Ion guide and method of manufacturing ion guide
By using solid RF electrodes and a gap design in the ion guide, combined with deflectors and guide electrodes, the problems of surface charging and heat generation on printed circuit boards are solved, achieving high-resolution ion mobility separation and simplifying manufacturing, thus improving the accuracy and efficiency of analytical instruments.
Patent Information
- Application Number
- CN202511512355.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2024-10-24
- Filing Date
- 2025-10-22
- Publication Date
- 2026-04-24
AI Technical Summary
Existing ion directors suffer from surface charging interference with analysis results and PCB overheating and degassing when using printed circuit boards, leading to decreased accuracy of the analytical instrument and complex and time-consuming manufacturing process.
Employing a solid RF electrode and a gap design on the printed circuit board surface, an ion channel is formed in the gap through the RF electrode. Combined with the deflector section and the guide electrode, a switchable meandering path is provided, reducing surface exposure and heat generation.
It achieves high-resolution ion mobility separation, reduces surface charging interference and heat generation, simplifies the manufacturing process, and improves the accuracy and efficiency of analytical instruments.
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Figure CN121922559A_ABST
Abstract
Description
Technical Field
[0001] This disclosure relates to an ion director and a method for manufacturing an ion director. Background Technology
[0002] Ion directors are used in various analytical instrument systems, including mass spectrometry systems, to manipulate and control the movement of ions. For example, ion directors are commonly used to guide ions from an ion source to an analyzer.
[0003] Certain types of ion directors (such as traveling wave ion directors) use a controlled electric field to separate ions based on their mobility in a gas. This can provide additional separation and / or characterization of ions before they reach a mass analyzer.
[0004] In drift-based ion mobility separators, an electric field forces ions along a gas-filled ion path. This acceleration is resisted by collisions with the buffer gas, and ions with different mobilities reach different equilibrium velocities and separate, arriving at the ends of the path at different times. The resolution of this separation process increases with the square root of the ion guide length, meaning that high-resolution separators typically use very long ion paths. In commercial instruments, the length of a linear drift tube is generally limited to about 1 meter. Achieving wider separations often requires folding complex paths into relatively small 2D planes or 3D volumes.
[0005] Many high-resolution ion migration techniques exist that utilize complex pathways. For example, trap-ion mobility spectrometers can be implemented, such as those described in US7838826, US9281170, US9891194, and US10458944. There are also circulating ion migration devices that implement traveling waves, such as those described in US9552969 and US10903062. Helical tube ion migration devices also exist, such as those described in GB2447330 and US11373850. However, due to their essentially three-dimensional geometry, all these devices utilize a large number of discrete electrodes (some of which are very complex in shape or arrangement). This means that the device or apparatus design can only be used for limited purposes (with less flexibility for other purposes), is complex and time-consuming to manufacture, typically requires specialized production techniques, and may require a significant amount of manpower.
[0006] An example of an ion mobility separator utilizing a 2D plane including a folded path ion mobility separator is a SLIM (Simple Linear Ion Manipulation Structure) ion director, which may have the type described in US8835839B1, US9812311B2, and US11209393B2. These SLIM ion directors use a sandwich printed circuit board (PCB) structure with a printed array of radio frequency (RF) electrodes and direct current (DC) electrodes, the printed array of which is formed to be mountable on a relatively small surface (e.g., approximately 1m²). 2 A meandering channel of approximately 10 m along a path within the region. Traveling waves (described, for example, in US6894286B2 and US6794641B2) are typically used to drive ions because maintaining a DC gradient over such a length would produce a very high terminal potential. Beam switching, for example, as described in US10,804,089B2, can be implemented in combination with a SLIM ion guide to allow for switchable paths that can, for example, bypass long-mobility separators. This can be advantageous when the device is integrated into a mass spectrometer. SLIM devices offer high resolution and use relatively simple mechanical and electronic components, thus possessing high practical value.
[0007] In SLIM ion directors, the RF and DC electrodes are typically implemented through metallization of the PCB board. However, this (compared to discrete electrode-based techniques, which provide sufficient shielding for the dielectric surface where the discrete electrodes are arranged) results in a significant portion of the PCB surface being directly exposed to ions. This exposure can lead to surface charging of the PCB, which may (e.g., due to space charge effects) interfere with results, thereby reducing the accuracy of analytical instruments utilizing SLIM ion directors. Furthermore, placing the RF electrodes directly on the PCB material can increase dielectric losses due to RF dissipation within the PCB material, potentially leading to PCB heating and degassing. Degassing can also result in undesirable ion-molecule reactions, which may affect the analytical results obtained by analytical instruments implementing SLIM ion directors.
[0008] Therefore, there is a need for an ion director that can overcome these problems and a method for manufacturing such an ion director. Summary of the Invention
[0009] Against this backdrop, an ion director, an ion mobility separator including an ion director, an analytical instrument including an ion director, and a method for manufacturing an ion director are provided. Additional aspects of the invention are described in the specification and claims.
[0010] According to a first aspect, an ion guide extending longitudinally between a first end and a second end is provided, the ion guide comprising:
[0011] A first surface and a second surface, wherein the second surface is opposite to the first surface and there is a gap between the first surface and the second surface;
[0012] The first plurality of RF electrodes extend longitudinally between a first end and a second end of the ion guide.
[0013] The first plurality of RF electrodes includes a first arrangement of RF electrodes mechanically coupled to a first surface, the first arrangement of RF electrodes being positioned above the first surface and opposite to a second surface to define a first ion channel in the gap.
[0014] The first plurality of RF electrodes are configured to receive at least two phases of RF voltage and generate an RF oscillation potential that suppresses ions from approaching the first surface;
[0015] The first ion channel includes a guiding portion, wherein the guiding portion includes a first arrangement of guiding electrodes on a first surface.
[0016] The first arrangement of the guiding electrodes is configured to generate a guiding potential that guides ions along a first direction from the first end of the ion guide toward the second end, and
[0017] The first ion channel includes a deflector portion, wherein in a first operating mode, the deflector portion is configured to suppress the movement of ions along a first direction.
[0018] By employing an RF electrode that extends along the length of the ion guide along with the deflector section, a switchable, meandering ion path can be created, for example, for use in ion migration devices. Therefore, such an ion guide arrangement can provide a long, switchable ion travel path using relatively simple electrode shapes. This method also allows for the fabrication of finer ion guide structures.
[0019] In some examples, suppressing the movement of ions along the first direction may include deflecting the movement of ions away from the first direction.
[0020] The RF electrode can be a solid electrode (i.e., a non-printed electrode), and the first and second surfaces can each comprise a printed circuit board (PCB) surface. Therefore, the resulting structure can exhibit reduced heat generation and degassing of the PCB because the RF electrode is a solid electrode rather than a printed electrode on the PCB. Furthermore, such an arrangement can limit, reduce, or avoid surface charging that might affect the accuracy of the results, since the PCB surface is recessed relative to the ion channels.
[0021] The first plurality of RF electrodes may further include a second arrangement of RF electrodes mechanically coupled to a second surface, wherein the first arrangement and the second arrangement of RF electrodes are positioned above corresponding surfaces opposite each other to define a first ion channel in the gap. Therefore, the RF oscillation potential can suppress ion access to either the first or the second surface. In this case, the ion guide (particularly the guiding portion) may further include a second arrangement of guiding electrodes disposed on the second surface.
[0022] In another example, the second surface (e.g., a printed circuit board or metal plate) can be configured to receive a delayed DC voltage. Therefore, ions can be pressed against a quasi-potential provided by the RF electrodes and can be propelled through the ion guide by a guiding portion (e.g., by a traveling wave applied to the electrodes of the guiding portion). In this case, the second arrangement of guiding electrodes may be absent.
[0023] The ion director may also include a second plurality of RF electrodes extending transversely to the first direction. Therefore, more sophisticated ion directors can be manufactured while still employing relatively simple manufacturing methods.
[0024] Optionally, the deflector portion may include a first deflector portion and a second deflector portion, the first deflector portion including one or more deflector electrodes on a first surface, and the second deflector portion including one or more deflector electrodes on a second surface, wherein the deflector electrodes (i.e., one or more deflector electrodes on the first and second surfaces) are configured to generate a potential barrier to suppress ion movement along a first direction. In some embodiments, the deflector electrodes may be configured to receive an RF voltage and / or a DC voltage to generate a potential barrier.
[0025] In another specific implementation, in the second operating mode, the deflector electrodes are configured to allow ions to continue along their trajectory (in other words, without deflection). Therefore, the deflector electrodes can selectively allow ions to deflect or not deflect. This provides finer control over the ion trajectory within the ion guide.
[0026] The ion director may also include a second ion channel that is adjacent to and spaced apart from the first ion channel in a second direction transverse to the first direction. Providing a second ion channel as a potential alternative ion path allows the ion director to be used in a wider variety of environments. For example, the ion director can provide a meandering ion path over a relatively small area, which can make it particularly suitable for ion mobility separation.
[0027] Optionally, when operating in the first mode, the deflector portion can be configured to deflect ions from the first ion channel toward the second ion channel. Thus, the ion guide can be used to provide an elongated ion path, which can be optional. An elongated ion path can be useful for purposes such as ion mobility separation.
[0028] In some embodiments, the second ion channel may be provided by a second plurality of RF electrodes extending longitudinally between a first end and a second end of the ion guide, wherein the second plurality of RF electrodes includes a third arrangement of RF electrodes mechanically coupled to a first surface, and optionally a fourth arrangement of RF electrodes mechanically coupled to a second surface. The third arrangement of RF electrodes is positioned above the first surface and opposite the second surface, which optionally has the fourth arrangement of RF electrodes positioned thereon to define the second ion channel in the gap. In this case, the second ion channel may include a second guiding portion, wherein the second guiding portion includes a third arrangement of guiding electrodes on the first surface, and optionally a fourth arrangement of guiding electrodes on the second surface, wherein the third arrangement and optionally the fourth arrangement of guiding electrodes are configured to generate a guiding potential that guides ions in a third direction from the second end of the ion guide toward the first end.
[0029] In other words, the second plurality of RF electrodes, the second guiding portion, and the second ion channel can be arranged in the same (or similar) manner as the first plurality of electrodes, the first guiding portion, and the first ion channel. This simplifies the construction of ion directors that include elongated ion paths.
[0030] Optionally, the deflector section can be configured such that the generated potential barrier deflects the ion at 90 degrees relative to its ion path. That is, the deflector section not only inhibits the movement of the ion along the first direction but also deflects the ion from its previous ion path. This can be used to control or guide the ion trajectory.
[0031] In some implementations, at least one electrode of the first deflector portion and at least one electrode of the second deflector portion may each be defined at a leading edge extending in a direction transverse to the first direction. This can provide a simple way to deflect ions and / or suppress ion movement along the first direction using a relatively simple ion guide construction.
[0032] Optionally, the leading edge of each of the at least one deflector electrodes may extend in a direction transverse to the first direction, such that the leading edge of each of the at least one deflector electrode is at a 90-degree angle relative to the first direction. This can more effectively suppress the movement of ions in the first direction. Therefore, the deflector portion can be configured, for example, to trap ions in a portion of an ion guide.
[0033] In another specific embodiment, the leading edge of each of the at least one deflector electrodes may extend partially in a direction transverse to the first direction and partially in the first direction, such that the leading edge of each of the at least one deflector electrodes extends at an angle relative to the first direction. The angle may be a simple way to deflect ions and / or suppress the movement of ions along the first direction.
[0034] The tilt angle can be selected to provide a specific ion deflection and can be tuned. For example, at least one deflector electrode can be movable, allowing the leading edge to be adjusted to provide different ion deflections. The movement of the deflector electrode and / or the adjustment of the leading edge can be controlled by a controller configured to operate the ion guide.
[0035] The tilt angle can preferably be approximately 45 degrees relative to the first direction. Therefore, ion movement in the first direction can be completely or largely suppressed. This allows ions to be effectively deflected from the first channel toward a second channel spaced apart from the first channel.
[0036] In some examples, the leading edge of each of at least one deflector electrode can be formed from multiple deflector electrodes. This allows for a simplified construction of ion directors capable of deflecting ions. For example, the multiple deflector electrodes can be elongated electrodes and / or planar electrodes (e.g., PCB electrodes), which are easier to fabricate compared to other electrode shapes or solid electrodes. For example, this construction can be simpler than implementing an ion director with electrodes configured to provide a helical ion path.
[0037] In yet another embodiment, the deflector electrode may include a planar electrode in the plane of the first surface and the plane of the second surface. Optionally, the deflector electrode may include one or more electrodes printed on the first surface and one or more electrodes printed on the second surface. Either of these allows the ion director to be manufactured in a relatively simple manner (e.g., without requiring specialized electrode fabrication).
[0038] In some implementations, the deflector portion can be positioned at one end of the first ion channel. This allows for an optional elongated ion path and can be provided in a simple manner. In other examples, the deflector portion can be positioned at another location within the first ion channel.
[0039] In some examples, the deflector portion can be positioned at the junction between the first and second ion channels. This allows ions to be efficiently deflected from the first ion channel to the second ion channel.
[0040] In another specific embodiment, the deflector portion may include an external protective electrode having an arcuate cross-section, and the guiding electrode of the deflector portion may be shaped or arranged to at least partially conform to the arc of the external protective electrode. This arrangement of the electrodes in the deflector portion allows for more effective suppression of ion movement along a first direction and allows for the guidance of ions to another trajectory. For example, this arrangement of the electrodes allows ions to be guided to an antiparallel trajectory over a relatively short distance.
[0041] Optionally, the first ion channel may further include a protective portion comprising a first arrangement of protective electrodes at least partially surrounding a first plurality of RF electrodes on a first surface and a second arrangement of protective electrodes at least partially surrounding a second plurality of RF electrodes on a second surface, wherein the protective electrodes are configured to receive a voltage to confine ions within the ion channel. Thus, a relatively simple ion configuration can be used to confine ions to the first ion channel.
