Heat dissipation module and vehicle

Abstract

The invention provides a heat dissipation module and a vehicle, and relates to the technical field of vehicles, the heat dissipation module comprises a direct cooling runner plate, a direct cooling bottom plate, a direct cooling cover plate and a hot end heat dissipation structure; a through groove in a runner shape is formed in the direct cooling runner plate, and the through groove penetrates through the hot end face and the cold end face, opposite to each other in the thickness direction, of the direct cooling runner plate; the direct-cooling bottom plate is connected with the hot end face of the direct-cooling runner plate, the direct-cooling cover plate is connected with the cold end face of the direct-cooling runner plate, and the direct-cooling bottom plate and the direct-cooling cover plate seal and cover the two sides of the through groove correspondingly so as to seal the through groove into a closed runner; the hot end heat dissipation structure is connected with the side face, away from the direct cooling runner plate, of the direct cooling bottom plate. In the heat dissipation module, as for the formation of the flow channel, only the through groove in the shape of the flow channel needs to be formed in the direct cooling flow channel plate basically, and the structure of the through groove formed in the plate is relatively simple and low in processing difficulty, so that the forming efficiency of the flow channel can be improved, and the processing cost is further reduced.

Description

Technical Field

[0001] This invention relates to the field of vehicle technology, and more specifically, to a heat dissipation module and a vehicle. Background Technology

[0002] As a refrigeration device, in-vehicle refrigerators can refrigerate or freeze beverages, food, and other items while driving, effectively enhancing the user's driving experience. To improve cooling efficiency, current in-vehicle refrigerators typically employ a combination of semiconductor refrigeration and refrigerant refrigeration in their heat dissipation modules. This means that both semiconductor and refrigerant cooling are activated simultaneously during operation to enhance overall heat dissipation efficiency. Refrigerant cooling relies on specific flow channels to allow refrigerant to flow and achieve efficient heat exchange.

[0003] However, in related technologies, such flow channels are often directly machined into the heat dissipation structure of the hot end of the heat dissipation module. However, since the flow channels often contain irregularly shaped areas such as bends and corners, it is difficult to process them directly in the heat dissipation structure, resulting in low processing efficiency and significantly increasing processing costs. Summary of the Invention

[0004] The problem this invention addresses is: how to reduce the processing cost of the flow channels in a heat dissipation module.

[0005] To address the above problems, the present invention provides a heat dissipation module and a vehicle.

[0006] In a first aspect, the present invention provides a heat dissipation module, including a direct cooling channel plate, a direct cooling base plate, a direct cooling cover plate, and a hot-end heat dissipation structure; the direct cooling channel plate has a channel-shaped groove, which respectively penetrates the hot-end end face and the cold-end end face of the direct cooling channel plate opposite to each other along the thickness direction; the direct cooling base plate is connected to the hot-end end face of the direct cooling channel plate, the direct cooling cover plate is connected to the cold-end end face of the direct cooling channel plate, and the direct cooling base plate and the direct cooling cover plate respectively cover both sides of the groove to close the groove into a closed channel; the hot-end heat dissipation structure is connected to the side of the direct cooling base plate away from the direct cooling channel plate.

[0007] Optionally, the direct cooling flow channel plate, the direct cooling base plate, and the direct cooling cover plate are respectively stamped and formed, and the direct cooling flow channel plate, the direct cooling base plate, and the direct cooling cover plate are welded in sequence.

[0008] Optionally, the hot-end heat dissipation structure includes a hot-end heat dissipation base plate and a hot-end heat dissipation rib plate. The hot-end heat dissipation base plate is attached to the side of the direct cooling base plate away from the direct cooling flow channel plate, and the hot-end heat dissipation rib plate is perpendicularly connected to the side of the hot-end heat dissipation base plate away from the direct cooling flow channel plate.

[0009] Optionally, multiple hot-end heat dissipation ribs are provided, and each of the multiple hot-end heat dissipation ribs is connected to the hot-end heat dissipation base plate and arranged in sequence at intervals. Hot-end heat dissipation fins are provided between two adjacent hot-end heat dissipation ribs.

[0010] Optionally, the hot-end heat dissipation fins include a plurality of hot-end heat dissipation sub-fins connected in sequence. The arrangement direction of the plurality of hot-end heat dissipation sub-fins is perpendicular to the hot-end heat dissipation base plate. The length direction of the hot-end heat dissipation sub-fins is parallel to the hot-end heat dissipation base plate, and each hot-end heat dissipation sub-fin extends in a continuously bent manner along the length direction.

