Display screen lamp panel cutting method, storage medium and lamp panel cutting equipment

Abstract

The invention relates to a display screen lamp panel cutting method, a storage medium and lamp panel cutting equipment, and belongs to the technical field of LED display equipment manufacturing processes. The display screen lamp panel cutting method comprises the steps that a lamp panel of a display screen and plane images of wafers arrayed on the lamp panel are obtained; based on the plane image, wafers which are close to the to-be-spliced edge of the lamp panel and are arranged at intervals in the extension direction of the splicing line are selected as reference wafers; calculating the center point coordinate of the reference wafer; determining the position of a target cutting line of the lamp panel according to the center point coordinate of the reference wafer and the dot spacing of the wafers in the lamp panel, and enabling the distance from the center point of the reference wafer to the target cutting line to meet a preset spacing requirement; and controlling numerical control cutting equipment to cut the edge of the lamp panel along the target cutting line. Therefore, the positions of the edge wafers after cutting are kept consistent with the distances between the inner wafers, so that the dot distance precision after a plurality of lamp panels are spliced is consistent, and the display effect of a large-size LED display screen is remarkably improved.

Description

Technical Field

[0001] This invention relates to the field of LED display equipment manufacturing technology, and in particular to a method for cutting LED display lamp panels, a storage medium, and a lamp panel cutting device. Background Technology

[0002] In the field of LED display technology, large-size displays are typically composed of multiple LED panels spliced ​​together. To ensure the overall display effect, the pixel pitch at the splicing points of each panel needs to be consistent with the pixel pitch within the panel itself.

[0003] Conventional LED display panel cutting processes are typically controlled according to the panel's external dimensions, using marker points for positioning and identification to determine the cutting path. However, in COB packaging technology, the chips are directly mounted on the substrate surface, resulting in high pixel density and compact arrangement. During manufacturing, slight offsets in chip placement may occur. Furthermore, thermal expansion and contraction during panel processing and soldering can cause unpredictable deviations in the chip's actual position relative to the panel's edge.

[0004] Traditional cutting methods fail to reflect the true arrangement of the chips and cannot guarantee that the edge chip positions after cutting meet the splicing requirements. This makes it difficult to fully guarantee the continuity and consistency of the spliced ​​image. To correct these deviations, additional compensation movements or local corrections are usually required during the manufacturing process, leading to longer production cycles, increased labor costs, and difficulty in achieving stable and consistent splicing results in mass production. Summary of the Invention

[0005] The purpose of this invention is to solve the problem of inconsistent chip spacing after splicing the lamp board after cutting using existing processes.

[0006] To address the aforementioned technical problems, this application provides a method for cutting a display screen light panel, comprising: Acquire a planar image of the display's lamp panel and the chips arrayed on the lamp panel; Based on the planar image, select the wafers that are close to the edge of the light panel to be spliced ​​and are spaced apart along the splicing line extension direction as reference wafers; Calculate the coordinates of the center point of the reference wafer; Based on the center point coordinates of the reference wafer and the point spacing of the wafers inside the lamp board, the target cutting line position of the lamp board is determined so that the distance from the center point of the reference wafer to the target cutting line meets the preset spacing requirements. The CNC cutting equipment is controlled to cut the edge of the lamp panel along the target cutting line.

[0007] In some embodiments of this application, at least two wafers near the edge of the light panel to be spliced ​​are selected as the reference wafers.

[0008] In some embodiments of this application, determining the target cutting line position of the lamp board based on the center point coordinates of the reference wafer and the pixel pitch of the wafers inside the lamp board, so that the distance from the center point of the reference wafer to the cutting line meets the preset spacing requirement includes: Connect the center point coordinates of the two reference wafers to obtain the baseline; Obtain the center-to-center distance D between adjacent chips inside the lamp board; The distance between the target cutting line and the baseline is set to L; The coordinate position of the target cutting line is determined by controlling L=D / 2.

[0009] In some embodiments of this application, the two reference wafers are located at the beginning and end of a wafer sequence along the splicing line extension direction, respectively.

[0010] In some embodiments of this application, controlling the CNC cutting equipment to cut the edge of the lamp panel along the target cutting line includes: The actual position of the cut lamp panel edge is obtained in real time using a visual positioning device; Calculate the distance deviation between the actual edge position and the target cutting line; Based on the calculated distance deviation, the cutting path of the CNC cutting equipment is dynamically adjusted to correct the cutting position.

