Manufacturing method of printed circuit board and printed circuit board

Abstract

The invention relates to the technical field of printed circuit board manufacturing, and discloses a manufacturing method of a printed circuit board and the printed circuit board, and the manufacturing method of the printed circuit board comprises the steps: providing a substrate which comprises a first circuit layer, a second circuit layer and an insulating layer, the substrate is provided with a female hole, and the female hole is internally provided with a conductive material, the first circuit layer and / or the second circuit layer are / is connected with the conductive material; a limiting insulating medium and an electronic component are arranged in the female hole, the limiting insulating medium limits the electronic component in the female hole, and the electronic component is insulated from the conductive material. The manufacturing method of the printed circuit board and the printed circuit board are used for solving the problem that in the prior art, electronic components need to occupy a large surface area of the printed circuit board, and the wiring density of a circuit is limited.

Description

Technical Field

[0001] This application relates to the field of printed circuit board manufacturing technology, and in particular to a method for manufacturing a printed circuit board and a printed circuit board. Background Technology

[0002] In the process of manufacturing printed circuit boards, some electronic components (such as capacitors) are usually assembled using surface mount technology (SMT). This means that the connection pads are designed directly on the surface of the printed circuit board, and the components are mounted on the connection pads using SMT technology.

[0003] Because electronic components require a large surface area of ​​printed circuit boards, the wiring density is limited, resulting in low surface area utilization of printed circuit boards, which in turn leads to low integration of printed circuit boards. Summary of the Invention

[0004] This application provides a method for manufacturing a printed circuit board and a printed circuit board, which solves the problem in the prior art that electronic components need to occupy a large surface area of ​​the printed circuit board, thus limiting the wiring density.

[0005] In a first aspect, embodiments of this application provide a method for manufacturing a printed circuit board, comprising: A substrate is provided, the substrate including a first circuit layer, a second circuit layer and an insulating layer located between the first circuit layer and the second circuit layer, the substrate having a female hole, the interior of the female hole being disposed of a conductive material, and the first circuit layer and / or the second circuit layer being connected to the conductive material; A limiting insulating medium and electronic components are provided inside the main hole. The limiting insulating medium restricts the electronic components within the main hole, and the electronic components are insulated from the conductive material.

[0006] In some embodiments, the method of manufacturing the printed circuit board further includes: splitting the conductive material into multiple conductive portions, wherein the first circuit layer is connected to one of the conductive portions, and the second circuit layer is connected to another conductive portion.

[0007] In some embodiments, the step of splitting the conductive material into multiple conductive portions includes: Multiple cut-off holes are machined through the conductive material, and the cut-off holes divide the conductive material into multiple conductive portions.

[0008] In some embodiments, after the plurality of cut-off holes through the conductive material are machined, the cut-off holes are filled with a cut-off insulating medium that separates two adjacent conductive portions.

[0009] In some embodiments, when the limiting insulating medium and electronic components are provided in the female hole, the cutting-off insulating medium is filled in the cutting-off hole.

[0010] In some embodiments, the provision of a limiting insulating medium and electronic components within the female hole includes: The female hole is filled with a first insulating medium, and the conductive material is located between the inner wall of the female hole and the first insulating medium. A sub-hole is machined in the first insulating medium; Electronic components are disposed within the sub-hole; A second insulating medium is filled between the inner wall of the sub-hole and the electronic component, the second insulating medium abutting against the electronic component, and the limiting insulating medium includes the first insulating medium and the second insulating medium.

[0011] In some embodiments, filling the space between the inner wall of the sub-hole and the electronic component with a second insulating medium includes: Resin is inserted between the inner wall of the sub-hole and the electronic component, and the second insulating medium includes the resin; And / or, an adhesive layer is provided on at least one side of the substrate, and the adhesive layer and the substrate are pressed together such that a portion of the adhesive layer melts and fills the gap between the inner wall of the sub-hole and the electronic component, wherein the second insulating medium includes at least a portion of the adhesive layer.

[0012] In some embodiments, the length direction of the electronic component is parallel to the arrangement direction of the first circuit layer, the insulating layer, and the second circuit layer.

[0013] Secondly, embodiments of this application provide a printed circuit board, the printed circuit board including a substrate, the substrate including a first circuit layer, a second circuit layer and an insulating layer located between the first circuit layer and the second circuit layer, the substrate having a female hole, the interior of the female hole being disposed of a conductive material, the first circuit layer and / or the second circuit layer being connected to the conductive material; a limiting insulating medium and electronic components are disposed within the female hole, the limiting insulating medium confining the electronic components within the female hole, and the electronic components being insulated from the conductive material.

[0014] In some embodiments, the conductive material includes a plurality of conductive portions, the first circuit layer is connected to one of the conductive portions, and the second circuit layer is connected to the other conductive portion.

