Method for conducting FPC wiring between liquid crystal substrate and driving IC

Abstract

The invention relates to a method for conducting FPC wiring between a liquid crystal substrate and a driving IC and a storage medium, and belongs to the technical field of electronic design automation. The method comprises the steps that IC teeth and FPC teeth are grouped according to the electric signal function and sequence to form tooth group pairs CP [i]; respectively drawing extension lines in the extension direction of the reference line section by taking each tooth group as a unit to obtain four extension lines and four extension points; connecting extension points of extension lines on the same side of the tooth group pair CP [i] to obtain a tooth group wiring B [i]; performing cyclic detection and adjustment on the tooth group wires until all the tooth group wires meet the minimum wire arrangement spacing value, the minimum wire width value and the target impedance value; and performing wiring space adjustment on tooth group wiring. According to the method, efficient wiring of the computer can be achieved, the accuracy of wiring impedance and the wiring attractiveness are improved, the labor cost and the time cost are saved, the trial and error cost is reduced, and improvement of the design efficiency of the liquid crystal panel is promoted.

Description

Technical Field

[0001] This invention belongs to the field of electronic design automation technology. Specifically, this invention relates to a method for performing FPC wiring between a liquid crystal substrate and a driver IC, and a storage medium. Background Technology

[0002] In the field of LCD panel design, EDA (Electronic Design Automation) software tools are commonly used to implement IC-FPC constant resistance routing, equal resistance routing, and other wire-aided design functions. IC-FPC refers to the FPC (Flexible Printed Circuit) wiring connecting the pins of the LCD panel driver IC chip to the LCD substrate. High-precision wiring is typically required to meet signal integrity requirements. The LCD driver IC controls the TFT switches on the LCD substrate through signals sent by the FPC, thereby adjusting the voltage and brightness of each pixel. The substrate itself does not directly process signals but relies on the driver IC and FPC to complete the driving task. One end of the FPC has IC teeth for electrical connection to the pins of the driver IC, and the other end has FPC teeth for connection to the LCD substrate via conductive adhesive.

[0003] Current EDA technologies for IC-FPC routing employ a manual edge-align method (a routing method where signal lines are aligned along the edges of the chip or connector). However, depending on the IC design requirements, each signal port has different impedance requirements. Manually routing and adjusting the routing configuration to match the impedance values ​​is complex, requiring repeated cycles of "routing-impedance verification-routing adjustment-impedance verification," which is time-consuming. Furthermore, manual routing often results in some trace impedances, trace widths, or spacing not meeting design requirements, necessitating repeated adjustments to the routing configuration to improve impedance values ​​and to the routing positions to improve trace widths and spacing. These issues often overlap, requiring engineers to perform a large amount of repetitive routing work.

[0004] At the same time, such as Figure 1 As shown, due to the dense arrangement of IC pins and FPC pins, the total area of ​​space available for routing between IC pins and FPC pins is very limited. Changing the shape and position of a single line often has a chain reaction, and eventually several lines need to be readjusted and re-laid out. Under the condition of meeting various constraints, the final routing shape after adjustment is often unpredictable, often resulting in strange wiring shapes that affect the aesthetics of the product. Summary of the Invention

[0005] To address the aforementioned issues, this invention discloses a method for FPC wiring between a liquid crystal substrate and a driver IC. This computer-based automatic calculation and wiring solution solves the problems of repeated manual adjustments, errors during wiring calculations, high labor intensity, and low design efficiency. It improves the accuracy of wiring impedance and the aesthetics of wiring, thereby increasing product design efficiency.

[0006] A first aspect of the present invention provides a method for performing FPC wiring between a liquid crystal substrate and a driver IC, comprising the following steps:

[0007] S1, group IC teeth and FPC teeth according to their electrical signal functions and order. Teeth with the same function and adjacent teeth are assigned to IC tooth group C[i] and FPC tooth group P[i] respectively. IC tooth group C[i] and FPC tooth group P[i] with the same sequence number form a tooth group pair CP[i], where i is the tooth group number;

[0008] S2, taking each tooth group as a unit, taking the outer edge of the left and right lateral teeth of the tooth group as the baseline line segment, extend the line segment outwards to obtain 4 extension lines and 4 extension points;

[0009] S3, taking each tooth group as a unit, connect the extension points of the same side extension line of the tooth group to CP[i] to obtain the tooth group wiring B[i];

[0010] S4, perform cyclic detection and adjustment of the tooth group wiring until all tooth group wiring meets the minimum wiring spacing value and minimum line width value;

[0011] S5, perform cyclic detection and adjustment of the tooth group wiring until each tooth group wiring meets its target impedance value;

[0012] S6, adjusts the wiring space for the dental assembly, specifically including:

[0013] S6.1, adjust the wiring space by aligning it to both sides;

[0014] S6.2, adjust the wiring space in a center-aligned manner.

[0015] In a second aspect, the present invention provides a processor-readable storage medium storing a computer program, wherein when the processor executes the computer program, it implements the method for performing FPC wiring between a liquid crystal substrate and a driver IC as described in the first aspect of the present invention.

[0016] The advantages of this invention compared to the prior art are:

[0017] This invention, based on a computer-automated calculation and wiring solution, solves the problems of repeated manual adjustments, errors during wiring calculations, high labor intensity, and low design efficiency. It enables efficient computer-aided wiring, improves the accuracy of wiring impedance and the aesthetics of wiring, saves labor and time costs, reduces trial and error costs, and promotes improved design efficiency. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of an IC tooth rack and an FPC tooth rack provided for an embodiment of the present invention.

