Copper header brazing device capable of forming inner weld legs based on solder guidance

Abstract

The invention belongs to the technical field of copper pipe brazing, and particularly relates to a copper collecting pipe brazing device for forming inner weld legs based on welding flux guiding. The copper collecting pipe brazing device for forming the inner weld leg based on the solder guide comprises a fixing mechanism suitable for fixing a thin pipe, a guide ring and an excess material collecting ring to a hole part of a thick pipe so as to form and keep a solder guide flow channel which turns and is communicated with the excess material collecting pipe after an inner hole opening is formed; and the heating assembly is arranged on the fixing mechanism and is suitable for heating the hole part, so that after the welding flux at the outer hole opening is melted, the welding flux flows along the welding flux guide runner, and after the welding flux turns at the inner hole opening to form an inner welding leg, the remaining welding flux flows into the remaining material collecting pipe. According to the device, the use amount of the welding flux can be controlled to be more simply controlled in an interval from a point value, the part, located in front of the excess material collecting pipe, of the welding flux guiding flow channel is filled with the welding flux, it can be guaranteed that a gap between the outer wall of a thin pipe and the hole wall is filled with the welding flux, and the welding flux can turn to form an inner welding foot after going out of an inner hole opening.

Description

Technical Field

[0001] This invention belongs to the field of copper pipe brazing technology, specifically relating to a copper manifold brazing device that forms inner weld legs based on solder guidance. Background Technology

[0002] When producing non-standard copper manifolds, holes are drilled in a thicker pipe, and then thinner pipes are brazed to each hole. Compared to the common brazing of two straight pipes joined together, this method results in a shorter gap for solder filling between the thinner pipe and the hole. Taking a common Φ108×3 thick pipe and a Φ22.2×1.2 thin pipe as an example, when one end of the thinner pipe is inserted into the hole, the gap between the outer wall of the thinner pipe and the hole wall is the gap for solder filling. The length of this gap is limited by the wall thickness of the thicker pipe, resulting in only a very short section. Therefore, controlling the amount of solder filling the gap when brazing the thinner pipe to each hole on the thicker pipe is currently very difficult. This is because the amount of solder that a gap can hold is a fixed value. If too little solder is used, the amount of solder will be below this value, and the gap will not be filled. If too much solder is used, the amount of solder will exceed this value, causing it to overflow from the gap, forming uncontrollable weld beads or even dripping onto the inner wall of the thicker pipe on the opposite side.

[0003] Therefore, in the current production of copper manifolds, it is difficult to control the amount of solder used when brazing the thin tube to the holes on the thick tube. This application proposes a copper manifold brazing device based on solder guidance to form inner weld feet. Summary of the Invention

[0004] The purpose of this invention is to provide a copper manifold brazing device based on solder guidance to form inner weld feet, so as to solve the technical problem of difficulty in controlling the amount of solder used when brazing the thin tube to each hole on the thick tube in the current copper manifold production.

[0005] To address the aforementioned technical problems, this invention provides a copper manifold brazing device based on solder guidance to form an inner solder joint, comprising: a fixing mechanism adapted to fix a thin tube, a guide ring, and a scrap collection ring in the bore of a thick tube, and to ensure that the top surface of the receiving groove formed on the top surface of the scrap collection ring abuts against the inner wall of the thick tube and the end face of the thin tube, respectively, to form a cavity, wherein the cavity is connected to the cavity formed by the outer wall of the thin tube and the bore wall, and the scrap collection tube disposed at the bottom of the cavity, so that the guide ring located in the cavity and extending into the bore is connected to the inner wall of the thick tube and the end face of the thin tube, respectively. The guide ring abuts against the outer wall of the thin tube and the wall of the hole through the protrusion of the cavity, so that the guide ring located in the cavity and extending into the cavity abuts against the wall and bottom of the cavity through the protrusion of the cavity, so as to form and maintain the solder guide flow channel that turns after exiting the inner orifice and connects to the residual material collection pipe; the heating component, which is set on the fixed mechanism, is suitable for heating the orifice so that the solder at the outer orifice melts and flows along the solder guide flow channel, and after turning at the inner orifice to form the inner weld foot, it continues to flow, and the excess solder flows into the residual material collection pipe.

