Coil electronic component

Abstract

The present disclosure provides a coil electronic component, which may include a main body, the first surface and the second surface are opposite to each other in a first direction; the third surface and the fourth surface are opposite to each other in a second direction and are connected with the first surface and the second surface; the fifth surface and the sixth surface are opposite to each other in a third direction and are connected with the first surface to the fourth surface; and including a magnetic material; three or more coils embedded in the main body; and the first insulating layer and the second insulating layer are respectively arranged on the first surface and the second surface of the main body and / or are respectively arranged on the fifth surface and the sixth surface of the main body. The sum of the thickness of the first insulating layer and the thickness of the second insulating layer may be greater than or equal to 90 [mu] m and less than or equal to 120 [mu] m.

Description

Technical Field

[0001] This disclosure relates to a coil electronic assembly. Background Technology

[0002] An inductor (a type of coil electronic component) is a typical passive component used in electronic circuits, together with resistors and capacitors, to remove noise. It also utilizes electromagnetic properties in combination with capacitors to provide resonant circuits, filter circuits, etc., for amplifying signals in a specific frequency band.

[0003] Furthermore, as the demand for high-performance electronic devices increases, their power consumption is also rising. This increased power consumption necessitates higher switching frequencies for power management integrated circuits (PMICs) or DC-DC converters used in the power circuits of electronic devices, resulting in higher output currents and a greater use of power inductors to stabilize the output current of PMICs or DC-DC converters.

[0004] There is also an increasing demand for array-type inductors, which offer the advantage of reduced installation area. Array-type inductors consist of multiple coils and multiple external electrodes connected to the coils, and sufficient insulation resistance between the external electrodes needs to be ensured. Summary of the Invention

[0005] One aspect of this disclosure is to provide a coil electronics assembly with a high switching frequency.

[0006] Another aspect of this disclosure provides a coil electronic assembly with sufficient insulation resistance.

[0007] However, the problems to be solved by this disclosure are not limited to those mentioned above, but can be extended in various ways within the scope of the technical spirit included in the embodiments.

[0008] This disclosure provides a coil electronic assembly, which may include: a body having a first and a second surface opposite to each other in a first direction, a third and a fourth surface opposite to each other in a second direction and connecting the first and second surfaces, and a fifth and a sixth surface opposite to each other in a third direction and connecting the first and fourth surfaces, and comprising a magnetic material; three or more coils embedded in the body; and a first insulating layer and a second insulating layer respectively disposed on the first and second surfaces of the body and / or respectively disposed on the fifth and sixth surfaces of the body. The sum of the thickness of the first insulating layer and the thickness of the second insulating layer may be greater than or equal to 90 μm and less than or equal to 120 μm.

[0009] Both the first insulating layer and the second insulating layer may include magnetic materials.

[0010] The magnetic material included in the first insulating layer and the magnetic material included in the second insulating layer may be different from the magnetic material included in the body.

[0011] The magnetic permeability of the first insulating layer may be greater than that of the main body, and the magnetic permeability of the second insulating layer may be greater than that of the main body.

[0012] The coil electronic assembly may further include a first support member, a second support member, and a third support member, which are embedded in the body and spaced apart from each other. The three or more coils may include a first coil, a second coil, and a third coil spaced apart from each other. The first coil may be disposed on the first support member, the second coil may be disposed on the second support member, and the third coil may be disposed on the third support member.

[0013] The winding axis of each of the first coil, the second coil, and the third coil may be parallel to the third direction, the first insulating layer may be disposed on the fifth surface of the body, and the second insulating layer may be disposed on the sixth surface of the body.

[0014] The winding axis of each of the first coil, the second coil, and the third coil may be parallel to the first direction, the first insulating layer may be disposed on the fifth surface of the body, and the second insulating layer may be disposed on the sixth surface of the body.

[0015] The winding axis of each of the first coil, the second coil, and the third coil may be parallel to the first direction, the first insulating layer may be disposed on the first surface of the body, and the second insulating layer may be disposed on the second surface of the body.

[0016] The first coil may include two coil patterns respectively disposed on one and another surface opposite to each other on the first support member and connected to each other by a through hole through the first support member; the second coil may include two coil patterns respectively disposed on one and another surface opposite to each other on the second support member and connected to each other by a through hole through the second support member; and the third coil may include two coil patterns respectively disposed on one and another surface opposite to each other on the third support member and connected to each other by a through hole through the third support member.

[0017] The main body may be a stack of multiple magnetic sheets, and the three or more coils may include a first coil, a second coil, and a third coil spaced apart from each other, and each of the first coil, the second coil, and the third coil may include multiple conductive patterns respectively disposed on the multiple magnetic sheets and connected to each other.

[0018] The three or more coils may include a first coil, a second coil, and a third coil spaced apart from each other, and each of the first coil, the second coil, and the third coil may include at least one turn of wire.

[0019] The main body may include a first core passing through the first coil, a second core passing through the second coil, and a third core passing through the third coil.

[0020] An insulating film may be provided on the surface of the conductor.

[0021] The coil electronics may further include three or more pairs of external electrodes, which are respectively connected to the three or more coils. Each of the three or more pairs of external electrodes may include one external electrode disposed on the third surface and another external electrode disposed on the fourth surface.

[0022] The first insulating layer and the second insulating layer may be disposed only on a surface selected from the first surface, the second surface, the fifth surface and the sixth surface of the body.

[0023] The first insulating layer and the second insulating layer may be disposed only on the first surface and the second surface of the main body, respectively, or may be disposed only on the fifth surface and the sixth surface of the main body, respectively.

[0024] According to this disclosure, a coil electronic component with a high switching frequency can be provided.

[0025] Furthermore, according to this disclosure, a coil electronics assembly that ensures sufficient insulation resistance can be provided. Attached Figure Description

[0026] Figure 1 This is a schematic perspective view of a coil electronics assembly according to an embodiment.

[0027] Figure 2 yes Figure 1 Floor plan.

[0028] Figure 3 It is along Figure 1 A schematic cross-sectional view taken from line I-I'.

[0029] Figure 4This is a schematic perspective view of a coil electronics assembly according to another embodiment.

[0030] Figure 5 This is a schematic perspective view of a coil electronics assembly according to yet another embodiment.

[0031] Figure 6 This is a schematic perspective view of a coil electronics assembly according to another embodiment.

[0032] Figure 7 yes Figure 6 Floor plan.

[0033] Figure 8 It is shown Figure 6 An exploded perspective view of the main body of the coil electronic component.

[0034] Figure 9 This is a schematic perspective view of a coil electronics assembly according to another embodiment.

