Test conveying device with material rack for semiconductor chip

Abstract

The invention relates to the technical field of conveying, in particular to a semiconductor chip testing and conveying device with a material rest, which comprises a detection table, a shooting module is arranged on one side of the upper surface of the detection table, a sliding plate is mounted on the upper surface of the detection table through a moving mechanism, and a moving plate is fixedly mounted on the upper surface of the sliding plate. A jacking mechanism is embedded in the upper surface of the movable plate, a fixed table is fixedly installed on the upper surface of the detection table and close to the upper portion of the sliding plate, a material placing frame is fixedly embedded in the upper surface of the fixed table and corresponds to the upper portion of the movable plate, and clamping mechanisms are arranged on the two sides of the fixed table respectively; according to the automatic chip conveying and detecting device, batch automatic conveying and detecting of chips are achieved, operation of a worker is not needed in the midway, the guiding effect on a test plate is ensured, and the feeding and discharging process is smoother.

Description

Technical Field

[0001] This invention relates to the field of conveying technology, and more particularly to a test conveying device for semiconductor chips with a material rack. Background Technology

[0002] In semiconductor chip testing, the arrangement of test boards must prioritize accurate positioning, reliable contact, and suitable heat dissipation, while incorporating foolproof structures and anti-static designs. Simultaneously, compatibility with different packaged chips enhances versatility. The conveying process prioritizes linear motor transport to control a stable transmission speed. Positioning sensors synchronize with the testing cycle, and integrated RFID or barcode scanning ensures traceability. Supplemented by buffer devices, emergency stop buttons, and anti-static treatment, these measures prevent test board displacement, chip damage, or electrostatic discharge, collaboratively ensuring both testing accuracy and efficiency.

[0003] Existing conveying devices require the test boards to be gradually positioned onto the moving end of a linear motor, necessitating a robotic arm to handle and load the boards step by step. The robotic arm must grasp, position, and place the test boards one by one, with each action taking 0.5-2 seconds. This is unsuitable for the production capacity demands of high-speed testing equipment, easily causing waiting times at testing stations. During repeated handling, the robotic arm's repetitive positioning errors accumulate, leading to positioning deviations between the test board and the moving end of the linear motor, affecting the accuracy of subsequent testing. Improper control of the robotic arm's gripper pressure can easily cause edge deformation, surface scratches, or damage to chip pads, especially for thin and lightweight test boards, posing a higher risk of damage. Therefore, a semiconductor chip testing conveying device with a material rack is proposed. Summary of the Invention

[0004] The purpose of this invention is to address the shortcomings of the prior art by providing a test delivery device for semiconductor chips with a feed rack.

[0005] To achieve the above objectives, the technical solution adopted by the present invention is as follows: a test conveying device for semiconductor chips with a material rack, comprising a test platform, a shooting module disposed on one side of the upper surface of the test platform, a sliding plate mounted on the upper surface of the test platform via a moving mechanism, a moving plate fixedly mounted on the upper surface of the sliding plate, a lifting mechanism embedded on the upper surface of the moving plate, a fixed platform fixedly mounted on the upper surface of the test platform near the upper part of the sliding plate, a material rack fixedly embedded on the upper surface of the fixed platform corresponding to the upper part of the moving plate, clamping mechanisms disposed on both sides of the fixed platform, limiting plates fixedly connected at the corners of the upper surface of the material rack, a sliding groove formed on the inner surface of the limiting plate, a sliding frame embedded in the inner side of the sliding groove via an elastic mechanism, a guide belt movably embedded in the inner side of the sliding frame, two symmetrical inner support plates disposed on the inner side of the sliding frame near the inner surface of the guide belt, and guide mechanisms disposed on the two sides of the two inner support plates that are close to each other.

[0006] Preferably, the moving mechanism includes a linear motor fixedly mounted on the upper surface of the detection table, the moving end of the linear motor being fixedly connected to the lower surface of the sliding plate, and a connecting pad being fixedly connected between the upper surface of the sliding plate and the lower surface of the moving plate.

