Filter and massive multiple-input multiple-output unit device in wireless communication system

Abstract

The present disclosure relates to a 5th-Generation (5G) or pre-5G communication system for supporting a higher data transmission rate than a 4th-Generation (4G) system such as Long Term Evolution (LTE). A filter and a massive multiple-input multiple-output unit apparatus in a wireless communication system are disclosed. A filter in a wireless communication system includes a resonant plate in which a cover, a housing, a printed circuit board (PCB), and a plurality of resonators are formed in a single layer, where the resonant plate may be disposed between the cover and the PCB.

Description

[0001] This application is a divisional application of the patent application filed on June 23, 2021, with application number 202180045095.7 and entitled "Antenna Filter in Wireless Communication System and Electronic Device Including the Antenna Filter". Technical Field

[0002] This disclosure generally relates to wireless communication systems, and more specifically, to antenna filters in wireless communication systems and electronic devices including such antenna filters. Background Technology

[0003] Since the commercialization of fourth-generation (4G) communication systems, efforts have been ongoing to develop enhanced fifth-generation (5G) communication systems, or pre-5G communication systems, to meet the ever-increasing demand for wireless data traffic. For this reason, 5G or pre-5G communication systems are referred to as super-4G network communication systems or post-Long Term Evolution (LTE) systems.

[0004] 5G communication systems are considered to be implemented in ultra-high frequency (millimeter wave) bands (e.g., the 60 GHz band) to achieve high data transmission rates. For 5G communication systems, technologies are being discussed for beamforming, massive MIMO, full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, and large antennas to mitigate path loss of radio waves and increase transmission distance in the ultra-high frequency band.

[0005] In addition, technologies for Evolved Small Cell, Advanced Small Cell, Cloud Ratio Access Network (RAN), Ultra-Dense Network, Device-to-Device Communication (D2D), Wireless Backhaul, Mobile Network, Cooperative Communication, Cooperative Multipoint (CoMP), and Interference Cancellation are being developed for 5G communication systems to enhance the network of the system.

[0006] In addition, hybrid frequency shift keying and orthogonal amplitude modulation (FQAM) and sliding window superposition coding (SWSC) as advanced coding and modulation (ACM) schemes, as well as filter bank multicarrier (FBMC), non-orthogonal multiple access (NOMA) and sparse code multiple access (SCMA) as enhanced access technologies in 5G systems are under development.

[0007] Products incorporating multiple antennas to enhance communication performance are under development, and it is anticipated that equipment with a large number of antennas utilizing massive MIMO technology will be used. As the number of antenna elements in communication equipment increases, the number of accompanying radio frequency (RF) components (e.g., filters) will inevitably increase as well. Summary of the Invention

[0008] Technical issues

[0009] Based on the above discussion, this disclosure provides an apparatus and method for miniaturizing filters in wireless communication systems.

[0010] Furthermore, this disclosure provides an apparatus and method for a filter with a suspension structure in a wireless communication system.

[0011] Furthermore, this disclosure provides an apparatus and method for achieving the same performance as a metal cavity filter in a wireless communication system using a filter with a suspension structure.

[0012] Furthermore, this disclosure provides an apparatus and method for enhancing filter characteristics by generating multiple cross-couplings in a wireless communication system.

[0013] Solution to the problem

[0014] According to various embodiments of the present disclosure, a filter in a wireless communication system may include: a cover; a housing; a printed circuit board (PCB); and a resonant plate in which a plurality of resonators are formed on a single layer, the resonant plate being disposed between the cover and the PCB.

[0015] According to various embodiments of the present disclosure, a massive MIMO unit (MMU) device in a wireless communication system may include: at least one processor configured to process signals; a plurality of filters configured to filter signals; and an antenna array configured to radiate signals, wherein the plurality of filters may include filters configured by a resonant plate arranged between a top cover and a filter plate, wherein a plurality of resonators are formed on a single layer in the resonant plate.

[0016] Beneficial effects of the invention

[0017] The apparatus and methods according to various embodiments of this disclosure can achieve product miniaturization through filters with suspension structures, while enhancing filter performance by generating multiple cross-couplings.