[0035] Figure 10 It is along Figure 9 A schematic cross-sectional view taken from line II-II'. Detailed Implementation

[0036] In the following, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings to enable those skilled in the art to readily implement the embodiments of the present disclosure. The drawings and description are to be considered illustrative rather than restrictive in nature. Throughout the specification, the same reference numerals denote the same elements. Furthermore, in the drawings, some components are exaggerated, omitted, or shown schematically, and the dimensions of the individual components do not perfectly reflect their actual dimensions.

[0037] It should be understood that the accompanying drawings are provided only to help understand the embodiments disclosed in this specification, and the technical spirit disclosed in this specification is not limited to the drawings. This disclosure includes all variations, equivalents or alternatives that do not depart from the technical spirit of this disclosure.

[0038] Terms including ordinal numbers such as first and second are used to describe various components, but components are not limited by these terms. These terms are only used to distinguish one component from another.

[0039] Furthermore, it will be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" another element, the element may be directly on the other element, or there may be an intermediate element present. In contrast, when an element is referred to as being "directly on" another element, there is no intermediate element present. Additionally, when an element is referred to as being "on" a reference portion, the element is located "above" or "below" the reference portion, and this does not specifically mean that the element is located "above" or "on" the reference portion in a direction opposite to the direction of gravity.

[0040] Throughout this specification, it should be understood that the terms "comprising" or "having" indicate the presence of the features, quantities, steps, operations, components, parts, or combinations thereof described in the specification, but do not preclude the possibility of the presence or addition of one or more other features, quantities, steps, operations, components, parts, or combinations thereof. Therefore, unless expressly stated to the contrary, the word "comprising" and variations such as "including" or "containing" will be understood to imply the inclusion of the stated elements, but do not exclude any other elements.

[0041] Furthermore, throughout the instruction manual, "plan view" refers to the target portion viewed from the top, and "section view" refers to the cross-section obtained by vertically cutting the target portion viewed from the side.

[0042] Furthermore, throughout the specification, the term "connection" can refer not only to a direct connection between two or more components, but also to an indirect connection between two or more components through other components; it can refer not only to a physical connection, but also to an electrical connection; and it can also refer to a situation where two or more components are called by different names according to their location and / or function, but are integrated.

[0043] Figure 1 This is a schematic perspective view of a coil electronics assembly according to an embodiment. Figure 2 yes Figure 1 The floor plan, and Figure 3 It is along Figure 1 A schematic cross-sectional view taken from line I-I'.

[0044] Reference Figure 1 , Figure 2 and Figure 3 According to the embodiment, the coil electronics 1000 corresponds to an array-type inductor comprising a plurality of coils 111, 112, 113 and 114 spaced apart from each other.

[0045] The coil electronics assembly 1000 includes a first coil 111, a second coil 112, a third coil 113, and a fourth coil 114, but the embodiments are not limited thereto. For example, if desired, the coil electronics assembly of this disclosure may include three coils or more than four coils.

[0046] The coil electronics assembly 1000 includes a main body 100, a plurality of external electrodes 121, 122, 123, 124, 125, 126, 127 and 128 disposed on the outer surface of the main body 100, and a surface insulating layer 900.

[0047] The main body 100 may have a generally rectangular hexahedral shape, but this embodiment is not limited to this. Due to the shrinkage of magnetic powder or the like during sintering, the main body 100 may not have a perfect rectangular hexahedral shape, but may have a generally rectangular hexahedral shape. For example, the main body 100 may have a generally rectangular hexahedral shape, for example, the corners or vertices may have a rounded shape.

[0048] In this embodiment, for ease of description, the two surfaces of the main body 100 that are opposite each other in the length direction (L-axis direction) will be defined as the first surface S1 and the second surface S2, the two surfaces of the main body 100 that are opposite each other in the width direction (W-axis direction) will be defined as the third surface S3 and the fourth surface S4, and the two surfaces of the main body 100 that are opposite each other in the thickness direction (T-axis direction) will be defined as the fifth surface S5 and the sixth surface S6.

[0049] The length of the coil electronics component 1000 can be expressed as: the maximum length of a plurality of line segments connected to the two outermost boundary lines of the coil electronics component 1000 that are opposite each other in the length direction (L-axis direction) and parallel to the length direction (L-axis direction) at the center of the coil electronics component 1000 in the width direction (W-axis direction) and in the length direction (L-axis direction). Alternatively, the length of the coil electronics component 1000 can be expressed as the minimum length of a plurality of line segments connected to the two outermost boundary lines of the coil electronics component 1000 that are opposite each other in the length direction (L-axis direction) and parallel to the length direction (L-axis direction) in the cross-sectional photograph. Optionally, the length of the coil electronics 1000 may represent the arithmetic mean of the lengths of at least two of a plurality of line segments that connect the two outermost boundary lines of the coil electronics 1000 shown in the cross-sectional photograph above and are opposite each other in the length direction (L-axis direction) and parallel to the length direction (L-axis direction).

[0050] The thickness of the coil electronic component 1000 can be represented as the maximum length of a plurality of line segments parallel to the thickness direction (T-axis), connected to the two outermost boundary lines of the coil electronic component 1000 opposite to each other in the thickness direction (T-axis) at the center of the coil electronic component 1000 in the width direction (W-axis direction). Alternatively, the thickness of the coil electronic component 1000 can be represented as the minimum length of a plurality of line segments parallel to the thickness direction (T-axis) connected to the two outermost boundary lines of the coil electronic component 1000 opposite to each other in the thickness direction (T-axis) as shown in the cross-sectional photograph. Optionally, the thickness of the coil electronics 1000 may be represented as the arithmetic mean of the lengths of at least two of a plurality of line segments that are opposite each other in the thickness direction (T-axis direction) and parallel to the thickness direction (T-axis direction) of the coil electronics 1000 shown in the cross-sectional photograph above.

[0051] The width of the coil electronics component 1000 can be represented as the maximum length of a plurality of line segments that connect the two outermost boundary lines of the coil electronics component 1000 that are opposite each other in the width direction (W-axis direction) at the center of the coil electronics component 1000 in the thickness direction (T-axis direction) and are parallel to the width direction (W-axis direction). Alternatively, the width of the coil electronics component 1000 can be represented as the minimum length of a plurality of line segments that connect the two outermost boundary lines of the coil electronics component 1000 that are opposite each other in the width direction (W-axis direction) and are parallel to the width direction (W-axis direction). Optionally, the width of the coil electronics 1000 may represent the arithmetic mean of the lengths of at least two of a plurality of line segments that connect the two outermost boundary lines of the coil electronics 1000 shown in the cross-sectional photograph above and are opposite to each other in the width direction (W-axis direction) and parallel to the width direction (W-axis direction).

