Quartz tool and application thereof, and semiconductor part processing method

Abstract

The invention provides a quartz tool and application thereof, and a processing method of semiconductor parts. The quartz tool comprises a tool body and an adsorption bottom plate which is detachably mounted at the bottom of the tool body; the tool body and the adsorption bottom plate are both made of quartz; a workpiece containing groove is formed in the upper surface of the tool body, a first exhaust hole is formed in the workpiece containing groove, and a second exhaust hole is formed in the middle of the tool body. A third exhaust hole is formed in the middle of the adsorption bottom plate, a fourth exhaust hole is formed in the side face of the adsorption bottom plate, and the first exhaust hole, the second exhaust hole, the third exhaust hole and the fourth exhaust hole communicate with one another to form an exhaust channel. According to the quartz tool disclosed by the invention, the to-be-processed workpiece can be fixed on the quartz tool in a vacuum adsorption manner under the assistance of vacuumizing equipment, so that the fixation and the disassembly are convenient; moreover, the quartz tool is high in hardness, stable in structure and not prone to deformation, the flatness stability of the clamped product is improved, and the overall machining quality can be improved.

Description

Technical Field

[0001] This application relates to the field of semiconductor component processing technology, and more specifically, to a quartz tooling and its application, and a method for processing semiconductor components. Background Technology

[0002] In recent years, with the expansion of the global semiconductor market, the localization of the semiconductor industry has become an urgent task. The localization of semiconductor equipment largely depends on breakthroughs in key technologies of precision semiconductor components. Precision semiconductor components are not only one of the most difficult and technologically advanced links in semiconductor equipment manufacturing, but also one of the bottlenecks in China's semiconductor equipment industry.

[0003] Precision semiconductor components, such as silicon electrodes, wafer carriers, etching cavity components, precision probes, and optical lenses, are the core foundation of chip manufacturing equipment and processes. Their processing accuracy, material properties, and stability directly determine chip yield, performance, and production costs. However, current processing techniques for precision semiconductor components typically use metal tooling with paraffin wax to fix the workpiece. This necessitates repeated wax application, heating, cooling, and dewaxing operations to meet the processing requirements of different surfaces of the workpiece, resulting in a complex overall process and a long processing cycle. Summary of the Invention

[0004] To address the aforementioned issues, this application provides a quartz fixture and its application, as well as a method for processing semiconductor components. The quartz fixture of this application, with the assistance of a vacuum pump, allows the workpiece to be processed to be fixed onto the fixture via vacuum adsorption, facilitating fixing and disassembly and improving the ease of use. Simultaneously, it avoids repeated heating and dewaxing operations, thereby preventing deformation of the workpiece and improving overall processing quality. Furthermore, the quartz fixture of this application is made of quartz, which has the advantages of high hardness and structural stability. It will not deform during long-term use, thus improving the flatness stability of the workpiece after clamping, further enhancing overall processing quality and effectively preventing damage to semiconductor components.

[0005] Firstly, this application provides a quartz tooling.

[0006] The quartz tooling of this application includes a tooling body and an adsorption base plate that can be detachably installed at the bottom of the tooling body; both the tooling body and the adsorption base plate are made of quartz.

[0007] The upper surface of the tooling body is provided with a workpiece placement groove, which is used to place the workpiece to be processed.

[0008] At least one first vent hole is provided in the workpiece placement slot. The first vent hole extends from the upper surface of the tooling body to the lower surface of the tooling body but does not penetrate the lower surface of the tooling body.

[0009] A second vent hole is provided on the lower surface of the tooling body. The second vent hole extends from the lower surface of the tooling body toward the upper surface of the tooling body but does not penetrate the upper surface of the tooling body, and the second vent hole is connected to the first vent hole.

[0010] The upper surface of the adsorption base plate is provided with a third vent hole corresponding to the second vent hole. The third vent hole is used to communicate with the second vent hole, and the third vent hole extends along the upper surface of the adsorption base plate toward the lower surface of the adsorption base plate but does not penetrate the lower surface of the adsorption base plate.

[0011] A fourth exhaust hole is provided on the side of the adsorption base plate. The fourth exhaust hole is used to communicate with a vacuum pump and extends into the adsorption base plate to communicate with the third exhaust hole.

[0012] When the adsorption base plate is installed at the bottom of the tooling body, the first exhaust hole, the second exhaust hole, the third exhaust hole and the fourth exhaust hole are connected in sequence to form an exhaust channel.

[0013] Based on the above solution, this application places the workpiece to be processed in the workpiece placement slot and connects the fourth exhaust port to a vacuum device. By turning on the vacuum device, the air between the workpiece and the workpiece placement slot is discharged sequentially through the first, second, third, and fourth exhaust ports, thereby creating a negative pressure environment between the workpiece and the workpiece placement slot. This allows the workpiece to be fixed to the quartz fixture by vacuum adsorption. When it is necessary to remove or flip the workpiece, the connection with the vacuum device is disconnected or ventilation is initiated, allowing air to re-enter between the workpiece and the workpiece placement slot, thereby relieving the negative pressure environment and facilitating the removal or flipping of the workpiece.