[0018] The effects achieved in this disclosure are not limited to those mentioned above. Based on the description provided below, those skilled in the art will clearly understand other effects not mentioned above. Attached Figure Description

[0019] Figure 1a This is a view illustrating a wireless communication system according to various embodiments of the present disclosure.

[0020] Figure 1b This is a view illustrating examples of antenna arrays in a wireless communication system according to various embodiments of the present disclosure.

[0021] Figure 2This is a cross-sectional view showing the suspension structure according to various embodiments of the present disclosure.

[0022] Figure 3 This is a view illustrating examples of filters with suspension structures according to various embodiments of the present disclosure.

[0023] Figure 4 This is an exploded perspective view of a filter with a suspension structure according to various embodiments of the present disclosure.

[0024] Figure 5a This is a view illustrating examples of cross-coupling of filters with suspension structures according to various embodiments of the present disclosure.

[0025] Figure 5b This is a view illustrating examples of the cross-coupling of filters with suspension structures according to various embodiments of the present disclosure, and the performance of the filters.

[0026] Figure 6a This is a view illustrating an example arrangement of strips for cross-coupling in a filter with a suspension structure according to an embodiment of the present disclosure.

[0027] Figure 6b This is a view illustrating an example of a coupling connection in a filter with a suspension structure according to an embodiment of the present disclosure.

[0028] Figure 7 This is a view illustrating an example of filter performance in a filter with a suspension structure according to an embodiment of the present disclosure, showing the band arrangement.

[0029] Figure 8 This is a view illustrating the functional configuration of an electronic device including a filter with a suspension structure according to various embodiments of the present disclosure. Detailed Implementation

[0030] The terminology used in this disclosure is for describing particular embodiments and is not intended to limit the scope of other embodiments. Singular terms may include plural forms unless otherwise stated. All terms used herein, including technical or scientific terms, may have the same meaning as commonly understood by one of ordinary skill in the art. It will also be understood that terms defined in dictionaries may be interpreted as having the same or similar meaning as in the context of the related art, and not in an idealized or over-formalized manner, unless expressly so defined herein. In some cases, even if a term is defined in the specification, it should not be construed as excluding embodiments of this disclosure.

[0031] In the various embodiments of this disclosure described below, hardware-based methods will be described by way of example. However, the various embodiments of this disclosure include techniques using both hardware and software, and therefore software-based methods are not excluded.

[0032] As used in the following description, terms indicating components of an electronic device (e.g., substrate, board, printed circuit board (PCB), flexible PCB (FPCB), module, antenna, antenna element, circuit, processor, chip, component, device), terms indicating the shape of a component (e.g., structure, structure, support portion, contact portion, protrusion, opening), terms indicating the connection portion between structures (e.g., connection portion, contact portion, support portion, contact structure, conductive member, assembly), and terms indicating circuits (e.g., PCB, FPCB, signal line, feeder, data line, RF signal line, antenna line, RF path, RF module, RF circuit) are merely examples for ease of explanation. Therefore, this disclosure is not limited to the terms described below, and other terms with the same technical meaning may be used. Furthermore, terms such as “…part,” “…unit,” or those ending in the suffixes “-device” and “-piece” refer to at least one shape structure or unit that performs a function.

[0033] Furthermore, in this disclosure, the expressions "greater than" or "less than" can be used to determine whether a specific condition is met or reached; however, these expressions are merely for illustrative purposes and do not preclude the expressions "greater than or equal to" or "less than or equal to". A condition described by "greater than or equal to" can be replaced by "greater than", a condition described by "less than or equal to" can be replaced by "less than", and a condition described by "greater than or equal to and less than" can be replaced by "greater than and less than or equal to".

[0034] Furthermore, this disclosure describes various embodiments using terminology used in some communication standards (e.g., the 3rd Generation Partnership Project (3GPP), the Institute of Electrical and Electronics Engineers (IEEE)), but these embodiments are merely examples. The various embodiments of this disclosure can be readily modified and applied to other communication systems.