[0052] The length, width, and thickness of the coil electronics assembly 1000 can each be measured using a micrometer measurement method. In this method, a micrometer with gage repeatability and reproducibility (R&R) can be used to measure the length by setting a zero point, inserting the coil electronics assembly 1000 according to this embodiment between the tips of the micrometer, and rotating the measuring rod of the micrometer. When measuring the length of the coil electronics assembly 1000 using this micrometer method, the length can represent a single measurement or the arithmetic mean of multiple measurements. This is equally applicable to the measurement of the width and thickness of the coil electronics assembly 1000.

[0053] A plurality of coils 111, 112, 113, and 114 spaced apart from each other along the longitudinal direction (L-axis direction), and a plurality of support members 131, 132, 133, and 134 may be provided in the main body 100. The plurality of coils preferably have substantially the same shape. Here, disclosure that the plurality of coils have the same shape or substantially the same shape means that the line width, thickness, and number of turns of the coil patterns of each coil are substantially the same. Figures 1 to 3 In this embodiment, for ease of description, the number of coil turns is expressed as approximately 1.5 turns, but this embodiment is not limited to this and can be appropriately selected by those skilled in the art considering electrical characteristics (such as the required inductance and DC resistance (Rdc)).

[0054] The main body 100 constitutes the shape of the coil electronic assembly 1000 and is the space in which a magnetic circuit is formed when current is applied to the first coil 111, the second coil 112, the third coil 113 and the fourth coil 114 through the multiple external electrodes 121, 122, 123, 124, 125, 126, 127 and 128. This magnetic circuit is the path through which the magnetic flux generated by the first coil 111, the second coil 112, the third coil 113 and the fourth coil 114 passes.

[0055] The body 100 surrounds and encloses the first coil 111, the second coil 112, the third coil 113, and the fourth coil 114, as well as the first support member 131, the second support member 132, the third support member 133, and the fourth support member 134, and includes a magnetic material. For example, the body 100 may include magnetic particles, and an insulating material may be interposed between the magnetic particles.

[0056] The magnetic material may include first metallic magnetic particles, second metallic magnetic particles with a particle size smaller than the first metallic magnetic particles, and third metallic magnetic particles with a particle size smaller than the second metallic magnetic particles. The average particle size D of the first metallic magnetic particles... 50 The average particle size D of the second metallic magnetic particles can be greater than or equal to 5 μm and less than or equal to 30 μm. 50It can be greater than or equal to 1 μm and less than or equal to 5 μm, and the average particle size D of the third metallic magnetic particle is... 50 It can be greater than or equal to 0.05 μm and less than or equal to 0.5 μm.

[0057] Magnetic particles can be ferrite particles or metallic magnetic particles that exhibit magnetic properties.

[0058] Ferrite particles may include, for example, at least one of spinel-type ferrites (such as Mg-Zn-based ferrites, Mn-Zn-based ferrites, Mn-Mg-based ferrites, Cu-Zn-based ferrites, Mg-Mn-Sr-based ferrites, Ni-Zn-based ferrites), hexagonal ferrites (such as Ba-Zn-based ferrites, Ba-Mg-based ferrites, Ba-Ni-based ferrites, Ba-Co-based ferrites, Ba-Ni-Co-based ferrites), garnet-type ferrites (such as yttrium (Y)-based ferrites) and Li-based ferrites.

[0059] The metallic magnetic particles may include two or more types of metallic magnetic particles with specific different compositions, and may include at least one selected from the group consisting of iron (Fe), silicon (Si), chromium (Cr), cobalt (Co), molybdenum (Mo), aluminum (Al), niobium (Nb), copper (Cu), and nickel (Ni). For example, the metallic magnetic particles may be at least one of pure iron, Fe-Si based alloys, Fe-Si-Al based alloys, Fe-Ni based alloys, Fe-Ni-Mo based alloys, Fe-Ni-Mo-Cu based alloys, Fe-Co based alloys, Fe-Ni-Co based alloys, Fe-Cr based alloys, Fe-Cr-Si based alloys, Fe-Si-Cu-Nb based alloys, Fe-Ni-Cr based alloys, and Fe-Cr-Al based alloys. Here, different compositions of the metallic magnetic particles may mean different amounts of the contained elements.

[0060] The metallic magnetic particles can be amorphous or crystalline. For example, the metallic magnetic particles can be Fe-Si-B-Cr based amorphous alloys, but the embodiments are not limited thereto. The metallic magnetic particles can have an average particle size ranging from about 0.1 μm to about 30 μm, but the embodiments are not limited thereto.

[0061] In this specification, the average particle size can be expressed as D 90 D 50 Particle size distribution, expressed as such. Particle size distribution is well known to those skilled in the art; it is an index indicating the proportion of particles of a certain size (particle diameter) within a group of particles to be measured. D 50 (The particle size corresponding to 50% of the cumulative volume of the particle size distribution) refers to the average particle size.

[0062] Metallic magnetic particles can be two or more different types of metallic magnetic particles. Here, different types of metallic magnetic particles mean that the metallic magnetic particles are distinguishable from each other in at least one aspect of average particle size, composition, component ratio, crystallinity, and shape.

[0063] The insulating material may include at least one of epoxy resin, polyimide, liquid crystal polymer, etc., but the embodiments are not limited thereto.

[0064] Coils 111, 112, 113, and 114 are embedded in the main body 100, exhibiting the characteristics of the coil electronics assembly 1000. For example, when the coil electronics assembly 1000 according to this embodiment is used as a power inductor, when current is applied to coils 111, 112, 113, and 114, the coils can be used to stabilize the power supply of the electronic device by storing energy in the form of a magnetic field and maintaining the output voltage.

[0065] Starting with the first coil 111, which is closest to the first surface S1 of the main body 100, the second coil 112, the third coil 113, and the fourth coil 114 are arranged sequentially in the length direction (L-axis direction). Therefore, the fourth coil 114 is set closest to the second surface S2 of the main body 100, and the second coil 112 and the third coil 113 are arranged between the first coil 111 and the fourth coil 114.

[0066] The corresponding winding axes of the first coil 111, the second coil 112, the third coil 113, and the fourth coil 114 can be parallel to the thickness direction (T-axis direction) of the main body 100.

[0067] The first coil 111 is connected to the first external electrode 121 and the second external electrode 122, which are spaced apart from each other in the width direction (W-axis direction) of the body 100. The second coil 112 is connected to the third external electrode 123 and the fourth external electrode 124, which are also spaced apart from each other in the width direction (W-axis direction) of the body 100.

