Circuit board manufacturing process based on two-side overturning

Abstract

The invention discloses a circuit board manufacturing process based on two-side overturning, and belongs to the field of circuit board processing. The circuit board manufacturing process based on two-side overturning comprises the following steps: S1, blanking and edging; s2, drilling for the first time; s3, hole metallization is carried out; s4, making an outer layer circuit image; s5, the workpiece is conveyed to a turnover device to be turned over, and secondary drilling is conducted; s7, carrying out post-treatment; and S5, a turn-over device comprises two rotating plates which are arranged in a spaced mode and can rotate synchronously, each rotating plate is provided with a plurality of clamping assemblies, two material rotating assemblies parallel to the circuit board are symmetrically arranged on the sides, away from each other, of the rotating plates, and two unlocking assemblies are symmetrically arranged between the rotating plates. By arranging the clamping assembly to be matched with the unlocking assembly, the circuit board can be stably pressed on the rotating plate before overturning, firm clamping is kept all the time in the overturning process, it is ensured that the positioning precision of the circuit board is not changed due to the overturning action, and the accuracy and consistency of the position of the circuit board when the circuit board enters a secondary drilling station are ensured.

Description

Technical Field

[0001] This invention relates to the field of circuit board processing, and in particular to a circuit board manufacturing process based on double-sided flipping. Background Technology

[0002] Double-sided circuit boards are a type of circuit board frequently used in the manufacturing of electronic devices. Compared to single-sided circuit boards, they offer higher reliability and more complex circuit structures. In current technology, to meet the demands for miniaturization, high performance, and increased complexity in electronic devices, double-sided circuit boards are commonly used. During the manufacturing of these double-sided circuit boards, the boards are flipped over for processing.

[0003] Chinese patent discloses a circuit board manufacturing process based on double-sided flipping, application number 202411275872.9. The above patent can effectively solve the problem that existing technologies generally use double-sided circuit boards to meet the needs of miniaturization, high performance and complexity of electronic devices. During the manufacturing process, the circuit boards are flipped for processing. This process relies on manual labor, which reduces production efficiency and makes it difficult to guarantee the accuracy and quality of the workpiece.

[0004] Existing automatic flipping devices utilize a combination of an inclined placement trough and gravity to automatically flip and transport circuit boards. However, during the flipping process, the circuit boards rely primarily on gravity and the passive positioning of the trough structure, lacking a stable clamping structure. This makes the circuit boards prone to sliding or shifting during rotation or reversal. During the unloading stage, the circuit boards slide out of the placement trough, making it difficult to guarantee the accuracy and consistency of their position after unloading. This may necessitate additional positioning mechanisms for secondary correction to ensure the precision of subsequent processing, increasing the overall production efficiency due to the added process steps. Summary of the Invention

[0005] This invention provides a circuit board manufacturing process based on double-sided flipping, which can solve the problem in the prior art that there is no stable clamping structure during circuit board flipping, making it difficult to ensure the accuracy and consistency of the circuit board position after cutting.

[0006] A circuit board manufacturing process based on double-sided flipping includes the following steps: S1. Cut and grind the edges of the provided substrate; S2. Drill holes in the processed substrate to form initial through holes; S3. The substrate with the initial through-hole is subjected to chemical copper plating and electroplating to thicken it, so that a conductive copper layer is formed on the hole wall and the board surface. S4. Form outer layer circuit patterns on both sides of the substrate, and perform tin plating, etching and tin removal in sequence to obtain a double-sided circuit board with outer layer circuits. S5. The double-sided circuit board is transported to the flipping device. After the circuit board is flipped by the flipping device, it is drilled again to form secondary through holes. S6. For the circuit board that has completed the secondary drilling, the solder mask layer is printed, the characters are printed, the shape is processed and the electrical test is performed in sequence. The flipping device described in S5 includes two rotating plates with a gap between them that can rotate synchronously. Each rotating plate is provided with multiple clamping components. On the opposite side of each rotating plate, there are two material transfer components that are parallel to the circuit board. There are two unlocking components that are symmetrically provided between the rotating plates.

