Light-emitting module

Abstract

The invention is suitable for the technical field of light-emitting modules, and provides a light-emitting module, the light-emitting module comprises a packaging part, a first heat dissipation bearing part, a second heat dissipation bearing part, a light-emitting part and a light-emitting driving part, the first heat dissipation bearing part and the second heat dissipation bearing part are separately arranged, and at least parts of the first heat dissipation bearing part and the second heat dissipation bearing part are embedded in one side of the packaging part; the light-emitting part is borne on the first heat dissipation bearing part and located between the first heat dissipation bearing part and the packaging part, and the light-emitting driving part is borne on the second heat dissipation bearing part and located between the second heat dissipation bearing part and the packaging part.

Description

Technical Field

[0001] This application belongs to the field of light-emitting module technology, and more specifically, relates to a light-emitting module. Background Technology

[0002] With the development of automotive lighting and display technologies, higher requirements are being placed on the luminous efficacy, reliability, and integration of light-emitting modules. Light-emitting modules typically consist of light-emitting diodes (LEDs) and their driver chips integrated on a circuit board. In existing technologies, the LEDs and driver chips are usually arranged independently.

[0003] However, the independent arrangement of light-emitting diodes and driver chips results in a larger space occupied by the light-emitting module on the circuit board, which is not conducive to miniaturization design. In addition, the two share a heat dissipation path, which can easily lead to local heat accumulation and thermal stress concentration, affecting the device life and color stability. Summary of the Invention

[0004] The purpose of this application is to provide a light-emitting module that solves the technical problem that light-emitting modules in the prior art are large in size and prone to thermal stress concentration.

[0005] To achieve the above objectives, according to one aspect of this application, a light-emitting module is provided. The light-emitting module includes: an encapsulation portion, a first heat dissipation support portion, a second heat dissipation support portion, a light-emitting portion, and a light-emitting driving portion. The first heat dissipation support portion and the second heat dissipation support portion are separately disposed, and at least a portion of the first heat dissipation support portion and at least a portion of the second heat dissipation support portion are both embedded on one side of the encapsulation portion. The light-emitting portion is supported on the first heat dissipation support portion and is located between the first heat dissipation support portion and the encapsulation portion. The light-emitting driving portion is supported on the second heat dissipation support portion and is located between the second heat dissipation support portion and the encapsulation portion.

[0006] Optionally, the encapsulation part includes an encapsulation body, at least a portion of the first heat dissipation support part and at least a portion of the second heat dissipation support part are both embedded in the first side of the encapsulation body; the second side of the encapsulation body is provided with a first receiving recess and a second receiving recess, the second side is away from the first side, the first receiving recess and the second receiving recess are separately provided, and the first receiving recess is connected to the first heat dissipation support part, and together with the first heat dissipation support part, they form a first cup bowl, the first cup bowl is used to accommodate the light-emitting part, the second receiving recess is connected to the second heat dissipation support part, and together with the second heat dissipation support part, they form a second cup bowl, the second cup bowl is used to accommodate the light-emitting driving part.

[0007] Optionally, the encapsulation unit further includes a light-transmitting encapsulation unit and a light-shielding encapsulation unit. The light-transmitting encapsulation unit is disposed in the first cup and bowl and is used to perform light-transmitting encapsulation on the light-emitting part. The light-shielding encapsulation unit is disposed in the second cup and bowl and is used to perform light-shielding encapsulation on the light-emitting driving part.

[0008] Optionally, the light-emitting module further includes a bridging portion, which includes at least one bridging unit. At least a portion of the bridging unit is embedded in the first side of the encapsulation body, and in the thickness direction of the encapsulation portion, the orthographic projection of the bridging unit coincides with the orthographic projection of the first receiving recess and the orthographic projection of the second receiving recess.

[0009] Optionally, the bridging unit is disposed separately from the first heat dissipation support and the second heat dissipation support.

[0010] Optionally, the bridging unit and the second heat dissipation support are integrally formed.

[0011] Optionally, at least one bridging unit may be multiple bridging units, at least one of the multiple bridging units may be separately disposed from the first heat dissipation support and the second heat dissipation support, and at least one of the multiple bridging units may be integrally formed with the second heat dissipation support.

[0012] Optionally, the first heat dissipation support portion is provided with a first reinforcing beam structure, at least a portion of which is embedded in the encapsulation portion and is inclined relative to the outer wall of the encapsulation portion to which it is directed; and / or, the second heat dissipation support portion is provided with a second reinforcing beam structure, at least a portion of which is embedded in the encapsulation portion and is inclined relative to the outer wall of the encapsulation portion to which it is directed.

[0013] Optionally, the light-emitting part includes a plurality of first light-emitting units for emitting a first color light, a plurality of second light-emitting units for emitting a second color light, and a plurality of third light-emitting units for emitting a third color light, wherein the colors of the first color light, the second color light, and the third color light are different from each other; wherein the plurality of first light-emitting units are connected in series, the plurality of second light-emitting units are connected in series, and the plurality of third light-emitting units are connected in series; the plurality of first light-emitting units are arranged in a triangle; and / or, the plurality of second light-emitting units are arranged in a triangle; and / or, the plurality of third light-emitting units are arranged in a triangle.

[0014] Optionally, the light-emitting part includes multiple light-emitting unit groups. Each light-emitting unit group includes a first light-emitting unit for emitting a first color light, a second light-emitting unit for emitting a second color light, and a third light-emitting unit for emitting a third color light. The colors of the first color light, the second color light, and the third color light are different from each other. The geometric centers of the first light-emitting unit, the second light-emitting unit, and the third light-emitting unit in the same light-emitting unit group form a triangle.