[0014] The quartz fixture of this application can fix the workpiece to be processed onto the quartz fixture by vacuum adsorption with the assistance of vacuum equipment, making fixing and disassembly convenient. Moreover, the quartz fixture of this application has high hardness and stable structure, and will not deform during long-term use, thus improving the flatness stability of the product after clamping, which is conducive to improving the overall processing quality and effectively avoiding damage to semiconductor components.

[0015] For example, in some embodiments, the second exhaust port is located in the middle of the lower surface of the tooling body, and the third exhaust port is located in the middle of the upper surface of the adsorption base plate. This arrangement allows the exhaust end of the third exhaust port to directly contact and communicate with the intake end of the second exhaust port after the adsorption base plate is installed at the bottom of the tooling body, thereby connecting the first, second, third, and fourth exhaust ports sequentially to form an exhaust channel.

[0016] In some embodiments, the tooling body has a plurality of first mounting holes along its thickness direction, and the adsorption base plate has a plurality of second mounting holes along its thickness direction. The plurality of second mounting holes correspond one-to-one with the plurality of first mounting holes, for detachable connection via threaded fasteners. Based on the above scheme, a better detachable connection between the tooling body and the adsorption base plate can be achieved, facilitating the maintenance or timely replacement of the quartz tooling and extending its service life.

[0017] In some embodiments, the threaded fastener includes, but is not limited to, any one of screws and bolts. Based on the above solution, a detachable connection between the mounting body and the adsorption base plate can be achieved while reducing manufacturing costs.

[0018] In some embodiments, a first sealing groove is formed on the lower surface of the tooling body, and the first sealing groove is located around the second vent hole; a second sealing groove is formed on the upper surface of the adsorption base plate, and the second sealing groove matches the first sealing groove to form a closed sealing cavity for placing a sealing ring. Based on the above solution, it is beneficial to improve the airtightness of the venting channel formed between the tooling body and the adsorption base plate, thereby ensuring that the workpiece to be processed can be stably fixed in the workpiece placement groove during the processing, which is beneficial to improving the overall processing quality of the workpiece.

[0019] Secondly, this application provides an application of quartz tooling in the processing of semiconductor components.

[0020] It should be noted that the quartz tooling used in this application is the same as that in the first aspect, and has all the beneficial effects brought about by the quartz tooling in the first aspect.

[0021] In this application, the quartz fixture is used to clamp semiconductor components. The quartz fixture of this application is applicable to the processing of different semiconductor components. Therefore, this application does not limit the specific semiconductor components; appropriate semiconductor components can be selected according to actual needs. For example, in some embodiments, the semiconductor components include any one of polycrystalline silicon semiconductor components, monocrystalline silicon semiconductor components, and silicon carbide semiconductor components.

[0022] This application does not limit the specific silicon component products; appropriate silicon component products can be selected according to actual needs. For example, the silicon component products include silicon electrodes.

[0023] Thirdly, this application provides a method for processing semiconductor components.

[0024] The semiconductor component processing method of this application includes the following steps:

[0025] Step 1: Clamping and fixing the thinned blank material: Using any of the quartz fixtures described in the first aspect of this application as clamping fixtures, the blank material corresponding to the workpiece to be processed is placed in the workpiece placement groove of the fixture body, with the first surface of the blank material facing upwards; after alignment, the fourth vent hole on the quartz fixture is connected to a vacuum pump to perform vacuum treatment on the quartz fixture, and the air between the blank material and the workpiece placement groove flows through the first vent hole and is discharged through the vent channel, so that the blank material is fixed on the quartz fixture by vacuum adsorption.

[0026] It should be noted that the processing method of this application is applicable to various types of semiconductor components. Therefore, this application does not limit the specific type of semiconductor component; the appropriate semiconductor component can be selected according to actual needs. For example, in some embodiments, the semiconductor component includes any one of polycrystalline silicon semiconductor components, monocrystalline silicon semiconductor components, and silicon carbide semiconductor components.

[0027] It should also be noted that the vacuuming process in this application requires the use of vacuuming equipment. However, this application does not specifically limit the type of vacuuming equipment, as long as it can remove the air between the tooling body and the blank material, so that a negative pressure state is formed between the two, and the blank material is fixed on the quartz tooling by vacuum adsorption.

[0028] In some embodiments, this application employs a vacuum process to a negative pressure ≤ -60 kPa. Based on the above solution, the blank material can be stably fixed on the quartz tooling, facilitating precise machining in subsequent processes.

[0029] In some preferred embodiments, the present application uses a vacuum process to achieve a negative pressure of -60 kPa to -100 kPa. Based on the above solution, the blank material can be more stably fixed on the quartz tooling without damaging it, thereby further improving the overall processing quality.

[0030] In some embodiments, in order to improve the processing quality of semiconductor components, before clamping and fixing the blank material corresponding to the workpiece to be processed, the surface of the blank material is pre-treated to improve the surface flatness of the blank material, thereby improving the processing quality of semiconductor components.

