System and method for cooling with combination of pressure differential cooling and pulsating heat pipe

Abstract

The present disclosure relates to a cooling system. The cooling system includes a housing and at least two fins. The housing surrounds one or more electronic devices. The at least two fins extend from an outer surface of the housing. Each of the at least two fins is configured to direct an airflow to create a high pressure region and a low pressure region. The housing includes a conduit assembly having a conduit inlet and a conduit outlet. The conduit inlet is configured to be positioned in the high pressure region and the conduit outlet is configured to be positioned in the low pressure region.

Description

Technical Field

[0001] This specification generally relates to devices for cooling structures, and more specifically, to devices for cooling structures that utilize pressure differences to increase airflow. Background Technology

[0002] Electric aircraft rely on motors to generate lift and / or thrust. They also use various other electronic devices (such as motors and inverters) to control aircraft functions and perform various tasks. One type of electric aircraft can be an electric vertical takeoff and landing vehicle (eVTOL). These electronic devices can be encapsulated together within a shell. These electronic devices can generate a significant amount of heat, requiring cooling to keep the electronics within their optimal operating temperature range. Traditional cooling systems may involve using the shell's surface and cooling fins to dissipate heat, as well as other types of cooling devices. Traditional cooling systems can result in poor heat dissipation around the surfaces of the electronic components' enclosures, potentially leading to reduced cooling effectiveness and electronic functionality. Summary of the Invention

[0003] In one embodiment, a cooling system is provided. The cooling system includes a housing and at least two fins. The housing surrounds one or more electronic devices. At least two fins extend from an outer surface of the housing. Each of the at least two fins is configured to direct airflow to generate a high-pressure zone and a low-pressure zone. The housing includes a duct assembly having a duct inlet and a duct outlet. The duct inlet is configured to be located in the high-pressure zone, and the duct outlet is configured to be located in the low-pressure zone.

[0004] In another embodiment, an electric motor assembly is provided. The electric motor assembly includes a motor housing, a motor within the motor housing, a casing, one or more electronic devices, and at least two fins. The casing has an outer surface and opposing inner surfaces, the inner surfaces defining an inner cavity within the casing. The one or more electronic devices are positioned within the inner cavity of the casing to be surrounded by the inner surfaces. At least two fins extend from the outer surface of the casing. Each pair of the at least two fins and the outer surface of the casing define an inner cavity within the fin. Each of the at least two fins is configured to guide airflow to generate a high-pressure zone and a low-pressure zone. The casing includes a duct assembly having a duct inlet and a duct outlet. The duct inlet is configured to be located in the high-pressure zone and the duct outlet is configured to be located in the low-pressure zone.

[0005] In yet another embodiment, an electric vertical takeoff and landing (EVTOL) vehicle is provided. The EVTOL vehicle includes an electric motor assembly. The electric motor assembly includes a motor housing, a motor within the motor housing, a casing, one or more electronic devices, and at least two fins. The casing has an outer surface and opposing inner surfaces, the inner surfaces defining an inner cavity within the casing. The one or more electronic devices are positioned within the inner cavity of the casing and surrounded by the inner surfaces. At least two fins extend from the outer surface of the casing. Each pair of the at least two fins and the outer surface of the casing define an inner cavity within the fin. Each of the at least two fins is configured to direct airflow to generate a high-pressure zone and a low-pressure zone. The casing includes a duct assembly having a duct inlet and a duct outlet. The duct inlet is configured to be located in the high-pressure zone and the duct outlet is configured to be located in the low-pressure zone.

