Electronic device

Abstract

The invention provides electronic equipment, and relates to the technical field of electronics, and a circuit board assembly of the electronic equipment comprises a circuit board which is provided with an electronic device; the first support is arranged on the circuit board, and the electronic device is located between the first support and the circuit board; the second bracket is arranged on the surface, back to the circuit board, of the first bracket; the cover plate is connected with the surface, back to the circuit board, of the first support and connected with the surface, back to the circuit board, of the second support; the second support is used for transmitting at least one part of the acting force borne by the cover plate to the circuit board through the first support. The second support can be connected with the cover plate under the condition that it is guaranteed that the electronic device is not damaged by pressing, the connection area between the circuit board assembly and the cover plate is increased, and therefore the connection stability between the circuit board assembly and the cover plate and the connection stability between the cover plate and the frame are improved.

Description

Technical Field

[0001] This application relates to the field of electronic technology, and in particular to an electronic device. Background Technology

[0002] Electronic devices generally include a cover, a frame, and a circuit board assembly. The circuit board assembly is housed within the frame, and the cover is connected to the frame and seals the circuit board assembly within the frame.

[0003] The circuit board assembly may include a circuit board, electronic components mounted on the circuit board, and a support, with the electronic components positioned between the support and the circuit board. The cover plate is bonded to the support in the circuit board assembly, which improves the adhesion between the cover plate, the screen, and the structural components, suppresses shell vibration, suppresses screen vibration, and prevents the cover plate from delaminating to the frame.

[0004] However, the connection stability between the cover plate and the bracket in the aforementioned related technologies is poor, which affects the bonding stability between the cover plate and the circuit board assembly, and in turn affects the connection stability between the cover plate and the frame. Summary of the Invention

[0005] This application provides an electronic device that can increase the connection stability between the cover plate and the bracket, and increase the adhesive stability between the cover plate and the circuit board assembly, thereby increasing the connection stability between the cover plate and the frame.

[0006] This application provides an electronic device, which includes:

[0007] Circuit board assembly, including:

[0008] A circuit board on which electronic components are disposed;

[0009] A first bracket is disposed on the circuit board, and the electronic device is located between the first bracket and the circuit board;

[0010] The second bracket is disposed on the surface of the first bracket facing away from the circuit board;

[0011] A cover plate is connected to a portion of the surface of the first bracket facing away from the circuit board, and to the surface of the second bracket facing away from the circuit board;

[0012] The second bracket is used to transmit at least a portion of the force exerted on the cover plate to the circuit board through the first bracket.

[0013] This application provides an electronic device in which a circuit board assembly electrically connects electronic devices to a circuit board and places the electronic devices between a first bracket and the circuit board. The electronic devices are connected to the circuit board, and the first bracket can fix and protect the electronic devices, reducing the probability of the electronic devices falling off the circuit board and improving the connection stability between the electronic devices and the circuit board.

[0014] The surface of the first bracket facing away from the circuit board is connected to the cover plate, which enables the connection between the circuit board assembly and the cover plate, improves the connection stability between the cover plate and the frame, reduces vibration, and prevents the cover plate and the frame from delaminating.

[0015] The circuit board assembly includes a second bracket, which is positioned on the surface of the first bracket facing away from the circuit board. The cover plate is connected to the surface of the second bracket facing away from the circuit board. When the cover plate is subjected to a force, the second bracket can transfer part or all of the force to the circuit board through the first bracket. This ensures that electronic components are not damaged by forces acting on the cover plate towards the electronic components. It also allows areas on the first bracket that could not be connected to the cover plate to be connected to the cover plate through the second bracket, thereby expanding the connection area between the circuit board assembly and the cover plate. This further improves the connection stability between the cover plate and the circuit board assembly, further reduces vibration, prevents the cover plate from delaminating with the frame, and enhances the connection stability between the cover plate and the frame.

[0016] In some embodiments, the first support includes:

[0017] A pressure plate is attached to the surface of the electronic device facing away from the circuit board, and the surface of the pressure plate facing away from the circuit board is connected to the cover plate;

[0018] A first support member is disposed between the circuit board and the pressure plate to support the pressure plate;

[0019] The second bracket is disposed on the surface of the pressure plate facing away from the circuit board, and the second bracket is used to transmit at least a portion of the force to the circuit board via the pressure plate and the first support member.

[0020] In this way, the first bracket, including a pressure plate, adheres to the surface of the electronic device facing away from the circuit board, and the pressure plate is connected to the circuit board via a first support member. This restricts the movement of the electronic device in the thickness direction of the electronic device, reduces the probability of the electronic device detaching from the circuit board, and improves the connection stability between the circuit board and the electronic device. The surface of the pressure plate facing away from the circuit board can be used to connect with a cover plate to improve the connection stability between the cover plate and the circuit board assembly, and also improves the connection stability between the cover plate and the frame.

[0021] The second bracket is disposed on the surface of the pressure plate facing away from the circuit board. When the cover plate is subjected to a force toward the electronic device, the second bracket can transfer at least part of the force to the pressure plate. Since the pressure plate and the circuit board are connected by the first support member, the first support member supports the pressure plate and bears the force applied to the pressure plate. Therefore, the pressure plate will transfer the force to the first support member, and finally the first support member will transfer at least part of the force to the circuit board. This can prevent the force on the cover plate from being transferred to the electronic device, reduce the probability of the electronic device being crushed when the second bracket is connected to the cover plate, and increase the connection area between the circuit board assembly and the cover plate.

[0022] In some embodiments, the second support includes:

[0023] A support plate is disposed on the side of the pressure plate facing away from the circuit board, and a first gap is formed between the support plate and the pressure plate. The surface of the support plate facing away from the pressure plate is connected to the cover plate.

[0024] A second support member is disposed between the pressure plate and the support plate, and the second support member is used to support the support plate;

[0025] The support plate is used to transmit the force to the first support through the second support and the pressure plate.

[0026] In this way, the second bracket connects the support plate to the cover plate and uses the second support member to connect the support plate to the pressure plate, forming a first gap between the support plate and the pressure plate. This allows the force applied to the cover plate towards the electronic device to be first transmitted to the support plate. Due to the first gap between the support plate and the pressure plate, the support plate cannot directly transmit the force to the pressure plate, but instead transmits it to the second support member. The force applied to the second support member is then further transmitted to the corresponding first support member through the pressure plate, thus preventing the pressure plate from transmitting the force to the electronic device and reducing the chance of damaging the electronic device.

[0027] In some embodiments, the first support member includes a plurality of members, and a second interval is formed between two adjacent first support members;

[0028] The electronic devices include multiple components, and the electronic devices are disposed within the second interval;

[0029] The second support member includes a plurality of them, each second support member corresponds to one first support member, and a first interval is formed between each pair of adjacent and spaced second support members, the first interval corresponding to the second interval.

[0030] In this way, by setting multiple first support members, the force on the pressure plate can be distributed, improving the pressure plate's bearing capacity and thus enhancing the stability of the first support members supporting the pressure plate. Setting multiple second support members, and using these second support members to support the support plate, can further distribute the force on the support plate, improving its bearing capacity. Each second support member corresponds to one first support member, increasing the force transmission path from the support plate to the first support members through the second support members, thereby reducing the probability of damage to electronic components.