[0042] In some examples, a first arrangement of RF electrodes may be mechanically coupled to a first surface via a first plurality of spacers, the spacers being spaced apart and configured to define a gap between the first surface and the first arrangement of RF electrodes; and / or a second arrangement of RF electrodes may be mechanically coupled to a second surface via a second plurality of spacers, the spacers being spaced apart and configured to define a gap between the second surface and the second arrangement of RF electrodes. This can help reduce, limit, or avoid charging on the dielectric surface to which the RF electrodes are coupled, since the RF electrodes are spaced apart from the surface by spacers. Furthermore, since the contact between the first and second surfaces and the corresponding first and second arrangements of RF electrodes can be limited, reduced, or minimized, heat generation on the first and second surfaces can be further reduced, limited, or minimized.
[0043] In some examples, the first and / or second arrangement of the RF electrodes may include planar electrodes. Therefore, the ion director manufacturing process can be relatively simple.
[0044] Optionally, the ion director may also include a bypass channel at a first end of the ion director, the bypass channel extending in a direction transverse to the first direction and including an additional guiding electrode configured to generate a guiding potential to cause ions to move in the transverse direction. This allows for the optional avoidance of elongated ion paths, thereby allowing the ion director to be used in a wider range of environments.
[0045] In some examples, a portion of the deflector section may be positioned at the junction between the first ion channel and the bypass channel, and may be configured to deflect ions into the first channel when operating in a first mode, and allow ions to continue traveling laterally through the bypass channel when operating in a second mode. This can be a simple ion guide arrangement that allows optional bypassing of elongated ion paths.
[0046] In some examples, additional guiding electrodes may include one or more additional guiding electrodes disposed on the first surface and one or more additional guiding electrodes disposed on the second surface, wherein the additional guiding electrodes extend along the first direction. This configuration can provide a simple way to deflect ions into the first ion channel.
[0047] In some examples, the pilot electrode may be configured to receive a voltage to provide the pilot potential as a traveling wave. Additionally or alternatively, a separate pilot electrode may be configured to receive a voltage to provide the pilot potential as a traveling wave. This allows ions to be guided in a simple manner along the direction of the traveling wave. It also avoids the need to maintain a DC gradient over a certain length, thus preventing very high termination potentials.
[0048] In some implementations, the guiding electrode may be configured to receive an RF voltage and / or a DC voltage. Additionally or alternatively, a further guiding electrode may be configured to receive an RF voltage and / or a DC voltage. This allows for fine control of ion trajectory (e.g., using a combination of RF and DC voltages).
[0049] Optionally, at least some of the guide electrodes may extend in a direction transverse to the first direction. For example, the guide electrodes may extend below (or above) and across the first plurality of RF electrodes. Additionally or alternatively, additional guide electrodes may extend in a direction transverse to the first direction.
[0050] In some implementations, the deflector section can be divided into a guiding section such that, in a first operating mode, ions can be captured in a portion of the guiding section. This allows the ion director to be used in a variety of ways. For example, the ion director can be used to separate ion packets for delivery to downstream elements.
[0051] Optionally, the guiding portion may include a limiting portion configured to generate a limiting potential to confine ions toward the central longitudinal axis of the ion channel. Thus, ions can be focused by the ion guide.
[0052] In some implementations, the limiting potential can be generated by an RF voltage or a DC voltage applied to the limiting portion.
[0053] Optionally, the limiting portion may include a first limiting portion on a first surface and a second limiting portion on a second surface, wherein each limiting portion includes at least two electrodes defining opposing leading edges spaced apart along a direction transverse to the first direction, wherein the opposing leading edges converge toward a central longitudinal axis along the first direction. Combined with the deflector portion that divides the guiding portion, the ion guide can thus operate as a combined ion trap and ion funnel. This allows for finer control of ion confinement and allows for further ion confinement toward the central longitudinal axis.
[0054] In another specific implementation, an additional guiding electrode may extend in the lateral direction, and the extension of the guiding electrode may decrease towards the second end. This can further help guide ions through the ion guide along the central longitudinal axis and can operate as a planar ion funnel.
[0055] Optionally, the extension of the guiding electrode gradually decreases toward the second end. Gradually decreasing the extension of the guiding electrode allows ions to be guided more smoothly through the ion guide and along the central longitudinal axis.
[0056] Optionally, the ion guide may form at least a portion of an ion funnel, ion trap, or collision cell. Combinations of the ion guides discussed above may be provided. For example, the ion guide may form at least a portion of an ion funnel and an ion trap.
[0057] According to the second aspect, an ion mobility separator is provided, which includes any of the ion directors discussed above.
[0058] According to the third aspect, an analytical instrument is provided that includes any of the ion directors discussed above.
[0059] Optionally, the analytical instrument may include a mass spectrometry system comprising a mass analyzer and any of the ion directors discussed above. In another example, the analytical instrument may include an ion mobility separator discussed above. In yet another example, the analytical instrument may include an ion mobility spectrometer comprising any of the ion directors discussed above.
[0060] According to the fourth aspect, a method for manufacturing an ion director is provided, the method comprising the following steps:
[0061] Provide printed circuit board (PCB) sheets, and provide electrode precursor sheets including multiple protruding electrode precursor portions integrally formed together;
[0062] Mechanically attaching multiple protruding electrode front portions to the PCB sheet; and
[0063] When the protruding electrode precursor portion is attached to the PCB sheet, the electrode precursor sheet is processed to separate the protruding electrode precursor portion in order to form a separate electrode that is mechanically attached to the PCB sheet.
[0064] This manufacturing method allows for the provision of ion directors in which the PCB sheet is recessed relative to the electrodes. This can significantly reduce the variation of ions reaching the dielectric material of the PCB sheet. It can also reduce or limit PCB heating and degassing. Either of these can mean that the ion director design may be suitable for ion mobility separation and other purposes, such as for collecting and focusing ions from ion sources, ion trap arrays, collision cells, ion directors, etc.
[0065] Alternatively, the processing can be performed using wire etching or laser etching. Therefore, the protruding electrode precursor portion can be easily separated.
[0066] In some examples, the protruding electrode precursor portion may include a protrusion from a base portion of the electrode precursor sheet, wherein the base portion and the protrusion are integrally formed to provide an integrally formed protruding electrode precursor portion. Forming the protruding electrode precursor portion as a protrusion from the base portion allows for the fabrication of multiple electrodes in a simple manner. This allows for the fabrication of relatively complex electrode arrangements without requiring complex manufacturing methods.
[0067] Optionally, the processing may include machining along the surface of the base portion to separate the protruding electrode precursor portion from the base portion. Thus, the electrode can be easily separated from the base portion to provide the electrode. This allows for the fabrication of relatively complex electrode arrangements without requiring complex manufacturing methods.
[0068] In some implementations, the protruding electrode precursor portion may be attached to a frame portion of the electrode precursor sheet to provide an integrally formed protruding electrode precursor portion, and the processing includes processing the electrode precursor sheet to separate the protruding electrode precursor portion from the frame portion. Providing a protruding electrode precursor portion attached to the frame portion allows for the fabrication of relatively complex electrode arrangements using relatively simple manufacturing methods.
[0069] Optionally, the protruding electrode front portion can be arranged to provide an electrode with an arcuate cross-section and a plurality of electrodes shaped or arranged to at least partially conform to the arcuate electrode once separated from the frame component or base portion. Thus, the entire arrangement of the electrodes can be arranged in an arcuate configuration.
[0070] In another specific implementation, multiple separators can be provided on the dielectric material and / or protruding electrode precursor portions of the PCB sheet, spaced apart and configured to define a gap between the protruding electrode precursor portions and the dielectric material. Such separators allow the RF electrodes to be recessed relative to the PCB sheet, thereby reducing, potentially drastically, the chance of ions reaching the dielectric material of the PCB sheet. Therefore, charging on the PCB surface can be reduced, limited, or avoided. This, in turn, can lead to more accurate results.
[0071] In some examples, mechanically attaching each of a plurality of protruding electrode precursor portions to the dielectric material may include mechanically attaching the plurality of protruding electrode precursor portions to the PCB sheet via a plurality of separators. In other words, the separators can serve a dual purpose: mechanically attaching the plurality of electrode precursor portions to the PCB sheet and causing the plurality of electrode precursor portions (which, once separated, will be used as RF electrodes) to be recessed from the PCB sheet. Therefore, a relatively simple construction can be implemented to avoid, limit, or reduce charging of the PCB sheet.
[0072] In some examples, the PCB sheet may include multiple holes for receiving multiple separators. Therefore, one end of each (or some) of the multiple separators may extend through the holes (and thus through the PCB sheet). This end may include a recess or pit for receiving electrodes. The other end of each (or some) of the multiple separators may be mechanically coupled to the PCB sheet.
[0073] In manufacturing apparatuses that include providing an electrode precursor sheet comprising multiple electrode precursor portions, the multiple protruding electrode precursor portions can be mechanically attached to the PCB sheet, while the multiple protruding electrode precursor portions are positioned in recesses of multiple separators. In other examples, discrete electrodes can be individually positioned in the recesses.
[0074] In another example, the recess may have an arcuate (e.g., semicircular) cross-section. This allows the RF rod to be used as an RF electrode. Other examples of arcuate shapes include C-shaped, U-shaped, horseshoe-shaped, and V-shaped recesses. Other non-closed loops or other pseudo-circular non-closed shapes may be used, and in other examples, other recess shapes may be used.
[0075] In some implementations, mechanically attaching multiple protruding electrode precursor portions to a PCB sheet may include soldering multiple protruding electrode precursor portions to the PCB sheet.
[0076] In some examples, multiple protruding electrode precursor portions can form multiple rod electrodes upon separation. Rod electrodes (and are typically cylindrical rod electrodes, but hyperbolic rods can also be used) can be used in various ion director implementations.
[0077] According to the fifth aspect, a method is provided, which includes the following steps:
[0078] A plurality of discrete electrodes and a printed circuit board (PCB) sheet are provided, the PCB sheet including at least a plurality of channels extending in a first direction along the PCB sheet;
[0079] At least one of a plurality of discrete electrodes is placed into a channel of a plurality of channels; and
[0080] Multiple discrete electrodes are mechanically connected to the PCB sheet.
[0081] This manufacturing method allows for the provision of ion directors in which the PCB sheet is recessed relative to the electrodes or otherwise positioned distal to them. This can significantly reduce variations in the dielectric material reaching the PCB sheet. It can also reduce or limit PCB heating and degassing. Either of these can mean that the ion director design may be suitable for ion mobility separation and other purposes, such as collecting and focusing ions from ion sources, ion trap arrays, collision cells, ion directors, etc.
[0082] Optionally, mechanically attaching multiple discrete electrodes to a PCB sheet may include soldering multiple discrete electrodes to a PCB sheet.
[0083] Preferably, the multiple channels may include multiple recessed channels in the PCB sheet. Therefore, the PCB sheet can be recessed relative to the electrodes.
[0084] In some implementations, the method may also include placing discrete electrodes into each of a plurality of recessed channels. This can further reduce, limit, or prevent the opportunity for ions to reach the dielectric material of the PCB sheet.
[0085] In another specific implementation, placing at least one of a plurality of discrete electrodes into a recessed channel may include placing the length of at least one electrode into the recessed channel. Thus, the electrode can be completely recessed relative to the dielectric material of the PCB sheet.
[0086] In some examples, multiple discrete electrodes may comprise multiple rod electrodes. Rod electrodes (and are typically cylindrical rod electrodes, but hyperbolic rods may also be used) can be used in a variety of ion director implementations.
[0087] In some implementations, the method may also include stretching multiple discrete wires onto a fixture to provide multiple discrete electrodes.
[0088] In some specific implementations, at least some of the recessed channels of the PCB sheet may include opposing pairs of recessed channels that extend only partially in a first direction and may be positioned at the edge of the PCB sheet. Therefore, a fixture can be provided from the PCB sheet by stretching multiple discrete wires around the edge of the PCB sheet via opposing pairs of recessed channels that extend only partially in the first direction and are positioned at the edge of the PCB sheet. Thus, the PCB sheet can serve a dual function: for manufacturing discrete electrodes and for holding discrete electrodes after manufacturing. This simplifies the manufacturing process of the ion guide. Furthermore, due to the dual function of the PCB sheet, discrete electrodes can be more appropriately manufactured for specific ion guide applications. For example, the opposing pairs of recessed channels can be arranged to provide the necessary spacing and / or electrode length between electrodes.
[0089] In some examples, multiple channels may be provided by multiple spaced-apart separators coupled to a PCB sheet and configured to define a gap between multiple discrete electrodes and the PCB sheet, wherein some of the separators or the first end of each separator may include a recess or pit to provide a channel for receiving electrodes.
[0090] Multiple spaced-apart separators can be directly coupled to the surface of the PCB sheet at their second ends. The PCB sheet may also include multiple holes for receiving the multiple separators. Thus, the first end of each (or some) of the multiple separators can extend through the corresponding hole (and therefore through the PCB sheet).
[0091] In another example, the recess may have an arcuate (e.g., semicircular) cross-section. This allows the RF rod to be used as an RF electrode. Other examples of arcuate shapes include C-shaped, U-shaped, horseshoe-shaped, and V-shaped recesses. Other non-closed loops or other pseudo-circular non-closed shapes may be used, and in other examples, other recess shapes may be used.
[0092] It should be noted that any feature described herein may be used with any particular aspect or embodiment of the invention. Furthermore, combinations of any particular device, structural, or method features are provided, even if such combinations are not explicitly disclosed.
[0093] The invention will now be described with reference to the accompanying drawings, which depict different embodiments of the invention and are provided purely by way of example and not by way of limitation. Attached Figure Description
[0094] This invention can be implemented in various ways, and preferred embodiments will now be described by way of example only and with reference to the accompanying drawings, in which:
[0095] Figure 1 A cross-sectional view of an ion director is illustrated, comprising two sets of opposing RF electrodes, each set of opposing RF electrodes being coupled to opposing surfaces;
[0096] Figure 2 A cross-sectional view of an ion director is shown, which includes a plurality of ion channels formed by RF electrodes extending between a first end and a second end of the ion director, and a deflector portion configured to deflect ions into the ion channels or allow ions to continue traveling without deflection.
[0097] Figure 3 An exemplary embodiment of the deflector electrode of the deflector section is illustrated;
[0098] Figure 4 A cross-sectional view of an ion director is shown, which includes a deflector portion and an ion channel formed by an RF electrode extending between a first end and a second end of the ion director. The deflector portion divides the ion director to allow ions to be confined to the first portion of the ion director.