[0019] Figure 2 This is a schematic diagram of the shape of a dental wiring B[i] provided in an embodiment of the present invention.

[0020] Figure 3 This is a schematic diagram illustrating a dental wiring arrangement where the spacing is less than the minimum wiring spacing value, as provided in an embodiment of the present invention.

[0021] Figure 4 This is a schematic diagram illustrating a dental wiring method where the line width is less than the minimum line width value, provided as an embodiment of the present invention.

[0022] Figure 5 This is a schematic diagram of wiring adjustment provided in an embodiment of the present invention.

[0023] Figure 6 This is a schematic diagram of a wiring space adjustment method that aligns to both sides, provided by an embodiment of the present invention.

[0024] Figure 7 This is a schematic diagram showing the result of adjusting the wiring space by aligning it to both sides, as provided in an embodiment of the present invention.

[0025] Figure 8 This is a schematic diagram of a wiring space adjustment method for center alignment provided in an embodiment of the present invention.

[0026] Figure 9 This is a flowchart illustrating a method for FPC wiring between a liquid crystal substrate and a driver IC, provided as an embodiment of the present invention. Detailed Implementation

[0027] The technical solutions of the embodiments of this application will be clearly described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application are within the scope of protection of this application.

[0028] The terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such use of data can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class and the number of objects is not limited; for example, a first object can be one or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0029] Method Implementation Examples

[0030] This invention discloses a method for FPC wiring between a liquid crystal substrate and a driver IC. The computer-based automatic calculation and wiring solution solves the problems of repeated manual adjustments, errors in wiring calculation, high labor intensity, and low design efficiency. It improves the accuracy of wiring impedance and the aesthetics of wiring, thereby improving product design efficiency.

[0031] like Figures 1 to 9 As shown. A first aspect of the present invention provides a method for performing FPC wiring between a liquid crystal substrate and a driver IC, specifically including:

[0032] S1. Group IC teeth and FPC teeth according to their electrical signal functions and order. Teeth with the same function and adjacent teeth are assigned to IC tooth group C[i] and FPC tooth group P[i] respectively. IC tooth group C[i] and FPC tooth group P[i] with the same sequence number form a tooth group pair CP[i], where i is the tooth group number.

[0033] This step allows the IC tooth group C[i] and FPC tooth group P[i] to be arranged in a sequential order, facilitating subsequent wiring between tooth groups with the same sequence number i. The electrical signal function of the tooth group to CP[i] is jointly defined by the electrical functions of the FPD driver IC chip pins and the FPD LCD panel pins.

[0034] S2, taking each tooth group as a unit, and using the outer edges of the left and right lateral teeth of the tooth group as the baseline segment, extend the baseline segment outwards to obtain 4 extension lines and 4 extension points. Specifically, this includes:

[0035] S2.1, the outer extension direction of the baseline segment of IC tooth group C[i] points to FPC tooth group, the lengths of the two extension lines are set to Gi1 and Gi2 respectively, and the endpoints of the newly obtained extension lines are IC extension point Di1 and IC extension point Di2;

[0036] S2.2, the outer extension direction of the baseline segment of the FPC tooth group P[i] points to the IC tooth group, and the lengths of the two extension lines are set to Gi3 and Gi4 respectively. The endpoints of the newly obtained extension lines are FPC extension point Di3 and FPC extension point Di4.

[0037] Among them, IC extension point Di1 and FPC extension point Di3 are on the same side of CP[i] of the tooth group, and IC extension point Di2 and FPC extension point Di4 are on the same side of CP[i] of the tooth group.

[0038] The values ​​of Gi1, Gi2, Gi3, and Gi4 cannot exceed half the vertical distance between the IC tooth rack and the FPC tooth rack.

[0039] Optionally, when taking the first value, Gi1, Gi2, Gi3, and Gi4 are randomly selected from a preset range.

[0040] Optionally, the same value can be randomly selected within a preset range as the initial value for G11, G12, G13, G14, ..., Gi1, Gi2, Gi3, Gi4, ..., Gn1, Gn2, Gn3, Gn4. n is the number of tooth groups.

[0041] The units for Gi1, Gi2, Gi3, and Gi4 are routing grid points, and the specific unit is related to the user-defined grid size.

[0042] S3, taking each tooth group as a unit, connect the extension points of the same-side extension line of the tooth group to CP[i] to obtain the tooth group wiring B[i]. Specifically, it includes:

[0043] S3.1, the IC extension point Di1 and the FPC extension point Di3 are on the same side of the tooth group pair CP[i]. Draw a line connecting the two points to obtain the straight line L(i1, i3);

[0044] S3.2, the IC extension point Di2 and the FPC extension point Di4 are on the same side of the tooth group pair CP[i]. Draw a line connecting the two points to obtain the straight line L(i2, i4);

[0045] S3.3, fill the internal area enclosed by the two extended lines of IC tooth group C[i], the straight line L(i1, i3), the two extended lines of FPC tooth group P[i], and the straight line L(i2, i4) with PCB wiring to obtain tooth group wiring B[i].

[0046] like Figure 2 The diagram shows the shape of the tooth group wiring B[i].