[0035] The metal cavity filter and the suspended filter mentioned in this disclosure can be determined based on the arrangement of the resonators. The metal cavity filter has a structure comprising multiple metal cavities and resonators disposed within each cavity. Each resonator can be referred to as a "pole". However, the suspended filter has a structure comprising resonators on a single layer, i.e., a suspended structure. Air gaps exist in the upper and lower portions of the resonators. The suspended filter may include a plate in which the resonators are implemented between two air gaps.

[0036] To achieve magnetic cross-coupling, metal cavity resonators can be positioned in finite locations (e.g., where the three poles form a triangle), and metal cavity filters can include additional structures (e.g., screws or tuning bolts) for adjusting them. However, because suspended structure filters can transmit radio frequency (RF) signals through an air layer without the obstructions of structures forming the metal cavity and additional structures, suspended structure filters can exhibit relatively more cross-coupling than metal cavity filters.

[0037] The present disclosure described below relates to antenna filters in wireless communication systems and electronic devices including such antenna filters. Specifically, the present disclosure describes techniques for achieving miniaturization and enhanced filter performance in wireless communication systems by using filters with suspended structures instead of metal cavity filters as antenna filters.

[0038] Figure 1a Wireless communication systems according to various embodiments of the present disclosure are illustrated. For example, Figure 1a The wireless communication environment 100 includes a base station 110 and a terminal 120, which are part of the nodes using the wireless channel.

[0039] Base station 110 is a network infrastructure that provides wireless access to terminal 120. Base station 110 has a coverage area defined as a predetermined geographical area based on the distance at which the signal can be transmitted. In addition to base station, base station 110 may also be referred to as "massive multiple-input multiple-output (MIMO) unit (MMU)," "access point (AP)," "eNodeB (eNB)," "fifth-generation (5G) node," "5G NodeB (NB)," "wireless point," "transmit / receive point (TRP)," "access unit," "distributed unit (DU)," "transmit / receive point (TRP)," "radio unit (RU)," "remote radio headend (RRH)," or other terms with the same technical meaning as those mentioned above.

[0040] Terminal 120 is a device used by a user and can communicate with base station 110 via a wireless channel. In some cases, terminal 120 can operate without user intervention. That is, terminal 120 is a device that performs machine-type communication (MTC) and can be carried by no user. Besides "terminal," terminal 120 may also be referred to as "user equipment (UE)," "mobile station," "subscriber station," "customer equipment (CPE)," "remote terminal," "wireless terminal," "electronic device," "vehicle terminal," "user equipment," or other terms with the same technical meaning as those mentioned above.

[0041] Figure 1bExamples of antenna arrays in wireless communication systems according to various embodiments of the present disclosure are shown. Beamforming can be used as one of the techniques for mitigating radio propagation path loss and increasing the transmission distance of radio propagation. Beamforming can generally concentrate the arrival area of ​​radio propagation by using multiple antennas, or it can improve the directivity of the receiver sensitivity with respect to a particular direction. Therefore, base station 110 may include multiple antennas to form beamforming coverage, rather than forming a signal in an isotropic mode by using a single antenna. Antenna arrays including multiple antennas will be described below. Figure 1b The examples of antenna arrays shown are merely examples for explaining embodiments of this disclosure and are not to be construed as limiting other embodiments of this disclosure.

[0042] Reference Figure 1b Base station 110 may include antenna array 130. According to an embodiment, base station 110 may include a massive MIMO unit (MMU) comprising antenna array 130. Each antenna included in antenna array 130 may be referred to as an array element or antenna element. Figure 1b In this embodiment, antenna array 130 is shown as a two-dimensional planar array, but this is merely an example and does not limit other embodiments of this disclosure. According to another embodiment, antenna array 130 can be configured in various forms, such as a linear array. The antenna array can be referred to as a massive MIMO (Massively Multi-Size Antenna Array).