[0031] Furthermore, since there are multiple electronic components on the circuit board, and these multiple electronic components are arranged within the second interval, the areas corresponding to more electronic components on the circuit board assembly can be connected to the cover plate through the second bracket, thereby increasing the connection area between the circuit board assembly and the cover plate.

[0032] In some embodiments, there are two first support members and two second support members, with each first support member corresponding to one second support member;

[0033] A second gap is formed between the two first support members, and at least one of the electronic devices is disposed within the second gap.

[0034] In this way, by setting two first support members and two second support members, and placing at least one electronic device within the second interval, the force exerted on the cover plate toward the electronic device will be transmitted through the support plate to the two second support members, and further transmitted directly from the two second support members to the two corresponding first support members through the pressure plate, and finally transmitted to the circuit board through the two first support members. This reduces the force exerted on the electronic device, avoids damage to the electronic device, and increases the connection area between the circuit board assembly and the cover plate.

[0035] In some embodiments, there are three first support members, the three first support members are arranged along a first direction, there is a second interval between each two adjacent first support members, and at least one electronic device is disposed in each first interval.

[0036] The second support member has three parts, each second support member corresponds to one first support member, and the first interval is formed between each two adjacent second support members.

[0037] In some embodiments, the first support member and the corresponding second support member at least partially overlap along a second direction, the second direction being the thickness direction of the electronic device.

[0038] In some embodiments, the second support does not overlap with the electronic device along a second direction, the second direction being the thickness direction of the electronic device.

[0039] In this way, by setting three first support members and three second support members, electronic devices can be set in the second interval between each pair of adjacent first support members, and the three second supports are set in a one-to-one correspondence with the three first support members. This allows the force exerted on multiple electronic devices at different positions on the circuit board to be transmitted through the support plate to the second support members, and then further transmitted from the second support members to the first support members. This can further increase the connection area between the circuit board assembly and the cover plate while ensuring that more electronic devices are not damaged by external forces.

[0040] In some embodiments, the support plate at least partially overlaps with the electronic device along the second direction.

[0041] In this way, by partially or completely overlapping the support plate with the electronic device in the second direction, when the cover plate is subjected to a force toward the electronic device, the force on the cover plate is guaranteed not to be directly transmitted to the area on the pressure plate corresponding to the electronic device. Instead, the cover plate transmits the force to the support plate, then to the second support member, and further to the area on the pressure plate that is not perpendicular to the electronic device. Finally, the pressure plate transmits the force to the first support member. This avoids the area on the pressure plate corresponding to the electronic device being directly subjected to the force transmitted by the cover plate, reducing the probability of the electronic device being crushed and damaged by the force transmitted to the pressure plate.

[0042] In some embodiments, along the second direction, the second bracket protrudes from the surface of the pressure plate facing away from the circuit board, so as to form a third gap between the pressure plate and the cover plate.

[0043] In this way, by making the second bracket protrude from the surface of the pressure plate facing away from the circuit board, the cover plate can first connect with the surface of the second bracket facing away from the circuit board, and can form a third gap in the area of ​​the cover plate except for the area connected to the pressure plate. This third gap forms a buffer zone between the cover plate and the pressure plate. When the cover plate transmits force toward the electronic device, part of it is transmitted to the pressure plate and the first support member through the second bracket, while the other part is transmitted from the cover plate to the area on the pressure plate corresponding to the third gap. The cover plate can utilize the space of the third gap to absorb the force applied to the cover plate through deformation, thereby reducing the impact of the force on the pressure plate. This reduces the force transmitted from the pressure plate to the electronic device, thus reducing the probability of the electronic device being damaged by pressure.

[0044] In some embodiments, along the second direction, the support plate does not overlap with the electronic device, and the orthographic projection of the electronic device is located within the third interval.

[0045] In this way, by placing the orthographic projection of the electronic device within the third gap, the third gap allows the cover plate to deform and absorb energy when subjected to a force toward the electronic device, thereby reducing the impact of the force on the pressure plate, which in turn reduces the force transmitted from the pressure plate to the electronic device and lowers the probability of the electronic device being damaged by pressure.

[0046] Furthermore, since the second bracket protrudes from the surface of the pressure plate facing away from the circuit board, when the cover plate is subjected to a force toward the electronic device, part of the force will be transmitted to the second bracket. The second bracket can then further transmit this part of the force to the circuit board through the first support member. Therefore, the second bracket can also reduce the force transmitted to the pressure plate, thereby further reducing the impact of the force on the pressure plate and further reducing the probability of the electronic device being damaged by pressure.

[0047] In some embodiments, along the second direction, the shortest distance between the orthographic projection of the support plate and the orthographic projection of the electronic device is greater than or equal to 0 mm and less than or equal to 6 mm.

[0048] Thus, due to the supporting effect of the second bracket on the cover plate, the closer the part of the cover plate corresponding to the third interval is to the second bracket, the stronger the rigidity of the cover plate and the less likely it is to deform. Conversely, the farther away from the second bracket, the more easily the cover plate will deform under force because it lacks support. Therefore, along the second direction, the shortest distance between the orthographic projection of the electronic device and the orthographic projection of the support plate should not be too large. This avoids the cover plate from being squeezed onto the area on the pressure plate corresponding to the electronic device due to large deformation, thereby reducing the pressure of the pressure plate on the electronic device.

[0049] In some embodiments, along the second direction, the height of the first interval is greater than or equal to 0.05 mm;

[0050] The second direction is the thickness direction of the electronic device.

[0051] In this way, by making the height of the first gap greater than 0.05mm, it is possible to prevent the support plate from directly squeezing the pressure plate when it deforms under stress, thereby preventing the force transmitted directly from the support plate to the pressure plate from squeezing the electronic components.

[0052] In some embodiments, the surface of the pressure plate facing away from the circuit board has a groove, and the second bracket is disposed within the groove.

[0053] In this way, by setting a groove on the surface of the pressure plate facing away from the circuit board and placing the second bracket in the groove, the total thickness of the first and second brackets can be reduced when the second bracket is assembled with the first bracket, thereby reducing the total thickness of the circuit board assembly. This reduces the space occupancy rate of the circuit board assembly in the thickness direction within the electronic device, which is conducive to the thinner and lighter design of the electronic device.

[0054] In some embodiments, the second bracket further includes a third support member;

[0055] The third support member is disposed between the pressure plate and the support plate, and the extension direction of the third support member intersects with the extension direction of the second support member;

[0056] Along the second direction, the third support is offset from the electronic device, and the third support partially overlaps with the first support; the second direction is the thickness direction of the electronic device.

[0057] In this way, by including the third support member, the second support member can be used together with the second support member to support the support plate of the second support member, thereby improving the overall structural rigidity of the support plate and reducing the probability of deformation of the support plate when subjected to the force transmitted by the cover plate.

[0058] Furthermore, along the second direction, the third support does not overlap with the electronic components, and the third support partially overlaps with the first support. In this way, the support plate can further transfer the force transmitted to the support plate to the first support through the second and third support components, which improves the force transmission path between the support plate and the first support. This helps the second bracket to transmit the force to the circuit board and reduces the probability of electronic components being damaged by pressure.

