Power conversion device

Abstract

The invention provides a power conversion device. Relates to the technical field of power electronics. The power conversion device comprises a shell, and a circuit board, a bearing piece, a first conducting bar, a second conducting bar and an inductor which are arranged in the shell, wherein the bearing part comprises a first surface and a second surface, the first surface and the second surface deviate from each other, the inductor is arranged on the first surface, the first conducting bar, the second conducting bar and the circuit board are arranged on the second surface, and the first surface is fixed on the shell; the inductor is provided with a first end and a second end, the first end penetrates through the bearing part and is connected with the first conducting bar, and the second end penetrates through the bearing part and is connected with the second conducting bar; the first conducting bar and the second conducting bar are electrically connected with the circuit board. Thus, the inductor is arranged on the bearing part, the bearing part is arranged on the shell, the dead weight of the inductor or external force borne by the inductor is applied to the shell, and the circuit board has higher reliability after being free of the external force.

Description

Technical Field

[0001] This application relates to the field of power electronics technology, and in particular to a power conversion device. Background Technology

[0002] Power conversion devices typically include inductors, which play a crucial role in filtering, voltage regulation, energy storage, and energy transmission, ensuring that the power conversion device can efficiently and stably convert direct current into alternating current.

[0003] In related technologies, inductors are usually soldered to circuit boards. When the inductor is heavy, it can easily cause the circuit board to deform. The deformation of the circuit board can damage sensitive components on the circuit board, such as ceramic capacitors and diodes. Summary of the Invention

[0004] This application provides a power conversion device. In this power conversion device, an inductor is mounted on a support member, and the support member is housed within a housing. Thus, a portion of the inductor's weight or a portion of the external force acting on the inductor is applied to the housing. The external force on the circuit board from the inductor is reduced, thereby reducing the deformation of the circuit board caused by the inductor and decreasing the risk of damage to sensitive components on the circuit board.

[0005] To achieve the above objectives, the embodiments of this application adopt the following technical solutions:

[0006] This application provides a power conversion device. The power conversion device of this application embodiment can be applied in the fields of site energy, residential energy storage, industrial and commercial energy storage, large ground power station energy storage or vehicle charging. The power conversion device can be an inverter, uninterruptible power supply, energy storage converter or vehicle charger, etc.

[0007] The power conversion device provided in this application includes a housing and a circuit board, a carrier, a first conductive bus, a second conductive bus, and an inductor disposed within the housing; wherein, the carrier includes a first side and a second side that are opposite to each other, the first side is provided with an inductor, and the second side is provided with the first conductive bus, the second conductive bus, and the circuit board, and the first side is fixed to the housing; the inductor has a first end and a second end, the first end passes through the carrier and is connected to the first conductive bus, and the second end passes through the carrier and is connected to the second conductive bus; both the first conductive bus and the second conductive bus are electrically connected to the circuit board.

[0008] In the power conversion device based on the embodiments of this application, the inductor is fixed on the carrier, and the carrier contacts and is fixed to the housing. The weight of the inductor and / or the external force experienced by the inductor is applied to the housing through the carrier. Compared with the inductor being directly soldered to the circuit board in related technologies, the circuit board needs to withstand greater external stress due to the weight of the inductor itself. In addition, during the production and transportation of the power conversion device, the inductor will be subjected to vibration, which will cause the circuit board to withstand even greater external stress. In this application, the weight of the inductor or the external force it receives (for example, the inductor may receive a large external force during the assembly or transportation of the power conversion device) is transmitted to the housing through the carrier. In this way, the external force from the inductor on the circuit board is reduced, the circuit board is less likely to deform, and the sensitive components set on the circuit board are less likely to be damaged, so that the power conversion device of this application has higher reliability.

[0009] In addition, an inductor is provided on the first side, and a first conductive bus and a second conductive bus are provided on the second side. That is, the carrier is located between the inductor and the conductive bus (here, the first conductive bus and the second conductive bus are collectively referred to as the conductive bus). Compared with when the inductor is directly soldered to the circuit board, the inductor and the circuit board are closer together. In this embodiment of the application, the circuit board and the inductor are farther apart. Since the alternating magnetic field generated by the inductor when passing AC current is lower the distance from the inductor, when there is a greater distance between the circuit board and the inductor, the circuit board is less affected by the alternating magnetic field generated by the inductor when passing AC current, that is, the eddy current loss caused by the copper foil of the circuit board is reduced.

[0010] In some feasible embodiments, the inner side of the housing is provided with multiple protrusions facing the support member, each protrusion being closely attached to the inner sidewall of the housing, the side of the protrusion facing the support member being provided with a connecting hole, and the side of the protrusion facing the support member contacting the first surface, the support member being provided with multiple first through holes penetrating the first surface and the second surface; the power conversion device also includes a connector, the connector passing through the first through hole and the connecting hole.

[0011] In this example, after the inner side of the housing is provided with bosses, the first surface directly contacts the side of the multiple bosses facing the carrier, that is, the carrier is placed on the multiple bosses. The connector passes through the first through hole on the carrier and connects to the connecting hole on the boss, pressing the carrier onto the multiple bosses. Furthermore, the inner side of the housing is provided with multiple bosses, and each boss is closely attached to the inner side wall of the housing, so that the multiple bosses are located at the edge of the housing, occupying little internal space of the housing, which facilitates the arrangement of other components in the power conversion device within the housing.

[0012] In some possible implementations, the number of inductors is multiple; the power conversion device also includes a bus, which is disposed on the second side, with one end of the bus connected to the second end of at least one inductor and the other end of the bus connected to a second conductive bus.

[0013] In this example, when one end of a bus is connected to the second end of an inductor and the other end is connected to a second conductive bus, the second conductive bus can be positioned at any location on the second side. The bus can connect the second conductive bus and the second end of the inductor. That is, the position of the second conductive bus on the carrier is not limited by the position of the second end of the inductor. Thus, the circuit board is not affected by the position of the second conductive bus when wiring the circuit. Therefore, when wiring the circuit board, the position of the other electrical components connected to the circuit board in the power conversion device can be considered, and the electrical components in the power conversion device can be laid out more reasonably.

[0014] When multiple inductors are connected to their second terminals on a busbar, the second terminals of the multiple inductors are connected in parallel through the busbar. The AC power output from the multiple inductors is then collected by the busbar and transmitted to a second busbar. It can be seen that the AC power is collected through the structure of the power conversion device, without the need for collection through the circuit on the circuit board, which reduces the manufacturing difficulty of the circuit board and reduces the area of ​​the circuit board.

[0015] Furthermore, one end of the busbar is connected to the second terminals of multiple inductors, and the other end of the busbar is connected to a second conductive busbar, which reduces the number of second conductive busbars. Naturally, this also reduces the number of connection points between the second conductive busbars and the circuit board. Since electrical components have contact resistance at the connection points, the fewer connection points between electrical components, the lower the resistance of the circuit. Therefore, with fewer second conductive busbars and fewer connection points between the second conductive busbars and the circuit board, the current loss during the flow between the circuit board and the second conductive busbars is smaller, and the power conversion device naturally has lower losses and higher efficiency.

[0016] In some feasible implementations, the second side is provided with a clamping structure, which includes two clamping members arranged opposite to each other. The clamping members extend from the second side in a direction away from the inductor, and the two clamping members clamp a portion of the busbar.

[0017] In this example, when assembling the bus and the carrier, the bus only needs to be pressed between the two clamping members in the clamping structure. It can be seen that when the bus and the carrier are assembled, the two clamping members can guide the bus; and after the two clamping members in the clamping structure clamp part of the bus, the clamping structure achieves the fixation of the bus and realizes the assembly of the bus and the carrier.

[0018] In some feasible implementations, there are multiple busbars and multiple second conductors, and the multiple second conductors and multiple busbars are spaced apart perpendicular to the arrangement direction of the multiple inductors; one end of each busbar is connected to the second end of at least one inductor, and the other end of each busbar is connected to a second conductor.

