UV curing device with light guide and in-process radiation measurement

Abstract

Apparatuses and methods for curing adhesive and simultaneously or in parallel evaluating curing in a robotic assembly unit are disclosed. An apparatus according to aspects of the present disclosure includes a radiation source configured to emit radiation during an assembly process to cure an adhesive in a cured region; a radiation guide configured to transmit radiation emitted from the radiation source to the curing area; and a sensor configured to measure a reflection of the transmitted radiation reflected back from the curing area during curing of the adhesive, where the sensor is located proximate the radiation guide; and a controller configured to determine whether the measured reflections meet a threshold, and to signal a remedial action of the assembly process based on the determination that the measured reflections do not meet the threshold.

Description

[0001] Cross-reference to related applications

[0002] This application claims priority to U.S. Provisional Application No. 63 / 510,082, filed June 23, 2023, entitled “UV Curing Apparatus with LightGuide and In-Process Radiometry,” which has been assigned to the assignee of this application, the entire contents of which are incorporated herein by reference as if fully set forth herein. Technical Field

[0003] This disclosure relates generally to additive manufacturing, and more specifically, to curing adhesives in robotic assembly units. Background Technology

[0004] 3D printing (also known as additive manufacturing, AM) has recently offered new opportunities to more efficiently construct complex transportation structures such as cars, airplanes, ships, motorcycles, buses, and trains. AM technology is capable of manufacturing complex parts using a wide variety of materials. Applying AM processes to industries that produce these products has proven to produce structurally more efficient transportation structures. For example, cars produced using 3D-printed parts can be stronger, lighter, and thus more fuel-efficient. Furthermore, AM enables manufacturers to 3D print parts that are far more complex and equipped with more advanced features and performance than parts manufactured via traditional machining and casting techniques. 3D objects can be formed using material layers based on the object's digital model data. A 3D printer can form a structure defined by the digital model data by printing one layer at a time.

[0005] 3D printing is design-independent, offering geometric and design flexibility that conventional manufacturing processes cannot provide. Furthermore, 3D printing technology can produce parts with extremely small feature sizes, as well as geometries that are difficult or impossible to produce using conventional manufacturing processes.

[0006] Despite these recent advances, several obstacles remain regarding the practical implementation of AM technology in transportation structures and other mechanized components. For example, regardless of whether AM is used to produce various parts of such equipment, manufacturers typically rely on labor-intensive and expensive techniques such as welding, riveting, etc., to join parts together, such as nodes used in transportation structures. The limitations associated with welding and similar techniques also apply to parts that are currently too large to be 3D printed in a single AM ​​step, such as vehicle gearboxes. A given 3D printer is often limited to rendering objects of finite size, typically determined by the available surface area of ​​the printer's build plate and the permissible volume that the printer can accommodate. In these cases, manufacturers are often relegated to building parts using conventional, expensive, and time-consuming processing techniques. Alternatively, manufacturers can 3D print multiple sub-parts and combine them to form complete functional parts. Summary of the Invention

[0007] The following section will describe more comprehensively several aspects of the apparatus and methods for designing joints for adhesive fixation, with reference to 3D printing technology.

[0008] The apparatus according to aspects of this disclosure includes a radiation head having a radiation source configured to emit radiation during an assembly process to cure an adhesive in a curing area, a radiation guide configured to transmit the radiation emitted from the radiation source to the curing area, and a sensor configured to measure the reflection of transmitted radiation reflected from the curing area during the curing of the adhesive, wherein the sensor is located near the radiation guide; and a controller configured to determine whether the measured reflection meets a threshold, and based on the determination that the measured reflection does not meet the threshold, to signal a remedial action of the assembly process.

[0009] This device may optionally include the radiation guide having a fused silica rod.

[0010] This device may also optionally include emitting the radiation from the radiation source and determining whether the measured reflection meets the threshold in parallel.

[0011] This device may also optionally include the controller, which is further configured to proceed to subsequent steps in the assembly process based on the determination that the measured reflection satisfies the threshold.

[0012] This device may also optionally include the remedial action, which includes stopping the assembly process or applying additional radiation to the adhesive.

[0013] This device may also optionally include the controller, which is further configured to adjust the threshold according to different curing conditions.

[0014] This device may optionally include the controller, which is also configured to signal the remedial action based on the difference between the measured reflection and the threshold.

[0015] This device may also optionally include a radiating head whose movement is angular, the angular movement changing the direction of the radiation emitted from the radiating head.

[0016] This device may also optionally include a light shield configured to receive the radiation source, the radiation guide, and the sensor.

[0017] This device may also optionally include a chassis, a radiator coupled to the sunshade, a gearbox coupled to the chassis, and a mounting arm coupled between the gearbox and the radiator.

[0018] This device may also optionally include the radiation source, which may include an ultraviolet (UV) source, and the adhesive may include a UV-curable adhesive.

[0019] The method according to aspects of this disclosure includes approaching features on the cured surface of a second part that is to be joined with a first part via a robotic process, performing a curing process within the assembly process by emitting radiation via a radiation source to cure an adhesive in the cured area during the assembly process, and sending the radiation emitted from the radiation source to the cured area via a radiation guide; performing a verification check during the assembly process by measuring the reflection of the transmitted radiation reflected from the cured area during the curing of the adhesive via a sensor, wherein the sensor is located near the radiation guide, determining whether the measured reflection meets a threshold, and signaling a remedial action of the assembly process based on the determination that the measured reflection does not meet the threshold.

[0020] This method may also include the radiation guide having a fused silica rod.

[0021] This method may also include emitting the radiation from the radiation source and determining whether the measured reflection meets the threshold in parallel.

[0022] This method may also include proceeding to subsequent steps in the assembly process based on the determination that the measured reflections satisfy the threshold.

[0023] This method may also include remedial actions, such as stopping the assembly process or applying additional radiation to the adhesive.

[0024] This method may also include adjusting the threshold according to different curing conditions.

[0025] This method may also include signaling the remedial action based on the difference between the measured reflection and the threshold.

[0026] This method may also include the radiation source including an ultraviolet (UV) source, and the adhesive including a UV-curable adhesive.

[0027] This method may also include the radiation source, the sensor, and the radiation guide being integrated into an end effector. The method includes the end effector being movable in an angular motion that alters the direction of the radiation emitted from the radiation source.

[0028] This method may also include retaining joints in which the first and second parts are additively manufactured.

[0029] It should be understood that, through the following detailed description, those skilled in the art will readily understand other aspects of the joining structure (or multiple structures) and sub-components, wherein only a few embodiments are shown and described by way of illustration. As those skilled in the art will recognize, the apparatus for adhesive fastening can have other and different embodiments, and several details thereof can be modified in various other aspects, all without departing from the invention. Therefore, the drawings and detailed description should be regarded as illustrative in nature, rather than restrictive. Attached Figure Description

[0030] Various aspects of the apparatus and method for printing joints with additive manufacturing structures will now be presented in detail, by way of example rather than limitation, with the accompanying drawings, wherein:

[0031] Figures 1A-1D Various side views of a 3-D printer system according to aspects of this disclosure are shown.

[0032] Figure 1E A functional block diagram of a 3-D printer system according to aspects of this disclosure is shown.

[0033] Figure 2 An example of an additively manufactured hollow node according to aspects of this disclosure is shown.

[0034] Figure 3 The connection at the retaining feature between the structures according to aspects of this disclosure is shown.

[0035] Figure 4 An exploded view of the mounting arm and radiating head according to aspects of this disclosure is shown.

[0036] Figure 5The process of performing the solidification process and the verification process in parallel according to aspects of this disclosure is illustrated.

[0037] Figure 6 This is a flowchart illustrating an example method of the system and method described herein.

[0038] Figure 7 This is a flowchart illustrating an example method of the system and method described herein. Detailed Implementation

[0039] The detailed description given below, in conjunction with the accompanying drawings, is intended to provide an exemplary description of joinable additive manufacturing structures (or structures) and sub-components, and is not intended to represent the only embodiments that can be practiced with respect to this disclosure. The term “exemplary” as used throughout this disclosure means “serving as an example, instance, or illustration” and is not necessarily to be construed as superior to or advantageous to other embodiments set forth in this disclosure. The detailed description includes specific details and is intended to provide a thorough and complete disclosure that fully communicates the scope of this disclosure to those skilled in the art. However, this disclosure can be practiced without these specific details. In some cases, well-known structures and components may be shown in block diagram form or omitted entirely to avoid obscuring the various aspects set forth in this disclosure.