[0007] Preferably, the flipping device further includes a housing filled with a cleaning medium, and the clamping assembly can be immersed in the cleaning medium.

[0008] Preferably, the clamping assembly includes a placement slot formed on the rotating plate, a pressure plate movable in the placement slot, a plurality of guide rods fixed on the pressure plate, and a plurality of springs sleeved on the corresponding guide rods. The guide rods all slide through the interior of the rotating plate, and a connecting plate is fixedly provided on the top of each plurality of horizontally adjacent guide rods.

[0009] Preferably, the unlocking component includes a first cylinder fixed to the housing, a mounting plate fixed to the drive shaft of the first cylinder, a fixing block fixed to the connecting plate, and a guide ramp on the fixing block, wherein the mounting plate and the guide ramp are in sliding contact.

[0010] Preferably, the material transfer assembly includes a movable plate, a plurality of rotating shafts rotatably connected to the movable plate, a conveying wheel fixed on the rotating shaft, and a drive assembly for driving the plurality of rotating shafts to rotate synchronously. The conveying wheel has a groove in the middle that can contact the edge of the circuit board.

[0011] Preferably, the drive assembly includes a first motor fixed to the top of the movable plate, a coupling fixed to the output shaft of the first motor, and a plurality of bevel gears. The plurality of bevel gears are respectively fixed to the coupling and the rotating shaft, and each pair of adjacent bevel gears are meshed together.

[0012] Preferably, the material transfer assembly further includes a second cylinder fixed to the housing, and the moving plate is fixedly connected to the drive shaft of the second cylinder.

[0013] Preferably, both sides of the housing are provided with conveyor belts, which cooperate with adjacent transfer components to realize the loading and unloading of circuit boards.

[0014] Preferably, the housing is provided with a control component for driving the rotating plate to rotate; The control assembly includes a main shaft rotatably connected to the housing, a second motor fixed to the housing, and two first gears. The two first gears are respectively fixed to the main shaft and the output shaft of the second motor, and the two first gears are meshed together.

[0015] Preferably, the housing is an ultrasonic cleaner.

[0016] This invention provides a circuit board manufacturing process based on double-sided flipping, which has the following beneficial effects: 1. By using a clamping assembly in conjunction with an unlocking assembly, the circuit board can be stably pressed onto the rotating plate before flipping, maintaining a firm grip throughout the flipping process. This effectively prevents the circuit board from sliding or shifting during rotation or reversal. After flipping, the clamping assembly can only release the circuit board by controlling the unlocking assembly, ensuring that its positioning accuracy remains unchanged due to the flipping action. This flipping method ensures the accuracy and consistency of the circuit board's position when entering the secondary drilling station, guaranteeing the machining accuracy of the secondary through holes. Furthermore, it reduces the need for additional secondary positioning steps due to flipping and repositioning, simplifying the process and improving overall production efficiency.

[0017] 2. When the rotating board drives the circuit board to flip, it is immersed in the cleaning medium in the chamber, which integrates the online cleaning function of the drilled holes; the cleaning medium, together with the ultrasonic assistance in the chamber, helps to effectively shake off the impurity particles attached to the hole wall and remove the impurities remaining in the drilled holes to prevent blockage. Attached Figure Description

[0018] Figure 1 A schematic diagram of the process structure for a circuit board manufacturing process based on double-sided flipping provided by the present invention; Figure 2 A schematic diagram of a flipping device structure for a circuit board manufacturing process based on two-sided flipping provided by the present invention. Figure 3 A cross-sectional view of the housing structure in a flipping device for a circuit board manufacturing process based on two-sided flipping provided by the present invention. Figure 4 A schematic diagram of the transfer plate structure in a flipping device for a circuit board manufacturing process based on two-sided flipping provided by the present invention. Figure 5 This invention provides a circuit board manufacturing process based on double-sided flipping. Figure 4 Enlarged structural diagram at point A in the middle; Figure 6 This invention provides a circuit board manufacturing process based on double-sided flipping. Figure 4 Enlarged structural diagram at point B.

