second desorption needle PN2 in the event that the desorption process proceeds abnormally.

[0162] If the pressure value obtained by the pressure sensor FS of the second desorption needle PN2 during the second time period TS2 (e.g., the pressure value at the selected time point in the second time period TS2 of the second curve 1400) is less than the second reference value, the second desorption needle PN2 can continue to push the substrate SUB and perform the desorption process (i.e., step S8340).

[0163] If the pressure value obtained by the pressure sensor FS of the second desorption needle PN2 during the second time period TS2 is equal to or greater than the second reference value, the method can determine that the desorption process is proceeding abnormally, and the method can include performing subsequent process steps.

[0164] because Figures 13 to 17 The description shows that the adsorption process is proceeding normally, so it will be provided based on the situation where at least one of the steps S8310 (determining whether the first pressure value is equal to or greater than the first reference value), S8320 (determining whether the gap value is equal to or greater than the reference gap value), and S830 (determining whether the second pressure value is equal to or greater than the second reference value) determines that the pressure data meets the preset standard, so that step S8340 is performed to continue pushing the substrate SUB with the desorption needle PN and carry out the desorption process.

[0165] Reference Figure 12 and Figure 17In step S8340, where the substrate SUB is continued to be pushed using the desorption needle PN and the desorption process is performed, the second desorption needle PN2 can push the substrate SUB, and the third adhesive suction cup PSC3 can separate from the substrate SUB. Therefore, the first adhesive suction cup PSC1 to the third adhesive suction cup PSC3 formed around the first desorption needle PN1 and the second desorption needle PN2 can separate from the substrate SUB.

[0166] As described in this paper, the first adhesive suction cup PSC1 to the third adhesive suction cup PSC3 can be sequentially separated from the substrate SUB along the desorption direction DR_D, so that the obtained pressure data can be determined to meet the preset standard, thus enabling the desorption process to be carried out in sequence appropriately.

[0167] Reference Figure 12 as well as Figures 18 to 22 This section will describe the detailed steps of the unit desorption process DC in the case of abnormal execution of the desorption process. For ease of explanation, descriptions that are repeated in this document will be simplified or omitted.

[0168] Reference Figure 12 , Figure 19 and Figure 20 At step S8000, where a substrate SUB and a carrier CR are attached to each other via adhesive suction cups PSC, the method may include providing a substrate SUB and a carrier CR coupled to each other. In an embodiment, a first desorption needle PN1 can push the rear surface of the substrate SUB through a pinhole PH located between the first adhesive suction cup PSC1 and the second adhesive suction cup PSC2, thereby spaced the first adhesive suction cup PSC1 from the substrate SUB.

[0169] Reference Figure 12 , Figure 19 and Figure 20 At step S8100, where an initial value is provided for the reentry quantity, the method may include providing an initial value of 0 for the reentry quantity, the reentry quantity indicating information about the number of operations performed with the second desorption needle PN2. In an embodiment, the second desorption needle PN2 may obtain information about the pressure generated on the substrate SUB through a pinhole PH located between the second adhesive chuck PSC2 and the third adhesive chuck PSC3.

[0170] Reference Figure 12 and Figures 18 to 22 In step S8200, where the substrate SUB is pushed by the desorption needle PN and pressure data is acquired by the pressure sensor FS, the method may include controlling the second desorption needle PN2 to contact a portion of the substrate SUB and push the substrate SUB, and (e.g., via the pressure sensor FS) acquiring pressure data generated on the substrate SUB.

[0171] Reference Figure 18 The method may include measuring pressure data generated on the substrate SUB using a pressure sensor FS of the second desorption needle PN2 during a first time period TS1' and a second time period TS2' following the first time period TS1'. In an embodiment, the method may include controlling the operation of the second desorption needle PN2 based on the pressure data measured by the pressure sensor FS during the first time period TS1' and the second time period TS2'.