[0040] Additive manufacturing

[0041] Additive manufacturing (AM) involves accumulating layers of material on a build plate using a stored geometric model to produce three-dimensional (3-D) components with features defined by the model. AM technology is capable of printing complex parts using a wide variety of materials. 3-D objects can be manufactured based on computer-aided design (CAD) models. CAD models can be used to generate a set of instructions or commands compatible with a specific 3D printer. The AM process can create solid 3D objects using CAD models and printing instructions. In the AM process, different materials or combinations of materials (such as engineering plastics, thermoplastic elastomers, metals, ceramics and / or alloys, or combinations thereof) can be used to create uniquely shaped 3D objects.

[0042] Using AM components in combination with two or more other parts can offer significant flexibility and cost savings. These and other benefits enable manufacturers of mechanical structures to produce parts at a lower cost and / or more efficiently. The combination techniques described in this disclosure relate to processes for joining AM components and / or commercial off-the-shelf (COTS) components. AM components are 3D parts printed by, for example, adding one or more materials layer by layer based on a pre-programmed design. The components described herein can be for assembling various devices, such as engine components, structural components, etc. Furthermore, without departing from the scope of this disclosure, such AM or COTS components can be used for assemblies such as vehicles, trucks, trains, motorcycles, boats, aircraft, etc., or other mechanized assemblies.

[0043] Components and terminology in AM

[0044] In this disclosure, the component is an example of an AM component. The component can be any 3D-printed component including features (such as interfaces) for mating with another component. The component can have internal or external features configured to accept a particular type of component. Alternatively or additionally, the component can be shaped to accept a particular type of component. Without departing from the scope of this disclosure, the component can utilize any internal design or shape and accept any kind of component.

[0045] Component interfaces can be configured to connect to another component. For example, but not limited to, interfaces between components can be tongue and groove structures. The interface can have high-precision features or complex geometries, allowing it to perform specific functions, including creating connections across structures such as pipes, structural panels, extrusions, sheet metal, and / or other structural members.

[0046] For clarity, components may also include relatively simple connecting features configured to connect with a more complex network of connecting features at the interface to form streamlined connections between structures. While these components may contain more basic features, they can advantageously be 3D printed at higher printing rates. Alternatively, suitable non-3D printing manufacturing techniques can be used to construct the components.

[0047] Many different AM technologies can be well-suited for constructing parts in transport structures or other mechanized assemblies. Such 3D printing technologies can include, for example, directed energy deposition (DED), selective laser melting (SLM), selective laser sintering (SLS), direct metal laser sintering (DMLS), electron beam melting (EBM), powder bed fusion (PBF), and / or other AM processes involving the melting or fusion of metal powders.

[0048] Like many 3D printing technologies, these processes (such as PBF systems) create building blocks layer by layer. Each layer, or “slice,” is formed by depositing a layer of powder and exposing a portion of the powder to an energy beam. The energy beam is applied to the molten region of the powder layer, which coincides with the cross-section of the building block within the layer. The molten powder cools and melts to form a slice of the building block. This process can be repeated to form the next slice of the building block, and so on. Each layer is deposited on top of the previous one. The resulting structure is a building block assembled piece by piece, starting from the ground up. SLS and various other PBF technologies can be well-suited for the construction of gearboxes and other transportation structural components. However, it should be understood that other AM technologies, such as fused deposition modeling (FDM), can also be used for such applications.

[0049] Tongue-and-groove (TNG) structures can be used to connect two or more components at an interface. For example, the tongue portion of a component can act as a single protrusion surrounding a peripheral area, extending all the way around that area. The tongue portion of a component can also project outwards relative to the peripheral area of ​​that component; in this view, the lateral extension of the tongue portion can be considered as "coming out" of the component.

[0050] The recessed portion of the interface is part of the second component and can be provided along the peripheral area of ​​the second component. The recessed portion may, but does not necessarily, include the material of the second component. The recessed portion may extend all the way around the peripheral area and may be a single channel in the second component. The recessed portion may also be inserted inward along the peripheral area relative to the second component and travel laterally around the second component. The tenon and the recess can be arranged on the first and second components such that when the two components are placed at the contact point, the tenon can be aligned with the recess and can be fitted into the recess around the peripheral area at the interface between the two components.

[0051] While this disclosure primarily relates to the use of tenons and grooves to join two or more components, the techniques described herein are not limited to tenons and grooves. In fact, any suitable technique for joining multiple structures may be used without departing from the scope of this disclosure.

[0052] An AM can include the fabrication of one or more nodes. A node is a structural member that can include one or more interfaces for connecting to other nodes or spanning components such as pipes, extrusions, panels, etc. Using an AM, nodes can be constructed to include additional features and functions, including interface functionality, depending on the object. As described herein, the terms node and structure are used interchangeably.

[0053] As mentioned above, nodes and other components can be connected together. For example, one or more nodes and / or other components can be connected together to form a larger component. Therefore, individual AM structures often need to be connected together, or individual AM structures often need to be connected to machined or COTS parts to provide the combined structure, such as realizing the aforementioned modular network or forming complex internal assemblies in a vehicle. Examples include structure-to-structure connections, structure-to-panel connections, structure and pipe connections, and structure-extrusion connections, etc. For example, to connect AM joint components to body panels, mechanical connectors (such as screws, clamps, etc.) can be used. Alternatively or additionally, adhesives can be used to form a strong bond. To connect these parts, tight tolerances are usually required, meaning that the parts must be positioned for precise assembly in a given orientation. For example, it may be necessary to position the two parts to be adhered to avoid direct contact with each other, thereby mitigating potential electrolytic corrosion problems. Generally, the adhesive bond between the AM joint component and the panel should allow for precise assembly. Therefore, for example, the AM joint component should not be misaligned or offset from the body panel, and the parts should maintain the correct orientation when establishing a permanent bond.

[0054] This disclosure relates to curing adhesives in robotic assembly units and evaluating the cured adhesives in real time.

[0055] Additive Manufacturing Environment

[0056] Figures 1A-1D Various side views of a 3-D printer system according to aspects of this disclosure are shown.

[0057] In this disclosure, the 3D printer system may be a powder-bed fusion (PBF) system 100. Figures 1A-1D The PBF system 100 is shown during different operational phases. Figures 1A-1DThe specific embodiment shown is one of many suitable examples of PBF systems employing the principles of this disclosure. It should also be noted that... Figures 1A-1D Elements in other figures in this disclosure are not necessarily drawn to scale, but may be drawn larger or smaller for better illustration of the concepts described herein. The PBF system 100 may include a depositor 101 capable of depositing each layer of metal powder, an energy beam source 103 capable of generating an energy beam, a deflector 105 capable of applying the energy beam to melt the powder material, and a build plate 107 capable of supporting one or more components, such as build 109. Although the terms “melting” and / or “positive melting” are used to describe the mechanical coupling of powder particles, other mechanical actions (e.g., sintering, melting, and / or other electrical, mechanical, electromechanical, electrochemical, and / or chemical coupling methods) are also considered to be within the scope of this disclosure.

[0058] The PBF system 100 may also include a build base plate 111 located within a powder bed container. The walls of the powder bed container 112 typically define the boundaries of the powder bed container, with the build base plate 111 sandwiched between the walls 112 and adjacent to a portion of the underlying build base plate 111. The build base plate 111 may be gradually lowered (build plate 107) so that the depositor 101 can deposit the next layer. The entire apparatus may reside within a chamber 113 that can enclose other components, thereby protecting the equipment, enabling atmospheric and temperature regulation, and mitigating the risk of contamination. The depositor 101 may include a hopper 115 containing powder 117 (such as metal powder) and a leveler 119 capable of leveling the top of each layer of deposited powder.

[0059] Specific reference Figure 1A The figure shows the PBF system 100 after the slice of component 109 has been melted, but before the next layer of powder has been deposited. In fact, Figure 1A The diagram shows the current state (e.g., formed by 200 individual slices) of the PBF system 100 after it has deposited and melted slices in multiple layers (e.g., 200 individual layers) to form the current state of the building block 109. The multiple individual layers that have been deposited have created a powder bed 121, which includes deposited but unmelted powder.

[0060] Figure 1B The diagram illustrates a PBF system 100 at a stage where the build base 111 can reduce the powder layer thickness 123. Lowering the build base 111 causes the build member 109 and powder bed 121 to decrease the powder layer thickness 123, such that the top of the build member 109 and powder bed 121 is lower than the top of the powder bed container wall 112 by an amount equal to the powder layer thickness 123. Thus, for example, a space with a uniform thickness equal to the powder layer thickness 123 can be created above the top of the build member 109 and powder bed 121.