[0068] The third coil 113 is connected to the fifth external electrode 125 and the sixth external electrode 126, which are spaced apart from each other in the width direction (W-axis direction) of the body 100. The fourth coil 114 is connected to the seventh external electrode 127 and the eighth external electrode 128, which are spaced apart from each other in the width direction (W-axis direction) of the body 100.

[0069] The first external electrode 121, the second external electrode 122, the third external electrode 123, the fourth external electrode 124, the fifth external electrode 125, the sixth external electrode 126, the seventh external electrode 127, and the eighth external electrode 128 extend from the third surface S3 or the fourth surface S4 of the body 100 to cover a portion of the fifth surface S5 and a portion of the sixth surface S6, but the embodiment is not limited thereto. Specifically, the first external electrode 121, the third external electrode 123, the fifth external electrode 125, and the seventh external electrode 127 extend from the third surface S3 of the body 100 to cover a portion of the fifth surface S5 and a portion of the sixth surface S6, and the second external electrode 122, the fourth external electrode 124, the sixth external electrode 126, and the eighth external electrode 128 extend from the fourth surface S4 of the body 100 to cover a portion of the fifth surface S5 and a portion of the sixth surface S6, but the embodiment is not limited thereto. For example, the first external electrode 121, the second external electrode 122, the third external electrode 123, the fourth external electrode 124, the fifth external electrode 125, the sixth external electrode 126, the seventh external electrode 127, and the eighth external electrode 128 may be disposed only on the third surface S3 or the fourth surface S4 of the body 100, or may extend from the third surface S3 or the fourth surface S4 to cover only a portion of the sixth surface S6.

[0070] For example, the first external electrode 121, the second external electrode 122, the third external electrode 123, the fourth external electrode 124, the fifth external electrode 125, the sixth external electrode 126, the seventh external electrode 127, and the eighth external electrode 128 may include conductive materials such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), chromium (Cr), titanium (Ti), or alloys thereof, but the embodiments are not limited thereto.

[0071] As another example, the first external electrode 121, the second external electrode 122, the third external electrode 123, the fourth external electrode 124, the fifth external electrode 125, the sixth external electrode 126, the seventh external electrode 127, and the eighth external electrode 128 may comprise a conductive metal and glass. The conductive metal may be, for example, at least one of copper (Cu), nickel (Ni), tin (Sn), palladium (Pd), platinum (Pt), gold (Au), silver (Ag), tungsten (W), titanium (Ti), lead (Pb), and alloys thereof. The glass composition included in the external electrodes may be a mixture of oxides. The glass composition may include, for example, silicon oxide, boron oxide, aluminum oxide, transition metal oxide, alkali metal oxide, alkaline earth metal oxide, or combinations thereof. Here, transition metals can be selected from zinc (Zn), titanium (Ti), copper (Cu), vanadium (V), manganese (Mn), iron (Fe), and nickel (Ni); alkali metals can be selected from lithium (Li), sodium (Na), and potassium (K); and alkaline earth metals can be selected from magnesium (Mg), calcium (Ca), strontium (Sr), and barium (Ba). The method of forming the external electrode is not particularly limited. For example, the external electrode can be formed by immersing the body in a conductive paste containing a conductive metal and glass, or by printing the conductive paste onto the surface of the body (e.g., by screen printing or gravure printing). Furthermore, various other methods can be used to form the external electrode, such as coating the surface of the body with conductive paste or transferring a dry film formed by drying the conductive paste onto the body.

[0072] Reference Figure 3 The first coil 111 is disposed on the first support member 131. The first coil 111 includes an upper coil 111a disposed on the upper surface 131a of the first support member 131 and a lower coil 111b disposed on the lower surface 131b of the first support member 131. The upper coil 111a and the lower coil 111b are connected to each other through a first through hole V1 penetrating the first support member 131.

[0073] The first support member 131 may be made of an insulating material including a thermosetting insulating resin (such as epoxy resin), a thermoplastic insulating resin (such as polyimide), or a photosensitive insulating resin, or may be formed using an insulating material prepared by impregnating a reinforcing material (such as glass fiber or inorganic filler) into the insulating resin. For example, the support member may be made of an insulating material such as a prepreg, Ajinomoto Build-up Film (ABF), FR-4, bismaleimide triazine (BT) film, or photosensitive dielectric (PID) film, but the embodiments are not limited thereto.

[0074] As an inorganic filler, at least one selected from the group consisting of silicon dioxide (SiO2), aluminum oxide (Al2O3), silicon carbide (SiC), barium sulfate (BaSO4), talc, clay, mica powder, aluminum hydroxide (Al(OH)3), magnesium hydroxide (Mg(OH)2), calcium carbonate (CaCO3), magnesium carbonate (MgCO3), magnesium oxide (MgO), boron nitride (BN), aluminum borate (AlBO3), barium titanate (BaTiO3), and calcium zirconate (CaZrO3) can be used.

[0075] Each of the first coil 111 and the first via V1 may be made of a conductive material such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), or alloys thereof, but the embodiments are not limited thereto.

[0076] An insulating film IF may be disposed between the first coil 111 and the body 100. The insulating film IF may be formed along the surface of the first support member 131 and the surface of the first coil 111. The insulating film IF is not present in the portions of the first support member 131 and the first coil 111 connected to the first external electrode 121 and the second external electrode 122. The insulating film IF serves to insulate the first coil 111 from the body 100 and may include known insulating materials such as parylene. The insulating film IF may be formed using any insulating material, and there are no particular limitations. For example, the insulating film IF may be formed using polyurethane resin, polyester resin, epoxy resin, or polyamide-imide resin. The insulating film IF may be formed by methods such as vapor deposition, but is not limited thereto. For example, the insulating film IF may be formed by stacking insulating films on both surfaces of the first support member 131.

[0077] The second coil 112 includes an upper coil 112a and a lower coil 112b connected to each other through a second through-hole V2 passing through the second support member 132; the third coil 113 includes an upper coil 113a and a lower coil 113b connected to each other through a third through-hole V3 passing through the third support member 133; and the fourth coil 114 includes an upper coil 114a and a lower coil 114b connected to each other through a fourth through-hole V4 passing through the fourth support member 134. The second coil 112, the third coil 113, and the fourth coil 114 differ from the first coil 111 only in their positions, therefore redundant descriptions of them will be omitted.

[0078] The surface insulating layer 900 can be disposed on the fifth surface S5 and the sixth surface S6 of the main body 100.