[0011] In some embodiments of this application, the distance deviation between the actual edge position and the target cutting line is controlled to be ≤0.05.

[0012] In some embodiments of this application, after the step of controlling the CNC cutting equipment to cut the edge of the lamp panel along the target cutting line, the method further includes: The cut light panels are then assembled according to the preset positions. Detect the center-to-center distance between the chips on both sides of the splicing line of adjacent light panels; Determine whether the center-to-center spacing of the chips on both sides of the splicing line of adjacent light panels is consistent with the center-to-center spacing of the chips inside the light panel; When the center point spacing deviation exceeds the preset allowable range, the cutting parameters of the CNC cutting equipment are readjusted and the corresponding edge is recut.

[0013] In some embodiments of this application, calculating the center point coordinates of the reference wafer includes: Based on the acquired planar image, the contour of the reference wafer is extracted using a grayscale threshold segmentation method; Calculate the center coordinates of the extracted reference wafer profile.

[0014] This application also provides a storage medium storing a computer program thereon, the computer program being used to execute the display screen light panel cutting method described above.

[0015] This application also discloses a light panel cutting device, which includes a processor and a memory, wherein the memory stores a computer program; the processor executes the computer program to implement the display screen light panel cutting method described above.

[0016] As can be seen from the above technical solution, the beneficial effects of the present invention are as follows: This application provides a method for cutting LED display panels, a storage medium, and a panel cutting device. By acquiring a planar image of the panel and the chip array, a chip near the edge to be spliced ​​is selected as a reference, and its center point coordinates are calculated. Then, combined with the pixel pitch of the chips inside the panel, the target cutting line position is precisely determined, ensuring that the position of the edge chip after cutting remains consistent with the pixel pitch of the internal chips. This effectively avoids problems in traditional cutting processes, such as uneven pixel pitch at the splicing point, visual discontinuity at the splicing seam, and impact on the continuity of the display image caused by chip mounting misalignment, thermal expansion and contraction of the panel, or frame deviation. It achieves high pixel pitch accuracy and good consistency after splicing multiple panels, significantly improving the display effect of large-size LED displays. Simultaneously, it reduces post-processing steps, shortens the production cycle, lowers labor costs, and improves the stability and efficiency of mass production. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the cut structure of the LED panel for the display screen.

[0018] Figure 2 for Figure 1 A magnified schematic diagram of the central display screen.

[0019] Figure 3 This is a schematic diagram of the process for cutting the LED panel of a display screen.

[0020] Figure 4 A flowchart illustrating the process of calculating the center point coordinates of the reference wafer in step S300.

[0021] Figure 5 This is a flowchart illustrating step S400, which determines the target cutting line position of the lamp board based on the center point coordinates of the reference wafer and the point spacing of the wafers inside the lamp board, so that the distance from the center point of the reference wafer to the target cutting line meets the preset spacing requirements.

[0022] Figure 6 This is a schematic diagram of the process in step S500 whereby the CNC cutting equipment is controlled to cut the edge of the lamp panel along the target cutting line.

[0023] Figure 7 This is a schematic diagram illustrating the specific process for verifying the splicing of the cut display screen.

[0024] The annotations in the attached figures are explained as follows: 10. Display screen; 11. Light board; 12. Chip; 121. Reference chip; 13. Target cutting line; 14. Reference line. Detailed Implementation

[0025] Typical embodiments embodying the features and advantages of the present invention will be described in detail in the following description. It should be understood that the present invention can have various variations in different embodiments without departing from the scope of the present invention, and the descriptions and illustrations herein are for illustrative purposes only and not intended to limit the present invention.

[0026] In the description of this application, it should be understood that, in the embodiments shown in the accompanying drawings, the indications of direction or positional relationships (such as up, down, left, right, front, and back, etc.) are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the mechanism or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. These descriptions are appropriate when these elements are in the positions shown in the accompanying drawings. If the description of the positions of these elements changes, these directional indications also change accordingly.

[0027] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the stated features. In the description of this application, "a plurality of" means two or more, unless otherwise explicitly specified.

