Electronic equipment and control method

Abstract

According to the invention, the action of the fan better matched with the surface temperature is economically realized aiming at the action state of the electronic equipment. A controller, a temperature sensor for detecting temperature, and a fan are housed in a housing, and the controller and the temperature sensor are disposed on a substrate. A model indicating a correlation between a measured temperature, which is a temperature detected by the temperature sensor, and a surface temperature, which is a temperature at a reference point on the surface of the case, is set in advance in the controller, and the controller calculates an estimated value of the surface temperature on the basis of the measured temperature using the model. And controls the operation of the fan on the basis of the estimated value.

Description

Technical Field

[0001] This application relates to electronic devices and control methods, such as temperature control of electronic devices that house various components inside a housing. Background Technology

[0002] Electronic devices, such as personal computers (PCs), contain components that act as heat sources. Components that consume a lot of power are the primary heat sources. Examples of heat-generating components include processors such as CPUs (Central Processing Units). To prevent malfunctions and breakdowns caused by rising temperatures, many electronic devices incorporate heat dissipation mechanisms. For example, the information processing device described in Patent Document 1 has a temperature sensor mounted on the substrate along with components such as the CPU, and includes a fan for dissipating heat generated by the components based on the temperature detected by the temperature sensor.

[0003] Patent Document 1: Japanese Patent Application Publication No. 2014-78199

[0004] With the miniaturization and multifunctionality of electronic devices, various components are sometimes mounted on a substrate at high density. In circuits with such high-density component configurations, heat generation often increases. Furthermore, depending on the usage status of the electronic device, the correlation between the measured temperature detected by a temperature sensor and the surface temperature sometimes becomes unreliable. If fan operation is controlled based on the temperature detected on the substrate, the fan may sometimes operate even when the surface temperature is relatively low. This can cause discomfort or inconvenience for the user. Summary of the Invention

[0005] This application was made to solve the above-mentioned problems. In one aspect of this application, an electronic device includes a controller, a temperature sensor for detecting temperature, and a fan inside a housing. The controller and the temperature sensor are disposed on a substrate. A model representing the correlation between the temperature detected by the temperature sensor (i.e., the measured temperature) and the temperature of a reference point on the surface of the housing (i.e., the surface temperature) is preset in the controller. The controller uses the model to calculate an estimated value of the surface temperature based on the measured temperature and controls the operation of the fan based on the estimated value.

[0006] Alternatively, the electronic device may have a main system configured on the substrate and control the power consumption of the system based on the estimated value.

[0007] Alternatively, the electronic device may have two or more of the aforementioned temperature sensors. The model illustrates the correlation between the set of measured temperatures detected by each of the aforementioned temperature sensors and the aforementioned surface temperature. The controller uses the model to calculate an estimated value of the aforementioned surface temperature based on the set of the aforementioned measured temperatures.

[0008] Alternatively, in the aforementioned electronic device, the aforementioned reference point is the location with the highest temperature on the surface of the aforementioned housing.

[0009] Alternatively, in the aforementioned electronic device, the reference point may be any one of the bottom surface of the housing, the periphery of the vent of the housing, and the surface of the input device covering the housing.

[0010] Alternatively, in the above-mentioned electronic device, peripheral devices are also housed inside the housing, and the peripheral devices are also disposed on the substrate. The model is set with reference to the set of measured temperature and surface temperature detected in each scenario according to different operating states of the peripheral devices.

[0011] One aspect of this application relates to a control method for an electronic device. The electronic device houses a controller, a temperature sensor for detecting temperature, and a fan inside a housing. The controller and the temperature sensor are disposed on a substrate. A model is pre-set to represent the correlation between the temperature detected by the temperature sensor (i.e., the measured temperature) and the temperature of a reference point on the surface of the housing (i.e., the surface temperature). The electronic device uses the model to calculate an estimated value of the surface temperature based on the measured temperature and controls the operation of the fan based on the estimated value.

[0012] According to the embodiments of this application, it is possible to economically achieve fan operation that is more matched to the surface temperature for the operating state of electronic devices. Attached Figure Description

[0013] Figure 1 This is an external view showing an example of the external structure of the electronic device according to this embodiment.

[0014] Figure 2 This is a schematic block diagram illustrating an example of the hardware structure of the electronic device involved in this embodiment.

[0015] Figure 3 This is a top view showing an example of the configuration of the devices inside the first housing according to this embodiment.

[0016] Figure 4 This is a schematic block diagram illustrating an example of the functional structure of the electronic device involved in this embodiment.