[0061] Figure 1CA PBF system 100 in the following stage is shown, wherein a depositor 101 is positioned to deposit powder 117 in a space created above the top surface of a component 109 and a powder bed 121, the space being defined by a powder bed container wall 112. In this example, the depositor 101 moves gradually above the defined space while releasing powder 117 from a hopper 115. A leveler 119 can level the released powder to form a powder layer 125, leaving a top surface 126 configured to receive molten energy from an energy beam source 103. The thickness of the powder layer 125 is substantially equal to the powder layer thickness 123 (see [link to relevant documentation]). Figure 1B Therefore, the powder in the PBF system can be supported by a powder material support structure, which may include, for example, a build plate 107, a build base plate 111, a build element 109, a wall 112, etc. It should be noted that the thickness of the powder layer 125 shown (i.e., the powder layer thickness 123) is... Figure 1B ()) Greater than is used when referring to the above text. Figure 1A The actual thickness of the 200 previously deposited individual layers discussed.

[0062] Figure 1D The PBF system 100 is shown in the following stage, with a powder layer 125 deposited. Figure 1C Following this, energy beam source 103 generates energy beam 127, and deflector 105 applies the energy beam to melt the next slice in the building block 109. In various exemplary embodiments, energy beam source 103 may be an electron beam source, in which case energy beam 127 constitutes an electron beam. Deflector 105 may include deflection plates that can generate an electric or magnetic field that selectively deflects the electron beam such that the electron beam scans over a designated area to be melted. In various embodiments, energy beam source 103 may be a laser, in which case energy beam 127 is a laser beam. Deflector 105 may include an optical system that uses reflection and / or refraction to manipulate the laser beam to scan the selected area to be melted.

[0063] In various embodiments, deflector 105 may include one or more gimbals and actuators that can rotate and / or translate the energy beam source to position the energy beam. In various embodiments, the energy beam source 103 and / or deflector 105 may modulate the energy beam, for example, by turning the energy beam on and off during deflector scanning, such that the energy beam is applied only to appropriate areas of the powder layer. For example, in various embodiments, the energy beam may be modulated by a digital signal processor (DSP).

[0064] Figure 1E A functional block diagram of a 3-D printer system according to aspects of this disclosure is shown.

[0065] In this disclosure, control devices and / or elements, including computer software, may be coupled to PBF system 100 to control one or more components within PBF system 100. Such devices may be computer 150, which may include one or more components that can assist in controlling PBF system 100. Computer 150 may communicate with PBF system 100 and / or other AM systems via one or more interfaces 151. Computer 150 and / or interface 151 are examples of devices that can be configured to implement the various methods described herein that can assist in controlling PBF system 100 and / or other AM systems.

[0066] In this disclosure, computer 150 may include at least one processor unit 152, memory 154, signal detector 156, digital signal processor (DSP) 158, and one or more user interfaces 160. Computer 150 may include additional components without departing from the scope of this disclosure.

[0067] Computer 150 may include at least one processor unit 152, which may assist in the control and / or operation of PBF system 100. Processor unit 152 may also be referred to as central processing unit (CPU). Memory 154, which may include read-only memory (ROM) and random access memory (RAM), may provide instructions and / or data to the processor. A portion of memory 154 may also include non-volatile random access memory (NVRAM). Processor 152 typically performs logical and arithmetic operations based on program instructions stored in memory 154. Instructions in memory 154 may be executable (e.g., executed by processor unit 152) to implement the methods described herein.

[0068] Processor unit 152 may include or be a component of a processing system implemented with one or more processors. The one or more processors may be implemented with any combination of a general-purpose microprocessor, microcontroller, digital signal processor (DSP), floating-point gate array (FPGA), programmable logic device (PLD), controller, state machine, gated logic, discrete hardware component, special-purpose hardware finite state machine, or any other suitable entity capable of performing information computation or other operations.

[0069] Processor unit 152 may also include a machine-readable medium for storing software. Software should be interpreted broadly as any type of instruction, whether referred to as software, firmware, middleware, microcode, hardware description language, or others. Instructions may include code (e.g., source code format, binary code format, executable code format, RS-274 instructions (G-code), numerical control (NC) programming languages, and / or any other suitable code format). When executed by one or more processors, the instructions cause the processing system to perform the various functions described herein.

[0070] Computer 150 may also include a signal detector 156, which can be used to detect and quantify signals of any level received by computer 150 for use by processing unit 152 and / or other components of computer 150. Signal detector 156 can detect signals such as the power of energy beam source 103, the position of deflector 105, the height of build plate 111, the amount of powder 117 remaining in depositor 101, the position of leveler 119, and other signals. In addition to or in place of processor unit 152, signal detector 156 can also control other components as described with respect to this disclosure. Computer 150 may also include a DSP 158 for processing signals received by computer 150. DSP 158 can be configured to generate instructions and / or instruction packets for transmission to PBF system 100.

[0071] In some aspects, computer 150 may also include user interface 160. User interface 160 may include a keyboard, pointing device, and / or display. User interface 160 may include any elements or components that convey information to and / or receive input from the user of computer 150.

[0072] Various components of computer 150 can be coupled together via bus system 151. Bus system 151 may include, for example, a data bus, as well as power buses, control signal buses, and status signal buses in addition to the data bus. Components of computer 150 can be coupled together or use some other mechanism to accept or provide input to each other.

[0073] although Figure 1E The diagram shows multiple individual components, but these components can be combined or used together to implement one or more of them. For example, processor unit 152 can be used not only to implement the functions described above regarding processor unit 152, but also to implement the functions described above regarding signal detector 156, DSP 158, and / or user interface 160. Furthermore, Figure 1E Each component shown can be implemented using multiple individual elements.

[0074] By way of example, one or more processors may be used to implement elements, any part of elements, or any combination of elements. Examples of processors include microprocessors, microcontrollers, graphics processing units (GPUs), central processing units (CPUs), application processors, digital signal processors (DSPs), reduced instruction set computing (RISC) processors, system-on-a-chip (SoCs), baseband processors, field-programmable gate arrays (FPGAs), programmable logic devices (PLDs), state machines, gated logic, discrete hardware circuits, and other suitable hardware configured to perform the various functions described in this disclosure. One or more processors may execute the software as described above.

[0075] In one or more aspects, the described functions can be implemented using hardware, software, firmware, or any combination thereof. If implemented in software, these functions can be stored or transmitted as one or more instructions or codes on a computer-readable medium. Computer-readable media include computer storage media and communication media, including any medium that facilitates the transfer of a computer program from one place to another. Storage media can be any available medium that is accessible to a computer. By way of example and not limitation, such computer-readable media can include RAM, ROM, EEPROM, optical disc (CD) ROM (CD-ROM) or other optical disc storage, disk storage or other magnetic storage devices, or any other medium that can be used to carry or store the required program code in the form of instructions or data structures and is accessible to a computer. Disks and optical discs as used herein include CDs, laser discs, optical discs, digital versatile optical discs (DVDs), floppy disks, and Blu-ray discs, where disks typically reproduce data magnetically, while optical discs reproduce data optically using lasers. Therefore, computer-readable media includes non-transitory computer-readable media (e.g., tangible media).

[0076] Robot assembly environment

[0077] Figure 2 A perspective view of an example of a non-fixed assembly system 200 is shown. The non-fixed assembly system 200 can be used for various operations associated with the non-fixed assembly of vehicles, such as robotic assembly of node-based vehicles. The non-fixed assembly system 200 may include one or more elements associated with at least a portion of the assembly of a vehicle without any fasteners. For example, one or more elements of the non-fixed assembly system 200 may be configured for one or more operations in which, during robotic assembly of a node-based vehicle, a first structure is combined with one or more other structures without using any fasteners.

[0078] Assembly unit 205 can be configured at the location of the non-fixed assembly system 200. Assembly unit 205 can be a vertical assembly unit. Within assembly unit 205, the non-fixed assembly system 200 can include a group of robots 207, 209, 211, 213, 215, and 217. Robot 207 can be referred to as a keystone robot. The non-fixed assembly system 200 can include a parts table 221 that can accommodate parts and structures accessed by the robots. For example, a first structure 223 and a second structure 225 can be placed on one of the parts table 221 for pickup and assembly by the robot. In various embodiments, one or more structures can be additively manufactured structures, such as complex nodes.

[0079] The non-fixed assembly system 200 may also include a computing system 229 for issuing commands to various controllers of the robot in the assembly unit 205. In this example, the computing system 229 is communicatively connected to the robot via wireless communication. The non-fixed assembly system 200 may also include a metering system 231, which can accurately measure the position of the robot's robotic arm and / or the structure held by the robot.