[0006] The beneficial effect of this invention is that the copper manifold brazing device based on solder guidance to form inner solder feet can fix the thin tube, guide ring, and residual material collection ring to the hole of the thick tube through a fixing mechanism. This allows the top surfaces of the two groove edges of the residual material collection ring to abut against the inner wall of the thick tube and the end face of the thin tube, respectively. The guide ring abuts against the outer wall of the thin tube and the hole wall through the protruding part of the cavity, and the guide ring abuts against the groove wall and the bottom of the groove through the protruding part of the groove cavity. This forms and maintains a solder guiding flow channel that turns after exiting the inner hole and connects to the residual material collection tube. Thus, the amount of solder used only needs to be controlled to a level that allows it to overflow. Starting from the waste material collection tube and ending at the point where the waste material collection tube is filled, the portion of the solder guide channel before the waste material collection tube is filled with solder. The control of the amount of solder is changed from a single point value to a simpler control within a range. The fact that the portion of the solder guide channel before the waste material collection tube is filled with solder not only ensures that the gap between the outer wall of the thin tube and the hole wall is filled, but also allows the solder to turn after exiting the inner hole to form an inner weld leg, connecting the thin tube with the inner wall of the surrounding thick tube, resulting in a larger brazing connection area. Attached Figure Description

[0007] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings used in the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0008] Figure 1 This is a schematic diagram of the copper manifold brazing device based on solder guidance to form inner solder feet according to the present invention. Figure 1 ; Figure 2 This is a cross-sectional view of the copper manifold brazing apparatus of the present invention, which forms inner solder feet based on solder guidance. Figure 1 ; Figure 3 The explosion of the copper manifold brazing device based on solder guidance to form inner solder feet according to the present invention Figure 1 ; Figure 4 This is a cross-sectional view of the copper manifold brazing apparatus of the present invention, which forms inner solder feet based on solder guidance. Figure 2 ; Figure 5 The explosion of the copper manifold brazing device based on solder guidance to form inner solder feet according to the present invention Figure 2 ; Figure 6 This is a cross-sectional view of the copper manifold brazing apparatus of the present invention, which forms inner solder feet based on solder guidance. Figure 3 ; Figure 7 The explosion of the copper manifold brazing device based on solder guidance to form inner solder feet according to the present invention Figure 3 ; Figure 8 This is a cross-sectional view of the copper manifold brazing apparatus of the present invention, which forms inner solder feet based on solder guidance. Figure 4 ; Figure 9 This is a cross-sectional view of the copper manifold brazing apparatus of the present invention, which forms inner solder feet based on solder guidance. Figure 5 ; Figure 10 This is a schematic diagram of the copper manifold brazing device based on solder guidance to form inner solder feet according to the present invention. Figure 2 ; Figure 11 The explosion of the copper manifold brazing device based on solder guidance to form inner solder feet according to the present invention Figure 4 ; Figure 12 This is a three-dimensional view of the residual material collection ring of the copper manifold brazing device based on solder guidance to form inner solder feet according to the present invention; Figure 13 This is a schematic diagram of the copper manifold brazing device of the present invention, which forms inner weld legs based on solder guidance, when the tray is placed in the supporting recess; in the figure: Fixed mechanism 100, coarse pipe adjusting assembly 110, adjusting track 111, adjusting slider 112, pipe clamp seat 113, clamp plate 114, pipe clamp bolt 115, welded base rod 120, ring support assembly 130, ring support block 131, support recess 132, tray 133, annular protrusion 134, support step 135, ring fixing assembly 140, fine pipe pressure ring 141, tray screw hole 142, fixing bolt 143, lifting assembly 150, lifting base 151, lifting connecting rod 152, lifting knob 153, base rod clamping base 161, clamping arm 162, guide ring 200, annular groove cavity 210, annular hole cavity 220, residual material collection ring 300, accommodating 310 groove, top surface of groove edge 311, groove cavity 410, bottom gap of groove 411, gap of groove wall 412, inner wall gap of coarse tube 413, end face gap of thin tube 414, cavity 420, wall gap of hole 421, outer wall gap of thin tube 422, residual material collection pipe 430, branch channel 440, cavity protrusion 510, groove cavity protrusion 520, bottom protrusion of groove 521, wall protrusion of groove wall 522, welding material guide channel 600, heating component 700, welding torch 710, grinding and cutting motor 800, transmission part 810, thin tube 910, outer wall of thin tube 911, end face of thin tube 912, coarse tube 920, inner wall of coarse tube 921, hole wall 931, inner orifice 932, outer orifice 933, cutting blade 940. Detailed Implementation

[0009] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments implemented by those skilled in the art without creative effort are within the protection scope of the present invention. Example