[0006] These features and additional features provided by the embodiments described herein will be more fully understood in conjunction with the accompanying drawings and the following detailed description. Attached Figure Description

[0007] The embodiments illustrated in the accompanying drawings are illustrative and exemplary in nature and are not intended to limit the subject matter defined by the claims. The following detailed description of the illustrative embodiments will be understood when read in conjunction with the following drawings, wherein the same structures are indicated by the same reference numerals, wherein:

[0008] Figure 1 A front sectional view schematically depicting a system according to one or more embodiments shown and described herein, the system comprising a motor, a housing, a plurality of fins, and a propeller assembly;

[0009] Figure 2 A partial isolated view schematically depicting a pulsating heat pipe embedded within fins and coupled to the inner surface of a housing according to one or more embodiments shown and described herein;

[0010] Figure 3A schematic depiction Figure 2 A partial sectional view taken from line 3A-3A of an exemplary two-component cooling system according to one or more embodiments shown and described herein;

[0011] Figure 3B schematic depiction Figure 2 A cross-sectional view taken from line 3B-3B of an exemplary two-component cooling system according to one or more embodiments shown and described herein;

[0012] Figure 3C schematic depiction Figure 2Front view of an exemplary two-component cooling system according to one or more embodiments shown and described herein;

[0013] Figure 3D schematic depiction Figure 2 A top view of an exemplary two-component cooling system according to one or more embodiments shown and described herein;

[0014] Figure 3E schematic depiction Figure 3D A top sectional view taken from line 3E-3E of an exemplary two-component cooling system according to one or more embodiments shown and described herein;

[0015] Figure 4 schematic depiction Figure 2 A partial cross-sectional view taken from line 3A-3A of an exemplary two-component cooling system according to one or more embodiments shown and described herein, now illustrating the airflow path;

[0016] Figure 5 schematic depiction Figure 4 A partial cross-sectional view taken from line 5-5 of an exemplary two-component cooling system according to one or more embodiments shown and described herein, illustrating airflow conduction and conventional heat transfer; and

[0017] Figure 6 A schematic depiction of one or more embodiments shown and described herein. Figure 1 An example of an eVTOL two-component cooling system. Detailed Implementation

[0018] Embodiments of this disclosure relate to a cooling system for an electric vertical takeoff and landing vehicle (eVTOL). The eVTOL includes a motor and inverter package. The package may include a metal housing that can accommodate various electronic devices. One or more fins may be attached to the outer surface of the housing. The cooling system may use a two-part cooling structure, one part including a pulsating heat pipe (PHP) assembly partially embedded within the housing, and a second part including a series of pipe systems passing through the housing, the pipe systems using a pressure differential to increase airflow around the housing and fins to enhance heat transfer.

[0019] A duct inlet can be installed between two of a plurality of external fins mounted on the outer surface of the housing. The duct inlet allows airflow through an internal channel constructed within the housing. Airflow can exit the housing through a duct outlet. The duct inlet and outlet can be positioned such that the orientation of the plurality of fins surrounding the duct inlet and outlet creates a high-pressure zone near the duct inlet and a low-pressure zone near the duct outlet, which can increase airflow through the duct and through the channel. For example, the angle of attack of the plurality of fins can be positioned to create this pressure difference. This airflow helps transfer heat from electronic devices mounted inside the housing. In some embodiments, a PHP (Physical Cooling Device) can be embedded within the housing and fins. The PHP can contain alternating liquid slugs and vapor slugs, which can further enhance the cooling effect of the cooling system by increasing heat transfer from the electronic devices to the fins.

[0020] Conventional cooling systems may restrict heat diffusion and concentrate heat in the portions of the housing and fins closest to the heat source. This does not efficiently utilize the full area of ​​the housing and fins (because heat is not dissipated across the entire housing and fins), and less heat is removed from the heat source designed to be cooled by the housing and fins compared to this system. In a two-part cooling structure, one part includes a pulsating heat pipe (PHP) assembly at least partially embedded within the fins, and the second part includes a series of pipe systems passing through the housing. These pipe systems use pressure differentials to increase airflow around the housing and fins to enhance heat transfer, thereby more effectively transferring heat to the entire housing and fins. This allows for more efficient utilization of the total area of ​​the housing and fins and improved heat diffusion across the entire housing and fins compared to conventional cooling systems. Advantageously, the cooling system described herein utilizes a two-phase heat transfer mechanism to remove heat from at least one heat-generating device. The first heat transfer mechanism is configured to utilize the pulsating heat pipe to allow heat to move efficiently across the heat pipe through the housing. The second mechanism redirects the airflow into the cavity of the housing, thereby reducing the thermal resistance between the heat-generating device and the airflow to improve heat transfer.