[0017] Figure 5This is a flowchart illustrating an example of a control method for an electronic device according to this embodiment.

[0018] Figure 6 This is a graph illustrating the correlation between measured temperature and estimated temperature.

[0019] Figure 7 This is a diagram illustrating a control example of the electronic device involved in this embodiment.

[0020] Explanation of reference numerals in the attached figures

[0021] 1...Electronic device; 10...Main system; 11...CPU; 12...Main memory; 21...Chipset; 22...ROM; 23...Storage; 24...Display; 25...WLAN module; 26...Input / output (I / F); 31...EC; 32...Input device; 32k...Keyboard; 32t...Pointing stick; 33...Battery; 34...Power supply circuit; 35 (35-1, 35-2)...Temperature sensor; 36...Heat dissipation mechanism; 38...Power switch; 102...First housing; 102r...Exhaust port; 103...Substrate; 104...Second housing; 108 (108a, 108b)...Hinge; 110...Power management unit; 362...Drive circuit; 364...Fan; 366...Heat pipe. Detailed Implementation

[0022] Hereinafter, embodiments of the present application will be described with reference to the accompanying drawings. An example of the structure of the electronic device 1 according to this embodiment will be described. Figure 1 This is an external view showing an example of the external structure of the electronic device 1 according to this embodiment. Figure 1 In the example, electronic device 1 is configured as a notebook PC (in this application, it is sometimes referred to as "notebook PC").

[0023] Electronic device 1 includes a first housing 102 and a second housing 104. The first housing 102 and the second housing 104 are parallel to each other with one side surface (sometimes referred to as the "back surface" in this application) facing each other and are rotatably engaged about a rotation axis A using hinges 108a and 108b. The angle between the first housing 102 and the second housing 104 changes by rotation. Without external force applied, the angle between the first housing 102 and the second housing 104 is maintained by the hinges 108a and 108b, supported by the bottom surface of the first housing 102. Electronic device 1 is used with the angle between the first housing 102 and the second housing 104 obtuse, allowing each surface to be open. Additionally, in this application, the side surface of the first housing 102 and the second housing 104 opposite the back surface is sometimes referred to as the "front surface".

[0024] A power switch 38, a keyboard 32k, and a pointing stick 32t are disposed on the surface of the first housing 102. The power switch 38 is disposed within a predetermined distance from one end of the back surface. The keyboard 32k covers most of the surface of the first housing 102 and is supported by the first housing 102 around its perimeter. The pointing stick 32t is disposed in the center of the keyboard 32k.

[0025] A display 24 is disposed on the surface of the second housing 104. The display 24 covers most of the surface of the second housing 104.

[0026] Various components are housed in the first housing 102 and the second housing 104. As described later, the main system 10, EC (Embedded Controller) 31, temperature sensors 35-1 and 35-2, fan 364, etc., are housed inside the first housing 102. Specific components that are part of it are pre-configured on the substrate. For example, the main system 10, EC 31, temperature sensors 35-1 and 35-2, etc., are configured on the substrate.

[0027] Next, an example of the hardware structure of the electronic device 1 according to this embodiment will be described. Figure 2 This is a schematic block diagram illustrating an example of the hardware structure of the electronic device 1 according to this embodiment.

[0028] Electronic device 1 includes a main system 10, ROM (Read Only Memory) 22, storage 23, display 24, WLAN (Wireless Local Area Network) module 25, input / output I / F (Interface) 26, EC 31, input device 32, battery 33, power supply circuit 34, temperature sensor 35, and heat dissipation mechanism 36. Figure 1In this example, electronic device 1 has two temperature sensors 35-1 and 35-2. The heat dissipation mechanism 36 has a drive circuit 362 and a fan 364.

[0029] The main system 10 is the computer system that constitutes the core of the electronic device 1. The main system 10 includes a CPU (Central Processing Unit) 11, a main memory 12, and a chipset 21.

[0030] CPU 11 is a processor that executes various programs. For example, it executes firmware, OS (Operating System), utility software, application programs, etc. In this application, "executing a program" or "program execution" refers to executing the processing instructed by the instructions recorded in the program. By executing programs, CPU 11, in conjunction with main memory 12 and other hardware, implements the functions of the main system 10.

[0031] Main memory 12 is a writable memory used as a read area for the CPU 11 to execute programs or as a work area for writing processing data to the executable programs. Main memory 12 is composed, for example, of multiple DRAM (Dynamic Random Access Memory) chips. CPU 11 and main memory 12 constitute the minimum hardware required to form the main system 10.

