Method for improving environmental reliability of display module

Abstract

The invention relates to the technical field of display module manufacturing, and discloses a display module environment reliability improving method, which comprises the following steps of: detecting an external environment temperature in real time through a sensor, and transmitting detection data to a whole machine processor; the whole machine processor carries out calculation and analysis according to a preset display module working temperature threshold value and outputs a control instruction; and the heating and heat dissipation system responds to the instruction, independently starts the backboard heating and heat dissipation layer, independently starts the transparent ITO heating circuit layer, or cooperatively starts the two heating and heat dissipation layers to execute heating or heat dissipation actions, so that the overall working temperature of the module is maintained in a stable interval. According to the display module, the heating and heat dissipation layers are arranged on the back plate and the cover plate of the display module, and heating and heat dissipation protection is provided in an extreme module application scene, so that the overall working environment of the module is relatively stable.

Description

Technical Field

[0001] This invention relates to the field of display module manufacturing technology, specifically a method for improving the environmental reliability of display modules. Background Technology

[0002] There are two main types of display modules on the market: TFT LCD modules and OLED display modules. These two types of products are commonly used in the consumer electronics market, but also have applications in specialized scenarios such as industrial control. Consumer electronics applications require operating temperatures of -20°C to 70°C, and general display panels are designed to these specifications. However, industrial control applications require -30°C to 80°C, and other specialized applications require -40°C to 85°C. Consumer-grade display modules cannot function properly in these environments. A common industry approach is to improve panel performance, such as by using wide-temperature LCDs. However, these types of panels have fewer applications, smaller production volumes, and higher prices. Summary of the Invention

[0003] To address the shortcomings of existing technologies, this invention provides a method for improving the environmental reliability of display modules, solving the problem of xxxx.

[0004] To achieve the above objectives, the present invention provides the following technical solution:

[0005] A method for improving the environmental reliability of a display module includes the following steps:

[0006] Pre-fabricated heat dissipation layer: The back panel heat dissipation layer includes a thermally conductive layer, a heat-generating circuit layer, and an adhesive layer, which are stacked in sequence to form a composite structure of "thermally conductive layer + heat-generating circuit layer + adhesive layer"; The cover plate heat dissipation layer includes a transparent ITO heat-generating circuit layer, which is arranged between the cover plate and the display panel.

[0007] Heat dissipation layer assembly: The prefabricated backplate heat dissipation layer is fixed to the corresponding position on the backplate of the display module by adhesive layer;

[0008] Power supply connection: Connect the power supply board interface of the heat dissipation layer on the back panel and the power supply board interface of the transparent ITO heat dissipation layer on the cover to the power interface reserved on the display module respectively.

[0009] System coordinated control: The external ambient temperature is detected in real time by sensors and the detected data is transmitted to the whole machine processor; the whole machine processor calculates and analyzes according to the preset display module operating temperature threshold and outputs control commands; the heat dissipation system responds to the commands, individually activating the back panel heat dissipation layer, individually activating the transparent ITO heat dissipation circuit layer, or jointly activating the two heat dissipation layers to perform heat dissipation or heat dissipation actions, so that the overall operating temperature of the module is maintained within a stable range.

[0010] Preferably, the transparent ITO heating circuit layer is arranged on one side of the cover plate using the ITO fabrication process, with the transparent ITO heating circuit layer facing the display panel side, thus completing the assembly and alignment of the cover plate and the display module.

[0011] Preferably, the preset operating temperature threshold for the display module is -20℃ to 70℃.

[0012] Preferably, the sensor for detecting the external ambient temperature is arranged in one corner of the back panel and is connected to the external environment.

[0013] Preferably, the thermally conductive layer is a single layer of aluminum foil or a single layer of copper foil.

[0014] The present invention has the following beneficial effects:

[0015] This method for improving the environmental reliability of display modules provides heating and heat dissipation protection in extreme module application scenarios by setting heat dissipation layers on the back panel and cover of the display module, ensuring that the actual operating temperature of the module is between -20° and 70°. At the same time, the entire heat dissipation system performs heating or cooling based on the external environmental conditions detected by the sensors and the calculation results of the whole machine processor, enabling the entire display module to efficiently adapt to the operating environment. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the layout of the display module and heat dissipation system of the present invention;

[0017] Figure 2 This is a schematic diagram of the backplate heat dissipation layer structure of the present invention.

[0018] In the diagram: 1. Display module; 2. Backplate; 3. Backplate heat dissipation layer; 31. Thermal conductive layer; 32. Heat-generating circuit layer; 33. Adhesive layer; 4. Cover plate; 5. Transparent ITO heat-generating circuit layer. Detailed Implementation

[0019] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0020] A method for improving the environmental reliability of a display module includes the following steps:

[0021] Heat dissipation layer prefabrication: The back panel heat dissipation layer 3 includes a thermally conductive layer 31, a heat-generating circuit layer 32, and an adhesive layer 33, which are stacked in sequence to form a composite structure of "thermally conductive layer 31 + heat-generating circuit layer 32 + adhesive layer 33"; the cover plate 4 heat dissipation layer includes a transparent ITO heat-generating circuit layer 5, which is arranged between the cover plate 4 and the display panel.

