Light emitting diode packaging structure and manufacturing method thereof

By using a three-axis adjustable component and a servo motor driven packaging structure, the problems of fixed clamping force and insufficient degrees of freedom of vision system in LED packaging are solved, realizing flexible clamping and multi-dimensional positioning, and improving welding accuracy and reliability.

CN121924899APending Publication Date: 2026-04-24GUANGDONG SANLIAN OPTOELECTRONICS CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
GUANGDONG SANLIAN OPTOELECTRONICS CO LTD
Filing Date
2026-01-29
Publication Date
2026-04-24

AI Technical Summary

Technical Problem

Existing LED packaging processes suffer from low efficiency, poor consistency, difficulty in balancing gripping reliability and pin protection due to fixed clamping force, limited freedom of vision systems that cannot perform all-round detection, poor equipment coordination and lack of integrated intelligent control, making it difficult to achieve high-precision closed-loop process adjustment.

Method used

The packaging structure, which employs a three-axis adjustable component, an adjustable platform, a vision detector, and a servo motor drive, achieves flexible clamping, multi-dimensional positioning, and improved welding accuracy through flexible clamping, multi-angle detection, and online fine-tuning.

Benefits of technology

It achieves flexible and non-destructive clamping of LED pins, ensuring ultra-high precision alignment and connection reliability of solder joints, and improving packaging efficiency and consistency.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention discloses a light emitting diode packaging structure and a manufacturing method thereof, and relates to the technical field of packaging. The three-axis adjusting part with the adjusting function is fixedly installed at the top in the packaging machine frame through bolts, the three-axis adjusting part is specifically composed of a three-axis type pneumatic sliding seat and an installation seat, the current of the second electromagnetic lantern ring is dynamically adjusted, flexible lossless clamping and feeding of diode pins are achieved, and material damage is fundamentally avoided. Three-dimensional space positioning and guiding are conducted through the visual detector rotating at multiple angles, and ultrahigh-precision alignment of welding spots is guaranteed; the pin angle is synchronously adjusted through the servo driving gear ring, online dynamic fine adjustment and compensation before welding are completed, and the connection reliability is remarkably improved.
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Description

Technical Field

[0001] This invention relates to the field of packaging technology, specifically to a light-emitting diode packaging structure and its manufacturing method. Background Technology

[0002] The packaging process of light-emitting diodes (LEDs) is a critical link affecting product performance and reliability. Currently, traditional packaging relies heavily on manual or semi-automatic equipment, resulting in low efficiency, poor consistency, and easy damage to devices. Although existing automation solutions employ mechanical clamping and vision positioning, they still have significant shortcomings: First, the fixed clamping force of rigid fixtures makes it difficult to balance reliable gripping with non-destructive protection of precision pins; second, the vision system has limited degrees of freedom, making it unable to perform multi-angle and all-round inspection of solder joints, resulting in insufficient three-dimensional alignment accuracy; third, the coordination between equipment in each process is poor, lacking integrated intelligent control, making it difficult to achieve high-precision closed-loop process adjustment. Summary of the Invention

[0003] Therefore, in order to overcome the above-mentioned shortcomings, the present invention provides a light-emitting diode packaging structure and a method for manufacturing the same.

[0004] This invention is implemented as follows: a light-emitting diode (LED) packaging structure and its manufacturing method are constructed. The device includes a packaging machine; a three-axis adjusting component with an adjusting function is fixedly installed on the top of the packaging machine frame by bolts, and the three-axis adjusting component is specifically composed of a three-axis pneumatic slide and a mounting base; a packaging component is fixedly installed on the bottom of the mounting base of the three-axis adjusting component by bolts; an adjustable platform with an adjusting function is fixedly installed on the packaging machine platform by bolts, and the adjustable platform is specifically composed of a pneumatic piston cylinder fixedly installed on the packaging machine platform and a packaging platform installed on the top side of the pneumatic piston cylinder; a control console with a control function is fixedly installed on the front end of the packaging machine by bolts.