[0079] The surface insulating layer 900 may partially cover the fifth surface S5 and the sixth surface S6 of the main body 100. That is, the first external electrode 121, the second external electrode 122, the third external electrode 123, the fourth external electrode 124, the fifth external electrode 125, the sixth external electrode 126, the seventh external electrode 127, and the eighth external electrode 128 may be disposed on a portion of the fifth surface S5 and a portion of the sixth surface S6 of the main body 100, and the surface insulating layer 900 does not cover the first external electrode 121, the second external electrode 122, the third external electrode 123, the fourth external electrode 124, the fifth external electrode 125, the sixth external electrode 126, the seventh external electrode 127, and the eighth external electrode 128.

[0080] The surface insulating layer 900 can prevent leakage current between the first external electrode 121, the second external electrode 122, the third external electrode 123, the fourth external electrode 124, the fifth external electrode 125, the sixth external electrode 126, the seventh external electrode 127 and the eighth external electrode 128.

[0081] The surface insulating layer 900 may include a magnetic material. For example, the surface insulating layer 900 may include magnetic particles, and the insulating material may be between the magnetic particles.

[0082] The permeability of the surface insulating layer 900 can be greater than that of the body 100. For example, the permeability of the body 100 can be 12 H / m, and the permeability of the surface insulating layer 900 can be 24 H / m. In this case, the surface insulating layer 900 can be made of a different material than the body 100. The composition of the material forming the surface insulating layer 900 and the composition of the material forming the body 100 can be inferred from scanning electron microscope (SEM) images of the coil electronics assembly.

[0083] For example, as a method for adjusting the permeability of the surface insulating layer 900 and the main body 100, the volume fraction of the first magnetic particles included in the surface insulating layer 900 and the volume fraction of the second magnetic particles included in the main body 100 can be set to be different. Here, the volume fraction of the magnetic particles refers to the ratio of the volume of the first magnetic particles to the volume of the surface insulating layer 900 or the ratio of the volume of the second magnetic particles to the volume of the main body 100. In order to adjust the relative permeability of the surface insulating layer 900 and the main body 100 based on the volume fraction of the first magnetic particles and the volume fraction of the second magnetic particles, the first magnetic particles and the second magnetic particles can be made of the same material, for example, a metal alloy with the same composition. In addition, as a method for adjusting the permeability of the surface insulating layer 900 and the main body 100, when verified in cross-section, the area fraction of the first magnetic particles included in the first insulating layer 900 and the area fraction of the second magnetic particles included in the main body 100 can be set to be different. Here, the area fraction of magnetic particles refers to the ratio of the cross-sectional area of ​​the first magnetic particle to the cross-sectional area of ​​the surface insulating layer 900, or the ratio of the cross-sectional area of ​​the second magnetic particle to the cross-sectional area of ​​the main body 100.

[0084] When the permeability of the body 100 is less than the permeability of the surface insulating layer 900, the volume fraction of the second magnetic particles included in the body 100 is less than the volume fraction of the first magnetic particles included in the surface insulating layer 900. If the permeability of the body 100 is less than the permeability of the surface insulating layer 900, the coupling coefficient of the first coil 111, the second coil 112, the third coil 113, and the fourth coil 114 can be relatively increased. Here, the relative increase in the coupling coefficient means that the coupling coefficient is larger compared to the case where the permeability of the body 100 and the permeability of the surface insulating layer 900 are the same. When the permeability of the body 100 is relatively small, the magnetic flux flowing through the body 100 is relatively small, and the mutual inductance caused by the magnetic flux shared by the first coil 111, the second coil 112, the third coil 113, and the fourth coil 114 is relatively large. Here, the magnetic flux flowing through the body 100 can be understood as... Figure 3 The magnetic flux flowing through the main body 100 along the length direction (L-axis direction).

[0085] The surface insulating layer 900 includes a first insulating layer 910 and a second insulating layer 920. The first insulating layer 910 is disposed on the fifth surface S5 of the body 100, and the second insulating layer 920 is disposed on the sixth surface S6 of the body 100.

[0086] The sum of the thickness t1 of the first insulating layer 910 and the thickness t2 of the second insulating layer 920 can be greater than or equal to 90 μm and less than or equal to 120 μm.

[0087] If the sum of the thickness t1 of the first insulating layer 910 and the thickness t2 of the second insulating layer 920 is less than 90 μm, sufficient insulation resistance (IR) cannot be ensured because the surface insulating layer is too thin.

[0088] If the sum of the thickness t1 of the first insulating layer 910 and the thickness t2 of the second insulating layer 920 is greater than 120 μm, the self-inductance of the coil may increase due to the relatively large permeability, resulting in a significant increase in inductance. Furthermore, high permeability can imply large particles, which may lead to increased eddy current losses and consequently, an excessively low switching frequency.

[0089] Figure 4 This is a schematic perspective view of a coil electronics assembly according to another embodiment.

[0090] Reference Figure 4 The coil electronic assembly 2000 includes a main body 1100 and a first external electrode 1121, a second external electrode 1122, a third external electrode 1123, a fourth external electrode 1124, a fifth external electrode 1125, a sixth external electrode 1126, a seventh external electrode 1127 and an eighth external electrode 1128 disposed on the outer surface of the main body 1100.

[0091] Although the first external electrode 1121, the second external electrode 1122, the third external electrode 1123, the fourth external electrode 1124, the fifth external electrode 1125, the sixth external electrode 1126, the seventh external electrode 1127, and the eighth external electrode 1128 are shown to extend from the third surface S3 or the fourth surface S4 of the body 1100 and cover a portion of the sixth surface S6, the embodiments are not limited thereto. For example, the first external electrode 1121, the second external electrode 1122, the third external electrode 1123, the fourth external electrode 1124, the fifth external electrode 1125, the sixth external electrode 1126, the seventh external electrode 1127, and the eighth external electrode 1128 may be disposed only on the third surface S3 or the fourth surface S4 of the body 100, or may extend from the third surface S3 or the fourth surface S4 to cover a portion of the fifth surface S5 and a portion of the sixth surface S6.

[0092] The first coil 1111, the second coil 1112, the third coil 1113, and the fourth coil 1114 are embedded in the main body 1100. The corresponding winding axes of the first coil 1111, the second coil 1112, the third coil 1113, and the fourth coil 1114 can be parallel to the length direction (L-axis direction) of the main body 1100.

[0093] A surface insulating layer 1900 is disposed on the fifth surface S5 and the sixth surface S6 of the main body 1100.

[0094] The surface insulating layer 1900 includes a first insulating layer 1910 and a second insulating layer 1920. The first insulating layer 1910 is disposed on the fifth surface S5 of the body 1100, and the second insulating layer 1920 is disposed on the sixth surface S6 of the body 1100.