[0011] Optionally, the heat dissipation module further includes a semiconductor and a cold-end heat dissipation structure. The semiconductor is located on the side of the direct cooling cover plate away from the direct cooling flow channel plate, and the cold-end heat dissipation structure is located on the side of the semiconductor away from the direct cooling cover plate. The cold-end heat dissipation structure is connected to the direct cooling cover plate by fasteners so that the semiconductor is clamped between the cold-end heat dissipation structure and the direct cooling cover plate.

[0012] Optionally, the cold end heat dissipation structure includes a cooling block and a cold end mounting plate. The cooling block is located on the side of the semiconductor away from the direct cooling cover plate. The cold end mounting plate is connected to the side of the cooling block away from the semiconductor. The cold end mounting plate is connected to the direct cooling cover plate by the fastener.

[0013] Optionally, the cold end heat dissipation structure further includes multiple cold end heat dissipation plates and multiple cold end heat dissipation fins. The cold end heat dissipation plates and the cold end heat dissipation fins are located on the side of the cold end mounting plate away from the cold conduction block. The cold end heat dissipation plates are arranged parallel to the cold end mounting plate, and the multiple cold end heat dissipation plates and the multiple cold end heat dissipation fins are arranged alternately in a direction perpendicular to the cold end mounting plate.

[0014] Optionally, the cold end heat dissipation fins include a plurality of cold end heat dissipation sub-fins connected in sequence. The arrangement direction of the plurality of cold end heat dissipation sub-fins is parallel to the cold end mounting plate. The length direction of the cold end heat dissipation sub-fins is parallel to the cold end mounting plate, and each cold end heat dissipation sub-fin extends in a continuously bent manner along the length direction.

[0015] Secondly, the present invention provides a vehicle including an in-vehicle refrigerator, the in-vehicle refrigerator including the heat dissipation module as described above.

[0016] The beneficial effects of the heat dissipation module of the present invention are as follows: the flow channel is formed by the direct cooling base plate and the direct cooling cover plate respectively sealing both sides of the through groove of the direct cooling flow channel plate. That is to say, the formation of the flow channel basically only requires forming a through groove in the shape of the flow channel in the direct cooling flow channel plate. Forming a through groove structure in the plate is usually relatively simple. For example, it can be integrally stamped during the stamping of the direct cooling flow channel plate, which reduces the processing difficulty and thus improves the forming efficiency of the flow channel, thereby reducing the manufacturing cost. At the same time, the hot end heat dissipation structure is connected to the side of the direct cooling base plate away from the direct cooling flow channel plate. That is, the hot end heat dissipation structure and the direct cooling base plate are not integrally formed. This ensures that the flow channel is independent of the hot end heat dissipation structure, which avoids the flow channel being integrated into the hot end heat dissipation structure, thus avoiding increasing its structural complexity and processing difficulty, thereby further reducing the manufacturing cost. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the heat dissipation module according to an embodiment of the present invention; Figure 2 This is an exploded view of the heat dissipation module according to an embodiment of the present invention; Figure 3 This is an exploded view of the heat dissipation structure at the hot end of the heat dissipation module in an embodiment of the present invention. Figure 4 for Figure 3 Enlarged schematic diagram of part A of the heat dissipation structure at the mid-heat end; Figure 5 This is an exploded view of the cold-end heat dissipation structure in the heat dissipation module of an embodiment of the present invention; Figure 6 for Figure 5 Enlarged schematic diagram of part B of the intercooler end heat dissipation structure.