[0047] S4, perform cyclical checks and adjustments on the tooth group wiring until all tooth group wiring meets the minimum wire spacing and minimum wire width values. Specifically, this includes:

[0048] S4.1 Calculate the spacing between adjacent dental wiring groups and determine whether the spacing between dental wiring groups is greater than or equal to the minimum wiring spacing value. If not, adjust the values ​​of Gi1, Gi2, Gi3, and Gi4 until the spacing between dental wiring groups is greater than or equal to the minimum wiring spacing value.

[0049] S4.2 Calculate the line width of the dental wiring B[i] and determine whether the line width of the dental wiring B[i] is greater than or equal to the minimum line width value. If not, adjust the values ​​of Gi1, Gi2, Gi3, and Gi4 until the line width of the dental wiring B[i] is greater than or equal to the minimum line width value.

[0050] S4.3, repeat steps S4.1 and S4.2 until all tooth group wiring meets the minimum wire spacing value and minimum wire width value.

[0051] like Figure 3 The diagram shows a dental wiring arrangement where the spacing is less than the minimum wiring spacing value.

[0052] like Figure 4 The diagram shows a dental wiring layout where the line width is less than the minimum line width value.

[0053] S5 involves cyclically checking and adjusting the wiring of each tooth group until all wiring in each group meets its target impedance value. Specifically, this includes:

[0054] S5.1 Calculate the wiring impedance Zi1 of the tooth group wiring B[i], and determine whether the wiring impedance Zi1∈[Zi0-△Z, Zi0+△Z] is true. Zi0 is the target impedance, and △Z is the impedance error.

[0055] In this step, the wiring impedance Zi1 is automatically calculated based on the selected FPC substrate and metal layer materials, the actual wiring length, width, thickness, and positional relationships. The target impedance Zi0 is obtained by looking up a table. The unit of impedance is Ω.

[0056] The FPD LCD panel and FPD driver IC chip have strict target impedance matching requirements for each wiring. The target impedance Zi0 can be saved in advance in the device parameter configuration table and recalled at any time when needed.

[0057] S5.2 If not true, adjust the tooth group wiring B[i] according to the wiring adjustment mode until the wiring impedance Zi1∈[Zi0-△Z, Zi0+△Z] is true.

[0058] S5.3, execute step S4 until all tooth group wiring meets the minimum wire spacing value and minimum wire width value.

[0059] S5.4, repeat steps S5.1 and S5.3 until each group of teeth meets its target impedance value.

[0060] After completing step S5.4, each tooth group wiring can meet its target impedance value, and all tooth group wiring can meet the minimum wire spacing value and minimum wire width value.

[0061] The wiring adjustment mode specifically includes any one or a combination of steps S10.1 to S10.6:

[0062] S10.1 Extend IC point Di1 and draw a line segment of length Gi5 in the direction perpendicular to the FPC tooth bar. The new point obtained is the impedance adjustment point Di1'. The broken line V((i1, i1'), (i1', i3)) is used to replace the straight line L(i1, i3).

[0063] S10.2, extend IC point Di2 and draw a line segment of length Gi6 in the direction perpendicular to the FPC tooth bar. The new point obtained is the impedance adjustment point Di2'. The broken line V((i2, i2'), (i2', i4)) is used to replace the straight line L(i2, i4).

[0064] S10.3, extend the FPC point Di3 and draw a line segment of length Gi7 in the direction perpendicular to the IC tooth bar. The new point obtained is the impedance adjustment point Di3'. The broken line V((i1, i3'), (i3', i3)) is used to replace the straight line L(i1, i3).

[0065] S10.4, extend the FPC point Di4 and draw a line segment of length Gi8 in the direction perpendicular to the IC tooth bar. The new point obtained is the impedance adjustment point Di4'. The broken line V((i2, i4'), (i4', i4)) is used to replace the straight line L(i2, i4).

[0066] S10.5, extend IC point Di1 and draw a line segment of length Gi5 in the direction perpendicular to the FPC tooth rack to obtain the new point Di1', which is the impedance adjustment point; extend FPC point Di3 and draw a line segment of length Gi7 in the direction perpendicular to the IC tooth rack to obtain the new point Di3', which is the impedance adjustment point. The resulting broken line V((i1, i1'), (i1', i3'), (i3', i3)) is used to replace the straight line L(i1, i3).

[0067] S10.6, extend IC point Di2 and draw a line segment of length Gi6 in the direction perpendicular to the FPC tooth rack to obtain the new point Di2', which is the impedance adjustment point; extend FPC point Di4 and draw a line segment of length Gi8 in the direction perpendicular to the IC tooth rack to obtain the new point Di4', which is the impedance adjustment point. The resulting broken line V((i2, i2'), (i2', i4'), (i4', i4)) is used to replace the straight line L(i2, i4).

[0068] Among them, the values ​​of Gi5 to Gi8 cannot exceed half of the vertical distance between the IC tooth rack and the FPC tooth rack.

[0069] Preferably, when taking the first value, Gi5 to Gi8 are randomly selected from a preset range.

[0070] The unit for Gi5 to Gi8 is the wiring grid, and the specific unit is related to the user-defined grid size.

[0071] By selecting any one or a combination of steps S10.1 to S10.6, the wiring resistance can be adjusted to increase or decrease the wiring impedance value so that the wiring impedance meets the design requirements of the target impedance.