[0095] The sum of the thickness of the first insulating layer 1910 and the thickness of the second insulating layer 1920 can be greater than or equal to 90 μm and less than or equal to 120 μm.

[0096] In addition to the components mentioned above, the remaining components and Figure 1 The components of the coil electronic assembly shown are identical, so a repeated description of it will be omitted.

[0097] Figure 5 This is a schematic perspective view of a coil electronics assembly according to yet another embodiment.

[0098] Reference Figure 5 The coil electronic assembly 3000 includes a main body 2100 and a first external electrode 2121, a second external electrode 2122, a third external electrode 2123, a fourth external electrode 2124, a fifth external electrode 2125, a sixth external electrode 2126, a seventh external electrode 2127 and an eighth external electrode 2128 disposed on the outer surface of the main body 2100.

[0099] The first coil 2111, the second coil 2112, the third coil 2113, and the fourth coil 2114 are embedded in the main body 2100. The corresponding winding axes of the first coil 2111, the second coil 2112, the third coil 2113, and the fourth coil 2114 can be parallel to the length direction (L-axis direction) of the main body 2100.

[0100] A surface insulating layer 2900 is disposed on the first surface S1 and the second surface S2 of the main body 2100.

[0101] The surface insulating layer 2900 includes a first insulating layer 2910 and a second insulating layer 2920. The first insulating layer 2910 is disposed on a first surface S1 of the body 2100, and the second insulating layer 2920 is disposed on a second surface S2 of the body 2100.

[0102] The sum of the thickness of the first insulating layer 2910 and the thickness of the second insulating layer 2920 can be greater than or equal to 90 μm and less than or equal to 120 μm.

[0103] In addition to the components mentioned above, the remaining components and Figure 1 and Figure 4 The components of the coil electronic assembly shown are identical, so a repeated description of it will be omitted.

[0104] Figure 6This is a schematic perspective view of a coil electronics assembly according to another embodiment. Figure 7 yes Figure 6 The floor plan, and Figure 8 It is shown Figure 6 An exploded perspective view of the main body of the coil electronic component.

[0105] Reference Figure 6 and Figure 7 The coil electronic assembly 4000 includes a main body 3100, a first external electrode 3121, a second external electrode 3122, a third external electrode 3123, a fourth external electrode 3124, a fifth external electrode 3125, a sixth external electrode 3126, a seventh external electrode 3127 and an eighth external electrode 3128 disposed on the outer surface of the main body 3100, and a surface insulating layer 3900.

[0106] The first coil 3111, the second coil 3112, the third coil 3113, and the fourth coil 3114 are embedded in the main body 3100. The corresponding winding axes of the first coil 3111, the second coil 3112, the third coil 3113, and the fourth coil 3114 can be parallel to the thickness direction (T-axis direction) of the main body 3100.

[0107] The surface insulating layer 3900 is disposed on the fifth surface S5 and the sixth surface S6 of the main body 3100.

[0108] The surface insulating layer 3900 includes a first insulating layer 3910 and a second insulating layer 3920. The first insulating layer 3910 is disposed on the fifth surface S5 of the body 3100, and the second insulating layer 3920 is disposed on the sixth surface S6 of the body 3100.

[0109] The sum of the thickness of the first insulating layer 3910 and the thickness of the second insulating layer 3920 can be greater than or equal to 90 μm and less than or equal to 120 μm.

[0110] Reference Figure 8The main body 3100 can be a laminate made by stacking multiple magnetic sheets 3141, 3142, 3143, 3144, 3145, 3146, 3147, 3148 and 3149 and multiple magnetic sheets 3150 and 3151 in the thickness direction (T-axis direction). The magnetic sheets 3111a to 3111i, including a portion of the first coil 3111, conductive patterns 3112a to 3112i, including a portion of the second coil 3112, conductive patterns 3113a to 3113i, including a portion of the third coil 3113, and conductive patterns 3114a to 3114i, including a portion of the fourth coil 3114, are provided on the magnetic sheets 3150 and 3151, but no conductive patterns are provided on the magnetic sheets 3150 and 3151.

[0111] Multiple generally J-shaped conductive patterns 3111a, 3112a, 3113a, and 3114a are formed on the magnetic sheet 3141. One end of each of the conductive patterns 3111a, 3112a, 3113a, and 3114a extends from the edge of the magnetic sheet 3141 to be exposed from the fourth surface S4 of the body 3100.

[0112] Multiple conductive patterns 3111b, 3112b, 3113b, and 3114b are formed on the magnetic sheet 3142 and are electrically connected to the corresponding conductive patterns 3111a, 3112a, 3113a, and 3114a. The conductive patterns 3111b, 3112b, 3113b, and 3114b correspond to approximately three-quarters of the turns of the first coil 3111, the second coil 3112, the third coil 3113, and the fourth coil 3114, respectively, and are generally U-shaped.

[0113] Multiple conductive patterns 3111c, 3112c, 3113c, and 3114c are formed on the magnetic sheet 3143 and are electrically connected to the corresponding conductive patterns 3111b, 3112b, 3113b, and 3114b. The conductive patterns 3111c, 3112c, 3113c, and 3114c correspond to approximately 3 / 4 turns of the first coil 3111, the second coil 3112, the third coil 3113, and the fourth coil 3114, respectively, and are generally C-shaped.

[0114] Multiple conductive patterns 3111d, 3112d, 3113d, and 3114d are formed on the magnetic sheet 3144 and are electrically connected to the corresponding conductive patterns 3111c, 3112c, 3113c, and 3114c. The conductive patterns 3111d, 3112d, 3113d, and 3114d correspond to approximately 3 / 4 turns of the first coil 3111, the second coil 3112, the third coil 3113, and the fourth coil 3114, respectively, and are generally U-shaped.

[0115] Multiple conductive patterns 3111e, 3112e, 3113e, and 3114e are formed on the magnetic sheet 3145 and are electrically connected to the corresponding conductive patterns 3111d, 3112d, 3113d, and 3114d. The conductive patterns 3111e, 3112e, 3113e, and 3114e correspond to approximately 3 / 4 turns of the first coil 3111, the second coil 3112, the third coil 3113, and the fourth coil 3114, respectively, and are generally C-shaped.

[0116] Multiple conductive patterns 3111f, 3112f, 3113f, and 3114f are formed on the magnetic sheet 3146 and are electrically connected to the corresponding conductive patterns 3111e, 3112e, 3113e, and 3114e. The conductive patterns 3111f, 3112f, 3113f, and 3114f have the same structure as the aforementioned conductive patterns 3111b, 3112b, 3113b, and 3114b.

