Resistor and manufacturing method thereof

Abstract

The invention provides a resistor and a manufacturing method thereof, which are mainly characterized in that two ends of a resistor body of the resistor are concavely provided with accommodating grooves, and electrode materials are arranged in the accommodating grooves and are electrically connected with the resistor body; therefore, the volume of the electrode material protruding out of the surface of the resistor body can be greatly reduced, the space occupied by the whole manufactured resistor can be relatively reduced, an electronic circuit is effectively miniaturized, and the practical power and characteristics are increased in overall implementation and use.

Description

Technical Field

[0001] This invention relates to a resistor and its manufacturing method, particularly to a method that can significantly reduce the volume of electrode material protruding from the surface of the resistor, thereby reducing the overall space occupied by the finished resistor, effectively miniaturizing electronic circuits, and increasing practical power and performance in its overall application. Background Technology

[0002] Note: With the rapid development of economy and technology, the market is flooded with various types of electronic products to meet people's various needs in life; with the ever-changing research and development, all types of electronic products now emphasize miniaturization and multi-functionality, which requires the use of smaller electronic components in order to integrate more electronic components into electronic products to meet people's different needs.

[0003] Among them, the resistor element is commonly used in various types of electronic products. The resistor element mainly has a resistive body, and electrodes are provided at both ends of the resistive body. The electrodes are electrically connected to the resistive body, so that when it is installed on the circuit, the electrodes at both ends can be used to connect to the carrier circuit or other electronic components.

[0004] However, although the aforementioned resistor element can achieve the expected effect of being placed on the circuit and electrically connected to other electronic components, it has been found in its actual use that, because the resistor element has electrodes directly connected to both ends of the resistor body, the electrodes are stacked outside the resistor body, which makes it impossible to effectively reduce the overall volume and thickness of the resistor element, and consequently, the space occupied by the resistor element cannot be reduced, so there is still room for improvement in its overall structural design.

[0005] Given the current trend in consumer electronics towards lighter, thinner, shorter, and smaller designs, to meet these design requirements, the internal electronic components of these products must either increase their power handling capacity within their original dimensions or, for the same power, reduce their size to comply with the design requirements of consumer electronics.

[0006] In light of this, and drawing upon years of extensive design, development, and manufacturing experience in the relevant industry, the inventor has further researched and improved upon existing methods to address shortcomings, providing a resistor and its manufacturing method to achieve greater practical value. Summary of the Invention

[0007] The main objective of this invention is to provide a resistor and its manufacturing method, which can significantly reduce the volume of electrode material protruding from the surface of the resistor, thereby reducing the space occupied by the finished resistor, effectively miniaturizing electronic circuits, and increasing practical power and performance in its overall application.

[0008] The main objective and effect of the resistor manufacturing method of the present invention are achieved by the following specific technical means:

[0009] It mainly includes the following steps:

[0010] Processing receiving grooves: receiving grooves are formed at intervals on the upper end face of the resistor;

[0011] Formed electrodes: Electrode material is disposed in each receiving groove formed by the resistive body, so that the electrode material is electrically connected to the resistive body in the receiving groove.

[0012] Pelletizing: The resistive body is cut at the middle position of the electrode material electrically connected in the receiving groove, so that the resistive body is cut into several resistors with electrode material electrically connected at both ends.

[0013] In a preferred embodiment of the resistor manufacturing method of the present invention, in the step of processing the receiving groove, the receiving groove is formed on the upper end face of the resistor body by mechanical processing.

[0014] In a preferred embodiment of the resistor manufacturing method of the present invention, a masking process may be performed before the processing of the receiving groove step, wherein a masking material is spaced over the upper end face of the resistor body, so that the resistor body can be etched during the processing of the receiving groove step to form a plurality of receiving grooves at the position on the upper end face of the resistor body where the masking material is not covered. Then, after the electrode forming step, a masking material removal step is performed to remove the masking material covering the upper end face of the resistor body.

[0015] In a preferred embodiment of the resistor manufacturing method of the present invention, the shielding material is either a dry film photoresist or an adhesive tape.

[0016] In a preferred embodiment of the resistor manufacturing method of the present invention, in the electrode forming step, the electrode material is disposed in each receiving groove formed by the resistor body by any one of casting, electroplating, or metal printing.

[0017] In a preferred embodiment of the resistor manufacturing method of the present invention, the electrode material is copper (Cu).

