PCB (Printed Circuit Board) containing conductive silica gel elastic sheet and capable of realizing full-key non-punching, key and keyboard
By using conductive silicone springs and a specific chip combination on the PCB, full-key rollover and convenient lighting are achieved, solving the problems of redundant and complex I/O ports and single key design in traditional keyboards, and improving the reliability and stability of the keyboard.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- SIDIKO (GUANGZHOU) ELECTRONICS CO LTD
- Filing Date
- 2026-02-07
- Publication Date
- 2026-05-01
AI Technical Summary
In existing technologies, the I/O ports between traditional main control chips and button drive circuits are redundant and complex, with high wiring density. They cannot achieve full-key rollover and the buttons lack GRB indicators, resulting in a single form.
Using a PCB with conductive silicone springs, combined with chips such as Yuquancai, Yuhuicai, Yuhuancai, Yuquanqi, Yuhuiqi, Yuhuanqi, or Yuhuibeiqi, it communicates with the MCU through a serial communication circuit of a single bus in series and parallel to achieve full key rollover function, and integrates GRB LED beads in the chip to provide illumination.
It achieves independent full-key rollover for each key, simplifies the circuit structure, reduces the complexity of the I/O ports, improves the reliability and stability of the keyboard, reduces the sensitivity to external contamination, and provides convenient lighting through the GRB LEDs inside the chip.
Smart Images
Figure CN121964418A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to PCBs, and more particularly to PCBs containing conductive silicone springs and capable of full key rollover, keys, and keyboards. Background Technology
[0002] In the existing technology, the IO ports required between the traditional main control chip and the key drive circuit are redundant and complex, the wiring density is high, there is no keyboard that can achieve full key rollover function by using 3 to 6 electrical networks, and the keys do not have GRB indicators, and the form is simple. Summary of the Invention
[0003] The purpose of this invention is to overcome the shortcomings and deficiencies of the prior art and to provide a PCB containing conductive silicone springs that can achieve full bond knock-off.
[0004] Another object of the present invention is to provide a button.
[0005] Another object of the present invention is to provide a keyboard.
[0006] The objective of this invention is achieved through the following technical solution:
[0007] A PCB containing conductive silicone springs and capable of full key rollover includes a PCB body and conductive silicone springs; the PCB body is provided with a plurality of chips and pads; each pad includes two sub-pads, and each pad corresponds to a button; the two sub-pads are interleaved but not interconnected; wherein, a sub-pad whose one end is connected to the control signal interface pin of the chip is a signal pad, and a sub-pad whose one end is connected to the ground pin is a ground pad;
[0008] The conductive silicone spring serves as both an elastic conductive conductor and a reset button. When pressed, the conductive silicone spring deforms and simultaneously contacts the signal pad and ground pad, forming a physical conductive path. When released, the conductive silicone spring resets. When separated from any of the sub-pads, the physical conductive path is broken, thus forming an elastic conductive switch.
[0009] Furthermore, the chip is a full-color chip;
[0010] The Yuquancai chip contains GRB LEDs and integrates a control signal interface circuit, a GRB color driving circuit, an address code memory, and a serial communication circuit with a single bus in series and parallel connections. It includes control signal interface pins, power supply pins, ground pins, parallel data line pins, address code input pins, and address code output pins. The power supply pin is used to power the Yuquancai chip, and the ground pin is used for signal grounding and power grounding.
[0011] The control signal interface pins are connected to the signal pads on the PCB for communication. The control signal interface circuit is responsible for processing the elastic conductive switch signals generated by the changes in the signal pads and connecting them to the serial communication circuit of the serial single bus in series and parallel.
[0012] The address code input pins and address code output pins of n full-color chips are cascaded to form a series data line network DIN(1)-DOUT(n). The two ends of the series data line network DIN(1) and DOUT(n) are connected to the MCU respectively. The MCU writes the sequence bit formed by the cascaded full-color chips into the address code memory through the series data line network DIN(1)-DOUT(n) and uses it as the communication address code. The power supply pins of n full-color chips are connected in parallel to share the power supply network VCC, the ground pins are connected in parallel to share the ground network GND, and the parallel data line pins are connected in parallel to form a parallel data line network DIO, which is then connected to the MCU.
[0013] Serial-parallel single-bus serial communication circuits are used to process serial data line network information and parallel data line network information.
[0014] GRB RGB information and flexible conductive switch information can be transmitted on the parallel data line network DIO;
[0015] GRB RGB information and flexible conductive switch information can also be transmitted on the serial data line network DIN(1)-DOUT(n);
[0016] Both the parallel data line network DIO and the serial data line network DIN(1)-DOUT(n) use the serial single-bus communication protocol to transmit GRB holographic information and flexible conductive switch information, and are hot backups for each other.
[0017] Furthermore, the chip is a Yuhuicai chip;
[0018] The Yuhui Color chip contains GRB LED beads and integrates a control signal interface circuit, a GRB color driving circuit, an address code memory, and a parallel single-bus serial communication circuit; it includes control signal interface pins, power supply pins, ground pins, and parallel data line pins. The power supply pins are used to power the Yuhui Color chip, and the ground pins are used for signal grounding and power grounding.
[0019] The control signal interface pins are connected to the signal pads on the PCB for communication. The control signal interface circuit is responsible for processing the elastic conductive switch signals generated by the changes in the signal pads and connecting them to the parallel single-bus serial communication circuit.
[0020] The parallel data pins of n Yuhuicai chips are connected together to form a parallel data line network DIO, which is then connected to the MCU; the address code of the Yuhuicai chip is written into the address code memory through an external fixture and used as the communication address code;
[0021] Parallel single-bus serial communication circuits are used to process information from parallel data line networks;
[0022] GRB RGB information and flexible conductive switch information are transmitted on the parallel data line network DIO;
[0023] The parallel data line network uses a serial single-bus communication protocol to transmit GRB holographic information and flexible conductive switch information.