[0032] Chipset 21 has multiple controllers and can connect to multiple devices in a manner that allows for various data input and output. The controllers in chipset 21 can be, for example, any of the following: USB (Universal Serial Bus), SPI (Serial Peripheral Interface), PCI-Express bus, etc. Figure 1 In this example, chipset 21 is connected to ROM 22, memory 23, display 24, WLAN module 25, input / output I / F 26, and EC31.

[0033] ROM22 primarily stores firmware. Firmware stored in ROM22 includes BIOS (Unified Extensible Firmware Interface Basic Input / Output System) firmware, firmware used to control various devices, etc. ROM22 can also be any of the following: EEPROM (Electrically Erasable Programmable Read Only Memory), Flash ROM, etc.

[0034] Storage 23 is an auxiliary storage device for storing various data used in the processing of the main system 10, various data obtained through the aforementioned processing, and various programs. Storage 23 may be, for example, any of SSD (Solid State Drive) or HDD (Hard-disk Drive).

[0035] The display 24 displays a screen based on display data input from the CPU 11. The display 24 may be, for example, any of the following: a liquid crystal display (LCD) or an OLED (Organic Light Emitting Diode) display.

[0036] The WLAN module 25 connects to the WLAN in a manner capable of sending and receiving various types of data. The WLAN module 25 is able to send and receive various types of data with the WLAN or other devices connected to other networks via the WLAN. These other networks can be, for example, any of the following: the Internet, a public wireless network, a virtual private network, etc.

[0037] The I / O I / F26 connects to various devices via wired or wireless means to input and output data. For example, the I / O I / F26 may include a USB connector. A USB connector is a connector used for wired data input and output according to USB specifications.

[0038] The EC31 is a controller that monitors and controls the operation of various devices connected to it regardless of the operating state of the main system 10. The EC31 operates independently of the main system 10 and includes a CPU, ROM, RAM, timers, and input / output (I / O) functions. The EC31 can connect to devices with lower data transfer speeds than the chipset 21. Figure 1 In the example, EC31 is connected to input device 32, power supply circuit 34, temperature sensors 35-1 and 35-2, and heat dissipation mechanism 36.

[0039] Input device 32 detects the user's operation, generates an operation signal based on the detected operation, and outputs the generated operation signal to EC31. The keyboard 32k and pointing stick 32t described above are examples of input device 32.

[0040] Battery 33 charges the power supplied from power circuit 34. Alternatively, battery 33 discharges the power stored within itself into power circuit 34. The battery can be, for example, any of lithium-ion batteries, sodium-ion batteries, etc.

[0041] Power supply circuit 34, under the control of EC31, supplies power to each device. Power supply circuit 34 includes a charger and a transformer (DC / DC, Direct Current / Direct Current).

[0042] The charger charges the battery 33 with excess power remaining in the devices from the power supplied by the external power source that has not been consumed. When there is no power supply from the external power source or when the power supplied from the power source is insufficient for the needs of the devices, the charger supplies the power discharged from the battery 33 to the devices via a transformer.

[0043] The transformer converts the DC power supplied from an external power source or battery 33 via a charger into the voltage required for the operation of each device. The transformer then supplies the DC power with the converted voltage to the device at its destination.

[0044] Temperature sensors 35-1 and 35-2 are positioned at different locations to detect the temperature at their respective locations. Temperature sensors 35-1 and 35-2 then transmit the measured temperature values, i.e., the actual measured temperatures, to EC31.

[0045] The heat dissipation mechanism 36 includes a drive circuit 362 and a fan 364.

[0046] The drive circuit 362 causes the fan 364 to operate in a manner indicated by the control signal input from EC31. The drive circuit 362 supplies power to the fan 364 corresponding to the indicated output.

[0047] The fan 364 has a motor that rotates by consuming power supplied from the drive circuit 362, and the motor causes the blades to rotate. The rotation of the blades generates an airflow inside the first housing 102, and new air flows in from the outside of the first housing 102. The incoming air absorbs heat released from the components inside the first housing 102, causing its temperature to rise. The heated air is then exhausted to the outside of the first housing 102.