[0005] Preferably, the encapsulation component includes a fixed housing that is bolted to the side of the mounting base of the triaxial adjusting component; an adjusting cylinder with a driving function is bolted to the side of the fixed housing; a coil lug is inserted and fixed to the end of the piston rod of the adjusting cylinder, and the coil lug is welded and fixed to the side of the movable housing; a protective rubber pad is glued to the opposite surfaces of the fixed housing and the movable housing; a detection component is welded to the bottom of the fixed housing, and a clamping component is bolted to the inside of the fixed housing.

[0006] Preferably, the detection component includes a rotating seat welded and fixed to the bottom of the fixed housing; multiple sets of first electromagnetic collars are fixedly installed on the rod of the rotating seat; the first electromagnetic collars are fixedly disposed inside the mounting base.

[0007] Preferably, the mounting base is installed on the top of the vision detector and the electric actuator assembly respectively; the end of the adjusting rod of the electric actuator assembly is fixedly mounted with a mounting bracket.

[0008] Preferably, the first electromagnetic collar is a three-layer ring structure consisting of inner, middle and outer concentric circles, with the middle ring being wound with a coil.

[0009] Preferably, the electric actuator assembly specifically consists of a servo motor, a lead screw driven on the servo motor drive shaft, and a slider driven on the lead screw.

[0010] Preferably, the clamping component includes an editable controller that is bolted to the side of the fixed housing; a gearbox is bolted to the bottom of the fixed housing, and the gear inside the gearbox is inserted and fixed to the bottom of the servo motor drive shaft; the sides of the fixed housing and the movable housing are respectively bolted to a combination ring; a gear ring is rotatably provided inside the combination ring, and the gear ring meshes with the gear inside the gearbox; a square groove is provided inside the gear ring, and a locking component is fixedly installed inside the square groove.

[0011] Preferably, the locking component includes a magnetic block that is magnetically attracted inside the square groove of the gear ring; an adapter plate is rotatably installed in the through hole on the magnetic block plate, and a rubber wheel is rotatably installed at the front end of the adapter plate; the rotating rods on the front and rear sides of the adapter plate are all inserted and fixed at the center hole of the second electromagnetic collar.

[0012] Preferably, the outer periphery of the rubber wheel is covered with a contact layer made of silicone or polyurethane elastomer with a high coefficient of friction.

[0013] Preferably, the second electromagnetic collar is electrically connected to the programmable controller, which is configured to dynamically adjust the clamping force of the rubber wheel on the workpiece by controlling the magnitude of the electromagnetic force of the second electromagnetic collar.

[0014] A method for fabricating a light-emitting diode (LED) package structure includes the following steps: Step 1: Flexible feeding and clamping; by adjusting the cylinder to push the fixed housing and the moving housing closer together, multiple sets of rubber wheels flexibly contact and press the diode from multiple directions; by dynamically adjusting the current of the second electromagnetic collar, the clamping force is preset and controlled to achieve reliable gripping without damaging the material; Step 2: Visual alignment and initial positioning; the three-axis adjustment component moves and adjusts the packaged component that holds the diode; the first electromagnetic collar is energized to change the preset angle of the visual detector on the rotating seat crossbar, and performs multi-dimensional image acquisition on key positions such as the solder joints of the substrate, providing data for the three-axis adjustment component to complete the initial spatial positioning of the solder joints; Step 3: Angle fine-tuning and secondary positioning; Based on the visual data from Step 2, the servo motor drives the gear ring to rotate via the gearbox. The rotation of the gear ring synchronously drives the diode to rotate, thereby finely adjusting the angle and relative position of the diode pins and completing the secondary alignment of the solder joints. Step 4: Verification and Welding Encapsulation; Before welding, the vision detector can rotate again to verify the clamping status; then, the electric actuator assembly pushes the mounting bracket and welding gun at its end forward, precisely moving to the aligned welding point to complete the welding encapsulation process.