[0015] In some embodiments, the printed circuit board further includes a first connection layer and a third circuit layer, the first connection layer being located between the third circuit layer and the first circuit layer, the first connection layer having a first connection hole, the first connection hole having a first connection portion inside, and the third circuit layer being electrically connected to the electronic component through the first connection portion; and / or, the printed circuit board further includes a second connection layer and a fourth circuit layer, the second connection layer being located between the fourth circuit layer and the second circuit layer, the second connection layer having a second connection hole, the second connection hole having a second connection portion inside, and the fourth circuit layer being electrically connected to the electronic component through the second connection portion.

[0016] In some embodiments, the limiting insulating medium includes a first insulating medium and a second insulating medium, the conductive material is located between the inner wall of the main hole and the first insulating medium; the first insulating medium is provided with a sub-hole, the electronic component and the second insulating medium are both located in the sub-hole, the second insulating medium is located between the inner wall of the sub-hole and the electronic component, and the second insulating medium abuts against the electronic component.

[0017] Thirdly, embodiments of this application provide a printed circuit board, which is manufactured by the printed circuit board manufacturing method described in the first aspect.

[0018] The printed circuit board manufacturing method provided in this application has the following advantages: Since the substrate includes a first circuit layer, a second circuit layer, and an insulating layer located between the first and second circuit layers, the substrate is provided with a female hole, and a conductive material is disposed inside the female hole. The first circuit layer and / or the second circuit layer are connected to the conductive material. By providing a limiting insulating medium and electronic components inside the female hole, the electronic components are confined within the female hole using the limiting insulating medium, and the electronic components are insulated from the conductive material. This not only allows the electronic components to be embedded inside the substrate, avoiding the electronic components occupying a large portion of the substrate surface area, but also allows the first circuit layer and / or the second circuit layer to be connected by the conductive material, so that circuits can be laid around the electronic components, thereby increasing the wiring density.

[0019] The advantages of the printed circuit board provided in this application compared to the prior art can be seen in the description of the advantages of the manufacturing method of the printed circuit board provided in this application compared to the prior art, which will not be repeated here. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 This is a flowchart of a method for manufacturing a printed circuit board in one embodiment of this application; Figure 2 This is a schematic diagram of the processing plate structure in one embodiment of this application; Figure 3 Is Figure 2 A schematic diagram showing the machining of the female hole on the machining plate; Figure 4 Is Figure 2 A schematic diagram of the substrate obtained after conductive material is placed inside the female hole of the processing plate shown; Figure 5 Is Figure 4 A schematic diagram showing a resist film attached to one side of the substrate; Figure 6 Is Figure 5 A schematic diagram showing the mother hole of the substrate filled with a first insulating medium; Figure 7 It is to remove Figure 6 A schematic diagram of the resist film on the substrate shown; Figure 8 yes Figure 7 The corresponding top view; Figure 9 Is Figure 7 A schematic diagram showing the cutting-off holes machined on the substrate; Figure 10 yes Figure 9 The corresponding top view; Figure 11 Is Figure 9 The diagram shows a cut-off hole filled with a cut-off insulating medium. Figure 12 Is Figure 11 A schematic diagram showing the sub-holes machined on the first insulating medium of the substrate; Figure 13 Yes Figure 12 A schematic diagram of the circuit fabrication of the first and second circuit layers of the substrate shown. Figure 14 Is Figure 13 A schematic diagram showing the placement of electronic components within a sub-hole; Figure 15 Is Figure 14The diagram shows a second insulating medium filling the space between the inner wall of the sub-hole and the electronic components, forming a first connection layer and a second connection layer. Figure 16 They are respectively in Figure 15 The diagram shows a first connecting hole and a second connecting hole machined on the first connecting layer and the second connecting layer. Figure 17 They are respectively in Figure 16 The diagram shows a first connection part and a second connection part respectively provided in the first connection hole and the second connection hole, forming a third circuit layer and a fourth circuit layer; Figure 18 Yes Figure 17 The diagram shows the circuit fabrication process for the third and fourth circuit layers.

[0022] The markings in the diagram mean: 10. Substrate; 101. Processing board; 11. First circuit layer; 12. Second circuit layer; 13. Insulating layer; 14. Resistant film; 20. Female hole; 21. Conductive material; 211. Conductive part; 22. First insulating medium; 30. Cut-off hole; 31. Cut off the insulating medium; 40. Zi Kong; 41. Second insulating medium; 50. Electronic components; 60. First connection layer; 61. First connecting hole; 62. First connecting part; 70. Second connecting layer; 71. Second connecting hole; 72. Second connecting part; 80. Third line layer; 90. Fourth line layer. Detailed Implementation

[0023] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0024] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0025] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0026] In this specification, references to "one embodiment," "some embodiments," or simply "embodiment" mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. Furthermore, in one or more embodiments, specific features, structures, or characteristics may be combined in any suitable manner.