[0031] In some embodiments, a countersunk process is typically required on the blank material before processing the first surface. It should be noted that this application does not limit the specific countersunk process; the appropriate processing can be performed based on the actual type of semiconductor component required.

[0032] Step 2, processing of the first surface: According to actual needs, the first surface of the blank material that is vacuum adsorbed and fixed on the quartz tooling is processed.

[0033] It should be noted that this application does not limit the specific processing technology; the corresponding structure can be formed according to the actual semiconductor components required.

[0034] Step 3, processing of the second surface: The blank material is flipped over so that the second surface opposite to the first surface is facing upwards, and placed in the workpiece placement slot of the tooling body. After alignment, the quartz tooling is vacuumed again so that the blank material is re-fixed to the quartz tooling through vacuum adsorption. According to actual needs, the second surface of the blank material is processed to obtain the semiconductor component.

[0035] It is understandable that the connection between the quartz tooling and the vacuum equipment is disconnected or ventilation is introduced between flipping operations, so that air will re-enter between the workpiece to be processed and the workpiece placement slot, thereby relieving the negative pressure environment between the workpiece to be processed and the workpiece placement slot, and then the blank material is flipped over.

[0036] It should be noted that the specific operation of performing vacuum treatment again can refer to step one above. The goal is to re-fix the blank material onto the quartz tooling through vacuum adsorption.

[0037] In some embodiments, the polycrystalline silicon semiconductor component includes a polycrystalline silicon electrode.

[0038] The beneficial effects of the technical solutions provided in some embodiments of this application include at least the following: The quartz fixture of this application, with the assistance of a vacuum pump, allows the workpiece to be fixed to the quartz fixture by vacuum adsorption. This facilitates fixing and disassembly, eliminating the need for manual processes such as applying paraffin wax, heating, cooling, and dewaxing, thus simplifying the processing technology and shortening the processing cycle. Furthermore, the quartz fixture of this application has high hardness and structural stability, and will not deform during long-term use, thus improving the flatness stability of the product after clamping. This contributes to improving overall processing quality and effectively preventing damage to semiconductor components. Attached Figure Description

[0039] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0040] Figure 1 This is a schematic diagram of the quartz tooling used in this application.

[0041] Figure 2 This is a schematic diagram of the upper surface structure of the tooling body in this application.

[0042] Figure 3 This is a schematic diagram of the lower surface structure of the tooling body in this application.

[0043] Figure 4 This is a schematic diagram of the upper surface structure of the adsorption base plate in this application.

[0044] Figure 5 This is a schematic diagram of the lower surface structure of the adsorption base plate in this application.

[0045] Figure 6 This is a schematic diagram of the silicon electrode structure after the countersinking process in this application.

[0046] Figure 7 This is a schematic diagram of the silicon electrode structure after the C-surface structure is processed in this application.

[0047] Figure 8 This is a schematic diagram of the silicon electrode structure after the A-side structure is processed in this application.

[0048] In the figure, 100-tool body, 101-workpiece placement groove, 102-first vent hole, 103-second vent hole, 104-first mounting hole, 105-first sealing groove; 200-adsorption base plate, 201-third vent hole, 202-fourth vent hole, 203-second mounting hole, 204-second sealing groove; 300-silicon electrode, 301-countersunk hole, 302-C surface, 303-A surface. Detailed Implementation

[0049] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0050] In the description of this application, the terms "upper," "lower," "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings, and are used only for ease of description and simplification of operation. They do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. In addition, the terms "first" and "second" are used only for descriptive distinction and have no special meaning.

[0051] In recent years, with the expansion of the global semiconductor market, the localization of the semiconductor industry has become an urgent task. The localization of semiconductor equipment largely depends on breakthroughs in key technologies of precision semiconductor components. Precision semiconductor components are not only one of the most difficult and technologically advanced links in semiconductor equipment manufacturing, but also one of the bottlenecks in China's semiconductor equipment industry.

[0052] Precision semiconductor components, such as silicon electrodes, wafer carriers, etching cavity components, precision probes, and optical lenses, are the core foundation of chip manufacturing equipment and processes. Their processing accuracy, material properties, and stability directly determine chip yield, performance, and production costs. However, existing processing methods for precision semiconductor components generally involve multiple interconnected processes, resulting in a complex overall process and a long processing cycle.

[0053] For an example of existing silicon electrode fabrication methods, please refer to [link / reference]. Figure 1 The diameter of existing silicon electrodes is between 500mm and 600mm, and the thickness is between 20mm and 100mm. The traditional processing methods for existing silicon electrodes include surface pretreatment of the blank material, transfer and fixing of the blank material, mechanical fixing of the transfer to CNC machining center equipment, countersinking process, A-side structure processing, and C-side structure processing after flipping and fixing.