[0021] Now for reference Figure 1This illustrates an example embodiment of system 100. System 100 includes a housing 110, a motor 101, one or more electronic devices 113, a propeller 102, a propeller shaft 103, and an exemplary two-part cooling system 126. One or more electronic devices 113 are disposed within a cavity 111 (i.e., a enclosure) within the housing. That is, one or more electronic devices 113 are surrounded or enclosed by the housing 110. A plurality of fins 120 extend from the outside of the housing 110. The propeller shaft 103 is coupled to the motor 101 and the propeller 102. The housing 110 may have a through-hole 117 to allow the propeller shaft 103 to extend from the motor 101 to the propeller 102. The propeller 102 can provide lift, thrust, or a combination of lift and thrust. Any number of fins from the plurality of fins 120 may be included. It should be understood that... Figure 1 The arrangement of the components of system 100 is for illustrative purposes, and other arrangements are also possible.

[0022] One or more electronic devices 113 located within the cavity 111 of the housing may be one or more different electronic devices 113. The included one or more electronic devices 113 may be inverter packages or circuits, gate drivers, and / or the like. Alternatively or additionally, one or more electronic devices 113 may also include capacitors, insulated-gate bipolar transistors, power MOSFETs, or any other electronic devices. One or more electronic devices 113 may be power device packages 134 (… Figure 3A It can contain various layers 135 ( Figure 3A Examples include, but are not limited to, thermal conductors, electrical insulating layers, and thermal interface layers. One or more electronic devices 113 can be heat sources for system 100, wherein the electronic devices generate heat during operation.

[0023] Now for reference Figure 2 and 3A -3E, the housing 110 surrounding one or more electronic devices 113 can be of various shapes, including but not limited to cylindrical, annular, rectangular prism, and / or similar shapes. The housing 110 can be made of various materials, including but not limited to aluminum, steel, plastic, etc. The housing 110 includes a wall 122, which includes: an outer surface 124a and an inner surface 124b opposite to the outer surface 124a; a pair of sidewall surfaces 124c, 124d; and a pair of terminating end surfaces 124e, 124f to define an internal cavity 111 within the housing. That is, in some embodiments, the wall 122 can be continuous. In other embodiments, multiple wall segments define the wall 122. In some embodiments, multiple housings 110 may be arranged together, wherein each housing 110 has at least one fin 120a of a plurality of fins 120 attached thereto.

[0024] In some embodiments, the housing 110 and its components may be formed using additive manufacturing techniques or processes, such as 3D printing. As used herein, the term "additive manufacturing technique or process" generally refers to a manufacturing process that stacks consecutive layers of material to "build" a three-dimensional component layer by layer. The consecutive layers of material are typically fused together to form a monolithic component, which may have multiple integrated sub-components. Although additive manufacturing techniques are described herein as enabling the fabrication of complex objects by building them point-by-point, layer-by-layer (typically in the vertical direction), other manufacturing methods are possible and within the scope of this subject matter. For example, although the discussion herein relates to forming consecutive layers by adding material, those skilled in the art will understand that the methods and structures disclosed herein can be practiced with any additive manufacturing technique or manufacturing technology. For example, embodiments of the invention may use layer-additive processes, layer-subtractive processes, or hybrid processes.

[0025] Suitable additive manufacturing techniques according to this disclosure include, for example, fused deposition modeling (FDM), selective laser sintering (SLS), 3D printing (e.g., by inkjet and laser jetting), stereolithography (SLA), direct selective laser sintering (DSLS), electron beam sintering (EBS), electron beam melting (EBM), laser engineered net-shape (LENS), laser net-shape manufacturing (LNSM), direct metal deposition (DMD), digital light processing (DLP), direct selective laser melting (DSLM), selective laser melting (SLM), direct metal laser melting (DMLM), and other known processes.