[0027] In the process of manufacturing printed circuit boards, some electronic components (such as capacitors) are usually assembled using surface mount technology (SMT). This means that the connection pads are designed directly on the surface of the printed circuit board, and the components are mounted on the connection pads using SMT technology.

[0028] Because electronic components require a large surface area of ​​printed circuit boards, the wiring density is limited, resulting in low surface area utilization of printed circuit boards, which in turn leads to low integration of printed circuit boards.

[0029] In view of this, this application provides a method for manufacturing a printed circuit board and a printed circuit board. Since the substrate includes a first circuit layer, a second circuit layer, and an insulating layer located between the first circuit layer and the second circuit layer, the substrate is provided with a female hole, and a conductive material is disposed inside the female hole. The first circuit layer and / or the second circuit layer are connected to the conductive material. By providing a limiting insulating medium and electronic components inside the female hole, the electronic components are confined within the female hole using the limiting insulating medium, and the electronic components are insulated from the conductive material. This not only allows the electronic components to be embedded inside the substrate, avoiding the electronic components occupying a large portion of the substrate surface area, but also allows the first circuit layer and / or the second circuit layer to be connected by the conductive material, so that circuits can be laid around the electronic components, thereby increasing the wiring density.

[0030] To illustrate the technical solution of this application, the following description is provided in conjunction with specific accompanying drawings and embodiments.

[0031] Please refer to Figures 1 to 4In a first aspect, embodiments of this application provide a method for manufacturing a printed circuit board, comprising: S100: A substrate 10 is provided. The substrate 10 includes a first circuit layer 11, a second circuit layer 12, and an insulating layer 13 located between the first circuit layer 11 and the second circuit layer 12. The substrate 10 is provided with a female hole 20. A conductive material 21 is disposed inside the female hole 20. The first circuit layer 11 and / or the second circuit layer 12 are connected to the conductive material 21.

[0032] The substrate 10 can be a double-sided board or a multi-layer board, that is, a board with double-layer or multi-layer circuitry. Multiple first circuit layers 11 and multiple second circuit layers 12 can be provided.

[0033] The materials of the first circuit layer 11 and the second circuit layer 12 can both be copper, silver, or aluminum. The materials of the insulating layer 13 can include glass fiber and resin, such as epoxy resin, polytetrafluoroethylene resin, polyphenylene ether resin, polyimide resin, bismaleimide triazine resin, etc.

[0034] The conductive material 21 can be made of copper, silver, or aluminum, etc. The female hole 20 can be a plated through-hole (PTH), and the conductive material 21 can be a hole ring. One or more female holes 20 can be provided depending on the number of electronic components 50 to be embedded.

[0035] It is understood that the first circuit layer 11 is connected to the conductive material 21, while the second circuit layer 12 is not connected to the conductive material 21. The first circuit layer 11 can be connected to other circuit layers through the conductive material 21.

[0036] Alternatively, the second circuit layer 12 is connected to the conductive material 21, while the first circuit layer 11 is not connected to the conductive material 21. The second circuit layer 12 can be connected to other circuit layers through the conductive material 21.

[0037] Alternatively, the first circuit layer 11 and the second circuit layer 12 can be connected through the conductive material 21.

[0038] For example, multiple first circuit layers 11, second circuit layers 12, and conductive materials 21 can be provided. Some of the first circuit layers 11 and some of the second circuit layers 12 are connected through some of the conductive materials 21, and other parts of the first circuit layers 11 and other parts of the second circuit layers 12 are connected through other parts of the conductive materials 21.

[0039] Understandably, since the first circuit layer 11 and / or the second circuit layer 12 are connected to the conductive material 21, it is convenient to run wiring around the electronic component 50, thereby increasing the wiring density.

[0040] It should be noted that a processing board 101 with a first circuit layer 11, a second circuit layer 12, and an insulating layer 13 can be provided. Then, female holes 20 are drilled on the processing board 101. After drilling the female holes 20, a hole metallization process is performed to attach a metal layer of a predetermined thickness to the hole wall to form a conductive material 21, thereby obtaining the substrate 10. The metallization process can be a common process such as copper plating or electroplating thickening. Drilling can be completed by a CNC mechanical drilling machine or a laser drilling machine, with CNC mechanical drilling machines having higher processing efficiency.

[0041] S200: Please refer to this as well. Figures 5 to 15 A limiting insulating medium and an electronic component 50 are provided inside the female hole 20. The limiting insulating medium restricts the electronic component 50 inside the female hole 20, and the electronic component 50 is insulated from the conductive material 21.

[0042] Resin can be inserted into the female hole 20 or an adhesive layer can be pressed onto at least one side of the substrate 10 to form a limiting insulating medium. The electronic component 50 can be a capacitor, inductor, or chip, etc.

