Adhesive structure for adhering substrate to susceptor and associated method

Abstract

An adhesive stack comprises: a film layer comprising a first surface and a second surface; a first adhesive layer disposed on the first surface; and a second adhesive layer disposed on the second surface. Adhesive regions defined by the first adhesive layer and the second adhesive layer do not overlap each other to prevent heat transfer between the susceptor and the substrate through the adhesive stack via which the susceptor and the substrate are bonded to each other. Accordingly, even if the substrate is exposed to a heat flux from a heat source, a uniform temperature within the substrate can be maintained.

Description

Technical Field

[0001] This disclosure relates to an adhesive stack for adhering a substrate to a base in an environment where the substrate is exposed to heat. Background Technology

[0002] In various applications, it may be necessary to place a substrate (e.g., formed of a suitable glass, glass-ceramic, ceramic, or polymeric material) in an environment where it is subjected to heating above ambient temperature, and where it is desirable to attach the substrate to a base (e.g., a fastener or structural element in a larger system). For this attachment, an adhesive can be applied between the substrate and the base to bond the substrate to the base. To conserve adhesive material, the adhesive may not cover the entire surface of the substrate bonded to the base, but rather be applied to multiple discrete areas. Thus, some areas of the substrate may be in contact with the adhesive, while other areas may not. This configuration can alter the way heat is transferred between the substrate and the base, causing different areas of the substrate to remain at different temperatures due to heating. Such temperature variations may be undesirable.

[0003] Therefore, an adhesive structure that can help reduce temperature changes caused by this adhesion is desired. Summary of the Invention

[0004] Aspect (1) of this disclosure relates to an adhesive stack comprising: a film layer including a first surface and a second surface; a first adhesive layer disposed on the first surface; and a second adhesive layer disposed on the second surface, wherein adhesive regions defined by the first adhesive layer and the second adhesive layer do not overlap each other in a first direction perpendicular to the first surface of the film layer.

[0005] Aspect (2) of this disclosure relates to the adhesive stack according to aspect (1), wherein the peripheral edges of the adhesive region defined by the first adhesive layer and the second adhesive layer are separated from each other by at least 2 mm in a second direction parallel to the first surface.

[0006] Aspect (3) of this disclosure relates to the adhesive stack according to aspect (2), wherein the edges are spaced apart from each other by at least 4 mm in the second direction.

[0007] Aspect (4) of this disclosure relates to an adhesive stack according to any one of aspects (1) to (3), wherein one of the first adhesive layer and the second adhesive layer includes a single adhesive region on one of the first surface or the second surface.

[0008] Aspect (5) of this disclosure relates to an adhesive stack according to aspect (1), wherein the first adhesive layer and the other of the second adhesive layer include a plurality of discrete adhesive regions on the other of the first surface and the second surface.

[0009] Aspect (6) of this disclosure relates to the adhesive stack according to aspect (5), wherein the plurality of discrete regions are arranged symmetrically about the geometric center of the film layer.

[0010] Aspect (7) of this disclosure relates to the adhesive stack according to aspect (6), wherein the individual adhesive region is centered on one of the first surface and the second surface.

[0011] Aspect (8) of this disclosure relates to the adhesive stack according to aspect (4), wherein the discrete adhesive regions and the individual adhesive regions all have the same surface area.

[0012] Aspect (9) of this disclosure relates to an adhesive stack according to any one of aspects (1) to (3), wherein: both the first adhesive layer and the second adhesive layer define at least two adhesive regions, the first adhesive layer defines a first number of adhesive regions, and the second adhesive layer defines a second number of adhesive regions different from the first number of adhesive regions.

[0013] Aspect (10) of this disclosure relates to an adhesive stack according to aspect (9), wherein: one of the first adhesive layer and the second adhesive layer defines a greater number of adhesive regions and includes a central adhesive region at a geometric center on the film layer, and the other of the first adhesive layer and the second adhesive layer defines a lesser number of adhesive regions and includes adhesive regions arranged symmetrically about the central adhesive region in at least one direction.

[0014] Aspect (11) of this disclosure relates to an adhesive stack according to any one of aspects (1) to (3), wherein the film layer is formed of a thermoplastic resin.

[0015] Aspect (12) of the present invention relates to the adhesive stack according to aspect (11), wherein the thermoplastic resin is polyethylene terephthalate, and wherein the thickness of the film layer is at least 35 mm.

[0016] Aspect (13) of this disclosure relates to an adhesive stack according to any one of aspects (1) to (3), wherein the first adhesive layer and the second adhesive layer are formed of an acrylic pressure-sensitive adhesive.

[0017] Aspect (14) of this disclosure relates to an apparatus comprising: a base including a base surface; a substrate including a first main surface and a second main surface opposite to the first main surface, the first main surface facing away from the base; and an adhesive stack disposed between the base and the substrate, the adhesive stack comprising: a film layer including a first surface and a second surface; a first adhesive layer disposed on the first surface and bonding the first surface to the second main surface; and a second adhesive layer disposed on the second surface and bonding the second surface to the base surface, such that the substrate is bonded to the base via the adhesive stack, wherein: adhesive regions defined by the first adhesive layer and the second adhesive layer do not overlap each other in a first direction perpendicular to the base surface, and the adhesive stack does not detach from the base or the substrate when the first main surface of the substrate is heated to a temperature above 50°C by a heat source emitting heat flux onto the first main surface.

[0018] Aspect (15) of this disclosure relates to the device according to aspect (14), wherein the substrate is a glass substrate.

[0019] Aspect (16) of this disclosure relates to the device described in aspect (15), wherein the base is a glass plate.

[0020] Aspect (17) of this disclosure relates to the device according to aspect (15), wherein the adhesive stack is configured such that the film layer does not contact the base or substrate.