[0018] Explanation of reference numerals in the attached figures: 1. Direct cooling flow channel plate; 11. Through slot; 2. Direct cooling base plate; 3. Direct cooling cover plate; 4. Hot end heat dissipation structure; 41. Hot end heat dissipation base plate; 42. Hot end heat dissipation rib; 43. Hot end heat dissipation fin; 431. Hot end heat dissipation sub-fin; 4311. First bonding section; 4312. Second bonding section; 4313. Transition section; 5. Semiconductor; 6. Cold end heat dissipation structure; 61. Cooling block; 62. Cold end mounting plate; 621. Flange; 63. Cold end heat dissipation plate; 64. Cold end heat dissipation fin; 641. Cold end heat dissipation sub-fin; 6411. First connecting section; 6412. Second connecting section; 6413. Intermediate section; 7. Refrigerant pipe; 8. Refrigerant valve. Detailed Implementation

[0019] To make the above-mentioned objects, features, and advantages of the present invention more apparent and understandable, specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. Although some embodiments of the present invention are shown in the drawings, it should be understood that the present invention can be implemented in various forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the present invention. It should be understood that the accompanying drawings and embodiments of the present invention are for illustrative purposes only and are not intended to limit the scope of protection of the present invention.

[0020] In the attached figures, the X-axis represents the front-to-back position, with the positive direction of the X-axis representing the front and the negative direction representing the rear. The Y-axis represents the left-to-right position, with the positive direction representing the left and the negative direction representing the right. The Z-axis represents the up-down position, with the positive direction representing the top and the negative direction representing the bottom. It should be noted that the aforementioned representations of the X, Y, and Z axes are for ease of description and simplification of the invention, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention.

[0021] The term "comprising" and its variations as used herein are open-ended, meaning "including but not limited to"; the term "based on" means "at least partially based on"; the term "one embodiment" means "at least one embodiment"; the term "another embodiment" means "at least one additional embodiment"; the term "some embodiments" means "at least some embodiments"; and the term "optionally" means "optional embodiments". Definitions of other terms will be given in the following description. It should be noted that the concepts of "first," "second," etc., mentioned in this invention are used only to distinguish different devices, modules, or units, and are not intended to limit the order of functions performed by these devices, modules, or units or their interdependencies.

[0022] It should be noted that the terms "one" and "more" used in this invention are illustrative rather than restrictive. Those skilled in the art should understand that, unless otherwise expressly indicated in the context, they should be understood as "one or more".

[0023] This invention provides a heat dissipation module and a vehicle, which will be described in detail below with reference to specific embodiments.

[0024] like Figure 1 and Figure 2As shown in the figure, a heat dissipation module provided by an embodiment of the present invention includes a direct cooling channel plate 1, a direct cooling base plate 2, a direct cooling cover plate 3, and a hot-end heat dissipation structure 4. The direct cooling channel plate 1 has a channel-shaped through groove 11, which passes through the hot-end end face and the cold-end end face of the direct cooling channel plate 1 opposite to each other along the thickness direction. The direct cooling base plate 2 is connected to the hot-end end face of the direct cooling channel plate 1, and the direct cooling cover plate 3 is connected to the cold-end end face of the direct cooling channel plate 1. The direct cooling base plate 2 and the direct cooling cover plate 3 respectively cover both sides of the through groove 11 to close the through groove 11 into a closed channel. The hot-end heat dissipation structure 4 is connected to the side of the direct cooling base plate 2 away from the direct cooling channel plate 1.

[0025] It should be noted that the direct cooling channel plate 1 has two opposite end faces along its thickness direction, namely a hot end face and a cold end face. The hot end face is used to transfer heat to the hot end heat dissipation structure 4 for heat dissipation, while the cold end face is used to transfer cold energy to the cold end heat dissipation structure 6, which then transfers the cold energy to the refrigerator liner to achieve refrigerator cooling. Specifically, the through groove 11 extends along its depth direction to both end faces (i.e., the hot end face and the cold end face) of the direct cooling channel plate 1 along its thickness direction. It is understandable that the through-slot 11 passes through the hot end face and the cold end face of the direct cooling flow channel plate 1 respectively. That is, the two through-ports of the through-slot 11 are located in the hot end face and the cold end face of the direct cooling flow channel plate 1 respectively. Therefore, by connecting the direct cooling base plate 2 to the hot end face of the direct cooling flow channel plate 1, it can be ensured that the direct cooling base plate 2 covers the through-port of the through-slot 11 at the hot end face. By connecting the direct cooling cover plate 3 to the cold end face of the direct cooling flow channel plate 1, it can be ensured that the direct cooling cover plate 3 covers the through-port of the through-slot 11 at the cold end face. Finally, the two through-ports of the through-slot 11 are covered respectively, that is, the through-slot 11 is closed into a closed flow channel for refrigerant flow. It should also be noted that the heat dissipation module also includes a refrigerant pipe 7 and a refrigerant valve 8. The refrigerant pipe 7 is connected to the direct cooling base plate 2 and communicates with the flow channel. The refrigerant valve 8 is located on the refrigerant pipe 7 and is used to control the refrigerant in the refrigerant pipe 7 to be delivered to the flow channel. When the refrigerant flows in the flow channel, it can exchange heat with the hot end heat dissipation structure 4 to achieve refrigerant cooling.