[0018] The main objective and effect of the resistor of this invention are achieved by the following specific technical means:

[0019] Its main purpose is to make the resistor include a resistive element and electrode material; wherein:

[0020] The resistor has recessed grooves at both ends, and electrode material is provided in the grooves and electrically connected to the resistor.

[0021] In a preferred embodiment of the resistor of the present invention, the electrode material is copper (Cu). Attached Figure Description

[0022] Figure 1 : A schematic diagram of the manufacturing process of this invention;

[0023] Figure 2 : A schematic diagram of the manufacturing steps of this invention (I);

[0024] Figure 3 : Schematic diagram of the manufacturing steps of the present invention (II);

[0025] Figure 4 : Schematic diagram of the manufacturing steps of the present invention (III);

[0026] Figure 5 : Schematic diagram of the manufacturing steps of the present invention (IV);

[0027] Figure 6 : A schematic diagram of the manufacturing process of another embodiment of the present invention;

[0028] Figure 7 Another embodiment of the present invention is illustrated in the manufacturing steps (I).

[0029] Figure 8 Another embodiment of the present invention is illustrated in the manufacturing steps (II).

[0030] Figure 9 Another embodiment of the present invention, manufacturing steps (III);

[0031] Figure 10 Another embodiment of the present invention is illustrated in manufacturing steps (IV);

[0032] Figure 11 Another embodiment of the present invention is illustrated in manufacturing steps (V);

[0033] Figure 12 : Another embodiment of the manufacturing process of the present invention (VI).

[0034] Attached icon number

[0035] 1: Resistor

[0036] 11: Receiving slot

[0037] 2: Electrode materials

[0038] 3: Resistors

[0039] 4: Covering material

[0040] A: Processing accommodating tank

[0041] B: Shaped electrode

[0042] C: Dicing

[0043] A1: Masking Processing

[0044] A2: Remove the masking material Detailed Implementation

[0045] To provide a more complete and clear disclosure of the technical content, inventive purpose, and effects achieved by this invention, a detailed description is provided below, along with reference to the accompanying drawings and figure numbers:

[0046] First, please refer to Figure 1 The manufacturing process diagram of this invention is shown. This invention mainly comprises the following steps:

[0047] A. Machining the receiving groove: This is related to resistor 1 (please refer to the previous section as well). Figure 2 The manufacturing process of this invention is illustrated in the schematic diagram (I). An accommodating groove 11 is formed at intervals on the upper end surface (please refer to the diagram again). Figure 3 The manufacturing steps of the present invention are shown in the second schematic diagram. The accommodating groove 11 can be formed by machining.

[0048] B. Formed electrodes: Electrode material 2 is provided in each receiving groove 11 formed by the resistive body 1 (please refer to the previous section as well). Figure 4 The manufacturing steps of the present invention are shown in (III). The electrode material 2 is electrically connected to the resistor 1 in the receiving groove 11 by any one of electroplating, casting or metal printing. The electrode material 2 can be copper Cu.

[0049] C. Pelletizing: The resistor 1 is cut at the middle position of the electrode material 2 electrically connected to the receiving groove 11, so that the resistor 1 is cut into several resistors 3 with the electrode material 2 electrically connected at both ends (please refer to the previous section). Figure 5 The manufacturing steps of this invention are shown in schematic diagram (IV).

[0050] When the receiving groove 11 is to be formed on the upper surface of the resistor 1 by etching, it is necessary to first cover the resistor 1 with any kind of masking material such as dry film photoresist or adhesive tape, and then remove the masking material such as dry film photoresist or adhesive tape after the electrode is formed. Please refer to [further details needed]. Figure 6 Another embodiment of the present invention is shown in the manufacturing process diagram, and its steps are as follows:

[0051] A1. Shielding process: This is applied to resistor 1 (please refer to the following document as well). Figure 7Another embodiment of the present invention is shown in the manufacturing steps (I). The upper surface is covered with a shielding material 4 at intervals (please refer to the diagram again). Figure 8 Another embodiment of the present invention is shown in the manufacturing steps (II). The masking material 4 can be any one of dry film photoresist, tape, etc.