[0028] LED screens are typically composed of multiple display screens 10, each consisting of a lamp panel 11. Each lamp panel 11 has a large array of light-emitting chips 12 arranged to form display pixels in corresponding areas of the overall display screen 10. The chips 12 are arranged on the light-emitting surface of the lamp panel 11 according to a preset pixel pitch rule. The accuracy of the pixel pitch directly determines the overall clarity, uniformity, and image continuity of the display screen 10. During the production process of the display screen 10, multiple lamp panels 11 must be precisely aligned along the splicing direction to ensure that the spacing between the chips 12 at the edges of adjacent lamp panels 11 is consistent with the center-to-center spacing of the chips 12 inside the lamp panel 11, thereby maintaining the continuity of the pixel arrangement across the entire screen.

[0029] However, existing LED light board 11 cutting processes primarily rely on the physical dimensions of the light board 11, the bare board edge, or preset MARK points for positioning, determining the cutting path through these structural features. This cutting method does not directly reference the actual geometric position of the chip 12 on the light board 11. In COB packaging processes, the actual mounting position of the chip 12 may experience slight deviations due to factors such as die bonding errors, pad offsets, substrate stress changes, and thermal expansion and contraction, causing unpredictable errors in the center point of the chip 12 relative to the edge or MARK point of the light board 11.

[0030] Therefore, please refer to Figures 1 to 7 This embodiment provides a method for cutting display screen light panels, which achieves the required spacing accuracy of the 12-point wafers after splicing multiple light panels 11. For example... Figure 3 As shown, the method includes the following steps: S100: Acquire a planar image of the lamp board 11 of the display screen 10 and the chip 12 arrayed on the lamp board 11.

[0031] S200. Based on the planar image, select the chip 12 that is close to the edge of the light panel 11 to be spliced ​​and is arranged at intervals along the splicing line extension direction as the reference chip 121.

[0032] S300, calculates the center point coordinates of the reference wafer 121.

[0033] S400. Based on the center point coordinates of the reference wafer 121 and the point spacing of the wafers 12 inside the lamp board 11, determine the position of the target cutting line 13 of the lamp board 11, so that the distance from the center point of the reference wafer 121 to the target cutting line 13 meets the preset spacing requirements.

[0034] S500: Control the CNC cutting equipment to cut the edge of the lamp panel 11 along the target cutting line 13.

[0035] Specifically, to address the spacing issue of the wafers 12 after splicing adjacent light panels 11, this embodiment utilizes a planar image of the light panel 11 placed on the cutting table, acquired by a high-resolution industrial CCD camera or other precision imaging equipment. Through image processing and recognition algorithms, a wafer 12 that is close to the edge to be spliced ​​and parallel to the splicing edge is selected from the light panel 11 as a reference wafer 121.

[0036] The reference chip 121 is the row of chips 12 closest to the splicing edge. "Closest to the splicing edge" means the row of chips 12 with the shortest distance between its center point and the predetermined cutting area of ​​the lamp board 11, ensuring it accurately reflects the actual arrangement of chips 12 in the edge region of the lamp board 11. Subsequently, image processing is performed on the reference chip 121 to obtain its precise center point coordinates. Based on the obtained center point coordinates of the reference chip 121 and the theoretical spacing between the chips 12 inside the lamp board 11, the position of the target cutting line 13 of the lamp board 11 can be determined using a calculation formula. After obtaining the target cutting line 13, the system controls a CNC cutting device (e.g., a precision CNC cutting machine or laser cutting device) to cut the edge of the lamp board 11 along the target cutting line 13.

[0037] The method of this embodiment can accurately reflect the actual arrangement of the edge chips 12 of the light board 11, ensuring that the spacing between the chips 12 of multiple light boards 11 remains highly consistent after splicing. This effectively avoids the visual discontinuity problem of splicing seams that occurs in traditional cutting processes, improves the overall image continuity and display accuracy of the display screen 10, simplifies the production process, reduces manual debugging costs, and enhances the stability and efficiency of mass production of large-size LED display screens 10.

[0038] In this embodiment, in step S100, at least two chips 12 close to the edge of the lamp board 11 to be spliced ​​can be selected as reference chips 121.