[0048] Next, an example of the configuration of the devices inside the first housing 102 according to this embodiment will be described. Figure 3This is a top view showing an example of the configuration of the devices inside the first housing 102 according to this embodiment. A substrate 103 is laid inside the first housing 102. A CPU 11, main memory 12, chipset 21, ROM 22, storage 23, WLAN module 25, EC 31, power supply circuit 34, temperature sensors 35-1 and 35-2, and heat pipe 366 are disposed on the surface of the substrate 103. An input / output I / O 26, a battery 33, a drive circuit 362, and a fan 364 are also disposed in the first housing 102. The drive circuit 362 and the fan 364 are integrally formed, and... Figure 3 There is no indication of this.

[0049] An exhaust port 102r is provided in an area within a predetermined distance from the other end of the back surface of the first housing 102. The exhaust port 102r is surrounded by a rear frame (not shown). The exhaust port 102r faces the fan 364 across one end of the heat pipe 366. A keyboard frame (not shown) and a keyboard 32k are sequentially overlapped on the surface of the first housing 102. Figure 1 The keyboard bezel has multiple openings through which air can flow from the surface of the keyboard 32k into the interior of the first housing 102. When the fan 364 is activated, the incoming air passes through the interior space of the first housing 102, through one end of the fan 364 and heat pipe 366, and is exhausted from the exhaust port 102r. The air flowing into the first housing 102 experiences a temperature rise due to heat dissipation from the various components and the heat pipe 366. By expelling the heated air, the temperature rise inside the first housing 102 can be suppressed.

[0050] Figure 3 In this example, a chipset 21, a CPU 11, a main memory 12, and a WLAN module 25 are sequentially arranged from one end of the heat pipe 366 to the other. The heat generated in each of the chipset 21, CPU 11, main memory 12, and WLAN module 25 is conducted towards one end of the heat pipe 366 to dissipate heat to the surrounding air at that end.

[0051] Furthermore, temperature sensors 35-1 and 35-2 are each positioned within a predetermined distance of the CPU 11 and WLAN module 25. This allows for temperature control of the CPU 11 and WLAN module 25, which generate significant heat.

[0052] Additionally, the battery 33 is arranged parallel to its long side on the front surface of the first housing 102. The input / output I / F26 is disposed on the side end face of the first housing 102.

[0053] Next, an example of the functional structure of the electronic device 1 involved in this embodiment will be described. Figure 4 This is a schematic block diagram illustrating an example of the functional structure of the electronic device 1 according to this embodiment.

[0054] EC31 monitors the measured temperature reported by temperature sensors 35-1 and 35-2.

[0055] EC31 uses a pre-defined mathematical model to calculate the estimated surface temperature of a predetermined reference point on the surface of the first housing 102 based on the measured temperatures of temperature sensors 35-1 and 35-2. For example, EC31 uses a binary regression model as shown in equation (1) to calculate the estimated surface temperature Y based on the measured temperatures X1 and X2 of temperature sensors 35-1 and 35-2. apu (In this application, it is sometimes referred to as "estimated surface temperature Y") apu In equation (1), M1 and M2 represent the coefficients multiplied by the measured temperatures X1 and X2, respectively. The coefficients M1 and M2 represent the measured temperatures X1 and X2 multiplied by the estimated surface temperature Y. apu The weighting coefficient of contribution. C apu This represents a constant. Additionally, the order of the measured temperatures X1 and X2 can also be set in descending order of coefficients M1 and M2. The learning methods for mathematical models will be discussed later.

[0056] Equation 1

[0057]

[0058] EC31 refers to a control table to determine the output value of fan 364 corresponding to a predetermined surface temperature. The control table is preset in the register of EC31. The control table is a data table that correlates the predetermined surface temperature with the output value of fan 364. The control table is set so that the higher the predetermined surface temperature, the greater the output value. The output value can be indicated by the motor's rotational speed or by the noise level generated due to rotation. EC31 outputs a control signal indicating the determined output amount to drive circuit 362. The control table can also be preset with a lower limit for the operating temperature of fan 364. When the predetermined surface temperature is below the lower limit of the operating temperature, EC31 sets the output value of fan 364 to zero. In this case, the operation of fan 364 stops.

[0059] In addition, EC31 will notify the main system 10 of the estimated surface temperature.

[0060] The main system 10 executes the OS, which manages the execution of other programs, memory, processes and other computing resources, and input / output with various devices.

[0061] The main system 10 includes a power management unit 110. The power management unit 110 controls power consumption based on an estimated surface temperature notified from EC31. For example, the power management unit 110 controls the power consumption of the main system 10 by determining the operating mode based on the estimated surface temperature notified from EC31.