[0015] The beneficial effects of the light-emitting module provided in this application are as follows: Compared with the prior art, the light-emitting module provided in this application achieves compact integration of the light-emitting part and the light-emitting driving part by integrating them into the same package, thereby reducing the space occupied by the light-emitting module on the circuit board. At the same time, the light-emitting module supports the light-emitting part and the light-emitting driving part by separately setting the first heat dissipation support part and the second heat dissipation support part, respectively, so that the light-emitting part and the light-emitting driving part have independent heat dissipation paths, thereby improving the heat dissipation performance and reliability of the light-emitting module. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the structure of the light-emitting module provided in the embodiments of this application;

[0018] Figure 2 A schematic diagram of the structure of a light-emitting module with some components removed, provided in an embodiment of this application; Figure 3 A schematic diagram of the structure of a light-emitting module with some components removed, provided from another perspective in an embodiment of this application; Figure 4 This is a schematic diagram of the structure of a light-emitting module with the encapsulation removed, provided in an embodiment of this application. Figure 5 This is a schematic diagram of the structure of the light-emitting module from another perspective, as provided in an embodiment of this application. Figure 6 A schematic diagram of the structure of a light-emitting module with the encapsulation removed, provided from another perspective in an embodiment of this application; Figure 7 A schematic diagram of the structure of a light-emitting module with another part of its components removed, provided from another perspective in an embodiment of this application; The details of the reference numerals used in the above figures are as follows: 10. Encapsulation section; 11. Encapsulation body; 111. First receiving recess; 112. Second receiving recess; 12. Light-transmitting encapsulation unit; 13. Light-shielding encapsulation unit; 20. First heat dissipation bearing unit; 21. First reinforcing beam structure; 30. Second heat dissipation support; 31. Second reinforcing beam structure; 40. Bridging section; 41. Bridging unit; 50. The First Cup; 60. The second cup; 70. Light-emitting part; 71. First light-emitting unit; 72. Second light-emitting unit; 73. Third light-emitting unit; 80. Light-emitting drive unit. Detailed Implementation

[0019] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0020] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly or indirectly on that other element. When an element is referred to as being "connected to" another element, it can be directly or indirectly connected to that other element. Unless otherwise specified, the embodiments and features described in this application can be combined with each other. This application will now be described in detail with reference to the accompanying drawings and embodiments.

[0021] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0022] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0023] As described in the background section, with the development of automotive lighting and display technologies, higher requirements are being placed on the luminous efficacy, reliability, and integration of light-emitting modules. Light-emitting modules typically consist of light-emitting diodes (LEDs) and their driver chips integrated on a circuit board. In existing technologies, the LEDs and driver chips are usually arranged independently. However, this independent arrangement results in a larger footprint on the circuit board, hindering miniaturization design. Furthermore, the shared heat dissipation path can easily lead to localized heat accumulation and thermal stress concentration, affecting device lifespan and color stability.

[0024] See Figures 1 to 6As shown, in order to solve the above problems, according to one aspect of this application, an embodiment of this application provides a light-emitting module, which includes: an encapsulation part 10, a first heat dissipation support part 20, a second heat dissipation support part 30, a light-emitting part 70, and a light-emitting driving part 80, wherein the first heat dissipation support part 20 and the second heat dissipation support part 30 are separately disposed, and at least a portion of the first heat dissipation support part 20 and at least a portion of the second heat dissipation support part 30 are both embedded on one side of the encapsulation part 10; the light-emitting part 70 is supported on the first heat dissipation support part 20 and is located between the first heat dissipation support part 20 and the encapsulation part 10, and the light-emitting driving part 80 is supported on the second heat dissipation support part 30 and is located between the second heat dissipation support part 30 and the encapsulation part 10. The light-emitting module provided in this embodiment integrates the light-emitting part 70 and the light-emitting driving part 80 into the same package 10, achieving compact integration of the light-emitting part 70 and the light-emitting driving part 80, reducing the space occupied by the light-emitting module on the circuit board. At the same time, the light-emitting module supports the light-emitting part 70 and the light-emitting driving part 80 respectively through the separately provided first heat dissipation support part 20 and second heat dissipation support part 30, so that the light-emitting part 70 and the light-emitting driving part 80 have independent heat dissipation paths, improving the heat dissipation performance and reliability of the light-emitting module.

[0025] It should be noted that, in this embodiment, the encapsulation part 10 refers to the encapsulation structure that constitutes the outer body of the light-emitting module and is used to seal and protect the internal electronic components; the first heat dissipation support part 20 and the second heat dissipation support part 30 refer to heat-conducting components that are separately arranged and are used to support different functional components and conduct their heat, and both are at least partially embedded on one side of the encapsulation part 10; the light-emitting part 70 refers to the functional component that is disposed on the first heat dissipation support part 20 and is used to emit light, and it is located between the first heat dissipation support part 20 and the encapsulation part 10; the light-emitting driving part 80 refers to the functional component that is disposed on the second heat dissipation support part 30 and is used to drive and control the operation of the light-emitting part 70, such as a light-emitting driving chip, and it is located between the second heat dissipation support part 30 and the encapsulation part 10.

[0026] It is understood that in this embodiment, the separate arrangement of the first heat dissipation support 20 and the second heat dissipation support 30 means that the two are physically independent and there is no direct thermal connection between them, thus forming mutually isolated heat conduction paths; the light-emitting part 70 is supported by the first heat dissipation support 20, which means that the light-emitting part 70 is fixedly connected to the first heat dissipation support 20 through die bonding, bonding, welding, etc., and conducts the heat generated during operation through the first heat dissipation support 20; the light-emitting driving part 80 is supported by the second heat dissipation support 30, which means that the light-emitting driving part 80 is fixedly connected to the second heat dissipation support 30 through die bonding, bonding, welding, etc., and conducts the heat generated during its own operation independently through the second heat dissipation support 30; the compact integration of the light-emitting part 70 and the light-emitting driving part 80 facilitates the wiring design on the circuit board, and the independent heat dissipation paths provided by the first heat dissipation support 20 and the second heat dissipation support 30 allow the heat generated by the light-emitting part 70 and the light-emitting driving part 80 during operation to be dissipated independently and quickly, avoiding cracking and damage of the package 10 due to thermal stress concentration.