[0054] In the process of transferring and fixing the blank material, metal tooling (such as aluminum tooling) is mainly used in conjunction with paraffin wax. Specifically, the metal tooling is placed on a heating table by a transfer vehicle and heated. After the temperature (the bonding temperature requires a heating temperature > 100℃) is reached, paraffin wax is applied to the metal tooling using a specific tool. After the paraffin wax melts, it is scraped evenly, and then the blank material is placed on top of the paraffin wax to be fully heated. After the bonding is completed, it is allowed to cool down so that the blank material can be fixed to the metal tooling by the cured paraffin wax. However, this step, from heating the metal tooling to completing the cooling and bonding, generally takes 2 hours, which is too time-consuming.

[0055] Furthermore, after the raw material is fixed to the metal tooling using cured paraffin wax, the cooled metal tooling with the raw material fixed needs to be transported to the CNC machining center via a transfer trolley for mechanical fixing as required. Verifying the flatness of the installation (requirement <0.03) using a Renishaw probe at the equipment end is particularly critical. However, because the metal tooling used in existing technologies (such as aluminum tooling) is prone to deformation due to heat during the upstream process, coupled with the cumulative flatness error caused by paraffin wax bonding, the flatness of the installation is easily substandard, leading to repeated waxing and a significant waste of time.

[0056] Furthermore, since the blank material is fixed by paraffin wax, after the countersinking process is completed, it needs to be transported by a transfer vehicle to the dewaxing tank for dewaxing before subsequent processing can proceed. However, the process from the moment the entire material enters the tank until the paraffin wax and the blank material are completely separated, as well as the manual cleaning and wiping of residual paraffin wax and dirt, also takes a lot of time.

[0057] Furthermore, when processing the A-side structure of the blank material after dewaxing, it is necessary to re-melt paraffin wax to fix the blank material. After the A-side structure is processed, it needs to be transferred to the dewaxing tank again for dewaxing before it can be flipped over to facilitate the subsequent processing of the C-side structure. Moreover, when processing the C-side structure, it is necessary to repeat the paraffin wax bonding and fixing process, as well as the dewaxing process after the C-side structure is processed.

[0058] As can be seen from the above, the existing processing technology has very complicated steps, the overall processing time is too long, and the processing requires workers to perform manual operations many times, which is prone to errors and can easily lead to unqualified product quality. In addition, there are dangerous sources such as high temperature and boiling water in the process, which also bring safety hazards to actual production.

[0059] This application explores and analyzes the problems existing in the above-mentioned processing methods, and finds that they are mainly caused by the tooling used and the way the blank material is fixed in the tooling. Therefore, this application provides a quartz tooling and its application, and a processing method for semiconductor components, to avoid the occurrence of the above-mentioned problems.

[0060] The technical solutions in this application will now be described clearly and in detail with reference to the accompanying drawings.

[0061] Firstly, this application provides a quartz tooling.

[0062] As mentioned above, existing technologies primarily use metal tooling, which not only leads to a more complex overall processing procedure and a longer processing cycle, but also causes deformation of the metal tooling (e.g., aluminum tooling) during the heating process while holding the semiconductor components to be processed. If the deformation of the aluminum tooling is significant during heating, it directly affects the processing quality of the semiconductor components, leading to product defects. Furthermore, using metal tooling as clamping fixtures makes it easy for the semiconductor components to collide with the metal tooling, causing damage to the semiconductor components and even rendering them unusable. Therefore, this application provides a quartz tooling.

[0063] Please see Figure 1 The quartz tooling of this application includes a tooling body 100 and an adsorption base plate 200 that can be detachably installed at the bottom of the tooling body 100; both the tooling body 100 and the adsorption base plate 200 are made of quartz.

[0064] Please see Figure 2 The tooling body 100 of this application has a workpiece placement groove 101 on one surface, which is used to place the workpiece to be processed. It can be understood that the workpiece to be processed in this application is the semiconductor component that actually needs to be processed.

[0065] Based on the above solution, the workpiece placement groove 101 can limit the position of the workpiece to be processed to a certain extent. Combined with the effect of vacuum adsorption, it can better fix the position of the workpiece to be processed, thus improving the stability of product quality. Moreover, the adsorption base plate 200 at the bottom of the fixture body 100 can increase the overall thickness of the fixture body 100, which can effectively avoid the risk of the bottom wall of the workpiece placement groove 101 breaking and chipping during processing, further improving product quality. In addition, the quartz fixture structure of this application is stable and will not deform during long-term use, thus improving the flatness stability of the product after clamping. It also eliminates the need for manual application of paraffin wax, further improving the overall processing quality.

[0066] Please see Figure 2 In this application, at least one first vent hole 102 is provided in the workpiece placement groove 101. The first vent hole 102 extends along the upper surface of the tooling body 100 toward the lower surface of the tooling body 100 but does not penetrate the lower surface of the tooling body 100.

[0067] Please see Figure 3In this application, a second vent 103 is provided on the lower surface of the tooling body 100. The second vent 103 extends from the lower surface of the tooling body 100 toward the upper surface of the tooling body 100 but does not penetrate the upper surface of the tooling body 100, and the second vent 103 communicates with the first vent 102. This application does not specifically limit the location of the second vent 103, as long as the effect of this application can be achieved. For example, in some embodiments, the second vent 103 is located in the middle of the lower surface of the tooling body 100.