[0010] like Figure 1 , 2 As shown in Figures 3 and 5, the present invention provides a copper manifold brazing device based on solder guidance to form an inner solder foot, comprising: a fixing mechanism 100, which is adapted to fix a thin tube 910, a guide ring 200, and a scrap collection ring 300 in the hole of a thick tube 920, and to make the top surface 311 of the groove edge of the receiving groove 310 opened on the top surface of the scrap collection ring 300 abut against the inner wall 921 of the thick tube and the end face 912 of the thin tube respectively to form a groove cavity 410, and to make the groove cavity 410 communicate with the cavity 420 formed by the outer wall 911 of the thin tube and the hole wall 931, and the scrap collection pipe 430 provided at the bottom of the groove, so that the guide ring 200 located in the groove cavity 410 and extending into the cavity 420 can be guided to form a guide ring 200. The guide ring 200 abuts against the outer wall 911 and the hole wall 931 of the thin tube through the cavity protrusion 510, so that the guide ring 200 located in the groove cavity 410 and extending into the hole cavity 420 abuts against the groove wall and the bottom of the groove through the groove protrusion 520, so as to form and maintain the solder guide flow channel 600 that turns after exiting the inner hole 932 and connects to the residual material collection pipe 430; the heating component 700 is set on the fixing mechanism 100 and is suitable for heating the hole so that the solder at the outer hole 933 melts and flows along the solder guide flow channel 600, and continues to flow after turning at the inner hole 932 to form an inner solder foot, and the remaining solder flows into the residual material collection pipe 430.

[0011] This copper manifold brazing device, which forms an inner weld bead based on solder guidance, can fix the thin tube 910, guide ring 200, and residual material collection ring 300 to the hole of the thick tube 920 through the fixing mechanism 100. This allows the top surfaces 311 of the two groove edges of the residual material collection ring 300 to abut against the inner wall 921 of the thick tube and the end face 912 of the thin tube, respectively. The guide ring 200 abuts against the outer wall 911 of the thin tube and the hole wall 931 through the cavity protrusion 510, and against the groove wall and bottom through the groove protrusion 520. This forms and maintains a solder guiding flow channel 600 that turns after exiting the inner hole 932 and connects to the residual material collection pipe 430. In this way, the amount of solder used only needs to be controlled... By controlling the amount of solder within the range from the overflow discharge collection pipe 430 to the point where the discharge collection pipe 430 is filled, the portion of the solder guide channel 600 before the discharge collection pipe 430 can be filled with solder. The control of the amount of solder is changed from a single point value to a simpler control within a range. Furthermore, the fact that the portion of the solder guide channel 600 before the discharge collection pipe 430 is filled with solder not only ensures that the gap between the outer wall 911 of the thin tube and the hole wall 931 is filled, but also allows the solder to turn after exiting the inner hole 932 to form an inner weld leg, connecting the thin tube 910 with the surrounding inner wall 921 of the thick tube, resulting in a larger brazing connection area.

[0012] In at least one embodiment, the solder guide channel 600, extending from the outer orifice 933 to the end of the residual material collection tube 430, is formed by the guide ring 200 and the residual material collection ring 300 as follows.

[0013] like Figure 2 , 3 As shown in Figures 4 and 5, the top surface 311 of the groove edge is curved to abut against the inner wall 921 of the thick tube and the end face 912 of the thin tube, respectively. The groove cavity protrusion 520 may include a plurality of groove bottom protrusions 521, which are spaced apart at the bottom of the receiving groove 310 to support the guide ring 200, forming and maintaining a continuous groove bottom gap 411 between the guide ring 200 and the groove bottom. A plurality of groove wall protrusions 522 are spaced apart on both groove walls of the receiving groove 310 to limit the guide ring 200 by abutting against it, forming and maintaining a continuous groove wall gap 412 between the guide ring 200 and the groove wall, and communicating with the groove bottom gap 411.

[0014] like Figure 3 , 4As shown in Figure 5, the guide ring 200 may include: an annular groove cavity 210, which is supported by the groove bottom protrusion 521, abuts against the groove wall protrusion 522, and is sunk into the receiving groove 310 to form and maintain a gap 413 between the inner wall 921 of the coarse tube and a gap 414 between the end face 912 of the thin tube, and the gap 413 between the inner wall 921 of the coarse tube and the gap 414 between the end face 912 of the thin tube are respectively connected to the corresponding groove wall gap 412; and an annular cavity 220, which is provided with On the annular groove cavity 210, and extending into the cavity 420, a plurality of cavity protrusions 510 are provided at intervals on the outer and inner walls, so as to limit the thin tube 910 in the radial direction of the hole by respectively abutting against the hole wall 931 and the outer wall 911 of the thin tube, forming and maintaining a continuous hole wall gap 421 and thin tube outer wall gap 422, and the hole wall gap 421 communicates with the inner wall gap 413 of the thick tube and forms a bend, and the thin tube outer wall gap 422 communicates with the thin tube end face gap 414 and forms a bend.