[0026] The additive manufacturing process described herein can be used to form parts using any suitable material. For example, the material can be plastic, metal, concrete, ceramic, polymer, epoxy resin, photopolymer resin, or any other suitable material, which can be solid, liquid, powder, sheet, wire, or any other suitable form. More specifically, according to exemplary embodiments of this subject matter, parts manufactured by the additive manufacturing process described herein can be formed, in part or in whole, from or in combination with the following materials, including but not limited to pure metals, nickel alloys, chromium alloys, titanium, titanium alloys, magnesium, magnesium alloys, aluminum, aluminum alloys, and nickel-based or cobalt-based superalloys (e.g., those superalloys available from Special Metals Corporation under the trade name Inconel®). These materials are examples of materials suitable for the additive manufacturing process described herein and may generally be referred to as “additive materials.”

[0027] Furthermore, those skilled in the art will understand that a variety of materials and methods for bonding these materials can be used and are all considered to be within the scope of this disclosure. As used herein, reference to “melting” can refer to any suitable process used to form an adhesive layer between any of the aforementioned materials. For example, if the object is made of a polymer, melting can refer to forming a thermosetting bond between polymeric materials. If the object is an epoxy resin, a bond can be formed by a crosslinking process. If the material is ceramic, a bond can be formed by a sintering process. If the material is a powder metal, a bond can be formed by a melting or sintering process. Those skilled in the art will understand that other methods of melting materials to manufacture parts by additive manufacturing are possible, and those methods can be used to practice the subject matter currently disclosed.

[0028] In other embodiments, the housing 110 may be formed by casting, machining, or any other suitable manufacturing technique.

[0029] In some embodiments, each fin 120a may be mounted to the housing 110, for example, extending from the outer surface 124a. Each fin 120a may be mounted to the housing 110 and may be mounted and positioned to extend between the terminating end surfaces 124e, 124f and the sidewall surfaces 124c, 124d, respectively. Thus, in some embodiments, each fin 120a may extend the length of the outer surface 124a of the housing 110 between the terminating end surfaces 124e, 124f. This is not limiting, and in other embodiments, each fin 120a may have a uniform length, or may be of any length and not necessarily equal to the lengths of the other fins 120a.

[0030] Each fin 120a can be mounted to the housing 110 by various methods, including but not limited to soldering, brazing, and welding. In other embodiments, each fin 120a and the housing 110 can be made from a single piece of material. That is, each fin 120a can be integrated with the housing 110 into a single integral structure. In some embodiments, each fin 120a and the housing 110 can be formed by additive manufacturing techniques or processes, such as 3D printing. In other embodiments, each fin 120a and / or housing 110 can be formed by casting, machining, or any other suitable manufacturing technique.

[0031] Each fin 120a can be of various shapes, including but not limited to cylindrical, rectangular prism, rectangular, square, and / or similar shapes. Furthermore, each fin 120a can be planar, or can extend at multiple angles or directions relative to a Cartesian coordinate system and the outer surface 124a (e.g., the shape can be adjusted). Each of the plurality of fins 120a is configured to generate a pressure difference from one side to the other, as discussed in more detail herein.

[0032] Still referencing Figure 2 , 3A -3E and 5, an exemplary two-component cooling system 126 includes a pulsating heat pipe assembly 130 and a conduit assembly 132. The pulsating heat pipe assembly 130 may include at least one pulsating heat pipe 136 fluidly coupled to an inner surface 124b of a housing 110, and may be embedded within a housing cavity 111 and / or within the thickness of the housing 110 between the inner surface 124b and the outer surface 124a. In other embodiments, at least one pulsating heat pipe 136 may be at least partially embedded within a finned cavity 138 defined by an inner surface 140a of a pair of adjacent fins 120a of a plurality of fins 120 and an outer surface 124a of the housing 110. Each fin 120a further includes an opposing outer surface 140b. In other embodiments, at least a portion of at least one pulsating heat pipe 136 may be located within and / or fluidly coupled to the finned cavity 138.

[0033] At least a portion of at least one pulsating heat pipe 136 may also be located within and / or fluidly coupled to the inner surface 124b of the housing 110, and different portions may also, or alternatively, be located within and / or fluidly coupled to the finned cavity 138 by various methods, including but not limited to soldering or thermal paste. It should be understood that thermal paste may allow for more efficient heat transfer between at least one pulsating heat pipe 136 and the inner surface 124b of the housing 110 and / or the finned cavity 138. In other embodiments, at least one pulsating heat pipe 136 may be fluidly coupled to the inner surface 124b of the housing 110 and / or fluidly coupled to the finned cavity 138 via snap-fit ​​and / or via fasteners (such as, but not limited to, screws, rivets, nuts and bolts, welding, adhesives, etc.).