[0043] It should be noted that when the diameter of the female hole 20 is large, before plugging the hole, a resist film 14 (such as a brown film) can be applied to one side of the substrate 10 to block the bottom of the female hole 20, and the hole can be plugged on the other side to ensure that the resin plugging is full and without depressions. After plugging, the board can be baked (to cure the resin) and ground (to remove the resin protruding from the board surface and make the board surface flat). The resist film 14 can be made of high-temperature resistant tape, PI (Polyimide Film), etc. After the resin has been baked and initially cured or finally cured, the resist film 14 can be removed.

[0044] As can be seen from the above, the printed circuit board manufacturing method provided in this application embodiment, since the substrate 10 includes a first circuit layer 11, a second circuit layer 12, and an insulating layer 13 located between the first circuit layer 11 and the second circuit layer 12, the substrate 10 is provided with a female hole 20, and a conductive material 21 is disposed inside the female hole 20. The first circuit layer 11 and / or the second circuit layer 12 are connected to the conductive material 21. Furthermore, by providing a limiting insulating medium and an electronic component 50 inside the female hole 20, the limiting insulating medium restricts the electronic component 50 within the female hole 20, and the electronic component 50 is insulated from the conductive material 21. This not only allows the electronic component 50 to be embedded inside the substrate 10, avoiding the electronic component 50 occupying a large portion of the surface area of ​​the substrate 10, but also allows the first circuit layer 11 and / or the second circuit layer 12 to be connected through the conductive material 21, so that circuits can be laid around the electronic component 50, thereby increasing the wiring density and achieving higher integration.

[0045] As an implementable method, a limiting insulating medium and electronic components 50 are provided within the female hole 20, including: First, a first insulating medium 22 is filled into the female hole 20, and a conductive material 21 is located between the inner wall of the female hole 20 and the first insulating medium 22.

[0046] Resin can be inserted into the female hole 20 to form the first insulating medium 22.

[0047] For example, resin can be filled into the female hole 20 by screen printing or vacuum plugging. After the resin plugging, the substrate 10 is baked to cure the resin and form the first insulating medium 22. This step usually also includes grinding to remove resin protruding or overflowing onto the surface of the substrate 10, so that the surface of the substrate 10 is flat.

[0048] Secondly, a sub-hole 40 is machined on the first insulating medium 22.

[0049] The diameter of the sub-hole 40 is smaller than that of the female hole 20. The sub-hole 40 can be coaxial with or non-coaxial with the female hole 20. The diameter of the sub-hole 40 is greater than or equal to the cross-sectional dimension of the electronic component 50. The sub-hole 40 can be machined using a CNC mechanical drilling machine or a laser drilling machine. For example, using a CNC mechanical drilling machine, selecting an appropriate drill bit diameter, and performing concentric drilling on the first insulating medium 22 to complete the machining of the sub-hole 40 results in higher machining efficiency.

[0050] Next, electronic components 50 are installed inside the subhole 40.

[0051] Electronic components 50 can be installed in the sub-hole 40 by machine or manual means. Compared with the larger diameter of the main hole 20, the smaller diameter of the sub-hole 40 can limit the electronic components 50, making the embedding position of the electronic components 50 more precise, and thus making the embedding effect better.

[0052] Then, a second insulating medium 41 is filled between the inner wall of the sub-hole 40 and the electronic component 50. The second insulating medium 41 abuts against the electronic component 50. The limiting insulating medium includes a first insulating medium 22 and a second insulating medium 41.

[0053] In this embodiment, resin can be inserted between the inner wall of the sub-hole 40 and the electronic component 50, and the second insulating medium 41 includes resin; and / or, an adhesive layer can be provided on at least one side of the substrate 10, and the adhesive layer and the substrate 10 are pressed together so that a portion of the adhesive layer melts and fills the gap between the inner wall of the sub-hole 40 and the electronic component 50, and the second insulating medium 41 includes at least a portion of the adhesive layer, which may be a prepreg.

[0054] It is understandable that after the second insulating medium 41 is filled between the inner wall of the sub-hole 40 and the electronic component 50, the electronic component 50 and the conductive material 21 are isolated by the second insulating medium 41 to achieve the purpose of insulation. The second insulating medium 41 can restrict the position of the electronic component 50, thereby forming a substrate 10 in which the electronic component 50 is embedded.

[0055] By adopting the above solution, not only can the electronic components 50 be embedded inside the substrate 10, avoiding the electronic components 50 occupying a large area of ​​the substrate 10, but also the first circuit layer 11 and / or the second circuit layer 12 can be connected by the conductive material 21 to lay out the circuit around the electronic components 50, thereby improving the wiring density and increasing the integration.

[0056] It is understood that an adhesive layer is provided on at least one side of the substrate 10, that is, on the side of the first circuit layer 11 opposite to the insulating layer 13 and / or on the side of the second circuit layer 12 opposite to the insulating layer 13.