[0072] like Figure 5 The diagram shown is an example of executing step S10.2 with IC tooth group C[i] and executing step S10.1 with IC tooth group C[i+1].

[0073] Figure 5 In the process, after IC tooth group C[i] performs step S10.2, the right contour wiring becomes wider and the impedance decreases. After IC tooth group C[i+1] performs step S10.1, the left contour wiring becomes narrower and the impedance increases.

[0074] S6, adjusts the wiring space for the dental wiring group.

[0075] In practical design, it is often necessary to adjust the routing space of the dental assembly. Sometimes, the IC-FPC routing needs to be aligned to both sides, that is, the left dental assembly is aligned to the left and the right dental assembly is aligned to the right. Other times, the IC-FPC routing needs to be aligned to the center, that is, the two dental assemblies are aligned to the center. Therefore, step S6 specifically includes two spatial adjustment methods: S6.1 and S6.2.

[0076] S6.1, adjust the wiring space by aligning it to both sides.

[0077] like Figure 6 As shown, in order to adjust the wiring pattern to align with both sides, the left half of the dental group is aligned and wired from the leftmost end to the left, and the right half of the dental group is aligned and wired from the rightmost end to the right, maintaining the minimum wire spacing during the wiring process.

[0078] Step S6.1 specifically includes:

[0079] S6.1.1, divide the tooth group wiring B[1] to B[n] into two equal parts, left and right, and execute the left alignment wiring process for the left tooth group and the right alignment wiring process for the right tooth group respectively. n is generally an even number. If it is an odd number, those skilled in the art can adjust it according to the actual situation.

[0080] S6.1.2, for tooth group wiring B[1] to tooth group wiring B[n / 2], the left-side tooth group left alignment wiring process is executed sequentially, specifically including:

[0081] S6.1.2.1 Calculate the line width of the dental wiring B[i] and determine whether the line width of the dental wiring B[i] is greater than or equal to the minimum line width value. If not, adjust the values ​​of Gi1, Gi2, Gi3, and Gi4, or adjust the dental wiring B[i] according to the wiring adjustment mode until the line width of the dental wiring B[i] is greater than or equal to the minimum line width value.

[0082] S6.1.2.2 Calculate the wiring impedance Zi1 of the dental wiring group B[i] and determine whether the wiring impedance Zi1∈[Zi0-△Z, Zi0+△Z] is true; if not, adjust the dental wiring group B[i] according to the wiring adjustment mode until the wiring impedance Zi1∈[Zi0-△Z, Zi0+△Z] is true.

[0083] S6.1.2.3, repeat S6.1.2.1 to S6.1.2.2 until the tooth group wiring B[i] simultaneously satisfies the condition that the line width of the tooth group wiring B[i] is greater than or equal to the minimum line width value and the wiring impedance Zi1∈[Zi0-△Z, Zi0+△Z] is satisfied, and the wiring of the tooth group wiring B[i] is completed;

[0084] S6.1.2.4 Calculate the distance between B[i+1] and B[i], and determine whether the distance between B[i+1] and B[i] equals the minimum wire spacing value. If not, adjust the G(i+1)1, G(i+1)2, G(i+1)3, and G(i+1)4 values ​​of B[i+1], or adjust the tooth group wiring B[i+1] according to the wiring adjustment mode until the distance between B[i+1] and B[i] equals the minimum wire spacing value.

[0085] S6.1.2.5, perform steps S6.1.2.1 to S6.1.2.3 on the tooth group wiring B[i+1] to complete the wiring of the tooth group wiring B[i+1].

[0086] S6.1.3, for tooth group routing B[n] to tooth group routing B[n / 2 +1], the right-aligned routing process for the right tooth group is executed sequentially, specifically including:

[0087] S6.1.3.1 Calculate the line width of the dental wiring B[i] and determine whether the line width of the dental wiring B[i] is greater than or equal to the minimum line width value. If not, adjust the values ​​of Gi1, Gi2, Gi3, and Gi4, or adjust the dental wiring B[i] according to the wiring adjustment mode until the line width of the dental wiring B[i] is greater than or equal to the minimum line width value.

[0088] S6.1.3.2 Calculate the wiring impedance Zi1 of the dental wiring group B[i] and determine whether the wiring impedance Zi1∈[Zi0-△Z, Zi0+△Z] is true; if not, adjust the dental wiring group B[i] according to the wiring adjustment mode until the wiring impedance Zi1∈[Zi0-△Z, Zi0+△Z] is true.

[0089] S6.1.3.3, repeat S6.1.3.1 to S6.1.3.2 until the tooth group wiring B[i] simultaneously satisfies the condition that the line width of the tooth group wiring B[i] is greater than or equal to the minimum line width value and the wiring impedance Zi1∈[Zi0-△Z, Zi0+△Z] is satisfied, and the wiring of the tooth group wiring B[i] is completed;

[0090] S6.1.3.4 Calculate the distance between B[i-1] and B[i], and determine whether the distance between B[i-1] and B[i] equals the minimum wire spacing value. If not, adjust the G(i-1)1, G(i-1)2, G(i-1)3, and G(i-1)4 values ​​of B[i-1], or adjust the tooth group wiring B[i-1] according to the wiring adjustment mode until the distance between B[i-1] and B[i] equals the minimum wire spacing value.

[0091] S6.1.3.5, perform steps S6.1.3.1 to S6.1.3.3 on the tooth group wiring B[i-1] to complete the wiring of the tooth group wiring B[i-1].