[0007] Preferably, the lifting mechanism includes side plates fixedly installed on both sides of the sliding plate. A lifting cylinder and a guide cylinder are fixedly installed on the upper surface of the side plates. A guide post is slidably inserted into the upper end of the guide cylinder. A lifting support is fixedly connected to the upper end of the guide post and the telescopic end of the lifting cylinder. The lifting support slides through the outer surface of the moving plate.

[0008] Preferably, the lower surface of the material rack has a passage opening at the front.

[0009] Preferably, the clamping mechanism includes a clamping cylinder fixedly installed on the upper surface of the fixed platform. The telescopic end of the clamping cylinder is fixedly connected to a side clamping plate. The side clamping plates on both sides are respectively located on both sides of the material placement rack. A guide block is fixedly connected to the front surface of the clamping cylinder. A guide rod slides through the inner side of the guide block. One end of the guide rod is fixedly connected to the side surface of the side clamping plate.

[0010] Preferably, the elastic mechanism includes a buffer cylinder fixedly installed on the inner surface of the sliding groove, a T-shaped post slidably inserted into the port of the buffer cylinder, one end of the T-shaped post being fixedly connected to the edge of the outer surface of the sliding frame, and a return spring provided on the inner side of the buffer cylinder, the return spring being located at the end of the T-shaped post away from the sliding frame.

[0011] Preferably, rotating rollers are rotatably mounted on the upper and lower inner sides of the sliding frame, and the guide belt is fitted onto the outer surface of the two rotating rollers.

[0012] Preferably, the ends of the two inner support plates that are far apart are respectively fixedly connected to a curved section, the curved section being located outside the rotating roller, and the sides of the two inner support plates that are close to each other are respectively provided with comb teeth.

[0013] Preferably, the upper and lower sides of the sliding frame are respectively fixedly connected to transition blocks extending to the outside of the sliding groove, and the outer surface of the transition block is provided with an inclined guide surface.

[0014] Preferably, the guiding mechanism includes side folds fixedly connected to the two sides of the inner support plate. A telescopic rod is fixedly connected to the outer surface of the upper side fold, and a telescopic cylinder is fixedly connected to the outer surface of the lower side fold. A compression spring is provided inside the telescopic cylinder. The lower end of the telescopic rod is slidably inserted into the inner side of the telescopic cylinder. The upper end of the compression spring is fixedly connected to the lower end of the telescopic rod. Four guide blocks are fixedly connected to the inner wall of the sliding frame. An oblique guide groove is opened on the outer surface of each side fold, and the guide block slides through the inner side of the oblique guide groove.

[0015] Compared with the prior art, the present invention has the following beneficial effects: 1. This invention controls the extension of the lifting cylinder to move the lifting support upward and lift the test board. When the second test board (counting from bottom to top) is at the height of the side clamping plate, the lifting cylinder stops. Then, the clamping cylinder is controlled to extend so that the side clamping plate clamps the test board. After that, the lifting cylinder retracts, so that the lifting support moves the first test board down to the surface of the moving plate. Then, by controlling the linear motor, the sliding plate and the moving plate move forward together, moving the test board forward through the inside of the passage and to the front where it is picked up by the suction cup mechanism and inspected by the detection mechanism. This realizes the batch automated conveying and inspection of chips without the need for manual operation. 2. In this invention, as the test plate moves up and down along the inner side of several limiting plates, the guide belt guides the test plate to move smoothly. When the stacked test plates are placed in, they press against the inclined guide surface, causing the sliding frame to slide towards the inner side of the sliding groove, ensuring that the placement of the test plate is not obstructed. The guide belt will contact the edge of the test plate, thereby assisting in the up and down movement. When the test plate presses against the guide belt, it will push the inner support plate, causing the inclined guide groove to slide along the surface of the guide block. The two inner support plates approach each other and move together towards the inner side of the sliding groove. The interlocking comb edges ensure that there is no interference problem during movement. This movement scheme ensures that the contact between the guide belt and the test plate is not too tight, thus preventing the test plate from moving up and down smoothly. The interlocking of the two comb edges allows the guide belt to provide solid support at each position on that side, ensuring the guiding effect on the test plate and making the loading and unloading process smoother. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of a semiconductor chip testing and conveying device with a material rack according to the present invention; Figure 2 This invention relates to a test delivery device for semiconductor chips with a feed rack. Figure 1 Enlarged view of point A in the middle; Figure 3 This is a partial structural schematic diagram of a semiconductor chip testing and conveying device with a material rack according to the present invention; Figure 4 This is a schematic diagram of the moving plate of a semiconductor chip test conveying device with a material rack according to the present invention; Figure 5 This is a schematic diagram of the material rack of a semiconductor chip testing and conveying device with a material rack according to the present invention; Figure 6 This invention relates to a test delivery device for semiconductor chips with a feed rack. Figure 5 Enlarged view at point B in the middle; Figure 7 This is a cross-sectional view of the limiting plate of a semiconductor chip test conveying device with a material rack according to the present invention; Figure 8 This invention relates to a test delivery device for semiconductor chips with a feed rack. Figure 7 Enlarged view at point C; Figure 9 This is a cross-sectional view of the sliding frame of a semiconductor chip test conveying device with a material rack according to the present invention; Figure 10 This invention relates to a test delivery device for semiconductor chips with a feed rack. Figure 9 Enlarged view of point D in the middle.