[0059] In some embodiments, an adhesive layer is also included, wherein the surface of the second bracket facing away from the circuit board is connected to the cover plate via the adhesive layer.

[0060] In this way, by using an adhesive layer to bond the second bracket cover plate together, the assembly process between the cover plate and the circuit board assembly can be simplified while ensuring the connection stability between the cover plate and the circuit board assembly. This also simplifies the assembly process of electronic devices and improves the production efficiency of electronic devices.

[0061] In some embodiments, the adhesive layer may be a hot melt adhesive layer.

[0062] In this way, by setting the adhesive layer as a hot melt adhesive layer, the hot melt adhesive has a certain degree of flexibility, which can provide cushioning when the cover plate is subjected to impact or vibration, and can absorb part of the force in the process of the cover plate transmitting the force to the second support, thereby reducing the impact of the force on electronic devices and circuit boards.

[0063] Using hot melt adhesive can also simplify the production process, reduce assembly steps and time for cover plates and circuit board assemblies, and improve the production efficiency of electronic devices. Compared to connecting the cover plate and the second bracket through a mechanical structure, hot melt adhesive is less expensive, thus reducing the manufacturing cost of electronic devices.

[0064] In some embodiments, the second bracket and the first bracket are connected by a detachable connection.

[0065] In this way, by detachably connecting the second bracket to the first bracket, it is easy to replace and repair the second bracket separately, reducing the maintenance cost of the circuit board assembly, and thus reducing the maintenance cost of electronic equipment.

[0066] In some embodiments, the second bracket and the first bracket are an integral structure.

[0067] In this way, by setting the second bracket and the first bracket as an integrated structure, the assembly steps of the circuit board assembly can be simplified, and the assembly efficiency and production efficiency of electronic devices can be improved.

[0068] In some embodiments, the material of the second bracket may be at least one of plastic and metal.

[0069] Thus, if the second bracket is made of plastic, its weight and manufacturing cost can be reduced, which helps to reduce the weight and manufacturing cost of electronic devices. If the second bracket is made of metal, its structural strength can be improved, reducing the likelihood of it being crushed or damaged when subjected to forces transmitted from the cover plate, and facilitating the transmission of forces from the second bracket to the first bracket and the circuit board.

[0070] In some embodiments, the electronic device further includes:

[0071] The frame has a first side and a second side facing each other, the first side having a mounting groove, and the circuit board assembly being disposed within the mounting groove;

[0072] A screen assembly connected to the second side of the frame;

[0073] The cover plate is connected to the first surface of the frame.

[0074] In this way, by placing the circuit board assembly in the mounting slot of the frame, the frame can protect the circuit board assembly and support structural components such as the screen assembly and cover plate, thereby improving the overall structural strength and rigidity of the electronic device. Attached Figure Description

[0075] Figure 1 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application;

[0076] Figure 2 An exploded view of an electronic device provided in an embodiment of this application;

[0077] Figure 3 for Figure 1A schematic diagram of the cross-section of the electronic device at point AA;

[0078] Figure 4 This is a schematic diagram of the structure of a circuit board assembly provided in an embodiment of this application;

[0079] Figure 5 This is a schematic diagram of another circuit board assembly provided in an embodiment of this application;

[0080] Figure 6 for Figure 1 A schematic diagram of the first cross-section of the electronic device at point BB;

[0081] Figure 7 for Figure 1 A second cross-sectional schematic diagram of the electronic device at point BB;

[0082] Figure 8 for Figure 1 A schematic diagram of the third cross-section of the electronic device at point BB;

[0083] Figure 9 This is a schematic diagram of the structure of a second support provided in an embodiment of this application;

[0084] Figure 10 An exploded view of another electronic device provided in the embodiments of this application;

[0085] Figure 11 This is a schematic diagram of another circuit board assembly provided in an embodiment of this application.

[0086] Figure label:

[0087] 10. Electronic devices;

[0088] 11. Circuit board assembly; 12. Cover plate; 13. Frame; 14. Screen assembly; 13a. First surface;

[0089] 13b. Second side; 13c. Mounting slot;

[0090] 100. Circuit board;

[0091] 200. Electronic components;

[0092] 300, First support; 3

[0093] 10. Pressure plate; 320. First support member; 330. Second spacer; 340. Third spacer; 350. Groove;

[0094] 400. Second support;

[0095] 410, Support plate; 420, First spacer; 430, Second support member; 440, Third support member; 500, Adhesive layer. Detailed Implementation

[0096] The terminology used in the implementation section of this application is for the purpose of explaining specific embodiments of this application only, and is not intended to limit this application.

[0097] refer to Figure 1 and Figure 2 This application provides an electronic device 10, which includes, but is not limited to, mobile phones (e.g., candybar phones or foldable phones), tablet computers, laptops, ultra-mobile personal computers (UMPCs), handheld computers, walkie-talkies, internet TVs, televisions, in-vehicle devices, netbooks, POS machines, personal digital assistants (PDAs), wearable devices (e.g., smartwatches, smart wristbands, virtual reality devices, and other mobile or fixed terminals with display devices).

[0098] In this embodiment, a mobile phone is used as an example of the above-mentioned electronic device 10 for explanation.

[0099] Figure 2 An exploded view of an electronic device provided in an embodiment of this application. Figure 3 for Figure 1 A schematic diagram of the cross-section of the electronic device at point AA. Figure 4 This is a schematic diagram of a circuit board assembly provided in an embodiment of this application.

[0100] refer to Figures 2 to 4 The electronic device 10 may include a circuit board assembly 11, a cover plate 12, a frame 13, and a screen assembly 14. The frame 13 has a first surface 13a and a second surface 13b opposite each other in its thickness direction, and the screen assembly 14 can be disposed on the second surface 13b of the frame 13. The first surface 13a of the frame 13 has a mounting groove 13c, and the circuit board assembly 11 can be disposed in the mounting groove 13c. The frame 13 can be used to mount the circuit board assembly 11 and can provide protection for the circuit board assembly 11.

[0101] The cover plate 12 is placed on the first surface 13a of the frame 13. The cover plate 12 can be connected to the frame 13 by adhesive, for example, by double-sided adhesive. In a specific implementation, the portion of the cover plate 12 near the outer edge can be bonded to the portion of the frame 13 near the outer edge by double-sided adhesive. The double-sided adhesive can be arranged around the circumference of the cover plate 12 to increase the connection stability between the cover plate 12 and the frame 13 and the sealing performance of the cover plate 12 to the internal structure of the frame 13.

[0102] The cover plate 12 and the frame 13 are connected by adhesive. Compared with the cover plate 12 being connected to the frame 13 by mechanical parts, this simplifies the assembly process between the cover plate 12 and the frame 13 and reduces the manufacturing cost of the electronic device 10. The adhesive method is relatively simple to operate and convenient for assembly personnel, thereby reducing labor costs and further reducing the manufacturing cost of the electronic device 10.