[0021] Aspect (18) of this disclosure relates to a device according to any one of aspects (14) to (17), wherein the peripheral edges of the adhesive region defined by the first adhesive layer and the second adhesive layer are separated from each other by at least 2 mm in a second direction parallel to the first surface.

[0022] Aspect (19) of this disclosure relates to the device according to aspect (18), wherein the edges are spaced apart from each other by at least 4 mm in the second direction.

[0023] Aspect (20) of this disclosure relates to a device according to any one of aspects (14) to (17), wherein one of the first adhesive layer and the second adhesive layer includes a single adhesive region on one of the first surface or the second surface.

[0024] Aspect (21) of this disclosure relates to the device according to aspect (20), wherein the other of the first adhesive layer and the second adhesive layer includes a plurality of discrete adhesive regions on the other of the first surface and the second surface.

[0025] Aspect (22) of this disclosure relates to the device according to aspect (21), wherein the plurality of discrete regions are arranged symmetrically about the geometric center of the membrane layer.

[0026] Aspect (23) of this disclosure relates to the device according to aspect (22), wherein the single adhesive region is centered on one of the first surface and the second surface.

[0027] Aspect (24) of this disclosure relates to the device according to aspect (21), wherein the discrete adhesive regions and the individual adhesive regions all have the same surface area.

[0028] Aspect (25) of this disclosure relates to an apparatus according to any one of aspects (14) to (17), wherein: both the first adhesive layer and the second adhesive layer define at least two adhesive regions, the first adhesive layer defines a first number of adhesive regions, and the second adhesive layer defines a second number of adhesive regions different from the first number of adhesive regions.

[0029] Aspect (26) of this disclosure relates to the device according to aspect (25), wherein: one of the first adhesive layer and the second adhesive layer defines a greater number of adhesive regions and includes a central adhesive region at a geometric center on the film layer, and one of the first adhesive layer and the second adhesive layer defines a lesser number of adhesive regions and includes adhesive regions symmetrically arranged about the central adhesive region in at least one direction.

[0030] Aspect (27) of this disclosure relates to an apparatus according to any one of aspects (14) to (17), wherein the film layer is formed of a thermoplastic resin.

[0031] Aspect (28) of this disclosure relates to the device according to aspect (27), wherein the thermoplastic resin is polyethylene terephthalate, and wherein the thickness of the film layer is at least 35 mm.

[0032] Aspect (29) of this disclosure relates to an apparatus according to any one of aspects (14) to (17), wherein the first adhesive layer and the second adhesive layer are formed of an acrylic pressure-sensitive adhesive.

[0033] Aspect (30) of this disclosure relates to a method comprising adhering a substrate to a base using an adhesive stack as described in any one of claims 1 to 3.

[0034] Aspect (31) of this disclosure relates to the method according to aspect (30), the method further comprising removing the substrate from the base by applying mechanical force to the substrate to detach the adhesive stack from the base.

[0035] It should be understood that both the above general description and the following detailed description are merely exemplary and intended to provide an overview or framework for understanding the nature and features of the claims. Drawings are included to provide further understanding and are incorporated in and constitute a part of this specification. The drawings illustrate one or more embodiments and, together with the description, serve to explain the principles and operation of various aspects. Attached Figure Description

[0036] The accompanying drawings, which are incorporated in and form a part of this specification, illustrate several aspects of the invention and, together with the specification, explain the principles of the invention. In the drawings:

[0037] Figure 1 A side view of a device according to one or more embodiments of the present disclosure is depicted, the device including a substrate exposed to heat flux from a heat source, wherein the substrate is stacked and bonded to a base via an adhesive.

[0038] Figure 2A An example of adhering a substrate to one or more embodiments according to this disclosure is described. Figure 1 The side view of the adhesive stack of the base shown in the figure;

[0039] Figure 2B The present disclosure describes one or more embodiments of the invention. Figure 2A A top view of the adhesive region defined by the first and second adhesive layers of the adhesive stack, as illustrated in the figure;

[0040] Figure 3A An example of adhering a substrate to one or more embodiments according to this disclosure is described. Figure 1 The side view of the adhesive stack of the base shown in the figure;

[0041] Figure 3B The present disclosure describes one or more embodiments of the invention. Figure 3A A top view of the adhesive region defined by the first and second adhesive layers of the adhesive stack, as illustrated in the figure;

[0042] Figure 4A An example of adhering a substrate to one or more embodiments according to this disclosure is described. Figure 1The side view of the adhesive stack of the base shown in the figure;

[0043] Figure 4B The present disclosure describes one or more embodiments of the invention. Figure 4A The diagram shows a top view of the adhesive region defined by the first and second adhesive layers of the adhesive stack; and

[0044] Figure 5 An example of adhering a substrate to one or more embodiments according to this disclosure is described. Figure 1 The image shows a side view of the adhesive stack of the base. Detailed Implementation

[0045] Referring generally to the accompanying drawings, this document describes an adhesive stack for adhering a substrate to a base. The adhesive stack is configured to improve the non-uniformity of the substrate temperature distribution when the side of the substrate opposite the base is exposed to a heat flux from a heat source. The adhesive stack of this disclosure includes a film layer, a first adhesive layer on a first surface of the film layer, and a second adhesive layer on a second surface of the film layer. The second adhesive layer bonds the film layer to the base, and the first adhesive layer bonds the film layer to the substrate. It has been found that eliminating the overlap between the adhesive regions defined by the first and second adhesive layers in a direction perpendicular to the base and / or the first surface eliminates a direct path of heat conduction between the substrate and the base. Therefore, heat transfer between the substrate region overlapping with the adhesive stack and the base is reduced compared to a structure including an adhesive stack with overlapping opposing adhesive regions. The adhesive stack described herein is advantageously able to maintain a relatively uniform temperature distribution across the entire substrate, even when adhering a substrate to a base using a non-uniformly distributed adhesive stack. Therefore, the adhesive stack described herein offers flexibility in adhesive placement when substrate adhesion to a base is required.