[0039] Selecting at least two reference chips 121 can ensure that the position of the target cutting line 13 located by them is more accurate, avoid the overall cutting direction deviation caused by the position error of a single chip 12, significantly reduce the cutting error caused by the overall deformation of the lamp board 11, and improve the accuracy of the cutting line matching the actual pixel arrangement.

[0040] Please see Figure 4 In some embodiments, step S300, calculating the center point coordinates of the reference wafer 121, further includes the following steps: S310. Based on the acquired planar image, the contour of the reference wafer 121 is extracted using the grayscale threshold segmentation method.

[0041] S320. Calculate the center coordinates of the extracted reference wafer 121 profile.

[0042] Specifically, the system preprocesses the planar image of the light panel 11 acquired by the visual positioning device, including noise filtering, brightness equalization, and edge enhancement, to improve the accuracy of the wafer 12 contour recognition. Subsequently, the system performs binarization segmentation on the image based on a preset grayscale threshold, dynamically determining the optimal threshold through an adaptive threshold adjustment algorithm, ensuring that the wafer 12 region forms a clear target area in the binary image. After binarization, the system calls a contour extraction algorithm to accurately identify the outer boundary of the wafer 12, preserving the main contour of the target reference wafer 121. Next, the processing module performs geometric feature analysis on this main contour, calculating the centroid position of each pixel to obtain the center coordinates of the wafer 12.

[0043] Please see Figure 5 In some embodiments, step S400, determining the position of the target cutting line 13 of the lamp board 11 based on the center point coordinates of the reference wafer 121 and the point spacing of the wafers 12 inside the lamp board 11, so that the distance from the center point of the reference wafer 121 to the cutting line meets the preset spacing requirement, further includes: S410, Connect the center point coordinates of the two reference wafers 121 to obtain the reference line 14.

[0044] S420, Obtain the center point spacing D of adjacent chips 12 inside the lamp board 11.

[0045] S430, Set the distance between the target cutting line 13 and the baseline 14 to L.

[0046] S440, control L=D / 2 to determine the coordinate position of the target cutting line 13.

[0047] Specifically, a planar image of the light panel 11 is acquired using a high-precision visual positioning device, and multiple chips 12 in the image are located and identified. Based on the image analysis results, the system selects any two reference chips 121 along the splicing edge of the light panel 11. Next, the system calculates the coordinates of the center points of these two reference chips 121 and forms a baseline 14 by connecting these two center points. This baseline 14 represents the actual arrangement direction of the outermost chips 12 of the light panel 11.

[0048] Then, the system obtains the center-to-center distance D between adjacent chips 12 inside the lamp board 11. The center-to-center distance D between adjacent chips 12 inside the lamp board 11 refers to the standard distance between the center points of adjacent chips 12 on the lamp board 11. This parameter is usually set during the design phase of the lamp board 11.

[0049] Next, the distance L is set to half the center point spacing D of the internal wafers 12, i.e., L = D / 2. The specific coordinates of the target cutting line 13 are calculated and input into the cutting control system. The cutting device then performs precise cutting along the target cutting line 13, thereby ensuring that the distance from the center point of a row of wafers 12 at the cutting edge to the cutting line is consistent with the arrangement of the internal wafers 12, so as to achieve uniformity and continuity of the lamp panel 11 splicing, and thus avoid the phenomenon of pixel misalignment or inconsistent spacing in the display screen 10 after splicing two lamp panels 11.

[0050] Please see Figure 2 In some embodiments, the two reference wafers 121 selected in step S200 are located at the beginning and end of the wafer sequence along the splicing line extension direction, respectively.

[0051] Specifically, the system can first identify the chip column corresponding to the edge to be spliced, and extract the two chips 12 at both ends of the sequence as reference chips 121. At this time, the center points of the two selected reference chips 121 are not only located near the cutting line area, but the two reference chips 121 are also the two with the largest spacing among the chips 12 in this column. Therefore, the coordinates of their center points can accurately describe the direction of the chips 12 at the edge of the lamp board 11.