[0026] In this embodiment, the flow channel is formed by the direct cooling base plate 2 and the direct cooling cover plate 3 respectively sealing both sides of the through groove 11 of the direct cooling flow channel plate 1. That is to say, the formation of the flow channel basically only requires forming a through groove 11 in the shape of the flow channel in the direct cooling flow channel plate 1. Forming a through groove structure in the plate is usually relatively simple. For example, it can be integrally stamped during the stamping of the direct cooling flow channel plate 1, which has low processing difficulty and can improve the forming efficiency of the flow channel, thereby reducing processing costs. At the same time, the hot end heat dissipation structure 4 is connected to the side of the direct cooling base plate 2 away from the direct cooling flow channel plate 1. That is, the hot end heat dissipation structure 4 and the direct cooling base plate 2 are not integrally formed, which ensures that the flow channel is independent of the hot end heat dissipation structure 4. This can avoid the flow channel being integrated into the hot end heat dissipation structure 4 and increasing its structural complexity, which helps to reduce the processing difficulty of the hot end heat dissipation structure 4.

[0027] Optionally, such as Figure 1 and Figure 2 As shown, the direct cooling flow channel plate 1, the direct cooling base plate 2, and the direct cooling cover plate 3 are respectively stamped and formed, and the direct cooling flow channel plate 1, the direct cooling base plate 2, and the direct cooling cover plate 3 are welded in sequence.

[0028] It should be noted that, in addition to the through slot 11 in the direct cooling runner plate 1, the direct cooling runner plate 1, the direct cooling base plate 2, and the direct cooling cover plate 3 can also be provided with coaxial positioning holes, so as to achieve mutual positioning between the three plates when they are assembled. These through slots 11 and positioning holes can be integrally formed during the stamping of each plate. Specifically, the direct cooling runner plate 1, the direct cooling base plate 2, and the direct cooling cover plate 3 can be welded by brazing.

[0029] In this optional embodiment, the direct cooling flow channel plate 1, the direct cooling base plate 2, and the direct cooling cover plate 3 are formed by stamping. After stamping, the direct cooling flow channel plate 1, the direct cooling base plate 2, and the direct cooling cover plate 3 can be welded together to close the through groove 11 into a flow channel, avoiding the direct processing of the flow channel on the hot end heat dissipation structure 4. This process is efficient, facilitates rapid mass production, and reduces costs.

[0030] Optionally, such as Figure 3 As shown, the hot end heat dissipation structure 4 includes a hot end heat dissipation base plate 41 and a hot end heat dissipation rib plate 42. The hot end heat dissipation base plate 41 is attached to the side of the direct cooling base plate 2 away from the direct cooling flow channel plate 1, and the hot end heat dissipation rib plate 42 is perpendicularly connected to the side of the hot end heat dissipation base plate 41 away from the direct cooling flow channel plate 1.

[0031] Specifically, refer to Figure 2 and Figure 3The lower end face of the hot-end heat dissipation base plate 41 is attached to the upper end face of the direct-cooling base plate 2. In addition, the hot-end heat dissipation base plate 41 and the direct-cooling base plate 2 can be connected by welding methods such as brazing, and the hot-end heat dissipation rib plate 42 and the hot-end heat dissipation base plate 41 can also be connected by welding methods such as brazing.

[0032] Understandably, the base plate and ribs of traditional hot-end heat dissipation structures are often manufactured by extrusion, meaning the base plate and ribs are integrally formed profile structures through extrusion. However, such profile structures have high structural complexity, which significantly increases manufacturing difficulty. Therefore, in this optional embodiment, the hot-end heat dissipation structure 4 is divided into a connected hot-end heat dissipation base plate 41 and a hot-end heat dissipation rib plate 42. That is, the hot-end heat dissipation rib plate 42 and the hot-end heat dissipation base plate 41 are separate structures. In this way, the hot-end heat dissipation rib plate 42 and the hot-end heat dissipation base plate 41 can be formed into a whole by stamping and then welding them separately, avoiding the processing complexity caused by integral extrusion forming of the hot-end heat dissipation rib plate 42 and the hot-end heat dissipation base plate 41, thereby reducing manufacturing difficulty and cost.