[0046] For reference Figure 1The diagram illustrates device 100. Device 100 includes: a base 110 including a base surface 112; a substrate 120 including a first main surface 122 and a second main surface 124 opposite to the first main surface 122; and a plurality of adhesive stacks 130 disposed between the base 110 and the substrate 120. The plurality of adhesive stacks 130 bond the substrate 120 to the base 110. In various respects, the bond formed between the substrate 120 and the base 110 by the plurality of adhesive stacks 130 may be temporary, as the substrate 120 can be removed from the base 110 by applying mechanical force to the substrate 120 (e.g., detaching at least one of the plurality of adhesive stacks 130 from the base 110 or the substrate 120), such that the substrate 120 can be removed from the base 110 without damage (e.g., cracking, scratching, breaking) to the base 110 and the substrate 120. Device 100 can represent any environment in which a substrate 120 formed of any material described herein needs to be adhered to a base 110, which can be fixed in place within device 100 (e.g., attached to a fixture in the building where device 100 is located). For example, base 110 can be fixed to a location in a manufacturing plant, and substrate 120 can be adhered to the base to apply a coating or surface treatment to the first main surface 122.

[0047] In the depicted example, multiple adhesive stacks 1 30 bond a second main surface 124 of substrate 120 to a base surface 112 of base 110. Therefore, the first main surface 122 faces away from base 110 and generally faces heat source 140. Heat flux 1 50 from heat source 140 may incident onto the first main surface 122. The form of heat source 140 and thus the form of heat flux 150 can vary depending on the implementation of device 100. For example, in various aspects, heat source 140 may include a radiating emitter that emits heat flux in the form of radiation, which is absorbed by the material of substrate 120. In various aspects, heat source 140 may include a particle source, and heat flux 150 may be particles traveling toward substrate 120. Such particles may have kinetic energy transferred to substrate 120, resulting in heating, or may condense on the first main surface 122, resulting in heating of substrate 120. The heat flux 150 may also include a high-energy plasma that heats the substrate 120. Any heat source capable of raising the temperature of the substrate 120 from the ambient temperature of the device 100 (e.g., 23°C) can be used.

[0048] The substrate 120 can be of any suitable size and made of a suitable material. In various aspects, the substrate 120 can be formed of glass, glass-ceramic, ceramic, or polymeric materials. For example, in various aspects, the substrate 120 is formed of a glass of a suitable composition. In various aspects, the substrate 120 is a glass substrate or a glass-ceramic substrate. In various aspects, the substrate 120 is a multi-component glass composition having about 40 mol% to 80 mol% silicon dioxide and the balance being one or more other components, such as alumina, calcium oxide, sodium oxide, boron oxide, etc. In some implementations, the main composition of the substrate 120 is selected from the group consisting of aluminosilicate glass, borosilicate glass, and phosphosilicate glass. In other implementations, the main composition of the substrate 120 is selected from the group consisting of aluminosilicate glass, borosilicate glass, phosphosilicate glass, soda-lime glass, alkaline aluminosilicate glass, and alkaline aluminoborosilicate glass. In a further implementation, the substrate 120 is a glass-based substrate, including but not limited to glass-ceramic materials comprising about 90 wt% or more of a glass component and a ceramic component.

[0049] In all respects, the substrate 120 has a body composition comprising a glass composition, such as Eagle Glass 2 3. 4 or 5. The substrate 120 is substantially composed of, or consists of, the glass composition described above. In various aspects, the substrate 120 has an ion-exchangeable glass composition, which is strengthened by chemical or thermal methods known in the art. In various aspects, the substrate 120 is chemically strengthened by ion exchange.

[0050] In various respects, the base 110 is formed of a material suitable for a given application. For example, the base 110 may be formed of a material exhibiting similar properties to the material forming the substrate (e.g., if the substrate 120 is formed of glass, the base 110 may also be formed of glass exhibiting similar properties). This configuration can be advantageous because the substrate 120 and the base 110 can have similar coefficients of thermal expansion, which can limit stresses caused by thermal expansion / contraction on the adhesive stack 130 and reduce the likelihood of accidental delamination. This configuration is also advantageous because each adhesive layer of the multiple adhesive stacks 130 can use a similar adhesive, which simplifies the fabrication of the multiple adhesive stacks 130.

[0051] In the depicted example, substrate 120 is in the form of a planar sheet, its peripheral shape defined by a plurality of small surfaces 126. Base surface 112 is also planar, and therefore extends parallel to the first main surface 122 and the second main surface 124 (in the xy direction of the coordinate axes in the figure). This shape correspondence between base 110 and substrate 120 can be advantageous because it can reduce bending stress in substrate 120. Furthermore, maintaining the first main surface 122 in a flat planar shape (e.g., in the form of a material production process from which the material sheet for manufacturing substrate 120 is produced, such as a melt-drawing process in the case of a glass substrate) can facilitate the performance of various processes on the first main surface 122 when substrate 120 is adhered to base 110. The adhesive stack described herein is not limited to this configuration. For example, at least one of base surface 112, first main surface 122, or second main surface 124 can be curved. Furthermore, in some aspects, the base surface 112 may not have the same shape as the second main surface 124, and the substrate 120 may be elastically bent and held in such a bent state consistent with the base surface 112 by a plurality of adhesive stacks 130.

[0052] Still referencing Figure 1 Multiple adhesive stacks 130 can bond discrete regions of the second main surface 124 to the base surface 112. Limiting the range of adhesive material used to bond the substrate 120 to the base 110 advantageously reduces the utilization rate of the adhesive material. Thus, the substrate includes an adhesive region 170 that overlaps with one of the multiple adhesive stacks 130 in a direction perpendicular to the first main surface 122 (the z-direction in the depicted coordinate axes) and a non-adhesive region 160 that does not overlap with one of the multiple adhesive stacks 130. This non-uniform structure between the substrate 120 and the base 110 may result in non-uniform heat transfer between the base 110 and the substrate 120.