[0043] A key technology for enhancing data capacity in 5G communications could be beamforming using antenna arrays connected to multiple RF paths. To increase data capacity, the number of RF paths should increase, or the power of each RF path should increase. Increasing the number of RF paths leads to a larger product size, and currently, it's nearly impossible to increase the number of RF paths due to space constraints when installing actual base station equipment. Splitters (or dividers) can be used in the RF paths to increase antenna gain through higher output without increasing the number of RF paths. Therefore, multiple antenna elements can be connected using splitters, and the antenna gain can be increased.

[0044] The number of antennas (or antenna elements) in equipment performing wireless communication (e.g., base station 110) is increasing to enhance communication performance. Furthermore, the number of RF components (e.g., amplifiers, filters) and components used to process RF signals received or transmitted through the antenna elements is increasing. Therefore, when configuring communication equipment, it may be necessary to achieve spatial gain and cost efficiency while meeting communication performance requirements. As the number of paths increases, the number of filters in each antenna element used to process signals also increases.

[0045] Filters can include circuitry for filtering signals to transmit at a desired frequency by forming resonance. That is, filters can perform the function of selectively identifying frequencies. Desired filter characteristics can be obtained by applying a shape structure to the filter, but this may result in performance limitations. Many techniques have been proposed to minimize performance losses caused by the applied shape. In particular, miniaturization and weight reduction of filters are needed to arrange multiple filters in a limited space. For example, metal cavity filters may require a separate material (e.g., metal) for fixing, and each resonator is very sensitive, thus having the disadvantage of having to be manually tuned by screws. Such tuning can degrade mass production, potentially leading to high defect rates and increasing the price of the filter. Therefore, while metal cavity filters can be stable in terms of performance, they may be unsuitable for mass production as the number of antenna elements and RF paths increases. To address these problems and replace filters of related technologies (e.g., metal cavity filters), this disclosure proposes a simple and efficient structure that optimizes performance through a filter with a suspension structure.

[0046] Suspension structure

[0047] Figure 2 Cross-sections of suspension structures according to various embodiments of the present disclosure are shown. The suspension structures according to various embodiments of the present disclosure refer to structures in which a resonator is disposed within the space of a filter. Two air gaps may be formed, respectively, on the upper and lower surfaces of the plate in which the resonator is formed. In other words, the suspension structure may refer to a structure including a resonator plate between the two air gaps. As described above, compared to filters including metal cavity resonators, the suspension structures according to various embodiments of the present disclosure can be used to reduce the size of the filter.

[0048] Reference Figure 2 The filter 200 may include a first substrate 201, a second substrate 203, and a resonant plate 220. The resonant plate 220 may be referred to by various terms. For example, the resonant plate 220 may be referred to as a suspension plate. Furthermore, for example, the resonant plate 220 may be referred to as an intermediate plate. Furthermore, for example, the resonant plate 220 may be referred to as an interceptor plate or a blocked plate. Furthermore, for example, the resonant plate 220 may be referred to as a buffer plate. In the present disclosure described below, the resonant plate 220 may be referred to as a suspension plate 220, but other terms may be used. In other words, suspension plate 220 is merely a term used to indicate a resonator plate arranged by a suspension structure, and the term itself is not to be construed as limiting a particular function or configuration.

[0049] The first substrate 201 may be configured to face the upper surface of the suspension plate 220, which will be described below, and the second substrate 201 may be configured to face the lower surface of the suspension plate 220. According to an embodiment, the first substrate 201 may be a cover, and the second substrate 203 may be a plate (e.g., a printed circuit board (PCB)) for arranging the filter 200. The first substrate 201 and the second substrate 203 may together with a housing (not shown) surrounding the side surfaces form a space in the filter 200. The first substrate 201, the second substrate 203, and the housing are referred to as structures for forming spaces, but these are merely examples of structures for forming air gaps therein and are not intended to limit the suspension structures of this disclosure. For example, to form an internal space, at least one of the first substrate 201 or the second substrate 203 may be implemented as a single structure together with a housing surrounding the side surfaces.