[0080] Compared to conventional robot assembly plants, in the non-fixed assembly system 200, structures can be assembled without fasteners. For example, the structures do not need to be connected within any fasteners, such as those described above. Instead, at least one robot in assembly unit 205 can provide the functionality desired by the fasteners. For example, a robot can be configured (e.g., using an end effector of a robot arm) to directly contact the structures to be assembled within assembly unit 205, allowing these structures to be engaged and held without any fasteners. Furthermore, at least one robot can provide the functionality desired by the positioner and / or station. For example, a Keystone robot 207 can replace the positioner and / or station in the non-fixed assembly system 200.

[0081] The Keystone robot 207 may include a base and a robotic arm. The robotic arm may be configured to move, which may be guided by computer-executable instructions loaded into a processor communicatively connected to the Keystone robot 207. The Keystone robot 207 may contact the surface of the assembly unit 205 (e.g., the base plate of the assembly unit) via the base.

[0082] The Keystone robot 207 may include and / or connect to an end effector configured to engage and retain a first structure, such as a part of a vehicle. The end effector may be a component configured to abut with at least one structure. Examples of end effectors may include jaws, grippers, pins, or other similar components capable of facilitating non-fixed engagement and retention of a structure by the robot. In some embodiments, the first structure may be a portion of a vehicle chassis, body, frame, panel, base member, etc. For example, the first structure may include a base plate.

[0083] In some embodiments, the Keystone robot 207 may maintain a connection to the first structure via an end effector, while a set of other structures are (directly or indirectly) connected to the first structure. The Keystone robot 207 may be configured to engage and hold the first structure without any fasteners—for example, the aforementioned fasteners are not present in the non-fastener assembly system 200. In some embodiments, the structure to be held by at least one robot (e.g., the first structure) may be additively manufactured or co-printed with one or more features that facilitate engagement and holding of these structures by at least one robot without the use of any fasteners.

[0084] While holding the first structure, the Keystone robot 207 can position (e.g., move) the first structure; that is, the position of the first structure can be controlled by the Keystone robot 207 when it holds it. The Keystone robot 207 can hold or grasp the first structure, for example, using an end effector of the Keystone robot's robotic arm. For example, the Keystone robot 207 can hold the first structure by causing gripper fingers, jaws, etc., to contact one or more surfaces of the first structure and apply sufficient pressure thereto, allowing the Keystone robot to control the position of the first structure. In other words, when held by the Keystone robot 207, free movement of the first structure in space can be prevented, and the movement of the first structure can be restricted by the Keystone robot. As described above, the first structure may include one or more features that facilitate the non-fixed engagement and holding of the first structure by the Keystone robot 207.

[0085] When other structures (including sub-components, substructures of structures, etc.) are connected to the first structure, the Keystone robot 207 can maintain engagement with the first structure via its end effector. The first structure and the aggregate of one or more structures connected to it can be referred to as the structure itself, but it can also be referred to as a component or sub-component. Once the Keystone robot has engaged with the first structure, the Keystone robot 207 can maintain engagement with the components.

[0086] In some embodiments, the robots 209 and 211 of the assembly unit 205 may be similar to the Keystone robot 207 and may therefore include corresponding end effectors configured to engage with structures that can be connected to a first structure when held by the Keystone robot. In some embodiments, robots 209 and 211 may be referred to as assembly robots and / or material handling robots.

[0087] In some embodiments, robot 213 of assembly unit 205 can be used to influence the structural connection between the first structure and the second structure. For example, robot 213 can be referred to as a structural adhesive robot. Structural adhesive robot 213 can be similar to keystone robot 207, except that the structural adhesive robot may include a tool located at the distal end of the robot arm, configured to apply structural adhesive to at least one surface of the structure not held securely by the keystone robot and the structure not held securely by assembly robots 209, 211, before or after the structure is positioned near the bonding point relative to other structures for bonding with other structures. The bonding point can be a location that allows the first structure to be bonded to the second structure. For example, in various embodiments, the first and second structures can be bonded by applying adhesive while the structures are in the bonding point and subsequently curing the adhesive.

[0088] In various embodiments, a fast-curing adhesive may be additionally applied to rapidly bond and hold the structure, allowing the structural adhesive to cure without both robots holding the structure. In this regard, robot 215 of the non-fixed assembly system 200 can be used to apply and rapidly cure the fast-curing adhesive. In this exemplary embodiment, a fast-curing UV adhesive can be used, and robot 215 may be referred to as a UV robot. UV robot 215 may be similar to keystone robot 207, except that the UV robot may include a tool at the distal end of its robot arm configured to apply and cure the fast-curing UV adhesive, for example, when the first structure is near the bond relative to the second structure. That is, when the first and / or second structures are near the bond obtained through the orientation of at least one robot arm of keystone robot 207 and / or assembly robots 209, 211, UV robot 215 can cure the adhesive after applying it to the first and / or second structures.

[0089] In various embodiments, the robot can be used for a variety of different roles. For example, robot 217 can perform the roles of an assembly robot (such as assembly robots 209, 211) and a UV robot (such as UV robot 215). In this respect, robot 217 can be referred to as an "assembly / UV robot". When the distal end of the robot arm of the assembly / UV robot includes an end effector (e.g., connected via a tool flange), assembly / UV robot 217 can provide functions similar to each of assembly robots 209, 211. However, when the distal end of the robot arm of the assembly / UV robot includes a tool configured to apply UV adhesive and emit UV light to cure the UV adhesive, assembly / UV robot 217 can provide functions similar to UV robot 215.

[0090] The fast-curing adhesive applied by UV robot 215 and assembly / UV robot 217 can provide partial adhesive bonding because the adhesive can maintain the relative positions of the first and second structures near the bond until the structural adhesive can be cured to permanently bond the first and second structures.

[0091] When assembling at least a portion of the vehicle in assembly unit 205, the second structure can be directly bonded to the first structure by guiding various robots 207, 209, 211, 213, 215, and 217. The additive structure can be indirectly bonded to the first structure. For example, the first structure can be directly bonded to the second structure by the movement of one or more of the keystone robot 207, the structural adhesive robot 213, at least one assembly robot 209, 211, and / or the UV robot 215. Subsequently, when the additive structure is directly bonded to the second structure, the first structure bonded to the second structure can be indirectly bonded to the additive structure. Therefore, the first structure, which can continue to be held by the keystone robot 207, can evolve throughout the assembly process as the additive structure is directly or indirectly bonded to it.

[0092] In some embodiments, assembly robots 209, 211 may, for example, bond two or more structures together loosely with a partially fast-curing adhesive before bonding the two or more structures to a first structure held by keystone robot 207. The two or more structures bonded to each other before being bonded to a structural assembly may also be structures and may also be referred to as sub-assemblies. Thus, when a structure forms part of a structural sub-assembly connected to the first structure by the movement of keystone robot 207, structural adhesive robot 213, at least one assembly robot 209, 211, and UV robot 215, the structures in the structural sub-assembly may be indirectly connected to the first structure when the structural sub-assembly is bonded to the structural assembly comprising the first structure.

[0093] In some embodiments, a structural adhesive may be applied, for example, deposited in a groove in one of the structures, before the first and second structures are brought into the vicinity of the bonding. For example, the structural adhesive robot 213 may include a dispenser for the structural adhesive and may apply the structural adhesive before the structures are brought into the vicinity of the bonding. In some embodiments, the structural adhesive may be applied after the structural components have been fully constructed (i.e., once each structure of the vehicle portion has been bonded to the first structure). For example, the structural adhesive may be applied to one or more joints or other connections between the first and second structures. In some embodiments, the structural adhesive may be applied separately from the non-fixed assembly system 200.

[0094] Once assembled, i.e., all structures are assembled and held together with partial adhesive, structural adhesive has been applied and can be cured. While the structural adhesive is curing, that part of the vehicle can be completed and thus suitable for use in the vehicle. For example, the complete structural assembly can meet any applicable industry and / or safety standards defined for consumer and / or commercial vehicles.

[0095] According to various embodiments, one or more of robots 207, 209, 211, 213, 215, 217 can be securely attached to the surface of assembly unit 205 via a corresponding base for each robot. For example, one or more robots may have bases bolted to the base plate of the assembly unit. In various other embodiments, one or more robots may include components configured to move the robot within assembly unit 205 or may be connected thereto. For example, carrier 219 in assembly unit 205 may be connected to assembly / UV robot 217.

[0096] Each of robots 207, 209, 211, 213, 215, and 217 may include features common to all or some of the robots. For example, all robots may include a base, each base having a surface that contacts assembly unit 205 (e.g., a bottom surface) (e.g., resting on or being secured to the base plate of the assembly unit). Each base may have another surface (e.g., a top surface and / or a surface disposed on the base opposite the surface that contacts assembly unit 205), and at the respective other surface, the base may be connected to the proximal end of a corresponding robotic arm of one of the robots.