[0027] In some embodiments, the first heat dissipation support portion 20 in this embodiment includes a first heat dissipation support sheet. A first heat dissipation protrusion is provided on the side of the first heat dissipation support sheet opposite to the encapsulation portion 10. The first heat dissipation support sheet is embedded in the encapsulation portion 10, and at least a portion of the surface of the first heat dissipation protrusion is in communication with the external environment. In this embodiment, the provision of the first heat dissipation protrusion can establish an efficient heat dissipation path between the first heat dissipation support sheet and the external environment, ensuring that the first heat dissipation support portion 20 can efficiently dissipate heat from the light-emitting portion 70 independently.

[0028] In some embodiments, the material of the first heat dissipation support 20 in this embodiment is a metal, such as copper, copper alloy, or other metal materials with good heat dissipation performance.

[0029] In some embodiments, the second heat dissipation support portion 30 in this embodiment includes a second heat dissipation support sheet. A second heat dissipation protrusion is provided on the side of the second heat dissipation support sheet facing away from the encapsulation portion 10. The second heat dissipation support sheet is embedded in the encapsulation portion 10, and at least a portion of the surface of the second heat dissipation protrusion is in communication with the external environment. In this embodiment, the provision of the second heat dissipation protrusion can establish an efficient heat dissipation path between the second heat dissipation support sheet and the external environment, ensuring that the second heat dissipation support portion 30 can efficiently dissipate heat from the light-emitting driving portion 80 independently.

[0030] In some embodiments, the material of the second heat dissipation support 30 in this embodiment is a metal, such as copper, copper alloy, or other metal materials with good heat dissipation performance.

[0031] In some embodiments, the light-emitting module further includes a pin portion, which includes a first pin unit and a second pin unit. The first pin unit is at least partially embedded in the package portion 10 and electrically connected to the light-emitting portion 70. An external circuit board is electrically connected to the light-emitting portion 70 through the first pin unit. The second pin unit is at least partially embedded in the package portion 10 and electrically connected to the light-emitting driving portion 80. An external circuit board is electrically connected to the light-emitting driving portion 80 through the second pin unit. The independent arrangement of the first pin unit and the second pin unit in this embodiment can provide independent external electrical connection channels for the light-emitting portion 70 and the light-emitting driving portion 80, improving the installation convenience of the light-emitting module.

[0032] In some embodiments, the first heat dissipation support and the light-emitting part 70 are insulated from each other, for example, by means of an insulating thermally conductive layer. By insulating the first heat dissipation support from the light-emitting part 70, thermoelectric separation of the light-emitting part 70 can be achieved, improving the reliability of the light-emitting module.

[0033] In some embodiments, the second heat dissipation support and the light-emitting driving part 80 are insulated from each other, for example, by means of an insulating thermally conductive layer. By insulating the second heat dissipation support from the light-emitting driving part 80, thermoelectric separation of the light-emitting driving part 80 can be achieved, improving the reliability of the light-emitting module.

[0034] See Figures 1 to 3 and Figure 5As shown, in a specific embodiment, the encapsulation part 10 includes an encapsulation body 11. At least a portion of the first heat dissipation support part 20 and at least a portion of the second heat dissipation support part 30 are both embedded in the first side of the encapsulation body 11. The second side of the encapsulation body 11 is provided with a first receiving recess 111 and a second receiving recess 112. The first receiving recess 111 and the second receiving recess 112 are separately disposed. The first receiving recess 111 is connected to the first heat dissipation support part 20 and together with the first heat dissipation support part 20, they form a first cup bowl 50. The first cup bowl 50 is used to accommodate the light-emitting part 70. The second receiving recess 112 is connected to the second heat dissipation support part 30 and together with the second heat dissipation support part 30, they form a second cup bowl 60. The second cup bowl 60 is used to accommodate the light-emitting driving part 80. It should be noted that, in this embodiment, the encapsulation body 11 refers to the base portion constituting the main encapsulation structure of the light-emitting module; the first receiving recess 111 and the second receiving recess 112 refer to separate recessed structures formed on the second side of the encapsulation body 11; the first cup 50 refers to a bowl-shaped space formed by the first receiving recess 111 and the first heat dissipation support 20 for accommodating the light-emitting part 70, the inner wall of which is formed by the inner wall of the first receiving recess 111, and the bottom wall of which is formed by at least a portion of the surface of the first heat dissipation support 20 facing the encapsulation body 11; the second cup 60 refers to a bowl-shaped space formed by the second receiving recess 112 and the second heat dissipation support 30 for accommodating the light-emitting driving part 80, the inner wall of which is formed by the inner wall of the second receiving recess 112, and the bottom wall of which is formed by at least a portion of the surface of the second heat dissipation support 30 facing the encapsulation body 11; the first heat dissipation support 20 At least a portion of the first heat dissipation support 20 and at least a portion of the second heat dissipation support 30 are embedded in the first side of the encapsulation body 11, meaning that at least a portion of the structure of the first heat dissipation support 20 and the second heat dissipation support 30 is embedded in the first side of the encapsulation body 11 to achieve mechanical fixation between them; the first receiving recess 111 and the second receiving recess 112 are separately provided, meaning that the two recesses are independent of each other on the encapsulation body 11 and there is no communication or structural overlap between them; it can be understood that by accommodating the light-emitting part 70 and the light-emitting driving part 80 respectively by the separate first cup bowl 50 and the second cup bowl 60, the light-emitting part 70 and the light-emitting driving part 80 can be optically separated to a certain extent, reducing or even avoiding color difference caused by surface reflection of the light-emitting driving part 80. At the same time, when there are multiple light-emitting modules, by accommodating the corresponding light-emitting part 70 by the independent first cup bowl 50, the light-emitting part 70 can also be optically separated to a certain extent, reducing or even avoiding light crosstalk between adjacent light-emitting modules.

[0035] In some embodiments, the encapsulation body 11 in this embodiment includes a white encapsulating colloid. The material of the white encapsulating colloid can be a white reflective material such as white epoxy resin. The white encapsulating colloid can reflect the light inside the first cup bowl 50, reduce the absorption loss of light on the side wall of the first cup bowl 50, and allow more light to be emitted from the first cup bowl 50, thereby improving the light efficiency of the light-emitting module. Of course, in other embodiments, the encapsulation body 11 in this embodiment can also be other non-transparent insulating reflective materials.