[0050] A suspension plate 220 can be disposed in the space formed by the first substrate 201 and the second substrate 203. The suspension plate 220 is disposed between the first substrate 201 and the second substrate 203, such that the formed space is divided into a first air gap 211 and a second air gap 213. The first air gap 211 can be located between one surface of the suspension plate 220 and the first substrate 201. The second air gap 213 can be located between the other surface of the suspension plate 220 and the second substrate 203. Because the suspension plate is disposed between the two air gaps, the suspension plate can be referred to as a suspended air strip, a suspended air plate, or a term with the same meaning. A resonator implemented on the suspension plate can be referred to as a suspended resonator, a suspended air strip resonator, or a term with the same meaning.

[0051] The resonator of filter 200 can be implemented on suspension plate 200. Due to the air gap of filter 200, dielectric loss can be reduced. The reduction in dielectric loss can provide enhancements in insertion loss and reflection coefficient characteristics. These characteristics can overcome the disadvantages of metal cavities while providing performance similar to that of metal cavity filters. Therefore, filters according to various embodiments of this disclosure offer a solution that provides performance for replacing metal cavity filters through suspension structures while miniaturizing the product and minimizing manufacturing errors.

[0052] resonant circuit

[0053] Figure 3 Examples of filters 300 with suspension structures according to various embodiments of the present disclosure are shown. Figure 3 The filter 300 example illustrates a suspension structure. Figure 2 Filter 200. Figure 3 The filter 300 may include a resonant circuit implemented on the suspension plate.

[0054] Reference Figure 3The filter 300 may include an input port 311 and an output port 312. An RF signal can be applied to the input port 311. The filter 300 can transmit some frequency components of the RF signal received through the input port 311 to the output port 312 by the operation of the resonator, which will be described below. The filtered RF signal can be transmitted to an antenna through the output port 312. Here, the antenna may correspond to antenna elements of an antenna array or subarray.

[0055] Filter 300 may include a resonant circuit. The phenomenon where energy at the frequency corresponding to the corresponding period is transferred without loss when the periodicity of the resonant circuit structure (e.g., cavity) matches the periodicity of the signal is called resonance. The inductive and capacitive loads of the filter can be designed through structural arrangement so that the filter can control the desired and unwanted frequency band components of the RF signal. The characteristic that allows the desired frequency band components to pass is called the bandpass characteristic, and the characteristic that blocks the unwanted frequency band components is called the bandstop characteristic.

[0056] The resonant circuit of filter 300 may include multiple resonators. Filter 300 may include a first resonator 321, a second resonator 322, a third resonator 323, a fourth resonator 324, a fifth resonator 325, and a sixth resonator 326. A single-layer (i.e., two-dimensional) suspension structure can be implemented in the filter using a resonant circuit on the suspension plate instead of the resonant circuit of a metal cavity filter of the related art (i.e., resonators corresponding to the metal cavity respectively). Multiple resonators are formed by a single plate (i.e., suspension plate), rather than by arranging resonators in a metal cavity and arranging individual tuning bolts between the resonators, thereby simplifying the assembly process. Figure 3 The six resonant circuits are merely examples of exemplary structures for filter 300 and are not to be construed as limiting other embodiments of this disclosure.

[0057] According to various embodiments, each resonator may include a resonator having a T-shape (hereinafter referred to as a T-shaped resonator). The T-shaped resonator may be included in a suspension plate (e.g., Figure 2 In the suspension plate 220), to minimize the size of the filter 300. A T-shaped resonator is a circuit in which passive components (e.g., capacitors, inductors, or resistors) that provide the resonant frequency are arranged in a "T" shape. By using a T-shaped arrangement instead of a linear arrangement, the area of ​​the resonator on a single layer can be reduced. The resonant frequency can be determined by the arrangement and values ​​of the inductive load (e.g., inductance) and capacitive load (e.g., capacitance) of the resonator, and this is used to allow a specific frequency band to pass. The values ​​of the T-shape (e.g., height, width, and dimensions) can be determined based on the desired inductance and capacitance values. A T-shaped resonator can be connected to the RF signal lines of the input and output ports.