[0053] Due to the heat flux 150, the first main surface 122 can be heated to a temperature higher than that of the base 110. Since the substrate 120 covers the portion of the base 110 to which it is adhered, the base 110 is not directly exposed to the heat flux 150. Therefore, when the thermal system including the base 110 and the substrate 120 reaches equilibrium, the multiple adhesive stacks 130 can act as conduits for heat transfer. It has been found that heat conduction through the multiple adhesive stacks 130 can result in greater heat transfer at the adhered region 170 than at the non-adhesive region 160. In particular, a continuous path of solid material (formed by the components of the adhesive stacks) extending in the z-direction between the base 110 and the substrate 120 facilitates this conduction. When such a continuous solid material path exists, the temperature distribution on the first main surface 122 becomes uneven, and the temperature of the adhered region 170 is considerably lower than that of the non-adhesive region 160 (e.g., more than 10°C lower when the first main surface 122 is heated to a temperature exceeding 50°C), which can cause difficulties in various applications. In view of the above, the multiple adhesive stacks 1 30 have been configured to eliminate the direct path of heat transfer between the base 110 and the substrate 120.

[0054] Figure 2AA side view of one of a plurality of adhesive stacks 130 according to one or more embodiments of the present disclosure is depicted. As shown, the adhesive stack 130 includes: a film layer 200 including a first surface 202 and a second surface 204, a first adhesive layer 210 disposed on the first surface 202, and a second adhesive layer 220 disposed on the second surface 204. The film layer 200 may be a pre-formed layer, and the first adhesive layer 210 and the second adhesive layer 220 may be formed from adhesive segments coated on the film layer. 200. The film layer 200 is constructed from a suitable material based on various properties depending on the application (e.g., flexibility, tensile strength, temperature resistance, chemical resistance, moisture resistance, dimensional stability). In various respects, the film layer 200 is formed from a suitable thermoplastic resin material such as polyethylene terephthalate or epoxy resin. When the substrate 120 is a glass substrate, polyethylene terephthalate has been found to be suitable for a variety of applications, exhibiting suitable flexibility, dimensional stability, and durability in a variety of high-temperature applications. In other respects, the film layer 200 is formed of another polymeric material such as a polyimide film or rubber. In various respects, the film layer 200 includes a metallized foil layer. The film layer 200 includes a thickness 206. In various respects, the thickness 206 is at least 35 mm to prevent the substrate 120 from directly contacting the base 110. For example, in various respects, the thickness 206 can range from 30 mm to 100 mm (e.g., 35 mm to 70 mm, 40 mm to 60 mm, or 48 mm to 52 mm). The film layer 200 may also have a suitable length 207 in the x-direction and a suitable width 209 in the y-direction. In various respects, the length 207 and width 209 are based on the size of the substrate 120 to be bonded (see...). Figure 1 The number of adhesive stacks used in the bonding process is determined by the number of layers of adhesive used in the bonding process.

[0055] In various aspects, the first adhesive layer 210 and the second adhesive layer 220 may comprise at least one of toughened epoxy resin, flexible epoxy resin, acrylic resin, silicone resin, urethane, polyurethane, or silane-modified polymer. It has been found that the use of acrylic adhesives is advantageous in providing strong initial tack strength, thereby facilitating rapid bonding with the substrate 110 and base plate 120 with minimal initial pressure. Acrylic adhesives also exhibit good stability over a wide temperature range. The first adhesive layer 210 and the second adhesive layer 220 may have any suitable thickness to ensure adequate bonding between the substrate 110 and the base plate 120. For example, in various aspects, the thickness of the first and second adhesive layers 210 may range from 0.1 mm to 5 mm or from 0.5 mm to 2 mm.

[0056] Figure 2BThe positioning of the first adhesive layer 210 and the second adhesive layer 220 on the film layer 200 is schematically depicted. As shown, the first adhesive layer 210 defines a first adhesive region 230 and the second adhesive layer 220 defines a second adhesive region 240. The first adhesive region 230 represents the first surface 202 (see [reference]). Figure 2A The first adhesive region 230 may represent the surface area of ​​the adhesive that can be bonded to the second main surface 124 of the substrate 120 (see [reference]). Figure 1 The second adhesive region 240 represents the second surface 204 (see...). Figure 2A The second adhesive region 240 may represent the surface area of ​​the adhesive that can be bonded to the base surface 112 (see [reference]). Figure 1 ).

[0057] like Figure 2A and Figure 2B As shown, the formation of the first adhesive layer 210 and the second adhesive layer 220 ensures that the first adhesive region 230 and the second adhesive region 240 defined theretherein do not overlap each other in the z-direction (extending perpendicular to the first surface 202). That is, if a line extending in the z-direction scans the entire surface area of ​​the first surface 202, no single line will pass through either the first adhesive region 230 or the second adhesive region 240. Figure 2B As shown, the entire first adhesive region 230 is offset from the second adhesive region 240 in the x-direction (extending parallel to the first surface 202), such that the edge 236 of the first adhesive region 230 closest to the geometric center of the film layer 200 and the edge 246 of the second adhesive region 240 closest to the geometric center are separated from each other by a separation distance 260 in the x-direction. In all respects, the separation distance 260 is at least 2 mm or preferably at least 4 mm to facilitate the prevention of heat conduction through the adhesive stack 130. For example, the separation distance 260 can be 2 mm, 3 mm, 4 mm, 5 mm, 6 mm, 7 mm, 8 mm, 9 mm, 10 mm or anywhere within the range defined by any two of the stated values. In all respects, the separation distance 260 represents the minimum edge-to-edge separation distance in a plane parallel to the first surface 202 and / or the base surface 112 that separates the adhesive regions formed by the first adhesive layer 210 and the second adhesive layer 220 (see [reference]). Figure 1 The degree of deviation between the first adhesive region 230 and the second adhesive region 240 ensures that there is no direct conduction path of material in the z-direction through the adhesive stack 130 between the substrate 120 and the base 110 (see [reference]). Figure 1Despite the presence of heat flux 150, the degree of deviation has been found to help reduce temperature non-uniformity of the first primary surface 122.