[0099] Figure 5A and Figure 5B A flowchart illustrating a method for manufacturing an ion director is shown;
[0100] Figure 6 An example of a method for manufacturing an ion director is shown, the ion director including multiple electrodes coupled to a PCB sheet or another surface;
[0101] Figure 7 An example of a method for manufacturing an ion director is shown, the ion director including multiple electrodes coupled to a PCB sheet or another surface;
[0102] Figure 8 An analytical instrument incorporating an embodiment of this disclosure is shown;
[0103] Figure 9A and Figure 9B Another embodiment of the ion director is illustrated, which includes a plurality of spacers to separate the ion director electrodes from the PCB surface;
[0104] Figure 10A and Figure 10B A portion of an exemplary ion guide arrangement, including a deflector section, is shown.
[0105] Figure 11 An isometric view of an exemplary ion guide is shown, as is an exemplary electrode spacing;
[0106] Figure 12 , Figure 13 and Figure 14 It shows the use of Figure 11 An exemplary pseudopotential of the exemplary ion director shown;
[0107] Figure 15A An embodiment illustrating the electrode arrangement of the deflector section and the time series of the RF pseudopotential of the traveling wave applied to the guide electrodes of the deflector section is shown; and
[0108] Figure 15B It shows Figure 15A The ion trajectory of an ion with a mass-to-charge ratio of 500 in the deflector section shown.
[0109] It should be noted that the figures are shown for simplicity and are not necessarily drawn to scale. Similar features are provided using the same (or similar) reference numerals. Detailed Implementation
[0110] This disclosure provides an ion director incorporating a plurality of RF electrodes extending longitudinally between a first end and a second end of the ion director and mechanically coupled to opposing first or second surfaces of the ion director. The ion director includes a guiding portion, wherein guiding electrodes are disposed on the first and second surfaces to generate a guiding potential that guides ions along a first direction from the first end toward the second end. The ion director also includes a deflector portion configured in a first operating mode to suppress ion movement along the first direction.
[0111] The inventors have recognized that this ion director arrangement can provide a relatively long ion travel path (e.g., allowing for high-resolution ion mobility separation) while also providing sufficient shielding of the surface, enabling the limitation, reduction, or minimization of ion exposure to the dielectric material. Furthermore, this arrangement allows for the use of simplified discrete electrodes to provide shielding. This approach allows for the development of complex or sophisticated ion director structures while still allowing for relatively simple fabrication methods.
[0112] Figure 1 An example of such an electrode arrangement is shown, illustrating a cross-section of an ion channel 110 in an ion director 100, wherein the ion director extends longitudinally between a first end and a second end. The ion director 100 includes a first surface 102a and a second surface 102b opposite to the first surface 102a. The first surface 10a and the second surface 102b may be provided by a printed circuit board (PCB) sheet.
[0113] It should be understood that, for the sake of simplicity, the first surface 102a and the second surface 102b are... Figure 1The first surface 102a and the second surface 102b (and corresponding elements positioned on or mechanically connected to the first surface 102a and the second surface 102b) may be interchanged in other ways.
[0114] The first surface 102a is in the first direction (in) Figure 1 In the first surface 102a, the second surface 102b is separated from the first surface 102a along the first axis y. In other words, a gap is provided between the first surface 102a and the second surface 102b. Optionally, the gap between the first surface 102a and the second surface 102b can be in the range of 2 mm to 6 mm, and is preferably 4 mm.
[0115] A first arrangement 104a of RF electrodes extending longitudinally between the first and second ends of the ion guide 100 is mechanically coupled to a first surface 102a. Additionally, a second arrangement 104b of RF electrodes extending longitudinally between the first and second ends of the ion guide 100 is mechanically coupled to a second surface 104b. Each electrode of the first arrangement 104a and the second arrangement 104b can therefore be arranged on or above the first surface 102a and the second surface 102b, respectively.
[0116] The first arrangement 104a and the second arrangement 104b of the RF electrodes may not be directly attached to the first surface 102a and the second surface 102b, but may be mechanically connected, such that a non-conductive gap exists between the respective surface and the electrode arrangement. For example, the first arrangement 104a and the second arrangement 104b of the RF electrodes may be mechanically connected to the first surface 102a and the second surface 102b via spacers (as referenced). Figure 5A (As discussed later). Therefore, the first arrangement 104a and the second arrangement 104b of the RF electrodes can be spaced apart from the corresponding first surface 102a and second surface 102b by non-conductive gaps. Other methods are possible for supporting the first arrangement 104a and / or the second arrangement 104b of the RF electrodes above and away from the first surface 102a and / or the second surface 102b.
[0117] The extension of the first arrangement 104a and the second arrangement 104b of the RF electrodes does not need to extend from the first end to the second end of the ion guide 100. For example, the first arrangement 104a and the second arrangement 104b of the RF electrodes may extend across a portion or most (but not all) of the length of the ion guide 100 between the first end and the second end. For example, one or more of the first arrangement 104a and the second arrangement 104b of the RF electrodes may be shorter than the remaining RF electrodes 104a, 104b, such as... Figure 2 As shown and also as referenced Figure 10A The subject of discussion.
[0118] The first arrangement 104a and the second arrangement 104b are positioned opposite each other in a first direction, and define a first ion channel 110 in the gap between the first surface 104a and the second surface 104b. Although Figure 1 The first arrangement 104a and the second arrangement 104b are illustrated as being directly opposite each other, but it should be understood that there are some tolerances in the positioning of the RF electrode arrangements 104a, 104b, and they may not be directly opposite each other (but they can still be substantially opposite each other).
[0119] Figure 1 The first plurality of RF electrodes 104a, 104b shown are straight metal rods, which may be cylindrical or hyperboloidal. However, it should be understood that the RF electrodes may have another cross-sectional shape or be planar. For example, the first plurality of RF electrodes 104a, 104b may have a square or rectangular cross-section. It should also be understood that, although Figure 1 The first plurality of RF electrodes 104a, 104b shown include three pairs of adjacent RF electrodes (producing six pairs of opposing RF electrodes), but more or fewer pairs of RF electrodes may be provided. However, it is preferable to provide three or four pairs of adjacent electrode pairs.
[0120] Multiple RF electrodes 104a and 104b are configured to receive an RF voltage and generate an RF potential that inhibits ion approach to the first surface 104a and the second surface 104b. In other words, the first plurality of RF electrodes 104a and the second plurality of RF electrodes 104b can confine ions within the gap of the ion guide 100. This can be achieved by applying an RF voltage such that a voltage phase difference exists between adjacent RF electrodes to generate an RF field, thereby providing a reflective pseudopotential that can confine ions toward the center of the ion guide 100.
[0121] Voltage phase difference is typically provided by applying voltages of opposite phase to adjacent rods (i.e., voltage signals 180 degrees out of phase with the voltage signal applied to the adjacent rod). The applied RF voltage can typically range from 20V to 2000V and can have frequencies between 1MHz and 3MHz. However, it should be understood that different voltage ranges and frequencies can be used, for example, to guide ions with different mass ranges. For mass-to-charge ratios in the ranges of 40 to 200, 150 to 2000, and 500 to 10000 (where, for the latter two ranges, this can include multi-charged ions), frequencies up to 1MHz and 300Vp-p (peak-to-peak voltage) may be suitable. In cases where multiple RF electrodes 104a and / or 104b are mechanically coupled to surfaces 102a and / or 102b using separators or spacers (as will be referenced) Figure 5A(As discussed), increased losses can be compensated for using a lower voltage (e.g., below about 300 Vp-p). This voltage range can also prevent or limit Paschen discharge when the device is configured to operate within the device at pressures in the range of 2 to 4 mbar. However, the effect of such spacers can be simulated by including protrusions on the surfaces of the electrodes facing the first surface 102a and / or the second surface 102b. In this case, approximately 50% to 80% or more of the electrode length may not contact the first surface 102a and / or the second surface 102b at all, thus reducing losses. Such protrusions can be produced by wire cutting or electro-etching.
[0122] On either side of the first arrangement 104a and the second arrangement 104b of the RF electrodes, one or more protective electrodes 106 may be provided, which are configured to receive voltage in a second direction perpendicular to the first direction (in Figure 1 In this configuration, ions are confined along the second axis (x). Therefore, the guard electrode 106 can focus the ions in a direction perpendicular to the direction of travel. For example... Figure 2 As shown and will be discussed in more detail below, ions are typically guided to travel along a third axis that is perpendicular to both the first axis y and the second axis x.
[0123] One or more guard electrodes 106 may be elongated electrodes extending along most or all of the length of the ion channel 110. The elongated electrodes may have an applied DC voltage sufficiently higher than a peak voltage used to guide ions through the ion channel 110 (this peak voltage may be a traveling voltage wave, as will be discussed further below). This may be sufficient to guide ions away from the edges of the ion channel 110 and confine ions within the ion channel 110. Ions closer to the edges of the ion channel 110 may experience a reduced voltage compared to ions at or towards the center of the ion channel 110, but this can be compensated for using known methods and systems.
[0124] Electrode 108 is disposed on a first surface 102a and a second surface 102b. Electrode 108 may be configured to receive a DC voltage or a variable voltage to generate an electromagnetic field (in other words, an axial field) along a third axis that guides ions. Therefore, electrode 108 may form part of the guiding portion of ion channel 110. Electrode 108 may include a DC electrode and / or an RF electrode. In other words, electrode 108 may be configured to receive a DC voltage and / or an RF voltage.
[0125] The voltage applied to electrode 108 can be the same as the voltage applied to guard electrode 106. For example, all DC electrodes in a given cross-section can be connected to each other and therefore can have the same applied voltage. Electrode connections can be provided via through-holes in the first surface 102a and the second surface 102b. For example, if the first surface 102a and the second surface 102b are provided by a PCB sheet, the through-holes can be included in the PCB sheet. The PCB sheet (or another sheet of dielectric material) can also be used to route electrical connections on the outer surface of the PCB sheet (i.e., the surface of the PCB sheet that does not form ion channels).
[0126] The attenuation of the DC voltage from the electrodes on the first surface 102a and the second surface 102b toward the central axis (i.e., the third axis) of the ion guide 100 can depend on the aspect ratio of the opening between the sets of RF electrodes to the height of the RF electrodes above the first surface 102a and the second surface 102b. The DC voltage from surfaces 102a, 102b can droop or decrease, with the magnitude of the droop decreasing exponentially for lower aspect ratios. The attenuation at this point can typically be in the range of 0.1% to 30%. While this still allows ions to be driven by DC gradients up to several hundred volts, it may be preferable that the axial field is implemented as a traveling wave, as described, for example, in US 6,642,514 and US 6,479,815. For example, a traveling wave can be achieved by applying a DC voltage distribution across a set of electrodes and “moving” the DC voltage distribution by gradually applying it to subsequent electrodes. Thus, this can give the impression that a DC pulse is moving across a series of electrodes. The maximum DC voltage in the curve can, for example, be as high as 100V. In another example, an RF voltage can be applied to provide a pilot potential as a traveling wave. In other words, the traveling wave can be a DC or RF traveling wave.
[0127] The number N of electrodes in the electrode group to which DC voltage is applied can range from 4 to 12 electrodes, and can be, for example, a group of 8 electrodes. In practice, implementing a traveling wave can mean that every (N+i) electrodes (where i = 0, 1, ..., N-1) are hardwired together, but other methods of implementing a traveling wave are also possible.
[0128] In addition to being applied to electrode 108, a traveling wave (also referred to herein as a T-wave) may or alternatively be applied to guard electrode 106. The electrode to which the T-wave is applied, or to which the T-wave may be applied, may be referred to herein as a traveling wave electrode. When a traveling wave is applied to both electrode 108 and guard electrode 106, the traveling wave applied to the guard electrode may be the same as the traveling wave applied to electrode 108, but with an additional DC offset relative to the traveling wave toward the center of ion channel 110. This allows for the same conditions of ions toward the center of ion channel 110 as well as toward the edges (periphery) of ion channel 110. In the case of multiple ion channels adjacent to each other, at least two separate or spaced-apart guard electrodes 106 (which may also be considered as guard electrodes 106 split into two or more parts) may be arranged between adjacent ion channels to allow traveling waves in opposite directions to be applied to adjacent ion channels—for example, where adjacent ion channels form folded ion paths, such as... Figure 2 As shown.
[0129] At least some of the guiding electrodes can extend in a direction transverse to the first direction (e.g., the z-direction). Traveling wave electrodes 106 and 108 are in the ion travel direction ( Figure 1 The extension in the z-direction of the electrode 108 can be selected to provide a smooth or substantially smooth T-wave. For example, the period of the electrode 108 in the z-direction (i.e., the distance between the corresponding RF electrode pairs) can be less than half the width of the gap between the first surface 102a and the second surface 102b.
[0130] Ion channel 110 also includes a deflector portion (e.g., Figure 1 Not shown in the image, but... Figure 2 , Figure 3 and Figure 15A As shown in the diagram, the deflector portion is configured to suppress the movement of ions along a first direction. For example, the deflector portion may include one or more components or structures on either or both of the first surface 102a and the second surface 102b to physically block the trajectory of ions, which can force the ions to move laterally (along the x-direction). For example, the deflector portion may include a PCB sheet arranged perpendicularly on the first surface 102a and / or the second surface 102b (i.e., extending along the z-direction from at least one of the surfaces) to physically block the trajectory of ions, which can force the ions to travel laterally (along the x-direction), thereby deflecting the ions. In other words, the deflector portion may be implemented by one or more surfaces protruding from at least one of the first surface 102a and the second surface 102b, rather than by planar electrodes having a voltage applied to provide a deflection potential.
[0131] In other examples, the deflector portion may include one or more deflector electrodes on a first surface 102a and one or more deflector electrodes on a second surface 102b. The deflector electrodes on the first and second surfaces 102a and 102b may be configured to operate in a first operating mode in which the deflector electrodes generate a barrier that inhibits ion movement between the first and second ends of the ion guide 100 (along a third axis). For example, in the first mode, the voltage applied to the deflector electrodes may be sufficiently higher than the peak voltage of the traveling wave, such that the probability of ions overcoming or tunneling through the barrier is relatively low or zero. The barrier may be a DC barrier or an RF barrier.