[0057] Please refer to Figures 7 to 11 In some embodiments, the method of manufacturing a printed circuit board further includes: splitting the conductive material 21 into a plurality of conductive parts 211, with the first circuit layer 11 connected to one of the conductive parts 211 and the second circuit layer 12 connected to the other conductive part 211.

[0058] By adopting the above scheme, the first circuit layer 11 and the second circuit layer 12 can be connected through different conductive parts 211, thereby forming multiple independent traces and increasing the wiring density on the substrate 10.

[0059] It is understood that multiple first circuit layers 11 and second circuit layers 12 can be provided. Any two first circuit layers 11 can be electrically connected through one of the conductive parts 211, and any two second circuit layers 12 can be electrically connected through the other conductive part 211. The first circuit layer 11 can be connected to other circuit layers through the conductive part 211, and the second circuit layer 12 can be connected to other circuit layers through the conductive part 211.

[0060] Optionally, the conductive material 21 is divided into multiple conductive portions 211, including: Multiple cut-off holes 30 are machined to penetrate the conductive material 21, and the cut-off holes 30 divide the conductive material 21 into multiple conductive parts 211.

[0061] The cut-off hole 30 can be processed by a CNC mechanical drilling machine or a laser drilling machine.

[0062] With this configuration, part of the conductive material 21 can be removed through the cut-off holes 30. Multiple cut-off holes 30 divide the complete conductive material 21 in the mother hole 20 into multiple conductive parts 211, forming multiple independent traces.

[0063] It should be noted that the axis of the cut-off hole 30 can coincide with the hole wall of the female hole 20, so as to facilitate the processing of the cut-off hole 30 and the removal of part of the conductive material 21.

[0064] Optionally, after processing multiple cut-off holes 30 that penetrate the conductive material 21, the cut-off holes 30 are filled with a cut-off insulating medium 31, which separates two adjacent conductive parts 211.

[0065] With this configuration, the cut-off hole 30 can be filled by cutting off the insulating medium 31, thus preventing the cut-off hole 30 from becoming recessed, and achieving insulation between two adjacent conductive parts 211.

[0066] As an implementable method, when a limiting insulating medium and electronic components 50 are provided in the female hole 20, the cut-off insulating medium 31 is filled in the cut-off hole 30.

[0067] This configuration allows for the filling of limiting insulating medium and the cutting off of insulating medium 31 within the same process, improving production efficiency.

[0068] It is understandable that when the inner wall of the sub-hole 40 is filled with the second insulating medium 41 and the electronic component 50, the cut-off insulating medium 31 is filled in the cut-off hole 30. The second insulating medium 41 and the cut-off insulating medium 31 can be made of the same material.

[0069] Optionally, the step of dividing the conductive material 21 into multiple conductive portions 211 is performed after the step of filling the female hole 20 with the first insulating medium 22.

[0070] With this configuration, since the female hole 20 is filled with the first insulating medium 22, it is easier to operate when machining the cut-off hole 30, and it avoids generating more drill bit flash.

[0071] As an implementable method, a second insulating medium 41 is filled between the inner wall of the sub-hole 40 and the electronic component 50, including: Resin is inserted between the inner wall of the sub-hole 40 and the electronic component 50, and the second insulating medium 41 includes resin.

[0072] In this process, resin can be filled between the inner wall of the sub-hole 40 and the electronic component 50 by screen printing or vacuum plugging, so that the electronic component 50 is fixed in the sub-hole 40.

[0073] And / or, an adhesive layer is provided on the side of the first circuit layer 11 away from the insulating layer 13 and / or on the side of the second circuit layer 12 away from the insulating layer 13, and the adhesive layer and the substrate 10 are pressed together so that a portion of the adhesive layer melts and fills the gap between the inner wall of the sub-hole 40 and the electronic component 50, and the second insulating medium 41 includes at least a portion of the adhesive layer.

[0074] By adopting the above scheme, it is relatively easy to fill the space between the inner wall of the sub-hole 40 and the electronic component 50 with the second insulating medium 41.

[0075] Optionally, the length direction of the electronic component 50 is parallel to the arrangement direction of the first circuit layer 11, the insulating layer 13, and the second circuit layer 12.

[0076] This configuration allows the electronic component 50 to occupy a smaller area on a plane perpendicular to the arrangement direction of the first circuit layer 11, the insulating layer 13, and the second circuit layer 12, thereby freeing up valuable surface wiring space on the substrate 10. This facilitates independent wiring around the electronic component 50, allows for a more compact circuit layout, and helps to miniaturize the electronic component 50 or integrate more functional modules.

[0077] For example, when electronic component 50 is a capacitor, traditional planar surface-mount capacitors are limited by two-dimensional layout, while the vertical capacitor provided in this application embodiment utilizes a three-dimensional structure to perform multi-layer stacking or three-dimensional integration in the vertical direction, which can achieve higher capacitance density and higher capacitance value per unit area. It can be used in high-performance computing, high-frequency circuits, power electronics and embedded systems, and is suitable for high-end HDI (High-Density Interconnect) printed circuit boards.