[0036] See Figure 1 As shown, in a specific embodiment, the encapsulation unit 10 in this embodiment further includes a light-transmitting encapsulation unit 12 and a light-shielding encapsulation unit 13. The light-transmitting encapsulation unit 12 is disposed in the first cup bowl 50 and is used to perform light-transmitting encapsulation on the light-emitting part 70. The light-shielding encapsulation unit 13 is disposed in the second cup bowl 60 and is used to perform light-shielding encapsulation on the light-emitting driving part 80. It should be noted that, in this embodiment, the light-transmitting encapsulation unit 12 refers to an encapsulation body disposed within the first cup bowl 50, made of a material that allows light to pass through, used to seal and protect the light-emitting part 70 housed within the first cup bowl 50; the light-shielding encapsulation unit 13 refers to an encapsulation body disposed within the second cup bowl 60, made of a material that blocks light from passing through, used to seal and protect the light-emitting driving part 80 housed within the second cup bowl 60. It can be understood that, in this embodiment, the light-transmitting encapsulation unit 12 can ensure that the light-emitting part 70 emits light normally while simultaneously sealing and protecting it, and the light-shielding encapsulation unit 13 can further optically separate the light-emitting part 70 and the light-emitting driving part 80, avoiding color difference caused by surface reflection of the light-emitting driving part 80. It can also be understood that, in this embodiment, the first cup bowl 50 can also provide an independent light-mixing area for the light-emitting part 70, thereby improving the light-mixing effect of the light-emitting part 70.

[0037] In some embodiments, the light-transmitting encapsulation unit 12 in this embodiment includes a transparent encapsulating colloid, which can be made of a transparent epoxy resin, silicone, or other light-transmitting material. By setting the light-transmitting encapsulation unit 12 as a transparent encapsulating colloid, it is possible to ensure that the light emitted by the light-emitting part 70 has good transmittance. In other embodiments, the light-transmitting encapsulation unit 12 in this embodiment can also be a mist-like transparent encapsulating colloid doped with a light diffusing agent. Setting the light-transmitting encapsulation unit 12 as a mist-like transparent encapsulating colloid ensures that the light emitted by the light-emitting part 70 has a good light mixing effect.

[0038] In some embodiments, the light-shielding encapsulation unit 13 in this embodiment includes a black encapsulating colloid. The material of the black encapsulating colloid can be a black light-absorbing material such as black epoxy resin. The black encapsulating colloid can absorb light to achieve optical separation between the light-emitting part 70 and the light-emitting driving part 80, avoiding color difference caused by surface reflection of the light-emitting driving part 80. Of course, in other embodiments, the light-shielding encapsulation unit 13 in this embodiment can also be other non-transparent insulating light-absorbing materials.

[0039] See Figures 2 to 4 As shown, in a specific embodiment, the light-emitting module further includes a bridging portion 40, which includes at least one bridging unit 41. At least a portion of the bridging unit 41 is embedded in the first side of the encapsulation body 11, and in the thickness direction of the encapsulation portion 10, the orthographic projection of the bridging unit 41 coincides with the orthographic projection of the first receiving recess 111 and the orthographic projection of the second receiving recess 112. It should be noted that in this embodiment, the bridging portion 40 refers to an intermediate connecting component in the light-emitting module used to assist in the electrical connection between the light-emitting unit and the light-emitting driving unit across the cup and bowl; the bridging unit 41 is the basic connecting component constituting the bridging portion 40; the bridging unit 41 being at least partially embedded in the first side of the encapsulation body 11 means that at least a portion of the structure of the bridging unit 41 is embedded inside the first side of the encapsulation body 11 to achieve mechanical fixation between the two; in the thickness direction of the encapsulation portion 10, the orthographic projection of the bridging unit 41 coinciding with the orthographic projection of the first receiving recess 111 and the second receiving recess 112 means that along the thickness direction of the encapsulation portion 10... When projected, the projection area of ​​the bridging unit 41 overlaps with the projection areas of the first receiving recess 111 and the second receiving recess 112, allowing the bridging unit 41 to span the areas where the first cup bowl 50 and the second cup bowl 60 are located in spatial layout. It can be understood that the bridging unit 41 in this embodiment can establish a conductive path between the first cup bowl 50 and the second cup bowl 60 without destroying the independence between them, so that the light-emitting module can achieve cross-cup bowl electrical connection between the light-emitting part 70 and the light-emitting driving part 80 through the bridging unit 41 while maintaining the independence between the first cup bowl 50 and the second cup bowl 60.

[0040] In one specific embodiment, the bridging unit 41 is separately disposed from the first heat dissipation support 20 and the second heat dissipation support 30. It should be noted that, in this embodiment, the separate disposal of the bridging unit 41 from the first heat dissipation support 20 and the second heat dissipation support 30 means that the bridging unit 41, the first heat dissipation support 20, and the second heat dissipation support 30 are each independent physical components, and there is no integral molding or direct fixed connection between them. It can be understood that by separating the bridging unit 41 from the first heat dissipation support 20 and the second heat dissipation support 30, it is beneficial to establish conductive paths independent of the first heat dissipation support 20 and the second heat dissipation support 30 between the light-emitting part 70 and the bridging unit 41, and between the bridging unit 41 and the light-emitting driving part 80, ensuring independent heat dissipation for the first heat dissipation support 20 (integrating the light-emitting part 70) and the second heat dissipation support 30 (integrating the light-emitting driving part 80).

[0041] In another embodiment, the bridging unit 41 and the second heat dissipation support 30 are integrally formed. It should be noted that in this embodiment, the integral formation of the bridging unit 41 and the second heat dissipation support 30 means that the bridging unit 41 and the second heat dissipation support 30 are formed as a continuous, seamless integral structure using the same material and the same manufacturing process; they are physically inseparable. It is understood that by setting the bridging unit 41 to be integrally formed with the second heat dissipation support 30 and separate from the first heat dissipation support 20, it is beneficial to increase the heat dissipation area of ​​the second heat dissipation support 30 and improve its heat dissipation effect. Furthermore, the separate arrangement of the bridging unit 41 and the first heat dissipation support 20 facilitates the establishment of a conductive path between the light-emitting part 70 and the bridging unit 41 that is independent of the first heat dissipation support 20, ensuring independent heat dissipation for both the first and second heat dissipation support 30.