[0103] In addition, to better connect the cover plate 12 and the frame 13, reduce the chance of delamination between them, and improve the structural stability of the electronic device 10, the cover plate 12 can be connected to the circuit board assembly 11. For example, the surface of the circuit board assembly 11 facing away from the second side 13b can be connected to the cover plate 12 by dispensing adhesive. This not only improves the connection stability between the frame 13 and the cover plate 12, but also suppresses shell vibration and screen vibration of the electronic device 10, further improving the user experience of the electronic device 10.

[0104] Existing circuit board assemblies generally include a circuit board, a support, and electronic components. The electronic components are mounted on the circuit board, the support is connected to the circuit board, and the electronic components are located between the support and the circuit board. The circuit board assembly is connected to a cover plate via the support. However, the connection stability between the cover plate and the support in the existing circuit board assembly is poor, affecting the connection stability between the cover plate and the circuit board assembly, and also affecting the bonding stability between the cover plate and the frame.

[0105] The problem arises because, in the thickness direction of the electronic device, if the area on the bracket corresponding to the electronic component is bonded to the cover plate, when the cover plate is subjected to pressure towards the circuit board assembly, especially when the area on the cover plate corresponding to the electronic component is compressed, the compressive force on the cover plate is directly transmitted to the electronic component through the bracket, and further directly compresses the electronic component, leading to pressure damage. Therefore, to avoid pressure damage to the electronic component, the bracket in the prior art needs to avoid the area on the bracket corresponding to the electronic component when bonding to the cover plate. This results in the area on the bracket corresponding to the electronic component not being able to connect with the cover plate, and a smaller connection area between the cover plate and the bracket, affecting the bonding stability between the cover plate and the circuit board assembly.

[0106] refer to Figures 1 to 4 To address the aforementioned technical problems, this application provides an electronic device 10. The circuit board assembly 11 electrically connects an electronic device 200 to a circuit board 100 and places the electronic device 200 between a first bracket 300 and the circuit board 100. The electronic device 200 is connected to the circuit board 100, and the first bracket 300 can fix and protect the electronic device 200, reducing the probability of the electronic device 200 falling off the circuit board 100 and improving the connection stability between the electronic device 200 and the circuit board 100.

[0107] The surface of the first bracket 300 facing away from the circuit board 100 is connected to the cover plate 12, which enables the connection between the circuit board assembly 11 and the cover plate 12, and can improve the connection stability between the cover plate 12 and the frame 13, reduce screen vibration, and prevent the cover plate 12 and the frame 13 from delaminating.

[0108] The circuit board assembly 11 includes a second bracket 400, which is disposed on the surface of the first bracket 300 facing away from the circuit board 100. The cover plate 12 is connected to the surface of the second bracket 400 facing away from the circuit board 100. When the cover plate 12 is subjected to force, the second bracket 400 can transmit part or all of the force to the circuit board 100 through the first bracket 300. This ensures that the electronic device 200 is not damaged by the force on the cover plate 12. It also allows the area where the first bracket 300 could not be connected to the cover plate 12 to be connected to the cover plate 12 through the second bracket 400, thereby expanding the connection area between the circuit board assembly 11 and the cover plate 12. This further improves the connection stability between the cover plate 12 and the circuit board 100, and further reduces vibration and prevents the cover plate 12 from delaminating with the frame 13.

[0109] To make the above-mentioned objectives, features, and advantages of the embodiments of this application more apparent and understandable, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are merely some embodiments of this application, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0110] refer to Figures 1 to 4 This application provides an electronic device 10, which may include a circuit board assembly 11 and a cover plate 12. Further, the electronic device 10 may also include a frame 13 and a screen assembly 14.

[0111] The frame 13 has a first surface 13a and a second surface 13b opposite to each other. The first surface 13a has a mounting groove 13c, in which the circuit board assembly 11 is disposed. The screen assembly 14 is connected to the second surface 13b of the frame 13, and the screen assembly 14 is electrically connected to the circuit board assembly 11. The cover plate 12 is connected to the first surface 13a of the frame 13.

[0112] By placing the circuit board assembly 11 in the mounting slot 13c of the frame 13, the circuit board assembly 11 can be protected by the frame 13, and structural components such as the screen assembly 14 and the cover plate 12 can be supported by the frame 13, thereby improving the overall structural strength and rigidity of the electronic device 10.

[0113] refer to Figures 1 to 4 In some embodiments, the circuit board assembly 11 may include a circuit board 100, a first support 300, and a second support 400. Electronic devices 200 are disposed on the circuit board 100 and are electrically connected to the circuit board 100. There may be one or more electronic devices 200; when there are multiple electronic devices 200, they can be arranged on the same side of the surface of the circuit board 100. In a specific implementation, the electronic device 200 may be a board-to-board connector (BTB).

[0114] The first bracket 300 is disposed on the circuit board 100, and the electronic device 200 is located between the first bracket 300 and the circuit board 100. The first bracket 300 can fix the electronic device 200, prevent the electronic device 200 from shaking on the circuit board 100, or prevent the electronic device 200 from falling off the circuit board 100, thereby improving the connection stability between the electronic device 200 and the circuit board 100.

[0115] The surface of the first bracket 300 facing away from the circuit board 100 can be connected to the cover plate 12. Specifically, a portion of the surface of the first bracket 300 facing away from the circuit board 100 can be connected to the cover plate 12 via an adhesive layer 500, which can be a hot melt adhesive layer.

[0116] In this way, by connecting the surface of the first bracket 300 facing away from the circuit board 100 to the cover plate 12, the connection between the circuit board assembly 11 and the cover plate 12 can be realized, and the connection stability between the cover plate 12 and the frame 13 can be improved, reducing vibration and preventing the cover plate 12 and the frame 13 from delaminating.

[0117] The second bracket 400 is disposed on the surface of the first bracket 300 facing away from the circuit board 100, and the surface of the second bracket 400 facing away from the circuit board 100 can be connected to the cover plate 12. The second bracket 400 and the cover plate 12 can be connected by adhesive bonding, for example, the surface of the second bracket 400 facing away from the circuit board 100 can be connected to the cover plate 12 by dispensing adhesive.

[0118] When the cover plate 12 is subjected to a force, the second bracket 400 can be used to transmit at least a portion of the force to the circuit board 100 through the first bracket 300. It is understood that, in the thickness direction of the electronic device 10, the location where the force is applied can be in the area on the cover plate 12 corresponding to the first bracket 300, for example, it can correspond to the area on the first bracket 300 corresponding to the electronic device 200.

[0119] It should be noted that this force can be the compressive force applied externally to the cover plate 12 of the electronic device 10. The cover plate 12 will transmit the compressive force to the first bracket 300 through its connection with the first bracket 300. When the cover plate 12 transmits the compressive force toward the area on the first bracket 300 corresponding to the electronic device 200, the first bracket 300 will compress the electronic device 200, which will cause pressure damage to the electronic device 200.