[0132] Since ions are guided by the guiding electrodes toward the central longitudinal axis of the ion guide and can move along the central plane of the ion guide, the electric field generated by one or more deflector electrodes should preferably reach the central plane, and the voltage at that point should be higher than the traveling wave voltage (or other voltage used to guide the ions). This can generate a sufficient electric field across the RF electrodes to allow ions to travel from one valley of the quasi-potential between the RF electrodes to the next. For ions with a higher mass-to-charge (m / z) ratio, the depth of the valleys or troughs may be lower, which may lead to some m / z-related effects. However, this can be addressed by widening the tuning range of the device by adding an RF voltage component to the deflector electrodes.
[0133] A potential barrier can be used to deflect ions from one channel to another. For example, as a reference... Figure 2 As discussed in further detail, ions may be deflected from the third axis to another axis due to a potential barrier. In another example, the potential barrier can be used to trap or confine ions within a portion of ion channel 110, as referenced... Figure 4 Further detailed discussion is needed.
[0134] At least a portion of the deflector section may be disposed at an end of the ion channel 110. For example, the deflector section may be disposed toward a first end of the ion guide 100. Additionally or alternatively, the deflector section may be disposed at a junction between the ion channel and another channel. This allows at least a portion of the deflector section to act as a switch to provide a switchable ion path, such that ions can be allowed to proceed along their trajectory (e.g., in a second operating mode of one or more deflector electrodes) or be directed onto or toward another path.
[0135] The second operating mode may involve not applying a voltage to at least a portion of the deflector section (i.e., the potential difference across the deflector section may be zero), or applying a voltage such that ions of a given energy have a high probability of not being reflected by the barrier. For example, ions may be directed into or toward the first end ion channel 110 to travel along the ion channel 110, or directed toward another path to avoid traveling along the ion channel 110.
[0136] In another example, at least a portion of the deflector section may be arranged toward the second end of the ion guide 100, for example, to allow ions to travel the length of the ion channel 110 before being deflected into another channel. Again, this could mean that the deflector section is arranged at the junction between the ion channel and another channel. However, it should be understood that at least a portion of the deflector section does not need to be arranged at the second end of the ion channel 110 and / or toward the second end of the ion guide 100 to deflect ions into another channel. In such examples, at least a portion of the deflector section may act as a switch to deflect ions into another channel or allow ions to continue along their trajectory as discussed above (i.e., without being deflected).
[0137] The electrodes of the deflector portion can be planar electrodes that are planar within the planes of the first surface 102a and the second surface 102b. Alternatively or additionally, the electrodes of the deflector portion can be printed on the first surface 102a and the second surface 102b. (See reference...) Figure 2 , Figure 3 and Figure 4 The electrode arrangement for the deflector section will be discussed in more detail.
[0138] Ion channel 110 can be combined with one or more other ion channels. For example, two or more ion channels can be arranged to provide long (e.g., meandering or tortuous) ion paths. Long ion paths can be used for ion mobility separation (but they can be used in many other cases, such as for ion storage or mass-to-charge ratio-based ion spatial separation). In some cases, it may be desirable to construct ion channels that provide long ion paths in a relatively small region.
[0139] although Figure 1An example is illustrated with both a first surface 102a and a second surface 102b having a first arrangement 104a and a second arrangement 104b positioned above the surface; however, it should be understood that only one of the first surface 102a and the second surface 102b may have an RF electrode mechanically coupled thereto. For example, the second surface may be a printed circuit board or a metal plate to which a delayed DC voltage is applied. Ions in the ion channel 110 can then be guided toward the quasi-potential of the RF electrode on the opposing surface and can be advanced along the ion channel 110 by, for example, a traveling wave applied to an electrode of the guiding portion. This also applies to other embodiments and examples discussed herein.
[0140] Figure 2 One embodiment is illustrated in which two or more ion channels 110 are placed adjacent to or close to each other to provide an ion guide 200 with an elongated ion path. The ion guide 200 may also be referred to herein as an ion migration device 200, but it should be understood that the elongated path ion guide 200 can be used for other purposes.
[0141] For reference Figure 1 The deflector portion (or at least a portion thereof) discussed can be arranged at the end of the ion channel. For example, as... Figure 2 As shown, the deflector portion may include a first set of deflector electrodes 216 at a first end 220 of the first ion channel 210a and a second set of deflector electrodes 212 at a second end 222 of the first ion channel 210a. These may be referred to herein as the set of first end deflector electrodes 216 and the set of second end deflector electrodes 212, respectively.
[0142] exist Figure 2 In the illustrated embodiment, the assembly of first end deflector electrodes 216 can be configured to operate in a deflection or suppression mode, wherein the assembly of first end deflector electrodes 216 is configured to generate a barrier that inhibits ion movement along a second direction (similar to the first operating mode of the deflector electrodes discussed above). The assembly of first end deflector electrodes 216 can also be configured to operate in a transport mode, wherein the first end deflector electrodes 216 are configured to allow ion movement along a second direction (similar to the above reference). Figure 1 The second operating mode of the deflector electrode under discussion. In other words, the first end deflector electrode 216 can be configured to operate as a steering device with a switchable DC voltage, and therefore can be referred to as a switch. (Refer to...) Figure 3 The first end deflector electrode 216 (which can operate similarly to the second end deflector electrode 212) will be discussed in further detail.
[0143] In other examples, some or all of the set of first end deflector electrodes 216 may be absent. For example, ions may be received into the ion guide 200 along a first direction to enter the first ion channel 210a, instead of along a second direction (x-direction, e.g.) Figure 2 (As shown) is received into the ion guide 200.
[0144] Once accepted into the first ion channel 210a (accepted along the first direction or along the x-axis and deflected by the collection of the first end deflector electrodes 216), the ions travel along the first ion channel 210a along the first direction ( Figure 2 Proceeding in the z-direction (as shown in the reference) Figure 1 The first ion channel 210a, as discussed above, includes a deflector electrode 212, which is configured to... Figure 1 In the first operating mode discussed, a potential barrier is generated that inhibits the movement of ions along a first direction. For example, in the reference... Figure 2 In the described embodiment, the deflector portion 212 may be configured to deflect ions from the first ion channel 210a toward the second ion channel. The second ion channel may be, for example, an elongated ion path channel 210b or a bypass channel. Either channel may be referred to as the second ion channel.
[0145] exist Figure 2 In the illustrated embodiment, deflector electrode 212 is configured to deflect ions toward the second ion channel 210b. Electrode 208 in the second ion channel 210b can be configured to receive a voltage to generate an electromagnetic field along an axis parallel to the third axis (the fourth axis). In other words, after being deflected from the first ion channel 210a, ions can be guided onto the fourth axis to travel along the second ion channel 210b. Figure 2 As shown, ions can therefore travel along the second ion channel 210b in a direction antiparallel to the first direction. This direction may be referred to herein as the negative z-direction (and therefore, the first direction may be referred to herein as the positive z-direction) to distinguish the direction of travel along the z-direction. However, it should be understood that the second ion channel 210b may be different from... Figure 2The manner illustrated is positioned relative to the first ion channel 210a. Ions can travel, for example, along the fourth axis in a first direction (e.g., where the elongated ion path does not bend back to itself but continues in the positive z-direction), or they can travel along the fourth axis in a second direction (e.g., where the second ion channel 210b is arranged perpendicular to the first ion channel 210a). In another example, ions can be deflected from the first ion channel 210a toward a bypass channel (which can be similar to bypass channel 211, which will be discussed in further detail below). Thus, ions can experience a relatively short separation path, which can be useful in some ion guide operations (e.g., when ion mobility operations are not required).
[0146] Electrode 208 can be similar to Figure 1 The electrodes illustrated in the example. For example, although... Figure 2 Electrode 208 is illustrated as a solid electrode passing below RF electrode 204, but electrode 208 can be a strip electrode extending along the z-direction, such as... Figure 1 As shown. In other examples, electrode 208 may be a continuous electrode extending in the x-direction below RF electrode 204. Figure 11 Such examples are illustrated in more detail. It should be understood that... Figure 1 The electrodes 108 shown can be arranged similarly.
[0147] The deflector section can be configured such that the resulting potential barrier deflects ions at 90 degrees relative to their ion paths. This can be achieved by applying a voltage (which can be a DC voltage and / or an RF voltage) to one or more deflector electrodes 212, 216, the arrangement or shape of the one or more deflector electrodes, or a combination of these options. For example, as Figure 2 As shown, the deflector electrodes 212, 216 on the first surface 102a and the second surface 102b can define a leading edge 213 that extends at least partially in a second direction (also referred to herein as the lateral direction, which is transverse to the first direction) and at least partially in the first direction. Therefore, the leading edge 213 can extend at an angle relative to the first direction. Preferably, this angle can be approximately 45 degrees relative to the first direction. For example, this angle can be in the range of 40 and 50 degrees, 44 and 46 degrees, 44.5 and 45.5 degrees, or in another range centered at 45 degrees. The leading edge 213 of the deflector electrodes 212 and / or 216 on the first surface 102a and the second surface 102b can be formed by a plurality of deflector electrodes, as will be referred to Figure 3Further details will be discussed later. In other examples, the leading edge 213 of deflector electrode 212 and / or deflector electrode 216 may be formed by a single electrode. When a DC voltage and / or an RF voltage is applied, the leading edge 213 may be used to define a guiding potential that guides or deflects ions in the ion guide 200.
[0148] The electrodes of the deflector portion can be planar electrodes in the plane of the first surface 102a and the second surface 102b. For example, the electrodes of the deflector portion can be printed on the first surface 102a and the second surface 102b. In other examples, the electrodes of the deflector portion can be solid planar electrodes, as shown in the reference. Figure 5A , Figure 5B , Figure 6 and Figure 7 Manufactured as discussed.
[0149] The above references Figure 2 The ion guide 200 under discussion includes a deflector portion and at least two ion channels arranged adjacent to each other and spaced apart from each other in a second direction. This provides a device with at least one switchable ion path. However, as... Figure 2 As shown, two or more ion channels can be spaced apart and arranged adjacent to each other. This allows the device to provide more than one switchable ion path.
[0150] For example, in Figure 2 In the illustrated ion guide layout, ions can travel along one of three ion paths. Initially, ions can travel along bypass path 211. In this example, the first end deflector electrode 216 of the first ion channel 210a is configured to allow ions to pass in a straight line along axis x (the second direction). This can be achieved by not applying a voltage to at least a portion of the deflector section or by applying a voltage such that ions of a given energy are unlikely to be reflected by the potential barrier.
[0151] A DC voltage distribution can be gradually applied to the electrode assembly 214 in the bypass channel 211 to generate a traveling wave. Since this traveling wave will travel in the x-direction (along the bypass channel 211), it may be referred to herein as an x-wave, but it should be understood that the traveling wave does not need to be different from a traveling wave traveling in another direction. Preferably, the electrodes at the sides of the bypass channel have an increased DC voltage, which is applied to avoid, reduce, or limit ion loss in the z-direction.
[0152] Alternatively, ions can travel along a short or shortened separation path. In this example, the first end deflector electrode 216 of the first ion channel 210a is configured to suppress ion movement along the x-axis (second direction). An x-wave can also be used to carry ions toward the first end deflector electrode 216. As the x-wave pushes ions toward the barrier of the first end deflector electrode 216 in the x-direction, the ions are forced to drift laterally (along the z-direction) until they are picked up by a T-wave along the z-direction to travel along the first ion channel 210a. Since this traveling wave travels in the z-direction, it may be referred to herein as a z-wave.
[0153] After traveling from the first end 210a of the first ion channel to or toward the second end 210b of the first ion channel, the ion encounters a DC barrier and / or an RF barrier generated by the second end deflector electrode 212. Therefore, the ion drifts laterally again (this time, along the x-direction) until it is picked up by the traveling z-wave of the second ion channel 210b. Figure 2 In the example shown, the traveling z-wave travels in the opposite direction to the z-wave of the first ion channel 210a. However, it should be understood that, as discussed above, the second ion channel 210b may be arranged in a different orientation relative to the first ion channel 210a. Therefore, the traveling wave may not be a z-wave and may travel in another direction. It should also be understood that a shorter ion path can be provided by arranging a bypass channel toward or at the second end of the ion channel 210a, the bypass channel including additional deflectors such that ions can be deflected by the second-end deflector 212 into the bypass channel (shorter path) and optionally into the second ion channel 210b to obtain a longer ion path.
[0154] return Figure 2 The implementation plan described in the document Figure 2 The shaded arrows indicate the direction of the z-wave propagation for each ion channel and show the ion path. Unshaded (white) arrows only indicate the direction of the ion path. (See image.) Figure 2 As shown, the deflection and ion channel travel process can be repeated multiple times until the ions reach another first end deflector electrode 216 in the X-wave channel (bypass channel) 211. Therefore, when the additional first end deflector electrode 216 is configured to allow ions to pass through, ions can be allowed to continue traveling along the bypass channel 211 (e.g., carried by the X-wave). Thus, ions can be allowed to exit from the ion guide.
[0155] Alternatively, ions can continue traveling along a long or narrow separation path. This path is covered if an additional first end deflector electrode 216 is configured to deflect ions away from the x-direction and toward another ion channel. Thus, ions can be guided into another set of z-waves to cover the longer path before exiting the ion guide.
[0156] The operation of deflector electrodes 212, 216 (and other components or portions of the ion guide 200) can be controlled by a controller (e.g., a central processing unit CPU). For example, the controller can be configured to switch the operation of deflector electrodes 212, 216 between a first operating mode and a second operating mode. Furthermore, the operation of deflector electrodes 212, 216 can be coordinated with the ion position within the ion migration device 200. For example, the controller can be configured to switch between deflector modes for a limited time period to allow a portion of the extended ion pack to be diverted to bypass path 211, while the remainder of the ion pack is diverted to the extended path. In this way, ions with a narrower range of ion mobility can be processed earlier (from bypass path 211) before the remainder of the ion pack.