[0015] The present invention has the following advantages: By providing an improved LED packaging structure and its manufacturing method, the present invention offers the following improvements compared to similar devices: The present invention discloses a light-emitting diode packaging structure and its manufacturing method, which achieves flexible and non-destructive clamping and feeding of diode pins by dynamically adjusting the current of the second electromagnetic collar, fundamentally avoiding material damage; uses a multi-angle rotating vision detector for three-dimensional spatial positioning and guidance, ensuring ultra-high precision alignment of solder joints; and completes online dynamic fine-tuning and compensation before soldering by synchronously adjusting the pin angle through a servo-driven gear ring, significantly improving connection reliability. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of the present invention; Figure 2 This is a schematic diagram of the axial structure of the packaging component of the present invention; Figure 3 This is an exploded structural diagram of the packaging component of the present invention; Figure 4 This is an exploded view of the clamping component of the present invention; Figure 5 This is the invention Figure 4 Enlarged structural diagram at point A; Figure 6 This is an exploded structural diagram of the detection component of the present invention.

[0017] The components include: 1. Packaging machine; 2. Three-axis adjustment component; 3. Packaging component; 4. Adjustable platform; 5. Control console; 31. Fixed housing; 32. Adjustable cylinder; 33. Coil ear plate; 34. Moving housing; 35. Detection component; 36. Clamping component; 351. Rotary seat; 352. First electromagnetic collar; 353. Mounting seat; 354. Vision detector; 355. Electric actuator assembly; 356. Mounting bracket; 361. Editable controller; 362. Gearbox; 363. Servo motor; 364. Combination ring; 365. Gear ring; 366. Locking component; 366. Magnetic block; 3661. Adapter plate; 3662. Rubber wheel; 3663. Second electromagnetic collar; 3664. Detailed Implementation

[0018] The following is in conjunction with the appendix Figures 1-6 The principles and features of the present invention are described below. The examples given are for illustrative purposes only and are not intended to limit the scope of the invention. The invention is described more specifically in the following paragraphs by way of example with reference to the accompanying drawings. It should be noted that the drawings are in a very simplified form and use non-precise proportions, and are only used to facilitate and clarify the illustration of the embodiments of the invention.

[0019] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0020] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "setting" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances. The embodiments of this invention will now be described according to its overall structure.

[0021] Example 1:

[0022] Please see Figures 1-6 The present invention discloses a light-emitting diode (LED) packaging structure and its manufacturing method, comprising a packaging machine 1; a three-axis adjusting component 2 with an adjusting function is fixedly installed on the top of the packaging machine 1 frame by bolts, and the three-axis adjusting component 2 is specifically composed of a three-axis pneumatic slide and a mounting base; a packaging component 3 is fixedly installed on the bottom of the mounting base of the three-axis adjusting component 2 by bolts; an adjustable platform 4 with an adjusting function is fixedly installed on the packaging machine 1 platform by bolts, and the adjustable platform 4 is specifically composed of a pneumatic piston cylinder fixedly installed on the packaging machine 1 platform and a packaging platform installed on the top side of the pneumatic piston cylinder; a control console 5 with a control function is fixedly installed on the front end of the packaging machine 1 by bolts.

[0023] The encapsulation component 3 includes a fixed housing 31 that is bolted to the side of the mounting base of the triaxial adjusting component 2; an adjusting cylinder 32 with a driving function is bolted to the side of the fixed housing 31; a coil ear plate 33 is inserted and fixed to the end of the piston rod of the adjusting cylinder 32, and the coil ear plate 33 is welded and fixed to the side of the movable housing 34; a protective rubber pad is glued to the opposite surfaces of the fixed housing 31 and the movable housing 34; a detection component 35 is welded to the bottom of the fixed housing 31, and a clamping component 36 is bolted to the inside of the fixed housing 31.

[0024] The detection component 35 includes a rotating seat 351 welded and fixed to the bottom of the fixed housing 31; multiple sets of first electromagnetic collars 352 are fixedly installed on the rod of the rotating seat 351; the first electromagnetic collars 352 are fixedly installed inside the mounting base 353; the mounting base 353 is respectively installed on the top of the visual detector 354 and the electric actuator assembly 355; the end of the adjusting rod of the electric actuator assembly 355 is fixedly installed with a mounting bracket 356.