[0058] In the depicted example, the first adhesive region 230 is larger than the second adhesive region 240. The larger first adhesive region 230 prevents contact between the substrate 120 and the film layer 200. The larger first adhesive region 230 also facilitates bonding to the substrate 120 and removal of the substrate 120 from the base 110 by peeling the second adhesive layer 220 from the base 110. Figure 2B As shown, the first adhesive region 230 has a first dimension 232 in the x-direction, and the second adhesive region 240 has a second dimension 242 in the x-direction. In all respects, the first dimension 232 is at least twice as large as the second dimension 242.

[0059] In various aspects, the first adhesive region 230 and the second adhesive region 240 may have the same dimensions in the y-direction, thereby distributing the adhesive force over a sufficiently wide area to achieve adequate adhesion. In some embodiments, the first adhesive region 230 and the second adhesive region 240 may have different peripheral shapes. In various aspects, the first adhesive region 230 and the second adhesive region 240 are separated from the peripheral edge 208 of the film layer 200 by at least a minimum edge separation distance 270. In various aspects, the minimum edge separation distance 270 is 0.5 mm to facilitate the fabrication of the adhesive stack 130.

[0060] For reference Figure 3A and Figure 3B This schematically depicts another adhesive stack 130'. Adhesive stack 130' can be used as an alternative. Figure 1 Some or all of the multiple adhesive stacks 130 depicted herein. As shown, adhesive stack 130' includes: a film layer 300 including a first surface 302 and a second surface 304, a first adhesive layer 310 disposed on the first surface 302, and a second adhesive layer 320 disposed on the second surface 304. The film layer 300 may be a pre-formed layer, and the first adhesive layer 310 and the second adhesive layer 320 may be formed from material segments coated on the film layer 300. The materials and thicknesses of the film layer 300, the first adhesive layer 310, and the second adhesive layer 320 may be similar to those described above with respect to film layer 200, first adhesive layer 210, and second adhesive layer 220.

[0061] Adhesive stack 130' with about Figure 2A and Figure 2BThe difference in the described adhesive stack 130 is that the second adhesive layer 320 includes a plurality of discrete adhesive regions disposed around the adhesive region formed by the first adhesive layer 310. It has been found that the plurality of discrete adhesive regions formed by the second adhesive layer 320 helps prevent contact between the substrate 110 and the membrane layer 300, which has been found to increase conductive heat transfer. Figure 3B As shown, a first adhesive layer 310 defines a first adhesive region 330, and a second adhesive layer 320 defines a second adhesive region 340 and a third adhesive region 350. The second adhesive region 340 is offset from the first adhesive region 330 in the x-direction, and the third adhesive region 350 is offset from the first adhesive region 330 in the negative x-direction. As shown, the edges 334 of the closest first adhesive regions 330 and 344 of the second adhesive region 340 are separated from each other in the x-direction by a separation distance of 370. The edges 336 of the closest first adhesive regions 330 and 354 of the third adhesive region 350 are separated from each other in the x-direction by a separation distance of 380. In all respects, the separation distances 370 and 380 can be 2 mm, 3 mm, 4 mm, 5 mm, 6 mm, 7 mm, 8 mm, 9 mm, 10 mm, or any point within the range defined by any two of the stated values. The degree of deviation from the first adhesive region 330 to the second adhesive region 340 and the third adhesive region 350 ensures that there is no direct conduction path of material in the z-direction through the adhesive stack 130 between the substrate 120 and the base 110 (see [reference]). Figure 1 Despite the presence of heat flux 150, the degree of deviation has been found to help reduce temperature non-uniformity of the first main surface 122. There is no overlap in the z-direction between the first adhesive region 330 and the second adhesive region 340 and the third adhesive region 350. Although the second adhesive layer 320 is depicted as comprising two adhesive regions, it should be understood that any suitable number of discrete adhesive regions may be included, provided that none of the discrete adhesive regions overlaps with the first adhesive region 330 in the z-direction.

[0062] In all respects, the plurality of discrete adhesive regions formed in the second adhesive layer 320 are arranged symmetrically about the geometric center of the second surface 304 in at least one direction. As shown in FIG3, for example, the edges 344 of the second adhesive region 340 and the edges 354 of the third adhesive region 350 are equidistant from the geometric center of the second surface 304 in the x-direction, and the second adhesive region 340 and the third adhesive region 350 have the same dimensions in the x and y directions. Therefore, the geometric center 338 of the first adhesive region 330 is located on the line connecting the geometric centers 348 of the second adhesive region 348 and the geometric center 358 of the third adhesive region 358, and the geometric center 338 is equidistant from the geometric centers 348 and 358. If the geometric center of each adhesive region is equidistant from the center of the surface of the adhesive layer that defines the adhesive region, the arrangement of the adhesive regions is symmetrical herein.

[0063] In various respects, the second adhesive region 340 and the third adhesive region 350 may also form a combined adhesive region that is symmetrical about at least one axis of symmetry extending through a point overlapping the geometric center of the second surface 304. For example, the depicted second adhesive region 340 and third adhesive region 350 form a combined adhesive region that is symmetrical about a first axis of symmetry extending in the x-direction and a second axis of symmetry extending in the y-direction, and both the first and second axes of symmetry extend through a point overlapping the geometric center of the second surface 304 in the z-direction. This symmetrical adhesive region is believed to help prevent contact between the film layer 300 and the substrate 110 (see [link to relevant documentation]). Figure 1 Preventing this contact prevents heat transfer between the substrate 120 and the base 110 and helps maintain the temperature uniformity of the first main surface 122 when exposed to the heat flux 150.