[0172] exist Figure 18 In the diagram, the first curve 1200' shows the pressure data measured over time by the second desorption needle PN2 during the first time period TS1'. The second curve 1400' shows the pressure data measured over time by the second desorption needle PN2 during the second time period TS2'. The first peak 1240' can be the peak value of the first curve 1200', and can also be the pressure value measured at a time point directly adjacent to the second time period TS2' within the first time period TS1'. The second peak 1440' can be the peak value of the second curve 1400', and can also be the pressure value measured at the final time point within the second time period TS2'. The initial value 1420' can be the initial data of the second curve 1400', and can also be the pressure value measured at a time point directly adjacent to the first time period TS1' within the second time period TS2'.

[0173] In this embodiment, during the first time period TS1', the pressure sensor FS of the second desorption needle PN2 can acquire pressure data, and the second desorption needle PN2 can push the rear surface of the substrate SUB. During the first time period TS1', the second desorption needle PN2 can contact and push the rear surface of the substrate SUB, and the first desorption needle PN1 can push the rear surface of the substrate SUB so that the first adhesive suction cup PSC1 can separate from the substrate SUB. Therefore, in the first curve 1200', the pressure value can increase over time during the first time period TS1'.

[0174] In one embodiment, while the first desorption needle PN1 supports a portion of the rear surface of the substrate SUB, the second desorption needle PN2 can push the substrate SUB, thereby spaced the second adhesive suction cup PSC2 from the substrate SUB. In another embodiment, immediately before the substrate SUB and the second adhesive suction cup PSC2 separate from each other, the first curve 1200' may have a first peak value 1240'. Immediately after the substrate SUB and the second adhesive suction cup PSC2 separate from each other, the stress generated between the second adhesive suction cup PSC2 and the substrate SUB is removed, thereby allowing the initial value 1420' of the second curve 1400' to have a relatively low value. For example, the first peak value 1240' and the initial value 1420' may have a difference of the gap value G'. Therefore, when the first adhesive suction cup PSC1, the second adhesive suction cup PSC2, and the third adhesive suction cup PSC3 do not separate from the substrate SUB in the order of the desorption direction DR_D (for example, when the first adhesive suction cup PSC1, the second adhesive suction cup PSC2, and the third adhesive suction cup PSC3 separate from the substrate SUB in the order of the first adhesive suction cup PSC1, the third adhesive suction cup PSC3, and the second adhesive suction cup PSC2), the time point at which the third adhesive suction cup PSC3 separates from the substrate SUB can be the time point at which the first time period TS1 and the second time period TS2 are distinguished from each other.

[0175] In this embodiment, during the second time period TS2', the pressure sensor FS of the second desorption needle PN2 can acquire pressure data, and the second desorption needle PN2 can push the rear surface of the substrate SUB. During the second time period TS2', the second desorption needle PN2 can contact and push the rear surface of the substrate SUB, and the first desorption needle PN1 can support the rear surface of the substrate SUB at a position adjacent to the first adhesive suction cup PSC1. Therefore, in the second curve 1400', the pressure value can increase over time during the second time period TS2'.

[0176] Reference Figure 12 After the start of the second time period TS2', if the pressure data obtained by the pressure sensor FS of the second desorption needle PN2 meets the preset standard, the method may include step S8340 of continuing to push the substrate SUB with the desorption needle PN and performing the desorption process.

[0177] For example, according to an embodiment, the step of determining whether the pressure data acquired by the pressure sensor FS meets the preset standard may include step S8310 of determining whether the first pressure value is equal to or greater than the first reference value, step S8320 of determining whether the gap value is equal to or greater than the reference gap value, and step S8330 of determining whether the second pressure value is equal to or greater than the second reference value.

[0178] In an embodiment, at step S8310 of determining whether the first pressure value is equal to or greater than the first reference value, the method may include determining whether the pressure value obtained by the pressure sensor FS of the second desorption needle PN2 during the first time period TS1' is equal to or greater than the first reference value.

[0179] In an embodiment, if the pressure value obtained by the pressure sensor FS of the second desorption needle PN2 during the first time period TS1' is equal to or greater than the first reference value, the step S8320 of determining whether the gap value is equal to or greater than the reference gap value can be performed.