[0042] See Figures 2 to 4As shown, in another embodiment, at least one bridging unit 41 in this embodiment is a plurality of bridging units 41. At least one of the plurality of bridging units 41 is separately disposed from the first heat dissipation support part 20 and the second heat dissipation support part 30, and at least one of the plurality of bridging units 41 is integrally formed with the second heat dissipation support part 30. It should be noted that, in this embodiment, the separate arrangement of the bridging unit 41 from the first heat dissipation support 20 and the second heat dissipation support 30 means that the bridging unit 41, the first heat dissipation support 20, and the second heat dissipation support 30 are each independent physical components, and there is no integral molding or direct fixed connection between them. The integral molding of the bridging unit 41 and the second heat dissipation support 30 means that the bridging unit 41 and the second heat dissipation support 30 are formed by the same material and the same manufacturing process into a continuous, seamless integral structure, and the two are physically inseparable. It can be understood that by setting some of the bridging units 41 to be separate from the first heat dissipation support 20 and the second heat dissipation support 30, and setting some of the bridging units 41 to be integrally molded with the second heat dissipation support 30 and separate from the first heat dissipation support 20, it is possible to maintain the independent heat dissipation of the first heat dissipation support 20 and the second heat dissipation support 30, while improving the heat dissipation effect of the second heat dissipation support 30 and achieving a performance balance between the two. In some embodiments, the bridging unit 41 in this embodiment includes a metal pad, which can be directly electrically connected to the light-emitting part 70 and the light-emitting driving part 80 through conductive structures such as bonding wires, solder wires, and conductive adhesive.

[0043] See Figure 5As shown, in a specific embodiment, a first reinforcing beam structure 21 is provided on the first heat dissipation support 20. At least a portion of the first reinforcing beam structure 21 is embedded in the encapsulation portion 10 and is inclined relative to the outer wall of the encapsulation portion 10 to which it points. It should be noted that the first reinforcing beam structure 21 in this embodiment refers to a reinforcing member provided on the first heat dissipation support 20 to improve the structural strength and reliability of the encapsulation portion 10. For example, the first reinforcing beam structure 21 can be a metal beam whose extension direction is inclined relative to the outer wall of the encapsulation portion 10 to which it points. At least a portion of the first reinforcing beam structure 21 being embedded in the encapsulation portion 10 means that at least a portion of the structure of the first reinforcing beam structure 21 is embedded in the encapsulation portion 10. The internal material enhances the mechanical interlock between the first heat dissipation support 20 and the encapsulation part 10. The inclined setting of the first reinforcing beam structure 21 relative to the outer wall of the encapsulation part 10 it points to means that the extension direction of the first reinforcing beam structure 21 within the encapsulation part 10 forms a certain angle with the normal direction of the outer wall of the encapsulation part 10 it points to, rather than being parallel or perpendicular. The pointing direction of the first reinforcing beam structure 21 is from one end toward the first heat dissipation support 20 to one end away from the first heat dissipation support 20. It can be understood that the setting of the first reinforcing beam structure 21 can optimize the internal stress distribution path and transmission direction of the encapsulation part 10, thereby preventing the encapsulation part 10 from lateral cracking or peeling along the normal direction of its outer wall. In some embodiments, a first auxiliary reinforcing beam structure is provided on the first heat dissipation bearing portion 20 in this embodiment. The first auxiliary reinforcing beam structure is provided on the same side as the first reinforcing beam structure 21. The first auxiliary reinforcing beam structure is at least partially embedded in the encapsulation portion 10 and is perpendicular to the outer wall of the encapsulation portion 10 pointed to by the first reinforcing beam structure 21. The first auxiliary reinforcing beam structure can work with the first reinforcing beam structure 21 to further optimize the internal stress distribution path and transmission direction of the encapsulation portion 10, thereby reducing the risk of cracking or peeling of the encapsulation portion 10.

[0044] See Figure 5As shown, in a specific embodiment, the second heat dissipation support 30 is provided with a second reinforcing beam structure 31. At least a portion of the second reinforcing beam structure 31 is embedded in the encapsulation portion 10 and is inclined relative to the outer wall of the encapsulation portion 10 to which it is directed. It should be noted that the second reinforcing beam structure 31 in this embodiment refers to a reinforcing member provided on the second heat dissipation support 30 to improve the structural strength and reliability of the encapsulation portion 10. For example, the second reinforcing beam structure 31 can be a metal beam whose extension direction is inclined relative to the outer wall of the encapsulation portion 10 to which it is directed; at least a portion of the second reinforcing beam structure 31 being embedded in the encapsulation portion 10 means that at least a portion of the structure of the second reinforcing beam structure 31 is embedded in the internal material of the encapsulation portion 10 to enhance the mechanical interlock between the second heat dissipation support 30 and the encapsulation portion 10; the second reinforcing beam structure 31 is inclined relative to the outer wall of the encapsulation portion 10 to which it is directed. The inclined setting of the outer wall of the encapsulation portion 10 means that the extension direction of the second reinforcing beam structure 31 within the encapsulation portion 10 forms a certain angle with the normal direction of the outer wall of the encapsulation portion 10 corresponding to its pointing direction, rather than being parallel or perpendicular. The pointing direction of the second reinforcing beam structure 31 is from one end toward the second heat dissipation support portion 30 to the end away from the second heat dissipation support portion 30. It can be understood that the setting of the second reinforcing beam structure 31 can optimize the internal stress distribution path and transmission direction of the encapsulation portion 10, thereby preventing the encapsulation portion 10 from undergoing lateral cracking or peeling along the normal direction of its outer wall. In some embodiments, a second auxiliary reinforcing beam structure is provided on the second heat dissipation support portion 30 in this embodiment. The second auxiliary reinforcing beam structure is located on the same side as the second reinforcing beam structure 31, and is at least partially embedded within the encapsulation portion 10, and is perpendicular to the outer wall of the encapsulation portion 10 to which the second reinforcing beam structure 31 points. The second auxiliary reinforcing beam structure can work in conjunction with the second reinforcing beam structure 31 to further optimize the internal stress distribution path and transmission direction of the encapsulation portion 10, reducing the risk of cracking or peeling of the encapsulation portion 10.