[0120] In the electronic device 10 provided in this application embodiment, by setting the second bracket 400 on the surface of the first bracket 300 facing away from the circuit board 100, and connecting the cover plate 12 to the surface of the second bracket 400 facing away from the circuit board 100, when the cover plate 12 is subjected to a force, the second bracket 400 can transmit part or all of the force to the circuit board 100 through the first bracket 300. This ensures that the electronic device 200 is not damaged by the force, and allows the area on the first bracket 300 that could not be connected to the cover plate 12 to be connected to the cover plate 12 through the second bracket 400. This expands the connection area between the circuit board assembly 11 and the cover plate 12, further improves the connection stability between the cover plate 12 and the circuit board 100, and further reduces vibration and prevents the cover plate 12 from delaminating with the frame 13, thus improving the connection stability between the cover plate 12 and the frame 13.

[0121] refer to Figure 2 In some embodiments, the electronic device 10 may also include an adhesive layer 500, through which the surface of the second bracket 400 facing away from the circuit board 100 is connected to the cover plate 12.

[0122] In this way, by using the adhesive layer 500 to bond the cover plate 12 of the second bracket 400 together, the assembly process between the cover plate 12 and the circuit board assembly 11 can be simplified while ensuring the connection stability between the cover plate 12 and the circuit board assembly 11. This also simplifies the assembly process of the electronic device 10 and improves the production efficiency of the electronic device 10.

[0123] In a practical implementation, the adhesive layer 500 can be a hot melt adhesive layer. By setting the adhesive layer 500 as a hot melt adhesive layer, since hot melt adhesive has a certain degree of flexibility, it can provide cushioning when the cover plate 12 is subjected to impact or vibration, and can absorb part of the force in the process of the cover plate 12 transmitting the force to the second support 400, thereby reducing the impact of the force on the electronic device 200 and the circuit board 100.

[0124] Using hot melt adhesive can also simplify the production process, reduce the assembly steps and time of the cover plate 12 and circuit board assembly 11, and improve the production efficiency of the electronic device 10. Compared with the mechanical connection between the cover plate 12 and the second bracket 400, the use of hot melt adhesive is less expensive and can reduce the manufacturing cost of the electronic device 10.

[0125] refer to Figure 3 and Figure 4 In some embodiments, the first bracket 300 may include a pressure plate 310 and a first support member 320. The pressure plate 310 is attached to the surface of the electronic device 200 facing away from the circuit board 100, and the surface of the pressure plate 310 facing away from the circuit board 100 is connected to the cover plate 12. The first support member 320 and the pressure plate 310 may be an integral structure.

[0126] This can limit the movement of the electronic device 200 in the thickness direction of the electronic device 10, reduce the probability of the electronic device 200 falling off the circuit board 100, and improve the connection stability between the circuit board 100 and the electronic device 200.

[0127] Furthermore, the surface of the pressure plate 310 facing away from the circuit board 100 can be connected to the cover plate 12 to realize the connection between the circuit board assembly 11 and the cover plate 12, improve the connection stability between the cover plate 12 and the circuit board assembly 11, and improve the connection stability between the cover plate 12 and the frame 13.

[0128] A first support member 320 is disposed between the circuit board 100 and the pressure plate 310. One end of the first support member 320 is disposed on the circuit board 100, and the other end of the first support member 320 is connected to the pressure plate 310. The first support member 320 can be used to support the pressure plate 310. When the pressure plate 310 is compressed, the first support member 320 can provide support for the pressure plate 310 and transmit the compressive force to the circuit board 100. The first support member 320 can also be used to connect the pressure plate 310 and the circuit board 100.

[0129] The second bracket 400 can be disposed on the surface of the pressure plate 310 facing away from the circuit board 100 and connected to the cover plate 12. The second bracket 400 is used to transmit at least a portion of the force through the pressure plate 310 to the first support member 320, and further transmit at least a portion of the force through the first support member 320 to the circuit board 100.

[0130] In this way, the second bracket 400 is disposed on the surface of the pressure plate 310 facing away from the circuit board 100. When the cover plate 12 is subjected to force, the second bracket 400 can transfer at least part of the force to the pressure plate 310. Since the pressure plate 310 and the circuit board 100 are connected by the first support member 320, the first support member 320 supports the pressure plate 310 and bears the force applied to the pressure plate 310. Therefore, the pressure plate 310 will transfer the force to the first support member 320, and finally, at least part of the force will be transferred to the circuit board 100 through the first support member 320. This avoids the force on the cover plate 12 from being transferred to the electronic device 200. With the second bracket 400 connected to the cover plate 12, the probability of the electronic device 200 being damaged by pressure is reduced, and the connection area between the circuit board 100 assembly and the cover plate 12 is increased.

[0131] refer to Figure 4 In some embodiments, the surface of the pressure plate 310 facing away from the circuit board 100 has a groove 350, and the second bracket 400 is disposed in the groove 350.

[0132] In some embodiments, along the second direction (e.g.) Figure 4 In the Z direction, the depth of the groove 350 can be less than or equal to the height of the second bracket 400 to ensure that the second bracket 400 is not lower than the surface of the first bracket 300 facing the cover plate 12.

[0133] For example, the depth of the groove 350 can be equal to the height of the second bracket 400, so that the surface of the second bracket 400 facing the cover plate 12 is flush with the surface of the first bracket 300 facing the cover plate 12. Alternatively, the depth of the groove 350 can be less than the height of the second bracket 400, so that the surface of the second bracket 400 facing the cover plate 12 protrudes beyond the surface of the first bracket 300 facing the cover plate 12.

[0134] In this way, by setting a groove 350 on the surface of the pressure plate 310 facing away from the circuit board 100 and placing the second bracket 400 in the groove 350, when the second bracket 400 is assembled with the first bracket 300, the total thickness of the first bracket 300 and the second bracket 400 can be reduced, thereby reducing the total thickness of the circuit board assembly 11. This reduces the space occupancy rate of the circuit board assembly 11 in the thickness direction within the electronic device 10, which is conducive to the thinner and lighter design of the electronic device 10.

[0135] refer to Figure 3 and Figure 4 In some embodiments, the second bracket 400 may include a support plate 410 and a second support member 430. The support plate 410 is disposed on the side of the pressure plate 310 facing away from the circuit board 100, and a first gap 420 is formed between the support plate 410 and the pressure plate 310. The surface of the support plate 410 facing away from the pressure plate 310 is connected to the cover plate 12. The second support member 430 and the support plate 410 may be an integral structure.

[0136] The second support member 430 is disposed between the pressure plate 310 and the support plate 410, and the second support member 430 is used to support the support plate 410.

[0137] refer to Figure 4 When the force on the cover plate 12 is transmitted to the second bracket 400, the transmission path of the force on the second bracket 400, the first bracket 300, and the circuit board 100 is as follows: Figure 4 As indicated by the arrow in the diagram. The support plate 410 of the second bracket 400 is used to transmit at least a portion of the force to the pressure plate 310 through the second support member 430, and further transmit at least a portion of the force to the first support member 320 through the pressure plate 310.

[0138] In this way, the second bracket 400 connects the support plate 410 to the cover plate 12 and uses the second support member 430 to connect the support plate 410 to the pressure plate 310, forming a first gap 420 between the support plate 410 and the pressure plate 310. Thus, when the cover plate 12 is subjected to force, it will first be transmitted to the support plate 410. Since there is a first gap 420 between the support plate 410 and the pressure plate 310, the support plate 410 cannot directly transmit the force to the pressure plate 310, but transmits it to the second support member 430. The second support member 430 corresponds to the first support member 320, so the force on the second support member 430 will be further transmitted to the corresponding first support member 320 through the pressure plate 310. This avoids the pressure plate 310 transmitting the force to the electronic device 200, thus reducing the chance of the electronic device 200 being damaged.