[0068] Please see Figure 4 and Figure 5 In this application, a third exhaust hole 201 corresponding to the second exhaust hole 103 is formed on the upper surface of the adsorption base plate 200. The third exhaust hole 201 is used to communicate with the second exhaust hole 103, and extends along the upper surface of the adsorption base plate 200 toward the lower surface of the adsorption base plate 200 but does not penetrate through the lower surface of the adsorption base plate 200. A fourth exhaust hole 202 is formed on the side of the adsorption base plate 200. The fourth exhaust hole 202 is used to communicate with a vacuuming device, and extends into the adsorption base plate 200 to communicate with the third exhaust hole 201. When the adsorption base plate 200 is installed at the bottom of the tooling body 100, the first exhaust hole 102, the second exhaust hole 103, the third exhaust hole 201, and the fourth exhaust hole 202 form an exhaust channel. This application does not specifically limit the location of the third exhaust hole 201, as long as the effect of this application can be achieved. For example, in some embodiments, the third exhaust port 201 is opened in the middle of the upper surface of the adsorption base plate 200. With the above arrangement, after the adsorption base plate 200 is installed on the bottom of the tooling body 100, the exhaust end of the third exhaust port 201 is directly connected to the inlet end of the second exhaust port 103, so that the first exhaust port, the second exhaust port, the third exhaust port and the fourth exhaust port form an exhaust channel for discharging air to achieve vacuum adsorption.

[0069] It should be noted that the channel formed by the connection between the second exhaust hole 103 and the first exhaust hole 102 can be regarded as the first exhaust channel, and the channel formed by the connection between the fourth exhaust hole 202 and the third exhaust hole 201 can be regarded as the second exhaust channel. Since the third exhaust hole 201 is connected to the second exhaust hole 103, the second exhaust channel is connected to the first exhaust channel, thereby forming an exhaust channel for achieving vacuum adsorption. This allows the quartz fixture of this application to allow the air between the workpiece to be processed and the workpiece placement groove 101 to be discharged through the exhaust channel formed by the first exhaust hole 102, the second exhaust hole 103, the third exhaust hole 201 and the fourth exhaust hole 202 with the assistance of a vacuum pump, and to achieve negative pressure. This allows the workpiece to be processed to be fixed on the quartz fixture by vacuum adsorption, which is convenient for fixing and disassembling.

[0070] It should also be noted that when setting up the connection between the first exhaust port 102 and the second exhaust port 103, a process hole can be opened on the side of the tooling body 100. The connection between the first exhaust port 102 and the second exhaust port 103 can be achieved by opening the process hole from the outside to the inside. Then, the process hole can be sealed with screws or other sealing materials.

[0071] Please see Figure 2 and Figure 4 In some embodiments, the tooling body 100 has a plurality of first mounting holes 104 along its thickness direction, and the adsorption base plate 200 has a plurality of second mounting holes 203 along its thickness direction. The plurality of second mounting holes 203 correspond one-to-one with the plurality of first mounting holes 104, for detachable connection via threaded fasteners. Based on the above scheme, the detachable connection between the tooling body 100 and the adsorption base plate 200 can be better achieved, facilitating the maintenance or timely replacement of the quartz tooling and extending its service life.

[0072] In some embodiments, the threaded fastener includes, but is not limited to, any one of screws and bolts. Based on the above solution, a detachable connection between the mounting body and the adsorption base plate 200 can be achieved while reducing manufacturing costs.

[0073] Please see Figure 3 and Figure 4In some embodiments, a first sealing groove 105 is formed on the lower surface of the tooling body 100, and the first sealing groove 105 is located around the second vent hole 103; a second sealing groove 204 is formed on the upper surface of the adsorption base plate 200, and the second sealing groove 204 matches the first sealing groove 105 to form a closed sealing cavity for placing a sealing ring. Based on the above scheme, it is beneficial to improve the airtightness of the vent channel formed between the tooling body 100 and the adsorption base plate 200, thereby ensuring that the workpiece to be processed can be stably fixed in the workpiece placement groove 101 during the processing, which is beneficial to improving the overall processing quality of the workpiece.

[0074] Secondly, this application provides an application of quartz tooling in the processing of semiconductor components.

[0075] It should be noted that the quartz tooling used in this application is the same as that in the first aspect, and has all the beneficial effects brought about by the quartz tooling in the first aspect.

[0076] In this application, the quartz fixture is used to clamp semiconductor components. The quartz fixture of this application is applicable to the processing of different semiconductor components. Therefore, this application does not limit the specific semiconductor components; appropriate semiconductor components can be selected according to actual needs. For example, in some embodiments, the semiconductor components include any one of polycrystalline silicon semiconductor components, monocrystalline silicon semiconductor components, and silicon carbide semiconductor components. It should be noted that the material of the silicon component product includes any one of polycrystalline silicon, monocrystalline silicon, and silicon carbide. It is understood that in the integrated circuit manufacturing process, silicon components are etched simultaneously with the wafer. High-purity silicon components and wafers are both made of silicon material, resulting in more uniform etching electrical properties. Therefore, silicon component products are widely used in semiconductor etching machines. Polycrystalline silicon usually refers to a form of silicon. When molten elemental silicon solidifies under supercooled conditions, silicon atoms arrange themselves into many crystal nuclei in a diamond lattice. These crystal nuclei grow into grains with different crystal plane orientations, and these grains combine to crystallize into polycrystalline silicon.