[0180] In an embodiment, during a first time period TS1', when the first desorption needle PN1 pushes the substrate SUB to separate the second adhesive suction cup PSC2 from the substrate SUB, the pressure sensor FS of the second desorption needle PN2 can measure pressure data. Here, if the second adhesive suction cup PSC2 and the substrate SUB are excessively coupled to each other, the second adhesive suction cup PSC2 may not be properly separated from the substrate SUB. Even if the second adhesive suction cup PSC2 and the substrate SUB are not properly separated, relatively high stress may still be generated around the second adhesive suction cup PSC2 due to the push of the substrate SUB by the first desorption needle PN1. In this case, the pressure value measured by the pressure sensor FS of the second desorption needle PN2 during the first time period TS1' may have a relatively high value. Therefore, if the method determines that the pressure value (e.g., the first peak value 1240') obtained by the pressure sensor FS of the second desorption needle PN2 is equal to or greater than a first reference value, the method may include determining that at least some of the adhesive suction cups PSCs (e.g., the second adhesive suction cup PSC2) are abnormally strongly coupled to each other with the substrate SUB, and thus determining that the desorption process has been abnormally performed.

[0181] In an embodiment, when the gap value G' is equal to or greater than the reference gap value, the method may include performing step S8330 of determining whether the second pressure value is equal to or greater than the second reference value.

[0182] In an embodiment, if the desorption process proceeds abnormally, when the first desorption needle PN1 may support a portion of the rear surface of the substrate SUB and the second desorption needle PN2 pushes the substrate SUB, the second adhesive suction cup PSC2 and the substrate SUB may remain coupled to each other, while the third adhesive suction cup PSC3 may separate from the substrate SUB. For example, a normal desorption process might mean that the second adhesive suction cup PSC2 separates from the substrate SUB earlier than the third adhesive suction cup PSC3. However, if the second adhesive suction cup PSC2 is excessively coupled to the substrate SUB, the order of separation between the adhesive suction cups PSC and the substrate SUB may be reversed relative to the desorption direction DR_D. In this case, given the relatively high stress generated between the second adhesive suction cup PSC2 and the substrate SUB, the stress between the third adhesive suction cup PSC3 and the substrate SUB may be removed, resulting in a relatively high gap value G' compared to a normal desorption process. Therefore, when the gap value G' is determined to be equal to or greater than the reference gap value, the method may include determining that the second adhesive suction cup PSC2 and the substrate SUB are abnormally strongly coupled, and thus determining that the desorption process has been abnormally performed.

[0183] In an embodiment, if the pressure value obtained by the pressure sensor FS of the second desorption needle PN2 during the second time period TS2' is equal to or greater than the second reference value, the process can determine that the desorption process is proceeding abnormally, and the method can include performing subsequent process steps.

[0184] In an embodiment, if the desorption process proceeds abnormally, when the first desorption needle PN1 supports a portion of the rear surface of the substrate SUB and the second desorption needle PN2 pushes the substrate SUB, the second adhesive suction cup PSC2 and the substrate SUB may remain coupled to each other, while the third adhesive suction cup PSC3 may separate from the substrate SUB. As a result, relatively high stress may be generated between the second adhesive suction cup PSC2 and the substrate SUB, and the pressure value obtained by the second desorption needle PN2 during the second time period TS2' (e.g., the pressure value at the selected time point in the second time period TS2 of the second curve 1400) may have a relatively high value compared to when the desorption process proceeds normally. Therefore, if the method determines that the second pressure value is equal to or greater than the second reference value, the method may include determining that the second adhesive suction cup PSC2 and the substrate SUB are abnormally strongly coupled to each other and therefore remain coupled during the second time period TS2', and determining that the desorption process has proceeded abnormally.

[0185] Therefore, in the embodiments, by using the pressure sensor FS included in the desorption needle PN, the process can determine whether the desorption process is proceeding normally based on preset standards.

[0186] In an embodiment, if the method determines that the first pressure value is equal to or greater than the first reference value at step S8310, determines that the gap value G' is equal to or greater than the reference gap value at step S8320, and determines that the second pressure value is equal to or greater than the second reference value at step S8330, the method may include performing the step S8350 of providing a warning signal.