[0139] In some embodiments, the first support member 320 may include a plurality of first support members 320, and a second interval 330 is formed between two adjacent first support members 320;

[0140] The electronic device 200 may include multiple components, which are disposed within the second interval 330. By providing multiple first support members 320, the force on the pressure plate 310 can be distributed, thereby improving the pressure-bearing capacity of the pressure plate 310 and enhancing the support stability of the first support members 320 on the pressure plate 310.

[0141] If a second interval 330 is formed between each pair of adjacent first support members 320, at least one electronic device 200 can be disposed within at least a portion of the second interval 330. In this way, the pressure plate 310 near the electronic device 200 can be supported by the first support members 320, which can improve the structural strength and stiffness of the area on the pressure plate 310 corresponding to the electronic device 200, reduce the deformation of the area on the pressure plate 310 opposite to the electronic device 200 when subjected to force, and reduce the probability of the electronic device 200 being damaged by pressure.

[0142] The second support member 430 may include multiple members, each second support member 430 corresponding to one first support member 320. A first gap 420 is formed between each pair of adjacent and spaced-apart second support members 430, and the first gap 420 corresponds to the second gap 330. By aligning the first gap 420 with the second gap 330, direct contact between the area on the pressure plate 310 corresponding to the electronic device 200 and the cover plate 12 can be avoided. Furthermore, through the connection between the support plate 410 and the cover plate 12, the force exerted on the cover plate 12 can be transmitted through the support plate 410 to the second support member 430, and further transmitted from the second support member 430 to the corresponding first support member 320, thereby preventing damage to the electronic device 200.

[0143] Furthermore, each second support member 430 corresponds to a first support member 320, which can improve the force transmission path of the support plate 410 through the second support member 430 to the first support member 320, and reduce the probability of damage to the electronic device 200.

[0144] Furthermore, since there are multiple electronic devices 200 on the circuit board 100 and multiple electronic devices 200 are arranged within the second interval 330, the areas corresponding to more electronic devices 200 on the circuit board assembly 11 can be connected to the cover plate 12 through the second bracket 400, which can increase the connection area between the circuit board assembly 11 and the cover plate 12 and improve the connection stability between the cover plate 12 and the circuit board 100.

[0145] refer to Figure 4 In one exemplary embodiment, there are two first support members 320, each corresponding to one second support member 430. A second interval 330 is formed between the two first support members 320, and at least one electronic device 200 is disposed within the second interval 330.

[0146] In this way, by setting two first support members 320 and two second support members 430, and placing at least one electronic device 200 within the second interval 330, the force exerted on the cover plate 12 will be transmitted through the support plate 410 to the two second support members 430, and further transmitted directly from the two second support members 430 to the two corresponding first support members 320 through the pressure plate 310, and finally transmitted to the circuit board 100 through the two first support members 320. This reduces the force exerted on the electronic device 200, prevents damage to the electronic device 200, and increases the connection area between the circuit board assembly 11 and the cover plate 12.

[0147] refer to Figure 5 In other embodiments, the first support member 320 has three members, and the three first support members 320 are arranged along a first direction (e.g., Figure 5 Arranged in the X direction, each pair of adjacent first support members 320 has a second interval 330 between them, and each first interval 420 contains at least one electronic device 200. There are also three second support members 430, each corresponding to one first support member 320, and each pair of adjacent second support members 430 forms a first interval 420.

[0148] In this way, by setting three first support members 320 and three second support members 430, electronic devices 200 can be set in the second interval 330 between each two adjacent first support members 320, and the three second supports are set in a one-to-one correspondence with the three first support members 320. This allows the force exerted on multiple electronic devices 200 at different positions on the circuit board 100 to be transmitted through the support plate 410 to the second support members 430, and further transmitted from the second support members 430 to the first support members 320. This can further increase the connection area between the circuit board assembly 11 and the cover plate 12 while ensuring that more electronic devices 200 are not damaged by external forces.

[0149] refer to Figure 3 and Figure 4 In some embodiments, along the second direction (e.g.) Figure 4 In the Z-direction, the first support member 320 and the corresponding second support member 430 at least partially overlap, and the second direction is the thickness direction of the electronic device 10.

[0150] In this way, by making the first support member 320 at least partially overlap with the corresponding second support member 430, the force transmission path from the second support member 430 through the pressure plate 310 to the first support member 320 can be shortened. When the first support member 320 and the second support member 430 overlap at least partially in the height direction, the force transmitted by the second support member 430 can be transmitted more directly to the first support member 320 through the pressure plate 310. This direct transmission path reduces the bending moment and shear force borne by the pressure plate 310, thereby reducing the possibility of deformation of the pressure plate 310, and thus reducing the probability of deformation of the pressure plate 310 leading to crushing of the electronic device 200.

[0151] If the first support member 320 and the second support member 430 do not overlap, the pressure plate 310 may be subjected to large bending stress. By making the first support member 320 at least partially overlap with the corresponding second support member 430, the force transmission path is more perpendicular, reducing the bending stress of the pressure plate 310.

[0152] refer to Figure 3 and Figure 4 The second support member 430 does not overlap with the electronic device 200, and the second direction is the thickness direction of the electronic device 10. In this way, the force transmitted to the second support member 430 can be prevented from being transmitted to the electronic device 200 through the pressure plate 300.

[0153] refer to Figure 6 and Figure 7 In some embodiments, along the second direction, the support plate 410 at least partially overlaps with the electronic device 200 so that the support plate 410 can correspond to the area on the pressure plate 310 that corresponds to the electronic device 200.

[0154] In some embodiments, when the surface area of ​​the support plate 410 is greater than the surface area of ​​the electronic device 200, the orthographic projection of the electronic device 200 can be completely located within the orthographic projection range of the support plate 410 along the second direction, and the orthographic projection of the electronic device 200 will not overlap with the orthographic projection of the second support member 430.

[0155] In this way, by partially or completely overlapping the support plate 410 with the electronic device 200 in the second direction, when the position of the cover plate 12 subjected to force corresponds to the electronic device 200 in the second direction, it can be ensured that the force on the cover plate 12 is not directly transmitted to the area on the pressure plate 310 corresponding to the electronic device 200. Instead, the force is transmitted from the cover plate 12 to the support plate 410, then from the support plate 410 to the second support member 430, and further from the second support member 430 to the area on the pressure plate 310 that is not perpendicular to the electronic device 200. Finally, the force is transmitted from the pressure plate 310 to the first support member 320. This avoids the area on the pressure plate 310 corresponding to the electronic device 200 being directly subjected to the force transmitted by the cover plate 12, reducing the probability that the electronic device 200 will be damaged by being squeezed due to the force transmitted to the pressure plate 310.