[0033] Optionally, such as Figure 2 and Figure 3 As shown, multiple hot-end heat dissipation ribs 42 are provided, and the multiple hot-end heat dissipation ribs 42 are all connected to the hot-end heat dissipation base plate 41 and arranged in sequence at intervals. Hot-end heat dissipation fins 43 are provided between two adjacent hot-end heat dissipation ribs 42.

[0034] Specifically, refer to Figure 1 and Figure 3 Multiple hot-end heat dissipation fins 42 can be arranged in a direction parallel to the upper surface of the hot-end heat dissipation base plate 41 (i.e. Figure 1 The heat dissipation fins 43 are arranged sequentially at intervals along the Y-axis direction. Multiple heat dissipation fins 43 can also be provided. Multiple heat dissipation fins 43 are arranged sequentially at intervals along the direction parallel to the upper surface of the heat dissipation base plate 41 and are inserted between two adjacent heat dissipation ribs 42.

[0035] Understandably, in the past, after the base plate and ribs of the hot-end heat dissipation structure were integrally formed by extrusion, the spacing between the ribs was usually small, making it difficult to insert other structures. This meant that the hot-end heat dissipation structure could only dissipate heat through the ribs, resulting in a limited heat exchange area and poor heat dissipation efficiency. In view of this, the optional embodiment provides hot-end heat dissipation fins 43 between each pair of adjacent hot-end heat dissipation fins 42. This can effectively utilize the gap between the two hot-end heat dissipation fins 42, thereby increasing the heat exchange area and improving heat dissipation efficiency. In addition, since the hot-end heat dissipation fins 42 and the hot-end heat dissipation base plate 41 are separate structures, the spacing between the hot-end heat dissipation fins 42 can be adjusted according to the size of the hot-end heat dissipation fins 43 before being welded to the hot-end heat dissipation base plate 41, thus ensuring that the hot-end heat dissipation fins 43 can be smoothly inserted between the hot-end heat dissipation fins 42.

[0036] Optionally, such as Figure 4 As shown, the hot end heat dissipation fin 43 includes a plurality of hot end heat dissipation sub-fins 431 connected in sequence. The arrangement direction of the plurality of hot end heat dissipation sub-fins 431 is perpendicular to the hot end heat dissipation base plate 41. The length direction of the hot end heat dissipation sub-fins 431 is parallel to the hot end heat dissipation base plate 41, and each hot end heat dissipation sub-fin 431 extends in a continuously bent manner along the length direction.

[0037] Specifically, each hot-end heat dissipation sub-fin 431 includes multiple hot-end heat dissipation sub-fins 431, and the multiple hot-end heat dissipation sub-fins 431 are arranged sequentially and in the following direction (i.e. Figure 1 The Z-axis direction is perpendicular to the hot-end heat dissipation base plate 41, and the length direction of the hot-end heat dissipation sub-fins 431 (i.e., the Z-axis direction) ... Figure 1 The X-axis direction is parallel to the heat dissipation base plate 41 at the hot end.

[0038] In addition, the hot-end heat dissipation sub-fin 431 can be configured as a waveform structure, specifically including multiple first bonding sections 4311, multiple second bonding sections 4312, and multiple transition sections 4313. The multiple first bonding sections 4311 are bonded to an adjacent hot-end heat dissipation fin 42, and the multiple second bonding sections 4312 are bonded to another adjacent hot-end heat dissipation fin 42. The multiple first bonding sections 4311 and multiple second bonding sections 4312 are alternately arranged along the length direction of the hot-end heat dissipation sub-fin 431. The transition section 4313 connects the adjacent first bonding sections 4311 and second bonding sections 4312. In this way, the hot-end heat dissipation sub-fin 431 forms a waveform structure.

[0039] In this optional embodiment, by continuously bending and extending each of the hot-end heat dissipation sub-fins 431 along the length direction, the effective surface area of ​​the hot-end heat dissipation sub-fins 431 can be greatly increased in a limited space, allowing the outside air to have more sufficient contact with the hot-end heat dissipation sub-fins 431, further increasing the heat exchange area, and thus further improving the heat dissipation efficiency.