[0015] refer to Figure 4 This forms one path: the outer orifice 933, the hole wall gap 421, the coarse tube inner wall gap 413, and the groove wall gap 412 corresponding to the coarse tube inner wall gap 413; and another path: the outer orifice 933, the thin tube outer wall gap 422, the thin tube end face gap 414, and the groove wall gap 412 corresponding to the thin tube end face gap 414. Finally, they converge at the bottom gap 411 and then lead to the solder guide channel 600 of the residual material collection pipe 430. After the heating component 700 heats the hole, the solder at the outer orifice 933 melts and, through capillary action, travels along the path of the outer orifice 933, the hole wall gap 421, the gap 413 of the inner wall of the coarse tube, and the corresponding groove wall gap 412. This path of solder turns after exiting the inner orifice 932, wetting the inner wall 921 of the coarse tube to form an inner weld bead. Similarly, through capillary action, the solder travels along the path of the outer orifice 933, the outer wall gap 422 of the thin tube, the end face gap 414 of the thin tube, and the corresponding groove wall gap 412. This path of solder turns after exiting the inner orifice 932, wetting the inner wall 921 of the thin tube. The brazing connection area of ​​the tube end face 912 is increased by a portion of the thin tube end face 912. Finally, the two solders converge at the bottom gap 411 of the tank. At this time, the solder has completed the wetting of the thin tube 910 and the thick tube 920. Since the amount of solder used is determined from the starting point of overflowing into the residual material collection pipe 430 to the end point of filling the residual material collection pipe 430, there is still excess solder. Due to the existence of the residual material collection pipe 430 with lower flow resistance, the excess solder will continue to move forward and flow into the residual material collection pipe 430, and therefore will not overflow from the contact surface of the top surface 311 of the tank edge, the inner wall 921 of the thick tube, and the end face 912 of the thin tube.

[0016] At this time, see Figure 4 and Figure 5From a cross-sectional perspective, the solder covers the outer surface of the guide ring 200. For the guide ring 200, the brazing connection area is the outer surface of the guide ring 200. In at least one embodiment, the top surface of the annular cavity 220 may have a branch channel 440 extending to the bottom surface of the annular groove cavity 210. The solder melting at the outer orifice 933 can also advance along the branch channel 440, thus increasing the wetting area of ​​the guide ring 200 and increasing the brazing connection area for the guide ring 200.

[0017] In at least one embodiment, such as Figure 4 , Figure 11 and Figure 12 As shown, the guide ring 200 can be composed of two rings, an inner and an outer ring. Both rings have annular cavities 220. The annular groove 210 of the outer ring faces outward, and the annular groove 210 of the inner ring faces inward. A cavity protrusion 510 can also be provided on the inner wall of the annular cavity 220 of the inner ring. Thus, when the inner and outer rings are placed in the receiving groove 310 of the waste material collection ring 300, a gap is maintained between the inner and outer rings. This gap is equal in width to the gap 421 of the hole wall and the gap 422 of the outer wall of the thin tube. This gap is the branch channel 440. The inner and outer rings that make up the guide ring 200 and the waste material collection ring 300 can be obtained by turning copper rings using a CNC machine tool.

[0018] In at least one embodiment, the fixing mechanism 100 fixes the thin tube 910, the guide ring 200 and the residual material collection ring 300 to the hole of the thick tube 920 in the following manner.

[0019] like Figure 1 and Figure 6 As shown, the fixing mechanism 100 may include: a coarse tube adjusting assembly 110, adapted to fix the coarse tube 920 and move the coarse tube 920 along the welding base rod 120 passing through the coarse tube 920, and keep the coarse tube 920 stationary when the hole on the coarse tube 920 moves to the welding position; a ring supporting assembly 130, disposed on the welding base rod 120, adapted to support the inserted residual material collection ring 300 and the guide ring 200, as well as the thin tube 910 inserted through the hole, and to keep the residual material collection ring 300... 0. The guide ring 200, the thin tube 910, and the hole located at the welding position are concentric; the ring fixing assembly 140 is adapted to fix the residual material collection ring 300, the guide ring 200, and the thin tube 910 placed on the ring support assembly 130, and to abut the top surface 311 of the groove side on one side with the end face 912 of the thin tube; the lifting assembly 150 is adapted to lift the fixed residual material collection ring 300, the guide ring 200, and the thin tube 910 together until the top surface 311 of the groove side on the other side abuts the inner wall 921 of the thick tube.