[0156] refer to Figure 8 In some embodiments, along the second direction, the second bracket 400 protrudes from the surface of the pressure plate 310 facing away from the circuit board 100, so that a third gap 340 is formed between the pressure plate 310 and the cover plate 12. The area on the pressure plate 310 corresponding to the third gap 340 can be connected to the cover plate 12 by dispensing adhesive.

[0157] In this way, by making the second bracket 400 protrude from the surface of the pressure plate 310 facing away from the circuit board 100, the cover plate 12 can first connect with the surface of the second bracket 400 facing away from the circuit board 100, and the cover plate 12 can form a third gap 340 except for the area connected with the pressure plate 310, and a buffer zone is formed between the cover plate 12 and the pressure plate 310 through the third gap 340.

[0158] When the cover plate 12 transmits force toward the electronic device 200, part of it is transmitted to the pressure plate 310 and the first support member 320 through the second bracket 400. When the other part is transmitted from the cover plate 12 to the area on the pressure plate 310 corresponding to the third interval 340, the cover plate 12 can use the space of the third interval 340 to absorb the force applied to the cover plate 12 through deformation, so as to reduce the impact of the force on the pressure plate 310, thereby reducing the force transmitted from the pressure plate 310 to the electronic device 200 and reducing the probability of the electronic device 200 being damaged by pressure.

[0159] refer to Figure 8 In other embodiments, along the second direction, the support plate 410 does not overlap with the electronic device 200, and the orthographic projection of the electronic device 200 is located within the third interval 340. It is understood that, along the second direction, the orthographic projection of the support plate 410 can be made non-overlapping with the orthographic projection of the electronic device 200.

[0160] In this way, by placing the orthographic projection of the electronic device 200 within the third interval 340, since the third interval 340 allows the cover plate 12 to deform and absorb energy when subjected to force, the influence of the force on the pressure plate 310 can be reduced, thereby reducing the force transmitted from the pressure plate 310 to the electronic device 200 and reducing the probability of the electronic device 200 being damaged by pressure.

[0161] Furthermore, since the second bracket 400 protrudes from the surface of the pressure plate 310 facing away from the circuit board 100, when the cover plate 12 is subjected to force, part of the force will be transmitted to the second bracket 400. The second bracket 400 can further transmit this part of the force to the circuit board 100 through the first support member 320. Therefore, the second bracket 400 can also reduce the force transmitted to the pressure plate 310, thereby further reducing the impact of the force on the pressure plate 310 and further reducing the probability of the electronic device 200 being damaged by pressure.

[0162] refer to Figure 8 In some embodiments, along the second direction, the support plate 410 does not overlap with the electronic device 200, and the orthographic projection of the electronic device 200 is located within the third interval 340, the shortest distance between the orthographic projection of the support plate 410 and the orthographic projection of the electronic device 200 (e.g., Figure 8 The minimum distance between the orthographic projection of the support plate 410 and the orthographic projection of the electronic device 200 can be any value within the range of 0 mm to 6 mm. For example, the minimum distance between the orthographic projection of the support plate 410 and the orthographic projection of the electronic device 200 can be one of 1 mm, 2 mm, 3 mm, 4 mm, and 5 mm. Alternatively, the minimum distance between the orthographic projection of the support plate 410 and the orthographic projection of the electronic device 200 can be any value within the range of 0 mm to 6 mm.

[0163] Thus, due to the supporting effect of the second bracket 400 on the cover plate 12, the closer the portion of the cover plate 12 corresponding to the third interval 340 is to the second bracket 400, the stronger the rigidity of the cover plate 12 and the less likely it is to deform. Conversely, the farther away from the second bracket 400, the more easily the cover plate 12 will deform under stress due to the lack of support. Therefore, along the second direction, the shortest distance between the orthographic projection of the electronic device 200 and the orthographic projection of the support plate 410 should not be too large, thereby preventing the cover plate 12 from being squeezed into the area on the pressure plate 310 corresponding to the electronic device 200 due to large deformation, thus reducing the pressure of the pressure plate 310 on the electronic device 200.

[0164] refer to Figure 8 In some embodiments, along the second direction, the height of the first interval 420 (e.g.) Figure 8The first interval 420 is greater than or equal to 0.05 mm, and the second direction is the thickness direction of the electronic device 10. For example, the height of the first interval 420 can be one of 0.05 mm, 0.07 mm, 0.09 mm, 0.10 mm, 0.12 mm and 0.14 mm.

[0165] In this way, by making the height of the first interval 420 greater than 0.05mm, it is possible to prevent the support plate 410 from directly pressing the pressure plate 310 when it deforms under stress, thereby preventing the force transmitted directly from the support plate 410 to the pressure plate 310 from pressing the electronic device 200.

[0166] refer to Figure 9 In some embodiments, the second support 400 may further include a third support 440. The third support 440 is disposed between the pressure plate 310 and the support plate 410, and the extending direction of the third support 440 intersects the extending direction of the second support 430. Along a second direction, the third support 440 does not overlap with the electronic device 200, and the third support 440 partially overlaps with the first support 320. The second direction is the thickness direction of the electronic device 10.

[0167] In this way, the second support 400 can include a third support member 440, which enables the third support member 440 and the second support member 430 to work together to support the support plate 410 of the second support 400, thereby improving the overall structural rigidity of the support plate 410 and reducing the probability of the support plate 410 deforming when subjected to the force transmitted by the cover plate 12.

[0168] Furthermore, along the second direction, the third support member 440 is made not to overlap with the electronic device 200, and the third support member 440 partially overlaps with the first support member 320. In this way, the support plate 410 can further transfer the force transmitted to the support plate 410 to the first support member 320 through the second support member 430 and the third support member 440, thereby improving the force transmission path between the support plate 410 and the first support member 320. This helps the second bracket 400 to transmit the force to the circuit board 100 and reduces the probability of the electronic device 200 being damaged by pressure.

[0169] refer to Figure 9 In some embodiments, the length extension direction of the third support member 440 (e.g. Figure 9 The X-direction can be perpendicular to the length extension direction of the second support member 430 (e.g., the X-direction). Figure 9 center Y direction).

[0170] There can be multiple third support members 440. If there are two first support members 320 and two second support members 430, there can also be two third support members 440. The two third support members 440 are arranged at intervals along the length extension direction of the second support members 430, and both ends of each third support are used to connect the two second support members 430, so that the two third support members 440 and the two second support members 430 together form a frame structure. Along the second direction, the orthographic projection of the electronic device 200 can be located within the frame structure, and the orthographic projection of the electronic device 200 does not overlap with the orthographic projections of the second support members 430 and the third support members 440.

[0171] refer to Figure 2 In some embodiments, the second bracket 400 and the first bracket 300 are connected by a detachable connection. In this way, by detachably connecting the second bracket 400 and the first bracket 300, it is convenient to replace and repair the second bracket 400 separately, reduce the maintenance cost of the circuit board assembly 11, and thus reduce the maintenance cost of the electronic device 10.

[0172] In some examples, the second bracket 400 and the first bracket 300 can be detachably connected by threaded fasteners such as screws to improve the connection stability between the first bracket 300 and the second bracket. If the second bracket 400 includes a second support member 430 and a support plate 410, screws can pass through the support plate 410 and the second support member 430 to form a threaded connection with the first bracket 300.