[0040] Optionally, such as Figure 2 and Figure 5 As shown, the heat dissipation module further includes a semiconductor 5 and a cold-end heat dissipation structure 6. The semiconductor 5 is located on the side of the direct cooling cover plate 3 away from the direct cooling flow channel plate 1, and the cold-end heat dissipation structure 6 is located on the side of the semiconductor 5 away from the direct cooling cover plate 3. The cold-end heat dissipation structure 6 is connected to the direct cooling cover plate 3 by fasteners so that the semiconductor 5 is clamped between the cold-end heat dissipation structure 6 and the direct cooling cover plate 3.

[0041] Semiconductor 5 is a component that includes both N-type and P-type conductors. The N-type and P-type conductors form a PN junction, thereby forming a thermocouple pair. When current flows through it, a Peltier effect is generated inside, which enables heat transfer. The end of semiconductor 5 facing the hot-end heat dissipation structure 4 is the hot end, which can dissipate heat through the hot-end heat dissipation structure 4. The end of semiconductor 5 facing the cold-end heat dissipation structure 6 is the cold end, which can cool down through the cold-end heat dissipation structure 6.

[0042] In this optional embodiment, the cold end heat dissipation structure 6 is connected to the direct cooling cover plate 3 by fasteners, so that the semiconductor 5 is clamped between the cold end heat dissipation structure 6 and the direct cooling cover plate 3, which enables the semiconductor 5 to be detachably installed in the heat dissipation module, thereby facilitating the quick replacement of the semiconductor 5 to adapt to different cooling needs.

[0043] Optionally, such as Figure 5 As shown, the cold end heat dissipation structure 6 includes a cold-conducting block 61 and a cold end mounting plate 62. The cold-conducting block 61 is located on the side of the semiconductor 5 away from the direct cooling cover plate 3. The cold end mounting plate 62 is connected to the side of the cold-conducting block 61 away from the semiconductor 5. The cold end mounting plate 62 is connected to the direct cooling cover plate 3 by the fastener.

[0044] Specifically, the cold end mounting plate 62 has flanges 621 formed at both ends along its width. The flanges 621 protrude from one side of the cooling block 61. Through holes can be formed in the flanges 621, through which fasteners pass and connect to the direct cooling cover plate 3, so that the cold end mounting plate 62 and the direct cooling cover plate 3 are indirectly connected. In addition, it should be noted that since the semiconductor 5 and the cooling block 61 are located between the direct cooling cover plate 3 and the cold end mounting plate 62, when the cold end mounting plate 62 is connected to the direct cooling cover plate 3 by fasteners, the semiconductor 5 and the cooling block 61 will be clamped between the direct cooling cover plate 3 and the cold end mounting plate 62, thus achieving a fixed connection.

[0045] Understandably, cold-end heat dissipation structures are often manufactured using extrusion, where the cooling block and mounting plate are integrally formed profiles through extrusion. However, such profiles have high structural complexity, significantly increasing manufacturing difficulty. Therefore, in this optional embodiment, the cold-end heat dissipation structure 6 is divided into a cooling block 61 and a cold-end mounting plate 62, which are connected and fixed only by clamping. This ensures that the cooling block 61 and the cold-end mounting plate 62 are separate structures. Thus, the cooling block 61 and the cold-end mounting plate 62 can be formed into a whole by stamping and then clamping them separately, avoiding the complex processing problems caused by integral extrusion of the cooling block 61 and the cold-end mounting plate 62, thereby reducing manufacturing difficulty and cost.

[0046] Optionally, such as Figure 2 and Figure 5 As shown, the cold end heat dissipation structure 6 also includes a plurality of cold end heat dissipation plates 63 and a plurality of cold end heat dissipation fins 64. The cold end heat dissipation plates 63 and the cold end heat dissipation fins 64 are located on the side of the cold end mounting plate 62 away from the cold conduction block 61. The cold end heat dissipation plates 63 are arranged parallel to the cold end mounting plate 62. The plurality of cold end heat dissipation plates 63 and the plurality of cold end heat dissipation fins 64 are arranged alternately in a direction perpendicular to the cold end mounting plate 62.