[0078] It is understandable that the thickness of the substrate 10 can be greater than the length of the electronic component 50, so that the electronic component 50 will not protrude from the board surface after being placed in the sub-hole 40.

[0079] Please refer to Figures 1 to 15 Secondly, embodiments of this application provide a printed circuit board, which includes a substrate 10. The substrate 10 includes a first circuit layer 11, a second circuit layer 12, and an insulating layer 13 located between the first circuit layer 11 and the second circuit layer 12. The substrate 10 is provided with a female hole 20, and a conductive material 21 is disposed inside the female hole 20. The first circuit layer 11 and / or the second circuit layer 12 are connected to the conductive material 21. A limiting insulating medium and an electronic component 50 are disposed inside the female hole 20. The limiting insulating medium restricts the electronic component 50 within the female hole 20, and the electronic component 50 is insulated from the conductive material 21.

[0080] The printed circuit board provided in this application embodiment includes a substrate 10 comprising a first circuit layer 11, a second circuit layer 12, and an insulating layer 13 located between the first circuit layer 11 and the second circuit layer 12. The substrate 10 is provided with a female hole 20, and a conductive material 21 is disposed inside the female hole 20. The first circuit layer 11 and / or the second circuit layer 12 are connected to the conductive material 21. A limiting insulating medium and an electronic component 50 are disposed inside the female hole 20. The limiting insulating medium restricts the electronic component 50 within the female hole 20, and the electronic component 50 is insulated from the conductive material 21. Therefore, not only can the electronic component 50 be embedded inside the substrate 10, avoiding the electronic component 50 occupying a large area of ​​the substrate 10, but the first circuit layer 11 and / or the second circuit layer 12 can be connected through the conductive material 21 to arrange circuits around the electronic component 50, thereby increasing the wiring density.

[0081] Optionally, the conductive material 21 includes a plurality of conductive parts 211, the first circuit layer 11 is connected to one of the conductive parts 211, and the second circuit layer 12 is connected to the other conductive part 211.

[0082] With this configuration, the first circuit layer 11 and the second circuit layer 12 can be connected through different conductive parts 211, thereby forming multiple independent traces and increasing the wiring density on the substrate 10.

[0083] Optionally, the limiting insulating medium includes a first insulating medium 22 and a second insulating medium 41. The conductive material 21 is located between the inner wall of the female hole 20 and the first insulating medium 22. A female hole 40 is provided on the first insulating medium 22. The electronic component 50 and the second insulating medium 41 are both located in the female hole 40. The second insulating medium 41 is located between the inner wall of the female hole 40 and the electronic component 50, and the second insulating medium 41 abuts against the electronic component 50.

[0084] This configuration not only allows the electronic components 50 to be embedded inside the substrate 10, avoiding the electronic components 50 occupying a large portion of the surface area of ​​the substrate 10, but also allows the first circuit layer 11 and / or the second circuit layer 12 to be connected by the conductive material 21, so that circuits can be laid around the electronic components 50, thereby increasing the wiring density and achieving higher integration.

[0085] It is understandable that the first insulating medium 22 and the second insulating medium 41 can be made of the same material, and the first insulating medium 22 and the second insulating medium 41 are different parts of the limiting insulating medium.

[0086] Please refer to Figures 15 to 18In some embodiments, the printed circuit board further includes a first connection layer 60 and a third circuit layer 80. The first connection layer 60 is located between the third circuit layer 80 and the first circuit layer 11. The first connection layer 60 is provided with a first connection hole 61, and a first connection portion 62 is provided inside the first connection hole 61. The third circuit layer 80 and the electronic component 50 are electrically connected through the first connection portion 62. The printed circuit board further includes a second connection layer 70 and a fourth circuit layer 90. The second connection layer 70 is located between the fourth circuit layer 90 and the second circuit layer 12. The second connection layer 70 is provided with a second connection hole 71, and a second connection portion 72 is provided inside the second connection hole 71. The fourth circuit layer 90 and the electronic component 50 are electrically connected through the second connection portion 72.

[0087] This configuration facilitates the connection and electrical conduction between the third circuit layer 80 and / or the fourth circuit layer 90 and the electronic component 50.

[0088] It should be noted that the third circuit layer 80 and / or the fourth circuit layer 90 can be formed by electroplating or lamination.

[0089] In the printed circuit board provided in this application embodiment, when the electronic component 50 is a capacitor, the connection path between the capacitor and the third circuit layer 80 and / or the fourth circuit layer 90, which serve as the chip power / ground network, is significantly shortened, reducing parasitic inductance caused by bonding wires, package traces, etc., which can significantly improve power integrity and achieve extremely low parasitic inductance.