[0187] As a result, based on pressure data acquired by the pressure sensor FS, embodiments of this disclosure support clear analysis of whether the desorption process is proceeding normally, and automated equipment can be implemented. Therefore, process yield can be improved, and user convenience can be ensured.

[0188] Furthermore, based on pressure data, the success of the desorption process can be determined by using multiple standards in a series sequence. Therefore, the analytical reliability of the desorption process can be improved.

[0189] At step S8350, where a warning signal is provided, the method may include providing the user with information indicating that the desorption process has been determined to be proceeding abnormally.

[0190] According to embodiments, the warning signal can be an audio signal or a visual signal. For example, in a desorption control system SYS (see...) Figure 9 This may include a warning providing component capable of providing a warning signal. In embodiments, the warning providing component may include an audio providing component and / or a visual providing component (such as a display, for example). In embodiments, the warning providing component may be included in a package comprising a first controller CON1 to a third controller CON3 (see...). Figure 9 In any of the devices of ). However, this disclosure is not limited to the foregoing examples.

[0191] At step S8360, where the desorption needle PN is separated from the substrate SUB, the acquisition of pressure data via the pressure sensor FS is paused, and the re-entry quantity is increased by 1. The desorption process using the second desorption needle PN2 can be paused.

[0192] At step S8360, the first desorption needle PN1 can continue to support the lower portion of the substrate SUB, and the second desorption needle PN2 can separate from the substrate SUB. Therefore, the pushing operation of the second desorption needle PN2 on the substrate SUB can be released, and the pressure measurement operation of the pressure sensor FS of the second desorption needle PN2 on the substrate SUB can be released.

[0193] In an embodiment, the method may include performing step S8360 after step S8350 of providing a warning signal. However, this disclosure is not limited to the foregoing example. For example, the method may include performing step S8360 before step S8350 of providing a warning signal.

[0194] At step S8360, the method may include increasing the number of re-entries in the desorption process for the second desorption needle PN2. Therefore, the number of re-entries can be determined based on the number of times the previous cycle has been performed.

[0195] At step S8370, which determines whether the number of re-entries is greater than a set count, the method may include comparing the number of re-entries with a set count.

[0196] In an embodiment, the set count can be a preset number of times to repeat the previous loop. For example, with a set count of n (n is a natural number of 1 or greater), the previous loop can be repeated (n+1) times.

[0197] At step S8370, in response to determining that the number of re-entries is equal to or less than a set count, the method may include re-executing step S8200 of pushing the substrate SUB with the desorption needle PN and acquiring pressure data with the pressure sensor FS, and subsequently re-executing steps such as determining whether the desorption process is proceeding normally based on the pressure data according to a preset standard.

[0198] In an embodiment, at step S8370, in response to determining that the re-entry quantity is no greater than a set count and re-executing step S8200 of pushing the substrate SUB with the desorption needle PN and acquiring pressure data via the pressure sensor FS, the method may include reducing the pushing speed of the second desorption needle PN2 (i.e., the speed at which the second desorption needle PN2 extends (or moves) toward the substrate SUB) and controlling the second desorption needle PN2 according to the reduced pushing speed. Therefore, if the method determines that the desorption process is partially abnormally proceeding, the method may include pushing the substrate SUB with the second desorption needle PN2 according to the reduced pushing speed, thereby allowing the desorption process to proceed with a reduced risk of damaging the substrate SUB.

[0199] At step S8370, in response to determining that the number of re-entries is greater than a set count, the method may include pausing the desorption process using the second desorption needle PN2 and performing step S8380 of providing an alarm signal.

[0200] At step S8380, the method may include providing an alarm signal to notify the user whether to suspend the desorption process in case the desorption process is proceeding abnormally. Therefore, by reviewing the alarm signal and determining that the desorption process is not proceeding properly, the user can check information about the progress of the desorption process and whether repairs (e.g., to the desorption needle PN or the substrate SUB) are necessary at a relatively early stage.