[0064] In all respects, the first adhesive region 330 is the geometric center on the first surface 302. That is, the geometric center of the first adhesive layer 310 may overlap with the geometric center of the first surface 302 in the xy-plane. The first adhesive region 330 may also be symmetrical about axes of symmetry extending in both the x and y directions, and these axes extend through the geometric center of the first adhesive region. This arrangement has been found to help prevent contact between the film layer 300 and the substrate 120 (see [link to documentation]). Figure 1 Preventing this contact prevents heat transfer between the substrate 120 and the base 110 and helps maintain the temperature uniformity of the first main surface 122 when exposed to the heat flux 150.

[0065] In all respects, the outer edges 346 of the second adhesive region 340 and 356 of the third adhesive region 350 are aligned with the outer edge 308 of the film layer 300 in the z-direction (e.g., in some respects, one of the outer edges 308 of the film layer 300 and the outer edge 346 of the second adhesive region 340 may form a straight line). This configuration maximizes the area of ​​the second surface 304 on which the second adhesive layer 320 can be disposed, thereby maximizing the bonding area between the film layer 300 and the substrate 110 (see...). Figure 1 ).

[0066] In all respects, each of the first adhesive region 330, the second adhesive region 340, and the third adhesive region 350 has the same dimensions in at least one of the x-direction and y-direction. For example, the first adhesive region 330 is depicted as having a first dimension 332 in the x-direction, the second adhesive region 340 is depicted as having a second dimension 342 in the x-direction, and the third adhesive region 350 is depicted as having a third dimension 352 in the x-direction. In all respects, the first dimension 332, the second dimension 342, and the third dimension 352 may be equal to each other to facilitate the formation of symmetrical adhesive regions and to facilitate the fabrication of the adhesive stack 130'. In all respects, the dimensions of the first adhesive region 330, the second adhesive region 340, and the third adhesive region 350 are different from each other in at least one of the x-direction and y-direction. Although the depicted symmetrical adhesive regions ensure that there is no contact between the film layer 300, the base 110, and the substrate 120 (see... Figure 1 However, asymmetrical arrangements can also work as long as the adhesive areas avoid overlapping.

[0067] exist Figure 3A and Figure 3B In the depicted aspect, the combined adhesive region of the first adhesive layer 310 (corresponding to the first adhesive region 330) may be smaller than the combined adhesive region of the second adhesive layer 320 (corresponding to the combination of the second adhesive region 340 and the third adhesive region 350). In fact, in the depicted embodiment, the first adhesive region 330 is half the combination of the second adhesive region 340 and the third adhesive region 350. This configuration facilitates the removal of the substrate 120 from the base 110 at the first adhesive layer 310 by applying mechanical force to the substrate 120. Furthermore, with... Figure 2A and Figure 2B Compared to the depicted embodiment, reducing the bonding area between the adhesive stack 130' and the substrate 120 can reduce heat transfer to the film layer 300.

[0068] For reference Figure 4A and Figure 4B The diagram schematically depicts another adhesive stack 130. Adhesive stack 130 can be used as an alternative. Figure 1 The figure depicts some or all of the multiple adhesive stacks 130. As shown, the adhesive stack 130 includes: a film layer 400 including a first surface 402 and a second surface 404, a first adhesive layer 410 disposed on the first surface 402, and a second adhesive layer 420 disposed on the second surface 404. The film layer 400 may be a pre-formed layer, and the first adhesive layer 410 and the second adhesive layer 420 may be formed from material segments coated on the film layer 400. The materials and thicknesses of the film layer 400, the first adhesive layer 410, and the second adhesive layer 420 may be similar to those described above with respect to the film layer 200, the first adhesive layer 210, and the second adhesive layer 220.

[0069] Adhesive stack 130” and about Figure 2A and Figure 2B The difference in the described adhesive stack 130 is that the first adhesive layer 410 includes a plurality of discrete adhesive regions disposed around the adhesive region formed by the second adhesive layer 420. It has been found that the plurality of discrete adhesive regions formed by the first adhesive layer 410 helps prevent contact between the substrate 120 and the film layer 400, which has been found to increase conductive heat transfer. Figure 4B As shown, a first adhesive layer 40 defines a first adhesive region 430 and a second adhesive region 440, while a second adhesive layer 320 defines a third adhesive region 450. The first adhesive region 430 is offset from the third adhesive region 450 in the x-direction, and the second adhesive region 440 is offset from the third adhesive region 450 in the negative x-direction. As shown, the edges 434 of the closest first adhesive region 430 and the edge 454 of the third adhesive region 450 are separated from each other in the x-direction by a separation distance of 470. The edges 444 of the closest second adhesive region 440 and the edge 456 of the third adhesive region 450 are separated from each other in the x-direction by a separation distance of 480. In all respects, the separation distances 470 and 480 can be 2 mm, 3 mm, 4 mm, 5 mm, 6 mm, 7 mm, 8 mm, 9 mm, 10 mm, or any point within the range defined by any two of the stated values. The deviation from the third adhesive region 450 to the first adhesive region 430 and the second adhesive region 440 ensures that there is no direct conduction path of material in the z-direction through the adhesive stack 130 between the substrate 120 and the base 110 (see [reference]). Figure 1 Despite the presence of a heat flux of 150, the degree of deviation has been found to help reduce temperature non-uniformity on the first main surface 122. There is no overlap in the z-direction between the third adhesive region 450 and the first adhesive region 430 and the second adhesive region 440.