[0034] The pulsating heat pipe assembly 130 may be configured in a closed loop and may further include an evaporator section 142, which may be positioned adjacent to or within one or more electronic devices 113 in an inner cavity 111 defined by an inner surface 124b. As a non-limiting example, R404A may be used as the refrigerant passing through the pulsating heat pipe assembly 130. When one or more electronic devices 113 generate heat during operation, this heat is transferred to the evaporator section 142 of the pulsating heat pipe assembly 130. The condenser section 144 of the pulsating heat pipe assembly 130 may be positioned away from one or more electronic devices 113, and in some embodiments, within the airflow of the propeller 102 (not shown). The refrigerant may travel between the evaporator section 142 and the condenser section 144, thereby converting between a gaseous and a liquid phase. Such conversion may absorb and release heat, thereby absorbing heat from one or more electronic devices 113 and releasing vapor from the housing 110. This arrangement offers the following advantages: higher heat transfer capacity, high heat flux diffusion, ability to withstand the gravitational acceleration experienced by the aircraft, performance unaffected by orientation, and simple structure.

[0035] exist Figures 3A-3E In the illustrated embodiment, the pulsating heat pipe assembly 130 is embedded within two adjacent or adjacent housings 110 and is configured to absorb heat from one or more electronic devices 113 and release vapor from the housings 110 and the pipe assembly 132, as discussed in more detail herein. It should be understood that the pulsating heat pipe assembly 130 can be embedded within any suitable number of housings 110, cavities 111, and / or the like. In other embodiments, the system 100 may include a plurality of pulsating heat pipe assemblies 130. Each of the plurality of pulsating heat pipe assemblies 130 may be embedded in a corresponding housing such that the number of pulsating heat pipe assemblies 130 is equal to the number of housings 110 in the system 100.

[0036] In other embodiments, multiple pulsating heat pipe assemblies 130 may be present, each of which may be embedded within a housing 110. As a non-limiting example, there may be six pulsating heat pipe assemblies 130 and twelve housings 110, or five pulsating heat pipe assemblies 130 and fifteen housings 110.

[0037] In other embodiments, there may be a plurality of condenser segments 144 embedded in the housing 110, fins 120a and / or the like, and a plurality of evaporator segments 142 connected to the inner surface 124b of the housing 110.

[0038] Now for reference Figure 5The pulsating heat pipe assembly 130 may include alternating liquid slugs 170a and vapor slugs 170b, which can further enhance the cooling effect of the two-part cooling system 126 by increasing heat transfer from one or more electronic devices 113 to the plurality of fins 120 via the pipe assembly 132, as discussed in more detail herein.

[0039] It should be understood that the pulsating heat pipe assembly 130 is configured to efficiently transfer heat input from one or more electronic devices 113 to the pipe assembly 132, as discussed in more detail herein.

[0040] Still referencing Figure 2 and 3A -3E, and now referencing Figure 4 The duct assembly 132 includes a fluid conduit 145 having a duct inlet 146 extending from the outer surface 124a of the wall 122 within a finned cavity 138, and fluidly connected via the fluid conduit 145 to a duct outlet 152 located within another or different finned cavities 138. The duct inlet 146 fluidly connects the housing cavity 111 and the finned cavity 138 such that airflow entering the finned cavity 138 can be guided by the duct inlet 146 and directed to the housing cavity 111. Figure 4 As best depicted, the pipe inlet 146 is located on the high-pressure side of the fin 120a. In some embodiments, the housing cavity 111 includes a plurality of thermally enhanced structures (such as a plurality of ribs 150) to assist in removing heat generated by one or more electronic devices 113. In other embodiments, the housing cavity 111 includes a plurality of recesses to assist in removing heat generated by one or more electronic devices 113. The plurality of ribs 150 may be metal foam or other porous metal shapes configured to assist in removing heat generated by one or more electronic devices 113.