[0045] In some embodiments, the bridging unit 41 in this embodiment is provided with a third reinforcing beam structure, at least a portion of which is embedded in the encapsulation portion 10 and is inclined relative to the outer side wall of the encapsulation portion 10 to which it is directed. It should be noted that, in this embodiment, the third reinforcing beam structure refers to a reinforcing member disposed on the bridging unit 41 to improve the structural strength and reliability of the encapsulation part 10. For example, the third reinforcing beam structure can be a metal beam whose extension direction is inclined relative to the outer wall of the encapsulation part 10 it points to; the third reinforcing beam structure being at least partially embedded in the encapsulation part 10 means that at least a portion of the third reinforcing beam structure is embedded in the internal material of the encapsulation part 10 to enhance the mechanical interlock between the bridging unit 41 and the encapsulation part 10; the third reinforcing beam structure being inclined relative to the outer wall of the encapsulation part 10 it points to means that the extension direction of the third reinforcing beam structure within the encapsulation part 10 forms a certain angle with the normal direction of the outer wall of the encapsulation part 10 it points to, rather than being parallel or perpendicular, wherein the pointing direction of the third reinforcing beam structure is from one end toward the bridging unit 41 to one end away from the bridging unit 41; it can be understood that the arrangement of the third reinforcing beam structure can optimize the internal stress distribution path and transmission direction of the encapsulation part 10, thereby preventing the encapsulation part 10 from undergoing lateral cracking or peeling along the normal direction of its outer wall. In some embodiments, a third auxiliary reinforcing beam structure is provided on the bridging unit 41 in this embodiment. The third auxiliary reinforcing beam structure is provided on the same side as the third reinforcing beam structure. The third auxiliary reinforcing beam structure is at least partially embedded in the encapsulation part 10 and is provided perpendicularly to the outer wall of the encapsulation part 10 to which the third reinforcing beam structure points. The third auxiliary reinforcing beam structure can work with the third reinforcing beam structure to further optimize the internal stress distribution path and transmission direction of the encapsulation part 10, thereby reducing the risk of cracking or peeling of the encapsulation part 10.

[0046] In some embodiments, a fourth reinforcing beam structure is provided on the first pin unit in this embodiment. At least part of the fourth reinforcing beam structure is embedded in the package portion 10 and is inclined relative to the outer wall of the package portion 10. It should be noted that the fourth reinforcing beam structure in this embodiment refers to a reinforcing member disposed on the first pin unit to improve the structural strength and reliability of the package 10. For example, the fourth reinforcing beam structure can be a metal beam whose extension direction is inclined relative to the outer wall of the package 10 it points to. The fourth reinforcing beam structure being at least partially embedded in the package 10 means that at least a portion of the fourth reinforcing beam structure is embedded in the internal material of the package 10 to enhance the mechanical interlock between the first pin unit and the package 10. The fourth reinforcing beam structure being inclined relative to the outer wall of the package 10 it points to means that the extension direction of the fourth reinforcing beam structure within the package 10 forms a certain angle with the normal direction of the outer wall of the package 10 it points to, rather than being parallel or perpendicular. The pointing direction of the fourth reinforcing beam structure is from the end toward the first pin unit to the end away from the first pin unit. It can be understood that the arrangement of the fourth reinforcing beam structure can optimize the internal stress distribution path and transmission direction of the package 10, thereby preventing the package 10 from undergoing lateral cracking or peeling along the normal direction of its outer wall. In some embodiments, a fourth auxiliary reinforcing beam structure is provided on the first pin unit in this embodiment. The fourth auxiliary reinforcing beam structure is provided on the same side as the fourth reinforcing beam structure. The fourth auxiliary reinforcing beam structure is at least partially embedded in the packaging part 10 and is provided perpendicularly to the outer wall of the packaging part 10 to which the fourth reinforcing beam structure points. The fourth auxiliary reinforcing beam structure can work with the fourth reinforcing beam structure to further optimize the internal stress distribution path and transmission direction of the packaging part 10, thereby reducing the risk of cracking or peeling of the packaging part 10.

[0047] In some embodiments, the second pin unit in this embodiment is provided with a fifth reinforcing beam structure, at least a portion of which is embedded in the package portion 10 and is inclined relative to the outer side wall of the package portion 10 to which it is directed. It should be noted that, in this embodiment, the fifth reinforcing beam structure refers to a reinforcing member disposed on the second pin unit to improve the structural strength and reliability of the package 10. For example, the fifth reinforcing beam structure can be a metal beam whose extension direction is inclined relative to the outer wall of the package 10 it points to; the fifth reinforcing beam structure being at least partially embedded in the package 10 means that at least a portion of the fifth reinforcing beam structure is embedded in the internal material of the package 10 to enhance the mechanical interlock between the second pin unit and the package 10; the fifth reinforcing beam structure being inclined relative to the outer wall of the package 10 it points to means that the extension direction of the fifth reinforcing beam structure within the package 10 forms a certain angle with the normal direction of the outer wall of the package 10 it points to, rather than being parallel or perpendicular, wherein the pointing direction of the fifth reinforcing beam structure is from one end toward the second pin unit to one end away from the second pin unit; it can be understood that the arrangement of the fifth reinforcing beam structure can optimize the internal stress distribution path and transmission direction of the package 10, thereby preventing the package 10 from undergoing lateral cracking or peeling along the normal direction of its outer wall. In some embodiments, a fifth auxiliary reinforcing beam structure is provided on the second pin unit in this embodiment. The fifth auxiliary reinforcing beam structure is provided on the same side as the fifth reinforcing beam structure. The fifth auxiliary reinforcing beam structure is at least partially embedded in the packaging part 10 and is provided perpendicularly to the outer wall of the packaging part 10 to which the fifth reinforcing beam structure points. The fifth auxiliary reinforcing beam structure can work with the fifth reinforcing beam structure to further optimize the internal stress distribution path and transmission direction of the packaging part 10, thereby reducing the risk of cracking or peeling of the packaging part 10.

