Method for improving hole position precision of alignment holes of multi-stage HDI (High Density Interconnect) plate and HDI plate

Abstract

The invention discloses a method for improving the hole position precision of alignment holes of a multi-order HDI plate and the HDI plate, and the method comprises the steps: designing an arrangement mode of N groups of alignment hole patterns, each group of alignment hole patterns comprises four alignment hole patterns, and the four alignment hole patterns are distributed at the four corners of the HDI plate; all the alignment hole patterns at each corner are arranged according to the principle of minimum plate occupation space; the multiple layers of daughter boards are sequentially stacked on the two sides of the core board to form a mother board; carrying out drilling, electroplating and pattern transfer on the mother board, and making a first group of alignment hole patterns; laser layers are overlaid on the two sides of the mother board to obtain 1 + M + 1 layers of daughter boards, and a first set of alignment holes are drilled in the 1 + M + 1 layers of daughter boards according to the first set of alignment hole patterns; drilling, electroplating and pattern transfer are sequentially carried out on the 1 + M + 1 layer of daughter boards, and a second group of alignment hole patterns are made; superposing a laser layer on the 1 + M + 1 layer of daughter board to obtain a 2 + M + 2 layer of daughter board, and drilling a second group of alignment holes in the 2 + M + 2 layer of daughter board according to the second group of alignment hole patterns; and repeating for N times to obtain an N + M + N multi-order HDI plate. According to the invention, the occupied out-of-board data space is small, and the alignment degree of the multi-order HDI board is ensured.

Description

Technical Field

[0001] This invention belongs to the field of PCB board technology, specifically relating to a method for improving the hole position accuracy of a multi-level HDI board and the HDI board itself. Background Technology

[0002] With the increasing use of small-sized portable electronic devices and high-density interconnects, the requirements for HDI boards are becoming more and more stringent. For example, multi-stage HDI boards with a stacked structure of N+M+N, where M represents the first laminated sub-board and N represents N laser-stacked layers, require N alignment holes.

[0003] The traditional method for creating alignment vias is as follows: a 6.0mm copper-free area is cut out of the target layer, and a 4.25mm diameter copper pad is designed in the center. The entire reference layer is a 6.0mm diameter copper-free area (see details). Figure 1 and Figure 2 This traditional approach has the following problems: the higher the laser overlay layer, the more alignment holes are required, the more space is occupied by external materials, and the larger the margin requirement becomes (see details). Figure 3 This affects the substrate cutting utilization rate, and the probability of incomplete alignment hole patterns is increasing (see details). Figure 4 This leads to increasingly poor alignment hole accuracy (greater than 1.0 mil). Summary of the Invention

[0004] To address the aforementioned issues, this invention proposes a method and an HDI board for improving the hole position accuracy of multi-level HDI boards. This method occupies less external data space, ensuring the alignment accuracy of multi-level HDI boards, thereby guaranteeing overall yield and production cycle.

[0005] To achieve the above-mentioned technical objectives and effects, the present invention is implemented through the following technical solution:

[0006] In a first aspect, the present invention provides a method for improving the hole position accuracy of alignment holes in a multi-stage HDI board, comprising:

[0007] Design an arrangement of N sets of alignment hole patterns. Each set of alignment hole patterns includes four alignment hole patterns, which are distributed at the four corners of the HDI board. All alignment hole patterns at each corner are arranged to minimize the board space occupied.

[0008] Provide core boards;

[0009] A multi-layer sub-board is provided, wherein the multi-layer sub-board is sequentially stacked on both sides of the core board and formed into a mother board by a single pressing;

[0010] The mother plate is drilled, electroplated, and pattern transferred sequentially, and the first set of alignment hole patterns is made according to the pre-designed arrangement of N sets of alignment hole patterns.

[0011] Laser layers are superimposed on both sides of the mother board to obtain a 1+M+1 layer sub-board. The first set of alignment holes required for the first superposition is drilled on the 1+M+1 layer sub-board according to the first set of alignment hole pattern.