[0019] In this example, there are multiple second conductive busbars, which can output multi-phase AC power. At this time, a carrier is provided with multiple inductors, multiple first conductive busbars, and multiple second conductive busbars, so the integration of the carrier, first conductive busbars, second conductive busbars, and inductors is high. The multiple second conductive busbars are arranged at intervals perpendicular to the arrangement direction of the multiple inductors. At this time, the arrangement directions of the multiple first conductive busbars and the multiple second conductive busbars are perpendicular to each other, so that the carrier, first conductive busbars, second conductive busbars, and inductors can be used on circuit boards with different wiring methods.

[0020] In some possible implementations, the power conversion device further includes a first support and a second support, both of which extend from the second surface in a direction away from the plurality of inductors; a first conductive bus is connected to the side of the first support away from the second surface, and a second conductive bus is connected to the side of the second support away from the second surface.

[0021] In this example, since both the first and second conductive busbars fixed to the carrier are connected to the circuit board, a small portion of the force transmitted from the inductor to the carrier is still transmitted to the circuit board. The first support supports the first conductive busbar, and the second support supports the second conductive busbar. At this time, the small portion of the force applied by the inductor to the carrier will be transmitted to the first and second support seats, and then to the circuit board. Thus, the first and second conductive busbars do not need to bear the force transmitted from the carrier to the circuit board, ensuring the connection between the first conductive busbar and the first end of the inductor, as well as the connection between the busbar and the second conductive busbar.

[0022] In some possible implementations, the circuit board includes a first circuit board and a second circuit board disposed on the second side, the distance between the first circuit board and the second side being less than or greater than the distance between the second circuit board and the second side, the first circuit board contacting and connecting to a first conductive busbar, and the second circuit board contacting and connecting to a second conductive busbar; the distance between the side of the first support facing away from the second side and the second side is less than or greater than the distance between the side of the second support facing away from the second side and the second side.

[0023] In this example, since the distance between the first circuit board and the second surface is less than or greater than the distance between the second circuit board and the second surface, i.e., the first circuit board and the second circuit board are on different planes, in order to achieve the connection between the first circuit board and the first conductive busbar, and the connection between the second circuit board and the second conductive busbar, the distance between the side of the first support facing away from the second surface and the second surface is less than or greater than the distance between the side of the second support facing away from the second surface and the second surface, so that the first conductive busbar and the second conductive busbar are on different planes. The first conductive busbar and the second conductive busbar can be connected to the first circuit board and the second circuit board with different distances from the second surface, which can adapt to the situation where there are multiple circuit boards in the power conversion device.

[0024] In some possible implementations, the first support is located at any end of the carrier perpendicular to the arrangement direction of the plurality of inductors, and the second support is located at any end of the carrier along the arrangement direction of the plurality of inductors.

[0025] In this example, the second support is disposed at any end of the carrier along multiple inductor arrangement directions. At this time, the second support is located at the edge of the carrier, that is, the second support avoids the main body of the carrier and will not interfere with the arrangement of the first conductive busbar on the carrier.

[0026] Furthermore, since the second conductive bus is located on the end face of the second support base away from the inductor, the second conductive bus on the second support base is also located at the edge of the carrier. At this time, the first conductive bus is located in the main body of the carrier, while the second conductive bus is located at the edge of the carrier. The arrangement of the first and second conductive buses is dispersed, which reduces the wiring density of the circuit board at the connection of the first conductive bus and the connection of the second conductive bus.

[0027] In some possible implementations, the housing includes an integrally formed first housing portion and a second housing portion, the first housing portion having a first receiving cavity and the second housing portion having a second receiving cavity, the first receiving cavity being in communication with the second receiving cavity; the first receiving cavity being used to receive a circuit board, a carrier, a first conductive bus and a second conductive bus; and the second receiving cavity being used to receive an inductor.

[0028] In this example, the second housing portion for accommodating the inductor has a second receiving cavity for accommodating the inductor. That is, the inductor is accommodated by the housing of the power conversion device to achieve protection of the inductor. It can be considered that the housing of the power conversion device and the housing of the inductor are integrally set, without a separate inductor housing. This realizes the integrated design of the housing of the power conversion device and the housing of the inductor. When assembling the power conversion device, there is no need to assemble the housing of the power conversion device and the housing of the inductor separately. Naturally, there is no need for a seal between the housing of the power conversion device and the housing of the inductor. This facilitates the assembly of the power conversion device and reduces the material cost of the power conversion device.

[0029] In some feasible embodiments, the carrier is provided with an opening penetrating the first and second surfaces, the opening connecting to the second receiving cavity.

[0030] In this example, the filler layer fills the gap between the outer surface of the inductor and the cavity wall. This filler layer forms a protective layer on the outer surface of the inductor, isolating it from the external environment. The filler layer effectively prevents the inductor from intruding dust, moisture, and other contaminants, thereby improving the inductor's reliability and lifespan; in other words, the inductor has higher protection performance. Furthermore, the filler layer can fix the inductor in place, preventing it from loosening due to vibration or impact, thus improving the inductor's reliability and stability.

[0031] The opening allows liquid filler material to enter the second cavity during inductor assembly. After the liquid material solidifies to form a filler layer, the second cavity is connected to the first cavity through the opening. The heat generated by the inductor when passing alternating current can be easily dissipated to the outside of the second cavity through the opening, which facilitates heat dissipation of the inductor.

[0032] In some feasible ways, at least one of the first and second surfaces is provided with a shielding layer.

[0033] In this example, the shielding layer is located between the inductor and the circuit board. The shielding layer can effectively block the electromagnetic radiation generated by the inductor when it carries AC power, and block the alternating magnetic field generated by the inductor when it carries AC power as much as possible on the side where the inductor is located on the first side of the carrier. That is, the shielding layer further reduces the electromagnetic interference of the alternating magnetic field generated by the inductor when it carries AC power to other electrical components in the power conversion device. For example, it reduces the impact of the alternating magnetic field on the circuit board, thereby reducing the eddy current loss caused by the copper foil of the circuit board.

[0034] Furthermore, compared to forming a potting layer around the inductor surface, in this example, the inductor surface is exposed to the air, making it easier to dissipate heat generated when current flows through the inductor. During inductor assembly, unlike potting layers which require filling the second receiving cavity with liquid adhesive after the inductor is assembled and waiting for it to solidify, the shielding layer can be pre-processed on the first and / or second surfaces. During assembly, only the carrier needs to be fixed to the housing, facilitating the assembly of the power conversion device.

[0035] In some possible implementations, the circuit board is positioned on the side of the first and second conductive bus away from the second surface.

[0036] In this example, the circuit board is positioned on the side of the first and second conductive bars that is away from the second surface, and the circuit board and the first conductive bar are closer together. Similarly, the circuit board and the first conductive bar are closer together, which facilitates the circuit board contacting the first conductive bar and the second conductive bar.

[0037] In some possible implementations, the power conversion device also includes a support frame comprising two opposing supports and a partition connecting the opposing surfaces of the two supports, the supports being disposed on the side of the carrier facing away from the first conductive busbar; a plurality of inductors are connected between the opposing surfaces of the two supports and distributed on opposite sides of the partition.

[0038] In this example, the inductor is connected between the opposing surfaces of two supports to fix the inductor to the two supports, and multiple inductors are distributed on opposite sides of the separator. The separator can block the intensity of the alternating magnetic field generated by the inductor when passing alternating current, reducing the mutual influence between multiple inductors. In this way, multiple inductors are integrated on a single bracket, reducing the space occupied by multiple inductors, making the power conversion device more compact and smaller in size. Attached Figure Description

[0039] Figure 1 A schematic diagram of a power conversion device, taking an inverter as an example, is provided for an embodiment of this application;

[0040] Figure 2 A single-phase full-bridge inverter circuit diagram provided for an embodiment of this application;

[0041] Figure 3 This is a schematic diagram of the structure of a photovoltaic system provided in an embodiment of this application;

[0042] Figure 4 for Figure 1 An exploded schematic diagram of the power conversion device shown;

[0043] Figure 5 This is a schematic diagram of a structure provided in an embodiment of this application after connecting the carrier, the first conductive bus, the second conductive bus, and the inductor.

[0044] Figure 6 This is a schematic diagram of the structure after the bracket and inductor are connected, as provided in an embodiment of this application;

[0045] Figure 7 This is a schematic diagram of another structure after the carrier, the first conductive bus, the second conductive bus, and the inductor are connected, as provided in the embodiments of this application.