[0092] After step S6.1, there will generally be some extra space between B[n / 2] and B[n / 2 +1], such as... Figure 7 This is a schematic diagram showing the result after adjusting the wiring space by aligning it to both sides. Figure 7 The area within the middle box represents the remaining space in the center after adjustment. To eliminate this remaining space, you can adjust the wiring space using step S6.2.

[0093] S6.2, adjust the wiring space in a center-aligned manner.

[0094] like Figure 8 As shown, in order to adjust the wiring pattern towards the center, the left half of the tooth group is wired from the rightmost end towards the center, and the right half of the tooth group is wired from the leftmost end towards the center, maintaining the minimum line spacing during the wiring process.

[0095] Step S6.2 specifically includes:

[0096] S6.2.1 Calculate the spacing between B[n / 2] and B[n / 2 +1], and determine whether the spacing between B[n / 2] and B[n / 2 +1] equals the minimum wire spacing value. If not, subtract the minimum wire spacing value from the distance between B[n / 2] and B[n / 2 +1] and divide it into equal parts. Adjust the values ​​of G(n / 2)1, G(n / 2)2, G(n / 2)3, G(n / 2)4, G(n / 2 +1)1, G(n / 2 +1)2, G(n / 2 +1)3, and G(n / 2 +1)4, or adjust the tooth group wiring B[n / 2] and B[n / 2 +1] according to the wiring adjustment mode until the spacing between B[n / 2] and B[n / 2 +1] equals the minimum wire spacing value.

[0097] S6.2.2, for tooth group wiring B[n / 2] to tooth group wiring B[1], the left tooth group alignment wiring process is executed sequentially, specifically including:

[0098] S6.2.2.1 Calculate the line width of the dental wiring B[i] and determine whether the line width of the dental wiring B[i] is greater than or equal to the minimum line width value. If not, adjust the values ​​of Gi1, Gi2, Gi3, and Gi4, or adjust the dental wiring B[i] according to the wiring adjustment mode until the line width of the dental wiring B[i] is greater than or equal to the minimum line width value.

[0099] S6.2.2.2 Calculate the wiring impedance Zi1 of the dental wiring group B[i] and determine whether the wiring impedance Zi1∈[Zi0-△Z, Zi0+△Z] is true; if not, adjust the dental wiring group B[i] according to the wiring adjustment mode until the wiring impedance Zi1∈[Zi0-△Z, Zi0+△Z] is true.

[0100] S6.2.2.3, repeat S6.2.2.1 to S6.2.2.2 until the tooth group wiring B[i] simultaneously satisfies the condition that the line width of the tooth group wiring B[i] is greater than or equal to the minimum line width value and the wiring impedance Zi1∈[Zi0-△Z,Zi0+△Z] is satisfied, and the wiring of the tooth group wiring B[i] is completed;

[0101] S6.2.2.4 Calculate the distance between B[i-1] and B[i], and determine whether the distance between B[i-1] and B[i] equals the minimum wire spacing value. If not, adjust the G(i-1)1, G(i-1)2, G(i-1)3, and G(i-1)4 values ​​of B[i-1], or adjust the tooth group wiring B[i-1] according to the wiring adjustment mode until the distance between B[i-1] and B[i] equals the minimum wire spacing value.

[0102] S6.2.2.5, perform steps S6.2.2.1 to S6.2.2.3 on the tooth group wiring B[i-1] to complete the wiring of the tooth group wiring B[i-1].

[0103] S6.2.3, for tooth group routing B[n / 2 +1] to tooth group routing B[n], the right tooth group alignment routing process is executed sequentially, specifically including:

[0104] S6.2.3.1 Calculate the line width of the dental wiring B[i] and determine whether the line width of the dental wiring B[i] is greater than or equal to the minimum line width value. If not, adjust the values ​​of Gi1, Gi2, Gi3, and Gi4, or adjust the dental wiring B[i] according to the wiring adjustment mode until the line width of the dental wiring B[i] is greater than or equal to the minimum line width value.

[0105] S6.2.3.2 Calculate the wiring impedance Zi1 of the dental wiring group B[i] and determine whether the wiring impedance Zi1∈[Zi0-△Z, Zi0+△Z] is true; if not, adjust the dental wiring group B[i] according to the wiring adjustment mode until the wiring impedance Zi1∈[Zi0-△Z, Zi0+△Z] is true.

[0106] S6.2.3.3, repeat S6.2.3.1 to S6.2.3.2 until the tooth group wiring B[i] simultaneously satisfies the condition that the line width of the tooth group wiring B[i] is greater than or equal to the minimum line width value and the wiring impedance Zi1∈[Zi0-△Z, Zi0+△Z] is satisfied, and the wiring of the tooth group wiring B[i] is completed;

[0107] S6.2.3.4 Calculate the distance between B[i+1] and B[i], and determine whether the distance between B[i+1] and B[i] equals the minimum wire spacing value. If not, adjust the values ​​of G(i+1)1, G(i+1)2, G(i+1)3, and G(i+1)4 of B[i+1], or adjust the tooth group wiring B[i+1] according to the wiring adjustment mode until the distance between B[i+1] and B[i] equals the minimum wire spacing value.

[0108] S6.2.3.5, perform steps S6.2.3.1 to S6.2.3.3 on the tooth group wiring B[i+1] to complete the wiring of the tooth group wiring B[i+1].