[0025] The first electromagnetic collar 352 is specifically composed of a three-layer ring structure with concentric circles, consisting of an inner, middle, and outer ring, with a coil wound inside the middle ring; the electric actuator assembly 355 is specifically composed of a servo motor, a lead screw driven on the servo motor drive shaft, and a slider driven on the lead screw.

[0026] The clamping component 36 includes an editable controller 361 that is bolted to the side of the fixed housing 31; a gearbox 362 is bolted to the bottom of the fixed housing 31, and the gear inside the gearbox 362 is inserted and fixed to the bottom of the transmission shaft of the servo motor 363; the sides of the fixed housing 31 and the movable housing 34 are bolted to the combined ring 364; a gear ring 365 is rotatably provided inside the combined ring 364, and the gear ring 365 meshes with the gear inside the gearbox 362; a square groove is opened inside the gear ring 365, and a locking component 366 is fixedly installed inside the square groove.

[0027] Example 2:

[0028] Please see Figures 1-6 The present invention provides a light-emitting diode packaging structure and its manufacturing method. Compared with Embodiment 1, this embodiment further includes: a locking member 366 including a magnetic block 3661 magnetically adsorbed inside the square groove of the toothed ring 365; an adapter plate 3662 is rotatably installed in the through hole on the plate of the magnetic block 3661, and a rubber wheel 3663 is rotatably installed at the front end of the adapter plate 3662; the rotating rods on the front and rear sides of the adapter plate 3662 are all inserted and fixed at the center hole of the second electromagnetic collar 3664.

[0029] The outer periphery of the rubber wheel 3663 is covered with a contact layer made of silicone or polyurethane elastomer with a high coefficient of friction; the second electromagnetic collar 3664 is electrically connected to the editable controller 361, which is configured to dynamically adjust the clamping force of the rubber wheel 3663 on the workpiece by controlling the magnitude of the electromagnetic force of the second electromagnetic collar 3664.

[0030] The working principle of the above-mentioned LED packaging structure and its manufacturing method is as follows: First, when using this device, place it in the work area, and then connect it to an external power source to provide the power required for its operation. Second, the LED substrate is placed on the adjustable platform 4 by an external feeding device, and the diode is fed into the package 3. Here, the diode is placed between the fixed housing 31 and the movable housing 34 with the leads facing down. Then, the movable housing 34 is pushed closer to the fixed housing 31 by the adjusting cylinder 32, so that the multiple sets of rubber wheels 3663 on both sides flexibly contact and press the package material from multiple directions. Here, the rotational resistance of the adapter plate 3662 and the rotational resistance of the rubber wheel 3663 are reduced to the minimum by changing the current of the two sets of second electromagnetic collars 3664. Then, the current of the two sets of second electromagnetic collars 3664 is changed again to increase the rotational resistance of the adapter plate 3662 and the rubber wheel 3663 to the maximum. The preset electromagnetic damping force ensures that the clamping force is moderate, which can reliably grasp the material without damaging it, thus completing the feeding action of the diode. Third, the programmable controller 361 outputs a specific current signal to the second electromagnetic collar 3664 according to the characteristics of the packaged diode through a preset program. The magnitude of the current determines the electromagnetic damping force or locking force of the second electromagnetic collar on the rotating rod inside its central hole, thereby presetting the maximum resistance torque when the adapter plate 3662 swings and the rubber wheel 3663 presses, thus realizing stepless and dynamic pre-adjustment of the clamping force. Then, the three-axis adjustment component 2 drives the packaged component 3 and the diode to move above the LED substrate, and the motor on the side of the rotating seat 351 drives its crossbar to rotate. Here, the programmable controller 361 sends a command to the first electromagnetic collar 352 of the vision detector 354, so that it is energized and magnetized to attract the crossbar of the rotating seat 351 and rotate accordingly. The controller 361 can accurately drive the vision detector 354 to rotate around the axis to multiple preset angles, and perform multi-dimensional image acquisition of the position, polarity, solder joint quality and colloid state of the LED substrate, so that the packaged component 3 and the diode can be driven to perform the initial solder joint positioning process with the cooperation of the three-axis adjustment component 2. Fourth, the servo motor 363 can also be started by the programmable controller 361. The power is transmitted through the gearbox 362 to drive the gear ring 365 that meshes with it to rotate in the combined ring 364. Since the locking member 366 is fixed in the square groove of the gear ring 365 by the magnetic block 3661, the rotation of the gear ring 365 drives all the locking members 366 to change the circumferential angle synchronously, thereby changing the rotation angle of the diode on the rubber wheel 3663, and thus changing the relative position of the diode pin, completing the secondary positioning process of the solder joint. Fifth, by controlling the electromagnetic force on and off of the first electromagnetic collar at different positions in an orderly manner, the mounting base 353 can be allowed or prevented from rotating around the rod; thereby, the programmable controller 361 can precisely drive the vision detector 354 and the electric push rod assembly 355 to rotate around the axis to multiple preset angles. The rotation of the vision detector 354 can quickly visually verify the clamped material again. Then, the electric push rod assembly 355 pushes the mounting bracket 356 and the welding gun installed in the mounting bracket 356 forward to the welding point and perform welding to complete the welding encapsulation.