[0157] It should be understood that the additional first end deflector 216 can be arranged in addition to Figure 2 Another location besides the one shown, and / or an additional first end deflector may be provided to change the point at which ions can be guided back onto the elongated ion path or allowed to continue traveling through bypass channel 211. This allows for better control over the ion path length. It will also be understood that, although already referenced... Figure 2 Different ion path lengths were discussed, but other arrangements of ion channels and / or bypass channels can provide different ion path lengths.
[0158] When the device 200 is used as an ion mobility separator, ion mobility separation can be performed in the range of 1 mbar to 10 mbar, preferably 2 mbar to 3 mbar. Examples of sizes suitable for high-resolution ion mobility spectroscopy (IMS) would include a bypass channel length of 0.3 m (extending in the x-direction), a short path of 5 m, and a long path of approximately 10 m, which could result in a flight time of up to one second. The width of the ion channel (extending in the x-direction) can be 8 mm, and the RF electrode 204 can have a width or diameter of 0.5 mm and can be spaced 1 mm apart (through its outer edges). In other examples, the distance between the centers of the RF electrodes can be 1.5 mm.
[0159] The confinement channel (including the channel with guard electrodes to confine ions to the ion channel) can have a width of 4 mm (extending in the x-direction). Therefore, each ion channel (including the confinement channel) can have a width of 12 mm. This allows for ion path lengths exceeding 10 meters (including technology margin) within a 400 mm × 400 mm system. This allows for IMS resolutions in the range of 300 to 400 (i.e., ion pack length less than 25 mm).
[0160] As referenced above Figure 1 The topics discussed and such Figure 2 As shown, some of the multiple RF electrodes can be truncated compared to the rest. This allows for reducing, limiting, or minimizing the width of the electrodes within the confinement channel or confinement section. For example, the confinement electrodes (electrodes of the confinement section) may utilize traveling waves and DC offset to maintain uniform ion movement. However, adjacent sets of confinement electrodes may have traveling waves in opposite directions. To avoid, limit, or reduce field penetration, wider confinement electrodes can be provided (e.g., each confinement electrode has a width corresponding to two or more pairs (periodic) of RF electrodes). Another option is not to provide RF electrodes above and on top of the confinement electrodes, in which case the confinement electrodes can be narrow to one or two pairs of RF electrodes. Figure 2 A variant is illustrated where there is no RF electrode above the confinement electrode, which can provide a denser (or most dense) arrangement of ion channels, but this requires fabricating a shorter RF electrode.
[0161] Figure 3 An example is a deflector electrode (e.g., that which can form part of the deflector portion of an ion guide). Figure 2 An exemplary embodiment of the deflector electrodes 216 and / or 212 in the [element / component]. Figure 3 As shown, the deflector section (or a portion thereof) can be implemented as an assembly of electrodes 315a-e distributed between the RF rod electrodes 304. The assembly of electrodes 315a-e may have an applied traveling wave or an applied voltage that delays ion travel.
[0162] Electrodes 315a-e can be implemented as diagonally split elongated electrodes, such as... Figure 3As shown. That is, electrodes 315a-e may include rectangular or elongated ends and wedge-shaped ends, wherein the wedge-shaped ends may define a leading edge 313 of the deflector portion. Each electrode in electrodes 315a-e may be split into two partial electrodes 317a, 317b, wherein different voltages are applied to each partial electrode 317a, 317b. In other examples, only some electrodes in electrodes 315a-e may be split into two electrodes 317a, 317b. The voltage applied to each partial electrode 317a, 317b may be switchable. Diagonally splitting at least some electrodes in electrodes 315a-e can reduce the instability of the deflector to ion deflection.
[0163] When implemented solely as a deflector (i.e., when the deflector portion cannot be switched to a second mode where ions are not deflected), the lower (shaded) portion electrode 317a may have an applied T-wave that propels ions along a first direction (along the z-direction) to the upper (white) portion electrode 317b, which may have an applied voltage to form a DC or RF delay barrier. When implemented as a switch (i.e., the deflector can be switched to a second operating mode, in which ion transport is permitted through the deflector electrodes), the upper portion electrode 317b may be connected to the lower portion electrode 317a to transport ions (allowing ions to pass through), or a delay voltage may be applied to redirect or deflect the ions.
[0164] It should be understood that the configuration of the applied voltage (e.g., which partial electrodes are applied to) will depend on the arrangement of the deflectors or switches in the ion guide. For example, when implemented as a switch as part of a first end deflector portion, the lower partial electrode 317a may have an applied delay or deflector voltage, and the upper partial electrode 317b may have an applied T-wave. Similarly, when implemented as a switch of a second end deflector portion, the lower partial electrode 317a may have an applied T-wave, and the upper partial electrode 317b may have an applied delay or deflector voltage. It should also be understood that the terms "upper" and "lower" are relative and can depend on the orientation of the deflector. That is, partial electrodes 317a and 317b may be referred to as first partial electrode 317a and second partial electrode 317b (and vice versa). Furthermore, although electrodes 317a and 317b have been described as partial electrodes due to diagonal splitting, it should be understood that they may also be simply referred to as electrodes.
[0165] Figure 3The electrode method shown can be used to form any type of planar (or substantially planar) ion device. For example, the electrode arrangement can be used to trap ions prior to implantation with or without the application of a T-wave. In other examples, electrodes 315a-e can alternatively be implemented as a two-dimensional (2D) array of elongated (i.e., unsplit) electrodes with or without the applied traveling wave.
[0166] Figure 4 The example shown is based on the reference. Figure 3 An example of an ion director 400 formed using the described split electrode method. The cross-section of the ion director 400 may correspond to... Figure 1 The cross-sectional view shown will therefore not be repeated in detail from the reference. Figure 1 The characteristics described.
[0167] Ions can enter the ion guide 400 along an axis parallel to the z-axis (i.e., along the first direction). Figure 4 The axis of the ion guide 400 (which is a planar ion funnel 400) can be the central axis of the ion guide 400, or it can be deflected from an axis parallel to the x-axis toward an axis parallel to the z-axis. For example, a bypass channel including a set of deflector electrodes can be provided at the first end of the ion guide 400 to allow ions to bypass the ion guide 400.
[0168] The ion guide 400 includes a portion comprising a deflector or shutter electrode 415 extending at 90 degrees relative to the first direction. In other words, the shutter electrode 415 may have a leading edge extending in a direction transverse to the first direction.
[0169] The voltage on the shutter electrode 415 allows ions to be captured in a portion of the guide section in a first mode of ion suppression. For example, as Figure 4 As shown, when operating in the first mode, electrode 415 can confine or trap ions toward the first end of ion guide 400 (in a portion of the guiding section). The deflector portion can thus divide the guiding section of ion guide 400. Ions can then be pulsed into downstream devices by removing the potential barrier on shutter electrode 415 and allowing ions to be optionally propelled in the z-direction by a traveling wave.
[0170] The guiding portion may include a confining portion configured to generate a potential to confine ions along an axis parallel to the z-direction toward the central longitudinal axis of the ion channel. The confining potential may be generated by an RF voltage or a DC voltage. The confining portion may include a first confining portion on a first surface 102a and a second confining portion on a second surface 102b. Each confining portion may include at least two electrodes defining opposing leading edges 418 spaced apart in a laterally direction, the opposing leading edges 418 converging along a first direction toward the central longitudinal axis. The at least two electrodes may each be a solid (monolithic) electrode, or may include multiple split electrodes, as referenced above. Figure 3 The discussion focuses on the fact that at least two electrodes may have a triangular shape (e.g., a right-angled triangle shape), or may include multiple elongated electrodes with wedge-shaped ends.
[0171] The length (extension in the x-direction) of the guiding electrode in the limiting portion of the ion guide 400 can decrease toward the second end of the ion guide 400. This reduction in length can correspond to the opposing leading edges 418 of the limiting portion. An assembly of electrodes having a substantially planar surface parallel to the longitudinal axis of the ion guide 400 can thus form a substantially triangular or irregular quadrilateral (or trapezoidal) surface, such as... Figure 4 As shown in the diagram. Therefore, this surface shape defined by the leading edge 418 can be used to define a limiting potential when a DC voltage and / or RF voltage is applied, which guides or restricts ions along an axis in the ion guide 400. For example, the limiting potential can direct ions toward the central axis of the ion guide 400, thereby increasing the ion density. This can be useful for ejecting ions from the ion guide 400 and for ejecting ions into or toward downstream devices.
[0172] The ion directors considered and discussed in this article include both protruding electrodes and planar electrodes (which may be, for example, printed electrodes). Fabricating an ion director that includes such protruding and planar electrodes can be complex, and the complexity of fabrication can increase with the complexity of the device, the number of electrodes, and / or the type of electrodes. For example, elongated RF rods are outside the scope of conventional PCB technology.
[0173] Therefore, this disclosure also relates to a method of manufacturing an ion director, which may be an ion director according to any of the examples discussed herein. Figure 5A The flowchart illustrates an example method for manufacturing an ion director.
[0174] At step 501, a printed circuit board (PCB) sheet is provided. The PCB sheet is typically formed of a non-conductive material, usually a dielectric material that can be reinforced, such as glass fiber. For example, the material could be FR-4 (glass-reinforced epoxy laminate). In other examples, the material could be Megtron 6 (which provides lower losses than FR-4) or ceramic (e.g., low-temperature ceramic). The PCB can be formed of multiple layers, preferably two layers, but optionally four or more layers, which can be achieved using conventional techniques. The PCB sheet may include through-holes to provide electrical contact from the outer surface of the PCB to components. The thickness of the PCB sheet can be less than 2 mm or in the range of 2 mm to 4 mm. In the latter case, the PCB sheet (or multiple such PCB sheets) can be used as the walls of a vacuum chamber.
[0175] At step 502, an electrode precursor sheet is provided. The electrode precursor sheet may be a sheet of stainless steel or nickel, or a sheet of another material. The electrode precursor sheet includes a plurality of protruding electrode precursor portions (which may be referred to herein as electrode precursor portions) integrally formed together. In other words, the protruding electrode precursor portions are bonded together by the material of the electrode precursor sheet. For example, the protruding electrode precursor portions may be attached to a frame portion or a base portion of the electrode precursor sheet.
[0176] It should be understood that steps 501 and 502 can be performed in any order.
[0177] In step 503, a plurality of protruding electrode precursor portions are mechanically attached to the provided PCB sheet. Preferably, each of the plurality of protruding electrode precursor portions is mechanically attached to the PCB sheet, but in some examples, only some of the plurality of protruding electrode precursor portions are mechanically attached to the PCB sheet.
[0178] Multiple protruding electrode precursor portions can be mechanically coupled to a PCB sheet (e.g., the dielectric material of the PCB sheet) via separators (also referred to as spacers). The mechanical coupling via separators can be as described in GB2587045. For example, each RF electrode can be mechanically coupled to the dielectric material of the PCB sheet via multiple spaced-apart separators configured to define a (non-conductive) gap between the protruding electrode precursor portion and the dielectric material of the PCB sheet. Each (or at least some) of the separators may include a protrusion, and the dielectric material may include a corresponding receiving portion such that, when the electrode precursor portion is coupled to the dielectric material, the protrusion of each separator is received within the corresponding receiving portion of the dielectric material.
[0179] In another example, it can be as follows Figure 9A and Figure 9B The separator shown is provided, which will be discussed in more detail below.
[0180] In another example, multiple electrode precursor portions can also be attached to the PCB, or alternatively, by soldering at least some, preferably all, of the electrode precursor portions to the PCB sheet. For example, the electrode precursor portions can be reflow soldered to the PCB sheet (temporarily attached to the PCB sheet using solder paste, followed by controlled heating). The electrode precursor portions or electrode precursor sheets can be coated in a solder-compatible layer prior to soldering.
[0181] At step 504, when the electrode precursor portions are attached to the PCB sheet (i.e., after step 503), the electrode precursor sheet is processed to separate the electrode precursor portions in order to form separate electrodes mechanically attached to the PCB sheet. That is, the electrode precursor portions are separated from each other so that they are no longer integrally formed from a single material sheet, while remaining attached to the PCB sheet.
[0182] Processing can be performed via wire etching. In other examples, other methods can be used to separate the assembly of precursor electrodes from the material. For instance, thermal cutting processes such as flame cutting, plasma cutting, or laser cutting can be used. In another example, chemical etching or embossing can be used.
[0183] In an example where the protruding electrode precursor portion includes a protrusion from the base portion of the electrode precursor sheet, the processing steps may include processing along the surface of the base portion to separate the electrode precursor portion from the base portion. Figure 6 The process is illustrated in the example.
[0184] In an example where the protruding electrode precursor portion is attached to the frame portion of the electrode precursor sheet (in other words, the electrode precursor portion is joined or connected together via a bridging element of the electrode precursor sheet material), the processing steps may include processing the electrode precursor sheet to separate the electrode precursor portion from the frame portion of the electrode precursor sheet (i.e., removing or processing the material bridging element). Figure 7 The process is illustrated in the example.
[0185] Because the protrusions extend above the surface of the PCB sheet, this means there is no line of sight from ions to the dielectric material on the PCB sheet (i.e., ion trajectories are unlikely to intersect the PCB sheet). In other words, making the PCB sheet recessed relative to the electrodes (preferably RF electrodes) can significantly reduce the variation of ions reaching the dielectric material, and reduce the effect of any stray fields that might arise if ions do land on the dielectric material. Therefore, compared to SLIM devices, the likelihood of PCB charging, dielectric losses due to RF dissipation into the PCB material can be limited or reduced, and thus heat generation and ion-molecule reactions are reduced. Therefore, this device can provide improved results, for example, through more accurate ion mobility separation.
[0186] Furthermore, compared to multi-electrode systems, the electrode shape and arrangement, as well as the overall design, can be simpler (e.g., protruding from the electrode precursor sheet). Additionally, the proposed method and system allow for greater flexibility in device design, which may be partly attributed to the less complex electrode shape and arrangement. Moreover, the design can be substantially planar, which minimizes the manual labor required to construct the device and allows for the use of existing electronic device manufacturing techniques.
[0187] The proposed device design is applicable not only to ion mobility separation but also to a variety of other purposes. For example, the device can be used to collect and focus ions from ion sources (e.g., ion funnels, multipolar or stacked ring ion directors), ion trap arrangements, collision cells, ion directors, etc. The device arrangement can also be used in multi-stage systems (i.e., including a series of different optional devices).