[0070] In various aspects, the plurality of discrete adhesive regions formed in the first adhesive layer 410 are arranged symmetrically about the geometric center of the first surface 402 in at least one direction. As shown in FIG3, for example, the edges 434 of the first adhesive region 430 and the second adhesive region 440 are equidistant from the geometric center of the first surface 402, and the first adhesive region 430 and the second adhesive region 440 have the same dimensions in the x and y directions. In various aspects, the first adhesive region 430 and the second adhesive region 440 may also form a combined adhesive region that is symmetrical about at least one axis of symmetry extending through a point overlapping the geometric center of the first surface 402. Such symmetrical adhesive regions are believed to help prevent contact between the film layer 400 and the substrate 120 (see Figure 3). Figure 1 The third adhesive region 450 may also be the center on the second surface 404 to prevent contact between the film layer 400 and the substrate 110. Preventing this contact prevents heat transfer between the substrate 120 and the substrate 110 and helps maintain the temperature uniformity of the first main surface 122 when exposed to the heat flux 150. In each respect, the first adhesive region 430 has a first dimension 432, the second adhesive region 440 has a first dimension 442, and the third adhesive region 450 has a first dimension 452, which may be similar to the following regarding Figure 4A and Figure 4B The described adhesive stack 130' has a first adhesive region 330 with a first dimension 332, a second adhesive region 340 with a first dimension 342, and a third adhesive region 350 with a first dimension 352.

[0071] In all respects, aligning the outer edges of the first adhesive region 430 and the second adhesive region 440 with the outer edge 408 of the film layer 400 in the z-direction maximizes the area of ​​the first surface 402 on which the first adhesive layer 410 can be disposed, thereby maximizing the bonding area between the film layer 400 and the substrate 120 (see [reference]). Figure 1 ).

[0072] For reference Figure 5 Furthermore, aspects including adhesive stacking are envisioned, wherein both the first adhesive layer and the second adhesive layer define at least two adhesive regions. In these aspects, the adhesive layers can define any number of adhesive regions, as long as the bonding regions are perpendicular to the base surface 112 (see [reference]). Figure 1The adhesive layers may extend in directions that do not overlap each other. In various aspects, the first adhesive layer and the second adhesive layer may define different numbers of adhesive regions; and the one defining a larger number of adhesive regions in the first adhesive layer and the second adhesive layer may include a central adhesive region at the geometric center of the film layer. In these aspects, the one defining a smaller number of adhesive regions in the first adhesive layer and the second adhesive layer may include adhesive regions arranged symmetrically about the central adhesive region in at least one direction.

[0073] Figure 5 A schematic depiction of alternatives Figure 1 The adhesive stack 130"' is one of some or all of the multiple adhesive stacks 130 depicted. As shown, the adhesive stack 130"' includes: a film layer 500 including a first surface 502 and a second surface 504, a first adhesive layer 510 disposed on the first surface 502, and a second adhesive layer 520 disposed on the second surface 504. The film layer 500 may be a pre-formed layer, and the first adhesive layer 510 and the second adhesive layer 520 may be formed from material segments coated on the film layer 500. The materials and thicknesses of the film layer 500, the first adhesive layer 510, and the second adhesive layer 520 may be similar to those described above with respect to film layer 200, first adhesive layer 210, and second adhesive layer 220.

[0074] In the depicted example, the first adhesive layer 510 defines a greater number of adhesive regions than the second adhesive layer 520. The second adhesive layer 520 may define n adhesive regions while the first adhesive layer 510 may define n+1 adhesive regions. As shown, the first adhesive layer 510 defines a first adhesive region 530, a second adhesive region 540, and a third adhesive region 550; while the second adhesive layer 520 defines a fourth adhesive region 560 and a fifth adhesive region 570. The fourth adhesive region 560 and the fifth adhesive region 570 are offset from the first adhesive region 530, the second adhesive region 540, and the third adhesive region 550 in the x-direction, such that none of the adhesive regions defined by the first adhesive layer 510 overlaps with any adhesive region defined by the second adhesive layer 520 in the z-direction. In one embodiment, adhesive regions 530, 540, 550, 560, and 570 may have any shape and be offset in a direction parallel to the first surface 502 and the second surface 504. For example, as described above regarding... Figure 3B and Figure 4BAs described, each of adhesive regions 530, 540, 550, 560, and 570 can be a rectangular strip having a longitudinal dimension in the y-direction. The edges of the first adhesive region 530 and the second adhesive region 540 closest to the fourth adhesive region 560 can be offset from the fourth adhesive region 560 by at least 2 mm in the x-direction to prevent heat transfer. The edges of the second adhesive region 540 and the third adhesive region 550 closest to the fifth adhesive region 570 can be offset from the fifth adhesive region 570 by at least 2 mm in the x-direction to prevent heat transfer.

[0075] exist Figure 5 In the illustrated example, one of the adhesive regions defined in the first adhesive layer 510 and the second adhesive layer 520 (the first adhesive layer 510 in this example) includes a central adhesive region (the second adhesive region 540) at the geometric center of the film layer 500 (in the depicted example, the second adhesive region 540 is at the geometric center of the first film surface 520), while one of the adhesive regions defined in the first adhesive layer 510 and the second adhesive layer 520 (the second adhesive layer 520 in the depicted example) includes adhesive regions symmetrically arranged about the central adhesive region in at least one direction (in the depicted example, the fourth adhesive region 560 and the fifth adhesive region 570 are symmetrically arranged about the second adhesive region 540). As described herein, having the adhesive regions at the center of the film layer and symmetrically arranged about the central adhesive region on the other side of the film layer can help prevent any contact between the film layer and any adherent material, thereby preventing heat conduction.

[0076] Unless otherwise expressly stated, it is not intended to interpret any method described herein as requiring its steps to be performed in a particular order. Therefore, no particular order is intended to be inferred unless a method claim actually describes the order in which its steps are to be followed or unless otherwise specifically stated in the claims or specification that the steps are limited to a particular order. Furthermore, as used herein, “a” is intended to include one or more components or elements, and is not intended to be interpreted as referring to only one.