[0090] As an feasible approach, an adhesive layer is provided on the side of the first circuit layer 11 away from the insulating layer 13, and the adhesive layer and the substrate 10 are pressed together so that when part of the adhesive layer melts and fills the gap between the inner wall of the sub-hole 40 and the electronic component 50, the part of the adhesive layer melts and solidifies to form the first connection layer 60 and the second connection layer 70 respectively. Then, the first connection hole 61 and the second connection hole 71 are processed on the first connection layer 60 and the second connection layer 70 respectively. Then, the first connection part 62, the third circuit layer 80, the second connection part 72, and the fourth circuit layer 90 are formed by chemical deposition and electroplating, so that the two ends of the electronic component 50 are electrically connected to the third circuit layer 80 and the fourth circuit layer 90 through the first connection part 62 and the second connection part 72 respectively, forming a network. Then, the circuits of the third circuit layer 80 and the fourth circuit layer 90 can be fabricated.

[0091] As another feasible approach, a laminate can be formed by directly laminating the first connecting layer 60 and the third circuit layer 80, as well as the second connecting layer 70 and the fourth circuit layer 90, on both sides of the substrate 10. Then, a pre-browning treatment is performed, and the first connecting hole 61 and the second connecting hole 71 are machined on the first connecting layer 60 and the second connecting layer 70, respectively. At the same time, holes are machined on the third circuit layer 80 and the fourth circuit layer 90. Then, the first connecting portion 62 and the second connecting portion 72 are formed by chemical deposition and electroplating, and the holes on the third circuit layer 80 and the fourth circuit layer 90 are filled, so that the two ends of the electronic component 50 are electrically connected to the third circuit layer 80 and the fourth circuit layer 90 through the first connecting portion 62 and the second connecting portion 72, respectively, forming a network. Then, the circuits on the third circuit layer 80 and the fourth circuit layer 90 can be fabricated.

[0092] It should be noted that the first connecting layer 60 and the second connecting layer 70 can be insulating dielectric layers or substrate layers obtained by laminating prepregs. During the process of laminating the first connecting layer 60 and the third circuit layer 80, as well as the second connecting layer 70 and the fourth circuit layer 90 on both sides of the substrate 10 to form a laminate, part of the adhesive layer melts and fills the gap between the inner wall of the sub-hole 40 and the electronic component 50, forming the second insulating dielectric 41. Part of the adhesive layer melts and solidifies to form the first connecting layer 60 and the second connecting layer 70. The third circuit layer 80 and the fourth circuit layer 90 can be copper foil, etc., and the first connecting hole 61 and the second connecting hole 71 can be processed by laser drilling.

[0093] It is understood that the adhesive layer may include a prepreg, etc., for forming the first bonding layer 60 and / or the second bonding layer 70.

[0094] When a first connecting layer 60 and a third circuit layer 80, as well as a second connecting layer 70 and a fourth circuit layer 90, are respectively laminated on both sides of a substrate 10 to form a laminate, the first connecting layer 60 and a first plate, as well as the second connecting layer 70 and a second plate, can be respectively laminated on both sides of the substrate 10 to form a laminate. The first plate may include the third circuit layer 80, and the first plate may be copper foil, a double-sided core board, or other multilayer boards. The second plate may include the fourth circuit layer 90, and the second plate may be copper foil, a double-sided core board, or other multilayer boards.

[0095] It is understandable that before the first connecting layer 60 and the third circuit layer 80, as well as the second connecting layer 70 and the fourth circuit layer 90, are laminated on both sides of the substrate 10 to form a laminate, the first circuit layer 11 and the second circuit layer 12 need to complete the fabrication and quality inspection of the outer pattern circuits, and perform browning treatment on the substrate 10.

[0096] It is also understandable that after the first connection layer 60 and the third circuit layer 80, as well as the second connection layer 70 and the fourth circuit layer 90 are respectively pressed onto both sides of the substrate 10 to form a laminate, layers can be added on the upper and lower sides of the laminate of the composite laminate structure, and patterned circuits, metallized vias, etc. can be made to produce a higher density printed circuit board.

[0097] Thirdly, embodiments of this application provide a printed circuit board, which is manufactured by the printed circuit board manufacturing method of the first aspect.

[0098] The printed circuit board provided in this application embodiment includes a substrate 10 comprising a first circuit layer 11, a second circuit layer 12, and an insulating layer 13 located between the first circuit layer 11 and the second circuit layer 12. The substrate 10 is provided with a female hole 20, and a conductive material 21 is disposed inside the female hole 20. The first circuit layer 11 and / or the second circuit layer 12 are connected to the conductive material 21. By providing a limiting insulating medium and electronic components 50 inside the female hole 20, the limiting insulating medium restricts the electronic components 50 within the female hole 20, and the electronic components 50 are insulated from the conductive material 21. This not only allows the electronic components 50 to be embedded inside the substrate 10, avoiding the electronic components 50 occupying a large portion of the surface area of ​​the substrate 10, but also allows the first circuit layer 11 and / or the second circuit layer 12 to be connected through the conductive material 21, so that circuits can be laid around the electronic components 50, thereby increasing the wiring density and achieving higher integration.