[0188] Various techniques can be used to form RF electrodes above the PCB surface. This includes suspending multiple wires on or across a PCB sheet, or providing a series of closely positioned metal pillars or blocks. The metal pillars or blocks can be placed robotically using standard electronic techniques. It should be understood that other methods can be used to provide RF electrodes above the PCB surface.
[0189] Figure 5B A flowchart illustrating another method for manufacturing an ion director is provided. At step 510, a plurality of discrete electrodes and a PCB sheet are provided, the PCB sheet including a plurality of recessed channels extending at least partially along a first direction of the PCB sheet.
[0190] Discrete electrodes can be rod electrodes and / or RF electrodes. Providing discrete electrodes may include providing a wire or cylinder of stretchable material, and stretching the wire on a fixture (a tool for controlling the position or positioning of the component). In other words, the wire or cylinder may be a flexible wire or cylinder. The wire can be stretched to form an RF rod. Therefore, the wire or cylinder can be considered an electrode precursor material. In the case where the discrete electrode includes a rod electrode, the rod may preferably have a diameter or width in the range of 0.1 mm to 2 mm.
[0191] At step 520, at least one of the plurality of discrete electrodes is placed or arranged in one of the plurality of recessed channels. Placing at least one discrete electrode in the recessed channel may include placing the length of at least one electrode into the recessed channel. In other words, the entire electrode may be arranged within the recessed channel or portion. For example, a rod electrode may be arranged entirely within the recessed portion. Preferably, the recessed channels are separated by a gap of approximately 1 to 4 times the electrode width or diameter. This allows the gap between adjacent electrodes to be 1 to 4 times the rod diameter or width. For example, the gap between RF rod electrodes may be in the range of 0.1 mm to 8 mm.
[0192] In other examples, placing at least one electrode into the recessed channel may include placing only a portion of the at least one electrode into the recessed channel. For example, at least some of the recessed channels of a plurality of PCB sheets may extend only partially in a first direction and be located at the edge of the PCB sheet. This may allow the PCB sheet to be used as a fixture for pulling wires through the recessed channels to form an RF rod.
[0193] In step 530, multiple discrete electrodes are mechanically coupled to the provided PCB sheet. This mechanical coupling can be referenced as described above. Figure 5A This can be achieved as discussed. For example, discrete RF electrodes can be attached to a PCB sheet using solder paste and soldered via reflow soldering. Prior to soldering, the discrete electrodes can be coated with a solder-compatible layer.
[0194] Reference Figure 6 The PCB sheet 602 is provided with printed circuitry 630 on one surface of the PCB sheet 602 and an electrode precursor sheet 603 including a plurality of protruding electrode precursor portions 632. The electrode precursor sheet 603 may be a sheet of stainless steel or nickel, and the protruding electrode precursor portions 632 may be provided as ribs (elongated cuboid electrodes), but it should be understood that other materials and shapes may be provided.
[0195] exist Figure 6In the example shown, the electrode precursor portion 632 is a protrusion extending from the base portion of the electrode precursor sheet 603. The PCB sheet 602 is mechanically attached to the electrode precursor sheet 603 by mechanically attaching multiple electrode precursor portions to the dielectric material of the PCB sheet 602 (e.g., by soldering). After mechanical attachment, the material of the mechanically attached portion is processed along the surface of the base portion to separate the protruding electrode precursor portion 632 from the base portion. Thus, individual ribs (or other protrusions) remain mechanically attached to the PCB sheet 602 as individual electrodes 633. Processing can be performed by wire etching 634 or laser etching.
[0196] Reference Figure 7 The system provides an electrode precursor sheet 703 and a PCB sheet 702 comprising multiple protruding electrode precursor portions 732, with printed circuitry (not shown) on one surface of the PCB sheet 702. The electrode precursor sheet 703 may be a sheet of stainless steel or nickel, and the protruding electrode precursor portions 732 may be provided as elongated electrodes, but it should be understood that other materials and shapes may be provided.
[0197] exist Figure 7 In the example shown, the electrode precursor portion 732 is attached to the frame portion 736 of the electrode precursor sheet. The electrode precursor portion 732 can be formed by etching a planar material sheet (e.g., chemical etching using a mask). Other methods for forming the electrode precursor portion 732, such as surface etching, electroforming, and laser cutting, are possible.
[0198] Electrode precursor sheet 703 is mechanically attached to PCB sheet 702. This can be done, for example, by gluing (or otherwise attaching) the electrode precursor sheet 703 to PCB sheet 702.
[0199] Because temperature changes during use cause PCB dimensions to change (expand or contract), the metallic material (e.g., stainless steel or nickel) of the electrode precursor sheet can warp. Therefore, the PCB sheet 702 may include a reinforcing material 740 on its surface. For example, the reinforcing material may be disposed on the surface of the PCB sheet 702 opposite to the surface to which the electrode precursor sheet 703 (not shown) is to be attached, and / or on the surface of the PCB sheet 702 to which the electrode precursor sheet is to be attached. The reinforcing material may be made of the same type of material as the electrode precursor sheet 703. This can help or force the PCB sheet 702 to expand in the same manner as the material of the electrode precursor sheet 703.
[0200] PCB sheet 703 may also include weakening portions 740 (e.g., having trenches, thinning portions, stress-relief portions, or slits) for cross-separated electrodes 733 (in Figure 7Stress relief is achieved across the length of electrode 733. In some examples, multiple weakened portions 740 may exist. Therefore, when the PCB sheet 702 expands due to temperature changes, any additional expansion that the reinforcing material 748 cannot control can be absorbed by these weaker portions 740.
[0201] Multiple separators can be disposed on the surface attached to the electrode precursor sheet 703. The multiple separators can be made of the same type of material as the electrode precursor sheet 703.
[0202] Following the mechanical connection, the material of the mechanical connection is processed to separate the protruding electrode precursor portion 732 from the frame component 736. In other words, processing is performed along one or more edges of the electrode precursor sheet 703. Thus, the protrusion, as the separating electrode 733, remains mechanically connected to the PCB sheet 702. Processing can be performed by wire etching, laser cutting, or another cutting method.
[0203] Figure 8 A schematic arrangement of a tandem mass spectrometer 800 suitable for performing methods according to embodiments of the present disclosure is shown. The tandem mass spectrometer 800 may be similar to, for example, the mass spectrometer described in US 10,699,888 B2.
[0204] exist Figure 8 In this process, the sample to be analyzed can be supplied (e.g., from an autosampler) to the tandem mass spectrometer 800. An ion source is used to ionize the sample molecules to generate precursor ions. Figure 8 In this embodiment, the ion source is an electrospray ionization source (ESI source) 820 operating at atmospheric pressure. However, it should be understood that other ion sources can be used alternatively to generate ions. For example, electron ionization (EI), chemical ionization (CI), or matrix-assisted laser desorption / ionization (MALDI) sources can be used.
[0205] Precursor ions generated by the ESI source 820 then enter the vacuum chamber or vacuum interface of the tandem mass spectrometer 800 and are guided by capillary 825 into the electrically driven ion funnel 830. The ion funnel 800 can be as shown in the reference... Figure 4 The planar ion funnel discussed may be another type of ion funnel. In some embodiments, the ion funnel 830 may be replaced by an S-lens with only RF. Precursor ions are focused by the ion funnel 830 into the ion guide 850. The ion guide 850 may be implemented according to any of the embodiments described herein.
[0206] An ion lens 860 may be located at the distal end of an ion guide 850 and may control the entry of precursor ions from the ion guide 850 into a channel of a downstream mass selector, which may be in the form of a quadrupole mass filter 870. Alternatively, an ion funnel 830 may operate as an ion gate. In embodiments where the ion funnel 830 is replaced by an RF-only S-lens, the RF-only S-lens may optionally operate in the same manner. The quadrupole mass filter 870 is typically, but not necessarily, segmented and may be used as a bandpass filter, allowing a selected mass number or a finite mass range to pass through while excluding precursor ions of other mass-to-charge ratios (m / z). For example, the quadrupole mass filter 870 may be controlled by a controller ( Figure 8 (Not shown) The filter mass filter 870 is controlled to select the range of mass-to-charge ratios of precursor ions that are allowed to pass through, while filtering out other ions in the precursor ion stream (those not allowed to pass through). Therefore, the filter mass filter 870 can filter precursor ions based on the range of m / z of interest. The filter mass filter 870 can also operate in RF-only mode, where the filter mass filter has no mass selectivity. That is, the filter mass filter 870 can transport substantially all m / z precursor ions.
[0207] although Figure 8 The quadrupole mass filter 870 is shown, but those skilled in the art should understand that other types of mass selection devices can also be suitable for selecting precursor ions within the mass range of interest. For example, ion separators as described in US 9,293,316B2, ion traps as described in WO-A-2013076307, ion mobility separators as described in US 8,581,177B2, ion-gate mass selection devices as described in WO-A-2012175517, or charged particle traps as described in US 7999223, all of which are incorporated herein by reference in their entirety. Those skilled in the art should understand that other methods for selecting precursor ions based on ion mobility, differential mobility, and / or transverse modulation may also be suitable.
[0208] Isolation of multiple precursor ions of different masses or mass ranges can also be performed in the ion trap using a method called simultaneous precursor scanning (SPS). Furthermore, in some embodiments, more than one ion selection device or mass selection device may be provided. For example, an additional mass selection device (which may also be referred to herein as a collision unit or ion routing multipole, IRM) may be provided downstream of the fragmentation chamber 820. In this way, MS3 scans or MSn scans (typically using a time-of-flight mass analyzer for mass analysis) can be performed if necessary.
[0209] The tandem mass spectrometer 800 can operate in one of several operating modes to perform analysis of precursor ions in the MS1 and / or MS2 domains. In the first operating mode, precursor ions can be analyzed in the MS1 domain using the first mass analyzer (orbit trap mass analyzer 810).
[0210] In the first operating mode, precursor ions can pass through the quadrupole exit lens / tangential lens arrangement 880 and enter the curved linear ion trap (C-trap) 805. The precursor ions can optionally enter the C-trap 805 via a first transfer multipole (not shown). The C-trap (first ion trap) 805 has a longitudinally extending curved electrode supplied with an RF voltage and an end cap supplied with a DC voltage. The result is a potential well extending along the curved longitudinal axis of the C-trap 805. In the first operating mode, the DC end cap voltage is applied to the C-trap such that ions arriving from the first transfer multipole are trapped in the potential well of the C-trap 805 and cooled within the potential well. The cooled precursor ions exist in a cloud towards the bottom of the potential well of the C-trap 805. The injection time of ions into the C-trap determines the number of precursor ions (ion swarm) subsequently ejected from the C-trap 805. Depending on the analysis to be performed, the precursor ions can be guided from the C-trap 805 to different parts of the tandem mass spectrometer 800.
[0211] When precursor ions are to be analyzed by orbital trap mass analyzer 810 (first mass analyzer), precursor ions are ejected orthogonally from the C-trap toward orbital trap mass analyzer 810. For example... Figure 8 As shown, the orbit trapping mass analyzer 810 can be an Orbitrap (RTM) mass analyzer sold by Thermo Fisher Scientific, Inc. The orbit trapping mass analyzer 810 has an eccentric injection port through which precursor ions are coherently injected into the orbit trapping mass analyzer 810. The precursor ions are then trapped within the orbit trapping mass analyzer 810 by a superlogarithmic electric field and perform reciprocating motion in the longitudinal direction while orbiting around internal electrodes.
[0212] In the orbital trap mass analyzer 810, the axial component (more or less) of the motion of the ion packet is defined as simple harmonic motion, where the angular frequency in the z-direction is related to the square root of the mass-to-charge ratio of a given ionic substance. Therefore, as time progresses, the precursor ions separate according to their mass-to-charge ratio.
[0213] Ions in the orbital trapping mass analyzer 810 are detected using an image current detector (not shown), which generates a "transient" in the time domain containing information about all ionic substances as they pass through the detector. This transient is then subjected to a Fast Fourier Transform (FFT), producing a series of peaks in the frequency domain. Based on these peaks, a mass spectrum representing the ion intensity relative to m / z can be generated. As used herein, "intensity" can refer to any suitable measure indicating or relating to the intensity of the detection, such as abundance, relative abundance, ion count, intensity, or relative intensity.
[0214] In the above configuration, precursor ions within the mass range of interest (selected by quadrupole mass filter 870) are analyzed by orbital trap mass analyzer 810 without fragmentation. The resulting mass spectrum is represented as MS1.
[0215] although Figure 8 While an orbital trapping mass analyzer 810 is shown, it should be understood that other mass analyzers may be used as the first mass analyzer according to embodiments of this disclosure. For example, a Fourier transform ion cyclotron resonance (FTICR) mass analyzer may be used as the first mass analyzer to analyze precursor ions in the MS1 domain. Mass analyzers such as orbital trapping mass analyzers and ion cyclotron resonance mass analyzers may also be used in this disclosure even when other types of signal processing, different from Fourier transform, are used to obtain mass spectrometry information from transient signals (e.g., as discussed in WO-2013 / 171313). In some embodiments, a ToF mass analyzer may also be used instead of the orbital trapping mass analyzer 810 to analyze precursor ions in the MS1 domain.
[0216] In the second operating mode of the tandem mass spectrometer 800, precursor ions can be analyzed by the ToF mass analyzer 850 (second mass analyzer) in the MS1 domain. Precursor ions to be analyzed by the second mass analyzer can be mass filtered by the quadrupole mass filter 870. Therefore, precursor ions can be filtered to include precursor ions from the m / z range of interest or from a sub-m / z range of interest.
[0217] To enable the ToF mass analyzer 850 to analyze precursor ions, precursor ions can enter the C-trap 805 from the quadrupole exit lens / tangent lens arrangement 880 (and optionally the first transfer multipole), and continue through the C-trap 805 into the fragmentation chamber 820. Therefore, the C-trap 805 can be effectively operated as an ion director in the second operating mode. Alternatively, ions cooled in the C-trap 805 can be ejected from the C-trap into the fragmentation chamber 820 in the axial direction. Since the precursor ions are to be analyzed in the MS1 domain, the fragmentation chamber (IRM) 820 is not used to fragment the precursor ions. For example, the ions may not be subjected to the collision gas, or the energy of the precursor ions when they collide with the collision gas may be insufficient to fragment them. Therefore, the precursor ions can continue through the fragmentation chamber 820 and be ejected from the fragmentation chamber 820 into the C-trap 805 at opposite axial ends. Therefore, the fragmentation chamber 820 can also be effectively operated as an ion director in the second operating mode.