[0012] The 1+M+1 layer sub-board is drilled, electroplated, and pattern transferred sequentially. The second set of alignment hole patterns is made according to the pre-designed arrangement of N sets of alignment hole patterns.

[0013] Laser layers are superimposed on both sides of the 1+M+1 layer sub-board to obtain the 2+M+2 layer sub-board. The second set of alignment holes required for the second superposition is drilled on the 2+M+2 layer sub-board according to the second set of alignment hole pattern.

[0014] Repeat N times to obtain N+M+N multi-stage HDI boards.

[0015] In conjunction with the first aspect, optionally, the alignment hole pattern includes a circular target area, a middle annular area, and an outer annular area arranged sequentially from the inside to the outside.

[0016] In conjunction with the first aspect, optionally, the diameter of the circular target area is 2.0 mm.

[0017] In conjunction with the first aspect, optionally, the circular target area is made of copper.

[0018] In conjunction with the first aspect, optionally, the diameter of the outer annular region is 4.0 mm.

[0019] In conjunction with the first aspect, optionally, the outer annular region is made of copper.

[0020] In conjunction with the first aspect, optionally, the intermediate annular region is a copper-free region.

[0021] In conjunction with the first aspect, optionally, all the alignment hole patterns at each corner are arranged in a staggered array.

[0022] In conjunction with the first aspect, optionally, the alignment hole patterns at each corner are arranged in close proximity.

[0023] In a second aspect, the present invention provides an HDI board, which is prepared by the method described in any one of the first aspects for improving the hole position accuracy of a multi-stage HDI board.

[0024] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0025] The present invention provides a method and HDI board for improving the hole position accuracy of multi-level HDI boards. By creatively designing the arrangement of the hole patterns, the method minimizes the space occupied by the external data on the board, reduces the defect rate of incomplete hole patterns, and ensures the alignment accuracy of multi-level HDI boards, thereby guaranteeing the overall yield and production cycle. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the embodiments will be briefly described below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort, wherein:

[0027] Figure 1 This is a schematic diagram showing the dimensions of the alignment hole pattern in the prior art;

[0028] Figure 2 This is a schematic diagram of the alignment hole structure in the prior art;

[0029] Figure 3 This is the intended arrangement of alignment holes in existing technology;

[0030] Figure 4 This is a schematic diagram of an incomplete alignment hole pattern in the prior art;

[0031] Figure 5 This is a schematic diagram showing the dimensions of the alignment hole pattern according to an embodiment of the present invention;

[0032] Figure 6 This is a schematic diagram of the alignment hole structure according to an embodiment of the present invention;

[0033] Figure 7 This is a flowchart of a method for improving the hole position accuracy of a multi-stage HDI board according to an embodiment of the present invention;

[0034] Figure 8(a) is a schematic diagram of the arrangement of N sets of alignment hole patterns according to an embodiment of the present invention;

[0035] Figure 8(b) is a schematic diagram of the first set of alignment holes according to an embodiment of the present invention;

[0036] Figure 8(c) is a schematic diagram of the first alignment hole according to an embodiment of the present invention;

[0037] Figure 8(d) is a schematic diagram of the second set of alignment holes according to an embodiment of the present invention;

[0038] Figure 8(e) is a schematic diagram of the structure of an HDI board according to an embodiment of the present invention. Detailed Implementation

[0039] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0040] Furthermore, if the embodiments of this invention involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. If the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this invention.

[0041] Example 1

[0042] This invention provides a method for improving the hole position accuracy of alignment holes in multi-stage HDI boards, such as... Figure 7 As shown, it includes the following steps:

[0043] (1) Design the arrangement of N sets of alignment hole patterns. Each set of alignment hole patterns includes four alignment hole patterns, which are distributed at the four corners of the HDI board. All alignment hole patterns at each corner are arranged with the principle of minimizing the board space occupied. See Figure 8(a) for details.