[0048] In one specific embodiment, the light-emitting unit 70 includes a plurality of first light-emitting units 71 for emitting a first color light, a plurality of second light-emitting units 72 for emitting a second color light, and a plurality of third light-emitting units 73 for emitting a third color light. The colors of the first color light, the second color light, and the third color light are different from each other. The plurality of first light-emitting units 71 are connected in series, the plurality of second light-emitting units 72 are connected in series, and the plurality of third light-emitting units 73 are connected in series. The plurality of first light-emitting units 71 are arranged in a triangular arrangement; and / or, the plurality of second light-emitting units 72 are arranged in a triangular arrangement; and / or, the plurality of third light-emitting units 73 are arranged in a triangular arrangement. It should be noted that in this embodiment, the first light-emitting unit 71, the second light-emitting unit 72, and the third light-emitting unit 73 refer to independent light-emitting elements capable of emitting a first color light, a second color light, and a third color light, respectively. For example, the first light-emitting unit 71 is a blue light chip capable of emitting blue light, the second light-emitting unit 72 is a green light chip capable of emitting green light, and the third light-emitting unit 73 is a red light chip capable of emitting red light, etc. The series connection of multiple first light-emitting units 71 means that all first light-emitting units 71 are electrically connected in series to form a first light-emitting branch; the series connection of multiple second light-emitting units 72 means that all second light-emitting units 72 are electrically connected in series to form a second light-emitting branch; the series connection of multiple third light-emitting units 73 means that all third light-emitting units 73 are electrically connected in series to form a third light-emitting branch, and each light-emitting branch can be independently driven and controlled by the light-emitting driving unit 80; the triangular arrangement of multiple first light-emitting units 71 means that multiple first light-emitting units 71 are arranged in a triangular pattern. The geometric centers of the first light-emitting units 71 are connected to form a triangle; or, multiple first light-emitting units 71 are grouped together, each group including at least three first light-emitting units 71, and the geometric centers of the first light-emitting units 71 in the same group form at least one triangle, wherein the geometric center of the first light-emitting unit 71 refers to the centroid position of the first light-emitting unit 71 on its own planar projection outline; the triangular arrangement of multiple second light-emitting units 72 means that the geometric centers of the multiple second light-emitting units 72 are connected to form a triangle, or, multiple second light-emitting units 72 are grouped together, each group including at least three second light-emitting units 72, and the geometric centers of the second light-emitting units 72 in the same group form at least one triangle, wherein the geometric center of the second light-emitting unit 72 refers to the centroid position of the second light-emitting unit 72 on its own planar projection outline; the triangular arrangement of multiple third light-emitting units 73 means that the geometric centers of the multiple third light-emitting units 73 are connected to form a triangle, for example... Figure 7As shown, or, multiple third light-emitting units 73 are arranged in groups, each group of third light-emitting units 73 includes at least three third light-emitting units 73, and the geometric centers of the third light-emitting units 73 in the same group form at least one triangle, wherein the geometric center of the third light-emitting unit 73 refers to the centroid position of the third light-emitting unit 73 on its own planar projection outline; it can be understood that when the light-emitting module in this embodiment is used to realize functions such as vehicle lighting and vehicle display, the series-connected light-emitting units can make the operating voltage of the light-emitting module close to the vehicle power supply voltage, reduce the useless voltage drop in the light-emitting module, thereby reducing the unnecessary heat generation of the light-emitting module. Compared with the parallel electrical connection method, the series electrical connection method can ensure The current flowing through each light-emitting unit is strictly consistent, thereby eliminating the risk of overheating and premature aging of the light-emitting unit caused by uneven current distribution. At the same time, the high operating voltage and low operating current characteristics brought about by the series electrical connection can effectively reduce the Joule heat generated by parasitic resistance in the light-emitting module, thereby improving the overall photoelectric conversion efficiency of the light-emitting module and effectively reducing heat accumulation. In addition, arranging multiple first light-emitting units 71 in a triangular arrangement; and / or arranging multiple second light-emitting units 72 in a triangular arrangement; and / or arranging multiple third light-emitting units 73 in a triangular arrangement is beneficial to the uniform distribution of the corresponding color light in the first cup 50, thereby giving the light-emitting module better color uniformity.

[0049] In some embodiments, the bridging part 40 in this embodiment includes three bridging units 41, which are a first bridging unit, a second bridging unit, and a third bridging unit, respectively. A plurality of first light-emitting units 71 arranged in series are electrically connected to the light-emitting driving part 80 through the first bridging unit, a plurality of second light-emitting units 72 arranged in series are electrically connected to the light-emitting driving part 80 through the second bridging unit, and a plurality of third light-emitting units 73 arranged in series are electrically connected to the light-emitting driving part 80 through the third bridging unit.

[0050] In one specific embodiment, the light-emitting part 70 in this embodiment includes multiple light-emitting unit groups. Each light-emitting unit group includes a first light-emitting unit 71 for emitting a first color light, a second light-emitting unit 72 for emitting a second color light, and a third light-emitting unit 73 for emitting a third color light. The colors of the first color light, the second color light, and the third color light are different from each other. The geometric centers of the first light-emitting unit 71, the second light-emitting unit 72, and the third light-emitting unit 73 in the same light-emitting unit group form a triangle. It should be noted that the light-emitting unit group in this embodiment refers to a basic color mixing unit composed of three different colored light-emitting units. For example, the first light-emitting unit 71 is a blue light chip that can emit blue light, the second light-emitting unit 72 is a green light chip that can emit green light, and the third light-emitting unit 73 is a red light chip that can emit red light, etc. The geometric center of each light-emitting unit refers to the centroid position of the corresponding light-emitting unit on its own planar projection outline. It can be understood that setting the line connecting the geometric centers of the first light-emitting unit 71, the second light-emitting unit 72, and the third light-emitting unit 73 in the same light-emitting unit group as a triangle is beneficial to achieving uniform mixing of different colored lights in the first cup bowl 50, thereby giving the light-emitting module a better light mixing effect and color uniformity.