[0218] The ejected fragmented ions enter the second transfer multipole 830. The second transfer multipole 830 guides the precursor ions from the fragmentation chamber 820 to the extraction trap (second ion trap) 840. The extraction trap 840 can be a radio frequency pressure-controlled trap containing a buffer gas. A suitable buffer gas has a pressure of 5 × 10⁻⁶. -4 mbar to 1×10 -2 Nitrogen gas in the mbar range can be used, but other buffer gases may also be used. The extraction trap is capable of rapidly cutting off the applied RF voltage and applying a DC voltage to extract the captured precursor ions. Suitable flat plate extraction traps, also known as rectangular ion traps, are further described in US 9548195 (B2). Alternatively, a second C-trap is also suitable for use as a secondary ion trap.
[0219] An extraction trap 840 is provided to form an ion pack of precursor ions prior to precursor ion implantation into a ToF mass analyzer 850. The extraction trap 840 accumulates ions prior to precursor ion implantation into the ToF mass analyzer 850.
[0220] Despite Figure 8 The embodiment depicts an extraction trap 840 (ion trap), but those skilled in the art will understand that other methods for forming ion packets of precursor ions are equally suitable for this disclosure. For example, the aggregation of ions can be influenced by the relatively slow transfer of ions through a multipole, and the ions can then be ejected as a single packet into a ToF mass analyzer. Alternatively, the orthogonal displacement of precursor ions can be used to form packets. Further details of these alternatives can be found in US 6,812,453B2, which describes a traveling-wave ion aggregation method, the disclosure of which is incorporated herein by reference.
[0221] exist Figure 8The ToF mass analyzer 850 shown is a multiple reflection time-of-flight mass analyzer (MR-ToF), which may be similar to that described in US 9,136,101 B2. Figure 8 The ToF analyzer 850 includes a pair of ion mirrors (a first ion mirror and a second ion mirror) 860 spaced apart and opposite to each other in a first direction Z. The ion mirrors 860 typically extend along a drift direction x orthogonal to the first direction.
[0222] Extraction trap 840 injects ions into first mirror 860, and then the ions oscillate between the two mirrors 860. The ejection angle of the ions from extraction trap 840 and additional deflector 870 allows control over the ion energy in the drift direction, so that the ions are guided along the length of mirror 860 during oscillation, thereby producing a Z-shaped trajectory.
[0223] Ions oscillate between ion mirrors 860 and drift along the length of the ion mirrors at an injection angle set by a pair of deflectors 870. The ion mirrors 860 are tilted relative to each other to generate a reversing ion drift delay potential, causing the ion path to be slowly deflected and redirected back to the detector 880 or lens. The tilting of the relative mirrors can generally have the negative side effect of altering the time period of ion oscillation as the ions travel along the drift dimension. However, this can be corrected using a strip electrode (as a compensation electrode) that alters the flight potential of a portion of the inter-mirror space that varies along the length of the opposing mirrors 860. The combination of the varying width of the strip electrode and the varying distance between the mirrors 860 allows for ion reflection and spatial concentration onto the detector 880, as well as maintaining good temporal concentration. MR-ToF applicable to this disclosure is further described in US 9,136,101B2, the contents of which are incorporated herein by reference in their entirety.
[0224] Precursor ions accumulated in extraction trap 840 are injected as ion packets into ToF mass analyzer 850 (second mass analyzer). Once a predetermined number of ions have accumulated in extraction trap 840, the ions can be injected into MR-ToF. By ensuring that each ion packet injected into MR-ToF 150 has at least a predetermined (minimum) number of ions, the resulting ion packets reaching detector 880 can represent the entire mass range of interest in the MS1 spectrum. Therefore, a single ion packet is sufficient to obtain the MS1 spectrum of the ions.
[0225] In the third operating mode of the tandem mass spectrometer 800, the ToF mass analyzer 850 (second mass analyzer) can be used to analyze precursor ions in the MS2 domain.
[0226] To analyze precursor ions in the MS2 domain, some precursor ions can be transferred from the quadrupole mass filter 870 to the fragmentation chamber 820 in a manner similar to the second operating mode described above. The precursor ions to be transferred can be mass-selected by the quadrupole mass filter 870 to include the target precursor ion material or the m / z subrange of interest.
[0227] Fracture chamber 820 in Figure 8 The tandem mass spectrometer 800 contains a high-energy collisional dissociation (HCD) device. Collision gas can be supplied to the fragmentation chamber 820. When the precursor ions are to be fragmented, the kinetic energy of the precursor ions may increase, causing the precursor ions that reach the fragmentation chamber 820 and collide with the collision gas molecules to fragment into fragment ions.
[0228] Despite Figure 8 The HCD fragmentation chamber 820 is shown, but alternatively other fragmentation devices employing methods such as collision-induced fragmentation (CID), electron trapping fragmentation (ECD), electron transfer fragmentation (ETD), photodissociation, etc., can be used.
[0229] Fragmented ions can be ejected from fragmentation chamber 120 into C-trap 805 at the opposite axial end. The ejected fragmented ions enter a second transfer multipole 830 and then into extraction trap 840, where they accumulate. The fragmented ions can then be injected into a ToF mass analyzer 850 as described above.
[0230] In another operating mode, ion fragmentation can occur in the high-pressure region of the extraction trap 840 (instead of in the fragmentation chamber 820).
[0231] In another operating mode, the orbital trap mass analyzer 810 (first mass analyzer) can be used to analyze precursor ions in the MS2 domain. Fragment ions can be transferred from the fragmentation chamber 820 back to the C trap 805 and ejected from there into the orbital trap mass analyzer 810 for mass analysis.
[0232] It should be understood that in some implementations, the first mass analyzer (orbit trap mass analyzer 810) and the second mass analyzer (ToF mass analyzer 850) can operate simultaneously. That is, it should be understood that the tandem mass spectrometer 800 can operate in the first (or other) operating mode simultaneously with the second or third (or other) operating mode.
[0233] The tandem mass spectrometer 800 can be controlled by a controller, which is configured, for example, to control the jet timing of the trapping components, set appropriate potentials on the electrodes of the quadrupole 870, switch between operating modes of the deflector section, etc., to focus and filter ions, trap mass spectrometry data from the orbital trapping mass analyzer 810 and the ToF mass analyzer 850, control the order of MS1 and MS2 scans, etc. In other words, each component of the tandem mass spectrometer 800 can be controlled by the controller (not shown). The controller may include a computer serving as a data processor for receiving data from the mass analyzer representing the mass analysis or the amount of ions detected from the mass analyzer. The computer may also serve as a data processor for processing the data to provide mass spectrometry and / or quantitative analysis of the ions. The controller may also include a display and a user input device, allowing a user to view and input or select information. The user input device may be a keyboard and / or a mouse. It should be understood that the controller may include a computer operable according to a computer program that includes instructions for causing the (ion) analyzer or (tandem) mass spectrometer to perform the steps of the method according to this disclosure.
[0234] It should be understood that Figure 8 The specific arrangement of the components shown is not necessary for the operations scanned herein. In fact, other arrangements for performing the operations of this disclosure are also suitable.
[0235] Figure 9A and Figure 9B Another exemplary ion guide configuration implementing spacers is shown. In this example, a plurality of spaced-apart separators or spacers 942 are mechanically coupled to a first surface of a PCB sheet. Each of the plurality of spaced-apart separators 942 is mechanically coupled to the first surface at a first end of the separator. It should be understood that only some of the separators 942 may be coupled at the first end, and other mechanical coupling methods may be used.
[0236] The PCB sheet includes multiple holes 944 for receiving spacers 942 to allow the spacers 942 to pass through the PCB sheet. Each spacer 942 has a second end including a recess or pit for receiving an RF electrode, such as... Figure 9A and Figure 9B As shown. For example, the recess may have an arcuate (e.g., semi-circular) cross-section to receive, for example, a cylindrical RF rod. Figure 9A and Figure 9B As shown, spacer 942 can therefore support the cylindrical RF rod in the desired position (in Figure 9A and Figure 9B In the middle, above the second surface of the PCB opposite to the first surface). Other recessed shapes can be used to receive cylindrical RF rods or other shaped electrodes.
[0237] It should be understood that in other examples, the first ends of the plurality of spaces 942 may be mechanically connected to the second surface of the PCB. In this case, the PCB sheet does not need to include holes 944.
[0238] The plurality of spacers 942 may include a first arrangement of spacers 942 separated in a first direction and a second arrangement of spacers 942 separated in a first direction. For example, the first and second arrangements of spacers 942 may be used to provide RF with opposite phases and may be separated in a second direction perpendicular to the first direction to provide a sufficiently long tracking distance. Therefore, the first and second arrangements of spacers 942 may be offset from each other, such as Figure 9A and Figure 9B As shown.
[0239] Figure 10A and Figure 10B An exemplary ion guide arrangement is illustrated. Figure 10A An ion path and a printed circuit board are illustrated. The PCB can form part of a deflector section to suppress the movement of ions along a first direction and help guide ions into a second ion channel (not shown). Figure 10A It is shown that at least some RF rods (or other shaped RF electrodes) can extend only a portion of the PCB length. If a PCB is available, this can free up some space toward the center for, for example, spacers to precisely define the gap between opposing PCBs, pumping or gas inlets, etc.
[0240] Figure 10B An exemplary RF rod diameter and the gap dimension (in millimeters) between the RF rod and the PCB surface are shown. This allows traveling waves to significantly penetrate the RF rod, enabling ion movement at lower voltages.
[0241] Figure 11 Examples are given by Figure 9A , Figure 9B , Figure 10A and Figure 10B An isometric view of an exemplary ion guide implementation of the design, and similar to... Figure 1 and Figure 2 The exemplary ion guide shown.
[0242] The first arrangement of the RF electrode 1104 is in the first direction ( Figure 11 Extending in the z-direction and in the second direction ( Figure 11 Separated in the x-direction. A first arrangement 1104 of electrodes is arranged above a first plurality of guide electrodes 1108 extending along a second direction. The guide electrodes 1108 may be configured to receive different voltages to provide a traveling wave as discussed herein.
[0243] The first plurality of protective electrodes 1106 extending in the first direction at least partially surround the guide electrode 1108. Figure 11 In this configuration, the protective electrode 1106 is arranged on any side of the plurality of guiding electrodes 1108. The plurality of protective electrodes 1106 and guiding electrodes 1108 may be arranged in the same plane.
[0244] The second arrangement 1104 of the RF electrodes, the second plurality of guiding electrodes 1108, and the second plurality of protective electrodes 1106 are similarly arranged in a third direction ( Figure 11 The first arrangement of RF electrodes is opposite to and spaced apart from it in the y-direction.
[0245] Figure 11 Exemplary dimensions and spacings that can be implemented in an ion guide arrangement are also illustrated. For example, the guide electrode 1108 may have a length of 12.0 mm, and the gap between opposing guide electrodes 1108 and / or opposing guard electrodes 1106 may be 7.0 mm. The distance between the centers of the RF rods (or other RF electrode shapes) may be 4.0 mm, and the RF rods (or other RF electrode shapes) may be separated by 2.0 mm in a second direction. The guide electrode 1108 has a corresponding applied DC and / or RF voltage to generate a traveling wave with a period of 12.0 mm. It should be understood that more or fewer guide electrodes 1108 may be used to provide the same traveling wave period.
[0246] Figures 12 to 14 Examples of using Figure 11 An exemplary pseudopotential of the exemplary ion guide shown. Figure 12 This shows the peak-to-peak voltage between paired opposite bars for a mass-to-charge ratio of 500 at a frequency of 2MHz and an applied voltage of 200Vp-p. Figure 11 The RF pseudopotentials in the x and y directions. Figure 13 An example is shown for a traveling wave of ±30V and a protective electrode 1106 with ±30V applied. Figure 11 The pseudopotentials in the x and z directions. Figure 14 Examples are given for those caused by traveling waves and RF voltage. Figure 11 The pseudopotentials in the y and z directions.
[0247] Figure 15A A preferred exemplary arrangement of electrodes that can be used for the deflection portion discussed herein is illustrated.
[0248] The deflector section may include an external protective electrode 1506a having an arcuate cross-section. Figure 15A In the example shown, the bow-shaped external protective electrode 1506a has a C-shaped or U-shaped electrode, but other bow-shaped electrodes can be used, including horseshoe-shaped electrodes, V-shaped electrodes, semi-circular electrodes, other non-closed loops and / or other pseudo-circular non-closed shapes.
[0249] The external protective electrode 1506a can be extended from an elongated protective electrode that extends along the length of the ion channel (as shown in the reference). Figure 1 and Figure 2 (As discussed). In other words, the elongated portion of the external protective electrode 1506a can be larger than... Figure 1 The ion channel is longer and can extend along most or all of its length.
[0250] Guide electrodes 1508a and 1508b are positioned within the arc of the outer protective electrode 1506a. Guide electrode 1508b will have the same traveling wave as the guide electrode 1508a applied to the straight section. The only difference is that guide electrode 1508b begins to follow the curve of the outer protective electrode 1506a to surround the second set of guide electrodes 1508a, thereby providing two ion channels separated in one direction. The center-to-center spacing of the ion channels can be 16.0 mm. Guide electrode 1508a can be referenced as above. Figure 1 and Figure 2 As discussed. For example, the guide electrode 1508a may include an elongated or rectangular electrode extending in a direction perpendicular to the extension of the RF electrode, and may have a voltage distribution applied to provide a traveling wave.
[0251] On the other hand, the guide electrode 1508b can be shaped to conform to the arc of the outer protective electrode 1506b. The guide electrode 1508b can, for example, have a fan-shaped or wedge-shaped shape, optionally with an arc at at least one end. Other shapes of the guide electrode 1508b are possible. For example, when viewed in a plan view, a semi-circular or horseshoe-shaped channel can be provided by an arrangement of triangular and planar electrodes. Other arrangements of electrodes can provide such channel shapes.