[0024] Furthermore, the chip is a Yuhuancai chip;
[0025] The Yuhuancai chip contains GRB LED beads and integrates a control signal interface circuit, a GRB RGB driver circuit, and a serial single-bus serial communication circuit, including a control signal interface pin, a power supply pin, a ground pin, a serial signal input pin, and a serial signal output pin; the power supply pin is used to power the Yuhuancai chip, and the ground pin is used for signal grounding and power grounding;
[0026] The control signal interface pins are connected to the signal pads on the PCB for communication. The control signal interface circuit is responsible for processing the elastic conductive switch signals generated by the changes in the signal pads and connecting them to the serial communication circuit on a single bus.
[0027] The serial signal input pins and serial signal output pins of n GRB chips are cascaded to form a serial data line network DIN(1)-DOUT(n). The two ends of the serial data line network DIN(1) and DOUT(n) are connected to the MCU respectively. The MCU transmits GRB information and elastic conductive switch information to the MCU through the serial data line network DIN(1)-DOUT(n).
[0028] A serial single-bus serial communication circuit is used to process information from a serial data line network.
[0029] Both GRB RGB information and flexible conductive switch information are transmitted on the serial data line network DIN(1)-DOUT(n);
[0030] The serial data line network uses a serial single-bus communication protocol to transmit GRB holographic information and flexible conductive switch information.
[0031] Furthermore, the chip is a driver chip;
[0032] The controller chip integrates a control signal interface circuit, an address code memory, and a serial communication circuit with a single bus; it includes control signal interface pins, power supply pins, ground pins, parallel data line pins, address code input pins, and address code output pins; the power supply pin is used to power the controller chip, and the ground pin is used for signal grounding and power grounding;
[0033] The control signal interface pins are connected to the signal pads on the PCB for communication. The control signal interface circuit is responsible for processing the elastic conductive switch signals generated by the changes in the signal pads and connecting them to the serial communication circuit of the serial single bus in series and parallel.
[0034] The address code input pins and address code output pins of n controller chips are cascaded to form a serial data line network DIN(1)-DOUT(n). The two ends of the serial data line network DIN(1) and DOUT(n) are connected to the MCU respectively. The MCU writes the sequence bit formed by the cascaded controller chips into the address code memory through the serial data line network DIN(1)-DOUT(n) and uses it as the communication address code. The power supply pins of the n controller chips are connected in parallel to share the power supply network VCC, the ground pins are connected in parallel to share the ground network GND, and the parallel data line pins are connected in parallel to form a parallel data line network DIO, which is then connected to the MCU.
[0035] Serial-parallel single-bus serial communication circuits are used to process serial data line network information and parallel data line network information.
[0036] Information from the flexible conductive switch can be transmitted on the parallel data line network (DIO).
[0037] Information from flexible conductive switches can also be transmitted on the serial data line network DIN(1)-DOUT(n);
[0038] Both the parallel data line network DIO and the serial data line network DIN(1)-DOUT(n) use the serial single-bus communication protocol to transmit flexible conductive switch information and serve as hot backups for each other.
[0039] Furthermore, the chip is a driver chip;
[0040] The controller chip integrates a control signal interface circuit, an address code memory, and a parallel single-bus serial communication circuit; it includes control signal interface pins, power supply pins, ground pins, and parallel data line pins. The power supply pins are used to power the controller chip, and the ground pins are used for signal grounding and power grounding.
[0041] The control signal interface pins are connected to the signal pads on the PCB for communication. The control signal interface circuit is responsible for processing the elastic conductive switch signals generated by the changes in the signal pads and connecting them to the parallel single-bus serial communication circuit.
[0042] The parallel data pins of n controller chips are connected together to form a parallel data line network (DIO), which is then connected to the MCU. The address code of the controller chip is written into the address code memory through an external fixture and used as the communication address code.
[0043] Parallel single-bus serial communication circuits are used to process information from parallel data line networks;
[0044] Information from the flexible conductive switch is transmitted on the parallel data line network DIO;
[0045] The parallel data line network uses a serial single-bus communication protocol to transmit information about the flexible conductive switch.
[0046] Furthermore, the chip is a magic-controlling chip;
[0047] The device chip integrates a control signal interface circuit and a serial single-bus serial communication circuit, including a control signal interface pin, a power supply pin, a ground pin, a serial signal input pin, and a serial signal output pin; the power supply pin is used to power the device chip, and the ground pin is used for signal grounding and power grounding;
[0048] The control signal interface pins are connected to the signal pads on the PCB for communication. The control signal interface circuit is responsible for processing the elastic conductive switch signals generated by the changes in the signal pads and connecting them to the serial communication circuit on a single bus.
[0049] The serial signal input pins and serial signal output pins of n control chip are cascaded to form a serial data line network DIN(1)-DOUT(n). The two ends of the serial data line network DIN(1) and DOUT(n) are connected to the MCU respectively. The MCU transmits the elastic conductive switch information to the MCU through the serial data line network DIN(1)-DOUT(n).
[0050] A serial single-bus serial communication circuit is used to process information from a serial data line network.
[0051] Information from the flexible conductive switch is transmitted on the serial data line network DIN(1)-DOUT(n);
[0052] The serial data line network uses a serial single-bus communication protocol to transmit information about the flexible conductive switch.
[0053] Furthermore, the chip is a device chip for controlling virtual reality.
[0054] The Yuhuan backup chip integrates a control signal interface circuit and a serial single-bus serial communication circuit, including a control signal interface pin, a power supply pin, a ground pin, a first serial signal input pin, a first serial signal output pin, a second serial signal input pin, and a second serial signal output pin; the power supply pin is used to supply power to the Yuhuan backup chip, and the ground pin is used for signal grounding and power grounding;
[0055] The control signal interface pins are connected to the signal pads on the PCB for communication. The control signal interface circuit is responsible for processing the elastic conductive switch signals generated by the changes in the signal pads and connecting them to the serial communication circuit on a single bus.