[0031] This invention provides an improved LED packaging structure and its manufacturing method. By dynamically adjusting the current of the second electromagnetic collar 3664, flexible and non-destructive clamping and loading of the diode pins are achieved, fundamentally avoiding material damage. A multi-angle rotating vision detector 354 is used for three-dimensional spatial positioning and guidance, ensuring ultra-high precision alignment of the solder joints. By synchronously adjusting the pin angle through a servo-driven gear ring 365, online dynamic fine-tuning and compensation before soldering are completed, significantly improving connection reliability.

[0032] The above description shows and illustrates the basic principles, main features, and advantages of the present invention. Standard parts used in the present invention can be purchased from the market, and irregular parts can be customized according to the description and drawings. The specific connection methods of each part adopt conventional methods such as bolts, rivets, and welding that are mature in the prior art. The machinery, parts, and equipment adopt conventional models in the prior art, and the circuit connection adopts conventional connection methods in the prior art, which will not be described in detail here.

[0033] The above description of the disclosed embodiments enables those skilled in the art to make or use the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A light-emitting diode packaging structure, comprising a packaging machine (1); a three-axis adjusting component (2) with adjusting function is fixedly installed on the top of the frame of the packaging machine (1) by bolts, and the three-axis adjusting component (2) is specifically composed of a three-axis pneumatic slide and a mounting base; Its features are: The bottom of the mounting base of the three-axis adjusting component (2) is fixedly installed with a sealing component (3) by bolts; an adjustable platform (4) with adjustment function is fixedly installed on the platform of the sealing machine (1) by bolts, and the adjustable platform (4) is specifically composed of a pneumatic piston cylinder fixedly installed on the platform of the sealing machine (1) and a sealing platform installed on the top side of the pneumatic piston cylinder; a control console (5) with control function is fixedly installed at the front end of the sealing machine (1) by bolts. The encapsulation component (3) includes a fixed housing (31) that is fixedly mounted on the side of the mounting seat of the three-axis adjusting component (2) by bolts; an adjusting cylinder (32) with a driving function is fixedly mounted on the side of the fixed housing (31) by bolts; a coil ear plate (33) is inserted and fixed at the end of the piston rod of the adjusting cylinder (32), and the coil ear plate (33) is welded and fixed to the side of the movable housing (34); a rubber pad with a protective function is glued and fixed to the opposite surfaces of the fixed housing (31) and the movable housing (34); a detection component (35) is welded and fixed to the bottom of the fixed housing (31), and a clamping component (36) is fixedly mounted inside the fixed housing (31) by bolts.

2. The light-emitting diode packaging structure according to claim 1, characterized in that: The detection component (35) includes a rotating seat (351) welded and fixed to the bottom of the fixed housing (31); multiple sets of first electromagnetic collars (352) are fixedly installed on the rod of the rotating seat (351); the first electromagnetic collars (352) are fixedly arranged inside the mounting base (353).