[0052] A reference line 14 can be formed by using the center points of the reference chips 121 at the beginning and end of the sequence, running through the entire chip sequence. This reference line 14 directly reflects the arrangement direction of the chips 12 near the edge of the lamp board 11. Based on this reference line 14, and combined with the standard dot pitch D of the chips 12 inside the lamp board 11, the offset distance of the target cutting line 13 relative to the reference line 14 can be accurately determined, ensuring that the distance from the center point of the reference chip 121 to the cutting line meets the preset requirement of D / 2. This guarantees that the center point spacing of the chips 12 on the edge of adjacent lamp boards 11 remains consistent with the interior of the lamp board 11 after actual splicing. This significantly improves the directional and distance accuracy of edge cutting, preventing edge pixel misalignment or visual breaks in the splicing after splicing, and improving the overall uniformity and consistency of the displayed image.

[0053] Of course, in other embodiments, the method for selecting the reference wafer 121 and the method for determining the target cutting line 13 can be adjusted according to specific production needs. For example, in some application scenarios with higher requirements for splicing accuracy, more reference wafers 121 can be selected to further improve the overall cutting accuracy. In addition, if the lamp board 11 is very large or irregular in shape, the system can also dynamically adjust the baseline 14 through multi-point calibration or adaptive algorithms to further reduce errors caused by equipment deviation or raw material deformation.

[0054] Please see Figure 6In some embodiments, step S500, controlling the CNC cutting equipment to cut the edge of the lamp panel 11 along the target cutting line 13, includes: S510: The actual position of the edge of the cut light panel 11 is obtained in real time through a visual positioning device.

[0055] S520. Calculate the distance deviation between the actual edge position and the target cutting line 13.

[0056] S530: Based on the calculated distance deviation, dynamically adjust the cutting path of the CNC cutting equipment to correct the cutting position.

[0057] Specifically, to further improve the cutting accuracy of the lamp panel 11 and ensure that the overlap between the edge position of the cut lamp panel 11 and the target cutting line 13 meets the requirements for high-precision splicing, this embodiment introduces a visual feedback and dynamic correction mechanism during the CNC cutting process.

[0058] While the CNC cutting equipment performs the cutting operation along the target cutting line 13, a vision positioning device (such as a high-resolution industrial camera, line scan camera, or structured light measurement device) configured on the cutting platform acquires real-time images of the actual position of the edge of the light panel 11 after cutting. Based on the acquired images, the vision positioning device extracts the position coordinates of the actual edge line of the light panel 11 using image processing methods such as edge detection algorithms.

[0059] Subsequently, the system compares the detected position of the actual edge line with the pre-set target cutting line 13, and evaluates the error of the CNC cutting equipment on the current execution path by calculating the distance deviation between the two. This distance deviation includes not only the offset caused by the mechanical precision of the CNC equipment, but may also come from factors such as local warping of the lamp plate 11 material and micro-deformation caused by clamping stress. Therefore, calculating the deviation in real time can significantly improve the overall cutting accuracy.

[0060] After calculating the distance deviation, the control system dynamically adjusts the cutting path based on this deviation value. For example, when it detects that the actual cutting position is biased to one side relative to the target cutting line 13, the system immediately sends a correction command to the motion control module of the CNC cutting machine to make slight compensation to the tool trajectory, thereby recalibrating the subsequent cutting segments to the vicinity of the target cutting line 13. This dynamic correction process is achieved through closed-loop control and can continue throughout the entire cutting path execution, allowing the cutting trajectory to be automatically calibrated based on real-time data at any time.

[0061] This visual feedback-based dynamic adjustment method effectively compensates for the shortcomings of traditional CNC static path cutting, and is especially suitable for scenarios with extremely high cutting precision requirements, such as small-pitch LED panels 11. It ensures that the actual distance deviation from the center point of the reference chip 121 to the edge of the LED panel 11 after cutting remains ≤0.05 mm. This minimizes errors caused by equipment, materials, and environmental factors, thereby guaranteeing the consistency of the dot pitch when the LED panels 11 are finally spliced, providing a more uniform and complete display effect for the LED display screen 10.

[0062] Please see Figure 7 In some embodiments, after completing step S500, which involves controlling the CNC cutting equipment to cut the edge of the lamp panel 11 along the target cutting line 13, a splicing verification step is also provided, which includes: S610. The cut light panels 11 are spliced ​​together according to the preset positions.

[0063] S620, Detect the center point distance of the chips 12 on both sides of the splicing line of the adjacent light panels 11.