[0056] The first serial signal input pin and the first serial signal output pin of n Yuhuan backup chips are cascaded to form a first serial data line network DIN1(1)-DOUT1(n). The two ends of the first serial data line network DIN1(1) and DOUT1(n) are connected to the MCU respectively. The MCU transmits the elastic conductive switch information to the MCU through the first serial data line network DIN1(1)-DOUT1(n).
[0057] The second serial signal input pins and second serial signal output pins of n backup chips are cascaded to form a second serial data line network DIN2(1)-DOUT2(n). The two ends of the second serial data line network DIN2(1) and DOUT2(n) are connected to the MCU respectively. The second serial data line network DIN2(1)-DOUT2(n) serves as a backup data line network for the first serial data line network DIN1(1)-DOUT1(n).
[0058] A serial single-bus serial communication circuit is used to process information from a serial data line network.
[0059] The flexible conductive switch information is transmitted on the first serial data line network DIN1(1)-DOUT1(n) or the second serial data line network DIN2(1)-DOUT2(n);
[0060] The serial data line network uses a serial single-bus communication protocol to transmit information about the flexible conductive switch.
[0061] Furthermore, the chip is a backup chip;
[0062] The Yuhui backup chip integrates a control signal interface circuit, a parallel single-bus serial communication circuit, and an address code memory; it includes a control signal interface pin, a power supply pin, a ground pin, a first parallel data line pin, and a second parallel data line pin. The power supply pin is used to supply power to the Yuhui backup chip, and the ground pin is used for signal grounding and power grounding.
[0063] The control signal interface pins are connected to the signal pads on the PCB for communication. The control signal interface circuit is responsible for processing the elastic conductive switch signals generated by the changes in the signal pads and connecting them to the parallel single-bus serial communication circuit.
[0064] The first parallel data pins of n backup chips are connected together to form a first parallel data line network DIO1, which is then connected to the MCU; the second parallel data pins of n backup chips are connected together to form a second parallel data line network DIO2, which is then connected to the MCU. The second parallel data line network DIO2 serves as a backup data line network for the first parallel data line network DIO1; the address code of the backup chip is written into the address code memory through an external fixture and used as the communication address code.
[0065] Parallel single-bus serial communication circuits are used to process information from parallel data line networks;
[0066] The flexible conductive switch information is transmitted on the first parallel data line network DIO1 or the second parallel data line network DIO2;
[0067] The parallel data line network uses a serial single-bus communication protocol to transmit information about the flexible conductive switch.
[0068] Furthermore, the PCB is a rigid PCB or a flexible FPC.
[0069] Another objective of this invention is achieved through the following technical solution:
[0070] A key includes a keycap and a key pressing component. The key pressing component is a commonly used scissor-switch mechanism, a crater mechanism, or other pressing mechanism. The keycap is mounted on the key pressing component. When the keycap is pressed down, the conductive silicone spring and the solder pad become conductive, generating a signal change that triggers a switch. When the keycap is released, the conductive silicone spring and the solder pad reset the switch.
[0071] Another objective of this invention is achieved through the following technical solution:
[0072] A keyboard, which is manufactured using the aforementioned PCB and the aforementioned keys as its core.
[0073] Compared with the prior art, the present invention has the following advantages and beneficial effects:
[0074] 1. The full-color control chip, or color-enhancing chip, or color-enhancing chip, or color-enhancing device chip, or color-enhancing device chip, or color-enhancing backup chip, or color-enhancing backup chip used in this invention, each corresponding button has an independent control signal interface pin, with a natural full-key anti-ghosting function.
[0075] 2. This invention uses the Yuquancai chip, or the Yuhuicai chip, or the Yuhuancai chip. All of the above chips have built-in GRB LEDs for illumination, making them more convenient to use. They can perform both key functions and provide illumination, which is something that traditional keyboards simply cannot do.
[0076] 3. This invention uses a full-color chip, or a color-enhancing chip, or a holographic chip, or a full-color chip, or a color-enhancing chip, or a holographic chip, or a holographic backup chip, or a color-enhancing backup chip. It can communicate with the keyboard MCU with a maximum of 6 pins (VCC, GND, DIN1, DOUT1, DIN2, and DOUT2) and a minimum of 3 pins (VCC, DIO, and GND). It is very simple and is something that traditional keyboards simply cannot do.
[0077] 4. The overall circuit of this invention, composed of a full-color chip, a color-coordinated chip, a color-enhancing chip, a color-enhancing chip, a color-coordinated chip, a color-coordinated chip, a color-coordinated chip, a color-coordinated chip, a color-coordinated chip, a color-coordinated backup chip, or a color-coordinated backup chip, is simpler. The MCU with USB function can be externally placed at the wire end, making the heart of the keyboard (MCU) less susceptible to contamination by external liquids and dust. The MCU has good reliability, and the reliability and stability of the keyboard are further enhanced.
[0078] 5. This invention uses the Yuquancai chip or Yuquanqi chip as a serial communication circuit with series and parallel connections. The series and parallel connections serve as hot backups for each other. This hot backup is not a simple repetitive dual-serial hot backup, nor is it the same as a simple dual-parallel hot backup. The series and parallel hot backup has stronger complementarity, better hot backup effect, and more stable performance.
[0079] 6. This invention uses a full-color chip or a full-process chip to write code, which can be completed by the serial data network formed by the cascading of the chips themselves. It does not require any external fixtures, which simplifies the process, improves reliability and stability, and reduces manufacturing costs.
[0080] 7. The Yuhuan backup chip and Yuhui backup chip used in this invention are also equipped with backup data lines, which is a redundant design, resulting in high system stability and less likelihood of generating maintenance work orders.
[0081] 8. In order to minimize power consumption, the control signal interface pin of this invention operates in a time-division multiplexing manner: when the button is being detected, it is an input port (INPUT); when the button is not being detected, the control signal interface pin is an output port (OUTPUT), which can output a low level, and the button is in a zero power consumption state.