[0058] According to the implementation, multiple resonators can be arranged in series in one direction. T-shaped resonators can be arranged in series along the RF signal line. In this case, the inductive or capacitive load of a particular resonator can lead to coupling with the inductive or capacitive load of another particular resonator that is not adjacent. The size and position of each resonator can be related to the dimensions of the cross-coupling. By considering the cross-coupling effect (e.g., Figure 5a and Figure 5b Considering the S-parameters (the cross-coupling characteristics), multiple T-shaped resonators can be designed, which will be discussed below. Figure 5a and Figure 5b The size and location of each T-shaped resonator can be determined based on the requirements of the filter. T-shaped resonators, together with the characteristics of the suspension structure, can provide the effect of reducing filter size.

[0059] Filter with suspension structure

[0060] Figure 4 This is an exploded perspective view of a filter with a suspension structure according to various embodiments of the present disclosure. Filter 400 illustrates a filter with a suspension structure. Figure 2 Filter 200 and Figure 3 Filter 300. Will pass through Figure 4 The exploded perspective view is used to describe the manufacturing process of filter 400.

[0061] Reference Figure 4 The filter 400 may include multiple structures stacked one on top of another in the z-axis direction. The filter 400 may include a cover 410, a suspension plate 420, a housing 430, and a PCB 440. The cover 410, housing 430, and PCB 440 may form an internal space within the filter 300. The internal space may include air gaps as a medium. The internal space may include air gaps separated by the insertion of the suspension plate 420. The suspension plate may be referred to as a suspension air plate. Figure 3 As mentioned, the resonant circuit can be implemented on the suspension plate 420. The region of the resonant circuit of the suspension plate 420 corresponding to the multiple resonators can be formed by conductors. That is, the region of the resonant circuit of the suspension plate 420 can be occupied by conductors. In addition, the region other than the multiple resonators can be empty. In other words, the multiple resonators can be formed on a single layer. Note that this structure is different from the structure of arranging suspension lines on a dielectric board.

[0062] As the number of antennas increases, the complexity of RF components used to process RF signals also increases. Due to rental costs or space constraints at installation locations, RF components (antenna elements / filters / power amplifiers / transceivers, etc.) may need to be small, lightweight, and manufactured at low cost. Furthermore, since communication equipment is assembled from multiple RF components, the tolerances introduced each time the RF components are assembled increase, which can lead to performance degradation. Moreover, even when performing the same function, the cost of meeting the required communication performance can become an expense due to differences in structure and electrical characteristics. The resonant circuit for operating the filter 400 can be implemented on a single layer on the suspension plate 420, instead of including screws for fastening between structures and tuning bolts for controlling cross-coupling, thus greatly simplifying the manufacturing process. Furthermore, due to the air gap, the filter with cross-coupling effect can be implemented without additional structures. The filter 400 can minimize insertion loss due to connections with additional structures and errors caused by the connection process, thus facilitating mass production.

[0063] According to the embodiment, the PCB 440, the suspension plate 420, and the cover 410 can be arranged to be stacked sequentially with reference to the (-) z-axis direction. In this case, the first surface of the suspension plate 420 along the (+) z-axis and the cover 410 can be configured to form a first air gap along the z-axis, and the second surface of the suspension plate 420 along the (-) z-axis and the PCB 440 can be configured to form a second air gap along the z-axis.

[0064] According to one embodiment, the suspension plate 420 may include an input port (not shown) and an output port (not shown), as well as RF signal lines (not shown) connecting the input port and the output port. In other words, the input port, the output port, and the RF signal lines may be formed in the same layer as the resonators of the suspension plate 420. According to one embodiment, the suspension plate 420 may have a shape in which multiple resonators are connected to the RF signal lines. The input port may be connected to one side of the housing 430, and the output port may be connected to the other side of the housing 430.

[0065] According to one embodiment, the housing 430 may include a recess formed therein to receive the suspension plate 420. The recess allows the suspension plate 420 to be more easily secured to the housing 430. The suspension plate 420 may be positioned within the filter 400 to form a specified gap from the PCB 440 or the cover 410, thereby minimizing errors caused by assembly.