[0051] In summary, implementing the light-emitting module provided in this embodiment has at least the following beneficial technical effects: The light-emitting module provided in this embodiment integrates the light-emitting part 70 and the light-emitting driving part 80 into the same package 10, achieving compact integration of the light-emitting part 70 and the light-emitting driving part 80, reducing the space occupied by the light-emitting module on the circuit board. At the same time, the light-emitting module supports the light-emitting part 70 and the light-emitting driving part 80 respectively through the separately provided first heat dissipation support part 20 and second heat dissipation support part 30, so that the light-emitting part 70 and the light-emitting driving part 80 have independent heat dissipation paths, improving the heat dissipation performance and reliability of the light-emitting module.

[0052] The above are merely preferred embodiments of this application and are not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A light-emitting module, characterized in that, The light-emitting module includes: Packaging section (10); The first heat dissipation support part (20) and the second heat dissipation support part (30) are separately disposed, and at least a portion of the first heat dissipation support part (20) and at least a portion of the second heat dissipation support part (30) are embedded in one side of the encapsulation part (10). The light-emitting part (70) and the light-emitting driving part (80) are provided. The light-emitting part (70) is supported on the first heat dissipation support part (20) and is located between the first heat dissipation support part (20) and the encapsulation part (10). The light-emitting driving part (80) is supported on the second heat dissipation support part (30) and is located between the second heat dissipation support part (30) and the encapsulation part (10).

2. The light-emitting module according to claim 1, characterized in that, The encapsulation part (10) includes an encapsulation body (11), at least a portion of the first heat dissipation support part (20) and at least a portion of the second heat dissipation support part (30) are both embedded in the first side of the encapsulation body (11); The second side of the encapsulation body (11) is provided with a first receiving recess (111) and a second receiving recess (112). The second side is away from the first side. The first receiving recess (111) and the second receiving recess (112) are separately provided. The first receiving recess (111) is connected to the first heat dissipation support part (20) and together with the first heat dissipation support part (20) forms a first cup bowl (50). The first cup bowl (50) is used to accommodate the light-emitting part (70). The second receiving recess (112) is connected to the second heat dissipation support part (30) and together with the second heat dissipation support part (30) forms a second cup bowl (60). The second cup bowl (60) is used to accommodate the light-emitting driving part (80).

3. The light-emitting module according to claim 2, characterized in that, The encapsulation unit (10) further includes a light-transmitting encapsulation unit (12) and a light-shielding encapsulation unit (13). The light-transmitting encapsulation unit (12) is disposed in the first cup bowl (50) and is used to encapsulate the light-emitting part (70) in a light-transmitting manner. The light-shielding encapsulation unit (13) is disposed in the second cup bowl (60) and is used to encapsulate the light-emitting driving part (80) in a light-shielding manner.

4. The light-emitting module according to claim 2, characterized in that, The light-emitting module further includes a bridging portion (40), which includes at least one bridging unit (41). At least a portion of the bridging unit (41) is embedded in the first side of the encapsulation body (11), and in the thickness direction of the encapsulation portion (10), the orthographic projection of the bridging unit (41) partially coincides with the orthographic projection of the first receiving recess (111) and the orthographic projection of the second receiving recess (112).

5. The light-emitting module according to claim 4, characterized in that, The bridging unit (41) is separately disposed from the first heat dissipation support part (20) and the second heat dissipation support part (30).

6. The light-emitting module according to claim 4, characterized in that, The bridging unit (41) is integrally formed with the second heat dissipation support part (30).

7. The light-emitting module according to claim 4, characterized in that, The at least one bridging unit (41) is a plurality of bridging units (41), at least one of the bridging units (41) is separately disposed from the first heat dissipation support part (20) and the second heat dissipation support part (30), and at least one of the bridging units (41) is integrally formed with the second heat dissipation support part (30).

8. The light-emitting module according to claim 1, characterized in that, The first heat dissipation support part (20) is provided with a first reinforcing beam structure (21), at least a portion of the first reinforcing beam structure (21) is embedded in the encapsulation part (10) and is inclined relative to the outer side wall of the encapsulation part (10) to which it is directed. And / or, the second heat dissipation support (30) is provided with a second reinforcing beam structure (31), at least a portion of which is embedded in the encapsulation part (10) and is inclined relative to the outer side wall of the encapsulation part (10) to which it is directed.

9. The light-emitting module according to any one of claims 1 to 8, characterized in that, The light-emitting part (70) includes a plurality of first light-emitting units (71) for emitting a first color light, a plurality of second light-emitting units (72) for emitting a second color light, and a plurality of third light-emitting units (73) for emitting a third color light, wherein the colors of the first color light, the second color light, and the third color light are different from each other; Among them, a plurality of first light-emitting units (71) are connected in series, a plurality of second light-emitting units (72) are connected in series, and a plurality of third light-emitting units (73) are connected in series; The plurality of the first light-emitting units (71) are arranged in a triangular pattern; And / or, multiple second light-emitting units (72) are arranged in a triangular pattern; And / or, the plurality of the third light-emitting units (73) are arranged in a triangular pattern.

10. The light-emitting module according to any one of claims 1 to 8, characterized in that, The light-emitting part (70) includes multiple light-emitting unit groups. Each light-emitting unit group includes a first light-emitting unit (71) for emitting a first color light, a second light-emitting unit (72) for emitting a second color light, and a third light-emitting unit (73) for emitting a third color light. The colors of the first color light, the second color light, and the third color light are different from each other. The geometric centers of the first light-emitting unit (71), the second light-emitting unit (72), and the third light-emitting unit (73) in the same light-emitting unit group form a triangle.

Images