[0173] Alternatively, a first snap-fit ​​connector can be provided on the second bracket 400, and a second snap-fit ​​connector can be provided on the first bracket 300. The first bracket 300 and the second bracket 400 can be connected by a detachable connection of the first snap-fit ​​connector and the second snap-fit ​​connector, which facilitates the disassembly and connection of the first bracket 300 and the second bracket 400.

[0174] refer to Figure 10 and Figure 11 In other embodiments, the second bracket 400 and the first bracket 300 are an integral structure. By making the second bracket 400 and the first bracket 300 an integral structure, the assembly steps of the circuit board assembly 11 can be simplified, improving the assembly efficiency and production efficiency of the electronic device 10. In some examples, the first bracket 300 and the second bracket 400 can be an integral injection-molded structure.

[0175] In some embodiments, the material of the second bracket 400 can be at least one of plastic and metal. Thus, if the material of the second bracket 400 is plastic, the weight and manufacturing cost of the second bracket 400 can be reduced, contributing to a reduction in the weight and manufacturing cost of the electronic device 10. If the material of the second bracket 400 is metal, the structural strength of the second bracket 400 can be improved, reducing the likelihood of the second bracket 400 being crushed or damaged when subjected to forces transmitted by the cover plate 12, and facilitating the transmission of forces from the second bracket 400 to the first bracket 300 and the circuit board 100.

[0176] The various embodiments or implementation methods described in this specification are presented in a progressive manner. Each embodiment focuses on the differences from other embodiments, and the same or similar parts between the embodiments can be referred to each other.

[0177] Generally speaking, terms should be understood at least in part by their use in context. For example, at least in part by context, the term "one or more" as used in the text can be used to describe any feature, structure, or characteristic of the singular meaning, or a combination of features, structures, or characteristics of the plural meaning. Similarly, at least in part by context, terms such as "a" or "the" can also be understood to convey either singular or plural usage.

[0178] It should be readily understood that the terms “on,” “above,” and “on top of” in this disclosure should be interpreted in the broadest possible sense, such that “on” means not only “directly on something” but also “on something” with an intermediate feature or layer therebetween, and that “above” or “on top of” means not only “on top of something” but also “on top of something” without an intermediate feature or layer therebetween (i.e., directly on something).

[0179] Furthermore, for ease of explanation, spatially relative terms such as "below," "below," "under," "above," and "above" may be used to describe the relationship of one element or feature relative to other elements or features as shown in the figures. Spatially relative terms are intended to encompass different orientations of the device in use or operation other than those shown in the figures. The device may have other orientations (rotated 90 degrees or in other orientations), and the spatially relative descriptive terms used herein may be interpreted accordingly.

[0180] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

[0181] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, an indirect connection through an intermediate medium, or the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this application according to the specific circumstances.

[0182] The terms "first," "second," "third," "fourth," etc. (if present) in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

Claims

1. An electronic device, characterized in that, include: Circuit board assembly, including: A circuit board on which electronic components are disposed; A first bracket is disposed on the circuit board, and the electronic device is located between the first bracket and the circuit board; The second bracket is disposed on the surface of the first bracket facing away from the circuit board; A cover plate is connected to a portion of the surface of the first bracket facing away from the circuit board, and to the surface of the second bracket facing away from the circuit board; The second bracket is used to transmit at least a portion of the force exerted on the cover plate to the circuit board through the first bracket.

2. The electronic device according to claim 1, characterized in that, The first support includes: A pressure plate is attached to the surface of the electronic device facing away from the circuit board, and the surface of the pressure plate facing away from the circuit board is connected to the cover plate; A first support member is disposed between the circuit board and the pressure plate to support the pressure plate; The second bracket is disposed on the surface of the pressure plate facing away from the circuit board, and the second bracket is used to transmit at least a portion of the force to the circuit board via the pressure plate and the first support member.

3. The electronic device according to claim 2, characterized in that, The second support includes: A support plate is disposed on the side of the pressure plate facing away from the circuit board, and a first gap is formed between the support plate and the pressure plate. The surface of the support plate facing away from the pressure plate is connected to the cover plate. A second support member is disposed between the pressure plate and the support plate, and the second support member is used to support the support plate; The support plate is used to transmit at least a portion of the force to the first support through the second support and the pressure plate.

4. The electronic device according to claim 3, characterized in that, The first support member includes multiple members, and a second interval is formed between two adjacent first support members; The electronic devices include multiple components, and the electronic devices are disposed within the second interval; The second support member includes multiple members, each of which corresponds to one of the first support members. A first interval is formed between each pair of adjacent and spaced-apart second support members, and the first interval corresponds to the second interval.

5. The electronic device according to claim 3, characterized in that, Along a second direction, the first support member at least partially overlaps with the corresponding second support member, the second direction being the thickness direction of the electronic device.

6. The electronic device according to claim 3, characterized in that, Along the second direction, the second support does not overlap with the electronic device, and the second direction is the thickness direction of the electronic device.

7. The electronic device according to claim 6, characterized in that, Along the second direction, the support plate at least partially overlaps with the electronic device.

8. The electronic device according to claim 7, characterized in that, Along the second direction, the second bracket protrudes from the surface of the pressure plate facing away from the circuit board, so that a third gap is formed between the pressure plate and the cover plate.

9. The electronic device according to claim 8, characterized in that, Along the second direction, the support plate does not overlap with the electronic device, and the orthographic projection of the electronic device is located within the third interval.

10. The electronic device according to claim 9, characterized in that, Along the second direction, the shortest distance between the orthographic projection of the support plate and the orthographic projection of the electronic device is greater than or equal to 0 mm and less than or equal to 6 mm.

11. The electronic device according to claim 3, characterized in that, Along the second direction, the height of the first interval is greater than or equal to 0.05 mm; The second direction is the thickness direction of the electronic device.

12. The electronic device according to claim 2, characterized in that, The pressure plate has a groove on its surface facing away from the circuit board, and the second bracket is disposed in the groove.

13. The electronic device according to any one of claims 3-12, characterized in that, The second bracket also includes a third support member; The third support member is disposed between the pressure plate and the support plate, and the length extension direction of the third support member intersects with the length extension direction of the second support member; Along the second direction, the third support is offset from the electronic device, and the third support partially overlaps with the first support; the second direction is the thickness direction of the electronic device.

14. The electronic device according to any one of claims 1-12, characterized in that, It also includes the adhesive layer; The surface of the second bracket facing away from the circuit board is connected to the cover plate via an adhesive layer.

15. The electronic device according to claim 14, characterized in that, The adhesive layer is a hot melt adhesive layer.

16. The electronic device according to any one of claims 1-12, characterized in that, The second bracket and the first bracket are connected by a detachable connection. Alternatively, the second bracket and the first bracket may be an integral structure.

17. The electronic device according to any one of claims 1-12, characterized in that, The material of the second bracket is at least one of plastic and metal.

18. The electronic device according to any one of claims 1-12, characterized in that, The electronic device also includes: The frame has a first side and a second side facing each other, the first side having a mounting groove, and the circuit board assembly being disposed within the mounting groove; A screen assembly connected to the second side of the frame; The cover plate is connected to the first surface of the frame.

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