[0201] According to embodiments, the alarm signal can be an audio signal or a visual signal. For example, the desorption control system SYS may include an alarm providing component capable of providing an alarm signal. In embodiments, the alarm providing component may include an audio providing component and / or a visual providing component (such as a display). In embodiments, the alarm providing component may be included in a device including any one of the first controller CON1 to the third controller CON3. However, this disclosure is not limited to the foregoing examples.

[0202] Therefore, in this embodiment, the driving operation of the desorption needle PN for performing the desorption process can be controlled based on pressure data, thereby reducing the risk of damage to the substrate SUB. As a result, the process of separating the carrier CR and the substrate SUB from each other can be properly performed, and process reliability can be improved.

[0203] Various embodiments of this disclosure can provide desorption control methods, desorption control systems, and methods for transporting substrates, which can improve the reliability of the desorption process relative to the substrate and carrier, thereby preventing damage to the substrate and the like.

[0204] Various embodiments of this disclosure can provide desorption control methods, desorption control systems, and methods for transporting substrates, which can reduce process costs and enable process monitoring with improved user convenience.

[0205] Various embodiments of this disclosure can provide desorption control methods, desorption control systems, and methods for transporting substrates, enabling quantitative analysis of whether individual steps of the desorption process have been performed correctly.

[0206] While various embodiments have been described herein, those skilled in the art will appreciate that various modifications, additions and substitutions are possible without departing from the scope and spirit of this disclosure.

[0207] Therefore, the embodiments disclosed in this specification are for illustrative purposes and not intended to limit the technical spirit of this disclosure. The scope of this disclosure is defined by the appended claims.

Claims

1. A desorption control method in which, The desorption control method includes: Provides a substrate and carrier that are coupled to each other via adhesive suction cups; The substrate is propelled by a desorption needle including a pressure sensor, and pressure data associated with the propelling of the substrate by the desorption needle is acquired by the pressure sensor; and The operation of the desorption needle is controlled based on the pressure data.

2. The desorption control method according to claim 1, wherein: The adhesive suction cup includes a first adhesive suction cup, a second adhesive suction cup, and a third adhesive suction cup arranged sequentially along the desorption direction; The desorption needle includes: A first desorption needle is positioned between the first adhesive suction cup and the second adhesive suction cup; and The second desorption needle, positioned between the second adhesive suction cup and the third adhesive suction cup, acquires the pressure data by means of a pressure sensor on the second desorption needle simultaneously pushing the substrate; and The pressure data acquired by the pressure sensor of the second desorption needle is expressed as a first curve and a second curve, each representing the pressure value over time, wherein: The first curve indicates the pressure value over time in the first time period; The second curve indicates the pressure value over time in a second time period following the first time period; and The first curve has a first peak value of the pressure value, the second curve has an initial value of the pressure value and a second peak value, and the first peak value and the initial value differ from each other by a gap value.

3. The desorption control method according to claim 2, wherein In the case where the first adhesive suction cup, the second adhesive suction cup, and the third adhesive suction cup are sequentially separated from the substrate along the desorption direction, the time points at which the first time period and the second time period are distinguished from each other correspond to the time points at which the second adhesive suction cup and the substrate are separated from each other.

4. The desorption control method according to claim 2, wherein In the case where the first adhesive suction cup, the second adhesive suction cup, and the third adhesive suction cup do not separate from the substrate sequentially along the desorption direction, the time points at which the first time period and the second time period are distinguished from each other correspond to the time points at which the third adhesive suction cup and the substrate separate from each other.

5. The desorption control method according to claim 2, wherein The operation of controlling the desorption needle includes: in response to determining that the pressure data meets a preset standard, continuing to push the substrate through the second desorption needle.

6. The desorption control method according to claim 2, wherein The operation of controlling the desorption needle includes: Determine whether the pressure value during the first time period indicated by the first curve is equal to or greater than a first reference value; In response to determining that the pressure value indicated by the first curve is equal to or greater than the first reference value, the substrate continues to be pushed through the desorption needle; and In response to determining that the pressure value indicated by the first curve is less than the first reference value, it is determined whether the gap value is equal to or greater than the reference gap value.