[0064] S630. Determine whether the center point spacing of the chips 12 on both sides of the splicing line of the adjacent light board 11 is consistent with the center point spacing of the chips 12 inside the light board 11.

[0065] S640. When the center point spacing deviation exceeds the preset allowable range, readjust the cutting parameters of the CNC cutting equipment and recut the corresponding edge.

[0066] Specifically, after the CNC cutting equipment completes the edge cutting of the light panel 11 according to the target cutting line 13, in order to detect the consistency of the dot spacing in the splicing area of ​​the display screen 10, the system can also perform splicing verification on multiple cut light panels 11.

[0067] First, the multiple cut light panels 11 are placed on the splicing fixture according to the preset splicing order and spatial position. This fixture is usually a positioning platform with high flatness or a modular splicing frame, used to ensure the relative positional stability and splicing accuracy between the light panels 11.

[0068] After the light panels 11 are spliced ​​in a preset manner, visual inspection equipment (such as a high-resolution industrial camera array or a microscopic measuring device) is used to collect images of the wafers 12 on both sides of the splicing line of adjacent light panels 11, and the coordinates of the center point of the wafers 12 located near the splicing line are extracted by image processing algorithms.

[0069] The system then calculates the actual spacing between the center points of the chips 12 on both sides of the splicing line of adjacent LED panels 11 and compares it with the standard center point spacing D of the chips 12 inside the LED panel 11. The chip spacing D inside the LED panel 11 is a reference parameter used to control the pixel arrangement during the production process, ensuring the regularity of the display units inside the LED panel 11. Therefore, the spacing between the edge chips 12 of adjacent LED panels 11 after splicing should be consistent with D. If the visual inspection results show that the center point spacing of the chips 12 on both sides of the splicing line is consistent with the standard spacing or within the preset allowable error range, it indicates that the cutting accuracy meets the requirements, and the subsequent LED panel 11 assembly or whole screen assembly process can proceed.

[0070] When the detection system determines that the deviation exceeds the preset allowable range (e.g., greater than ±0.05mm), the system records the direction and amount of the deviation. The feedback control module then corrects the cutting compensation parameters of the CNC cutting equipment, such as adjusting the tool path offset, correcting the coordinate system zero point, or resetting the offset distance L of the target cutting line 13 to more accurately match the actual wafer 12 arrangement. After the cutting parameters are updated, the cutting operation is re-executed on the edge of the lamp board 11 where the deviation occurred.

[0071] Before recutting, the system can choose to re-photograph the reference chip 121 to calibrate the new reference line 14, or it can directly correct the original cutting line based on the deviation data. After recutting, the lamp board 11 is placed back into the splicing fixture, and the consistency of the dot spacing between adjacent lamp boards 11 is re-verified through the aforementioned visual inspection steps. This cyclic process can be repeated until the spacing between the chips 12 on both sides of the splicing line meets the design requirements.

[0072] This embodiment also provides a storage medium on which a computer program is stored, the computer program being used to execute the display screen light panel cutting method described above.

[0073] The storage medium can be a read-only memory (ROM), random access memory (RAM), flash memory, solid-state drive (SSD), or other non-volatile or volatile storage devices capable of storing computer instructions. When the computer program is stored in the computer storage medium and loaded and executed by an external device, the processor will sequentially call functional components such as the image acquisition module, image preprocessing module, wafer 12 contour extraction module, center point calculation module, cutting path generation module, and dynamic correction control module according to the program instructions, thereby realizing the cutting method of the display screen 10 lamp board 11.

[0074] Furthermore, the computer program is also used to automatically execute the splicing detection process after multiple light panels 11 have been cut, comparing the center point spacing of the wafers 12 on both sides of the splicing line. When a spacing deviation is detected to exceed the allowable range, the adjusted cutting parameters are re-output to drive the equipment to reprocess the corresponding edges. Through the program in this storage medium, the cutting process of the light panel 11 can be automated, intelligent, and controlled with high precision.

[0075] This embodiment also provides a light panel cutting device, which includes a processor and a memory, the memory storing a computer program. The processor executes the computer program to implement the above-described display screen light panel cutting method.