3. The light-emitting diode packaging structure according to claim 2, characterized in that: The mounting base (353) is installed on the top of the vision detector (354) and the electric actuator assembly (355), respectively; the end of the adjusting rod of the electric actuator assembly (355) is fixedly mounted with a mounting bracket (356).

4. The light-emitting diode packaging structure according to claim 3, characterized in that: The first electromagnetic collar (352) is specifically composed of a three-layer ring structure consisting of inner, middle and outer concentric circles, and the middle ring is wound with coils inside.

5. The light-emitting diode packaging structure according to claim 4, characterized in that: The electric actuator assembly (355) specifically consists of a servo motor, a lead screw driven on the servo motor drive shaft, and a slider driven on the lead screw.

6. The light-emitting diode packaging structure according to claim 5, characterized in that: The clamping member (36) includes an editable controller (361) that is fixedly mounted on the side of the fixed housing (31) by bolts; a gearbox (362) is fixedly mounted on the bottom of the fixed housing (31) by bolts, and the gear inside the gearbox (362) is inserted and fixed to the bottom of the transmission shaft of the servo motor (363); the sides of the fixed housing (31) and the movable housing (34) are respectively fixed to the combined ring (364) by bolts; a gear ring (365) is rotatably provided inside the combined ring (364), and the gear ring (365) meshes with the gear inside the gearbox (362); a square groove is opened inside the gear ring (365), and a locking member (366) is fixedly installed inside the square groove.

7. The light-emitting diode packaging structure according to claim 6, characterized in that: The locking component (366) includes a magnetic block (3661) that is magnetically attracted inside the square groove of the toothed ring (365); an adapter plate (3662) is rotatably installed in the through hole on the plate of the magnetic block (3661), and a rubber wheel (3663) is rotatably installed at the front end of the adapter plate (3662); the rotating rods on the front and rear sides of the adapter plate (3662) are all inserted and fixed at the center hole of the second electromagnetic collar (3664).

8. The light-emitting diode packaging structure according to claim 7, characterized in that: The outer periphery of the rubber wheel (3663) is covered with a contact layer made of silicone or polyurethane elastomer with a high coefficient of friction.

9. The light-emitting diode packaging structure according to claim 8, characterized in that: The second electromagnetic collar (3664) is electrically connected to the editable controller (361), which is configured to dynamically adjust the clamping force of the rubber wheel (3663) on the workpiece by controlling the magnitude of the electromagnetic force of the second electromagnetic collar (3664).

10. A method for fabricating a light-emitting diode (LED) package structure, used to implement the LED package structure as described in claim 9, characterized in that: Includes the following steps: Step 1: Flexible feeding and clamping; by adjusting the cylinder (32) to push the fixed housing (31) and the moving housing (34) closer together, multiple sets of rubber wheels (3663) flexibly contact and press the diode from multiple directions; by dynamically adjusting the current of the second electromagnetic collar (3664), the clamping force is preset and controlled to achieve reliable gripping without damaging the material; Step 2: Visual alignment and initial positioning; the three-axis adjustment component (2) drives the package (3) with the diode already clamped to move and adjust; the first electromagnetic collar (352) is energized to change the preset angle of the visual detector (354) on the crossbar of the rotating seat (351), and performs multi-dimensional image acquisition on key positions such as the solder joints of the substrate, providing data for the three-axis adjustment component to complete the initial spatial positioning of the solder joints; Step 3: Angle fine-tuning and secondary positioning; Based on the visual data from Step 2, the servo motor (363) drives the gear ring (365) to rotate via the gearbox (362). The rotation of the gear ring (365) will synchronously drive the diode to rotate, thereby finely adjusting the angle and relative position of the diode pins and completing the secondary alignment of the solder joint; Step 4: Verification and soldering encapsulation; Before soldering, the vision detector (354) can be rotated again to verify the clamping state; Subsequently, the electric actuator assembly (355) pushes the mounting bracket (356) at its end and the welding torch forward, precisely moving to the aligned welding point to complete the welding and encapsulation process.