[0017] The components include: 1. Testing table; 2. Linear motor; 3. Fixed table; 4. Sliding plate; 5. Connecting pad; 6. Moving plate; 7. Lifting support; 8. Side connecting plate; 9. Lifting cylinder; 10. Guide cylinder; 11. Guide column; 12. Material rack; 13. Limiting plate; 14. Through port; 15. Sliding groove; 16. Sliding frame; 17. Transition block; 18. Inclined guide surface; 19. Rotating roller; 20. Guide belt; 21. Inner support plate; 22. Bending section; 23. Side fold; 24. Inclined guide groove; 25. Guide block; 26. Comb spring; 27. Telescopic cylinder; 28. Telescopic rod; 29. ​​Comb edge; 30. T-shaped column; 31. Buffer cylinder; 32. Return spring; 33. Side clamping plate; 34. Clamping cylinder; 35. Guide block; 36. Guide rod; 37. Shooting module; 38. Test plate. Detailed Implementation

[0018] The following description is intended to disclose the invention and enable those skilled in the art to implement it. The preferred embodiments described below are merely examples, and other obvious variations will occur to those skilled in the art.

[0019] like Figures 1-10The semiconductor chip testing and conveying device with a material rack shown includes a testing platform 1. A camera module 37 is provided on one side of the upper surface of the testing platform 1. A sliding plate 4 is installed on the upper surface of the testing platform 1 via a moving mechanism. A moving plate 6 is fixedly installed on the upper surface of the sliding plate 4. A lifting mechanism is embedded on the upper surface of the moving plate 6. A fixed platform 3 is fixedly installed on the upper surface of the testing platform 1, near the upper part of the sliding plate 4. A material rack 12 is fixedly embedded on the upper surface of the fixed platform 3, corresponding to the upper part of the moving plate 6. Clamping mechanisms are provided on both sides of the fixed platform 3. Limiting plates 13 are fixedly connected to the corners of the upper surface of the material rack 12. A sliding groove 15 is opened on the inner surface of the limiting plate 13. A sliding frame 16 is embedded in the inner side of the sliding groove 15 via an elastic mechanism. A guide belt 20 is movably embedded in the inner side of the sliding frame 16. Two symmetrical inner support plates 21 are provided on the inner side of the sliding frame 16, near the inner surface of the guide belt 20. Guide mechanisms are provided on the two sides of the two inner support plates 21 that are close to each other. The camera module 37 enables real-time visual monitoring of the chip, and, in conjunction with the conveyor, dynamically captures the chip's status at the lifting and conveying station.