[0076] The light panel cutting equipment may include components such as a frame, a vision positioning unit, a CNC cutting mechanism, a processor, and a memory. The vision positioning unit can be an industrial camera, a light source module, and an image acquisition interface, used to acquire real-time visual images of the edge area of ​​the light panel 11 and the reference wafer 121. The CNC cutting mechanism can employ linear guides, servo motor drive components, laser cutting heads, or mechanical cutters, while the processor executes the computer program stored in the memory. During equipment operation, the processor first calls the vision positioning unit to acquire images of the light panel 11, performs preprocessing and feature recognition on the images, calculates the coordinates of the center point of the reference wafer 121, and generates the target cutting line 13. Then, it drives the CNC cutting mechanism to cut the edge of the light panel 11 along the target path. During the cutting process, the processor continuously calculates the deviation between the actual cutting trajectory and the target trajectory based on image feedback, and corrects the cutting path by adjusting the real-time control parameters of the servo motor, achieving dynamic refinement.

[0077] Please see Figure 1 and Figure 2 This embodiment takes the splicing and cutting of the lamp board 11 (i.e., the center point spacing D=1.2mm of the internal chip 12) of XS1.2 specification LED as an example to explain in detail the implementation process of this process.

[0078] First, the LED light board 11 to be cut is placed on the worktable of the cutting equipment, and the light board 11 is fixed firmly to avoid displacement during the cutting process. Then, the vision positioning device takes a picture of the surface of the light board 11 to obtain a planar image of the light board 11 and the array chip 12.

[0079] Next, based on the acquired planar image, two farthest wafers 12 that are close to the edge to be spliced ​​and are spaced apart along the splicing line are selected as reference wafers 121. These two reference wafers 121 are located at the beginning and end of the sequence of wafers, respectively.

[0080] Then, the contour of the reference wafer 121 is extracted using a grayscale threshold segmentation algorithm. After removing interference areas, the coordinates of the center point of the reference wafer 121 are calculated as reference data for cutting and positioning. By connecting the center points of the two reference wafers 121, the reference line 14 is obtained.

[0081] Based on the dot pitch D=1.2mm of the internal chip 12 of the lamp board 11, the target cutting line 13 is set outside the reference line 14, so that the distance from the center point of the reference chip 121 to the target cutting line 13 is L=0.6mm, so as to ensure that the spacing of the cut edge chip 12 is consistent with that of the internal chip 12 after splicing.

[0082] Subsequently, the CNC cutting equipment is controlled to cut the edge of the lamp board 11 along the target cutting line 13. During the cutting process, the vision positioning device monitors the actual cutting position of the edge of the lamp board 11 in real time and calculates the distance deviation between the actual edge and the target cutting line 13. The processor dynamically adjusts the cutting path according to the deviation information to ensure that the cutting accuracy meets the requirement that the dimensional deviation from the center point of the reference wafer 121 to the edge is ≤0.05mm.

[0083] After completing the edge cutting on one side, the above steps can be repeated so that all four edges of the lamp panel 11 are cut in this manner.

[0084] After all cutting is completed, the multiple cut light panels 11 are horizontally spliced ​​together according to the preset positions. The center point distance between the wafers 12 on both sides of the splicing line is checked again using a visual positioning device, and the detection result is compared with the spacing D=1.2mm between the wafers 12 inside the light panel 11. When the center point distance deviation at the splicing point is found to exceed the allowable range, the system will return to the cutting step, adjust the cutting parameters of the CNC cutting equipment, and re-cut the corresponding edge until the spacing at the splicing point meets the accuracy requirements.

[0085] In summary, this embodiment provides a display screen lamp panel cutting method, storage medium, and lamp panel cutting equipment provided by this application. By acquiring a planar image of the lamp panel 11 and the array of chips 12, selecting a chip 12 near the edge to be spliced ​​as a reference, and calculating its center point coordinates, and then combining the dot pitch of the chips 12 inside the lamp panel 11 to accurately determine the position of the target cutting line 13, it can be ensured that the position of the edge chip 12 after cutting is consistent with the dot pitch of the internal chips 12. By using the actual position of the chips 12 on the lamp panel 11 as a reference instead of the traditional lamp panel 11 border or MARK point for cutting, a direct correlation between cutting positioning and chip 12 arrangement is achieved; effectively avoiding the problems of uneven dot pitch at the splicing point, visual discontinuity of the splicing seam, and the impact on the continuity of the display image caused by chip 12 mounting offset, thermal expansion and contraction of the lamp panel 11, or border deviation in the traditional cutting process, it achieves high dot pitch accuracy and good consistency after splicing multiple lamp panels 11, significantly improving the display effect of the large-size LED display screen 10, while reducing post-processing steps, shortening the production cycle, reducing labor costs, and improving the stability and efficiency of mass production.