[0046] Reference numerals: 100, power conversion device; 200, energy storage device; 300, photovoltaic module; 400, load; 500, power grid;

[0047] 10. Housing; 11. First receiving cavity; 12. Second receiving cavity; 13. Boss; 131. Connecting hole;

[0048] 20. Circuit board;

[0049] 30. Bearing component; 31. Flanged edge; 32. Reinforcing grille; 33. Second through hole; 34a. First support base; 34b. Second support base; 35. Clamping component; 36. First through hole; 37. Opening;

[0050] 40. First conductive bar; 41. Clearance hole; 42. Card interface;

[0051] 50. Second conductive busbar;

[0052] 60. Inductor; 61. First terminal; 611. First latch; 62. Second terminal; 621. Second latch;

[0053] 70. Busbar;

[0054] 80. Bracket; 81. Support component; 82. Divider component. Detailed Implementation

[0055] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0056] The terms "first," "second," and similar terms used in this article do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, "one" or similar terms do not indicate a quantity limitation, but rather indicate the existence of at least one.

[0057] In the embodiments of this application, the terms "exemplarily" or "for example" are used to indicate examples, illustrations, or descriptions. Any embodiment or design described as "exemplarily" or "for example" in the embodiments of this application should not be construed as being more preferred or advantageous than other embodiments or design solutions. Specifically, the use of terms such as "exemplarily" or "for example" is intended to present the relevant concepts in a specific manner. In the description of the embodiments of this application, unless otherwise stated, "a plurality of" means two or more.

[0058] First, let me explain the technical terms used in this application:

[0059] Eddy current loss refers to the phenomenon where a conductor generates a circular current (eddy current) due to electromagnetic induction in an alternating magnetic field, resulting in the conversion of electrical energy into heat energy. Conductive components such as copper foil and metal supports in circuit boards may experience eddy current loss due to changes in the magnetic field during high-frequency signal transmission.

[0060] Alternating current (AC) refers to a current whose magnitude and direction change periodically with time; alternating magnetic field refers to a magnetic field whose magnitude and direction change with time. An alternating magnetic field is a magnetic field generated when alternating current is transmitted through a conductor. When the current is alternating current, the magnetic field generated will also change accordingly.

[0061] Inductive filtering utilizes impedance characteristics to impede the flow of high-frequency current, while allowing low-frequency or DC components to impede current surges through the inductor's self-inductance, thus suppressing high-frequency current.

[0062] Inductors are inevitably present in power conversion devices. Inductors mainly play key roles in power conversion devices such as filtering, voltage regulation, energy storage, and energy transmission, ensuring that the power conversion device can efficiently and stably convert DC to AC; or, perform voltage conversion on AC.

[0063] In related technologies, inductors are typically soldered to circuit boards. When the inductor is heavy, it can easily cause the circuit board to deform. This deformation can damage sensitive components on the circuit board, such as ceramic capacitors and diodes. Furthermore, vibrations during circuit board production and transportation can lead to cracking of the solder joints between the circuit board and electrical components.

[0064] Figure 1 This is a schematic diagram of the structure of a power conversion device 100, taking an inverter as an example, provided in an embodiment of this application. It should be noted that... Figure 1 The power conversion device 100 in this embodiment is only a schematic structure and does not represent the actual structure of a product. The power conversion device 100 in this application embodiment can be applied in fields such as site energy, residential energy storage, industrial and commercial energy storage, large-scale ground power station energy storage, or vehicle charging; the power conversion device 100 can be an uninterruptible power supply, an energy storage converter, or an on-board charger, etc. The power conversion device 100 is used to convert AC power transmitted through the power conversion device 100 into DC power; or, to transform the AC power passing through the power conversion device 100.

[0065] Figure 2 A single-phase full-bridge inverter circuit diagram is provided for an embodiment of this application, which is described below in conjunction with... Figure 2 Explain the function of inductors in circuits. Figure 2 The single-phase full-bridge inverter circuit diagram shown includes two parallel bridge arms. The voltage of the power supply is applied to the two power transistors in each bridge arm. The two power transistors in each bridge arm switch alternately to convert DC to AC. After the AC is input to the inductor, the inductor filters the high-frequency current, and the remaining stable current is finally output from the inductor.

[0066] It is understood that, in order to convert AC to DC, the power conversion device 100 includes a DC / AC conversion circuit; or, in order to transform AC, the power conversion device 100 includes an AC / AC conversion circuit. Depending on the application scenario, the power conversion device 100 includes different power conversion circuits. For example, if the power conversion device 100 is used to convert DC to single-phase AC, then the DC / AC conversion circuit could be as follows: Figure 2A single-phase full-bridge inverter circuit; a power conversion device 100 used to convert DC power to two-phase AC power, then the DC / AC conversion circuit can be a two-phase full-bridge inverter circuit; a power conversion device 100 used to convert DC power to three-phase AC power, then the DC / AC conversion circuit can be a three-phase full-bridge inverter circuit; a power conversion device 100 used to boost AC power, then the AC / AC conversion circuit can be a boost converter circuit, etc. Among them, a two-phase full-bridge inverter circuit converts two... Figure 2 The single-phase full-bridge inverter circuit shown is connected in parallel to a power supply, while the three-phase full-bridge inverter circuit connects three phases in parallel to a power supply. Figure 2 The single-phase full-bridge inverter circuit shown is connected in parallel to a power supply, and no further illustration is provided in this application.

[0067] Figure 3 This is a schematic diagram of a photovoltaic system provided in an embodiment of this application. The following is in conjunction with... Figure 3 The function of the power conversion device 100 when applied to a photovoltaic system according to the embodiments of this application will be described.

[0068] like Figure 3 The photovoltaic system shown includes an energy storage device 200, a power conversion device 100, a photovoltaic module 300, a load 400, and a power grid 500. When the energy storage device 200 outputs electrical energy, the power conversion device 100 converts the direct current (DC) output from the energy storage device 200 into alternating current (AC) and supplies it to the load 400 and / or the power grid 500; when the photovoltaic module 300 outputs electrical energy, the power conversion device 100 converts the DC output from the photovoltaic module 300 into AC and supplies it to the load 400 and / or the power grid 500; when the power grid 500 outputs electrical energy, the power conversion device 100 transforms the AC power from the power grid 500 and supplies it to the load 400.

[0069] Figure 4 for Figure 1 An exploded view of the power conversion device 100 shown; Figure 5 This is a schematic diagram of the structure after the carrier 30, the first conductive busbar 40, the second conductive busbar 50, and the inductor 60 are connected, as provided in an embodiment of this application. The following is in conjunction with... Figure 4 and Figure 5 The components within the power conversion device 100 are described.

[0070] To address the issue that soldering inductor 60 to circuit board 20 can easily lead to the failure of sensitive components on circuit board 20, such as... Figure 4 and Figure 5The power conversion device 100 shown includes a housing 10 and a circuit board 20, a carrier 30, a first conductive bus 40, a second conductive bus 50, and an inductor 60, all disposed within the housing 10. The first conductive bus 40, the second conductive bus 50, and the inductor 60 are all mounted on the carrier 30. The inductor 60 has a first end 61 and a second end 62. The first end 61 is used to connect to the first conductive bus 40, and the second end 62 is used to connect to the second conductive bus 50. Both the first conductive bus 40 and the second conductive bus 50 are used to connect to the circuit board 20. The carrier 30 is fixed to the housing 10.

[0071] In the power conversion device 100 of this application embodiment, the inductor 60 is mounted on the support member 30, and the support member 30 is mounted on the housing 10. Therefore, part of the weight of the inductor 60 and part of the external force acting on the inductor 60 are transmitted to the housing 10 through the support member 30. Compared to related technologies where the inductor 60 is directly soldered to the circuit board 20, the weight and external force acting on the inductor 60 are applied to the circuit board 20, resulting in the circuit board 20 needing to withstand greater external stress. Especially during the production and transportation of the power conversion device 100, the inductor 60 will also be subject to vibration, further increasing the stress on the circuit board 20. External stress: In the power conversion device 100 of this application embodiment, part of the gravity of the inductor 60 or part of the external force it receives is applied to the housing 10, which has better structural strength, through the bearing member 30. This reduces the external force from the inductor 60 on the circuit board 20, naturally reducing the deformation of the circuit board 20 caused by the external force from the inductor 60. This reduces the risk of damage to sensitive components mounted on the circuit board 20 due to the deformation of the circuit board 20; or reduces the degree of damage to sensitive components when damage occurs. The power conversion device 100 of this application has higher reliability.