[0020] like Figure 7 , 6As shown in Figures 8 and 13, the ring support assembly 130 may include: a ring support block 131, which is disposed on the welding base rod 120 and has a support recess 132 on its top surface; the ring support block 131 may be a slider with a self-locking function, which can be locked when it slides to the welding position. When the hole of the thin tube 910 to be welded on the thick tube 920 is also moved to the welding position through the thick tube adjustment assembly 110, the center of the hole can be aligned with the center of the support recess 132; a tray 133, which is disposed in the support recess 132 and has an annular protrusion 134 on its top surface, the annular protrusion 134 having a groove for the scrap material. The collecting ring 300 is adapted to the supporting step 135. After the residual material collecting ring 300, the guide ring 200 and the thin tube 910 are supported by the supporting step 135, they are concentric with the hole located at the welding position. The ring fixing assembly 140 may include: a thin tube pressure ring 141, which is adapted to press the end face of the thin tube 910 located outside the hole; a tray screw hole 142, which is opened on the tray 133; and a fixing bolt 143, which is adapted to pass through the thin tube pressure ring 141 and screw into the tray screw hole 142, so that the residual material collecting ring 300, the guide ring 200 and the thin tube 910 supported by the supporting step 135 are fixed on the tray 133.

[0021] like Figure 1 , 6 As shown in Figure 7, the lifting assembly 150 may include: a lifting base 151, which is disposed above the welding base rod 120; a lifting connecting rod 152, which passes through the lifting base 151 and connects to the thin tube pressure ring 141; and a lifting knob 153, which is disposed on the lifting base 151 and is adapted to lift the lifting connecting rod 152 when it is turned out, so as to drive the thin tube pressure ring 141, the residual material collection ring 300, the guide ring 200, and the thin tube 910 to be lifted. A guide groove may be provided on the side wall of the supporting recess 132, and a corresponding guide protrusion may also be provided on the tray 133, so that the residual material collection ring 300, the guide ring 200, and the thin tube 910 fixed on the tray 133 remain concentric with the hole located at the welding position when they are lifted.

[0022] like Figure 1As shown, the thick pipe adjustment assembly 110 may include: an adjustment track 111 parallel to the welding base rod 120, on which an adjustment slider 112 is provided; the adjustment slider 112 may also be a slider with a self-locking function; a pipe clamping seat 113 is connected to the adjustment slider 112; a clamping plate 114 is connected to the pipe clamping seat 113 by a pipe clamping bolt 115, which is adapted to move toward the pipe clamping seat 113 to clamp the thick pipe 920 when the pipe clamping bolt 115 is screwed into the pipe clamping seat 113; in order to avoid the thick pipe 920, a plurality of base rod clamping bases 161 may be provided below the welding base rod 120; each base rod clamping base 161 may be provided with a pair of clamping arms 162, which are adapted to rotate upward and clamp and fix the welding base rod 120, and when the thick pipe 920 passes through, the clamping arms 162 on the corresponding base rod clamping base 161 rotate downward and open.

[0023] For the residual material collection pipe 430 left in the coarse pipe 920 after welding, manual grinding and cutting can be selected.

[0024] In at least one embodiment, a method for collecting residual material in the coarse pipe 920 by grinding is also provided in the collection pipe 430. For example... Figure 1 , 5 As shown in Figure 10, the waste material collection tube 430 is flat; the welding base rod 120 is provided with several grinding motors 800, each grinding motor 800 is connected to a transmission part 810, so that the projection of the cutting blade connected to the grinding motor 800 through the transmission part 810 along the axial direction of the coarse tube 920 overlaps with the projection of the waste material collection tube 430 along the axial direction of the coarse tube 920, and the projection of the polishing blade connected to the grinding motor 800 through the transmission part 810 along the axial direction of the coarse tube 920 overlaps with the projection of the waste material collection tube 430 along the axial direction of the coarse tube 920, so that when the coarse tube 920 is removed after welding, the root of the waste material collection tube 430 after being cut by the cutting blade and polished by the polishing blade remains. Figure 10 In the transmission unit 810, all connected are cutting blades 940. In actual use, more grinding and cutting motors 800 can be set so that when the coarse tube 920 is removed after welding, each residual material collection tube 430 corresponds to multiple cutting blades and multiple polishing blades.