[0086] Although the invention has been described with reference to several typical embodiments, it should be understood that the terminology used is illustrative and exemplary, and not restrictive. Since the invention can be embodied in many forms without departing from the spirit or essence of the invention, it should be understood that the above embodiments are not limited to any of the foregoing details, but should be interpreted broadly within the spirit and scope defined by the appended claims. Therefore, all variations and modifications falling within the scope of the claims or their equivalents should be covered by the appended claims.

Claims

1. A method for cutting a display screen light panel, characterized in that, include: Acquire a planar image of the display's lamp panel and the chips arrayed on the lamp panel; Based on the planar image, select the wafers that are close to the edge of the light panel to be spliced ​​and are spaced apart along the splicing line extension direction as reference wafers; Calculate the coordinates of the center point of the reference wafer; Based on the center point coordinates of the reference wafer and the point spacing of the wafers inside the lamp board, the target cutting line position of the lamp board is determined so that the distance from the center point of the reference wafer to the target cutting line meets the preset spacing requirements. The CNC cutting equipment is controlled to cut the edge of the lamp panel along the target cutting line.

2. The display screen lamp panel cutting method according to claim 1, characterized in that, Select at least two wafers close to the edge of the light panel to be spliced ​​as the reference wafers.

3. The display screen lamp panel cutting method according to claim 2, characterized in that, Based on the center point coordinates of the reference wafer and the pixel spacing of the wafers inside the lamp board, the target cutting line position of the lamp board is determined, ensuring that the distance from the center point of the reference wafer to the cutting line meets the preset spacing requirements, including: Connect the center point coordinates of the two reference wafers to obtain the baseline; Obtain the center-to-center distance D between adjacent chips inside the lamp board; The distance between the target cutting line and the baseline is set to L; The coordinate position of the target cutting line is determined by controlling L=D / 2.

4. The display screen lamp panel cutting method according to claim 3, characterized in that, The two reference wafers are located at the beginning and end of the wafer sequence in the splicing line extension direction, respectively.

5. The display screen lamp panel cutting method according to claim 3, characterized in that, Controlling the CNC cutting equipment to cut the edge of the lamp panel along the target cutting line includes: The actual position of the cut lamp panel edge is obtained in real time using a visual positioning device; Calculate the distance deviation between the actual edge position and the target cutting line; Based on the calculated distance deviation, the cutting path of the CNC cutting equipment is dynamically adjusted to correct the cutting position.

6. The display screen lamp panel cutting method according to claim 5, characterized in that, The distance deviation between the actual edge position and the target cutting line should be controlled to be ≤0.

05.

7. The display screen lamp panel cutting method according to claim 1, characterized in that, After controlling the CNC cutting equipment to cut the edge of the lamp panel along the target cutting line, the process further includes: The cut light panels are then assembled according to the preset positions. Detect the center-to-center distance between the chips on both sides of the splicing line of adjacent light panels; Determine whether the center-to-center spacing of the chips on both sides of the splicing line of adjacent light panels is consistent with the center-to-center spacing of the chips inside the light panel; When the center point spacing deviation exceeds the preset allowable range, the cutting parameters of the CNC cutting equipment are readjusted and the corresponding edge is recut.

8. The method for cutting display screen lamp panels according to claim 1, characterized in that, The calculation of the center point coordinates of the reference wafer includes: Based on the acquired planar image, the contour of the reference wafer is extracted using a grayscale threshold segmentation method; Calculate the center coordinates of the extracted reference wafer profile.

9. A storage medium having a computer program stored thereon, characterized in that, The computer program is used to execute the display screen light panel cutting method as described in any one of claims 1-8.

10. A light panel cutting device, characterized in that, It includes a processor and a memory, wherein the memory stores a computer program; the processor executes the computer program to implement the display screen light panel cutting method as described in any one of claims 1-8.

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