[0072] The housing 10 is used to accommodate the circuit board 20, the carrier 30, the first conductive bus 40, the second conductive bus 50, and the inductor 60, such as Figure 4 and Figure 5 As shown, in some examples, the housing 10 includes an integrally formed first housing portion and a second housing portion. The first housing portion has a first receiving cavity 11, and the second housing portion has a second receiving cavity 12. The first receiving cavity 11 and the second receiving cavity 12 are in communication. The circuit board 20, the carrier 30, the first conductive bus 40, and the second conductive bus 50 are all disposed in the first receiving cavity 11, and the inductor 60 is disposed in the second receiving cavity 12, so that the housing 10 can accommodate the circuit board 20, the carrier 30, the first conductive bus 40, the second conductive bus 50, and the inductor 60.

[0073] In this embodiment, the first housing portion can be considered as the housing 10 of the power conversion device 100 in the related art, and the second housing portion can be considered as the housing of the inductor 60 in the related art. In this embodiment, the housing of the power conversion device 100 and the housing of the inductor 60 in the related art are integrally set, without a separate housing of the inductor 60. This realizes the integrated design of the housing of the power conversion device 100 and the housing of the inductor 60. When assembling the power conversion device 100, it is not necessary to assemble the housing of the power conversion device 100 and the housing of the inductor 60. Naturally, there is no need to set a seal between the housing of the power conversion device 100 and the housing of the inductor 60, which facilitates the assembly of the power conversion device 100 and reduces the material cost of the power conversion device 100.

[0074] It is understood that a power conversion device 100 may include multiple inductor modules consisting of a carrier 30, a first conductive bus 40, a second conductive bus 50, and an inductor 60. At the same time, a circuit board 20 may be provided in the power conversion device 100 to correspond to multiple inductor modules; or multiple circuit boards 20 may be provided in the power conversion device 100 to correspond to one or more inductor modules. The carrier 30, the first conductive bus 40, the second conductive bus 50, and the inductor 60 are assembled to form an inductor module and then assembled into the housing 10.

[0075] To ensure that the force exerted by the inductor 60 on the carrier 30 is promptly transmitted to the housing 10, in some examples, the carrier 30 is positioned in contact with the housing 10. In this way, the carrier 30 directly contacts the housing 10, and the force exerted by the inductor 60 on the carrier 30 is directly transmitted to the housing 10. It is understood that in other examples, a structure for force transmission or buffering, such as a gasket, may also be provided between the first surface and the housing 10.

[0076] To fix the circuit board 20 to the housing 10, in some examples, the carrier 30 is provided with a first through hole 33 penetrating the first and second surfaces; the inner side of the housing 10 is provided with a plurality of protrusions 13 facing the carrier 30, and each protrusion 13 is provided in close contact with the inner sidewall of the housing 10. Each protrusion 13 is provided with a connecting hole 131 on the side facing the carrier 30, and the side of the protrusion 13 facing the carrier 30 contacts the first surface; the power conversion device 100 also includes a connector that passes through the first through hole 33 and the connecting hole 131.

[0077] In some examples, the connector is a screw, and the connecting hole 131 is a threaded hole, such as... Figure 4As shown, the carrier 30 is fixed to the housing 10 by screws. After passing through the carrier 30, the screws are threaded to the boss 13, realizing a detachable connection between the carrier 30 and the housing 10, which facilitates the user to inspect and replace the circuit board 20 and the inductor module. Of course, in this embodiment, the carrier 30 and the circuit board 20 can be fixed to the housing 10 by other means, such as bonding, snap-fitting, etc.

[0078] The housing 10 includes a first receiving cavity 11 and a second receiving cavity 12. The boss 13 and the inductor 60 are both located on the first surface of the support member 30. To prevent the boss 13 and the inductor 60 from interfering with each other, in some examples, the bottom wall of the second receiving cavity 12 is provided with a boss 13 facing the support member 30, and the boss 13 is close to the side wall of the second receiving cavity 12. Multiple first through holes 33 are distributed along the edge of the support member 30. At this time, the multiple bosses 13 are located at the edge of the second receiving cavity 12, occupying a small space in the second receiving cavity 12, so as to facilitate the placement of the inductor 60 in the second receiving cavity 12.

[0079] To improve the heat dissipation of the power conversion device 100, such as Figure 4 As shown, in some examples, multiple heat dissipation fins are provided on the outer surface of the housing 10. The multiple heat dissipation fins at least cover the inductor 60. The heat dissipation fins can increase the contact area between the power conversion device 100 and the air, thereby improving the heat dissipation efficiency of the power conversion device 100.

[0080] The circuit board 20 is used to convert direct current to alternating current; or, the circuit board 20 is used to perform voltage conversion on alternating current. In conjunction with the power conversion device 100 including a power conversion circuit, it can be understood that the circuit board 20 is provided with the power conversion circuit to enable the power conversion device 100 to convert direct current to alternating current; or, the power conversion device 100 is used to perform voltage conversion on alternating current.

[0081] The support member 30 is used to support the first conductive bus 40, the second conductive bus 50, and the inductor 60, such as Figure 5 As shown, in some examples, the first conductive bus 40, the second conductive bus 50, and the inductor 60 all contact the carrier 30, thereby enabling the carrier 30 to support the first conductive bus 40, the second conductive bus 50, and the inductor 60.

[0082] In this embodiment, the shape, size, and material of the support member 30 are not limited, as long as the support member 30 can support the first conductive bus 40, the second conductive bus 50, and the inductor 60. Regarding the material of the support member 30, in this embodiment, the support member 30 is made of insulating material. Regarding the shape of the support member 30, such as… Figure 5 As shown, in some examples, the carrier 30 can be configured as a carrier plate.

[0083] To reduce eddy current losses on circuit board 20, such as Figure 4 As shown, in some examples, the carrier 30 has a first side and a second side facing away from each other. The inductor 60 is disposed on the first side of the carrier 30, and the circuit board 20 is disposed on the second side of the carrier 30. That is, the carrier 30 is located between the circuit board 20 and the inductor 60. In this case, there is a large distance between the circuit board 20 and the inductor 60. Since the alternating magnetic field generated by the inductor 60 when transmitting AC power has a lower intensity as it is farther away from the inductor 60, the interference caused by the alternating magnetic field generated by the inductor 60 when transmitting AC power to the circuit board 20 is reduced. That is, the eddy current loss of the copper foil of the circuit board 20 caused by the alternating magnetic field is reduced. Moreover, the alternating magnetic field generated by the inductor 60 when transmitting AC power is blocked by the carrier 30, which further reduces the eddy current loss of the copper foil of the circuit board 20 caused by the alternating magnetic field.

[0084] To further improve the effect of the carrier 30 in reducing eddy currents in the circuit board 20, in some examples, at least one of the first and second surfaces is provided with a shielding layer, such as a high-permeability alloy layer, a conductive polymer composite material, a flexible tin-based material, or nano-carbon powder. It should be noted that the shielding layer must not come into contact with the first conductive bus 40 or the second conductive bus 50 to prevent cross-current.

[0085] Since the inductor 60 and the circuit board 20 are located on opposite sides of the carrier 30, the inductor 60 and the circuit board 20 are located on opposite sides of the shielding layer. That is, the shielding layer is located between the inductor 60 and the circuit board 20. The shielding layer can effectively block the electromagnetic radiation generated by the inductor 60 when it carries AC power, and block the alternating magnetic field generated by the inductor 60 when it carries AC power to the side of the carrier 30 where the inductor 60 is located as much as possible. That is, the shielding layer further reduces the electromagnetic interference of the alternating magnetic field generated by the inductor 60 when it carries AC power to other electrical components in the power conversion device 100. For example, it reduces the influence of the alternating magnetic field on the circuit board 20, thereby reducing the eddy current loss caused by the copper foil of the circuit board 20.