[0252] The arc-shaped external protective electrode 1506a and the guiding electrode 1508b positioned within the arc of the external protective electrode 1506a can more effectively deflect ions from the first ion channel and towards the second ion channel. Furthermore, instead of simply deflecting ions from the first ion channel, the arrangement of the electrodes can be used to redirect ions (e.g., into the second ion channel). In other words, ions can be deflected from a first axis to a second axis parallel to the first axis and travel in an antiparallel direction. Therefore, ions can be transferred from the first ion channel to the second ion channel more efficiently and effectively. Thus, the deflection portion can also be referred to as a steering portion or steering element.
[0253] The internal protective electrode 1506b can be positioned between the guiding electrode 1508a, which forms part of two ion channels. This helps to separate the first and second ion channels and confine ions within specific ion channels. The internal protective electrode 1506b can have an oblong or elliptical shape. In some examples, the internal protective electrode 1506b can be split. For example, the internal protective electrode can be split in the direction in which the RF rod extends.
[0254] Figure 15A The time series of the RF pseudopotential of the traveling wave applied to the guide electrode 1508a and the guide electrode 1508b is also illustrated. Figure 15B The ion trajectory corresponding to an ion with a mass-to-charge ratio of 500 is illustrated. The ion trajectories in the turning portion are not separated by ion mobility.
[0255] Those skilled in the art will understand that other methods for selecting precursor ions based on ion mobility, differential mobility, and / or lateral modulation may also be suitable, and the methods and systems described herein can be used in connection with such methods. It should also be understood that the ion directors or devices discussed herein can be implemented in other mass spectrometers or any analytical instrument used for ion analysis. For example, in some embodiments, an ion mobility separator using an ion director as described herein can be coupled to an analytical instrument, which may be a mass spectrometer, such as a tandem mass spectrometer. Therefore, this disclosure provides a mass spectrometry system comprising a mass analyzer and any one (or more) of the ion directors described herein. The ion director may be configured to supply ions to the mass analyzer (directly or indirectly via an intermediate component).
[0256] An ion mobility spectrometer may also be provided. The ion mobility spectrometer may include any of the ion directors described herein, which provide a long ion path along which ions can be separated according to their mobility (thus providing high-resolution ion mobility data).
[0257] The methods described herein can be implemented using computer system configurations, including handheld devices, microprocessor systems, microprocessor-based or programmable consumer electronics, microcomputers, mainframe computers, etc. Implementation schemes can also be practiced in distributed computing environments, where tasks are performed by remote processing devices linked via a network.
[0258] Some embodiments may also be implemented as computer-readable code on a non-transitory computer-readable medium. A computer-readable medium is any data storage device capable of storing data that can subsequently be read by a computer system. Examples of computer-readable media include hard disk drives, network attached storage (NAS), read-only memory, random access memory, CD-ROM, CD-R, CD-RW, magnetic tape, and other optical and non-optical data storage devices. The computer-readable medium may also be distributed across a network-coupled computer system, such that the computer-readable code is stored and executed in a distributed manner. Although embodiments according to this disclosure have been described with reference to specific types of devices and applications (e.g., mass spectrometers) and these embodiments have specific advantages in this context, as discussed herein, the methods according to this disclosure can be applied to other types of devices and / or applications. The specific details of the ion guide, while potentially advantageous, can be significantly modified to obtain devices with similar or identical operation. Unless otherwise stated, each feature disclosed in this specification is interchangeable with alternative features for the same, equivalent, or similar purposes. Therefore, unless otherwise stated, each disclosed feature is merely one example of a series of equivalent or similar attribute features.
[0259] All aspects and / or features disclosed in this specification may be combined in any combination, except for mutually exclusive combinations of at least some of such features and / or steps. Specifically, preferred features of this disclosure apply to all aspects and embodiments of this disclosure and may be used in any combination. Similarly, features described in non-essential combinations may be used individually (not in combination).
[0260] The methods and apparatus of this disclosure, which utilize various electrode structures, are applicable. Electrodes of appropriate dimensions can be arranged in symmetrical or asymmetrical patterns on a substrate, and the electrodes can be linear or curved lines if electrode elongation is advantageous for a particular application. Individual electrodes can be planar, hemispherical, rectangular, or other shapes. The electrodes can be PCB-printed electrodes. Most importantly, the arrangement of RF electrodes does not necessarily need to extend only along the z-axis, as... Figures 2 to 4 As shown. RF electrodes can also be, for example, along... Figures 2 to 4 The x-axis is defined. In other words, a lattice or grid arrangement of RF electrodes is possible. Other arrangements of RF electrodes are also possible.
[0261] As used herein, the term RF electrode refers to the electrode to which an RF voltage power supply is connected. The term DC electrode refers to the electrode to which a DC voltage power supply is connected.
[0262] It should be understood that although set terms are used herein, this does not necessarily mean that the features discussed with reference to these set terms require that these features be applied to every element in the set terms. For example, although this document may describe an RF voltage being applied to the pilot electrodes, it should be understood that the RF voltage may be applied to only some of the pilot electrodes.
[0263] It should be understood that there are implicit "approximate" terms preceding the temperature, concentration, time, pressure, flow rate, cross-sectional area, voltage, current, etc., discussed in this teaching, resulting in slight and non-substantial deviations within the scope of this teaching. Furthermore, values referred to as "equal" may actually differ by less than a threshold amount. For example, the threshold amount could be 5%. The threshold can also be greater than 5% (e.g., 10%, 20%, or 50%) or less than 5% (e.g., 2% or 1%).
[0264] As used herein, including in the claims, unless the context otherwise indicates, the singular form of a term herein shall be construed to include the plural form, and vice versa. For example, unless the context otherwise indicates, singular references herein, such as “a” (e.g., an electrode), mean “one or more” (e.g., one or more electrodes).
[0265] In the specification and claims of this disclosure, the words “comprising,” “including,” “having,” and “containing,” as well as variations thereof, such as “comprising” or similar words, mean “including but not limited to,” and are not intended to (and do not) exclude other components. Furthermore, the use of “or” is inclusive, such that the phrase “A or B” is true when “A” is true, “B” is true, or both “A” and “B” are true.
[0266] The use of any and all examples or exemplary language (“for example,” “such as,” “e.g.,” and similar language) provided herein is intended only to better illustrate this disclosure and, unless otherwise required, does not indicate a limitation on the scope of this disclosure. No language in this specification should be construed as indicating any unrequired element necessary for the practice of this disclosure.
[0267] The terms “first” and “second” may be reversed or relabeled without changing the scope of the invention. That is, an element referred to as a “first” element (e.g., first surface 102a) may alternatively be referred to as a “second” element (e.g., second surface 102a), and an element referred to as a “second” element (e.g., second surface 102b) may alternatively be considered as a “first” element (e.g., first surface 102b).
[0268] Unless otherwise stated or required by context, any steps described in this specification may be performed in any order or simultaneously. Furthermore, the fact that a step is described as being performed after another step does not preclude intermediate steps being performed.
[0269] It should also be understood that, unless otherwise implied or expressly understood or stated, any possible candidates or alternatives listed for any given component or embodiment described herein may generally be used alone or in combination with each other. It should be understood that any list of such candidates or alternatives is merely illustrative and not restrictive, unless otherwise implied or expressly understood or stated.
[0270] In the detailed description of the various embodiments, numerous specific details are set forth for illustrative purposes to provide a thorough understanding of the disclosed embodiments. However, those skilled in the art will understand that these various embodiments may be practiced with or without these specific details. Furthermore, those skilled in the art will readily understand that the particular order in which the methods are presented and performed is exemplary, and that the order is contemplated to be changeable while remaining within the scope of the various embodiments disclosed herein.
[0271] All literature and similar materials cited in this application, including but not limited to patents, patent applications, papers, books, monographs, and Internet web pages, are expressly incorporated in their entirety for any purpose. Unless otherwise stated, all technical and scientific terms used herein have the meanings commonly understood by one of ordinary skill in the art to which the various embodiments described herein pertain.
Claims
1. An ion guide extending longitudinally between a first end and a second end, the ion guide comprising: A first surface and a second surface, wherein the second surface is opposite to the first surface and a gap is formed between the first surface and the second surface; The first plurality of RF electrodes extend longitudinally along or across the extension direction of the ion guide. The first plurality of RF electrodes includes a first arrangement of RF electrodes mechanically coupled to the first surface, the first arrangement of RF electrodes being positioned above the first surface and opposite the second surface to define a first ion channel in the gap. The first plurality of RF electrodes are configured to receive at least two phases of RF voltage and generate an RF oscillation potential that suppresses ions from approaching the first surface; The first ion channel includes a guiding portion, wherein the guiding portion includes a first arrangement of guiding electrodes on the first surface. The guiding electrode is configured to generate a guiding potential that guides ions along a first direction from the first end of the ion guide toward the second end, and The first ion channel includes a deflector portion, wherein in a first operating mode, the deflector portion is configured to suppress the movement of ions along the first direction.
2. The ion guide of claim 1, wherein the deflector portion comprises a first deflector portion and / or a second deflector portion, the first deflector portion comprising one or more deflector electrodes on the first surface, the second deflector portion comprising one or more deflector electrodes on the second surface, wherein the deflector electrodes are configured to generate a potential barrier to suppress the movement of ions along the first direction.
3. The ion guide according to claim 2, wherein, In the second operating mode, the deflector electrode is configured to allow ions to continue traveling along the trajectory.
4. The ion guide according to any one of claims 2 to 3, wherein the deflector portion is configured such that the generated potential barrier deflects the ions at 90 degrees relative to the ion path of the ions.
5. The ion guide according to any one of claims 2 to 4, wherein at least one electrode of the first deflector portion and at least one electrode of the second deflector portion are each defined on a leading edge extending in a direction transverse to the first direction.
6. The ion guide of claim 5, wherein the leading edge of each of the at least one deflector electrodes extends partially in a direction transverse to the first direction and partially in the first direction, such that the leading edge of each of the at least one deflector electrodes extends at an inclined angle relative to the first direction. The tilt angle is preferably about 45 degrees relative to the first direction.
7. The ion guide of claim 6, wherein the leading edge of each of the at least one deflector electrode is formed by a plurality of deflector electrodes.
8. The ion guide according to any of the preceding claims, wherein a first arrangement of RF electrodes is mechanically coupled to the first surface via a first plurality of separators, the first plurality of separators being spaced apart and configured to define a gap between the first surface and the first arrangement of RF electrodes; and / or a second arrangement of RF electrodes is mechanically coupled to the second surface via a second plurality of separators, the second plurality of separators being spaced apart and configured to define a gap between the second surface and the second arrangement of RF electrodes.
9. The ion guide according to any preceding claim, the ion guide further comprising a bypass channel at the first end of the ion guide, the bypass channel extending in a direction transverse to the first direction and including an additional guiding electrode configured to generate a guiding potential to move ions in the transverse direction, wherein a portion of the deflector portion is disposed at a junction between the first ion channel and the bypass channel and configured to deflect ions into the first channel when operating in the first mode and to allow ions to continue traveling through the bypass channel in the transverse direction when operating in a second mode.
10. The ion guide according to any of the preceding claims, wherein the guiding electrode and / or the additional guiding electrode is configured to receive a voltage to provide the guiding potential as a traveling wave.
11. The ion guide according to any preceding claim, wherein the guiding portion includes a limiting portion configured to generate a limiting potential to limit ions toward the central longitudinal axis of the ion channel.
12. A method for manufacturing an ion director, the method comprising the following steps: Provide printed circuit board (PCB) sheets, and provide electrode precursor sheets including multiple protruding electrode precursor portions integrally formed together; The plurality of protruding electrode front portions are mechanically attached to the PCB sheet; as well as When the protruding electrode precursor portion is attached to the PCB sheet, the electrode precursor sheet is processed to separate the protruding electrode precursor portion in order to form a separate electrode mechanically attached to the PCB sheet.
13. The method of claim 12, wherein the protruding electrode precursor portion includes a protrusion from a base portion of the electrode precursor sheet, wherein the base portion and the protrusion are integrally formed to provide an integrally formed protruding electrode precursor portion.
14. The method of any one of claims 12 to 13, wherein the protruding electrode precursor portion is attached to a frame portion of the electrode precursor sheet to provide the integrally formed protruding electrode precursor portion, and the processing includes processing the electrode precursor sheet to separate the protruding electrode precursor portion from the frame portion.
15. The method according to any one of claims 12 to 14, wherein a plurality of separators are provided on the dielectric material of the PCB sheet and / or the protruding electrode precursor portion, the plurality of separators being spaced apart and configured to define a gap between the protruding electrode precursor portion and the dielectric material.
16. A method for manufacturing an ion director, the method comprising the following steps: A plurality of discrete electrodes and a printed circuit board (PCB) sheet are provided, the PCB sheet including at least partially a plurality of channels extending in a first direction along the PCB sheet; At least one of the plurality of discrete electrodes is placed into a channel of the plurality of channels; as well as The plurality of discrete electrodes are mechanically connected to the PCB sheet.
17. The method of claim 16, wherein the plurality of channels comprises a plurality of recessed channels within the PCB sheet, and wherein the method further comprises placing discrete electrodes into each of the plurality of recessed channels.
18. The method of any one of claims 16 to 17, further comprising stretching a plurality of discrete wires on a fixture to provide the plurality of discrete electrodes.
19. The method of claim 18, wherein at least some of the recessed channels of the PCB sheet comprise opposing pairs of recessed channels, the opposing pairs of recessed channels extending only partially in the first direction and disposed at the edge of the PCB sheet, and The clamp is provided by the PCB sheet by stretching the plurality of discrete wires around the edge of the PCB sheet via the opposing pairs of recessed channels that extend only partially in the first direction and are located at the edge of the PCB sheet.
20. The method of any one of claims 16 to 19, wherein the plurality of channels are provided by a plurality of spaced-apart separators, the plurality of spaced-apart separators being coupled to the PCB sheet and configured to define a gap between the plurality of discrete electrodes and the PCB sheet. Each of the plurality of separators has a recessed portion at its first end to provide the plurality of channels.
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