[0044] (2) Provide core board;

[0045] (3) Provide a multi-layer sub-board, wherein the multi-layer sub-board is stacked sequentially on both sides of the core board and formed into a mother board by pressing in one step;

[0046] (4) Drilling, electroplating, and pattern transfer are performed on the mother plate in sequence, and the first set of alignment hole patterns is made according to the pre-designed arrangement of N sets of alignment hole patterns; see Figure 8(b) for details.

[0047] (5) Laser layers are superimposed on both sides of the mother board to obtain a 1+M+1 layer sub-board. The first set of alignment holes required for the first superposition is drilled on the 1+M+1 layer sub-board according to the first set of alignment hole pattern. See Figure 8(c) for details.

[0048] (6) Drilling, electroplating, and pattern transfer are performed on the 1+M+1 layer sub-board in sequence, and the second set of alignment hole patterns is made according to the pre-designed N sets of alignment hole patterns; see Figure 8(d) for details.

[0049] (7) Laser layers are superimposed on both sides of the 1+M+1 layer sub-board to obtain the 2+M+2 layer sub-board. The second set of alignment holes required for the second superposition is drilled on the 2+M+2 layer sub-board according to the second set of alignment hole pattern.

[0050] (8) Repeat N times to obtain N+M+N multi-stage HDI boards, see Figure 8(e) for details.

[0051] In the above solution, the arrangement of the alignment hole pattern is creatively designed, which reduces the space occupied by the external data on the board, reduces the defect rate of incomplete alignment hole pattern, and ensures the alignment accuracy of multi-level HDI boards, thereby ensuring the overall yield and production cycle.

[0052] In one specific embodiment of the present invention, such as Figure 5 As shown, the alignment hole pattern includes a circular target area, a middle annular area, and an outer annular area arranged sequentially from the inside to the outside.

[0053] The above solution allows for the use of a target drilling machine to align with the circular target area during the machining of alignment holes, thus obtaining the alignment holes. See details below. Figure 6 This improves drilling accuracy.

[0054] In one specific embodiment of the present invention, the diameter of the circular target area is 2.0 mm.

[0055] Based on the above scheme, by designing the diameter of the circular target area to be 2.0mm, the size of the alignment hole can be effectively reduced, resulting in a smaller space occupied by the external data on the board.

[0056] In one specific embodiment of the present invention, the circular target area is made of copper.

[0057] In one specific embodiment of the present invention, the diameter of the outer annular region is 4.0 mm.

[0058] In one specific embodiment of the present invention, the outer annular region is made of copper.

[0059] In one specific embodiment of the present invention, the intermediate annular region is a copper-free region.

[0060] In one specific embodiment of the present invention, all the alignment hole patterns at each corner are arranged in a staggered array. See Figure 8(a) for details.

[0061] Based on the above solution, the space occupied by alignment holes on the board can be effectively reduced, the defect rate of incomplete alignment hole patterns can be reduced, the alignment accuracy of multi-level HDI boards can be guaranteed, thereby ensuring the overall yield and production cycle.

[0062] In one specific embodiment of the present invention, the alignment hole patterns at each corner are arranged adjacent to each other.

[0063] Example 2

[0064] This invention provides an HDI board, which is prepared by the method described in any one of the first aspects for improving the alignment hole position accuracy of a multi-stage HDI board. Its structure is shown in Figure 8(e).

[0065] Those skilled in the art will understand that embodiments of this application can be provided as methods, systems, or computer program products. Therefore, this application can take the form of a completely hardware embodiment, a completely software embodiment, or an embodiment combining software and hardware aspects. Furthermore, this application can take the form of a computer program product embodied on one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.

[0066] This application is described with reference to flowchart illustrations and / or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of this application. It will be understood that each block of the flowchart illustrations and / or block diagrams, and combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, special-purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, generate instructions for implementing the flowchart... Figure 1 One or more processes and / or boxes Figure 1 A device that provides the functions specified in one or more boxes.