[0025] like Figure 1 , Figure 6 and Figure 9 As shown, the heating assembly 700 may include a plurality of welding torches 710 disposed around the welding position. In at least one embodiment, welding torches 710 are disposed both inside and outside the coarse tube 920 of the welding position to ensure uniform temperature of components along the solder guide channel 600. After the solder melts, it can flow into the residual material collection pipe 430 located at the rear end of the solder guide channel 600 through capillary action.

[0026] The working principle of this copper manifold brazing device, which forms inner weld legs based on solder guidance, is explained below.

[0027] like Figure 1 , 2 As shown in steps 4, 6, 7, 8, 9, 12, and 13, after sliding the ring support block 131 to the welding position and locking it, place the residual material collection ring 300 and guide ring 200 into the tray 133. Open the clamping arm 162 at the end of the welding base rod 120, place the thick tube 920 onto the welding base rod 120, and temporarily fix it with the clamp 114 of the thick tube adjusting assembly 110. Then close the clamping arm 162 at the end of the welding base rod 120. Move the thick tube 920 to the ring support block 131 through the thick tube adjusting assembly 110. During the movement, the clamping arms 162 along the way open to avoid obstruction and then close again. Afterward, rotate the thick tube 920 to finely adjust the hole of the thin tube 910 to be welded. Continue until the hole is in the welding position, with the center of the hole aligned with the center of the support recess 132. Then, clamp the thick tube 920 completely using the clamping plate 114, and lock the adjusting slider 112. Next, lift the lifting connecting rod 152, insert the thin tube 910 through the hole, and place it on the guide ring 200. At this time, the rolled solder can also be placed on it. Then, lower the lifting connecting rod 152, and the thin tube pressure ring 141 presses onto the thin tube 910. The fixing bolt 143 passes through the thin tube pressure ring 141 and is screwed into the tray screw hole 142. The residual material collection ring 300, the guide ring 200, and the thin tube 910 are fixed on the tray 133. Then, unscrew the lifting knob 153 and raise the lifting connecting rod 152. Figure 8 The tray 133, located at the bottom of the supporting recess 132, rises together with the lifting connecting rod 152 along with the thin tube pressure ring 141, thin tube 910, guide ring 200, residual material collection ring 300, and tray 133 until... Figure 6 , Figure 4 , Figure 2As shown, the top surface 311 of the groove edge of the residual material collection ring 300 abuts against the inner wall 921 of the coarse tube and the end face 912 of the thin tube, forming the aforementioned solder guiding channel 600. Subsequently, the heating component 700 heats up the hole, and the solder molten at the outer orifice 933 flows according to the aforementioned process, that is, it moves along the path of the outer orifice 933, the hole wall gap 421, the coarse tube inner wall gap 413, and the groove wall gap 412 corresponding to the coarse tube inner wall gap 413 through capillary action. The solder in this path turns after exiting the inner orifice 932 and wets the hole. The inner wall 921 of the coarse tube forms an inner weld bead, and the solder advances along the path of the outer orifice 933, the outer wall gap 422 of the thin tube, the end face gap 414 of the thin tube, and the corresponding groove wall gap 412 through capillary action. This path of solder turns after exiting the inner orifice 932, wetting the end face 912 of the thin tube, increasing the brazing connection area of ​​the end face 912. Finally, the two paths of solder converge at the bottom gap 411 of the groove. At this point, the wetting of the thin tube 910 and the coarse tube 920 by the solder is complete. Because the amount of solder used is... The range is defined from the point where the overflow into the residual material collection pipe 430 begins to the point where the residual material collection pipe 430 is filled. Therefore, there is still excess solder. Because of the presence of the residual material collection pipe 430, which has lower flow resistance, the excess solder will continue to flow into the residual material collection pipe 430, and thus will not overflow from the contact surfaces of the top surface 311 of the tank edge, the inner wall 921 of the thick pipe, and the end face 912 of the thin pipe. Finally, after cooling, the fixing bolt 143 is removed, and the tray 133 falls back into the supporting recess 132. The thin pipe 910 and the guide ring 200... The scrap collection ring 300 has been brazed to the hole, thus completing the brazing of the thin tube 910 for that hole. Then, for the remaining holes, the thin tubes 910 can be welded in the same way. After all the holes are welded, the coarse tube 920 is removed by the coarse tube adjustment component 110. Similarly, the scrap collection tube 430 remaining in the coarse tube 920 can be manually ground or the grinding motor 800 can be started. When the coarse tube 920 is removed, the scrap collection tube 430 is cut by the cutting blade and the root of the cut is polished by the grinding blade.