[0099] The above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be included within the protection scope of this application.

Claims

1. A method for manufacturing a printed circuit board, characterized in that, include: A substrate is provided, the substrate including a first circuit layer, a second circuit layer and an insulating layer located between the first circuit layer and the second circuit layer, the substrate having a female hole, the interior of the female hole being disposed of a conductive material, and the first circuit layer and / or the second circuit layer being connected to the conductive material; A limiting insulating medium and electronic components are provided inside the main hole. The limiting insulating medium restricts the electronic components within the main hole, and the electronic components are insulated from the conductive material.

2. The method for manufacturing a printed circuit board according to claim 1, characterized in that, The method for manufacturing the printed circuit board further includes: splitting the conductive material into multiple conductive parts, wherein the first circuit layer is connected to one of the conductive parts, and the second circuit layer is connected to the other conductive part.

3. The method for manufacturing a printed circuit board according to claim 2, characterized in that, The step of splitting the conductive material into multiple conductive parts includes: Multiple cut-off holes are machined through the conductive material, and the cut-off holes divide the conductive material into multiple conductive portions.

4. The method for manufacturing a printed circuit board according to claim 3, characterized in that, After processing multiple cut-off holes through the conductive material, the cut-off holes are filled with a cut-off insulating medium that separates two adjacent conductive portions.

5. The method for manufacturing a printed circuit board according to claim 4, characterized in that, When setting the limiting insulating medium and electronic components in the main hole, the cutting-off insulating medium is filled in the cutting-off hole.

6. The method for manufacturing a printed circuit board according to any one of claims 1 to 5, characterized in that, The provision of a limiting insulating medium and electronic components within the female hole includes: The female hole is filled with a first insulating medium, and the conductive material is located between the inner wall of the female hole and the first insulating medium. A sub-hole is machined in the first insulating medium; Electronic components are disposed within the sub-hole; A second insulating medium is filled between the inner wall of the sub-hole and the electronic component, the second insulating medium abutting against the electronic component, and the limiting insulating medium includes the first insulating medium and the second insulating medium.

7. The method for manufacturing a printed circuit board according to claim 6, characterized in that, The process of filling the space between the inner wall of the sub-hole and the electronic component with a second insulating medium includes: Resin is inserted between the inner wall of the sub-hole and the electronic component, and the second insulating medium includes the resin; And / or, an adhesive layer is provided on at least one side of the substrate, and the adhesive layer and the substrate are pressed together such that a portion of the adhesive layer melts and fills the gap between the inner wall of the sub-hole and the electronic component, wherein the second insulating medium includes at least a portion of the adhesive layer.

8. The method for manufacturing a printed circuit board according to any one of claims 1 to 5, characterized in that, The length direction of the electronic component is parallel to the arrangement direction of the first circuit layer, the insulating layer, and the second circuit layer.

9. A printed circuit board, characterized in that, The printed circuit board includes a substrate, which includes a first circuit layer, a second circuit layer, and an insulating layer located between the first circuit layer and the second circuit layer. The substrate has a female hole, and a conductive material is disposed inside the female hole. The first circuit layer and / or the second circuit layer are connected to the conductive material. A limiting insulating medium and electronic components are disposed inside the female hole. The limiting insulating medium restricts the electronic components within the female hole, and the electronic components are insulated from the conductive material.

10. The printed circuit board according to claim 9, characterized in that, The conductive material includes multiple conductive parts, the first circuit layer is connected to one of the conductive parts, and the second circuit layer is connected to the other conductive part.

11. The printed circuit board according to claim 9, characterized in that, The printed circuit board further includes a first connection layer and a third circuit layer. The first connection layer is located between the third circuit layer and the first circuit layer. The first connection layer is provided with a first connection hole, and a first connection portion is provided inside the first connection hole. The third circuit layer is electrically connected to the electronic component through the first connection portion. And / or, the printed circuit board further includes a second connection layer and a fourth circuit layer. The second connection layer is located between the fourth circuit layer and the second circuit layer. The second connection layer is provided with a second connection hole, and a second connection portion is provided inside the second connection hole. The fourth circuit layer is electrically connected to the electronic component through the second connection portion.

12. The printed circuit board according to any one of claims 9 to 11, characterized in that, The limiting insulating medium includes a first insulating medium and a second insulating medium. The conductive material is located between the inner wall of the main hole and the first insulating medium. A sub-hole is provided on the first insulating medium. The electronic component and the second insulating medium are both located in the sub-hole. The second insulating medium is located between the inner wall of the sub-hole and the electronic component. The second insulating medium abuts against the electronic component.

13. A printed circuit board, characterized in that, The printed circuit board is manufactured by the method for manufacturing a printed circuit board as described in any one of claims 1 to 8.

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