Electronic device and replaceable electronic module thereof

Abstract

The invention discloses an electronic device and a replaceable electronic module thereof. The replaceable electronic module comprises a carrier plate, a plurality of contact terminals, an electronic component and an assembling mechanism. The carrier plate is provided with a plurality of through holes, the contact terminal is provided with a contact part, a welding part and a connecting part, and the connecting part is connected with the contact part and the welding part and arranged in the through holes. The electronic component is arranged on the carrier plate, and the pins of the electronic component are electrically connected with the welding parts of the contact terminals. The replaceable electronic module is detachably assembled to a main circuit board through the assembling mechanism, the main circuit board is provided with a plurality of contact pads, and the contact terminals are in contact with the contact pads, so that the electronic assembly is electrically connected with the main circuit board.

Description

Technical Field

[0001] This invention relates to the technical field of electrical connection structures, and more particularly to an electronic device and its replaceable electronic module. Background Technology

[0002] Electronic modules manufactured using chip-on-board (PCB) packaging technology are increasingly widely used due to their ability to miniaturize products and reduce manufacturing costs. For example, many optoelectronic components utilize PCB packaging technology. Current PCB packaging technology involves soldering electronic modules to the main circuit board, forming an electrical connection. However, soldered modules are difficult to replace after damage, often requiring the entire main circuit board to be replaced, increasing product maintenance costs. Summary of the Invention

[0003] In view of this, the purpose of the present invention is to provide an electronic device and a replaceable electronic module thereof, which can be easily replaced after the electronic module is damaged, thus solving the problem of increased maintenance costs caused by the difficulty in replacing electronic modules that are soldered to the main circuit board in the prior art.

[0004] An embodiment of the present invention provides a replaceable electronic module, including a carrier board, a plurality of contact terminals, an electronic component, and a connection mechanism. The carrier board has a first surface, a second surface, and a plurality of through holes, the first surface and the second surface being disposed opposite to each other, and the through holes penetrating the first surface and the second surface. Each contact terminal includes a contact portion, a solder portion, and a connecting portion, the connecting portion connecting the contact portion and the solder portion to form an integrated structure for each contact terminal, and the connecting portion extending through the through holes. The contact portion is an arc-shaped, flexible arm located on the first surface, and the solder portion is located on the second surface. The electronic component is disposed on the second surface of the carrier board, and the electronic component has a plurality of pins, the pins forming an electrical connection with the solder portions of the terminals, thereby forming an electrical connection between the electronic component and the contact terminals. The connection mechanism is attached to the carrier board. The replaceable electronic module is detachably connected to a main circuit board via the connection mechanism. The main circuit board has a plurality of contact pads, the contact portions of the contact terminals contacting the contact pads, thereby forming an electrical connection between the electronic component and the main circuit board.

[0005] In another embodiment, the pins of the electronic component are electrically connected to the solder portion of the terminal by wire bonding.

[0006] In another embodiment, the assembly mechanism includes a pair of locking lugs and a pair of bolts, the locking lugs being aligned with a pair of locking holes on the main circuit board, and the bolts passing through the locking lugs and being detachably locked into the locking holes.

[0007] In another embodiment, each weld is a metal pad.

[0008] In another embodiment, the contact portion and the welding portion extend in the same direction as the connecting portion.

[0009] In another embodiment, the contact portion and the welding portion extend in directions to different sides of the connection portion.

[0010] In another embodiment, the connecting portion forms an interference fit with the wall of the through hole.

[0011] In another embodiment, the electronic component includes a photoelectric chip, and a plurality of pins of the photoelectric chip are electrically connected to a solder joint.

[0012] In another embodiment, the electronic components are connected to multiple optical fibers via a connector.

[0013] An embodiment of the electronic device of the present invention includes a main circuit board and the aforementioned replaceable electronic module. The main circuit board includes a plurality of contact pads. The replaceable electronic module is detachably assembled to the main circuit board via an assembly mechanism, and contact terminals contact the contact pads, thereby forming an electrical connection between the electronic component and the main circuit board.