[0082] 9. Each of the external control I / O ports of the chip described in this invention corresponds to one button, preferably one chip to one button. This results in shorter wiring, less susceptibility to external interference, more stable elastic switch signal changes, and higher button reliability. Attached Figure Description
[0083] Figure 1 This is a functional diagram of the full-color chip described in Embodiment 1 of the present invention.
[0084] Figure 2 This is an electrical connection diagram of the full-color chip and the pad (with conductive silicone spring) described in Embodiment 1 of the present invention.
[0085] Figure 3 This is an electrical connection diagram of the full-color chip and the pads (without conductive silicone springs) described in Embodiment 1 of the present invention.
[0086] Figure 4 This is an electrical connection diagram of the full-color chip and pads as described in embodiment 1 of the present invention.
[0087] Figure 5This is a schematic diagram of the overall structure of the PCB (without conductive silicone spring) described in this invention.
[0088] Figure 6 for Figure 5 A magnified view of a portion of region A.
[0089] Figure 7 This is a functional diagram of the Yuhuicai chip described in Embodiment 2 of the present invention.
[0090] Figure 8 This is a functional diagram of the Yuhuancai chip described in Embodiment 3 of the present invention.
[0091] Figure 9 This is a functional diagram of the controller chip described in Embodiment 4 of the present invention.
[0092] Figure 10 This is a functional diagram of the controller chip described in Embodiment 5 of the present invention.
[0093] Figure 11 This is a functional diagram of the device chip described in Embodiment 6 of the present invention.
[0094] Figure 12 This is a functional diagram of the Yuhuan Backup Chip described in Embodiment 7 of the present invention.
[0095] Figure 13 This is a functional diagram of the backup chip described in Embodiment 8 of the present invention.
[0096] The meanings of the reference numerals in the attached figures are as follows:
[0097] 1-PCB, 2-signal pad, 3-grounding pad, 4-chip, 5-conductive silicone spring. Detailed Implementation
[0098] The present invention will be further described in detail below with reference to the embodiments and accompanying drawings, but the embodiments of the present invention are not limited thereto.
[0099] Example 1
[0100] A PCB containing conductive silicone springs and capable of full-bond non-overlapping bonding, comprising the PCB body 1 and conductive silicone springs 5; such as Figure 5 and Figure 6 The PCB1 body is provided with a number of chips 4 and pads; each pad includes two sub-pads, and each pad is provided with a button; the two sub-pads are interleaved but not connected to each other; wherein, the sub-pad connected to the control signal interface pin of the chip at one end is the signal pad 2, and the sub-pad connected to the ground pin at one end is the ground pad 3.
[0101] The conductive silicone spring 5 serves as both an elastic conductive conductor and a button for resetting. When pressed, the conductive silicone spring 5 deforms and simultaneously contacts the signal pad 2 and the ground pad 3, forming a physical conductive path. When released, the conductive silicone spring 5 resets. When separated from any of the sub-pads, the physical conductive path is broken, thus forming an elastic conductive switch.
[0102] The PCB is either a rigid PCB or a flexible FPC.
[0103] like Figure 1 The chip is a Yuquancai chip; the Yuquancai chip contains GRB LED beads and integrates a control signal interface circuit, a GRB color driving circuit, an address code memory, and a serial communication circuit with a single bus; it includes control signal interface pins, power supply pins, ground pins, parallel data line pins, address code input pins, and address code output pins; the power supply pin is used to supply power to the Yuquancai chip, and the ground pin is used for signal grounding and power grounding;
[0104] like Figure 2 and Figure 3 The control signal interface pins are connected to the signal pads on the PCB for communication. The control signal interface circuit is responsible for processing the elastic conductive switch signals generated by the changes in the signal pads and connecting them to the serial communication circuit of the serial single bus in series and parallel.
[0105] like Figure 4 n full-color chips are electrically connected to the pads; the address code input pins and address code output pins of the n full-color chips are cascaded to form a series data line network DIN(1)-DOUT(n). The two ends of the series data line network DIN(1) and DOUT(n) are connected to the MCU respectively. The MCU writes the sequence bit formed by the cascaded full-color chips into the address code memory through the series data line network DIN(1)-DOUT(n) and uses it as the communication address code; the power supply pins of the n full-color chips are connected in parallel to share the power supply network VCC, the ground pins are connected in parallel to share the ground network GND, and the parallel data line pins are connected in parallel to form a parallel data line network DIO, which is then connected to the MCU.
[0106] Serial-parallel single-bus serial communication circuits are used to process serial data line network information and parallel data line network information.
[0107] GRB RGB information and flexible conductive switch information can be transmitted on the parallel data line network DIO;
[0108] GRB RGB information and flexible conductive switch information can also be transmitted on the serial data line network DIN(1)-DOUT(n);
[0109] Both the parallel data line network DIO and the serial data line network DIN(1)-DOUT(n) use the serial single-bus communication protocol to transmit GRB holographic information and flexible conductive switch information, and are hot backups for each other.
[0110] Example 2
[0111] Example 2 is identical to Example 1 except for the following content:
[0112] like Figure 7 The chip is a Yuhuicai chip; the Yuhuicai chip contains GRB LED beads and integrates a control signal interface circuit, a GRB color driving circuit, an address code memory, and a parallel single-bus serial communication circuit; it includes control signal interface pins, power supply pins, ground pins, and parallel data line pins. The power supply pins are used to supply power to the Yuhuicai chip, and the ground pins are used for signal grounding and power grounding.
[0113] The control signal interface pins are connected to the signal pads on the PCB for communication. The control signal interface circuit is responsible for processing the elastic conductive switch signals generated by the changes in the signal pads and connecting them to the parallel single-bus serial communication circuit.
[0114] The parallel data pins of n Yuhuicai chips are connected together to form a parallel data line network DIO, which is then connected to the MCU; the address code of the Yuhuicai chip is written into the address code memory through an external fixture and used as the communication address code;
[0115] Parallel single-bus serial communication circuits are used to process information from parallel data line networks;
[0116] GRB RGB information and flexible conductive switch information are transmitted on the parallel data line network DIO;
[0117] The parallel data line network uses a serial single-bus communication protocol to transmit GRB holographic information and flexible conductive switch information.