[0047] Specifically, refer to Figure 1 and Figure 5 The cold end mounting plate 62 and the multiple cold end heat dissipation plates 63 can be arranged in a direction perpendicular to the cold end mounting plate 62 (i.e., Figure 1 The cold-end heat dissipation fins 64 are arranged sequentially at intervals along the Z-axis direction. Multiple cold-end heat dissipation fins 64 can also be provided. These fins are arranged sequentially at intervals along a direction perpendicular to the cold-end mounting plate 62 and are correspondingly inserted between the cold-end mounting plate 62 and the cold-end heat dissipation plate 63, and between two adjacent cold-end heat dissipation plates 63. Specifically, the cold-end heat dissipation plate 63 and the cold-end heat dissipation fins 64 can be welded together, with the uppermost cold-end heat dissipation fin 64 then welded to the cold-end mounting plate 62.

[0048] In this optional embodiment, multiple cold-end heat dissipation plates 63 and multiple cold-end heat dissipation fins 64 are arranged alternately along a direction perpendicular to the cold-end mounting plate 62. This can effectively utilize the gap between the cold-end mounting plate 62 and the cold-end heat dissipation plates 63, as well as the gap between two adjacent cold-end heat dissipation plates 63, thereby increasing the heat exchange area and improving the cooling efficiency.

[0049] Optionally, such as Figure 6 As shown, the cold end heat dissipation fin 64 includes a plurality of cold end heat dissipation sub-fins 641 connected in sequence. The arrangement direction of the plurality of cold end heat dissipation sub-fins 641 is parallel to the cold end mounting plate 62. The length direction of the cold end heat dissipation sub-fins 641 is parallel to the cold end mounting plate 62, and each cold end heat dissipation sub-fin 641 extends in a continuous bent direction along the length direction.

[0050] Specifically, each cold-end heat dissipation fin 64 includes multiple cold-end heat dissipation sub-fins 641, which are arranged sequentially and in the following direction (i.e. Figure 1 The Y-axis direction is parallel to the cold end mounting plate 62, and the length direction of the cold end heat sink fins 641 (i.e., the Y-axis direction) is parallel to the cold end mounting plate 62, and the length direction of the cold end heat sink fins 641 is parallel to the Y-axis direction. Figure 1 The X-axis direction is parallel to the cold end mounting plate 62.

[0051] In addition, the cold end heat dissipation sub-fin 641 can be configured as a waveform structure, specifically including multiple first connecting segments 6411, multiple second connecting segments 6412, and multiple intermediate segments 6413. The multiple first connecting segments 6411 are attached to an adjacent cold end heat dissipation plate 63, and the multiple second connecting segments 6412 are attached to another adjacent cold end heat dissipation plate 63. The multiple first connecting segments 6411 and multiple second connecting segments 6412 are alternately arranged along the length direction of the cold end heat dissipation sub-fin 641. The intermediate segments 6413 are connected between adjacent first connecting segments 6411 and second connecting segments 6412. In this way, the cold end heat dissipation sub-fin 641 forms a waveform structure.

[0052] In this optional embodiment, by continuously bending and extending each cold-end heat dissipation sub-fin 641 of the cold-end heat dissipation fin 64 along the length direction, the effective surface area of ​​the cold-end heat dissipation sub-fin 641 can be greatly increased in a limited space, so that the air inside the refrigerator can have more sufficient contact with the cold-end heat dissipation sub-fin 641, further increasing the heat exchange area and thus further improving the cooling efficiency.

[0053] An embodiment of the present invention provides a vehicle including an in-vehicle refrigerator, the in-vehicle refrigerator including the heat dissipation module as described above.

[0054] In this embodiment, since the vehicle includes an in-vehicle refrigerator, and the in-vehicle refrigerator includes the aforementioned heat dissipation module, it possesses all the beneficial effects brought about by all embodiments of the aforementioned heat dissipation module, which will not be elaborated here.

[0055] While the present invention has been disclosed above, its scope of protection is not limited thereto. Those skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention, and all such changes and modifications will fall within the scope of protection of the present invention.