[0086] To facilitate the connection between the circuit board 20 and the first conductive bar 40 and the second conductive bar 50, in some examples, the first conductive bar 40 and the second conductive bar 50 are disposed on the second side of the carrier 30, and the circuit board 20 is located on the side of the first conductive bar 40 and the second conductive bar 50 away from the carrier 30. In this way, the circuit board 20, the first conductive bar 40 and the second conductive bar are all located on the same side of the circuit board 20, which facilitates the connection between the circuit board 20 and the first conductive bar 40 and the second conductive bar 50, and thus facilitates the assembly of the power conversion device 100.

[0087] Given that the circuit board 20 and inductor 60 are located on opposite sides of the carrier 30, and both the first conductive bus 40 and the second conductive bus 50 are used to connect the circuit board 20, to achieve the electrical connection between the first end 61 of inductor 60 and the first conductive bus 40, and the electrical connection between the second end 62 of inductor 60 and the second conductive bus 50, as follows: Figure 5 As shown, in some examples, the first end 61 of the inductor 60 passes through the carrier 30 and is connected to the first conductive bus 40, and the second end 62 of the inductor 60 passes through the carrier 30 and is connected to the second conductive bus 50.

[0088] To achieve the above-mentioned arrangement where the first end 61 of the inductor 60 passes through the carrier 30 and connects to the first conductive bus 40, and the second end 62 of the inductor 60 passes through the carrier 30 and connects to the second conductive bus 50, as follows: Figure 5 As shown, in some examples, the carrier 30 is provided with a plurality of second through holes 33. One end of the inductor 60 passes through a second through hole 33 and is connected to the first conductive bus 40. The other end of the inductor 60 also passes through a second through hole 33 and is connected to the second conductive bus 50, which facilitates the connection between the first end 61 of the inductor 60 and the first conductive bus 40, as well as the connection between the second segment of the inductor 60 and the second conductive bus 50.

[0089] To improve the structural strength of the support member 30, in some examples, the first and / or second surfaces of the support member 30 are provided with flanges 31 and reinforcing grids 32; wherein, the flanges 31 extend along the edge of the support member 30, the flanges 31 surround the periphery of the reinforcing grids 32, and the reinforcing grids 32 are connected to the inner wall of the flanges 31. Both the flanges 31 and the reinforcing grids 32 enhance the structural strength of the support member 30, enabling the support member 30 to withstand greater external forces. Figure 5 As shown, the second side of the support member 30 is provided with a flange 31 and a reinforcing grille 32.

[0090] In some examples, the support member 30 has a shielding layer on the first and / or second surfaces, and a flange 31 and a reinforcing grille 32 on the second surface.

[0091] Inductor 60 is used to filter the alternating current transmitted through it. The alternating current is transmitted into inductor 60 from its first terminal 61 and output to the outside of inductor 60 from its second terminal 62. To improve the filtering effect of inductor 60, in some examples, inductor 60 includes a magnetic core and a winding. The winding is nested within the magnetic core. The core's core function is to enhance the magnetic flux density of the inductor 60 coil using a high-permeability material, thereby significantly increasing the inductance value, reducing leakage flux, and improving energy transmission efficiency. Under the same magnetic flux density, inductor 60 can have a smaller size. The magnetic core enhances the filtering effect of inductor 60. Given that inductor 60 has a first terminal 61 and a second terminal 62, it can be understood that the winding also has a first terminal 61 and a second terminal 62.

[0092] In this embodiment, the number of inductors 60 is not limited. The number of inductors 60 varies depending on the power conversion circuit. For example, when the power conversion circuit is a half-bridge inverter circuit, only one inductor 60 is needed; when the power conversion circuit is a single-phase full-bridge inverter circuit, two inductors 60 are needed; when the power conversion circuit is a two-phase full-bridge inverter circuit, four inductors 60 are needed; and when the power conversion circuit is a three-phase full-bridge inverter circuit, six inductors 60 are needed. The specific number of inductors 60 can be set according to the different power conversion circuits used.

[0093] Figure 6 This is a schematic diagram illustrating the structure of a bracket 80 and an inductor 60 connected according to an embodiment of this application. When there are multiple inductors 60, to reduce the space occupied by the multiple inductors 60, such as... Figure 6 As shown, in some examples, the power conversion device 100 further includes a support 80, which includes two opposing support members 81 and a separator 82 connecting the opposing surfaces of the two support members 81. The support members 81 are disposed on the side of the carrier 30 facing away from the first conductive bus 40. A plurality of inductors 60 are connected between the opposing surfaces of the two support members 81, and the plurality of inductors 60 are distributed on opposite sides of the separator 82. Considering that the inductors 60 include a magnetic core and windings, it can be understood that the magnetic core is connected to the two support members 81.

[0094] The inductor 60 is connected between the opposing surfaces of the two supports 81 to fix the inductor 60 to the two supports 81. The multiple inductors 60 are distributed on opposite sides of the separator 82. The separator 82 can block the intensity of the alternating magnetic field generated by the inductor 60 when passing alternating current, reducing the mutual influence between the multiple inductors 60. In this way, the multiple inductors 60 are integrated on a bracket 80, reducing the space occupied by the multiple inductors 60. Therefore, the power conversion device 100 has a more compact structure and smaller size.

[0095] Since each phase of a single-phase, two-phase, and three-phase full-bridge inverter circuit has two inductors of 60, therefore, as Figure 6 As shown, in some examples, two inductors 60 are connected between the opposing surfaces of the two supports 81, with the two inductors 60 located on both sides of the separator 82. This integrates the two inductors 60 together to accommodate the power conversion device 100 when it includes a single-phase full-bridge inverter circuit, a two-phase full-bridge inverter circuit, or a three-phase full-bridge inverter circuit.

[0096] In some examples, inductor 60 does not have a support 80, and the two windings share a toroidal core to form a common-mode inductor. A separator is placed between the two windings to reduce electromagnetic interference between the two inductors 60. The structure can still be referred to. Figure 6 As shown, however, should be Figure 6 The two support members 81 in the middle serve as the magnetic core.

[0097] To further reduce the risk of the inductor 60 causing deformation of the circuit board 20, in some examples, the power conversion device 100 also includes a filler layer that fills the gap between the outer surface of the inductor 60 and the cavity wall of the second receiving cavity 12.

[0098] The filling layer fills the gap between the outer surface of the inductor 60 and the cavity wall of the receiving cavity. Part of the weight of the inductor 60 and part of the external force on the inductor 60 will be transferred to the housing 10 through the filling layer. At this time, the weight of the inductor 60 and the external force on the inductor 60 are transferred to the housing 10 by the bearing member 30 and the filling layer, which further reduces the risk of the inductor 60 causing damage to the circuit board 20.

[0099] The potting layer forms a protective layer that isolates the inductor 60 from the external environment. This means that the potted inductor 60 has higher protection performance. The filling layer can more effectively prevent the intrusion of dust, moisture and other contaminants, thereby improving the reliability and service life of the inductor 60. The potted inductor 60 may also have more stable electrical performance. Furthermore, the potting layer can fix the inductor 60, preventing it from loosening due to vibration or impact, thus improving the reliability and stability of the inductor 60.

[0100] Inductor 60 generates heat when carrying alternating current. To reduce the temperature of inductor 60, in some examples, the potting layer can be epoxy resin, silicone rubber, or polyurethane. Epoxy resin has high thermal conductivity and insulation, while silicone rubber or polyurethane has thermal conductivity and shock absorption functions. All three materials can have their thermal conductivity improved by adding thermally conductive fillers such as alumina and boron nitride, while ensuring electrical insulation and waterproof performance.

[0101] When there are multiple inductors 60, there are multiple second receiving cavities 12. The support 80 and the inductors 60 disposed on the support 80 are both disposed in the second receiving cavities 12. In some examples, the multiple second receiving cavities 12 are interconnected. It can be understood that the filling layer is formed by liquid filler being poured into the cavity wall of the second receiving cavity 12 and the outer surface of the inductor 60 and then solidifying. After the multiple second receiving cavities 12 are interconnected, the liquid filler can flow from one second receiving cavity 12 to another second receiving cavity 12, so that the liquid filler can fill the multiple second receiving cavities 12.