[0041] The sidewall surface 124c of the housing 110 includes a plurality of elongated slots 148 or gaps to fluidly connect the inner cavity 111 of the housing to the outer side of the housing 110. At least a portion of the plurality of elongated slots 148 may be positioned vertically below or below the duct inlet 146. Furthermore, the plurality of elongated slots 148 may be positioned such that the airflow exiting the plurality of elongated slots 148 is orthogonal to the airflow entering the duct inlet 146, such as... Figure 4 The best example is illustrated in the text.

[0042] The duct outlet 152 fluidly connects the inner cavity 111 of the housing and the inner cavity 138 of the fin, so that airflow from the inner cavity 111 of the housing can be guided into the inner cavity 138 of the fin through the duct outlet 152. Figure 4As best depicted, the pipe outlet 152 is located on the low-pressure side of the fin 120a. Thus, the airflow between the pipe inlet 146 and the pipe outlet 152 can depend on the pressure difference between the pipe inlet 146 and the pipe outlet 152. That is, in the described embodiment, the pipe inlet 146 and the pipe outlet 152 can be located at opposite ends or along the length of the fin cavity 138, and can be located in different or independent fin cavities 138.

[0043] In addition, such as Figure 4 As depicted, a plurality of channels 153 may be positioned to extend within or fluidly connect to each other within the housing cavity 111 or the housing cavity 111 or the housing cavity 113. Each of the plurality of channels 153 may be configured to transfer heat generated by one or more electronic devices 113. Furthermore, in some embodiments, each of the plurality of channels 153 may allow airflow to enter and / or change pressure to guide airflow as needed. For example, the plurality of channels 153 may be strategically positioned to have openings at specific points leading to the outside of the housing cavity 111 to change the pressure at those openings, thereby facilitating and / or causing airflow to be guided, for example, through a plurality of elongated slots 148 out of the housing cavity 111.

[0044] Each of the plurality of channels 153 can have a variety of cross-sectional shapes, including but not limited to rectangular, circular, or any other cross-sectional shape. Furthermore, in some embodiments, each of the plurality of channels 153 can be formed using 3D printing technology. In other embodiments, each of the plurality of channels 153 can be formed by casting, machining, or any other suitable manufacturing technology.

[0045] In this way, the pressure difference can be controlled by design. That is, the pressure difference can be adjusted to the desired airflow rate by changing the angle and / or shape of at least one of the plurality of fins 120a relative to the outer surface 124a, and / or the placement of the duct inlet 146 and / or the duct outlet 152 along the length of the fin 120a. In addition, the pressure difference can be controlled by adding a plurality of channels 153 at specific locations within the housing 110.

[0046] Now for reference Figure 4 and Figure 5During operation, the exemplary two-component cooling system 126 removes heat from one or more electronic devices 113 (such as power device packages 134) via a directional airflow 160 and a pulsating heat pipe assembly 130. The directional airflow 160 comprises two types of airflow: a finned airflow, as indicated by arrow 162, and a ducted airflow, as indicated by arrow 164. A plurality of fins 120 guide the finned airflow 162 between the plurality of fins 120 along the length of the fin cavity 138 of each of the plurality of fins 120a from one terminating end surface 124e to another terminating end surface 124f.

[0047] Thus, the finned airflow 162 is subjected to pressure defined or caused by the plurality of fins 120 and guided along the length of the housing 110. A ducted airflow 164 may be a portion of the finned airflow 162, which is guided from the finned cavity 138 to the duct inlet 146 within the finned cavity 138 via the pressure difference between the inner cavity 111 and the outer surface 124a of the housing 110. As depicted, the ducted airflow 164 enters through the duct inlet 146 and enters the inner cavity 111 to flow through or through multiple channels 153 as it passes through or flows over the plurality of ribs 150 located within the inner cavity 111, absorbing heat and / or agitating heat generated by one or more electronic devices 113. The generated heat is... Figure 4 Arrow 166 in the image represents...