[0014] The replaceable electronic module of the present invention is provided with multiple contact terminals and an assembly mechanism on a carrier board, so that the replaceable electronic module contacts the contact pad of the main circuit board through the contact terminals to form an electrical connection with the main circuit board. At the same time, the assembly mechanism allows the carrier board of the replaceable electronic module to be detachably assembled to the main circuit board. Thus, when the replaceable electronic module needs to be replaced due to damage or equipment upgrade, the replacement can be easily completed by simply disassembling the assembly mechanism. Attached Figure Description

[0015] Figure 1 is a cross-sectional view of an embodiment of the replaceable electronic module of the present invention; Figure 2 is a schematic diagram of the replaceable electronic module of the present invention before it is connected to the main circuit board; Figure 3 is a schematic diagram of the replaceable electronic module of the present invention after being assembled with the main circuit board; Figure 4 is a perspective view of the replaceable electronic module and the main circuit board of the present invention after assembly.

[0016] Explanation of reference numerals in the attached drawings: 1-Replaceable electronic module; 10-Carrier board; 11-First surface; 12-Second surface; 13-Through hole; 20-Contact terminal; 21-Contact part; 22-Soldering part; 23-Connecting part; 30-Electronic component; 31-Pin; 32-Optoelectronic chip; 40-Assembly mechanism; 41-Locking lug; C-Connector; D-Wire; F-Fiber optic cable; H-Lock hole; M-Main circuit board; P-Contact pad. Detailed Implementation

[0017] Please refer to Figures 1, 2, 3, and 4, which illustrate an embodiment of an electronic device and a replaceable electronic module of the present invention. The replaceable electronic module 1 of this embodiment includes a carrier board 10, a plurality of contact terminals 20, an electronic component 30, and a connection mechanism 40.

[0018] The carrier plate 10 is an insulating substrate, which has a first surface 11, a second surface 12 and a plurality of through holes 13. The first surface 11 and the second surface 12 are arranged opposite to each other, and the through holes 13 penetrate the first surface 11 and the second surface 12.

[0019] Each contact terminal 20 includes a contact portion 21, a welding portion 22, and a connecting portion 23. The connecting portion 23 connects the contact portion 21 and the welding portion 22, making each contact terminal 20 an integral structure. The connecting portion 23 extends through the through hole 13, and the connecting portion 23 forms an interference fit with the hole wall of the through hole 13, thereby positioning the contact terminal 20 in the through hole 13. The contact portion 21 is an arc-shaped flexible arm located on the first surface 11, and the welding portion 22 is located on the second surface 12. The contact portion 21 and the welding portion 22 are bent relative to the connecting portion 23, such that the welding portion forms a metal pad located on the second surface 12, and the contact portion 21 forms an arc-shaped flexible arm extending away from the through hole 13. In this embodiment, the contact portion 21 and the welding portion 22 extend in different directions toward the connecting portion 23, but the invention is not limited to this. In other embodiments, the contact portion 21 and the welding portion 22 extend in the same direction toward the connecting portion 23.

[0020] Electronic component 30 is disposed on the second surface 112 of carrier plate 10. Electronic component 30 has multiple pins 31, which are electrically connected to the solder portion 22 of contact terminal 20 via wire bonding, thereby forming an electrical connection between electronic component 30 and contact terminal 20. In this embodiment, electronic component 30 includes a photoelectric chip 32, and multiple pins 31 of photoelectric chip 32 are electrically connected to the solder portion 22 of contact terminal 20 via wires D. As shown in Figures 2, 3, and 4, electronic component 30 is connected to multiple optical fibers F via connector C. Connector C is disposed on carrier plate 10, so that the optical signal generated by photoelectric chip 32 can be transmitted via optical fiber F.

[0021] Please refer to Figures 2, 3, and 4. The assembly mechanism 40 is attached to the carrier plate 10. The assembly mechanism 40 includes a pair of locking lugs 41 and a pair of bolts (not shown). The pair of locking lugs 41 are attached to opposite sides of the carrier plate 10, and the locking lugs 41 are respectively aligned with a pair of locking holes H on the main circuit board M. The bolts pass through the locking lugs 41 and are detachably locked in the locking holes H. At the same time, the contact portion 21 of the contact terminal 20 overlaps with the contact pad P of the main circuit board M of an electronic device, so that the electronic component 30 is electrically connected to the main circuit board M through the structure of the carrier plate 10 and the terminal 20, thereby enabling the electronic component 30 to be electrically connected to multiple electronic components (such as a processor) mounted on the main circuit board M. The contact pad P of the main circuit board M can be set at a corresponding position according to the extension direction of the contact portion 21 of the contact terminal 20.