[0102] When the inductor 60 is assembled into the housing 10, in order to facilitate the formation of the filling layer, in some examples, the carrier 30 is provided with an opening 37 that penetrates the first and second surfaces and the opening 37 communicates with the second receiving cavity 12.

[0103] During the assembly of the inductor 60, the opening 37 allows liquid filling material to enter the second receiving cavity 12. After the liquid material solidifies to form a filling layer, the second receiving cavity 12 is connected to the first receiving cavity 11 through the opening 37. The heat generated by the inductor 60 when passing AC current can be easily dissipated to the outside of the second receiving cavity 12 through the opening 37. In other words, the opening 37 facilitates the heat dissipation of the inductor 60.

[0104] like Figure 5 As shown, in some examples, the second through-hole 33 can be used as an opening 37, in which case the carrier 30 can more effectively reduce the eddy currents generated by the circuit board 20. It is understood that the carrier 30 can also be provided with an opening 37 alone, in which case it is more conducive to heat dissipation of the inductor 60.

[0105] The first conductive bus 40 and the second conductive bus 50 are used to realize the electrical connection between the inductor 60 and the circuit board 20. In this embodiment, the shape, size, and material of the first conductive bus 40 and the second conductive bus 50 are not limited, as long as the first conductive bus 40 and the second conductive bus 50 realize the electrical connection between the inductor 60 and the circuit board 20. It can be understood that the first conductive bus 40 and the second conductive bus 50 are both connected to the power conversion circuit on the circuit board 20, so as to connect the inductor 60 connected to the first conductive bus 40 and the second conductive bus 50 to the power conversion circuit.

[0106] like Figure 5 As shown, in some examples, the first conductive bus 40 and the second conductive bus 50 both include a first segment, a second segment and a third segment connected in sequence. The first segment and the third segment are both arranged parallel to the carrier 30 on one side of the first conductive bus 40, and the second segment extends away from the inductor 60. In this case, both the first conductive bus 40 and the second conductive bus 50 are "Z" shaped.

[0107] In this embodiment, the connection between the second conductive bus 50 and the inductor 60 can be divided into two types: direct connection and indirect connection. Depending on the connection method, the number of inductors 60 connected to each second conductive bus 50 varies. Please refer to the following two possible implementation methods for details:

[0108] like Figure 5 As shown, in the first possible implementation, the first end 61 of each inductor 60 is connected to a first conductive bus 40, and the second end 62 of each inductor 60 is connected to a second conductive bus 50. In this implementation, the number of first conductive bus 40, second conductive bus 50 and inductor 60 are equal, and the first conductive bus 40, second conductive bus 50 and inductor 60 are connected in a one-to-one correspondence.

[0109] When there is one inductor 60, there is one first conductive bus 40 and one second conductive bus 50. In this case, the power conversion circuit can be a single-phase half-bridge inverter circuit.

[0110] When there are multiple inductors 60, the number of first conductive busbars 40, the number of second conductive busbars 50, and the number of inductors 60 are all multiple and equal. The multiple inductors 60, the multiple first conductive busbars 40, and the multiple second conductive busbars 50 are arranged in sequence at intervals, and the arrangement directions of the multiple inductors 60, the multiple first conductive busbars 40, and the multiple second conductive busbars 50 are parallel to each other.

[0111] In some examples, there are multiple second conductive bars 50, which are spaced apart perpendicular to the arrangement direction of multiple inductors 60. These multiple second conductive bars 50 can output multi-phase AC power. In this case, a carrier 30 is provided with multiple inductors 60, multiple first conductive bars 40, and multiple second conductive bars 50, resulting in a high degree of integration of the carrier 30, first conductive bars 40, second conductive bars 50, and inductors 60. Furthermore, the multiple second conductive bars 50 are spaced apart perpendicular to the arrangement direction of multiple inductors 60. In this case, the arrangement directions of the multiple first conductive bars 40 and the multiple second conductive bars 50 are mutually perpendicular, allowing the carrier 30, first conductive bars 40, second conductive bars 50, and inductors 60 to be applicable to circuit boards 20 with different wiring methods.

[0112] To achieve support of the first conductive busbar 40 and the second conductive busbar 50 by the carrier 30, such as Figure 5As shown, in some examples, the power conversion device 100 further includes a first support 34a and a second support 34b, both of which extend from the second surface in a direction away from the plurality of inductors 60; a first conductive bus 40 is disposed on the side of the first support 34a away from the second surface, and a second conductive bus 50 is disposed on the side of the second support 34b away from the second surface. The first support 34a and the second support 34b support the first conductive bus 40 and the second conductive bus 50 respectively. Since the first conductive bus 40 and the second conductive bus 50 are both connected to the circuit board 20, and a small portion of the external force on the inductor 60 will inevitably be transmitted to the circuit board 20 through the first conductive bus 40 and the second conductive bus 50, the first support 34a and the second support 34b can prevent the first conductive bus 40 and the second conductive bus 50 from deforming when the external force on the inductor 60 is transmitted to the first conductive bus 40 and the second conductive bus 50.

[0113] The first conductive busbar 40 and the second conductive busbar 50 both include a first segment, a second segment, and a third segment connected in sequence. The first segment of the first conductive busbar 40 is located on the side of the first support base 34a away from the carrier member 30, the third segment of the first conductive busbar 40 is located on the second side of the carrier member 30, and the second segment extends along the surface of the first support base 34a. The positional relationship between the second conductive busbar 50 and the second support base 34b is similar, and can be referenced to the positional relationship between the first conductive busbar 40 and the first support base 34a.

[0114] To achieve the connection between the first conductive bus 40 and the circuit board 20, and the connection between the second conductive bus 50 and the circuit board 20, as follows: Figure 5 As shown, in some examples, the first section of the first conductive bus 40 and the second conductive bus 50 are provided with clearance holes 41, and each first support 34a and each second support 34b are provided with threaded holes. When the circuit board 20 is connected to the first conductive bus 40 or the second conductive bus 50, the bolt passes through the clearance holes 41 on the circuit board 20, the first conductive bus 40 or the second conductive bus 50 and is threaded to the wall of the threaded hole to realize the connection between the first conductive bus 40 and the circuit board 20, or to realize the connection between the second conductive bus 50 and the circuit board 20.

[0115] In other examples, the first section of the first conductive busbar 40 and the second conductive busbar 50 are provided with clearance holes 41, and each support is provided with a nut. When the circuit board 20 is connected to the first conductive busbar 40 or the second conductive busbar 50, the bolt passes through the clearance holes 41 on the circuit board 20, the first conductive busbar 40 or the second conductive busbar 50 and is threaded to the hole wall of the nut.

[0116] To achieve the connection between the first conductive bus 40 and the first terminal 61 of the inductor 60, such as Figure 5As shown, in some examples, the third segment of the first conductive bus 40 is provided with a card interface 42, and the first end 61 of the inductor 60 branches into two first buckles 611. The two first buckles 611 are arranged parallel to the carrier 30 on one side of the first conductive bus 40, and the two first buckles 611 extend back to back. The first end 61 of the inductor 60 is partially located inside the card interface 42, and the first buckles 611 are located on the side of the third segment of the inductor 60 away from the inductor 60. In this way, the connection between the first conductive bus 40 and the first end 61 of the inductor 60 is realized.

[0117] The connection method of the second conductive bus 50 and the second terminal 62 of the inductor 60 is exactly the same as the connection method of the first conductive bus 40 and the first terminal 61 of the inductor 60. For details, please refer to... Figure 5 The connection between the second opening 37621 and the second conductive bus 50 shown in the diagram will not be described in detail here.

[0118] To strengthen the connection between the first conductive bus 40 and the first end 61 of the inductor 60, and the connection between the second conductive bus 50 and the second end 62 of the inductor 60, in some examples, the connection between the first conductive bus 40 and the first end 61 of the inductor 60 can be further reinforced by welding, and the connection between the second conductive bus 50 and the second end 62 of the inductor 60 can also be further reinforced by welding.