[0022] Heat dissipation layer assembly: The prefabricated backplate heat dissipation layer 3 is attached and fixed to the corresponding position of the backplate 2 of the display module 1 using adhesive layer 33;

[0023] Power supply connection: Connect the power supply board interface of the heat dissipation layer 3 on the back panel and the power supply board interface of the transparent ITO heat dissipation layer 5 on the cover plate 4 to the reserved power interface on the display module 1 respectively; the connection method can be soldering or other reliable electrical connection methods.

[0024] System coordinated control: The external ambient temperature is detected in real time by the sensor and the detected data is transmitted to the whole machine processor; the whole machine processor calculates and analyzes according to the preset operating temperature threshold of display module 1 and outputs control commands; the heat dissipation system responds to the commands, individually activating the back panel heat dissipation layer 3, individually activating the transparent ITO heat dissipation circuit layer 5, or jointly activating the two heat dissipation layers to perform heat dissipation or heat dissipation actions, so that the overall operating temperature of the module is maintained within a stable range.

[0025] like Figure 1 and 2 As shown, in this technical solution, by setting a heat dissipation layer on the back plate 2 and cover plate 4 of the display module 1, heat dissipation protection is provided in extreme module application scenarios to ensure that the actual working temperature of the module is between -20° and 70°. At the same time, the entire heat dissipation system performs heat generation or heat dissipation according to the external environment conditions detected by the sensors and the calculation results of the whole machine processor, so that the entire display module 1 can efficiently adapt to the operating environment.

[0026] In practical applications, the backplate heat dissipation layer 3 is attached to the backplate 2 of the display module 1, and the transparent ITO heat dissipation circuit layer 5 is set on the cover plate 4 (usually protective glass) of the display module 1. Then, the power supply circuit board interface of the backplate 2 and the power supply circuit board interface of the transparent ITO heat dissipation circuit layer 5 are connected to the reserved power interface on the display module 1 (by soldering or other means). This allows the entire heat dissipation system to perform heat dissipation or heat dissipation based on the external environment detected by the sensor and the calculation results of the whole machine processor, so that the overall working environment of the display module 1 is relatively stable.

[0027] In this embodiment, the transparent ITO heating circuit layer 5 is arranged on one side of the cover plate 4 through the ITO fabrication process, with the transparent ITO heating circuit layer 5 facing the display panel side, thus completing the assembly and alignment of the cover plate 4 and the display module 1.

[0028] In this embodiment, the preset operating temperature threshold for the display module 1 is -20℃ to 70℃.

[0029] In this embodiment, the sensor for detecting the external ambient temperature is arranged in one corner of the back panel 2 and is connected to the external environment.

[0030] In this embodiment, the heat-conducting layer 31 is a single layer of aluminum foil or a single layer of copper foil.

[0031] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, the phrase "comprising an element defined as..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0032] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A method for improving the environmental reliability of a display module, characterized in that, Includes the following steps: Pre-fabricated heat dissipation layer: The back panel heat dissipation layer includes a thermally conductive layer, a heat-generating circuit layer, and an adhesive layer, which are stacked in sequence to form a composite structure of "thermally conductive layer + heat-generating circuit layer + adhesive layer"; The cover plate heat dissipation layer includes a transparent ITO heat-generating circuit layer, which is arranged between the cover plate and the display panel. Heat dissipation layer assembly: The prefabricated backplate heat dissipation layer is fixed to the corresponding position on the backplate of the display module by adhesive layer; Power supply connection: Connect the power supply board interface of the heat dissipation layer on the back panel and the power supply board interface of the transparent ITO heat dissipation layer on the cover to the power interface reserved on the display module respectively. System collaborative control: The external ambient temperature is detected in real time through sensors, and the detected data is transmitted to the main processor. The processor calculates and analyzes the preset operating temperature threshold of the display module and outputs control commands. The heat dissipation system responds to the commands by activating the back panel heat dissipation layer, the transparent ITO heat dissipation circuit layer, or both heat dissipation layers in tandem to perform heat generation or heat dissipation actions, so that the overall operating temperature of the module is maintained within a stable range.

2. The method for improving the environmental reliability of a display module according to claim 1, characterized in that: The transparent ITO heating circuit layer is arranged on one side of the cover plate using the ITO fabrication process, with the transparent ITO heating circuit layer facing the display panel side, thus completing the assembly and alignment of the cover plate and the display module.

3. The method for improving the environmental reliability of a display module according to claim 1, characterized in that: The preset operating temperature threshold for the display module is -20℃ to 70℃.

4. The method for improving the environmental reliability of a display module according to claim 1, characterized in that: The sensor for detecting the external ambient temperature is located in one corner of the back panel and is connected to the external environment.

5. The method for improving the environmental reliability of a display module according to claim 1, characterized in that: The heat-conducting layer is made of a single layer of aluminum foil or a single layer of copper foil.

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