[0020] The moving mechanism includes a linear motor 2 fixedly mounted on the upper surface of the testing table 1. The moving end of the linear motor 2 is fixedly connected to the lower surface of the sliding plate 4. A connecting pad 5 is fixedly connected between the upper surface of the sliding plate 4 and the lower surface of the moving plate 6. The connecting pad 5 is made of a rigid metal plate to ensure that the moving plate 6 is at a suitable height. The linear motor 2 has the advantages of high speed and high precision in the transport of the test plate 38.

[0021] The lifting mechanism includes side plates 8 fixedly installed on both sides of the sliding plate 4. A lifting cylinder 9 and a guide cylinder 10 are fixedly installed on the upper surface of the side plates 8. A guide post 11 is slidably inserted into the upper end of the guide cylinder 10. The upper end of the guide post 11 and the telescopic end of the lifting cylinder 9 are jointly and fixedly connected to a lifting support 7, which slides through the outer surface of the moving plate 6. During the telescopic process of the lifting cylinder 9, the guide post 11 slides along the inner side of the guide cylinder 10 to ensure the smooth movement of the lifting support 7.

[0022] A passage 14 is provided on the front of the lower surface of the material rack 12. The opening height of the passage 14 is sufficient to ensure that the test plate 38 can pass through.

[0023] The clamping mechanism includes a clamping cylinder 34 fixedly mounted on the upper surface of the fixed platform 3. A side clamping plate 33 is fixedly connected to the telescopic end of the clamping cylinder 34. The side clamping plates 33 are located on both sides of the material rack 12. A guide block 35 is fixedly connected to the front surface of the clamping cylinder 34. A guide rod 36 slides through the inner side of the guide block 35, and one end of the guide rod 36 is fixedly connected to the side surface of the side clamping plate 33. During the telescopic movement of the clamping cylinder 34, the guide rod 36 slides relative to the inner side of the guide block 35, ensuring smooth movement of the side clamping plate 33. When the side clamping plates 33 on both sides approach each other, they can clamp and position the test plate 38 at that height, thus ensuring that only one test plate 38 falls onto the surface of the moving plate 6 each time.

[0024] The elastic mechanism includes a buffer cylinder 31 fixedly installed on the inner surface of the sliding groove 15. A T-shaped post 30 is slidably inserted into the port of the buffer cylinder 31. One end of the T-shaped post 30 is fixedly connected to the edge of the outer surface of the sliding frame 16. A return spring 32 is provided on the inner side of the buffer cylinder 31, located at the end of the T-shaped post 30 away from the sliding frame 16. The elastic force of the return spring 32 pushes the T-shaped post 30, ensuring that the guide strip 20 can partially protrude from the inner side of the sliding groove 15, thereby ensuring that the edge of the test plate 38 can contact the surface of the guide strip 20.

[0025] Rotating rollers 19 are rotatably mounted on the upper and lower inner ends of the sliding frame 16, and guide belts 20 are fitted onto the outer surfaces of the two rotating rollers 19. This is a common installation method for the guide belts 20. When the guide belts 20 move, the rotating rollers 19 rotate relative to the sliding frame 16.

[0026] Two curved sections 22 are fixedly connected to the ends of the two inner support plates 21 that are far apart. The curved sections 22 are located outside the rotating roller 19. The sides of the two inner support plates 21 that are close to each other are provided with comb teeth 29. The two sets of comb teeth 29 are staggered to ensure that the two inner support plates 21 can move close to each other without interference.

[0027] The upper and lower edges of the sliding frame 16 are respectively fixedly connected to transition blocks 17 extending to the outside of the sliding groove 15, and the outer surface of the transition block 17 is provided with inclined guide surfaces 18. With the design of the upper and lower inclined guide surfaces 18, when the test plate 38 contacts the inclined guide surfaces 18, it can push the guide strip 20 toward the inside of the sliding groove 15, ensuring that the test plate 38 can reach the surface of the guide strip 20.