[0117] Multiple conductive patterns 3111g, 3112g, 3113g, and 3114g are formed on the magnetic sheet 3147 and are electrically connected to the corresponding conductive patterns 3111f, 3112f, 3113f, and 3114f. The conductive patterns 3111g, 3112g, 3113g, and 3114g have the same structure as the aforementioned conductive patterns 3111c, 3112c, 3113c, and 3114c.

[0118] Multiple conductive patterns 3111h, 3112h, 3113h, and 3114h are formed on the magnetic sheet 3148 and are electrically connected to the corresponding conductive patterns 3111g, 3112g, 3113g, and 3114g. The conductive patterns 3111h, 3112h, 3113h, and 3114h have the same structure as the aforementioned conductive patterns 3111d, 3112d, 3113d, and 3114d.

[0119] Multiple generally J-shaped conductive patterns 3111i, 3112i, 3113i, and 3114i are formed on the magnetic sheet 3149 and electrically connected to corresponding conductive patterns 3111h, 3112h, 3113h, and 3114h. One end of each of the conductive patterns 3111i, 3112i, 3113i, and 3114i extends from the edge of the magnetic sheet 3149 to be exposed from the third surface S3 of the body 3100. Furthermore, the electrical connection between the conductive patterns on different magnetic sheets is made via through holes (not shown) formed in the magnetic sheets.

[0120] A magnetic sheet 3150 without conductive patterns is stacked on top of a magnetic sheet 3141. The magnetic sheet 3150 protects the conductive patterns 3111a, 3112a, 3113a, and 3114a on the magnetic sheet 3141. In addition, another magnetic sheet 3151 without conductive patterns is disposed below the magnetic sheet 3149.

[0121] The quantity of magnetic sheets described above is merely an example, and this embodiment is not limited thereto.

[0122] The first insulating layer 3910 is disposed above the magnetic sheet 3150, and the second insulating layer 3920 is disposed below the magnetic sheet 3150.

[0123] The sum of the thickness of the first insulating layer 3910 and the thickness of the second insulating layer 3920 can be greater than or equal to 90 μm and less than or equal to 120 μm.

[0124] In addition to the components mentioned above, the remaining components and Figure 1 The components of the coil electronic assembly shown are identical, so a repeated description of it will be omitted.

[0125] Figure 9 This is a schematic perspective view of a coil electronics assembly according to another embodiment, and Figure 10 It is along Figure 9 A schematic cross-sectional view taken from line II-II'.

[0126] Reference Figure 9 and Figure 10 The coil electronic assembly 5000 includes a main body 4100, a first external electrode 4121, a second external electrode 4122, a third external electrode 4123, a fourth external electrode 4124, a fifth external electrode 4125, a sixth external electrode 4126, a seventh external electrode 4127 and an eighth external electrode 4128 disposed on the outer surface of the main body 4100, and a surface insulating layer 4900.

[0127] The first coil 4111, the second coil 4112, the third coil 4113, and the fourth coil 4114 are embedded in the body 4100. The body 4100 may include a first core 4410 passing through the first coil 4111, a second core 4420 passing through the second coil 4112, a third core 4430 passing through the third coil 4113, and a fourth core 4440 passing through the fourth coil 4114.

[0128] The first coil 4111 includes at least one turn of wire. An insulating film IF may be disposed on the surface of the first coil 4111.

[0129] The second coil 4112, the third coil 4113, and the fourth coil 4114 differ from the first coil 4111 only in their positions, so redundant descriptions of them will be omitted.

[0130] A surface insulating layer 4900 is disposed on the fifth surface S5 and the sixth surface S6 of the main body 4100.

[0131] The surface insulating layer 4900 includes a first insulating layer 4910 and a second insulating layer 4920. The first insulating layer 4910 is disposed on the fifth surface S5 of the body 4100, and the second insulating layer 4920 is disposed on the sixth surface S6 of the body 4100.

[0132] The sum of the thickness t3 of the first insulating layer 4910 and the thickness t4 of the second insulating layer 4920 can be greater than or equal to 90 μm and less than or equal to 120 μm.

[0133] In addition to the components mentioned above, the remaining components and Figure 1 The components of the coil electronic assembly shown are identical, so a repeated description of it will be omitted.

[0134] [Manufacturing Example: Manufacturing of Coil Electronic Components] (Example 1) The following coil electronic assembly is manufactured: it has a main body with a permeability of 12H / m and four coils spaced apart from each other and embedded in the main body, and an upper insulating layer and a lower insulating layer with a permeability of 24H / m are provided on the top and bottom surfaces of the main body, and the sum of the thickness of the upper insulating layer and the thickness of the lower insulating layer is 90μm.

[0135] (Example 2) Example 2 is the same as Example 1, except that the sum of the thickness of the upper insulating layer and the thickness of the lower insulating layer is 100 μm.

[0136] (Example 3) Except that the sum of the thickness of the upper insulating layer and the thickness of the lower insulating layer is 110 μm, Example 3 is the same as Example 1.

[0137] (Example 4) Example 4 is the same as Example 1, except that the sum of the thickness of the upper insulating layer and the thickness of the lower insulating layer is 120 μm.

[0138] (Compare Example 1) Except that the sum of the thickness of the upper insulating layer and the thickness of the lower insulating layer is 80 μm, Comparative Example 1 is the same as Example 1.

[0139] (Compare Example 2) Except that the sum of the thicknesses of the upper and lower insulating layers is 130 μm, Comparative Example 2 is the same as Example 1.

[0140] [Experimental Example: Performance of Coil Electronic Components] (Insulation resistance) For each of Examples 1-4 and Comparative Examples 1-2, fifty coil electronic assemblies were manufactured, then mounted on a substrate, and placed at 125°C, 1.2 atm, 95% relative humidity, and applied rated voltage for 72 hours to examine the change in insulation resistance. Furthermore, coil electronic assemblies showing a decrease in insulation resistance compared to the initial value were considered defective. The results are summarized in Table 1. In Table 1, the defect rate refers to the ratio of the number of defective coil electronic assemblies to the total number of coil electronic assemblies.

[0141] (Table 1)

[0142] Referring to Table 1, the defect rate of the coil electronic assembly according to Examples 1-4 and Comparative Example 2 is 0.00%. In contrast, the defect rate of the coil electronic assembly according to Comparative Example 1 is 1.40%. This is because the sum of the thickness of the upper insulation layer and the thickness of the lower insulation layer of the coil electronic assembly according to Comparative Example 1 is relatively small (80 μm), which results in insufficient insulation resistance.

[0143] (Inductance increase rate) For each of Examples 1-4 and Comparative Examples 1-2, 50 coil electronic assemblies were manufactured, and the self-inductance of the first, second, third, and fourth coils was measured. The rate of increase of the inductance of each coil (i.e., the rate of increase of the self-inductance) was measured based on a reference value (Ref.), and the results are summarized in Table 2.