[0097] In some embodiments, the base may be connected to the proximal end of the robot arm via at least one rotational and / or translational mechanism. The at least one rotational and / or translational mechanism may provide at least one degree of freedom in the movement of the end effector or other tool of the robot arm. Accordingly, the at least one rotational and / or translational mechanism may provide at least one degree of freedom in the movement of the structure engaged and held by the end effector or other tool of the robot arm.

[0098] Each robotic arm of robots 207, 209, 211, 213, 215, and 217 may include a distal end disposed opposite to the proximal end of the robotic arm. Each robotic arm of each robot may include an end effector and / or tool, such as an adhesive application tool, a curing tool, etc. The end effector or tool may be located at the distal end of the robotic arm. In some embodiments, the distal end of the robotic arm may be connected to the end effector or tool (or tool flange) via at least one rotational and / or translational mechanism, which may provide at least one degree of freedom in the movement of the tool and / or the movement of the structure engaged and held by the tool of the robotic arm.

[0099] In some embodiments, the distal end of the robotic arm may include a tool flange and a tool included at the tool flange; for example, the tool may be attached to the distal end of the robotic arm via the tool flange. The tool flange may be configured to include multiple tools. Thus, for example, when the distal end of the robotic arm of assembly / UV robot 217 includes an end effector (e.g., connected via a tool flange), assembly / UV robot 217 can provide functionality similar to each of assembly robots 209, 211. Furthermore, when the distal end of the robotic arm of assembly / UV robot 217 includes a tool configured to apply UV adhesive and emit UV light to cure the adhesive, assembly / UV robot 217 can provide functionality similar to UV robot 215.

[0100] According to some embodiments, a tool flange and / or tool can provide one or more additional degrees of freedom for rotation and / or translation of the structure engaged and held by the tool. This additional degree of freedom can complement one or more degrees of freedom provided by one or more mechanisms that connect a base to the proximal end of the robot arm and / or connect the distal end of the robot arm to the tool (or tool flange). Exemplarily, the robot arm of at least one of robots 207, 209, 211, 213, 215, 217 may include at least one joint configured to rotate and / or translate at the distal and / or proximal ends, such as an articulated joint, a ball joint, and / or other similar joints.

[0101] One or more of the corresponding connections of robots 207, 209, 211, 213, 215, and 217 (e.g., one or more rotational and / or translational mechanisms connecting various components of one of the robots), the corresponding tool flanges, and / or the corresponding tools can provide at least some (possibly all) of the six degrees of freedom (6DoF) of the structure engaged and held by the robots. The 6DoF can include forward / backward (e.g., swell), upward / downward (e.g., heave), and left / right (e.g., yaw) for translation in space, and can also include yaw, pitch, and roll for rotation in space. Access to various parts of the structure can be obtained through one or more of the 6DoFs, rather than using fasteners to hold the structure, which cannot provide 6DoF during movement of the structure and would also prevent access to important parts of the structure attached to it.

[0102] Each of robots 207, 209, 211, 213, 215, and 217 can communicate with a controller, such as... Figure 2 One of the controllers 237, 239, 241, 243, 245, and 247 shown. Each of the controllers 237, 239, 241, 243, 245, and 247 may include, for example, a memory and a processor communicatively connected to the memory, and may be similar to the referenced... Figure 1E The computer 150 and memory 154 are described. According to some other embodiments, one or more of the controllers 237, 239, 241, 243, 245, 247 may be implemented as a single controller, which is communicatively connected to one or more robots controlled by the single controller.

[0103] Computer-readable instructions for performing non-fixed assembly can be stored in the memory of controllers 237, 239, 241, 243, 245, 247, and the processor of the controller can execute these instructions to cause robots 207, 209, 211, 213, 215, 217 to perform various non-fixed operations, such as those described above.

[0104] Controllers 237, 239, 241, 243, 245, and 247 can be communicatively connected to one or more components of associated robots 207, 209, 211, 213, 215, or 217, for example, via wired (e.g., bus or other interconnection) and / or wireless (e.g., wireless LAN, wireless intranet) connections. For example, each of the controllers can issue commands, requests, etc., to one or more components of the associated robot to perform various non-fixed operations.

[0105] According to some embodiments, controllers 237, 239, 241, 243, 245, and 247 can issue commands, etc., to the robotic arms of associated robots 207, 209, 211, 213, 215, or 217, and can guide the robotic arms, for example, based on a set of absolute coordinates relative to a global unit reference frame of assembly unit 205. In various embodiments, controllers 237, 239, 241, 243, 245, and 247 can issue commands, etc., to tools attached to the distal end of the robotic arm. For example, the controllers can control the operation of the tool, including depositing a controlled amount of adhesive on the surface of a first or second structure via an adhesive applicator, exposing the adhesive deposited between structures to UV light for a controlled duration via a curing tool, etc. In various embodiments, controllers 237, 239, 241, 243, 245, and 247 can issue commands, etc., to end effectors at the distal end of the robotic arm. For example, the controllers can control the operation of the end effectors, including engaging, retaining, and / or manipulating structures.

[0106] According to various other aspects, a computing system (such as computing system 229) similarly having a processor and memory can be communicatively connected to one or more of controllers 237, 239, 241, 243, 245, 247. In various embodiments, the computing system can be communicatively connected to the controllers via wired and / or wireless connections, such as local area networks, intranets, wide area networks, etc. In some embodiments, the computing system can be implemented in one or more of controllers 237, 239, 241, 243, 245, 247. In some other embodiments, the computing system can be located outside of assembly unit 205.

[0107] The processor of the computing system can execute instructions loaded from memory, and the execution of instructions can cause the computing system to issue commands to controllers 237, 239, 241, 243, 245, 247, such as sending messages including commands to one of the controllers via a network connection or other communication link.

[0108] According to some embodiments, one or more of the commands may indicate a set of coordinates and may indicate an action performed by one of the robots 207, 209, 211, 213, 215, 217 associated with one of the controllers receiving the command. Examples of actions that can be indicated by the commands include guiding the movement of the robot arm, manipulating tools, engaging structures via end effectors, rotating and / or translating structures, and so on. For example, a command issued by a computing system may cause the controller 239 of assembly robot 209 to guide the robot arm in assembly robot 209 so that the distal end of the robot arm can be positioned based on a set of coordinates indicated by the command.

[0109] Instructions that enable the controller to control the robot's movements, loaded from memory and executed by the computing system's processor, can be based on computer-aided design (CAD) data. For example, a CAD model of assembly unit 205 (e.g., a CAD model including the physical robot) can be constructed and used to generate commands issued by the computing system.

[0110] Therefore, in one example of a non-fixed assembly process, multiple robots (e.g., robots 207, 209, 211, 213, 215 and / or 17) are controlled (e.g., by computing system 229 and / or one or more controllers 237, 239, 241, 243, 245, 247) to join two structures together within an assembly unit (e.g., a vertical assembly unit, such as assembly unit 205). The assembly operation can be repeated, allowing multiple structures to be combined for non-fixed assembly of at least a portion of a vehicle (e.g., vehicle chassis, body, panels, etc.). A first material handling robot (e.g., robot 209) can hold (e.g., using an end effector) a first structure (e.g., first structure 223) to be combined with a second structure (e.g., second structure 225), which is similarly held by a second material handling robot (e.g., robot 211). A structural adhesive dispensing robot (e.g., robot 213) can apply structural adhesive to the surface of the first structure held by the first robot. The first material handling robot can then position the first structure near the joint relative to the second structure held by the second material handling robot. A metering system (e.g., metering system 231) can implement a move-measy-re-correct (MMC) procedure to accurately measure, correct, and move the robot arm and / or the structure held by the robot to a preferred position near the joint (e.g., using laser scanning and / or tracking).

[0111] The positioned structures (e.g., structures 223, 225) can then be bonded together using a structural adhesive and cured (e.g., over time or using heat). However, since the curing rate of the structural adhesive can be relatively long, a fast-curing adhesive robot (e.g., robot 215 or robot 217) additionally applies the fast-curing adhesive to the first and / or second structures while the first and second structures are near the bond, and then switches to an end effector that emits electromagnetic (EM) radiation (e.g., ultraviolet (UV) radiation) toward the fast-curing adhesive. For example, the fast-curing adhesive robot can apply a UV adhesive strip to the surfaces of the first and / or second structures such that the UV adhesive contacts both structures, and then the robot can emit UV radiation toward the UV adhesive strip. In various embodiments, the fast-curing adhesive robot can apply UV adhesive to retaining features, such as retaining feature 304 described below. When exposed to EM radiation, the fast-curing adhesive cures at a faster rate than the structural adhesive, allowing the first and second structures to remain in their relative positions without fasteners. This enables the robot to quickly perform other tasks (e.g., holding and bonding other parts) without waiting for the structural adhesive to cure. Once the structural adhesive has cured, the first and second structures are bonded together with structural integrity.