[0028] The guiding mechanism includes side flanges 23 fixedly connected to the two sides of the inner support plate 21. A telescopic rod 28 is fixedly connected to the outer surface of the upper side flange 23, and a telescopic cylinder 27 is fixedly connected to the outer surface of the lower side flange 23. A compression spring 26 is provided inside the telescopic cylinder 27. The lower end of the telescopic rod 28 slides into the inner side of the telescopic cylinder 27, and the upper end of the compression spring 26 is fixedly connected to the lower end of the telescopic rod 28. Four guide blocks 25 are fixedly connected to the inner wall of the sliding frame 16. An inclined guide groove 24 is provided on the outer surface of each side flange 23, and the guide block 25 slides through the inner side of the inclined guide groove 24. The inclined guide groove 24 is inclined to guide the side flange 23 to slide along the inclined direction. When the inner support plate 21 is compressed, the telescopic rod 28 moves downward relative to the telescopic cylinder 27, compressing the compression spring 26, ensuring that the two inner support plates 21 move synchronously in the horizontal direction and move closer to each other in the vertical direction.

[0029] Test boards 38 with semiconductor chips arranged on their surfaces are stacked sequentially in the placement rack 12 and located inside the four limiting plates 13. By controlling the extension of the lifting cylinder 9, the lifting support 7 moves upward, lifting the test boards 38. When the second test board 38 (counting from bottom to top) is at the height of the side clamping plate 33, the lifting cylinder 9 stops. Then, the clamping cylinder 34 is extended, causing the side clamping plate 33 to clamp the test board 38. After that, the lifting cylinder 9 retracts, causing the lifting support 7 to move the first test board 38 down to the surface of the moving plate 6. Then, by controlling the linear motor 2, the sliding plate 4 and the moving plate 6 move forward together, moving the test board 38 forward through the inside of the through-hole 14. When it reaches the front, it is picked up by the suction cup mechanism and inspected by the detection mechanism. This realizes the batch automated conveying and inspection of chips without the need for manual operation.

[0030] As the test plate 38 moves up and down along the inner side of several limiting plates 13, the guide belt 20 guides the test plate 38 to move smoothly. When the stacked test plates 38 are placed in, they press against the inclined guide surface 18, causing the sliding frame 16 to slide towards the inner side of the sliding groove 15, ensuring that the placement of the test plate 38 is not obstructed. The guide belt 20 will contact the edge of the test plate 38, thereby assisting in its up and down movement. When the test plate 38 presses against the guide belt 20, it will push against the inner support plate 21, causing the inclined guide groove 24 to move along the guide block 2. The surface of 5 slides, and the two inner support plates 21 move closer to each other and together toward the inside of the sliding groove 15. The intersecting comb teeth 29 can ensure that there is no interference problem during movement. This movement scheme ensures that the contact between the guide belt 20 and the test plate 38 is not too tight, so as not to cause the test plate 38 to move up and down smoothly. The two comb teeth 29 intersect each other, so that each position of the guide belt 20 on this side can play a solid support role, ensuring the guiding effect on the test plate 38 and making the loading and unloading process smoother.

[0031] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely principles of the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed invention. The scope of protection claimed by the appended claims and their equivalents is defined.

Claims

1. A test delivery device for semiconductor chips with a material rack, comprising a test stage (1), wherein a camera module (37) is disposed on one side of the upper surface of the test stage (1), characterized in that: A sliding plate (4) is mounted on the upper surface of the testing platform (1) via a moving mechanism. A moving plate (6) is fixedly mounted on the upper surface of the sliding plate (4). A lifting mechanism is embedded on the upper surface of the moving plate (6). A fixed platform (3) is fixedly mounted on the upper surface of the testing platform (1) near the upper part of the sliding plate (4). A material rack (12) is fixedly embedded on the upper surface of the fixed platform (3) corresponding to the upper part of the moving plate (6). Clamping mechanisms are respectively provided on both sides of the fixed platform (3). The material rack (12) 2) Limiting plates (13) are fixedly connected at the corners of the upper surface. The inner surface of the limiting plate (13) is provided with a sliding groove (15). The inner side of the sliding groove (15) is fitted with a sliding frame (16) through an elastic mechanism. The inner side of the sliding frame (16) is movably fitted with a guide belt (20). The inner side of the sliding frame (16) and the inner surface close to the guide belt (20) are provided with two symmetrical inner support plates (21). The two inner support plates (21) are respectively provided with guide mechanisms on the two sides close to each other.