[0052] A. Machining the receiving grooves: Etching is performed on the resistor 1 to form multiple receiving grooves 11 at the locations on the upper surface of the resistor 1 where the shielding material 4 is not covered (please refer to the previous section). Figure 9 Another embodiment of the present invention is shown in the manufacturing steps diagram (III);

[0053] B. Molded Electrode: The electrode material 2 is cast into each receiving groove 11 formed by the resistive body 1 (please refer to the previous section as well). Figure 10 Another embodiment of the present invention is shown in the manufacturing steps (fourth diagram). The electrode material 2 can be copper Cu, so that the electrode material 2 and the resistor 1 are electrically connected in the receiving groove 11.

[0054] A2. Removal of the shielding material: Remove the shielding material 4 covering the upper surface of the resistor 1 (please refer to the following document for further details). Figure 11 Another embodiment of the present invention is shown in the manufacturing steps diagram (V);

[0055] C. Pelletizing: The resistor 1 is cut at the middle position of the electrode material 2 electrically connected to the receiving groove 11, that is, the resistor 1 can be cut to form several resistors 3 with electrode material 2 electrically connected at both ends (please refer to the previous section). Figure 12 Another embodiment of the present invention is shown in a schematic diagram of the manufacturing steps (six).

[0056] In this way, the present invention can be used by coating a protective layer on the outside of the resistor 3 and placing the resistor 3 on the electronic circuit. The electrode material 2 in the receiving groove 11 at both ends of the resistor body 1 is connected to other electronic components. Since the electrode material 2 is electrically connected to the resistor body 1 through the receiving groove 11, the resistor 3 connected to other electronic components can achieve its resistive function.

[0057] Based on the above description of the structure and usage of the present invention, it can be seen that the present invention has the following advantages compared with the existing structure:

[0058] 1. The present invention mainly provides electrode material in the recessed receiving grooves at both ends of the resistor, so that the electrode material is electrically connected to the receiving groove and the resistor, which can greatly reduce the volume of the electrode material protruding from the surface of the resistor, thereby reducing the space occupied by the finished resistor and effectively miniaturizing the electronic circuit.

[0059] 2. The resistor of the present invention has electrode material disposed in the recessed receiving grooves at both ends of the resistor body. This configuration allows the resistor body to have a larger cross-sectional area, so it can withstand a larger power without overheating and being damaged.

[0060] However, the foregoing embodiments or figures are not intended to limit the product structure or usage of the present invention. Any appropriate changes or modifications made by those skilled in the art should be considered as not departing from the patent scope of the present invention.

[0061] In summary, the embodiments of the present invention can indeed achieve the expected effects, and the specific structure disclosed therein has not only never been seen in similar products, but has also not been disclosed before the application, thus fully complying with the provisions and requirements of the Patent Law, and thus an application for an invention patent is filed.

Claims

1. A method for manufacturing a resistor, characterized in that, include: Processing receiving grooves: receiving grooves are formed at intervals on the upper end face of the resistor; Formed electrodes: Electrode material is disposed in each receiving groove formed by the resistive body, so that the electrode material is electrically connected to the resistive body in the receiving groove. Pelletizing: The resistive body is cut at the middle position of the electrode material electrically connected in the receiving groove, so that the resistive body is cut into several resistors with electrode material electrically connected at both ends.

2. The resistor manufacturing method as described in claim 1, characterized in that, In the process of processing the receiving groove, the receiving groove is formed on the upper end face of the resistor by mechanical processing.

3. The resistor manufacturing method as described in claim 1, characterized in that, Before the processing of the receiving groove step, a masking processing step is further performed, in which a masking material is spaced over the upper end face of the resistor, so that the resistor can be etched during the processing of the receiving groove step to form multiple receiving grooves in the position where the upper end face of the resistor is not covered by the masking material. Then, after the electrode forming step, a masking material removal step is performed to remove the masking material covering the upper end face of the resistor.

4. The resistor manufacturing method as described in claim 3, characterized in that, The masking material can be either dry film photoresist or adhesive tape.

5. The resistor manufacturing method as described in claim 1, characterized in that, In the electrode forming step, the electrode material is disposed in each receiving groove formed by the resistive body by electroplating, casting, or metal printing.

6. The resistor manufacturing method as described in claim 1 or 5, characterized in that, The electrode material is copper.

7. A resistor comprising a resistive element and an electrode material; characterized in that: The resistor has recessed grooves at both ends, and electrode material is provided in the grooves and electrically connected to the resistor.

8. The resistor as claimed in claim 7, characterized in that, The electrode material is copper.

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