[0077] This application does not limit the specific silicon component products; appropriate silicon component products can be selected according to actual needs. For example, the silicon component products include silicon electrodes.

[0078] The quartz fixture of this application is used for clamping semiconductor components. Only a vacuuming process using a vacuum pump is needed to fix the semiconductor components to be processed. Fixing and disassembly are convenient, eliminating the need for manual processes such as applying paraffin wax, heating, cooling, and dewaxing, thus simplifying the processing technology and shortening the processing cycle. Furthermore, the quartz fixture of this application has high hardness and structural stability, and will not deform during long-term use, thus improving the flatness stability of the clamped product. This is beneficial for improving overall processing quality and effectively avoiding damage to the semiconductor components.

[0079] Thirdly, this application provides a method for processing semiconductor components.

[0080] The semiconductor component processing method of this application includes the following steps: Step 1: Clamping and fixing the thinned blank material: Using any of the quartz fixtures described in the first aspect of this application as clamping fixtures, the blank material corresponding to the workpiece to be processed is placed in the workpiece placement groove 101 of the fixture body 100, with the first surface of the blank material facing upwards; after alignment, the fourth vent 202 on the quartz fixture is connected to a vacuum pump to perform vacuum treatment on the quartz fixture, and the air between the blank material and the workpiece placement groove 101 flows through the first vent 102 and is discharged through the venting channel, so that the blank material is fixed on the quartz fixture by vacuum adsorption.

[0081] It should be noted that the processing method of this application is applicable to various types of semiconductor components. Therefore, this application does not limit the specific type of semiconductor component; the appropriate semiconductor component can be selected according to actual needs. For example, in some embodiments, the semiconductor component includes any one of polycrystalline silicon semiconductor components, monocrystalline silicon semiconductor components, and silicon carbide semiconductor components.

[0082] It should also be noted that the vacuuming process in this application requires the use of vacuuming equipment. However, this application does not specifically limit the type of vacuuming equipment, as long as it can remove the air between the tooling body 100 and the blank material, so that a negative pressure state is formed between the two, and the blank material is fixed on the quartz tooling by vacuum adsorption.

[0083] In some embodiments, this application employs a vacuum process to a negative pressure ≤ -60 kPa. Based on the above solution, the blank material can be stably fixed on the quartz tooling, facilitating precise machining in subsequent processes.

[0084] In some preferred embodiments, the present application uses a vacuum process to achieve a negative pressure of -60 kPa to -100 kPa. Based on the above solution, the blank material can be more stably fixed on the quartz tooling without damaging it, thereby further improving the overall processing quality.

[0085] In some embodiments, in order to improve the processing quality of semiconductor components, before clamping and fixing the blank material corresponding to the workpiece to be processed, the surface of the blank material is pre-treated to improve the surface flatness of the blank material, thereby improving the processing quality of semiconductor components.

[0086] In some embodiments, a countersunk process is typically required on the blank material before processing the first surface. It should be noted that this application does not limit the specific countersunk process; the appropriate processing can be performed based on the actual type of semiconductor component required.

[0087] Step 2, processing of the first surface: According to actual needs, the first surface of the blank material that is vacuum adsorbed and fixed on the quartz tooling is processed.

[0088] It should be noted that this application does not limit the specific processing technology; the corresponding structure can be formed according to the actual semiconductor components required.

[0089] Step 3, processing of the second surface: The blank material is flipped over so that the second surface opposite to the first surface is facing upwards, and placed in the workpiece placement slot 101 of the tooling body 100. After alignment, the quartz tooling is vacuumed again so that the blank material is re-fixed to the quartz tooling through vacuum adsorption. According to actual needs, the second surface of the blank material is processed to obtain the semiconductor component.

[0090] It is understandable that the connection between the quartz tooling and the vacuum equipment is disconnected or ventilation is provided between flipping operations, so that air will re-enter between the workpiece to be processed and the workpiece placement groove 101, thereby relieving the negative pressure environment between the workpiece to be processed and the workpiece placement groove 101, and then the blank material is flipped over.

[0091] It should be noted that the specific operation of performing vacuum treatment again can refer to step one above. The goal is to re-fix the blank material onto the quartz tooling through vacuum adsorption.

[0092] In some embodiments, the polycrystalline silicon semiconductor component includes a polycrystalline silicon electrode.

[0093] Fourthly, this application provides a method for processing a silicon electrode.