[0118] Example 3
[0119] Example 3 is identical to Example 1 except for the following content:
[0120] like Figure 8 The chip is a Yuhuancai chip; the Yuhuancai chip contains GRB LED beads and integrates a control signal interface circuit, a GRB RGB driving circuit, and a serial single-bus serial communication circuit, including a control signal interface pin, a power supply pin, a ground pin, a serial signal input pin, and a serial signal output pin; the power supply pin is used to supply power to the Yuhuancai chip, and the ground pin is used for signal grounding and power grounding;
[0121] The control signal interface pins are connected to the signal pads on the PCB for communication. The control signal interface circuit is responsible for processing the elastic conductive switch signals generated by the changes in the signal pads and connecting them to the serial communication circuit on a single bus.
[0122] The serial signal input pins and serial signal output pins of n GRB chips are cascaded to form a serial data line network DIN(1)-DOUT(n). The two ends of the serial data line network DIN(1) and DOUT(n) are connected to the MCU respectively. The MCU transmits GRB information and elastic conductive switch information to the MCU through the serial data line network DIN(1)-DOUT(n).
[0123] A serial single-bus serial communication circuit is used to process information from a serial data line network.
[0124] Both GRB RGB information and flexible conductive switch information are transmitted on the serial data line network DIN(1)-DOUT(n);
[0125] The serial data line network uses a serial single-bus communication protocol to transmit GRB holographic information and flexible conductive switch information.
[0126] Example 4
[0127] Example 4 is identical to Example 1 except for the following content:
[0128] like Figure 9 The chip is a driver chip; the driver chip integrates a control signal interface circuit, an address code memory, and a serial communication circuit with a single bus; it includes control signal interface pins, power supply pins, ground pins, parallel data line pins, address code input pins, and address code output pins; the power supply pin is used to supply power to the driver chip, and the ground pin is used for signal grounding and power grounding;
[0129] The control signal interface pins are connected to the signal pads on the PCB for communication. The control signal interface circuit is responsible for processing the elastic conductive switch signals generated by the changes in the signal pads and connecting them to the serial communication circuit of the serial single bus in series and parallel.
[0130] The address code input pins and address code output pins of n controller chips are cascaded to form a serial data line network DIN(1)-DOUT(n). The two ends of the serial data line network DIN(1) and DOUT(n) are connected to the MCU respectively. The MCU writes the sequence bit formed by the cascaded controller chips into the address code memory through the serial data line network DIN(1)-DOUT(n) and uses it as the communication address code. The power supply pins of the n controller chips are connected in parallel to share the power supply network VCC, the ground pins are connected in parallel to share the ground network GND, and the parallel data line pins are connected in parallel to form a parallel data line network DIO, which is then connected to the MCU.
[0131] Serial-parallel single-bus serial communication circuits are used to process serial data line network information and parallel data line network information.
[0132] Information from the flexible conductive switch can be transmitted on the parallel data line network (DIO).
[0133] Information from flexible conductive switches can also be transmitted on the serial data line network DIN(1)-DOUT(n);
[0134] Both the parallel data line network DIO and the serial data line network DIN(1)-DOUT(n) use the serial single-bus communication protocol to transmit flexible conductive switch information and serve as hot backups for each other.
[0135] Example 5
[0136] Example 5 is identical to Example 1 except for the following content:
[0137] like Figure 10 The chip is a controller chip; the controller chip integrates a control signal interface circuit, an address code memory, and a parallel single-bus serial communication circuit; it includes control signal interface pins, power supply pins, ground pins, and parallel data line pins. The power supply pins are used to supply power to the controller chip, and the ground pins are used for signal grounding and power grounding.
[0138] The control signal interface pins are connected to the signal pads on the PCB for communication. The control signal interface circuit is responsible for processing the elastic conductive switch signals generated by the changes in the signal pads and connecting them to the parallel single-bus serial communication circuit.
[0139] The parallel data pins of n controller chips are connected together to form a parallel data line network (DIO), which is then connected to the MCU. The address code of the controller chip is written into the address code memory through an external fixture and used as the communication address code.
[0140] Parallel single-bus serial communication circuits are used to process information from parallel data line networks;
[0141] Information from the flexible conductive switch is transmitted on the parallel data line network DIO;
[0142] The parallel data line network uses a serial single-bus communication protocol to transmit information about the flexible conductive switch.
[0143] Example 6
[0144] Example 6 is identical to Example 1 except for the following content:
[0145] like Figure 11The chip is a magic controller chip; the magic controller chip integrates a control signal interface circuit and a serial single-bus serial communication circuit, including a control signal interface pin, a power supply pin, a ground pin, a serial signal input pin, and a serial signal output pin; the power supply pin is used to supply power to the magic controller chip, and the ground pin is used for signal grounding and power grounding;
[0146] The control signal interface pins are connected to the signal pads on the PCB for communication. The control signal interface circuit is responsible for processing the elastic conductive switch signals generated by the changes in the signal pads and connecting them to the serial communication circuit on a single bus.
[0147] The serial signal input pins and serial signal output pins of n control chip are cascaded to form a serial data line network DIN(1)-DOUT(n). The two ends of the serial data line network DIN(1) and DOUT(n) are connected to the MCU respectively. The MCU transmits the elastic conductive switch information to the MCU through the serial data line network DIN(1)-DOUT(n).
[0148] A serial single-bus serial communication circuit is used to process information from a serial data line network.
[0149] Information from the flexible conductive switch is transmitted on the serial data line network DIN(1)-DOUT(n);
[0150] The serial data line network uses a serial single-bus communication protocol to transmit information about the flexible conductive switch.