[0144] The rate of increase in inductance is calculated as follows.

[0145] Referring to the self-inductance of the first, second, third, and fourth coils of the coil electronic assembly, which has a permeability of 12 H / m and no upper insulating layer on the top of the body and no lower insulating layer on the bottom of the body, the increase rate of self-inductance of each coil of the coil electronic assembly according to Examples 1-4 and Comparative Examples 1-2 is calculated. If the increase rate of inductance is less than 1%, it is considered suitable; if the increase rate of inductance is equal to or greater than 1%, it is considered unsuitable. This is because when the increase rate of inductance is equal to or greater than 1%, the difference in coupling coefficients between the coils increases, which may lead to performance degradation.

[0146] (Table 2)

[0147] Referring to Table 2, the inductance increase rate of each coil in the coil electronic assembly according to Examples 1-4 and Comparative Example 1 is less than 1%. In contrast, the inductance increase rate of each coil in the coil electronic assembly according to Comparative Example 2 is greater than 1%. This is because the sum of the thicknesses of the upper and lower insulating layers in the coil electronic assembly according to Comparative Example 2 is relatively large (130 μm), resulting in a larger permeability of the upper and lower insulating layers compared to the permeability of the bulk, leading to an excessively high inductance increase rate.

[0148] (Switching frequency) For each of Examples 1-4 and Comparative Examples 1-2, fifty coil electronics were fabricated, and the switching frequency was measured. The results are summarized in Table 3.

[0149] A switching frequency greater than 90MHz is considered appropriate, while a switching frequency equal to or less than 90MHz is considered inappropriate.

[0150] (Table 3)

[0151] Referring to Table 3, the switching frequency of the coil electronics according to Examples 1-4 and Comparative Example 1 is greater than 90 MHz. In contrast, the switching frequency of the coil electronics according to Comparative Example 2 is 82 MHz. This is because the sum of the thicknesses of the upper and lower insulating layers in the coil electronics according to Comparative Example 2 is relatively large (130 μm), which means that the insulating layer with high permeability includes large particles, resulting in increased eddy current losses and a decrease in the switching frequency.

[0152] Although embodiments of the present disclosure have been described above, the present disclosure is not limited thereto, and various modifications can be made within the spirit and scope of the claims, and the modified solutions are of course within the scope of the present disclosure.

Claims

1. A coil electronic assembly, comprising: The body has a first surface and a second surface opposite to each other in a first direction, a third surface and a fourth surface opposite to each other in a second direction and connecting the first surface and the second surface, and a fifth surface and a sixth surface opposite to each other in a third direction and connecting the first surface to the fourth surface, and includes a magnetic material; Three or more coils are embedded in the main body; as well as A first insulating layer and a second insulating layer are respectively disposed on the first surface and the second surface of the main body and / or respectively disposed on the fifth surface and the sixth surface of the main body. Wherein, the sum of the thickness of the first insulating layer and the thickness of the second insulating layer is greater than or equal to 90 μm and less than or equal to 120 μm.

2. The coil electronic assembly according to claim 1, wherein, Both the first insulating layer and the second insulating layer comprise magnetic materials.

3. The coil electronic assembly according to claim 2, wherein, The magnetic material included in the first insulating layer and the magnetic material included in the second insulating layer are different from the magnetic material included in the body.

4. The coil electronic assembly according to claim 2, wherein, The magnetic permeability of the first insulating layer is greater than that of the main body, and The magnetic permeability of the second insulating layer is greater than that of the main body.

5. The coil electronic assembly according to claim 1, further comprising: The first support member, the second support member, and the third support member are embedded in the main body and spaced apart from each other. The three or more coils include a first coil, a second coil, and a third coil spaced apart from each other. The first coil is mounted on the first support member. The second coil is disposed on the second support member, and The third coil is mounted on the third support member.

6. The coil electronic assembly according to claim 5, wherein, The winding axis of each of the first coil, the second coil, and the third coil is parallel to the third direction. The first insulating layer is disposed on the fifth surface of the body, and The second insulating layer is disposed on the sixth surface of the body.

7. The coil electronic assembly according to claim 5, wherein, The winding axis of each of the first coil, the second coil, and the third coil is parallel to the first direction. The first insulating layer is disposed on the fifth surface of the body, and The second insulating layer is disposed on the sixth surface of the body.

8. The coil electronic assembly according to claim 5, wherein, The winding axis of each of the first coil, the second coil, and the third coil is parallel to the first direction. The first insulating layer is disposed on the first surface of the body, and The second insulating layer is disposed on the second surface of the body.

9. The coil electronic assembly according to claim 5, wherein, The first coil comprises two coil patterns respectively disposed on one and another surface opposite to each other on the first support member and connected to each other by a through hole penetrating the first support member. The second coil comprises two coil patterns respectively disposed on one and another opposing surface of the second support member and connected to each other by a through-hole penetrating the second support member. The third coil comprises two coil patterns respectively disposed on one and another surface opposite to each other on the third support member and connected to each other by a through hole penetrating the third support member.

10. The coil electronics assembly according to claim 1, wherein, The main body is a stack of multiple magnetic sheets. The three or more coils include a first coil, a second coil, and a third coil spaced apart from each other, and Each of the first coil, the second coil, and the third coil includes a plurality of conductive patterns respectively disposed on the plurality of magnetic sheets and connected to each other.

11. The coil electronics assembly according to claim 1, wherein, The three or more coils include a first coil, a second coil, and a third coil spaced apart from each other, and Each of the first coil, the second coil, and the third coil includes at least one turn of wire.

12. The coil electronics assembly according to claim 11, wherein, The main body includes a first core that passes through the first coil, a second core that passes through the second coil, and a third core that passes through the third coil.

13. The coil electronics assembly according to claim 11, wherein, An insulating film is provided on the surface of the conductor.

14. The coil electronic assembly according to claim 1, further comprising: Three or more pairs of external electrodes are respectively connected to the three or more coils. Each of the three or more pairs of external electrodes includes one external electrode disposed on the third surface and another external electrode disposed on the fourth surface.

15. The coil electronics assembly according to claim 14, wherein, The first insulating layer and the second insulating layer are respectively disposed only on the surface selected from the first surface, the second surface, the fifth surface and the sixth surface of the body.

16. The coil electronics assembly according to claim 15, wherein, The first insulating layer and the second insulating layer are respectively disposed only on the first surface and the second surface of the main body, or respectively disposed only on the fifth surface and the sixth surface of the main body.

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