Claims

1. A heat dissipation module, characterized in that, The system includes a direct cooling channel plate (1), a direct cooling base plate (2), a direct cooling cover plate (3), and a hot-end heat dissipation structure (4). The direct cooling channel plate (1) has a channel-shaped groove (11) that passes through the hot end face and the cold end face of the direct cooling channel plate (1) along the thickness direction. The direct cooling base plate (2) is connected to the hot end face of the direct cooling channel plate (1), and the direct cooling cover plate (3) is connected to the cold end face of the direct cooling channel plate (1). The direct cooling base plate (2) and the direct cooling cover plate (3) respectively cover the two sides of the groove (11) to close the groove (11) into a closed channel. The hot-end heat dissipation structure (4) is connected to the side of the direct cooling base plate (2) away from the direct cooling channel plate (1).

2. The heat dissipation module according to claim 1, characterized in that, The direct cooling flow channel plate (1), the direct cooling base plate (2) and the direct cooling cover plate (3) are respectively stamped and formed, and the direct cooling flow channel plate (1), the direct cooling base plate (2) and the direct cooling cover plate (3) are welded in sequence.

3. The heat dissipation module according to claim 1, characterized in that, The hot end heat dissipation structure (4) includes a hot end heat dissipation base plate (41) and a hot end heat dissipation rib plate (42). The hot end heat dissipation base plate (41) is attached to the side of the direct cooling base plate (2) away from the direct cooling flow channel plate (1). The hot end heat dissipation rib plate (42) is perpendicularly connected to the side of the hot end heat dissipation base plate (41) away from the direct cooling flow channel plate (1).

4. The heat dissipation module according to claim 3, characterized in that, The hot end heat dissipation ribs (42) are provided in multiple ways. The multiple hot end heat dissipation ribs (42) are all connected to the hot end heat dissipation base plate (41) and arranged in sequence at intervals. Hot end heat dissipation fins (43) are provided between two adjacent hot end heat dissipation ribs (42).

5. The heat dissipation module according to claim 4, characterized in that, The hot end heat dissipation fins (43) include a plurality of hot end heat dissipation sub-fins (431) connected in sequence. The arrangement direction of the plurality of hot end heat dissipation sub-fins (431) is perpendicular to the hot end heat dissipation base plate (41). The length direction of the hot end heat dissipation sub-fins (431) is parallel to the hot end heat dissipation base plate (41), and each hot end heat dissipation sub-fin (431) extends in a continuous bent direction along the length direction.

6. The heat dissipation module according to claim 1, characterized in that, It also includes a semiconductor (5) and a cold end heat dissipation structure (6). The semiconductor (5) is located on the side of the direct cooling cover plate (3) away from the direct cooling flow channel plate (1). The cold end heat dissipation structure (6) is located on the side of the semiconductor (5) away from the direct cooling cover plate (3). The cold end heat dissipation structure (6) is connected to the direct cooling cover plate (3) by fasteners so that the semiconductor (5) is clamped between the cold end heat dissipation structure (6) and the direct cooling cover plate (3).

7. The heat dissipation module according to claim 6, characterized in that, The cold end heat dissipation structure (6) includes a cooling block (61) and a cold end mounting plate (62). The cooling block (61) is located on the side of the semiconductor (5) away from the direct cooling cover plate (3). The cold end mounting plate (62) is connected to the side of the cooling block (61) away from the semiconductor (5). The cold end mounting plate (62) is connected to the direct cooling cover plate (3) by the fastener.

8. The heat dissipation module according to claim 7, characterized in that, The cold end heat dissipation structure (6) further includes multiple cold end heat dissipation plates (63) and multiple cold end heat dissipation fins (64). The cold end heat dissipation plates (63) and the cold end heat dissipation fins (64) are located on the side of the cold end mounting plate (62) away from the cooling block (61). The cold end heat dissipation plates (63) are arranged parallel to the cold end mounting plate (62). The multiple cold end heat dissipation plates (63) and the multiple cold end heat dissipation fins (64) are arranged alternately in a direction perpendicular to the cold end mounting plate (62).

9. The heat dissipation module according to claim 8, characterized in that, The cold end heat dissipation fins (64) include a plurality of cold end heat dissipation sub-fins (641) connected in sequence. The arrangement direction of the plurality of cold end heat dissipation sub-fins (641) is parallel to the cold end mounting plate (62). The length direction of the cold end heat dissipation sub-fins (641) is parallel to the cold end mounting plate (62), and each cold end heat dissipation sub-fin (641) extends in a continuous bent direction along the length direction.

10. A vehicle, characterized in that, The vehicle refrigerator includes a heat dissipation module as described in any one of claims 1-9.

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