[0119] Figure 7 This is a schematic diagram illustrating another structure of the carrier, first conductive busbar, second conductive busbar, and inductor connected according to an embodiment of this application; as shown. Figure 7 As shown, in the second possible implementation, the first end 61 of each inductor 60 is connected to a first busbar 40; the power conversion device 100 also includes a busbar 70, which is disposed on the second side, with one end of the busbar 70 connected to the second end 62 of at least one inductor 60 and the other end of the busbar 70 connected to a second busbar 50.

[0120] When a busbar 70 is connected to the second end 62 of an inductor 60 at one end and to a second conductive busbar 50 at the other end, the busbar 70 can connect the second conductive busbar 50 and the second end 62 of the inductor 60 at any position on the second side. That is, the position of the second conductive busbar 50 on the carrier 30 is not limited by the position of the second end 62 of the inductor 60. In this way, the circuit board 20 is not affected by the position of the second conductive busbar 50 when wiring the circuit. Therefore, when wiring the circuit board 20, the positions of the other electrical components connected to the circuit board 20 in the power conversion device 100 can be considered, and the electrical components in the power conversion device 100 can be laid out more reasonably.

[0121] When multiple inductors 60 are connected to their second terminals 62 via a busbar 70, the second terminals 62 of the multiple inductors 60 are connected in parallel via the busbar 70. The AC power output from the multiple inductors 60 is then collected at the busbar 70 and transmitted to a second busbar 50. It can be seen that the AC power is collected through the structure of the power conversion device 100 without having to be collected through the circuit on the circuit board 20, which reduces the manufacturing difficulty of the circuit board 20 and reduces its size.

[0122] It is understandable that when a bus 70 connects to the second terminals 62 of multiple inductors 60, this implementation is only applicable when there are multiple inductors 60. In this implementation, alternating current enters the inductor 60 through the first terminal 61 of each inductor 60. The alternating current is filtered by the inductor 60 as it flows through it and then exits from the second terminal 62 of the inductor 60. One end of the bus 70 is connected to the second terminals 62 of multiple inductors 60, and the other end of the bus 70 is connected to a second bus 50, i.e., multiple... The second terminals 62 of each inductor 60 are connected in parallel through busbar 70. The AC current output from multiple inductors 60 is collected at busbar 70 and then transmitted to a second conductive busbar 50. This reduces the number of second conductive busbars 50, and naturally reduces the number of connection points between the second conductive busbars 50 and the circuit board 20. Since electrical components have contact resistance at connection points, the fewer connection points between electrical components, the lower the resistance of the line. Therefore, the fewer connection points between the second conductive busbars 50 and the circuit board 20, the stronger the current carrying capacity of the circuit board 20.

[0123] In this implementation method, the carrier 30 is also provided with a first support seat 34a and a second support seat 34b to support the first conductive busbar 40 and the second conductive busbar 50 respectively, which will not be described in detail here.

[0124] It can be understood that when the power conversion device 100 includes a bus 70, the first end 61 of the inductor 60 is connected to the first bus, the second end 62 of the inductor 60 is connected to the bus 70, and the bus 70 is connected to the third segment of the second conductive bus 50. In this possible implementation, the carrier 30 is also provided with multiple second through holes 33. The first end 61 of one inductor 60 passes through one second through hole 33 and is connected to the first conductive bus 40. The second ends 62 of two inductors 60 pass through a second through hole 33 together and are connected to the same bus 70; or, the second ends 62 of two inductors 60 pass through two second through holes 33 respectively and are connected to one bus 70.

[0125] In this possible implementation, the connection between the first end 61 of the inductor 60 and the first conductive bus 40 is exactly the same as that in the first possible implementation, and will not be described again here.

[0126] To achieve the connection between the bus 70 and the second end 62 of the inductor 60, in some examples, the second end 62 of the inductor 60 branches into two first latches 611. Both first latches 611 extend away from the inductor 60 and are clamped on both sides of the bus 70 to achieve the connection between the bus 70 and the second end 62 of the inductor 60.

[0127] To achieve the connection between the busbar 70 and the third segment of the second conductive busbar 50, in some examples, the third segment of the second conductive busbar 50 is provided with a card interface 42. The connection method between the busbar 70 and the second conductive busbar 50 is the same as the connection method between the second end 62 of the inductor 60 and the third segment of the second conductive busbar 50, that is, the end of the busbar 70 away from the inductor 60 branches into two first buckles 611, and the first buckles 611 are parallel to the support member 30 and are disposed on one side of the first conductive busbar 40.

[0128] The arrangement of the busbars 70 varies depending on the number of the second conductive busbars 50. The following describes the arrangement of one or more busbars 70 when the number of the second conductive busbars 50 is different:

[0129] When there is one second busbar 50, the busbar 70 includes a first busbar (i.e., there is one busbar 70), and the first busbar extends along the arrangement direction of the plurality of inductors 60.

[0130] When there are two second conductive busbars 50, the busbar 70 includes a first busbar and a second busbar (i.e., there are two busbars 70). The first busbar extends along the arrangement direction of the plurality of inductors 60. The second busbar includes a first segment, a second segment, and a third segment connected in sequence. The first segment and the third segment both extend along the arrangement direction of the plurality of inductors 60, and the first segment and the third segment are arranged perpendicular to the arrangement direction of the plurality of inductors 60, so that the two ends of the busbar 70 are staggered perpendicular to the plurality of inductors 60 to accommodate the arrangement of the plurality of second conductive busbars 50 at intervals perpendicular to the arrangement direction of the plurality of inductors 60.

[0131] When there are three second busbars 50, the busbar 70 includes a first busbar, a second busbar, and a third busbar (i.e., there are three busbars 70). The first busbar extends along the arrangement direction of the plurality of inductors 60. The second busbar and the third busbar each include a first segment, a second segment, and a third segment connected in sequence. The first segment and the third segment of the second busbar and the third busbar both extend along the arrangement direction of the plurality of inductors 60. The first segment and the third segment of the second busbar and the third busbar are arranged perpendicular to the arrangement direction of the plurality of inductors 60, so that the two ends of the second busbar and the third busbar are misaligned in the direction perpendicular to the arrangement direction of the plurality of inductors 60. The third segment of the second busbar and the third segment of the third busbar are also misaligned perpendicular to the arrangement direction of the plurality of inductors 60 to prevent the third segment of the second busbar and the third segment of the third busbar from interfering with each other.

[0132] Understandably, bus 70 can also be configured in other shapes.

[0133] When the power conversion circuit is mounted on two circuit boards 20, to achieve the following: the first conductive bus 40 is connected to one circuit board 20, and the second conductive bus 50 is connected to the other circuit board 20, as follows: Figure 7 As shown, in some examples, the circuit board 20 includes a first circuit board and a second circuit board disposed on the second side. The first circuit board is disposed on the side of the first conductive bar 40 away from the second side, and the second circuit board is disposed on the side of the second conductive bar 50 away from the second side. The distance between the first circuit board and the second side is smaller than the distance between the second circuit board and the second side. The first circuit board contacts the first conductive bar 40, and the second circuit board contacts the second conductive bar 50. The distance between the side of the first support 34a facing away from the second side and the second side is smaller than the distance between the side of the second support 34b facing away from the second side and the second side.

[0134] When there are multiple second conductive busbars 50, multiple second support seats 34b can be combined into one to form a larger second support seat 34b, which facilitates the processing of the second support seat 34b.

[0135] like Figure 7 As shown, in some examples, the second support is located at any end of the carrier 30 along the arrangement direction of the plurality of inductors 60.

[0136] The second support 34b is disposed at any end of the carrier 30 along the arrangement direction of the plurality of inductors 60. At this time, the second support 34b is located at the edge of the carrier 30, that is, the second support 34b avoids the main body of the carrier 30 and will not interfere with the arrangement of the first conductive bus 40 on the carrier 30. Since the second conductive bus 50 is disposed on the end face of the second support 34b away from the inductors 60, the second conductive bus 50 on the second support 34b is also located at the edge of the carrier 30. At this time, the first conductive bus 40 is disposed at the main body of the carrier 30, while the second conductive bus 50 is located at the edge of the carrier 30. The dispersed arrangement of the first conductive bus 40 and the second conductive bus 50 reduces the wiring density of the circuit board 20 at the connection of the first conductive bus 40 and the connection of the second conductive bus 50.