[0062] The main system 10 can adopt operating modes, such as a standard mode and a thermal protection mode. Different power control parameters are set for each operating mode. These power control parameters include, for example, PL1 (Power Limit 1) and PL2 (Power Limit 2). PL1 corresponds to the rated power of the CPU 11. The rated power is a threshold value that allows the moving average power consumption to temporarily exceed, but limits stable (e.g., for several seconds to tens of seconds or more) exceeding this value. The window length used for the moving average (the observation time for calculating the instantaneous value of the moving average at a given moment) is typically, for example, about 1 second to 10 seconds. PL2 is a threshold value used to limit the power consumption of the CPU 11 even if it is temporarily exceeded. Generally, for the CPU 11, a higher clock frequency results in more computational processing, accompanied by increased power consumption. The CPU 11 has a control mechanism that adjusts the clock frequency to prevent the instantaneous power consumption from exceeding PL2 and to prevent the moving average power consumption from exceeding PL1.

[0063] The standard mode is an operating mode that provides the standard functions expected as a specification of electronic device 1. The standard mode is provided when the estimated surface temperature at that moment is within a predetermined range of standard operating temperatures (in this application, sometimes referred to as "standard operating temperature"). The thermal protection mode is provided when the estimated surface temperature is within a predetermined range of individual operating temperatures (in this application, sometimes referred to as "thermal protection operating temperature"). The thermal protection operating temperature is a temperature range that includes temperatures higher than the standard operating temperature. The thermal protection mode is an operating mode that consumes less power than the standard mode. The power control parameters involved in the thermal protection mode are set to be smaller than those involved in the standard mode. Under the power consumption of a shared CPU 11, the output value of fan 364 in the thermal protection mode can be larger than the output value of fan 364 in the standard mode.

[0064] The power management unit 110 monitors the estimated surface temperature notified from EC31. If the operating mode is standard mode at that moment and the estimated surface temperature exceeds the upper limit of the standard operating temperature, the power management unit 110 changes the operating mode to thermal protection mode. Furthermore, the power management unit 110 notifies EC31 of the thermal protection mode as the changed operating mode.

[0065] If the operating mode at that moment is thermal protection mode and the estimated surface temperature is below the lower limit of the thermal protection operating temperature, the power management unit 110 changes the operating mode to the standard mode. The power management unit 110 notifies EC31 of the changed operating mode as thermal protection mode.

[0066] Additionally, if the operating mode at this moment is thermal protection mode and the estimated surface temperature exceeds the upper limit of the thermal protection operating temperature, the power management unit 110 can also change the operating mode to a hibernation state. The hibernation state is equivalent to a paused state where the operation of the CPU 11 and main memory 12 is stopped. The hibernation state is equivalent to state S4 in the system states defined by ACPI (Advanced Configuration and Power Interface). In contrast, standard mode and thermal protection mode are equivalent to state S0 in the system states defined by ACPI. When the power management unit 110 changes the operating mode from thermal protection mode to hibernation state, it stops the execution of the running program. The power management unit 110 generates an image file including various intermediate data and parameters generated by the processing of the CPU 11, and stores (temporarily stores) the generated image file in memory 23. Furthermore, the power management unit 110 notifies EC31 of the hibernation state as the operating mode. Subsequently, the CPU 11 terminates its operation. Moreover, EC31 causes the drive circuit 362 to stop supplying power to the CPU 11, main memory 12, and memory 23. Alternatively, EC31 can also cause the drive circuit 362 to stop supplying power to the fan 364.

[0067] The transition from hibernation mode to standard mode or thermal protection mode is conditional upon detecting a startup indication. EC31 detects the contact of the power switch 38 electrically or mechanically, initiating power supply from the power circuit 34 to the CPU 11, main memory 12, and storage 23. The CPU 11 reads the image file from storage 23 and stores it in main memory 12. Subsequently, the CPU 11 uses the read image file to resume execution of the program immediately preceding the change from operating mode to hibernation mode. Thus, the operation of the main system 10 restarts.

[0068] When transitioning from sleep mode to standard mode or thermal protection mode, EC31 again begins to notify the main system 10 of the calculated estimated surface temperature. At this time, EC31 again begins to control the operation of fan 364 using drive circuit 362.

[0069] When the estimated surface temperature notified from EC31 falls below the upper limit of the standard operating temperature, the main system 10 restarts operation in standard mode. When the estimated surface temperature notified from EC31 exceeds the upper limit of the standard operating temperature and falls below the lower limit of the standard operating temperature, the main system 10 restarts operation in thermal protection mode.