[0019] Explanation of reference numerals in the attached figures: 1. Housing; 2. Turning plate; 3. Clamping assembly; 31. Placement slot; 32. Pressure plate; 33. Guide rod; 34. Spring; 4. Unlocking assembly; 41. First cylinder; 42. Mounting plate; 43. Fixing block; 44. Guide ramp; 45. Roller; 5. Transfer assembly; 51. Moving plate; 52. Rotating shaft; 53. Conveying wheel; 54. Drive assembly; 541. First motor; 542. Coupling; 543. Bevel gear; 55. Second cylinder; 6. Control assembly; 61. Main shaft; 62. Second motor; 63. First gear; 7. Connecting plate; 8. Conveyor belt. Detailed Implementation

[0020] The specific embodiments of the present invention will be described in detail below, but it should be understood that the scope of protection of the present invention is not limited to the specific embodiments.

[0021] like Figures 1 to 6 As shown in the figure, an embodiment of the present invention provides a circuit board manufacturing process based on double-sided flipping, which includes the following steps: S1. Cut and grind the edges of the provided substrate; The copper-clad laminate is cut into the required board parts according to the design dimensions, and the edges are polished.

[0022] S2. Drill holes in the processed substrate to form initial through holes; The initial drilling is performed using a CNC drilling machine according to the design documents. This step drills through holes for electrical interconnection between upper and lower layers, as well as mounting holes for some components. The hole positions are precise, laying the foundation for subsequent processes.

[0023] S3. The substrate with the initial through-hole is subjected to chemical copper plating and electroplating to thicken it, so that a conductive copper layer is formed on the hole wall and the board surface. First, a thin layer of copper is deposited on the hole wall through chemical copper plating to achieve conductivity; then, the copper layer thickness of the entire board surface and inside the hole is increased through electroplating to meet the specified electrical conductivity and mechanical strength requirements.

[0024] S4. Form outer layer circuit patterns on both sides of the substrate, and perform tin plating, etching and tin removal in sequence to obtain a double-sided circuit board with outer layer circuits. The circuit pattern is formed on two copper layers by photolithography (exposure and development), tin is plated on the lines as a protective layer, the unprotected copper foil is then etched away, and finally the tin is removed to obtain a precise copper circuit pattern.

[0025] S5. The double-sided circuit board is transported to the flipping device. After the circuit board is flipped by the flipping device, it is drilled again to form secondary through holes. The circuit board is flipped over by an automated flipping device so that a second drilling can be performed on the other side of the board.

[0026] S6. Perform post-processing on the circuit board after secondary drilling in sequence: solder mask printing, character printing, shape processing and electrical testing.

[0027] Solder resist printing: Insulating ink (solder resist layer) is printed on the surface of the circuit board, exposing only the solder pads and other parts that need to be soldered, so as to play a role in insulation and protection.

[0028] Character printing: Printing component identification, polarity, and other text symbols on the solder mask layer.

[0029] Shape processing: The circuit board is cut, milled, and shaped according to its final shape.

[0030] Electrical testing: Perform electrical performance tests such as continuity and insulation tests on the finished board to ensure that the circuit functions correctly and the quality is up to standard.

[0031] In some specific implementation plans, such as Figure 2 and Figure 3 As shown. The flipping device in S5 includes a housing 1, two rotating plates 2 with a gap between them and capable of rotating synchronously, each rotating plate 2 is provided with multiple clamping components 3, and two material transfer components 5 arranged parallel to the circuit board are symmetrically provided on the opposite side of the rotating plates 2, and two unlocking components 4 are symmetrically provided between the rotating plates 2. The clamping components 3 and the unlocking components 4 cooperate to lock and unlock the circuit board on the rotating plates 2. The housing 1 is filled with cleaning medium, and the clamping components 3 can be immersed in the cleaning medium.