[0137] It is understandable that when the second support base 34b is not provided on the carrier 30, the second conductive bus 50 can also be provided at any end of the carrier 30 along the arrangement direction of the plurality of inductors 60. In this case, the first conductive bus 40 is provided at the main body position of the carrier 30, while the second conductive bus 50 is located at the edge position of the carrier 30. The arrangement of the first conductive bus 40 and the second conductive bus 50 is dispersed, which still reduces the wiring density of the circuit board 20 at the connection of the first conductive bus 40 and the connection of the second conductive bus 50.

[0138] With a second support base 34b provided on the carrier 30, and the second conductive bus 50 disposed on the side of the second support base 34b facing away from the plurality of inductors 60, the shape of the bus 70 will naturally change. The following describes the shape of the bus 70 after the second support base 34b is provided on the carrier 30, depending on the number of bus 70:

[0139] When there is only one busbar 70, the busbar 70 includes a first busbar, and the busbar 70 includes a first segment and a second segment connected in sequence. The first segment extends along the arrangement direction of the plurality of inductors 60, and the second segment extends away from the plurality of inductors 60. After the second segment extends away from the plurality of inductors 60, the busbar 70 can be connected to the second conductive busbar 50 disposed at the end of the second support 34b away from the carrier 30.

[0140] When there are two busbars 70, each busbar 70 includes a first busbar and a second busbar. The first busbar includes a first segment and a second segment connected in sequence. The first segment extends along the arrangement direction of the plurality of inductors 60, and the second segment extends away from the plurality of inductors 60. The second busbar includes a first segment, a second segment, a third segment, a fourth segment, a fifth segment, and a sixth segment connected in sequence. The first and third segments both extend along the arrangement direction of the plurality of inductors 60 and are arranged perpendicular to the arrangement direction of the plurality of inductors 60. The fourth and sixth segments both extend away from the plurality of inductors 60, and the fifth segment extends perpendicular to the arrangement direction of the plurality of inductors 60, so as to accommodate the arrangement of the plurality of second conductive busbars 50 at intervals perpendicular to the arrangement direction of the plurality of inductors 60.

[0141] When there are three busbars 70, each busbar 70 includes a first busbar, a second busbar, and a third busbar. The first busbar includes a first segment and a second segment connected in sequence. The first segment extends along the arrangement direction of the multiple inductors 60, and the second segment extends away from the multiple inductors 60. The second and third busbars each include a first segment, a second segment, a third segment, a fourth segment, a fifth segment, and a sixth segment connected in sequence. The first and third segments of the second and third busbars both extend along the arrangement direction of the multiple inductors 60, and the first and third segments of the second and third busbars are perpendicular to the arrangement direction of the multiple inductors 60. The second and third busbars are arranged in a column direction. The fourth and sixth segments of the second and third busbars extend away from the multiple inductors 60. The fifth segment of the second and third busbars extends perpendicular to the arrangement direction of the multiple inductors 60. The third segment of the second and third busbars is staggered perpendicular to the arrangement direction of the multiple inductors 60 to prevent the third segment of the second and third busbars from interfering with each other. The fifth segment of the second and third busbars is staggered in the extension direction of the second support 34b to prevent the fifth segment of the second and third busbars from interfering with each other.

[0142] In some examples, the carrier 30 has a clamping structure on the side facing the bus 70. The clamping structure includes two clamping members 35 disposed opposite to each other. The clamping members 35 extend from the second side in a direction away from the inductor 60, and the two clamping members 35 clamp a portion of the bus 70.

[0143] When assembling the busbar 70 and the carrier 30, the busbar 70 only needs to be pressed between the two clamping members 35 in the clamping structure. It can be seen that when the busbar 70 and the carrier 30 are assembled, the two clamping members 35 can guide the busbar 70. After the two clamping members 35 in the clamping structure clamp a portion of the busbar 70, the clamping structure achieves the fixation of the busbar 70 and realizes the assembly of the busbar 70 and the carrier 30.

[0144] Since there are multiple busbars 70, there are also multiple clamping structures in this embodiment. Each busbar 70 can have at least one clamping structure attached to it, such as... Figure 7 As shown, when the number of busbars 70 is three, for example, if the first busbar is short, only one clamping structure can be clamped on the first busbar, while the second and third busbars are longer, so two clamping structures can be clamped on the second and third busbars.

[0145] In the description of this specification, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0146] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any modifications or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A power conversion device, characterized in that, It includes a housing and a circuit board, a carrier, a first conductive bus, a second conductive bus, and an inductor disposed within the housing; wherein, The carrier includes a first side and a second side that are opposite to each other. The first side is provided with the inductor, and the second side is provided with the first conductive bar, the second conductive bar and the circuit board. The first side is fixed to the housing. The inductor has a first end and a second end, the first end passing through the carrier and connected to the first conductive busbar, and the second end passing through the carrier and connected to the second conductive busbar; Both the first conductive bus and the second conductive bus are electrically connected to the circuit board.

2. The power conversion device according to claim 1, characterized in that, The support member is provided with a first through hole penetrating the first surface and the second surface; the inner side of the housing is provided with a plurality of protrusions facing the support member, and each of the protrusions facing the support member is provided with a connecting hole, and the side of the protrusion facing the support member contacts the first surface; The power conversion device further includes: A connector that passes through the first through hole and the connecting hole.

3. The power conversion device according to claim 1 or 2, characterized in that, The number of inductors is multiple; the power conversion device further includes: A busbar is disposed on the second surface, one end of the busbar is connected to the second terminal of at least one of the inductors, and the other end of the busbar is connected to a second conductive busbar.

4. The power conversion device according to claim 3, characterized in that, The second surface is provided with a clamping structure, which includes two clamping members arranged opposite to each other. The clamping members extend from the second surface in a direction away from the inductor, and the two clamping members clamp a portion of the busbar.

5. The power conversion device according to claim 3 or 4, characterized in that, The number of the busbars and the second conductive busbars are both multiple, and the multiple second conductive busbars and the multiple busbars are all arranged at intervals perpendicular to the arrangement direction of the multiple inductors; Each bus is connected at one end to the second end of at least one of the inductors, and at the other end of each bus is connected to a second conductive bus.

6. The power conversion device according to any one of claims 1-5, characterized in that, The power conversion device further includes a first support base and a second support base, both of which extend from the second surface in a direction away from the inductor. The first conductive busbar is disposed on the side of the first support base away from the second surface, and the second conductive busbar is disposed on the side of the second support base away from the second surface.

7. The power conversion device according to claim 6, characterized in that, The circuit board includes a first circuit board and a second circuit board disposed on the second surface. The first circuit board is disposed on the side of the first conductive bus away from the second surface, and the second circuit board is disposed on the side of the second conductive bus away from the second surface. The distance between the first circuit board and the second surface is smaller than the distance between the second circuit board and the second surface. The first circuit board contacts the first conductive bus, and the second circuit board contacts the second conductive bus. The distance between the side of the first support facing away from the second surface and the second surface is less than the distance between the side of the second support facing away from the second surface and the second surface.

8. The power conversion device according to claim 6 or 7, characterized in that, The first support is located at any end of the carrier perpendicular to the arrangement direction of the plurality of inductors, and the second support is located at any end of the carrier along the arrangement direction of the plurality of inductors.

9. The power conversion device according to any one of claims 1-8, characterized in that, The housing includes an integrally formed first housing portion and a second housing portion. The first housing portion has a first receiving cavity, and the second housing portion has a second receiving cavity. The first receiving cavity and the second receiving cavity are in communication. The first receiving cavity is used to accommodate the circuit board, the carrier, the first conductive busbar, and the second conductive busbar; The second cavity is used to accommodate the inductor.

10. The power conversion device according to claim 9, characterized in that, The support member is provided with an opening that penetrates the first surface and the second surface, and the opening communicates with the second receiving cavity.

11. The power conversion device according to any one of claims 1-10, characterized in that, At least one of the first surface and the second surface is provided with a shielding layer.

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