[0109] In a second aspect, the present invention provides a processor-readable storage medium storing a computer program, wherein when the processor executes the computer program, it implements the method for performing FPC wiring between a liquid crystal substrate and a driver IC as described in the first aspect of the present invention.

[0110] The embodiments of this application have been described above with reference to the accompanying drawings. However, this application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of this application.

Claims

1. A method for performing FPC wiring between a liquid crystal substrate and a driver IC, characterized in that, Includes the following steps: S1, group IC teeth and FPC teeth according to their electrical signal functions and order. Teeth with the same function and adjacent teeth are assigned to IC tooth group C[i] and FPC tooth group P[i] respectively. IC tooth group C[i] and FPC tooth group P[i] with the same sequence number form a tooth group pair CP[i], where i is the tooth group number; S2, taking each tooth group as a unit, taking the outer edge of the left and right lateral teeth of the tooth group as the baseline line segment, extend the line segment outwards to obtain 4 extension lines and 4 extension points; S3, taking each tooth group as a unit, connect the extension points of the same side extension line of the tooth group to CP[i] to obtain the tooth group wiring B[i]; S4, perform cyclic detection and adjustment of the tooth group wiring until all tooth group wiring meets the minimum wiring spacing value and minimum line width value; S5, perform cyclic detection and adjustment of the tooth group wiring until each tooth group wiring meets its target impedance value; S6, adjusts the wiring space for the dental assembly, specifically including: S6.1, adjust the wiring space by aligning it to both sides; S6.2, adjust the wiring space in a center-aligned manner.

2. The method for performing FPC wiring between a liquid crystal substrate and a driver IC according to claim 1, characterized in that, Step S2 specifically includes: S2.1, the outer extension direction of the baseline segment of IC tooth group C[i] points to FPC tooth group, the lengths of the two extension lines are set to Gi1 and Gi2 respectively, and the endpoints of the newly obtained extension lines are IC extension point Di1 and IC extension point Di2; S2.2, the outer extension direction of the baseline segment of the FPC tooth group P[i] points to the IC tooth group, and the lengths of the two extension lines are set to Gi3 and Gi4 respectively. The endpoints of the newly obtained extension lines are FPC extension point Di3 and FPC extension point Di4.

3. The method for performing FPC wiring between a liquid crystal substrate and a driver IC according to claim 2, characterized in that, Step S3 specifically includes: S3.1, the IC extension point Di1 and the FPC extension point Di3 are on the same side of the tooth group pair CP[i]. Draw a line connecting the two points to obtain the straight line L(i1, i3); S3.2, the IC extension point Di2 and the FPC extension point Di4 are on the same side of the tooth group pair CP[i]. Draw a line connecting the two points to obtain the straight line L(i2, i4); S3.3, fill the internal area enclosed by the two extended lines of IC tooth group C[i], the straight line L(i1, i3), the two extended lines of FPC tooth group P[i], and the straight line L(i2, i4) with PCB wiring to obtain tooth group wiring B[i].

4. The method for performing FPC wiring between a liquid crystal substrate and a driver IC according to claim 3, characterized in that, Step S4 specifically includes: S4.1 Calculate the spacing between adjacent dental wiring groups and determine whether the spacing between dental wiring groups is greater than or equal to the minimum wiring spacing value. If not, adjust the values ​​of Gi1, Gi2, Gi3, and Gi4 until the spacing between dental wiring groups is greater than or equal to the minimum wiring spacing value. S4.2 Calculate the line width of the dental wiring B[i] and determine whether the line width of the dental wiring B[i] is greater than or equal to the minimum line width value. If not, adjust the values ​​of Gi1, Gi2, Gi3, and Gi4 until the line width of the dental wiring B[i] is greater than or equal to the minimum line width value. S4.3, repeat steps S4.1 and S4.2 until all tooth group wiring meets the minimum wire spacing value and minimum wire width value.

5. A method for performing FPC wiring between a liquid crystal substrate and a driver IC according to claim 4, characterized in that, The S5 steps specifically include: S5.1 Calculate the wiring impedance Zi1 of the tooth group wiring B[i] and determine whether the wiring impedance Zi1∈[Zi0-△Z, Zi0+△Z] is true; where Zi0 is the target impedance and △Z is the impedance error. S5.2 If not true, adjust the tooth group wiring B[i] according to the wiring adjustment mode until the wiring impedance Zi1∈[Zi0-△Z, Zi0+△Z] is true; S5.3, execute step S4 until all tooth group wiring meets the minimum wiring spacing value and minimum line width value; S5.4, repeat steps S5.1 and S5.3 until each group of teeth meets its target impedance value.