[0151] Example 7
[0152] Example 7 is identical to Example 1 except for the following content:
[0153] like Figure 12 The chip is a Yuhuan backup chip; the Yuhuan backup chip integrates a control signal interface circuit and a serial single-bus serial communication circuit, including a control signal interface pin, a power supply pin, a ground pin, a first serial signal input pin, a first serial signal output pin, a second serial signal input pin, and a second serial signal output pin; the power supply pin is used to supply power to the Yuhuan backup chip, and the ground pin is used for signal grounding and power grounding;
[0154] The control signal interface pins are connected to the signal pads on the PCB for communication. The control signal interface circuit is responsible for processing the elastic conductive switch signals generated by the changes in the signal pads and connecting them to the serial communication circuit on a single bus.
[0155] The first serial signal input pin and the first serial signal output pin of n Yuhuan backup chips are cascaded to form a first serial data line network DIN1(1)-DOUT1(n). The two ends of the first serial data line network DIN1(1) and DOUT1(n) are connected to the MCU respectively. The MCU transmits the elastic conductive switch information to the MCU through the first serial data line network DIN1(1)-DOUT1(n).
[0156] The second serial signal input pins and second serial signal output pins of n backup chips are cascaded to form a second serial data line network DIN2(1)-DOUT2(n). The two ends of the second serial data line network DIN2(1) and DOUT2(n) are connected to the MCU respectively. The second serial data line network DIN2(1)-DOUT2(n) serves as a backup data line network for the first serial data line network DIN1(1)-DOUT1(n).
[0157] A serial single-bus serial communication circuit is used to process information from a serial data line network.
[0158] The flexible conductive switch information is transmitted on the first serial data line network DIN1(1)-DOUT1(n) or the second serial data line network DIN2(1)-DOUT2(n);
[0159] The serial data line network uses a serial single-bus communication protocol to transmit information about the flexible conductive switch.
[0160] Example 8
[0161] Example 8 is identical to Example 1 except for the following content:
[0162] like Figure 13 The chip is a Yuhui backup chip; the Yuhui backup chip integrates a control signal interface circuit, a parallel single-bus serial communication circuit, and an address code memory; it includes a control signal interface pin, a power supply pin, a ground pin, a first parallel data line pin, and a second parallel data line pin. The power supply pin is used to supply power to the Yuhui backup chip, and the ground pin is used for signal grounding and power grounding.
[0163] The control signal interface pins are connected to the signal pads on the PCB for communication. The control signal interface circuit is responsible for processing the elastic conductive switch signals generated by the changes in the signal pads and connecting them to the parallel single-bus serial communication circuit.
[0164] The first parallel data pins of n backup chips are connected together to form a first parallel data line network DIO1, which is then connected to the MCU; the second parallel data pins of n backup chips are connected together to form a second parallel data line network DIO2, which is then connected to the MCU. The second parallel data line network DIO2 serves as a backup data line network for the first parallel data line network DIO1; the address code of the backup chip is written into the address code memory through an external fixture and used as the communication address code.
[0165] Parallel single-bus serial communication circuits are used to process information from parallel data line networks;
[0166] The flexible conductive switch information is transmitted on the first parallel data line network DIO1 or the second parallel data line network DIO2;
[0167] The parallel data line network uses a serial single-bus communication protocol to transmit information about the flexible conductive switch.
[0168] This invention also provides:
[0169] A key includes a keycap and a key pressing component. The key pressing component is a commonly used scissor-switch mechanism, a crater mechanism, or other pressing mechanism. The keycap is mounted on the key pressing component. When the keycap is pressed down, the conductive silicone spring and the solder pad become conductive, generating a signal change that triggers a switch. When the keycap is released, the conductive silicone spring and the solder pad reset the switch.
[0170] A keyboard, which is manufactured using the aforementioned PCB and the aforementioned keys as its core.
[0171] The chip in Example 4 is a controller chip, the chip in Example 5 is a converging chip, the chip in Example 6 is a magic chip, the chip in Example 7 is a magic backup chip, and the chip in Example 8 is a converging backup chip. A PCB is provided with any one of the chips in Examples 4 to 8. A light guide plate can also be provided below the PCB. The light guide plate can provide a light source for the keyboard as a backlight.
[0172] In Examples 1 to 8, it should be noted that in the same electrical system, all networks with the same name (such as VCC, GND, DIO, DIN, DOUT, DIN1, DOUT1, DIN2, DOUT2, DIO1, DIO2) are connected together in terms of electrical characteristics.
[0173] In Examples 1 to 8, in order to minimize power consumption, the control signal interface pin operates in a time-division multiplexing manner: when the button is being detected, it is an input port (INPUT); when the button is not being detected, the control signal interface pin is an output port (OUTPUT), which can output a low level, and the button is in a zero-power state.
[0174] The above embodiments are preferred embodiments of the present invention, but the embodiments of the present invention are not limited to the above embodiments. Any changes, modifications, substitutions, combinations, or simplifications made without departing from the spirit and principle of the present invention shall be considered equivalent substitutions and shall be included within the protection scope of the present invention.
Claims
1. A PCB containing conductive silicone springs and capable of full-key non-overlapping bonding, characterized in that, It includes a PCB body and conductive silicone springs; the PCB body is provided with a number of chips and pads; each pad includes two sub-pads, and each pad is provided with a button; the two sub-pads are interleaved but not connected to each other; wherein, the sub-pad connected to the control signal interface pin of the chip at one end is a signal pad, and the sub-pad connected to the ground pin at one end is a ground pad. The conductive silicone spring serves as both an elastic conductive conductor and a reset button. When pressed, the conductive silicone spring deforms and simultaneously contacts the signal pad and ground pad, forming a physical conductive path. When released, the conductive silicone spring resets. When separated from any of the sub-pads, the physical conductive path is broken, thus forming an elastic conductive switch.