[0032] During loading, the transfer component 5 on one side activates, feeding the circuit board into a clamping component 3 of the turntable 2. Then, the unlocking component 4 at that position controls the clamping component 3 to clamp the circuit board. The turntable 2 rotates, causing the circuit board to flip and transfer to the other side while immersed in the cleaning medium. Upon reaching the unloading position, the unlocking component 4 on that side activates, releasing the clamp, and the transfer component 5 on that side then transports and delivers the flipped circuit board, achieving automated flipping and transfer of the circuit board while it is clamped. Furthermore, during circuit board drilling, mechanical drilling is often used for small holes. During drilling, impurities can easily remain in the holes, causing blockage. When the turntable 2 flips the circuit board while immersing it in the cleaning medium in the housing 1, an online cleaning function for the drilled holes is integrated.

[0033] By using clamping component 3 in conjunction with unlocking component 4, the circuit board can be stably pressed onto the rotating plate 2 before flipping, maintaining a firm grip throughout the flipping process. This effectively prevents the circuit board from sliding or shifting during rotation or reversal. After flipping, the clamping component 3 can only release the circuit board by controlling the unlocking component 4, ensuring that its positioning accuracy remains unchanged due to the flipping action. This flipping method ensures the accuracy and consistency of the circuit board's position when entering the secondary drilling station, guaranteeing the machining accuracy of the secondary through holes. Furthermore, it reduces the need for additional secondary positioning steps due to flipping and repositioning, simplifying the process and improving overall production efficiency.

[0034] In some specific implementation plans, such as Figure 4 , Figure 5 and Figure 6 As shown. The clamping assembly 3 includes a placement groove 31 opened on the rotating plate 2, a pressure plate 32 movable in the placement groove 31, a plurality of guide rods 33 fixed on the pressure plate 32, and a plurality of springs 34 sleeved on the corresponding guide rods 33. The pressure plate 32 is provided with a plurality of through holes, and the guide rods 33 all slide through the interior of the rotating plate 2. A connecting plate 7 is fixedly provided on the top of each plurality of horizontally adjacent guide rods 33. A relatively hard soft pad can be provided at the mating surface between the placement groove 31 and the circuit board to reduce the friction between the rigid rotating plate 2 and the circuit board.

[0035] Before the circuit board from the previous process is conveyed to the placement slot 31, the extension of the drive shaft of the first cylinder 41 drives the pressure plate 32 to lift. After the circuit board moves into the placement slot 31, the first cylinder 41 retracts, and under the action of the spring 34, the pressure plate 32 presses the circuit board firmly and fixes it in the placement slot 31, ensuring the stability of the circuit board's position during the flipping and moving process. This makes the subsequent conveying and positioning more accurate, reduces the trouble of needing to reposition, and facilitates subsequent secondary drilling work. When the circuit board that has completed flipping is removed from the placement slot 31, the drive shaft of the first cylinder 41 extends and drives the pressure plate 32 to move downward. The circuit board can then be removed from the placement slot 31 via the transfer assembly 5.

[0036] In some specific implementation plans, such as Figure 2 , Figure 4 and Figure 6 As shown. The unlocking component 4 includes a first cylinder 41 fixed to the housing 1, a mounting plate 42 fixed to the drive shaft of the first cylinder 41, a fixing block 43 fixed to the connecting plate 7, and a guide ramp 44 provided on the fixing block 43. The mounting plate 42 and the guide ramp 44 are in sliding contact. To reduce friction between the mounting plate 42 and the guide ramp 44, rollers 45 are mounted on the mounting plate 42 to contact the guide ramp 44. The first cylinder 41 is fixed to the housing 1 by a mounting bracket located outside the rotation range of the rotating plate 2.