[0048] The ducted airflow 164 exits the inner cavity 111 of the housing via a plurality of elongated slots 148 fluidly connected to a plurality of channels 153 and an adjacent inner cavity 111, such that the ducted airflow 164 travels through the cavity and the plurality of channels 153 to exit the housing 110 as a heated airflow (as indicated by arrow 168) at the duct outlet 152. The heated airflow 168 is propelled away from the housing 110 via the finned airflow 162. It should be understood that the arrangement of the duct inlet 146 on the high-pressure side of the fin 120a, the plurality of channels 153, and the duct outlet 152 located on the low-pressure side of the fin 120a allows the ducted airflow 164 to travel through the housing 110 to remove heat 166 generated by one or more electronic devices 113 from the housing 110.

[0049] Now for reference Figure 6 System 100 is shown as being on eVTOL 172. Multiple motors 101 connected to multiple propellers 102 via multiple propeller shafts 103 can be used. eVTOL 172 can perform vertical takeoff and landing using lift from the multiple propellers 102. The multiple propellers 102 can also provide thrust to allow eVTOL 172 to move forward. Airflow from the propellers 102 can also be directed towards multiple fins 120 of system 100 (…). Figure 1 The airflow is provided. In an alternative embodiment, the airflow from propeller 102 can also provide airflow to the fin cavity 138, which is then directed to the duct assembly 132. Figure 4 The airflow allows the condenser section 144 to condense the refrigerant inside each pulsating heat pipe assembly 130, thereby cooling the electronic device 113.

[0050] System 100 can enhance the cooling of electronics 113 in an electric aircraft (including eVTOL 172). System 100 may include an exemplary two-part cooling system 126. Multiple fins 120 can also be selected by the user. Figure 4 The required number, angle and / or shape of each of the multiple fins 120 () Figure 4 The exemplary two-part cooling system 126 is arranged in a manner that combines fins, and / or similar elements to achieve the desired cooling capacity of the exemplary two-part cooling system 126. Each of the plurality of fins 120 may be positioned within the airflow of the plurality of propellers 102 such that the airflow can pass through the duct assembly 132 ( Figure 4 Further cooling is provided to the condenser section 144 embedded within the housing. The pulsating heat pipe assembly 130 can be mounted on multiple fins 120 ( Figure 4 Each fin 120a in ) Figure 4 More efficient heat transfer is achieved across the entire fin of the device. This more efficient heat transfer can remove more heat from the electronic device 113, which can enable the electronic device 113 to operate more efficiently.

[0051] The exemplary two-component cooling system described above provides a housing comprising a plurality of fins extending therefrom, and a plurality of heat transfer enhancement structures, such as channels, located within cavities of the housing. Each of the plurality of fins is configured to induce a pressure difference from one side of the fin to the other. A channel inlet is located on the high-pressure side of one of the plurality of fins, and a channel outlet is located on the low-pressure side of one of the plurality of fins to allow and direct airflow through the cavities of the housing to expel heat from the cavities. Furthermore, an integrated PHP structure is located within the housing, the integrated PHP structure being configured to transfer heat from the power unit to the plurality of fins.

[0052] While specific embodiments have been illustrated and described herein, it should be understood that various other changes and modifications may be made without departing from the spirit and scope of the claimed subject matter. Furthermore, although various aspects of the claimed subject matter have been described herein, these aspects need not be used in combination. Therefore, the appended claims are intended to cover all such changes and modifications within the scope of the claimed subject matter.

Claims

1. A cooling system, comprising: The casing that surrounds one or more electronic devices; as well as At least two fins extending from the outer surface of the housing, each of the at least two fins being configured to guide airflow to generate high-pressure and low-pressure zones. The housing includes a pipe assembly having a pipe inlet and a pipe outlet, the pipe inlet being configured to be located in the high-pressure area and the pipe outlet being configured to be located in the low-pressure area.

2. The cooling system according to claim 1, wherein, The outer casing further includes: An inner cavity is defined by the inner surface of the housing, and multiple thermally enhanced structures extend from the inner surface of the housing.

3. The cooling system according to claim 2, wherein, At least a portion of the one or more electronic devices is in contact with at least a portion of the inner surface of the housing.