2. The PCB containing conductive silicone springs and capable of full-bond non-overlapping bonding according to claim 1, characterized in that, The chip in question is a full-color chip; The full-color chip contains GRB LEDs and integrates a control signal interface circuit, a GRB color driving circuit, an address code memory, and a serial communication circuit with a single bus in series and parallel connections; it includes control signal interface pins, power supply pins, ground pins, parallel data line pins, address code input pins, and address code output pins. The power pin is used to power the full-color chip, and the ground pin is used for signal grounding and power grounding. The control signal interface pins are connected to the signal pads on the PCB for communication. The control signal interface circuit is responsible for processing the elastic conductive switch signals generated by the changes in the signal pads and connecting them to the serial communication circuit of the serial single bus in series and parallel. The address code input pins and address code output pins of n full-color chips are cascaded to form a series data line network DIN(1)-DOUT(n). The two ends of the series data line network DIN(1) and DOUT(n) are connected to the MCU respectively. The MCU writes the sequence bit formed by the cascaded full-color chips into the address code memory through the series data line network DIN(1)-DOUT(n) and uses it as the communication address code. The power supply pins of n full-color chips are connected in parallel to share the power supply network VCC, the ground pins are connected in parallel to share the ground network GND, and the parallel data line pins are connected in parallel to form a parallel data line network DIO, which is then connected to the MCU. Serial-parallel single-bus serial communication circuits are used to process serial data line network information and parallel data line network information. GRB RGB information and flexible conductive switch information can be transmitted on the parallel data line network DIO; GRB RGB information and flexible conductive switch information can also be transmitted on the serial data line network DIN(1)-DOUT(n); Both the parallel data line network DIO and the serial data line network DIN(1)-DOUT(n) use the serial single-bus communication protocol to transmit GRB holographic information and flexible conductive switch information, and are hot backups for each other.
3. The PCB containing conductive silicone springs and capable of full-bond non-overlapping bonding according to claim 1, characterized in that, The chip in question is a Yuhuicai chip; The Yuhui Color chip contains GRB LED beads and integrates a control signal interface circuit, a GRB color driving circuit, an address code memory, and a parallel single-bus serial communication circuit; it includes control signal interface pins, power supply pins, ground pins, and parallel data line pins. The power supply pins are used to power the Yuhui Color chip, and the ground pins are used for signal grounding and power grounding. The control signal interface pins are connected to the signal pads on the PCB for communication. The control signal interface circuit is responsible for processing the elastic conductive switch signals generated by the changes in the signal pads and connecting them to the parallel single-bus serial communication circuit. The parallel data pins of n Yuhuicai chips are connected together to form a parallel data line network DIO, which is then connected to the MCU; the address code of the Yuhuicai chip is written into the address code memory through an external fixture and used as the communication address code; Parallel single-bus serial communication circuits are used to process information from parallel data line networks; GRB RGB information and flexible conductive switch information are transmitted on the parallel data line network DIO; The parallel data line network uses a serial single-bus communication protocol to transmit GRB holographic information and flexible conductive switch information.
4. The PCB containing conductive silicone springs and capable of full-bond non-overlapping bonding according to claim 1, characterized in that, The chip in question is the Yuhuancai chip; The Yuhuancai chip contains GRB LED beads and integrates a control signal interface circuit, a GRB RGB driver circuit, and a serial single-bus serial communication circuit, including a control signal interface pin, a power supply pin, a ground pin, a serial signal input pin, and a serial signal output pin; the power supply pin is used to power the Yuhuancai chip, and the ground pin is used for signal grounding and power grounding; The control signal interface pins are connected to the signal pads on the PCB for communication. The control signal interface circuit is responsible for processing the elastic conductive switch signals generated by the changes in the signal pads and connecting them to the serial communication circuit on a single bus. The serial signal input pins and serial signal output pins of n GRB chips are cascaded to form a serial data line network DIN(1)-DOUT(n). The two ends of the serial data line network DIN(1) and DOUT(n) are connected to the MCU respectively. The MCU transmits GRB information and elastic conductive switch information to the MCU through the serial data line network DIN(1)-DOUT(n). A serial single-bus serial communication circuit is used to process information from a serial data line network. Both GRB RGB information and flexible conductive switch information are transmitted on the serial data line network DIN(1)-DOUT(n); The serial data line network uses a serial single-bus communication protocol to transmit GRB holographic information and flexible conductive switch information.
5. The PCB containing conductive silicone springs and capable of full-key non-overlapping bonding according to claim 1, characterized in that, The chip is a driver chip; The controller chip integrates a control signal interface circuit, an address code memory, and a serial communication circuit with a single bus; it includes control signal interface pins, power supply pins, ground pins, parallel data line pins, address code input pins, and address code output pins. The power pin is used to supply power to the controller chip, and the ground pin is used for signal grounding and power grounding. The control signal interface pins are connected to the signal pads on the PCB for communication. The control signal interface circuit is responsible for processing the elastic conductive switch signals generated by the changes in the signal pads and connecting them to the serial communication circuit of the serial single bus in series and parallel. The address code input pins and address code output pins of n controller chips are cascaded to form a serial data line network DIN(1)-DOUT(n). The two ends of the serial data line network DIN(1) and DOUT(n) are connected to the MCU respectively. The MCU writes the sequence bit formed by the cascaded controller chips into the address code memory through the serial data line network DIN(1)-DOUT(n) and uses it as the communication address code. The power supply pins of the n controller chips are connected in parallel to share the power supply network VCC, the ground pins are connected in parallel to share the ground network GND, and the parallel data line pins are connected in parallel to form a parallel data line network DIO, which is then connected to the MCU. Serial-parallel single-bus serial communication circuits are used to process serial data line network information and parallel data line network information. Information from the flexible conductive switch can be transmitted on the parallel data line network (DIO). Information from flexible conductive switches can also be transmitted on the serial data line network DIN(1)-DOUT(n); Both the parallel data line network DIO and the serial data line network DIN(1)-DOUT(n) use the serial single-bus communication protocol to transmit flexible conductive switch information and serve as hot backups for each other.