[0037] When the first cylinder 41 drives the mounting plate 42 to extend, the roller 45 on it will contact and slide with the guide slope 44 of the fixing block 43, thereby pushing the connecting plate 7 and the guide rod 33 to move upward, compressing the spring 34, driving the pressure plate 32 to lift up, and releasing the clamping of the circuit board.

[0038] In some specific implementation plans, such as Figure 2 , Figure 3 and Figure 5 As shown. The material transfer assembly 5 includes a movable plate 51, multiple rotating shafts 52 rotatably connected to the movable plate 51, a conveying wheel 53 fixed on the rotating shaft 52, a drive assembly 54 for driving the multiple rotating shafts 52 to rotate synchronously, and a second cylinder 55 fixed on the housing 1. The movable plate 51 is fixedly connected to the drive shaft of the second cylinder 55. The conveying wheel 53 has a groove in the middle that can contact the edge of the circuit board. The groove has a certain longitudinal height. The drive assembly 54 includes a first motor 541 fixed on the top of the movable plate 51, a coupling 542 fixed on the output shaft of the first motor 541, and multiple bevel gears 543. The multiple bevel gears 543 are respectively fixed on the coupling 542 and the rotating shaft 52, and every two adjacent bevel gears 543 are meshed together.

[0039] When the double-sided circuit board with the outer circuit pattern completed is conveyed to the side of the housing 1 by the conveyor belt 8 at the loading station, the moving plate 51 on this side moves under the drive of the second cylinder 55, so that the groove of the conveyor wheel 53 receives the edge of the circuit board. The first motor 541 starts, and through the meshing transmission of the bevel gear 543, the rotating shaft 52 rotates, driving the conveyor wheel 53 to horizontally send the circuit board into the placement slot 31 of a rotating plate 2. Correspondingly, when the circuit board that has been flipped is unloaded, the rotation of the rotating plate 2 conveys the circuit board to the unloading station. Here, the moving plate 51 moves under the drive of the second cylinder 55, so that the groove of the conveyor wheel 53 receives the edge of the circuit board. The first motor 541 starts, and through the meshing transmission of the bevel gear 543, the rotating shaft 52 rotates, driving the conveyor wheel 53 to horizontally send the circuit board out of the placement slot 31.

[0040] In some specific implementation plans, such as Figure 2 As shown. Both sides of the housing 1 are provided with conveyor belts 8. The conveyor belts 8 cooperate with the adjacent transfer components 5 to realize the loading and unloading of circuit boards. The height of the conveyor belts 8 and the adjacent placement slots 31 are matched to facilitate the transition of circuit boards between the conveyor belts 8 and the placement slots 31 through the transfer components 5.

[0041] The circuit board that has completed the previous process is conveyed to the transfer assembly 5 via the conveyor belt 8 at the loading station. The transfer assembly 5 clamps and moves the conveyed circuit board to the placement trough 31 for clamping and positioning. As the rotating plate 2 rotates, the circuit board, after being cleaned, moves to the unloading station, where the flipping process has been completed. Here, the transfer assembly 5 clamps and moves the conveyed circuit board out of the placement trough 31 and onto the conveyor belt 8 at the unloading station for conveying to the next process.

[0042] In some specific implementation plans, such as Figure 2 As shown. The housing 1 is also equipped with a control component 6 for driving the rotating plate 2 to rotate. The control component 6 includes a main shaft 61 rotatably connected to the housing 1, a second motor 62 fixed to the housing 1, and two first gears 63. The two first gears 63 are respectively fixed to the main shaft 61 and the output shaft of the second motor 62, and the two first gears 63 are meshed together.

[0043] A second motor 62 is installed on the housing 1. The output shaft of the second motor 62 and the main shaft 61 have a first gear 63 that meshes with each other, so that the main shaft 61 and the rotating plate 2 are driven to rotate by the second motor 62, thereby realizing the flipping and transfer of the circuit board.