[0070] Furthermore, when the estimated surface temperature exceeds the upper limit of the thermal protection operating temperature, EC31 does not start the main system 10, but maintains the operating mode as a hibernation state. At this time, EC31 does not start supplying power from the power supply circuit 34 to the CPU 11, main memory 12, and memory 23, but remains in a stopped state.

[0071] Next, an example of the control method of the electronic device 1 according to this embodiment will be described.

[0072] Figure 5 This is a flowchart illustrating an example of a control method for the electronic device 1 according to this embodiment.

[0073] (Step S102) Temperature sensors 35-1 and 35-2 disposed on the surface of substrate 103 detect the temperature respectively and notify EC31 as the measured temperature X1 and X2.

[0074] (Step S104) EC31 calculates the estimated surface temperature Y using a predetermined mathematical model based on the measured temperatures X1 and X2 notified from temperature sensors 35-1 and 35-2. apu EC31 will calculate the estimated surface temperature Y. apu Notify the main system 10.

[0075] (Step S106) EC31 is based on the estimated surface temperature Y apu This controls the operation of fan 364. Here, EC31 refers to a pre-set control table based on the estimated surface temperature Y. apu The system determines the output value of fan 364 and outputs a control signal indicating the determined output value to drive circuit 362. Drive circuit 362 supplies power to fan 364 corresponding to the output value indicated by the control signal. Thus, the output of fan 364 is controlled.

[0076] (Step S108) The power management unit 110 of the main system 10, based on the estimated surface temperature Y notified from EC31, apu The system determines the operating mode and sets the power control parameters based on the determined operating mode. This controls the power consumption of the main system 10. Then, the process ends. Figure 5 The processing.

[0077] Next, an example of a regression model used to calculate the estimated surface temperature based on measured temperature will be explained. The parameters of the regression model are obtained by pre-acquiring and performing regression analysis (learning) on ​​the training data. A set of training data consists of multiple datasets. Each dataset consists of measured values ​​(input values) of explanatory variables and measured values ​​(output values) of the target variable. According to the regression analysis, the parameters of the regression model are determined in a way that the index value of the difference between the estimated value and the measured value of the target variable calculated using a mathematical model on the measured values ​​of the explanatory variables is reduced (minimized) on the training data as a whole. In the regression model illustrated in Equation (1), the coefficients M1, M2 and the constant C apu These are equivalent to the parameters of the regression model. When determining the parameters of the regression equation, well-known regression analysis methods can be used. For example, the least squares method can be used as a regression analysis method. In this case, the index value representing the magnitude of the difference can be, for example, the sum of squares of the differences between the estimated and measured values.

[0078] Figure 6 This is a graph illustrating the training data and the regression model. Figure 6 In the diagram, the vertical axis represents the surface temperature, and the horizontal axis represents the measured temperature X1. The illustration of the measured temperature X2 is omitted. Each symbol represents a group of measured values ​​of the measured temperature X1 and the surface temperature for each dataset. The measured surface temperature (sometimes referred to as "measured surface temperature" in this application) is detected using a temperature sensor separate from temperature sensors 35-1 and 35-2. This temperature sensor is pre-set at a reference point on the surface of the first housing 102. Each dataset is configured to contain the measured surface temperature detected simultaneously with the measured temperatures X1 and X2. Figure 6 In the figure, the straight line represents the relationship between the measured temperature X1 and the estimated surface temperature Y, as shown by the regression model. apu The relationship between them. Based on regression analysis, the coefficients M1, M2, and the constant C, as parameters, are determined in a way that yields a regression model that represents the distribution of the dataset as a whole over the training data. apu .

[0079] By using a regression model, the surface temperature of a reference point is estimated based on measured temperatures X1 and X2. The reference point can be any point on the bottom surface of the first housing 102 (e.g., the center), the rear edge of the exhaust port 102r, or any point on the keyboard 32k covering the surface of the first housing 102 (e.g., the pointing stick 32t). These locations are highly likely to be touched continuously or frequently by the user during use of the electronic device 1. By avoiding abnormal temperature rises near the reference point during use, the user can use the electronic device 1 with peace of mind. Furthermore, the reference point can also be the location on the surface of the first housing 102 with the highest temperature during operation of the electronic device 1 (e.g., directly above the CPU 11). Therefore, by using the estimated surface temperature of the reference point as an upper limit, the possibility of the surface temperature of the first housing 102 becoming even higher can be reduced.