[0112] However, because the first and second structures near the joint can be oriented in various positions, the UV adhesive strips contacting one or more surfaces or the UV adhesive in the retaining features may occasionally shift (e.g., dripping from the surface, leaking from the retaining feature window, and dripping). For example, one structure may be positioned inverted relative to another, so the UV adhesive may drip due to gravity. As a result, when the UV adhesive is cured, the first and second structures may unintentionally remain in positions that do not provide acceptable tolerances, thus affecting the structural integrity of the assembly.

[0113] Difficulty in applying UV adhesive near the joint can also lead to improper holding of the structure. For example, a material handling robot holding a first and second structure near the joint may be tightly packaged within an assembly unit. Therefore, a rapid-curing adhesive robot may struggle to maneuver around the material handling robot and apply UV adhesive to the structures near the joint within this tightly packaged area. Furthermore, since the metering system may also use laser tracking to perform MMC on these structures in this tightly packaged area, the rapid-curing adhesive robot may obstruct the laser and MMC processes when attempting to apply UV adhesive. Consequently, the entire assembly may be affected. For example, when forming an assembly by stacking different parts, misalignment of one structure may affect the alignment of other parts supported by that structure. Additionally, due to the frequent movement of structures and sub-assemblies during the assembly process, improper holding can cause a structure or sub-assembly to deflect or fall out of the assembly.

[0114] Assembly and disassembly of the connector

[0115] Figure 3 The connection at the retaining feature between the structures according to aspects of this disclosure is shown.

[0116] like Figure 3 As shown, subcomponent 300 may include multiple structures, such as a first structure 223 and a second structure 225. When the first structure 223 and the second structure 225 are coupled, for example at interface 302, the first structure 223 may have a retaining feature 304, while the second structure 225 may have an alignment feature 306 coupled to the retaining feature 304.

[0117] The retaining feature 304 can have multiple functions, such as visually ensuring that the first structure 223 and the second structure 225 are coupled together, and aligning the first structure 223 and the second structure 225. Furthermore, the retaining feature 304 can be used as an insertion point for adhesive to bond the first structure 223 and the second structure 225 together.

[0118] When the first structure 223 and the second structure 225 are coupled together, an adhesive, such as a fast-curing adhesive, can be placed in the retaining feature 304 to bond with the alignment feature 306, while a second adhesive (such as a structural adhesive) can be placed elsewhere between the first structure 223 and the second structure 225. The fast-curing adhesive can provide a quick connection for the sub-assembly 300 during other assembly operations, allowing the sub-assembly to be handled and moved as a single piece for other assembly operations.

[0119] also, Figure 3An example of a sub-component 300 is shown, which includes a first structure 223 that is coupled to a second structure 225 using a retaining feature 304 and an alignment feature 306.

[0120] The first structure 223 of sub-assembly 300 may have an adhesive dispensing robot (e.g., robot 213, 215, or 217) that injects fast-curing adhesive into the retaining feature 304. After the adhesive is dispensed into the retaining feature 304 and the alignment feature 306 of the second structure 225 is inserted into the adhesive in the retaining feature, the adhesive in the retaining feature may be exposed to EM radiation, such as ultraviolet (UV) light, to cure the fast-curing adhesive contained within the retaining feature 304, thereby bonding the first and second structures together. The alignment feature 306 may be referred to as a tenon, which may be placed in the fast-curing adhesive within the retaining feature 304 of the first structure 223 by a material handling robot (e.g., robot 209 or 211). The alignment feature 306 may include multiple segments spaced apart from each other, multiple openings (e.g., a grid or mesh shape), or may be a solid tenon that contacts the fast-curing adhesive when the alignment feature 306 (tenon) is inserted into the retaining feature 304.

[0121] In similar embodiments, the emission source (e.g., a radiation source or UV light source) is typically located at the end of the tool (e.g., the distal end of a robotic arm). This means that while the part itself is being cured using a single piece of hardware, the light output cannot be measured. Instead, separate hardware is required for curing, and separate hardware is required to perform a verification process that measures the light output after the part features have been cured. Therefore, a radiometer configured to perform the verification process can be positioned on a separate tool holder in a fixed location. Consequently, the assembly system will also involve separate robotic movements (e.g., for the verification process) to move over the part and perform a light output check at the fixed location to verify that the radiation emitted from the radiation source is within specifications, thereby determining whether the curing has passed or failed a threshold.

[0122] Furthermore, in similar embodiments, the tool can be further limited by the bulky size of the radiating head. For example, if a curved concave part is present, the tool cannot be easily fitted near the curved concave part. Instead, the robot may have to spend extra time at each stage of the assembly process to move the robot to different fixed positions to measure the light output and verify that the light is working properly.

[0123] To address the aforementioned limitations, this disclosure describes an apparatus that moves a radiation source (e.g., a UV LED chip) away from the distal end of a tool by emitting light through the addition of a radiation guide (or light guide). This results in a significantly smaller tool footprint because the radiation guide occupies a much smaller cross-sectional area compared to the radiation source being located at the tip. Therefore, the radiation guide can be positioned closer to small parts and cracks, fitted into smaller areas or areas with higher curvature, and allows for greater flexibility in the design of the part itself. Furthermore, the shape of the radiation guide allows for the mounting of a photodiode along it, enabling sensors in the photodiode to measure the orientation of light from the radiation source on the surface of the part upon reflection. Thus, this apparatus can combine the curing process with a verification and inspection process previously performed in a separate robotic tool and requiring separate robotic motion to perform verification checks in real time after the part has been cured.

[0124] Figure 4 An exploded view of the mounting arm and radiating head according to aspects of this disclosure is shown.

[0125] The apparatus 400 combines a radiation source 408 (e.g., a UV light source or LED chip), a radiation guide (or light guide), a spectrally tuned photodiode 410, and a custom circuit board (not shown) with a microcontroller that includes circuitry for irradiating, delivering, and evaluating the emitted light energy from the radiation source 408. The apparatus 400 is designed to use light energy reflected from the surfaces of the bonded parts as an active process evaluation. This allows for real-time evaluation, eliminating the need for additional processes to ensure appropriate light energy is delivered to the cured area. Furthermore, this reduces cycle time by eliminating the need for robotic motion to transfer the emitting device to a fixed radiometer and perform individual measurements. In this way, each cure can be evaluated not at the beginning and end of a set of cures, improving quality control throughout the process.

[0126] Radiation head 406 is radiation source 408, such as a UV light source and / or associated mechanical and electronic components, which generates radiation that can be used to cure adhesives, as referenced. Figures 5-7 The radiator head 406 may include, for example, a radiation source 408, a photodiode 410, a light shield 412, and a radiation guide 414. It may also include screws and / or other connecting / attaching hardware to connect the various parts of the radiator head 406 together, and may also connect the radiator head 406 to the mounting arm 402 and the heat sink 404.

[0127] Heat sink 404 can provide thermal management for device 400. For example, heat sink 404 can be attached to the back of radiation source 408.

[0128] The UV end-of-arm tool (EOT) (e.g., the LED emitter on the radiation source 408 and photodiode 410) facilitates rapid curing of the retaining joint that supports the frame during the assembly process. Furthermore, the integration of the radiation guide 414 allows the UV EOT to access narrow geometries by extending the optical path via a narrow fused silica rod. In some examples, the radiation guide 414 may consist of a 10 mm x 55 mm fused silica rod housed within a printed, custom metal housing. The housing may also be used to house the photodiode 410.

[0129] Radiation source 408 can provide radiation, such as UV radiation, which can be directed in one or more desired directions. For example, but not limited to, radiation source 408 can direct UV radiation to sunshade 412.

[0130] The radiometer, a combination of a photodiode 410 and software and circuitry on a printed circuit board (PCB) (not shown), enables the system to convert light energy and assess intensity to determine if the level meets a predetermined threshold. The radiometer assembly and included circuitry are configured to evaluate various curing profiles and the energy emitted due to reflections at different angles. The positioning code of the control device 400 can contain instructions for evaluating different curing processes with varying threshold levels. In this way, the threshold energy can be tuned for each curing type.

[0131] Photodiode 410 can be used for in-process radiation measurement. Photodiode 410 is held at an angle to measure reflected light emitted during the curing process. Photodiode 410 is a wavelength-tuned component selected for specific sensitivity to light output. As will be explained in more detail below, photodiode 410 is a sensor configured to measure light emitted from radiation source 408 reflected back from the surface of the part to be cured.