[0028] In summary, this copper manifold brazing device based on solder guidance to form an inner weld leg has changed the control requirement of solder usage during the brazing of thin and thick tubes in copper manifold production from a single point value to a simpler control within a range. It can also ensure that the gap between the outer wall of the thin tube and the hole wall is filled and that an inner weld leg is formed at the inner hole opening.

[0029] In the embodiments provided in this application, it should be understood that the disclosed systems and devices can be implemented in other ways. The embodiments described above are merely illustrative. For example, the division of the mechanism is only a logical functional division, and there may be other division methods in actual implementation. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed.

[0030] In the description of this invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0031] Based on the above-described preferred embodiments of the present invention, and through the foregoing description, those skilled in the art can make various changes and modifications without departing from the inventive concept. The technical scope of this invention is not limited to the contents of the specification, but must be determined according to the scope of the claims.

Claims

1. A brazing device for copper manifolds based on solder guidance to form inner solder feet, characterized in that, include: A fixing mechanism (100) is adapted to fix the thin tube (910), guide ring (200) and residual material collection ring (300) in the hole of the thick tube (920), and to make the top surface (311) of the groove (310) opened on the top surface of the residual material collection ring (300) abut against the inner wall (921) of the thick tube and the end face (912) of the thin tube respectively to form a cavity (410), so that the cavity (410) is respectively in contact with the cavity (420) formed by the outer wall (911) of the thin tube and the hole wall (931) and the residual material collection ring (300) at the bottom of the groove. The material collection pipe (430) is connected so that the guide ring (200) located in the groove cavity (410) and extending into the hole cavity (420) abuts against the outer wall (911) of the thin tube and the hole wall (931) respectively through the hole cavity protrusion (510), and the guide ring (200) located in the groove cavity (410) and extending into the hole cavity (420) abuts against the groove wall and the bottom of the groove respectively through the groove cavity protrusion (520), so as to form and maintain the solder guide flow channel (600) that turns and connects to the residual material collection pipe (430) after exiting the inner hole (932). Heating component (700), which is mounted on fixing mechanism (100), is adapted to heat the hole so that the solder at the outer orifice (933) melts and flows along the solder guide channel (600), and after turning at the inner orifice (932) to form an inner solder foot, it continues to flow, and the remaining solder flows into the residual material collection pipe (430). The top surface (311) of the groove edge is curved, so as to abut against the inner wall (921) of the thick tube and the end face (912) of the thin tube respectively; The groove protrusion (520) includes: A plurality of groove bottom protrusions (521) are spaced apart on the groove bottom of the receiving groove (310) to support the guide ring (200), forming and maintaining a continuous groove bottom gap (411) between the guide ring (200) and the groove bottom. The two walls of the receiving groove (310) are provided with a number of groove wall protrusions (522) at intervals, so as to limit the guide ring (200) by abutting against it, and to form and maintain a continuous groove wall gap (412) between the guide ring (200) and the groove wall, and communicate with the groove bottom gap (411). The guide ring (200) includes: The annular groove cavity (210) is supported by the groove bottom protrusion (521), abuts against the groove wall protrusion (522), and sinks into the receiving groove (310) to form and maintain the gap (413) between the inner wall of the coarse tube (921) and the end face of the thin tube (912), and forms and maintains the gap (414) between the end face of the thin tube, and the gap (413) between the inner wall of the coarse tube and the gap (414) between the end face of the thin tube are respectively connected to the corresponding groove wall gap (412); An annular cavity portion (220) is provided on an annular groove portion (210) and extends into the cavity (420). A plurality of cavity protrusions (510) are provided on the outer and inner walls at intervals. By abutting against the hole wall (931) and the outer wall of the thin tube (911) respectively, the thin tube (910) is limited in the radial direction of the hole, forming and maintaining a continuous hole wall gap (421) and thin tube outer wall gap (422). The hole wall gap (421) communicates with the inner wall gap (413) of the thick tube and forms a bend, and the thin tube outer wall gap (422) communicates with the end face gap (414) of the thin tube and forms a bend.

2. The copper manifold brazing device based on solder guidance to form inner weld legs according to claim 1, characterized in that, The top surface of the annular cavity (220) has a branch channel (440) extending to the bottom surface of the annular groove cavity (210).