[0080] Next, an example of controlling the fan 364 according to this embodiment will be described. Figure 7 This is a diagram illustrating a control example for fan 364. Figure 7 Examples are shown of the measured temperature X1, the measured surface temperature, the estimated surface temperature, and the change in the rotational speed of the fan 364 over time, observed when the electronic device 1 operates under scenarios A through D. The illustration of the measured temperature X2 is omitted. Scenario A is an operation where the CPU 11 continuously performs image processing while executing steps instructed by intermittently issued individual processing requests. Scenario B is an operation where the CPU 11 performs steps instructed by intermittently issued processing requests without performing image processing. In scenarios A and B, heat is primarily generated in the CPU 11 and main memory 12. Scenario C is an operation where the CPU 11 sequentially reads a large amount of data pre-stored in memory 23 and uses the WLAN module 25 to transmit the read data. Scenario D is an operation where the CPU 11 sequentially receives data using the WLAN module 25 and writes the received data into memory 23. In scenarios C and D, heat is generated not only in the CPU 11 and main memory 12 but also in the WLAN module 25.

[0081] Figure 7 In the diagram, solid and dashed lines respectively indicate the rotational speeds obtained through this embodiment and the comparative example. In the comparative example, EC31 does not use the estimated surface temperature Y. apu Instead, the rotational speed of fan 364 is determined by the measured temperature X1.

[0082] In scenarios A and B, there was no significant difference in the rotational speed of fan 364 between this embodiment and the comparative example. Furthermore, the measured temperature X1 on the substrate was approximately the same as the estimated or measured surface temperature, with relatively small differences between them. On the other hand, in scenarios C and D, there was a significant difference in the rotational speed of fan 364 between this embodiment and the comparative example. Thus, in scenarios C and D, the correlation between the measured temperature and the surface temperature obtained in scenarios A and B was not maintained. In the comparative example, even when the surface temperature was relatively low, fan 364 did not unnecessarily operate at high output.

[0083] In contrast, in this embodiment, the output of fan 364 is suppressed. In scenario C, the rotational speed of this embodiment is 5 dB lower than that of the comparative example. In scenario D, the rotational speed of this embodiment is 8 dB lower than that of the comparative example. That is, even when there is a discrepancy between the measured temperature X1 on the substrate and the surface temperature due to the operating state, the operation of fan 364 is suppressed by using the estimated surface temperature. Furthermore, in scenarios C and D, the difference between the measured surface temperature and the estimated surface temperature is also small, with a maximum of about 1°C. This shows that this embodiment uses a regression model to estimate the surface temperature, thereby eliminating the need for a separate temperature sensor for detecting the surface temperature and economically reducing the output of fan 364. Furthermore, it is shown that by using multiple temperature sensors disposed at different positions on the substrate 103, the surface temperature can be accurately estimated even based on different operating states of the scenario.

[0084] Furthermore, while the above examples primarily focus on two temperature sensors on the substrate, they are not limited to this. The number of temperature sensors N can also be one or more. The EC31 uses a regression model to calculate the estimated surface temperature based on the measured temperatures detected by the N temperature sensors. The regression model used in calculating the estimated surface temperature can be pre-learned using training data comprising a dataset containing N measured temperatures based on the N temperature sensors as explanatory variables and the measured surface temperature based on the temperature sensor set at a reference point as the target variable. Some or all of the N temperature sensors can also be configured to be closer to a specific device than other devices.

[0085] Furthermore, the training data used in learning the regression model can also be configured as each scenario with different action states of surrounding devices, and contain at least one dataset consisting of explanatory and target variables.

[0086] The regression model is not limited to linear regression; it can also be a nonlinear regression model.

[0087] Electronic device 1 is not necessarily limited to laptop PCs; it can also be electronic devices implemented in other forms, such as tablet terminals.

[0088] As described above, the electronic device 1 according to this embodiment houses a controller (e.g., EC31), a temperature sensor 35 for detecting temperature, and a fan 364 inside a housing (e.g., first housing 102). The controller and the temperature sensor 35 are disposed on a substrate 103. A model (e.g., a regression model) representing the correlation between the temperature detected by the temperature sensor, i.e., the measured temperature (e.g., measured temperature X1, X2), and the temperature of a reference point on the surface of the housing, i.e., the surface temperature, is preset in the controller. The controller uses the preset model to calculate an estimated value of the surface temperature (e.g., estimated surface temperature Y) based on the measured temperature. apu ), and control the operation of fan 364 based on the calculated estimated value.