2. The semiconductor chip testing and conveying device with a feed rack according to claim 1, characterized in that: The moving mechanism includes a linear motor (2) fixedly installed on the upper surface of the detection table (1). The moving end of the linear motor (2) is fixedly connected to the lower surface of the sliding plate (4). A connecting pad (5) is fixedly connected between the upper surface of the sliding plate (4) and the lower surface of the moving plate (6).

3. The semiconductor chip testing and conveying device with a rack according to claim 1, characterized in that: The lifting mechanism includes side plates (8) fixedly installed on both sides of the sliding plate (4). A lifting cylinder (9) and a guide cylinder (10) are fixedly installed on the upper surface of the side plates (8). A guide post (11) is slidably inserted into the upper end of the guide cylinder (10). The upper end of the guide post (11) and the telescopic end of the lifting cylinder (9) are fixedly connected to a lifting support (7). The lifting support (7) slides through the outer surface of the moving plate (6).

4. The semiconductor chip testing and conveying device with a rack according to claim 1, characterized in that: The lower surface of the material rack (12) has a passage opening (14).

5. A test conveying device for semiconductor chips with a feed rack according to claim 1, characterized in that: The clamping mechanism includes a clamping cylinder (34) fixedly installed on the upper surface of the fixed platform (3). The telescopic end of the clamping cylinder (34) is fixedly connected to a side clamping plate (33). The side clamping plates (33) on both sides are located on both sides of the material rack (12). The front surface of the clamping cylinder (34) is fixedly connected to a guide block (35). The inner side of the guide block (35) is slidably connected to a guide rod (36). One end of the guide rod (36) is fixedly connected to the side surface of the side clamping plate (33).

6. A test conveying device for semiconductor chips with a feed rack according to claim 1, characterized in that: The elastic mechanism includes a buffer cylinder (31) fixedly installed on the inner surface of the sliding groove (15). A T-shaped post (30) is slidably inserted into the port of the buffer cylinder (31). One end of the T-shaped post (30) is fixedly connected to the edge of the outer surface of the sliding frame (16). A return spring (32) is provided on the inner side of the buffer cylinder (31). The return spring (32) is located at the end of the T-shaped post (30) away from the sliding frame (16).

7. A test conveying device for semiconductor chips with a feed rack according to claim 1, characterized in that: The sliding frame (16) has rotating rollers (19) mounted on its inner upper and lower ends respectively, and the guide belt (20) is fitted on the outer surface of the two rotating rollers (19).

8. A test conveying device for semiconductor chips with a feed rack according to claim 1, characterized in that: The two inner support plates (21) are respectively fixedly connected to a curved section (22) at their far ends. The curved section (22) is located outside the rotating roller (19). The two inner support plates (21) are respectively provided with a comb tooth edge (29) on their close sides.

9. A test conveying device for semiconductor chips with a feed rack according to claim 1, characterized in that: The upper and lower sides of the sliding frame (16) are respectively fixedly connected to transition blocks (17) extending to the outside of the sliding groove (15), and the outer surface of the transition block (17) is provided with a sloping guide surface (18).

10. A test conveying device for semiconductor chips with a feed rack according to claim 1, characterized in that: The guiding mechanism includes side folds (23) fixedly connected to the two sides of the inner support plate (21). A telescopic rod (28) is fixedly connected to the outer surface of the upper side fold (23), and a telescopic cylinder (27) is fixedly connected to the outer surface of the lower side fold (23). A compression spring (26) is provided on the inner side of the telescopic cylinder (27). The lower end of the telescopic rod (28) is slidably inserted into the inner side of the telescopic cylinder (27). The upper end of the compression spring (26) is fixedly connected to the lower end of the telescopic rod (28). Four guide blocks (25) are fixedly connected to the inner wall of the sliding frame (16). An oblique guide groove (24) is opened on the outer surface of each side fold (23). The guide block (25) slides through the inner side of the oblique guide groove (24).

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