[0132] The light shield 412 can confine the field of view of the radiation source 408 within a given aperture. For example, but not limited to, the light shield 412 can contain radiation from the radiation source 408 to a desired exposure beam width, such that any radiation from the radiation source 408 can be directed to a desired location and / or radiation emission from undesired areas can be minimized.

[0133] Furthermore, the radiation guide 414 extends the light transmission from the radiation source 408 by allowing the radiation source 408 to be placed further away from the tip of the tool. Specifically, since the radiation guide 414 is made of fused silica, the radiation source 408 is located at the end of the radiation head 406. Fused silica transmits wavelengths efficiently with very low loss. In some examples, fused silica can retain more than 90% of the light output. In this way, the radiation guide 414 is able to draw the light from the radiation source 408 to the tip of the radiation guide 414. Other materials tend to block UV light, preventing the light from being transmitted efficiently.

[0134] Therefore, the radiation guide 414 provides at least two key functions to the device 400. First, the radiation guide 414 reduces the size footprint of the radiation source at the cured part. This increases design flexibility, as it relates to the placement of UV features in areas of external surface curvature. Second, the radiation guide 414 can provide a body on which a photodiode 410 is mounted, having a sufficiently low angle of incidence to perform radiometric measurements on various geometries encountered during automated assembly. For example, this could include UV features placed on areas of high convex curvature.

[0135] The dimensions of the mounting arm 402 and the radiating head 406 can be selected to allow access to spaces that are not easily accessible. In this aspect of the disclosure, the selection of the dimensions of the mounting arm 402 and the radiating head 406 allows robots 209, 211, 215, 217 to extend the radiating head 406 at a compound angle into a small assembly volume. In such an aspect, retaining features can be placed in a wider range of locations on any given component.

[0136] Furthermore, the nose section of the UV EOT can be articulated at + / -90 degrees and can be precisely positioned to five unique locations. These locations can be selected during the virtual commissioning process. In some examples, servo motors drive the output section of the UV EOT. The desired position can be sent to the UV EOT by the robot and can be temporarily (on the fly) changed to reconfigure the end effector geometry as needed, enabling access to structural geometry. A secondary feedback encoder may be included to provide redundancy in the position information.

[0137] The device 400 may also include a PCB (not shown). In some examples, a first PCB provides, adjusts, and regulates power to the LED light string in the UV LED chip (or radiation source 408), and a second PCB includes a microcontroller configured to evaluate the photodiode 410 and secondary feedback signals. In some examples, the microcontroller may also be configured to convert information into I / O signals that are sent to the robot as high, low, or fault states of the light output and position data from the secondary feedback. The PCB may also include circuitry to allow for dimensional calibration of the EOT during mechanical setup.

[0138] Combining a light source (e.g., radiation source 408) and a light measurement device (photodiode 410) into a single compact end effector (radiation head 406) allows for curing and curing qualification in a single event. This reduces the number of steps required in the process and shortens the process time.

[0139] Figure 5 The process of performing a curing process and a radiation measurement process during the process is shown in accordance with aspects of this disclosure.

[0140] Specifically, Figure 5 Example 500 shows a robot controller 501 configured to control a light source 509 (e.g., Figure 4 The radiation source 408 emits light and controls the radiometer 503 (e.g., Figure 4 The photodiode 410 in the radiometer 503 checks the emitted light against a reference value. Specifically, the robot controller 501 sends signals to the secondary PCB board via the microcontroller in the radiometer 503.

[0141] The radiometer may include at least a microcontroller 505 and a photodiode 507. The microcontroller 505 may contain logic that sends a pass or fail signal back to the robot controller 501.

[0142] As an initial step, the robot (e.g., Figure 2 The robots 209, 211, 213, 215, and 217 shown can be positioned to the part to be solidified (e.g., the first structure 223 or the second structure 225).

[0143] The robot controller 501 can signal the light source 509 to emit light 502 toward the curing surface 511 of the part to be cured. The light emitted from the light source 509 will then bounce off the curing surface 511. Measuring the reflected light from the curing surface of the part allows the device to use the same hardware for both the light source and the radiometer, and allows the device sufficient flexibility to work with arbitrary geometries. This means that even if the surface and curvature of the part have different designs, the device can adapt to each unique design.

[0144] While emitting light 502 to light source 509, robot controller 501 can also signal radiometer 503 to initiate in-process verification check 504 for measuring the emitted light reflected by photodiode 507. Microcontroller 505 on radiometer 503 will also determine whether the emitted light passes through 506 or fails 508 based on a threshold value determined by the measurement based on photodiode 507. This, in turn, signals robot controller 501 based on the threshold value, indicating whether the emitted light resulted in acceptable or defective curing. In some examples, the threshold value can be stored on microcontroller 505. The advantage of this is that it provides immediate feedback on the emitted light, allowing any defects to be detected at the exact location and time during the process. This allows the process to be paused, or the operator to diagnose the defect upon detection. Therefore, performing in-process / verification checks simultaneously or in parallel during the curing process can also save significant time from the assembly process.

[0145] Furthermore, the microcontroller 505 can adjust, control, and set the threshold because the reflection of emitted light may differ due to different materials, finishes, or surfaces of the cured surface 511. In other words, the radiometer 503 can easily adapt to different properties and materials.

[0146] If the process stops due to a malfunction, the user can intervene to determine the cause of the defect. For example, the malfunction might involve photodiode 507 not detecting sufficient light. In this case, a separate process could be used to adjust the UV volume or re-perform the curing.

[0147] It is beneficial to assess any issues during the process immediately upon detecting a defect, rather than at the end of a curing cycle, because remedial action can be taken at the exact location where the defect was detected. As an illustrative example, if no proper remedial action is taken when a defect occurs, and if low light output exists and the robot has gone through the entire curing process and cured several features, the low light output defect may not be detected until very late in the process. This means that there may have been several moves between the defective parts. Subsequently, the robot or the user will need to go back and inspect each one during curing, which is difficult to do. In this case, the user may decide to scrap the entire frame.

[0148] Figure 6 This is a flowchart 600 illustrating an exemplary process for performing a curing process and in-process verification checks according to the system and method described herein. The exemplary process may at least partially utilize... Figure 4 The assembly system and apparatus 400 shown herein are used for implementation. As described herein, some aspects can be implemented using other tools, systems, or devices. For example, an assembly system could be... Figure 2The non-fixed assembly system 200 discussed in the text.

[0149] In some cases, method 600 can be provided by a system (e.g., Figure 4 The device 400 shown is executed, and the system includes a radiating head comprising a radiation source, a radiation guide, a sensor, and a controller. For example, refer to [reference needed]. Figure 4 The radiator 406 may include a radiation source 408, a radiation guide 414, and sensors and controllers (not shown) on a photodiode 410. In some examples, the system may also include a chassis, a heat sink coupled to the sunshade, a gearbox coupled to the chassis, and a mounting arm coupled between the gearbox and the heat sink. For example, refer back to the reference. Figure 4 The radiator 406 may include a mounting arm 402 coupled between a gearbox (not shown) and a radiator 404 coupled to a sunshade 412.

[0150] At block 602, method 600 may include a feature approaching a cured surface of a second part to be coupled with the first part via a robotic process. In some examples, the first and second parts may be additively manufactured retaining joints.

[0151] At block 604, method 600 may include curing the adhesive in the curing region by emitting radiation via a radiation source during the assembly process, thereby performing a curing process within the assembly process. In some examples, the radiation source may include an ultraviolet (UV) source, and the adhesive may include a UV-curing adhesive.

[0152] In some examples, the radiation head may include a radiation source configured to emit radiation during the assembly process to cure the adhesive in the cured area. As an example, refer back to the reference. Figure 5 The light source 509 can emit radiation back from the cured surface 511.

[0153] At block 606, method 600 may include transmitting radiation emitted from a radiation source to a cured region via a radiation guide. In some examples, the radiation guide may include a fused silica rod. In some examples, the radiation head may include a radiation guide configured to transmit radiation emitted from a radiation source to the cured region.

[0154] At block 608, method 600 may include performing a verification check during assembly by measuring the reflection of emitted radiation reflected back from the cured area during adhesive curing via a sensor, wherein the sensor is located near the radiation guide. In some examples, the radiation head may include a sensor configured to measure the reflection of emitted radiation reflected back from the cured area during adhesive curing. For example, refer to [reference needed]. Figure 5The photodiode 507 can be configured to measure the reflection of emitted radiation from the cured surface 511 during adhesive curing.