6. A method for performing FPC wiring between a liquid crystal substrate and a driver IC according to claim 5, characterized in that, The wiring adjustment mode specifically includes any one or a combination of steps S10.1 to S10.6: S10.1, extend IC point Di1 and draw a line segment of length Gi5 in the direction perpendicular to FPC tooth bar. The new point obtained is the impedance adjustment point Di1'. The broken line V((i1, i1'), (i1', i3)) is used to replace the straight line L(i1, i3). S10.2, extend IC point Di2, and draw a line segment of length Gi6 in the direction perpendicular to the FPC tooth bar. The new point obtained is the impedance adjustment point Di2'. The broken line V((i2, i2'), (i2', i4)) is used to replace the straight line L(i2, i4). S10.3, extend the FPC point Di3 and draw a line segment of length Gi7 in the direction perpendicular to the IC tooth bar. The new point obtained is the impedance adjustment point Di3'. The broken line V((i1, i3'), (i3', i3)) is used to replace the straight line L(i1, i3). S10.4, extend the FPC point Di4, and draw a line segment of length Gi8 in the direction perpendicular to the IC tooth bar. The new point obtained is the impedance adjustment point Di4'. The broken line V((i2, i4'), (i4', i4)) is used to replace the straight line L(i2, i4). S10.5, extend IC point Di1 and draw a line segment of length Gi5 in the direction perpendicular to the FPC tooth bar to obtain the new point Di1', which is the impedance adjustment point; extend FPC point Di3 and draw a line segment of length Gi7 in the direction perpendicular to IC tooth bar to obtain the new point Di3', which is the impedance adjustment point. The resulting broken line V((i1, i1'), (i1', i3'), (i3', i3)) is used to replace the straight line L(i1, i3). S10.6, extend IC point Di2 and draw a line segment of length Gi6 in the direction perpendicular to the FPC tooth bar to obtain the new point Di2', which is the impedance adjustment point; extend FPC point Di4 and draw a line segment of length Gi8 in the direction perpendicular to the IC tooth bar to obtain the new point Di4', which is the impedance adjustment point. The resulting broken line V((i2, i2'), (i2', i4'), (i4', i4)) is used to replace the straight line L(i2, i4).

7. A method for performing FPC wiring between a liquid crystal substrate and a driver IC according to claim 6, characterized in that, Step S6.1 specifically includes: S6.1.1, divide the tooth group wiring B[1] to B[n] into two equal parts, left and right, and execute the left tooth group left alignment wiring process and the right tooth group right alignment wiring process respectively; S6.1.2, for the tooth group wiring B[1] to the tooth group wiring B[n / 2], execute the left alignment wiring process of the left tooth group in sequence; S6.1.3, for the tooth group wiring B[n] to tooth group wiring B[n / 2 +1], execute the right alignment wiring process for the right tooth group in sequence.

8. A method for performing FPC wiring between a liquid crystal substrate and a driver IC according to claim 6, characterized in that, Step S6.2 specifically includes: S6.2.1 Calculate the distance between B[n / 2] and B[n / 2 +1], and determine whether the distance between B[n / 2] and B[n / 2 +1] equals the minimum wire spacing value. If not, subtract the minimum wire spacing value from the distance between B[n / 2] and B[n / 2 +1] and divide it into equal parts. Adjust the values ​​of G(n / 2)1, G(n / 2)2, G(n / 2)3, G(n / 2)4, G(n / 2 +1)1, G(n / 2 +1)2, G(n / 2 +1)3, and G(n / 2 +1)4, or adjust the tooth group wiring B[n / 2] and B[n / 2 +1] according to the wiring adjustment mode until the distance between B[n / 2] and B[n / 2 +1] equals the minimum wire spacing value. S6.2.2, for the tooth group wiring B[n / 2] to the tooth group wiring B[1], the left tooth group is aligned to the middle wiring process in sequence; S6.2.3, for the tooth group wiring B[n / 2 +1] to the tooth group wiring B[n], execute the right tooth group to center alignment wiring process in sequence.