[0094] To further illustrate the application of the quartz tooling of this application in the processing of semiconductor components, this application, taking a silicon electrode as an example, also provides a method for processing a silicon electrode based on any of the quartz toolings in the first aspect of this application, and the method for processing the silicon electrode of this application includes the following steps: Step 1, Surface pretreatment of raw materials: A blank material for a silicon electrode is provided, and its surface is pretreated to make the surface of the blank material smooth.

[0095] It should be noted that the processing method of this application is applicable to various types of semiconductor components. Therefore, this application does not limit the specific type of semiconductor component; the appropriate semiconductor component can be selected according to actual needs. For example, in some embodiments, the semiconductor component includes any one of polycrystalline silicon semiconductor components, monocrystalline silicon semiconductor components, and silicon carbide semiconductor components.

[0096] This application does not limit the specific process of surface pretreatment, as long as it can achieve the effect of this application. For example, in some embodiments, the blank material after surface pretreatment meets the following conditions: the flatness of the blank material is <0.05mm, and the parallelism of the upper and lower surfaces is <0.05mm.

[0097] For example, in some embodiments, the blank material specifications are OD600mm×ID350mm×T25mm, and the surface pretreatment is achieved using a surface grinder. Here, OD stands for Outside Diameter, referring to the outer diameter of the blank material; ID stands for Inside Diameter, referring to the inner diameter of the blank material; and T stands for Thickness, referring to the wall thickness of the blank material.

[0098] Step 2, clamping and fixing the blank material: Using any of the quartz fixtures described in the first aspect of this application as clamping fixtures, the blank material is placed in the workpiece placement groove 101 of the fixture body 100, with the first surface of the blank material facing upwards; after alignment, the fourth vent 202 on the quartz fixture is connected to a vacuum pump to perform vacuum treatment on the quartz fixture, and the air between the blank material and the workpiece placement groove 101 flows through the first vent 102 and is discharged through the venting channel, so that the blank material is fixed on the quartz fixture by vacuum adsorption.

[0099] It should be noted that the clamping fixture used in this application is the quartz fixture of the first aspect of this application. Therefore, the clamping fixture used in the fifth aspect of this application also possesses all the beneficial effects brought by the quartz fixture of the first aspect of this application. Therefore, please refer to the beneficial effects of the first aspect, which will not be repeated here. Using the quartz fixture of this application as the clamping fixture and employing vacuum adsorption for clamping and fixing can eliminate the need for manual operations such as applying paraffin wax, dewaxing, and wiping clean. While simplifying the process flow, it also reduces human intervention, thereby improving the overall processing quality and contributing to the improvement of product quality stability.

[0100] This application does not limit the specific vacuuming process, as long as the air between the quartz fixture and the blank material can be removed to create a negative pressure environment, allowing the blank material to be fixed onto the quartz fixture through vacuum adsorption. For example, in some embodiments, the vacuuming process is carried out to a negative pressure ≤ -60 kPa.

[0101] This application takes into account that excessive negative pressure (exceeding -100 kPa) between the quartz tooling and the blank material may damage the surface of the blank material. Therefore, in some preferred embodiments, a vacuum process is performed to reduce the negative pressure to -60 kPa to -100 kPa. Based on the above solution, the blank material can be clamped and fixed without damaging it.

[0102] It should also be noted that before actually clamping and fixing the blank material, the product can be transferred to the equipment end by a transfer trolley so that the blank material can be clamped and fixed on the quartz tooling.

[0103] Step 3, Countersunk process: The blank material, which is vacuum-adsorbed and fixed on the quartz tooling, undergoes a countersinking process.

[0104] For example, this application uses a countersunk process to open a plurality of countersunk holes 301 in the circumferential direction of the blank material, and the silicon electrode 300 obtained by the countersunk process is as follows: Figure 6 As shown.

[0105] Step 4, machining of the first surface: The first surface of the blank material is processed according to actual needs.

[0106] For example, this application does not require removing the blank material after the countersunk process; the first surface can be directly processed, that is, the C-surface 302 of the blank material can be processed to form the shape shown below. Figure 7The C-side structure is shown. Based on the above solution, this application can directly process the C-side structure without transferring it after the countersunk process. Compared with the existing process, this reduces the number of processes and avoids the risk of damage and scrap during transportation. While further simplifying the process, it also improves the overall processing quality and the quality of the final silicon electrode.

[0107] Step 5, machining of the second surface: The blank material is flipped over so that the second surface, opposite to the first surface, faces upwards and placed in the workpiece placement slot 101 of the quartz fixture body 100. After alignment, the quartz fixture is vacuum-treated so that the blank material is re-fixed to the quartz fixture through vacuum adsorption. According to actual needs, the second surface of the blank material is processed to obtain the semiconductor component. It is understood that the connection between the quartz fixture and the vacuum equipment is disconnected or ventilation is provided between the flipping operations, allowing air to re-enter between the workpiece to be processed and the workpiece placement slot 101, thereby relieving the negative pressure environment between the workpiece to be processed and the workpiece placement slot 101, before the blank material is flipped over again.