4. The cooling system according to claim 2, wherein, The outer casing further includes: Multiple long, narrow slots used to guide airflow. The plurality of elongated slots are positioned to extend through the inner surface and the opposite outer surface of the housing to fluidly connect the inner cavity and the pipe outlet.

5. The cooling system according to claim 4, wherein, Each pair of the at least two fins and the outer surface of the shell define an inner cavity within the fin, with the pipe inlet and the pipe outlet located in different inner fin cavities.

6. The cooling system according to claim 5, further comprising: At least one pulsating heat pipe, at least a portion of which is located within the cavity inside the housing.

7. The cooling system according to claim 6, wherein, Each of the at least one pulsating heat pipe is configured in a closed loop.

8. The cooling system according to claim 7, wherein, The inner cavity of the outer shell is an evaporator for the at least one pulsating heat pipe, and the inner cavity of the fins is a condenser for the at least one pulsating heat pipe.

9. An electric motor assembly, comprising: Motor housing; The motor is located inside the motor housing; A housing having an outer surface and an opposing inner surface, the inner surface defining an internal cavity within the housing; One or more electronic devices, the one or more electronic devices being positioned within the cavity of the housing to be surrounded by the inner surface; At least two fins extending from the outer surface of the housing, wherein each pair of the at least two fins and the outer surface of the housing define an internal cavity within the fin, each of the at least two fins being configured to guide airflow to generate high-pressure and low-pressure zones. The housing includes a pipe assembly having a pipe inlet and a pipe outlet, the pipe inlet being configured to be located in the high-pressure area and the pipe outlet being configured to be located in the low-pressure area.

10. The electric motor assembly according to claim 9, wherein, The inner cavity of the outer shell contains a plurality of thermally enhanced structures extending from the inner surface.

11. The electric motor assembly according to claim 10, wherein, The outer casing further includes: Multiple long, narrow slots used to guide airflow. The plurality of elongated slots are positioned to extend through the inner and outer surfaces to fluidly connect the housing cavity and the pipe outlet.

12. The electric motor assembly according to claim 11, wherein, The pipe inlet and the pipe outlet are located in different fin cavities.

13. The electric motor assembly of claim 12, further comprising: At least one pulsating heat pipe, at least a portion of which is located within the cavity inside the housing.

14. The electric motor assembly according to claim 13, wherein, Each of the at least one pulsating heat pipe is configured in a closed loop.

15. The electric motor assembly according to claim 14, wherein, The inner cavity of the outer shell is an evaporator for the at least one pulsating heat pipe, and the inner cavity of the fins is a condenser for the at least one pulsating heat pipe.

16. The electric motor assembly according to claim 9, wherein, At least a portion of the one or more electronic devices is in contact with at least a portion of the inner surface.

17. An electric vertical take-off and landing vehicle, comprising: Electric motor assembly, including: Motor housing; The motor is located inside the motor housing; A housing having an outer surface and an opposing inner surface, the inner surface defining an internal cavity within the housing; One or more electronic devices, the one or more electronic devices being positioned within the cavity of the housing to be surrounded by the inner surface; At least two fins extending from the outer surface of the housing, wherein each pair of the at least two fins and the outer surface of the housing define an internal cavity within the fin, each of the at least two fins being configured to guide airflow to generate high-pressure and low-pressure zones. The housing includes a pipe assembly having a pipe inlet and a pipe outlet, the pipe inlet being configured to be located in the high-pressure area and the pipe outlet being configured to be located in the low-pressure area.

18. The electric vertical take-off and landing vehicle according to claim 17, wherein, The housing cavity includes a plurality of thermally enhanced structures extending from the inner surface and a plurality of elongated slots for guiding airflow, the plurality of elongated slots being positioned to extend through the inner and outer surfaces to fluidly connect the housing cavity and the duct outlet.

19. The electric vertical take-off and landing vehicle according to claim 18, wherein, The pipe inlet and the pipe outlet are located in different fin cavities.

20. The electric vertical take-off and landing vehicle according to claim 19, further comprising: At least one pulsating heat pipe, at least a portion of which is located within the cavity inside the housing, and each of the at least one pulsating heat pipes is configured in a closed loop.

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