[0044] In some specific implementation schemes, the housing 1 is an ultrasonic cleaner, and the preferred cleaning medium is clean water; the cleaning medium, in conjunction with the ultrasonic assistance inside the housing, generates a strong microscopic impact force through the cavitation effect of the ultrasonic waves, effectively shaking off impurity particles attached to the hole wall; the liquid level of the cleaning medium is between the top of the vertical placement tank 31 and the first cylinder 41 located below.

[0045] In some specific implementations, to ensure a good service life for the tilting device, the surfaces of components in contact with the cleaning medium are coated with a corrosion-resistant coating, or preferably made of stainless steel.

[0046] To facilitate understanding of the embodiments of this solution by those skilled in the art, the working principle of this solution will now be briefly explained in conjunction with specific application scenarios: After the outer circuit pattern of the circuit board is completed, it is conveyed to one side of the housing 1 by the conveyor belt 8 at the loading station. The first cylinder 41 drives the shaft to extend, pushing the mounting plate 42 to move. The roller 45 contacts and slides with the guide ramp 44, thereby lifting the connecting plate 7 and compressing the spring 34. The connecting plate 7 drives the guide rod 33 to move upward, thereby lifting the pressure plate 32. The transfer assembly 5 located on this side is activated, and its moving plate 51 moves under the drive of the second cylinder 55, so that the groove of the conveyor wheel 53 receives the edge of the circuit board. Subsequently, the first motor 541 drives the rotating shaft 52 to rotate synchronously through the bevel gear 543 set, and the conveyor wheel 53 rotates accordingly, smoothly and horizontally feeding the circuit board into a placement slot 31.

[0047] Once the circuit board is fully inserted into the placement slot 31, the first cylinder 41 drives the shaft to retract, the spring 34 returns to its original deformation, and pushes the pressure plate 32 downward to press the circuit board firmly into the placement slot 31, completing the automatic clamping and locking. The second motor 62 starts, driving the main shaft 61 through the meshing first gear 63, causing the two rotating plates 2 to rotate synchronously. During rotation, the clamped and fixed circuit board is immersed in the cleaning medium in the housing 1. This process serves two purposes: first, it transfers the circuit board from the feeding side and flips it over to the discharge side; second, it uses cleaning water combined with ultrasonic waves to perform online cleaning of the circuit board surface and existing through holes, effectively removing impurities remaining in the drilled holes and preventing blockage.

[0048] When the rotating plate 2 rotates to its position and the placement slot 31 holding the circuit board reaches the unloading station, the drive shaft of the first cylinder 41 at this station extends, pushing the mounting plate 42 to move and cooperate with the guide inclined surface 44, thereby pushing the connecting plate 7 downward. The connecting plate 7 drives the guide rod 33 to move downward, which in turn causes the pressure plate 32 to move downward, releasing the clamping of the circuit board. The material transfer assembly 5 located at the unloading station starts, and its conveyor wheel 53, under the coordinated action of the second cylinder 55 and the first motor 541, horizontally removes the circuit board that has been flipped and cleaned from the placement slot 31 and places it on the conveyor belt 8 at the unloading station for transport to the next process (secondary drilling) for subsequent processing.

[0049] The above-disclosed embodiments are merely a few specific examples of the present invention. However, the embodiments of the present invention are not limited thereto, and any variations that can be conceived by those skilled in the art should fall within the protection scope of the present invention.