[0066] According to embodiments, the filter 400 can be mounted on a PCB (e.g., PCB 440) using surface mount technology (SMT), thereby simplifying the manufacturing process. SMT can be applied to simplify the assembly process between connecting components (e.g., cover 410 for forming spaces, housing 420, PCB 440, and suspension board 430 including resonant circuitry). Filters including suspension structures according to various embodiments of this disclosure can be mounted on a filter board (e.g., PCB 440) via SMT. Figure 4 On the PCB 440, this allows for greater optimization of mass production. According to another embodiment, the PCB may include one or more engagement slots for fastening to the housing.

[0067] If passed Figure 4 As described above, without additional structures, the filter 400 can be formed not only using the suspension plate 420 but also using the input ports, output ports, and RF signal lines in a single layer. Furthermore, the filter 400 can be implemented as a single component together with the cover 410, housing 420, and PCB 440. The filter 400, implemented as a single component, can be easily mass-produced, and as... Figure 1b As shown, the filter can be easily coupled to each antenna integrated into the antenna array. In particular, this filter also offers enhanced performance compared to other filters due to its low manufacturing and assembly errors.

[0068] Cross-coupling

[0069] Figure 5a Examples of cross-coupling of filters with suspension structures according to various embodiments of the present disclosure are shown. This filter exemplifies a filter with a suspension structure. Figure 4 The filter is 400. Here, cross-coupling refers to the coupling between resonators, not sequential coupling.

[0070] Reference Figure 5a Plan view 510 shows the view from above (e.g., Figure 4 When viewed in the (-) z-axis direction, at the suspension plate (e.g., Figure 4 The resonant circuit on the suspension plate 420. The resonant circuit of the filter 400 may include a first resonator 511, a second resonator 512, a third resonator 513, a fourth resonator 514, a fifth resonator 515, and a sixth resonator 516. The front view 530 shows the resonant circuit when viewed from the front (e.g., Figure 4 The filter (e.g., in the (-)y-axis direction) when observing. Figure 4(Filter 400). Front view 530 shows cross-coupling between non-adjacent resonators, as the opposite concept of sequential coupling. For example, the coupling between the first resonator 511 and the second resonator 512 may not correspond to cross-coupling. The coupling between the first resonator 511 and a resonator not adjacent to it corresponds to cross-coupling. For example, the coupling between the first resonator 511 and the third resonator 513, the coupling between the first resonator 511 and the fourth resonator 514, the coupling between the first resonator 511 and the fifth resonator 515, or the coupling between the first resonator 511 and the sixth resonator 516 corresponds to cross-coupling.

[0071] Figure 5b Examples of cross-coupled filter performance of filters with suspension structures according to various embodiments of the present disclosure are shown. Performance refers to S-parameters indicating the ratio of the output signal to the input signal.

[0072] refer to Figure 5b The curve 570 indicates the S-parameter S. 21 As a characteristic of filter 400. The horizontal axis indicates frequency (unit: GHz), and the vertical axis indicates S. 21 (Unit: dB). S 21 Indicates the transmittance coefficient, and through S 21 The bandpass performance of the filter can be identified, as well as its bandstop characteristics. According to an embodiment, filter 400 may include a bandpass filter to allow signals in a specific frequency band (e.g., from approximately 3.5 GHz to 3.8 GHz) to pass through. Referring to the frequency band from approximately 3.5 GHz to 3.8 GHz in graph 570, high SB values ​​close to 0 dB can be identified. 21 In other words, the RF signal in the passband can pass through filter 400 without loss. On the other hand, it can be identified that notches are formed in the frequency band after 4 GHz (e.g., first notch (about 3.9 GHz), second notch (about 4.1 GHz), third notch (about 4.4 GHz), fourth notch (about 5 GHz), fifth notch (about 6.1 GHz), and sixth notch (about 7.3 GHz)).