[0077] It will be apparent to those skilled in the art that various modifications and variations can be made without departing from the spirit or scope of the disclosed aspects. Since modifications, combinations, sub-combinations, and variations of the aspects in accordance with the spirit and substance of the disclosed aspects will be apparent to those skilled in the art, the disclosed aspects should be interpreted as encompassing all contents within the scope of the appended claims and their equivalents.

Claims

1. An adhesive stack, the adhesive stack comprising: The film layer includes a first surface and a second surface; A first adhesive layer is disposed on the first surface; and A second adhesive layer is disposed on the second surface, wherein the adhesive regions defined by the first adhesive layer and the second adhesive layer do not overlap each other in a first direction perpendicular to the first surface of the film.

2. The adhesive stack of claim 1, wherein the peripheral edges of the adhesive region defined by the first adhesive layer and the second adhesive layer are separated from each other by at least 2 mm in a second direction parallel to the first surface.

3. The adhesive stack of claim 2, wherein the peripheral edges are spaced at least 4 mm apart from each other in the second direction.

4. The adhesive stack of any one of claims 1 to 3, wherein one of the first adhesive layer and the second adhesive layer includes a single adhesive region on one of the first surface or the second surface.

5. The adhesive stack of claim 4, wherein the other of the first adhesive layer and the second adhesive layer includes a plurality of discrete adhesive regions on the other of the first surface and the second surface.

6. The adhesive stack of claim 5, wherein the plurality of discrete regions are arranged symmetrically about the geometric center of the film layer.

7. The adhesive stack of claim 6, wherein the individual adhesive region is centered on one of the first surface and the second surface.

8. The adhesive stack of claim 4, wherein the discrete adhesive regions and the individual adhesive regions all have the same surface area.

9. The adhesive stack as described in any one of claims 1 to 3, wherein: Both the first adhesive layer and the second adhesive layer define at least two adhesive regions. The first adhesive layer defines a first number of adhesive areas. The second adhesive layer defines a second number of adhesive regions that are different from the first number of adhesive regions.

10. The adhesive stack of claim 9, wherein: One of the first adhesive layer and the second adhesive layer defines a greater number of adhesive regions and includes a central adhesive region at the geometric center of the film layer, and The first adhesive layer and the second adhesive layer define a smaller number of adhesive regions and include adhesive regions arranged symmetrically about the central adhesive region in at least one direction.

11. The adhesive stack of any one of claims 1 to 3, wherein the film layer is formed of a thermoplastic resin.

12. The adhesive stack of claim 11, wherein the thermoplastic resin is polyethylene terephthalate, and wherein the thickness of the film layer is at least 35 mm.

13. The adhesive stack of any one of claims 1 to 3, wherein the first adhesive layer and the second adhesive layer are formed of acrylic pressure-sensitive adhesive.

14. An apparatus, the apparatus comprising: Base, the base including a base surface; A substrate, the substrate including a first main surface and a second main surface opposite to the first main surface, the first main surface facing away from the base; and An adhesive stack disposed between the base and the substrate, the adhesive stack comprising: The film layer includes a first surface and a second surface; A first adhesive layer, wherein the first adhesive layer is disposed on the first surface and bonds the first surface to the second main surface; and A second adhesive layer is disposed on the second surface and bonds the second surface to the base surface, such that the substrate is bonded to the base via the adhesive stack, wherein: The adhesive regions defined by the first adhesive layer and the second adhesive layer do not overlap each other in a first direction perpendicular to the surface of the base, and When the first main surface of the substrate is heated to a temperature above 50°C by a heat source that emits heat flux onto the first main surface, the adhesive stack does not detach from the base or substrate.

15. The device of claim 14, wherein the substrate is a glass substrate.

16. The device of claim 15, wherein the base is a glass plate.

17. The device of claim 15, wherein the adhesive stack is configured such that the film layer does not contact the base or the substrate.

18. The device of any one of claims 14 to 17, wherein the peripheral edges of the adhesive region defined by the first adhesive layer and the second adhesive layer are separated from each other by at least 2 mm in a second direction parallel to the first surface.

19. The device of claim 18, wherein the edges are spaced at least 4 mm apart from each other in the second direction.

20. The device of any one of claims 14 to 17, wherein one of the first adhesive layer and the second adhesive layer includes a single adhesive region on one of the first surface or the second surface.

21. The device of claim 20, wherein the other of the first adhesive layer and the second adhesive layer includes a plurality of discrete adhesive regions on the other of the first surface and the second surface.

22. The device of claim 21, wherein the plurality of discrete regions are arranged symmetrically about the geometric center of the membrane.

23. The device of claim 22, wherein the single adhesive region is centered on one of the first surface and the second surface.

24. The device of claim 21, wherein the discrete adhesive regions and the individual adhesive regions all have the same surface area.

25. The device as claimed in any one of claims 14 to 17, wherein: Both the first adhesive layer and the second adhesive layer define at least two adhesive regions. The first adhesive layer defines a first number of adhesive areas. The second adhesive layer defines a second number of adhesive regions that are different from the first number of adhesive regions.

26. The apparatus of claim 25, wherein: One of the first adhesive layer and the second adhesive layer defines a greater number of adhesive regions and includes a central adhesive region at the geometric center of the film layer, and The first adhesive layer and the second adhesive layer define a smaller number of adhesive regions and include adhesive regions arranged symmetrically about the central adhesive region in at least one direction.

27. The device according to any one of claims 14 to 17, wherein the film layer is formed of a thermoplastic resin.

28. The apparatus of claim 27, wherein the thermoplastic resin is polyethylene terephthalate, and wherein the thickness of the film layer is at least 35 mm.

29. The device of any one of claims 14 to 17, wherein the first adhesive layer and the second adhesive layer are formed of acrylic pressure-sensitive adhesive.

30. A method comprising adhering a substrate to a base using an adhesive stack as described in any one of claims 1 to 3.

31. The method of claim 30, further comprising removing the substrate from the base by applying mechanical force to the substrate to detach the adhesive stack from the base.

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