Claims

1. A circuit board manufacturing process based on double-sided flipping, characterized in that, Includes the following steps: S1. Cut and grind the edges of the provided substrate; S2. Drill holes in the processed substrate to form initial through holes; S3. The substrate with the initial through-hole is subjected to chemical copper plating and electroplating to thicken it, so that a conductive copper layer is formed on the hole wall and the board surface. S4. Form outer layer circuit patterns on both sides of the substrate, and perform tin plating, etching and tin removal in sequence to obtain a double-sided circuit board with outer layer circuits. S5. The double-sided circuit board is transported to the flipping device. After the circuit board is flipped by the flipping device, it is drilled again to form secondary through holes. S6. For the circuit board that has completed the secondary drilling, the solder mask layer is printed, the characters are printed, the shape is processed and the electrical test is performed in sequence. The flipping device described in S5 includes two rotating plates (2) with a gap between them and which can rotate synchronously. Each rotating plate (2) is provided with multiple clamping components (3). Two material transfer components (5) are symmetrically arranged parallel to the circuit board on the opposite side of each rotating plate (2). Two unlocking components (4) are symmetrically arranged between the rotating plates (2).

2. The circuit board manufacturing process based on double-sided flipping as described in claim 1, characterized in that, The flipping device also includes a housing (1), the housing (1) being filled with a cleaning medium, and the clamping assembly (3) being immersable in the cleaning medium.

3. The circuit board manufacturing process based on double-sided flipping as described in claim 2, characterized in that, The clamping assembly (3) includes a placement slot (31) opened on the rotating plate (2), a pressure plate (32) movable in the placement slot (31), a plurality of guide rods (33) fixed on the pressure plate (32) and a plurality of springs (34) sleeved on the corresponding guide rods (33). The guide rods (33) all slide through the interior of the rotating plate (2), and a connecting plate (7) is fixedly provided on the top of each plurality of horizontally adjacent guide rods (33).

4. The circuit board manufacturing process based on double-sided flipping as described in claim 3, characterized in that, The unlocking component (4) includes a first cylinder (41) fixed on the housing (1), a mounting plate (42) fixed on the drive shaft of the first cylinder (41), a fixing block (43) fixed on the connecting plate (7), and a guide slope (44) provided on the fixing block (43). The mounting plate (42) and the guide slope (44) are in sliding contact.

5. The circuit board manufacturing process based on double-sided flipping as described in claim 4, characterized in that, The material transfer assembly (5) includes a moving plate (51), a plurality of rotating shafts (52) rotatably connected to the moving plate (51), a conveying wheel (53) fixed on the rotating shaft (52), and a drive assembly (54) for driving the plurality of rotating shafts (52) to rotate synchronously. The conveying wheel (53) has a groove in the middle that can contact the edge of the circuit board.

6. The circuit board manufacturing process based on double-sided flipping as described in claim 5, characterized in that, The drive assembly (54) includes a first motor (541) fixed to the top of the movable plate (51), a coupling (542) fixed to the output shaft of the first motor (541), and a plurality of bevel gears (543). The plurality of bevel gears (543) are respectively fixed on the coupling (542) and the rotating shaft (52), and each pair of adjacent bevel gears (543) are meshed together.

7. The circuit board manufacturing process based on double-sided flipping as described in claim 5, characterized in that, The material transfer assembly (5) also includes a second cylinder (55) fixed on the housing (1), and the moving plate (51) is fixedly connected to the drive shaft of the second cylinder (55).

8. The circuit board manufacturing process based on double-sided flipping as described in claim 2, characterized in that, The box (1) is equipped with conveyor belts (8) on both sides. The conveyor belts (8) cooperate with the adjacent transfer assembly (5) to realize the loading and unloading of circuit boards.

9. The circuit board manufacturing process based on double-sided flipping as described in claim 8, characterized in that, The housing (1) is provided with a control component (6) for driving the rotating plate (2) to rotate. The control component (6) includes a main shaft (61) rotatably connected to the housing (1), a second motor (62) fixed to the housing (1), and two first gears (63). The two first gears (63) are respectively fixed on the main shaft (61) and the output shaft of the second motor (62), and the two first gears (63) are meshed together.

10. The circuit board manufacturing process based on double-sided flipping as described in claim 2, characterized in that, The housing (1) is an ultrasonic cleaner.

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