[0022] Although the assembly mechanism in this embodiment is illustrated using a bolt-locking structure as an example, the invention is not limited to this. Other assembly mechanisms, such as those using pin insertion or spring clip engagement, are also applicable. Although the electronic component in this embodiment is illustrated using a photoelectric chip as an example, the invention is not limited to this. Other electronic components requiring frequent replacement or upgrades are also applicable. Although the pins of the electronic component in this embodiment are electrically connected to the second welding structure via wire bonding, the invention is not limited to this. Other electrical connection structures (such as welding or lap joints) are also applicable.

[0023] The replaceable electronic module of the present invention is provided with multiple contact terminals and an assembly mechanism on a carrier board, so that the replaceable electronic module contacts the contact pad of the main circuit board through the contact terminals to form an electrical connection with the main circuit board. At the same time, the assembly mechanism allows the carrier board of the replaceable electronic module to be detachably assembled to the main circuit board. Thus, when the replaceable electronic module needs to be replaced due to damage or equipment upgrade, the replacement can be easily completed by simply disassembling the assembly mechanism.

[0024] The above description is merely a preferred embodiment of the present invention and should not be construed as limiting the scope of the invention. Any simple equivalent variations and modifications made in accordance with the claims and specification of the present invention are still within the scope of the invention. Furthermore, no embodiment or claim of the present invention needs to achieve all the objectives, advantages, or features provided by the present invention. In addition, the abstract and headings are merely for assisting in patent document searches and are not intended to limit the scope of the invention. Furthermore, the terms "first," "second," etc., mentioned in the specification or claims are only used to name elements or distinguish different embodiments or scopes, and are not used to limit the upper or lower limit of the number of elements.

Claims

1. A replaceable electronic module, characterized in that, include: A carrier plate having a first surface, a second surface and a plurality of through holes, wherein the first surface and the second surface are disposed opposite to each other and the plurality of through holes penetrate the first surface and the second surface; Multiple contact terminals, each contact terminal including a contact portion, a welding portion and a connecting portion, the connecting portion connecting the contact portion and the welding portion so that each contact terminal forms an integral structure, and the connecting portion extending through the through hole, the contact portion being an arc-shaped flexible arm and located on the first surface, and the welding portion being located on the second surface; An electronic component is disposed on the second surface of the carrier plate. The electronic component has multiple pins, which are electrically connected to multiple solder portions of multiple contact terminals, thereby forming an electrical connection between the electronic component and the multiple contact terminals. as well as A set of connecting mechanisms is attached to the carrier plate; The replaceable electronic module can be detachably assembled to a main circuit board via the assembly mechanism. The main circuit board has multiple contact pads, and the contact portion of the multiple contact terminals contacts the multiple contact pads, so that the electronic component and the main circuit board form an electrical connection.

2. The replaceable electronic module as described in claim 1, characterized in that, The plurality of pins of the electronic component are electrically connected to the plurality of solder joints of the plurality of contact terminals by wire bonding.

3. The replaceable electronic module as described in claim 1, characterized in that, The assembly mechanism includes a pair of locking lugs and a pair of bolts. The pair of locking lugs are aligned with a pair of locking holes on the main circuit board, and the pair of bolts pass through the pair of locking lugs and are detachably locked to the pair of locking holes.

4. The replaceable electronic module as described in claim 1, characterized in that, Each of these welded parts consists of a metal pad.

5. The replaceable electronic module as described in claim 1, characterized in that, The contact portion and the welded portion extend in the same direction as the connecting portion.

6. The replaceable electronic module as described in claim 1, characterized in that, The contact portion and the welded portion extend in different directions toward the connection portion.

7. The replaceable electronic module as described in claim 1, characterized in that, The connecting part forms an interference fit with the wall of the through hole.

8. The replaceable electronic module as described in claim 1, characterized in that, The electronic component includes an optoelectronic chip, and multiple pins of the optoelectronic chip are electrically connected to multiple solder joints.

9. The replaceable electronic module as described in claim 8, characterized in that, The electronic component is connected to multiple optical fibers via a connector.

10. An electronic device, characterized in that, include: A main circuit board, which includes multiple contact pads; as well as The replaceable electronic module as described in any one of claims 1 to 9 is detachably assembled to the main circuit board via the assembly mechanism, and the plurality of contact terminals contact the plurality of contact pads, thereby forming an electrical connection between the electronic component and the main circuit board.

Images