3. The copper manifold brazing device based on solder guidance to form inner weld legs according to claim 2, characterized in that, The fixing mechanism (100) includes: A thick tube adjustment assembly (110) is adapted to fix the thick tube (920) and move the thick tube (920) along a welding base rod (120) passing through the thick tube (920), and keep the thick tube (920) stationary when the hole on the thick tube (920) is moved to the welding position; A ring support assembly (130) is provided on the welding base rod (120) and is adapted to support the inserted scrap collection ring (300) and guide ring (200), as well as the thin tube (910) inserted through the hole, and to make the scrap collection ring (300), guide ring (200), thin tube (910) and the hole located at the welding position concentric; The ring fixing assembly (140) is adapted to fix the residual material collection ring (300), guide ring (200) and capillary tube (910) placed on the ring support assembly (130) and to abut the top surface (311) of the groove side on one side against the end face (912) of the capillary tube. Lifting assembly (150) is adapted to lift together the fixed residual material collection ring (300), guide ring (200) and thin tube (910) until the top surface (311) of the groove side on the other side abuts against the inner wall (921) of the thick tube.

4. The copper manifold brazing device based on solder guidance to form inner weld legs according to claim 3, characterized in that, The ring support assembly (130) includes: A ring support block (131) is provided on the welded base rod (120), and a support recess (132) is opened on the top surface. The tray (133) is disposed in the supporting recess (132) and has an annular protrusion (134) on its top surface. The annular protrusion (134) has a supporting step (135) adapted to the scrap collection ring (300). After the scrap collection ring (300), the guide ring (200) and the thin tube (910) are supported by the supporting step (135), they are concentric with the hole located at the welding position. The ring fixing assembly (140) includes: A capillary clamping ring (141) is adapted to clamp the end face of the capillary tube (910) located outside the hole; A tray screw hole (142) is formed on the tray (133); A fixing bolt (143) is adapted to pass through the thin tube pressure ring (141) and screw into the tray screw hole (142) to fix the residual material collection ring (300), guide ring (200) and thin tube (910) supported by the supporting step (135) on the tray (133).

5. The copper manifold brazing device based on solder guidance to form inner weld legs according to claim 4, characterized in that, The lifting component (150) includes: A lifting base (151) is disposed above the welded base rod (120); The lifting connecting rod (152) passes through the lifting base (151) and is connected to the thin tube pressure ring (141); The lifting knob (153) is located on the lifting base (151) and is adapted to lift the lifting connecting rod (152) when it is turned out, so as to drive the thin tube pressure ring (141), the residual material collection ring (300), the guide ring (200), and the thin tube (910) to be lifted.

6. The copper manifold brazing device based on solder guidance to form inner weld legs according to claim 3, characterized in that, The coarse tube adjustment assembly (110) includes: An adjustment track (111) parallel to the welding base rod (120) is provided with an adjustment slider (112). The adjusting slider (112) is connected to a clamp seat (113); A clamping plate (114) is connected to a clamping seat (113) by a clamping bolt (115) and is adapted to move toward the clamping seat (113) to clamp the thick pipe (920) when the clamping bolt (115) is screwed into the clamping seat (113). Several base rod embracing bases (161) are provided below the welded base rod (120). Each of the base rod clamping bases (161) is provided with a pair of clamping arms (162), which are suitable for rotating upward and clamping and fixing the welded base rod (120). When the thick pipe (920) passes through, the clamping arms (162) on the corresponding base rod clamping bases (161) rotate downward and open.

7. The copper manifold brazing device based on solder guidance to form inner weld legs according to claim 6, characterized in that, The waste material collection pipe (430) is flat; The welding base rod (120) is provided with a plurality of grinding motors (800), each grinding motor (800) is connected to a transmission part (810) so that the projection of the cutting blade connected to the grinding motor (800) via the transmission part (810) along the axial direction of the coarse tube (920) overlaps with the projection of the scrap collection tube (430) along the axial direction of the coarse tube (920) and the projection of the polishing blade connected to the grinding motor (800) via the transmission part (810) along the axial direction of the coarse tube (920) overlaps with the projection of the scrap collection tube (430) along the axial direction of the coarse tube (920) so that when the coarse tube (920) is removed after welding, the root of the scrap collection tube (430) after being cut by the cutting blade and polished by the polishing blade is left.

8. The copper manifold brazing device based on solder guidance to form inner weld legs according to claim 3, characterized in that, The heating assembly (700) includes: Several welding torches (710) are arranged around the welding position.

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