9. A method for performing FPC wiring between a liquid crystal substrate and a driver IC according to claim 7 or 8, characterized in that: Step S6.1.2 specifically includes: S6.1.2.1 Calculate the line width of the dental wiring B[i] and determine whether the line width of the dental wiring B[i] is greater than or equal to the minimum line width value. If not, adjust the values ​​of Gi1, Gi2, Gi3, and Gi4, or adjust the dental wiring B[i] according to the wiring adjustment mode until the line width of the dental wiring B[i] is greater than or equal to the minimum line width value. S6.1.2.2 Calculate the wiring impedance Zi1 of the dental wiring group B[i] and determine whether the wiring impedance Zi1∈[Zi0-△Z, Zi0+△Z] is true; if not, adjust the dental wiring group B[i] according to the wiring adjustment mode until the wiring impedance Zi1∈[Zi0-△Z, Zi0+△Z] is true. S6.1.2.3, repeat S6.1.2.1 to S6.1.2.2 until the tooth group wiring B[i] simultaneously satisfies the condition that the line width of the tooth group wiring B[i] is greater than or equal to the minimum line width value and the wiring impedance Zi1∈[Zi0-△Z, Zi0+△Z] is satisfied, and the wiring of the tooth group wiring B[i] is completed; S6.1.2.4 Calculate the distance between B[i+1] and B[i], and determine whether the distance between B[i+1] and B[i] equals the minimum wire spacing value. If not, adjust the G(i+1)1, G(i+1)2, G(i+1)3, and G(i+1)4 values ​​of B[i+1], or adjust the tooth group wiring B[i+1] according to the wiring adjustment mode until the distance between B[i+1] and B[i] equals the minimum wire spacing value. S6.1.2.5, Perform steps S6.1.2.1 to S6.1.2.3 on the tooth group wiring B[i+1] to complete the wiring of the tooth group wiring B[i+1]. Step S6.1.3 specifically includes: S6.1.3.1 Calculate the line width of the dental wiring B[i] and determine whether the line width of the dental wiring B[i] is greater than or equal to the minimum line width value. If not, adjust the values ​​of Gi1, Gi2, Gi3, and Gi4, or adjust the dental wiring B[i] according to the wiring adjustment mode until the line width of the dental wiring B[i] is greater than or equal to the minimum line width value. S6.1.3.2 Calculate the wiring impedance Zi1 of the dental wiring group B[i] and determine whether the wiring impedance Zi1∈[Zi0-△Z, Zi0+△Z] is true; if not, adjust the dental wiring group B[i] according to the wiring adjustment mode until the wiring impedance Zi1∈[Zi0-△Z, Zi0+△Z] is true. S6.1.3.3, repeat S6.1.3.1 to S6.1.3.2 until the tooth group wiring B[i] simultaneously satisfies the condition that the line width of the tooth group wiring B[i] is greater than or equal to the minimum line width value and the wiring impedance Zi1∈[Zi0-△Z, Zi0+△Z] is satisfied, and the wiring of the tooth group wiring B[i] is completed; S6.1.3.4 Calculate the distance between B[i-1] and B[i], and determine whether the distance between B[i-1] and B[i] equals the minimum wire spacing value. If not, adjust the G(i-1)1, G(i-1)2, G(i-1)3, and G(i-1)4 values ​​of B[i-1], or adjust the tooth group wiring B[i-1] according to the wiring adjustment mode until the distance between B[i-1] and B[i] equals the minimum wire spacing value. S6.1.3.5, Perform steps S6.1.3.1 to S6.1.3.3 on the tooth group wiring B[i-1] to complete the wiring of the tooth group wiring B[i-1]; Step S6.2.2 specifically includes: S6.2.2.1 Calculate the line width of the dental wiring B[i] and determine whether the line width of the dental wiring B[i] is greater than or equal to the minimum line width value. If not, adjust the values ​​of Gi1, Gi2, Gi3, and Gi4, or adjust the dental wiring B[i] according to the wiring adjustment mode until the line width of the dental wiring B[i] is greater than or equal to the minimum line width value. S6.2.2.2 Calculate the wiring impedance Zi1 of the dental wiring group B[i] and determine whether the wiring impedance Zi1∈[Zi0-△Z, Zi0+△Z] is true; if not, adjust the dental wiring group B[i] according to the wiring adjustment mode until the wiring impedance Zi1∈[Zi0-△Z, Zi0+△Z] is true. S6.2.2.3, repeat S6.2.2.1 to S6.2.2.2 until the tooth group wiring B[i] simultaneously satisfies the condition that the line width of the tooth group wiring B[i] is greater than or equal to the minimum line width value and the wiring impedance Zi1∈[Zi0-△Z,Zi0+△Z] is satisfied, and the wiring of the tooth group wiring B[i] is completed; S6.2.2.4 Calculate the distance between B[i-1] and B[i], and determine whether the distance between B[i-1] and B[i] equals the minimum wire spacing value. If not, adjust the G(i-1)1, G(i-1)2, G(i-1)3, and G(i-1)4 values ​​of B[i-1], or adjust the tooth group wiring B[i-1] according to the wiring adjustment mode until the distance between B[i-1] and B[i] equals the minimum wire spacing value. S6.2.2.5, Perform steps S6.2.2.1 to S6.2.2.3 on the tooth group wiring B[i-1] to complete the wiring of the tooth group wiring B[i-1]; Step S6.2.3 specifically includes: S6.2.3.1 Calculate the line width of the dental wiring B[i] and determine whether the line width of the dental wiring B[i] is greater than or equal to the minimum line width value. If not, adjust the values ​​of Gi1, Gi2, Gi3, and Gi4, or adjust the dental wiring B[i] according to the wiring adjustment mode until the line width of the dental wiring B[i] is greater than or equal to the minimum line width value. S6.2.3.2 Calculate the wiring impedance Zi1 of the dental wiring group B[i] and determine whether the wiring impedance Zi1∈[Zi0-△Z, Zi0+△Z] is true; if not, adjust the dental wiring group B[i] according to the wiring adjustment mode until the wiring impedance Zi1∈[Zi0-△Z, Zi0+△Z] is true. S6.2.3.3, repeat S6.2.3.1 to S6.2.3.2 until the tooth group wiring B[i] simultaneously satisfies the condition that the line width of the tooth group wiring B[i] is greater than or equal to the minimum line width value and the wiring impedance Zi1∈[Zi0-△Z, Zi0+△Z] is satisfied, and the wiring of the tooth group wiring B[i] is completed; S6.2.3.4 Calculate the distance between B[i+1] and B[i], and determine whether the distance between B[i+1] and B[i] equals the minimum wire spacing value. If not, adjust the values ​​of G(i+1)1, G(i+1)2, G(i+1)3, and G(i+1)4 of B[i+1], or adjust the tooth group wiring B[i+1] according to the wiring adjustment mode until the distance between B[i+1] and B[i] equals the minimum wire spacing value. S6.2.3.5, perform steps S6.2.3.1 to S6.2.3.3 on the tooth group wiring B[i+1] to complete the wiring of the tooth group wiring B[i+1].

10. A processor-readable storage medium, characterized in that, The processor-readable storage medium stores a computer program, and when the processor executes the computer program, it implements a method for performing FPC wiring between a liquid crystal substrate and a driver IC as described in any one of claims 1 to 9.

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