[0067] These computer program instructions may also be stored in a computer-readable storage medium that can direct a computer or other programmable data processing device to function in a particular manner, such that the instructions stored in the computer-readable storage medium produce an article of manufacture including instruction means, which are implemented in a process Figure 1 One or more processes and / or boxes Figure 1 The function specified in one or more boxes.

[0068] These computer program instructions may also be loaded onto a computer or other programmable data processing equipment to cause a series of operational steps to be performed on the computer or other programmable equipment to produce a computer-implemented process, thereby providing instructions that execute on the computer or other programmable equipment for implementing the process. Figure 1 One or more processes and / or boxes Figure 1 The steps of the function specified in one or more boxes.

[0069] The embodiments of the present invention have been described above with reference to the accompanying drawings. However, the present invention is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of the present invention without departing from the spirit and scope of the claims. All of these forms are within the protection scope of the present invention.

[0070] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the present invention as claimed. The scope of protection of this invention is defined by the appended claims and their equivalents.

Claims

1. A method for improving the hole position accuracy of alignment holes in a multi-stage HDI board, characterized in that, include: Design an arrangement of N sets of alignment hole patterns, with each set including four alignment hole patterns distributed at the four corners of the HDI board. All alignment holes at each corner are arranged to minimize the space occupied on the plate; Provide core boards; A multi-layer sub-board is provided, wherein the multi-layer sub-board is sequentially stacked on both sides of the core board and formed into a mother board by a single pressing; The motherboard is drilled, electroplated, and pattern transferred sequentially, and the first set of alignment hole patterns is made according to the pre-designed arrangement of N sets of alignment hole patterns. Laser layers are superimposed on both sides of the mother board to obtain a 1+M+1 layer sub-board. The first set of alignment holes required for the first superposition is drilled on the 1+M+1 layer sub-board according to the first set of alignment hole pattern. The 1+M+1 layer sub-board is drilled, electroplated, and pattern transferred sequentially. The second set of alignment hole patterns is made according to the pre-designed arrangement of N sets of alignment hole patterns. Laser layers are superimposed on both sides of the 1+M+1 layer sub-board to obtain the 2+M+2 layer sub-board. The second set of alignment holes required for the second superposition is drilled on the 2+M+2 layer sub-board according to the second set of alignment hole pattern. Repeat N times to obtain N+M+N multi-stage HDI boards.

2. The method for improving the hole position accuracy of a multi-stage HDI board according to claim 1, characterized in that: The alignment hole pattern includes a circular target area, a middle annular area, and an outer annular area arranged sequentially from the inside to the outside.

3. The method for improving the hole position accuracy of a multi-stage HDI board according to claim 2, characterized in that: The diameter of the circular target area is 2.0 mm.

4. The method for improving the hole position accuracy of a multi-stage HDI board according to claim 3, characterized in that: The circular target area is made of copper.

5. The method for improving the hole position accuracy of a multi-stage HDI board according to claim 2, characterized in that: The diameter of the outer circular area is 4.0 mm.

6. The method for improving the hole position accuracy of a multi-stage HDI board according to claim 5, characterized in that: The outer ring area is made of copper.

7. The method for improving the hole position accuracy of a multi-stage HDI board according to claim 2, characterized in that: The middle annular area is a copper-free region.

8. The method for improving the hole position accuracy of a multi-stage HDI board according to claim 1, characterized in that: All the alignment hole patterns at each corner are arranged in a staggered array.

9. The method for improving the hole position accuracy of a multi-stage HDI board according to claim 1, characterized in that: The alignment holes at each corner are arranged in close proximity.

10. An HDI board, characterized in that, The HDI board is prepared by the method for improving the alignment hole position accuracy of a multi-stage HDI board as described in any one of claims 1-9.

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