6. The PCB containing conductive silicone springs and capable of full-bond non-overlapping bonding according to claim 1, characterized in that, The chip is a driver chip; The controller chip integrates a control signal interface circuit, an address code memory, and a parallel single-bus serial communication circuit; it includes control signal interface pins, power supply pins, ground pins, and parallel data line pins. The power supply pins are used to power the controller chip, and the ground pins are used for signal grounding and power grounding. The control signal interface pins are connected to the signal pads on the PCB for communication. The control signal interface circuit is responsible for processing the elastic conductive switch signals generated by the changes in the signal pads and connecting them to the parallel single-bus serial communication circuit. The parallel data pins of n controller chips are connected together to form a parallel data line network (DIO), which is then connected to the MCU. The address code of the controller chip is written into the address code memory through an external fixture and used as the communication address code. Parallel single-bus serial communication circuits are used to process information from parallel data line networks; Information from the flexible conductive switch is transmitted on the parallel data line network DIO; The parallel data line network uses a serial single-bus communication protocol to transmit information about the flexible conductive switch.
7. The PCB containing conductive silicone springs and capable of full-bond non-overlapping bonding according to claim 1, characterized in that, The chip is a magic-controlling chip; The device chip integrates a control signal interface circuit and a serial single-bus serial communication circuit, including a control signal interface pin, a power supply pin, a ground pin, a serial signal input pin, and a serial signal output pin; the power supply pin is used to power the device chip, and the ground pin is used for signal grounding and power grounding; The control signal interface pins are connected to the signal pads on the PCB for communication. The control signal interface circuit is responsible for processing the elastic conductive switch signals generated by the changes in the signal pads and connecting them to the serial communication circuit on a single bus. The serial signal input pins and serial signal output pins of n control chip are cascaded to form a serial data line network DIN(1)-DOUT(n). The two ends of the serial data line network DIN(1) and DOUT(n) are connected to the MCU respectively. The MCU transmits the elastic conductive switch information to the MCU through the serial data line network DIN(1)-DOUT(n). A serial single-bus serial communication circuit is used to process information from a serial data line network. Information from the flexible conductive switch is transmitted on the serial data line network DIN(1)-DOUT(n); The serial data line network uses a serial single-bus communication protocol to transmit information about the flexible conductive switch.
8. The PCB containing conductive silicone springs and capable of full-key non-overlapping according to claim 1, characterized in that, The chip is a Yuhuan backup chip; The Yuhuan backup chip integrates a control signal interface circuit and a serial single-bus serial communication circuit, including a control signal interface pin, a power supply pin, a ground pin, a first serial signal input pin, a first serial signal output pin, a second serial signal input pin, and a second serial signal output pin; the power supply pin is used to supply power to the Yuhuan backup chip, and the ground pin is used for signal grounding and power grounding; The control signal interface pins are connected to the signal pads on the PCB for communication. The control signal interface circuit is responsible for processing the elastic conductive switch signals generated by the changes in the signal pads and connecting them to the serial communication circuit on a single bus. The first serial signal input pin and the first serial signal output pin of n Yuhuan backup chips are cascaded to form a first serial data line network DIN1(1)-DOUT1(n). The two ends of the first serial data line network DIN1(1) and DOUT1(n) are connected to the MCU respectively. The MCU transmits the elastic conductive switch information to the MCU through the first serial data line network DIN1(1)-DOUT1(n). The second serial signal input pins and second serial signal output pins of n backup chips are cascaded to form a second serial data line network DIN2(1)-DOUT2(n). The two ends of the second serial data line network DIN2(1) and DOUT2(n) are connected to the MCU respectively. The second serial data line network DIN2(1)-DOUT2(n) serves as a backup data line network for the first serial data line network DIN1(1)-DOUT1(n). A serial single-bus serial communication circuit is used to process information from a serial data line network. The flexible conductive switch information is transmitted on the first serial data line network DIN1(1)-DOUT1(n) or the second serial data line network DIN2(1)-DOUT2(n); The serial data line network uses a serial single-bus communication protocol to transmit information about the flexible conductive switch.
9. The PCB containing conductive silicone springs and capable of full-bond non-overlapping bonding according to claim 1, characterized in that, The chip is a Yuhui backup chip; The Yuhui backup chip integrates a control signal interface circuit, a parallel single-bus serial communication circuit, and an address code memory; it includes a control signal interface pin, a power supply pin, a ground pin, a first parallel data line pin, and a second parallel data line pin. The power supply pin is used to supply power to the Yuhui backup chip, and the ground pin is used for signal grounding and power grounding. The control signal interface pins are connected to the signal pads on the PCB for communication. The control signal interface circuit is responsible for processing the elastic conductive switch signals generated by the changes in the signal pads and connecting them to the parallel single-bus serial communication circuit. The first parallel data pins of n backup chips are connected together to form a first parallel data line network DIO1, which is then connected to the MCU; the second parallel data pins of n backup chips are connected together to form a second parallel data line network DIO2, which is then connected to the MCU. The second parallel data line network DIO2 serves as a backup data line network for the first parallel data line network DIO1; the address code of the backup chip is written into the address code memory through an external fixture and used as the communication address code. Parallel single-bus serial communication circuits are used to process information from parallel data line networks; The flexible conductive switch information is transmitted on the first parallel data line network DIO1 or the second parallel data line network DIO2; The parallel data line network uses a serial single-bus communication protocol to transmit information about the flexible conductive switch.
10. The PCB containing conductive silicone springs and capable of full-bond non-overlapping bonding according to claim 1, characterized in that, The PCB is either a rigid PCB or a flexible FPC.
11. A button, characterized in that, The device includes a keycap and a key pressing component. The key pressing component is a commonly used scissor-switch structure component, a crater structure component, or other pressing structure component. The keycap is assembled on the key pressing component. When the keycap is pressed down, the conductive silicone spring of claim 1 conducts with the solder pad, generating a signal change that triggers the switch. When the keycap is released, the conductive silicone spring and the solder pad reset the switch.
12. A keyboard, characterized in that, A keyboard manufactured using the PCB described in claims 1 to 10 and the key described in claim 11 as its core.