[0155] In some examples, the sensor is positioned near the radiation guide. See the reference for an example. Figure 4 The photodiode 410 is placed near the radiation guide 414 in the light shield 412.

[0156] At block 610, method 600 may include determining whether the measured reflection meets a threshold. In some examples, emitting radiation from the radiation source and determining whether the measured reflection meets the threshold can be performed in parallel. Combining light and optical measurement equipment into a single compact end effector allows for simultaneous curing and curing qualification in a single event. This facilitates the detection of defects at the exact location and time of occurrence, and also reduces the number of required process steps and shortens process time.

[0157] At block 612, method 600 may include signaling a remedial action for the assembly process based on a determination that the measured reflection does not meet a threshold. In some examples, the controller may be configured to signal a remedial action for the assembly process based on a determination that the measured reflection does not meet a threshold. In some examples, the remedial action may include stopping the assembly process. In some examples, the remedial action may include applying additional radiation to the adhesive. In some examples, the signal for the remedial action may be based on the difference between the measured reflection and the threshold.

[0158] In some examples, the radiating head may include a controller configured to determine whether the measured reflection meets a threshold, and based on the determination that the measured surface does not meet the threshold, signal a remedial action for the assembly process.

[0159] In some examples, the radiation source, sensor, and radiation guide can be combined in the end effector. In some examples, the radiation head may include a shield configured to receive the radiation source, sensor, and radiation guide. For example, refer back to the reference. Figure 4 The radiation source 408, photodiode 410, and radiation guide 414 are all integrated into a radiation head 406, which can be attached to the end effector of the Keystone robot. In some examples, the end effector can move in angular motion by changing the direction of radiation emitted from the radiation source. For example, return to reference. Figure 2 The robots 209 and 211 of the assembly unit 205 may include or be connected to an end effector configured to engage with a structure that can be connected to a first structure when held by the keystone robot.

[0160] Figure 7This is a flowchart 700 illustrating an exemplary process for performing a curing process and in-process verification checks according to the system and method described herein. The exemplary process may at least partially utilize... Figure 4 The assembly system and apparatus 400 shown herein are used for implementation. As described herein, some aspects can be implemented using other tools, systems, or devices. Optional aspects are shown in dashed lines. For example, an assembly system could be... Figure 2 The non-fixed assembly system 200 discussed in the text.

[0161] Optionally, at block 702, method 700 may include adjusting the threshold according to different curing processes. Because the reflection of emitted light differs due to the different materials, finishes, surfaces, etc., of the cured surfaces, the threshold can be adjusted according to different curing processes.

[0162] At block 704, method 700 may include a feature on a solidified surface of a second part to be coupled to the first part via a robotic process.

[0163] At block 706, method 700 may include curing the adhesive in the curing area by emitting radiation via a radiation source during the assembly process, thereby performing a curing process within the assembly process.

[0164] At block 708, method 700 may include sending radiation emitted from a radiation source to the cured area via a radiation guide.

[0165] At block 710, method 700 may include performing a verification check during the assembly process by measuring the reflection of emitted radiation reflected back from the cured area during adhesive curing via a sensor, wherein the sensor is located near the radiation guide.

[0166] At block 712, method 700 may include determining whether the measured reflection meets a threshold.

[0167] At block 714, method 700 may include determining, based on the measured reflection satisfying a threshold, proceeding to subsequent steps within the assembly process.

[0168] Advantages provided by this disclosure

[0169] In this aspect of the disclosure, an apparatus and method are provided for performing curing and evaluating curing in parallel. This allows for real-time evaluation of the curing status, eliminating the need for additional processes to ensure adequate light energy delivery to the cured area. For example, improvements include significant time savings from the assembly process by having separate tools perform the curing and evaluation processes. Specifically, using the same hardware to perform the curing and evaluation processes simultaneously reduces cycle time by eliminating the movement of a robot to transfer the emitting device to a fixed radiometer and perform individual measurements. In this way, each curing can be evaluated at the point of defect rather than at the beginning and end of a set of curing processes, thus improving quality control during the process. It is advantageous to evaluate any problems during the process immediately upon detection of defects rather than at the end of a set of curing processes, as remedial actions can be taken at the exact location where the defect was detected.

[0170] The foregoing description is provided to enable those skilled in the art to practice the various aspects described herein. Various modifications to these exemplary embodiments presented throughout this disclosure will be apparent to those skilled in the art, and the concepts disclosed herein can be applied to other techniques for printing structures and interconnections. Therefore, the claims are not intended to be limited to the exemplary embodiments presented throughout this disclosure, but should be given the full scope consistent with the language of the claims. All structural and functional equivalents of elements of the exemplary embodiments described throughout the disclosure that are known or hereafter known to those skilled in the art are intended to be covered by the claims. Furthermore, nothing disclosed herein is intended to be disclosed, regardless of whether it is expressly referenced in the claims. No element of a claim shall be construed as construed under 35 USC §112(f) or similar law in applicable jurisdiction unless that element expressly uses the phrase “means for…” or, in the case of a method claim, the phrase “steps for…”.

Claims

1. A system comprising: A radiation head, comprising: A radiation source configured to emit radiation during the assembly process to cure the adhesive in the curing area; A radiation guide configured to transmit radiation emitted from the radiation source to the cured area; and A sensor configured to measure the reflection of transmitted radiation from the cured area during the curing of the adhesive, wherein the sensor is located near the radiation guide; and The controller is configured to determine whether the measured reflection meets a threshold, and based on the determination that the measured reflection does not meet the threshold, to signal a remedial action for the assembly process.

2. The system of claim 1, wherein the radiation guide comprises a fused silica rod.

3. The system according to claim 1, wherein, The emission of radiation from the radiation source and the determination of whether the measured reflection meets the threshold are performed in parallel.

4. The system of claim 1, wherein the controller is further configured to: Based on the determination that the measured reflection meets the threshold, the process continues to subsequent steps in the assembly process.

5. The system of claim 1, wherein the remedial action includes stopping the assembly process.

6. The system of claim 1, wherein the remedial action comprises applying additional radiation to the adhesive.

7. The system of claim 1, wherein the controller is further configured to: The threshold is adjusted according to the different curing processes.

8. The system of claim 1, wherein the controller is further configured to: The remedial action is signaled based on the difference between the measured reflection and the threshold.

9. The system of claim 1, wherein the radiating head is movable in an angular motion, the angular motion changing the direction of radiation emitted from the radiating head.

10. The system of claim 1, wherein the radiating head further comprises: A light shield configured to receive the radiation source, the radiation guide, and the sensor.

11. The system of claim 10, wherein the system further comprises: Chassis; A heat sink, which is coupled to the light shield; A gearbox coupled to the chassis; as well as The mounting arm is coupled between the gearbox and the radiator.

12. The system of claim 1, wherein the radiation source comprises an ultraviolet (UV) source, and the adhesive comprises a UV-curable adhesive.

13. A method comprising: The robotic process approaches the feature on the solidified surface of the second part, which is to be combined with the first part; The curing process is performed within the assembly process by emitting radiation via a radiation source to cure the adhesive in the curing area during the assembly process; Radiation emitted from the radiation source is transmitted to the cured area via a radiation guide; A verification check is performed during the assembly process by measuring the reflection of emitted radiation from the cured area during the curing of the adhesive via a sensor located near the radiation guide. Determine whether the measured reflection meets the threshold; as well as Based on the determination that the measured reflection does not meet the threshold, a signal is issued to perform a remedial action in the assembly process.

14. The method of claim 13, wherein the radiation guide comprises a fused silica rod.

15. The method of claim 13, wherein emitting radiation from the radiation source and determining whether the measured reflection satisfies the threshold are performed in parallel.

16. The method of claim 13, further comprising: Based on the determination that the measured reflection meets the threshold, the process continues to subsequent steps within the assembly process.

17. The method of claim 13, wherein the remedial action comprises stopping the assembly process.

18. The method of claim 13, wherein the remedial action comprises applying additional radiation to the adhesive.

19. The method of claim 13, further comprising: The threshold is adjusted according to the different curing processes.

20. The method according to claim 13, wherein, The remedial action is signaled based on the difference between the measured reflection and the threshold.

21. The method of claim 13, wherein the radiation source comprises an ultraviolet (UV) source, and the adhesive comprises a UV-curable adhesive.

22. The method of claim 13, wherein the radiation source, the sensor, and the radiation guide are combined in an end effector.

23. The method of claim 22, wherein the end effector is capable of moving in an angular motion that alters the direction of radiation emitted from the radiation source.

24. The method of claim 13, wherein the first part and the second part are additively manufactured retaining joints.

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