7. The desorption control method according to claim 6, wherein The desorption control method further includes: In response to determining that the gap value is equal to or greater than the reference gap value, the substrate continues to be pushed through the desorption needle; and In response to determining that the gap value is less than the reference gap value, it is determined whether the pressure value in the second time period as indicated by the second curve is equal to or greater than the second reference value.

8. The desorption control method according to claim 7, wherein The desorption control method further includes: In response to determining that the pressure value indicated by the second curve is equal to or greater than the second reference value, the substrate continues to be pushed through the desorption needle; and A warning signal is provided in response to the determination that the pressure value indicated by the second curve is less than the second reference value.

9. The desorption control method according to claim 8, wherein The operation of controlling the desorption needle further includes: When the second desorption needle initially pushes the substrate, it provides an initial value for the re-entry quantity; and After providing the warning signal, the second desorption needle is controlled to be spaced apart from the substrate, the acquisition of pressure data by the pressure sensor through the second desorption needle is paused, and the reentry number is increased by 1.

10. The desorption control method according to claim 9, wherein, The operation of controlling the desorption needle further includes: determining whether the re-entry quantity is greater than a set count.

11. The desorption control method according to claim 10, wherein, The desorption control method further includes: providing an alarm signal in response to determining that the re-entry quantity is greater than the set count.

12. The desorption control method according to claim 11, wherein, The desorption control method further includes: in response to determining that the reentry quantity is equal to or less than the preset count: The substrate is pushed forward by the second desorption needle at a reduced pushing speed; and The pressure data is reacquired by the pressure sensor of the second desorption needle.

13. A desorption control system, wherein, The desorption control system includes: Adhesive suction cups are used to attach a carrier, including pinholes, to a substrate; A desorption needle pushes the substrate in a direction through the needle hole, and the desorption needle includes a pressure sensor for acquiring pressure data; and The controller receives the pressure data and controls the operation of the desorption needle based on the pressure data.

14. The desorption control system according to claim 13, wherein: The vehicle includes a central region and a peripheral region, the peripheral region being formed around the central region and forming a virtual region; The pinhole and the suction cup area positioned by the adhesive suction cup are formed in the intermediate region; and The suction cup area comprises multiple portions, each extending in one direction.

15. The desorption control system according to claim 14, wherein, The pinholes and the adhesive suction cups are alternately arranged in the suction cup area.

16. The desorption control system according to claim 13, wherein, The desorption needle includes: The main component includes a first end and a second end; A tip, provided on the first end and capable of pushing the substrate; and The pressure sensor is provided on the second end.

17. The desorption control system according to claim 13, wherein, The desorption control system further includes a needle plate with holes, wherein the pressure sensor is located in the holes.

18. The desorption control system according to claim 13, wherein, The desorption control system further includes: A signal amplifier is connected to the pressure sensor; and The controller provides an initial pressure measurement signal to the signal amplifier, receives pressure information from the signal amplifier, and provides an operation control signal to the pressure sensor.

19. A transmission method, wherein, The transmission method includes: Provide the base on the vehicle; Transmit the substrate; The substrate and the carrier are coupled together by adhesive suction cups; Perform a specific process on the substrate; and Perform the desorption process relative to the substrate and the carrier. in: Performing the desorption process includes performing multiple unit desorption processes; and Performing each of the plurality of said unit desorption processes includes: The substrate and the carrier are provided in a state in which the substrate and the carrier are attached to each other via the adhesive suction cup; The substrate is pushed by a desorption needle, and pressure data associated with the pushing of the substrate by the desorption needle is acquired by a pressure sensor; and The operation of the desorption needle is controlled based on the pressure data.

20. The transmission method according to claim 19, wherein: The specific process includes a deposition process; and Performing the desorption process includes: performing a first desorption process using a first desorption needle; and performing a second desorption process using a second desorption needle, as operations corresponding to the plurality of unit desorption processes respectively.

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