[0108] It should be noted that the specific operation of performing vacuum treatment again can refer to step one above. The goal is to re-fix the blank material onto the quartz tooling through vacuum adsorption.

[0109] For example, this application processes the second surface of the blank material, namely the A surface 303 of the blank material, by flipping it over to form a shape as shown in the example. Figure 8 The structure of surface A is shown.

[0110] The silicon electrodes obtained by the processing method of this application are free of microcracks, surface defects, or residual impurities, and the products are undamaged, resulting in high processing quality. This also demonstrates that the processing method of this application can improve the yield of semiconductor components while shortening the process flow, which is conducive to promoting the large-scale production of semiconductor components.

[0111] Obviously, the above embodiments of this application are merely examples for clear illustration and are not intended to limit the implementation of this application. Those skilled in the art can make other variations or modifications based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the scope of protection claimed by this application.

Claims

1. A quartz tooling, characterized in that, It includes a tooling body (100) and an adsorption base plate (200) that can be detachably installed at the bottom of the tooling body (100); both the tooling body (100) and the adsorption base plate (200) are made of quartz. The upper surface of the tooling body (100) is provided with a workpiece placement groove (101), which is used to place the workpiece to be processed; At least one first vent hole (102) is provided in the workpiece placement groove (101). The first vent hole (102) extends from the upper surface of the tooling body (100) toward the lower surface of the tooling body (100) but does not penetrate the lower surface of the tooling body (100). A second vent hole (103) is provided on the lower surface of the tooling body (100). The second vent hole (103) extends from the lower surface of the tooling body (100) toward the upper surface of the tooling body (100) but does not penetrate the upper surface of the tooling body (100). The second vent hole (103) is connected to the first vent hole (102). The upper surface of the adsorption base plate (200) is provided with a third exhaust hole (201) corresponding to the second exhaust hole (103). The third exhaust hole (201) is used to communicate with the second exhaust hole (103), and the third exhaust hole (201) extends along the upper surface of the adsorption base plate (200) toward the lower surface of the adsorption base plate (200) but does not penetrate the lower surface of the adsorption base plate (200). The adsorption base plate (200) has a fourth exhaust hole (202) on its side. The fourth exhaust hole (202) is used to communicate with a vacuum pumping device, and the fourth exhaust hole (202) extends into the adsorption base plate (200) to communicate with the third exhaust hole (201). When the adsorption base plate (200) is installed at the bottom of the tooling body (100), the first exhaust hole (102), the second exhaust hole (103), the third exhaust hole (201) and the fourth exhaust hole (202) are connected in sequence to form an exhaust channel.

2. The quartz tooling according to claim 1, characterized in that, The tooling body (100) has a plurality of first mounting holes (104) along its thickness direction, and the adsorption base plate (200) has a second mounting hole (203) along its thickness direction. The plurality of second mounting holes (203) correspond one-to-one with the plurality of first mounting holes (104) and are used to achieve detachable connection through threaded fasteners.

3. The quartz tooling according to claim 2, characterized in that, The threaded fastener includes any one of screws and bolts.

4. The quartz tooling according to claim 1, characterized in that, The lower surface of the tooling body (100) is provided with a first sealing groove (105), which is located around the second vent hole (103). The upper surface of the adsorption base plate (200) is provided with a second sealing groove (204), which matches the first sealing groove (105) and forms a closed sealing cavity for placing the sealing ring.

5. The application of the quartz tooling according to any one of claims 1 to 4 in the processing of semiconductor components, characterized in that, The quartz fixture is used to clamp semiconductor components; The semiconductor components include any one of polycrystalline silicon semiconductor components, monocrystalline silicon semiconductor components, and silicon carbide semiconductor components.

6. A method for processing a semiconductor component, characterized in that, Includes the following steps: Using the quartz fixture described in any one of claims 1 to 4 as a clamping fixture, the blank material corresponding to the workpiece to be processed is placed in the workpiece placement groove (101) of the fixture body (100), and the first surface of the blank material is placed upward; after alignment, the fourth vent hole (202) on the quartz fixture is connected to a vacuum pump, and the quartz fixture is vacuumed. The air between the blank material and the workpiece placement groove (101) flows through the first vent hole (102) and is discharged through the venting channel, so that the blank material is fixed on the quartz fixture by vacuum adsorption. According to actual needs, the first surface of the blank material that is vacuum adsorbed and fixed on the quartz tooling is processed; The blank material is flipped over so that the second surface opposite to the first surface is facing up, and placed in the workpiece placement slot (101) of the tooling body (100). After alignment, the quartz tooling is vacuumed again so that the blank material is re-fixed on the quartz tooling through vacuum adsorption. According to actual needs, the second surface of the blank material is processed to obtain the semiconductor component.

7. The processing method according to claim 6, characterized in that, Vacuum treatment is performed until the negative pressure is ≤-60Kpa.

8. The processing method according to claim 6, characterized in that, Vacuum treatment is performed until the negative pressure is -60Kpa ~ -100Kpa.

9. The processing method according to claim 6, characterized in that, The semiconductor component includes a silicon electrode.

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