[0089] According to this structure, the operation of fan 364 is controlled based on an estimated value of the surface temperature calculated from the measured temperature. Therefore, even if the correlation between the surface temperature and the measured temperature changes depending on the operating conditions, unexpected operation or increased output of fan 364 is avoided, achieving operation corresponding to the surface temperature. Furthermore, it avoids the increased production costs caused by installing a new temperature sensor for detecting the surface temperature.

[0090] Alternatively, the electronic device 1 may have a main system 10, which is configured on the substrate 103 and controls the power consumption of the system based on an estimated value of the surface temperature.

[0091] According to this structure, even when the correlation between the surface temperature and the measured temperature changes depending on the operating conditions, the operation of the main system 10 is controlled based on the surface temperature.

[0092] Alternatively, electronic device 1 may have two or more temperature sensors (e.g., temperature sensors 35-1, 35-2). The model for calculating the surface temperature shows the correlation between a set of measured temperatures detected by each temperature sensor (e.g., measured temperatures X1, X2) and the surface temperature (e.g., measured surface temperature). The controller uses this model to calculate an estimated value of the surface temperature (e.g., estimated surface temperature Y) based on the set of measured temperatures. apu ).

[0093] The reference point for surface temperature can also be the location with the highest temperature on the surface of the shell.

[0094] In addition, the reference point for surface temperature can also be any of the following: the bottom surface of the housing, the periphery of the housing's vent (e.g., the rear frame), and the surface of the input devices covering the housing (e.g., the keyboard 32k, the pointing stick 32t).

[0095] According to this structure, by using the measured temperatures detected at different locations on the substrate 103, even if there are variations in the correlation between the measured temperature and the surface temperature based on the changes in the temperature distribution within the housing caused by the operating state, the surface temperature can be estimated more accurately than when using only one temperature sensor.

[0096] Alternatively, the electronic device 1 may house peripheral devices (such as a WLAN module 25) on a substrate inside the housing, and the model for calculating the surface temperature may be set using training data consisting of one or more sets of measured temperatures and surface temperatures detected according to each operating state of the peripheral devices.

[0097] Based on this structure, a model is obtained for calculating the surface temperature from the measured temperature, taking into account the different temperature distributions for each scenario based on the different operating states of surrounding devices. Therefore, the estimation accuracy of the measured temperature calculated from the measured temperature is further improved.

[0098] The embodiments of this application have been described in detail above with reference to the accompanying drawings. However, the specific structure is not limited to the above embodiments and also includes designs that do not depart from the spirit of the invention. The structures described in the above embodiments can be combined arbitrarily.

Claims

1. An electronic device, characterized in that, The housing contains a controller, a temperature sensor for detecting temperature, and a fan. The controller and the temperature sensor are mounted on a substrate. A model representing the correlation between the temperature detected by the temperature sensor (i.e., the measured temperature) and the temperature of a reference point on the surface of the housing (i.e., the surface temperature) is pre-set in the controller. The controller uses the model to calculate an estimated value of the surface temperature based on the measured temperature, and controls the operation of the fan based on the estimated value.

2. The electronic device according to claim 1, characterized in that, It has a main system. The main system is configured on the substrate and controls the power consumption of the system based on the estimated value.

3. The electronic device according to claim 1, characterized in that, It has two or more of the aforementioned temperature sensors. The model illustrates the correlation between the set of measured temperatures detected by each of the temperature sensors and the surface temperature. The controller uses the model to calculate an estimated value for the surface temperature based on the set of measured temperatures.

4. The electronic device according to claim 1, characterized in that, The reference point is the location with the highest temperature on the surface of the shell.

5. The electronic device according to claim 1, characterized in that, The reference point is any one of the following: the bottom surface of the housing, the periphery of the vent of the housing, and the surface of the input device covering the housing.

6. The electronic device according to claim 1, characterized in that, The housing also houses peripheral components. The peripheral devices are also disposed on the substrate. The model is set with reference to one or more sets of the measured temperature and the surface temperature detected according to each operating state of the peripheral device.

7. A control method for an electronic device, wherein the electronic device houses a controller, a temperature sensor for detecting temperature, and a fan inside a housing, the controller and the temperature sensor being disposed on a substrate, and a model pre-set to represent the correlation between the temperature detected by the temperature sensor (i.e., the measured temperature) and the temperature of a reference point on the surface of the housing (i.e., the surface temperature). The control method is characterized in that... The electronic device uses the model to calculate an estimated value of the surface temperature based on the measured temperature, and controls the operation of the fan based on the estimated value.

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