[0073] Filter performance can be categorized into bandpass and attenuation characteristics. Bandpass characteristics can be determined by the resonance of a combination of inductive and capacitive loads. Attenuation characteristics can be categorized into insertion loss and skirt characteristics. Insertion loss indicates the characteristic that the input power is not fully output and acts as a loss due to the insertion of components or circuitry. Skirt characteristics refer to the bandpass characteristic curve (e.g., ...). Figure 5bThe slope in the boundary frequency band (e.g., after 3.8 GHz) of the curve (Figure 570). A steep slope can indicate high passivity. In other words, the presence of a notch, indicating a low passivity coefficient, enhances the skirt characteristics in the boundary frequency band. As the filter order increases, that is, the number of resonators increases, the skirt characteristics can be enhanced, but inversely proportionally, the insertion loss increases. To maintain a constant insertion loss, the resonators (first resonator 511, second resonator 512, third resonator 513, fourth resonator 514, fifth resonator 515, sixth resonator 516) of the filter 400 according to various embodiments can be configured to form a notch through cross-coupling.

[0074] In S 21 The notch formed at the low point of the parameter curve 570 indicates that many RF signals do not pass through in the corresponding frequency band. In other words, the notch formed at the low point signifies high reflection loss, meaning the filter blocks RF signals in the corresponding frequency band. The performance of the filter can be further enhanced by allowing signals in a specific frequency band to pass through while blocking signals in an adjacent frequency band.

[0075] Due to distance constraints between resonators and structural limitations of the metal cavity, metal cavity filters in related technologies may require a triangular arrangement with three resonators (i.e., three poles) as vertices. The purpose of this triangular arrangement is to enhance the bandpass filter characteristics by forming a notch. Furthermore, metal cavity filters may require additional structures (e.g., tuning bolts) to adjust cross-coupling. The additional structures and the arrangement required to form the notch may increase the filter size. However, filters with suspension structures according to various embodiments of this disclosure may not require forming a metal cavity and can utilize air gaps (e.g., Figure 2 The filter transmits RF signals through a first air gap 211 or a second air gap 213. Therefore, since even short distances are sufficient to induce cross-coupling of the RF signal, miniaturization of the filter is possible. Furthermore, the manufacturing process is simplified because no additional structures for forming cross-coupling are required. In other words, this filter can generate more cross-coupling within a limited size than a metal cavity filter and can form multiple notches. This results in enhanced skirt characteristics and enhanced S-parameter characteristics of the filter.

[0076] To explain cross-coupling, Figure 5aCross-coupling between the first resonator 511 and the third resonator 511, between the first resonator 511 and the fourth resonator 514, between the first resonator 511 and the fifth resonator 515, and between the first resonator 511 and the sixth resonator 516 are shown. However, this is only an example used to illustrate the cross-coupling of the first resonator 511. That is, the second resonator 512 can form cross-couplings with the fourth resonator 514, the fifth resonator 515, and the sixth resonator 516, respectively. Similarly, the third resonator 513, the fourth resonator 514, the fifth resonator 515, and the sixth resonator 516 can all form cross-couplings with other resonators (e.g., non-adjacent resonators). As described above, because the resonators in a resonant circuit implemented on a suspension plate use an air gap as a medium to easily transmit the RF signal of a particular resonator to another resonator, the resonators can form more cross-couplings within a limited size than a metal cavity resonator filter (in other words, a metal cavity filter). Furthermore, if the same or similar performance is guaranteed (e.g., S-parameters S11 or S21), a filter smaller than a metal cavity filter can be achieved through a suspension structure.

[0077] Figure 6a An example of the arrangement of strips for cross-coupling in a filter with a suspension structure according to an embodiment of the present disclosure is shown. The desired cross-coupling structure can be achieved by adding strips to the suspension plate of the filter.

[0078] Reference Figure 6a Perspective view 610 shows the three-dimensional structure of the suspension plate with added straps. Front view 620 is a view of the suspension plate from the front. Filter 600 may be included in, as shown in reference... Figure 3 and Figure 4 The resonant circuit is implemented on the suspension plate. Filter 600 may include an input port and an output port. Filter 600 may include a resonant circuit. The resonant circuit of filter 600 may include multiple resonators. According to an embodiment, each resonator may include a resonator with a T-shape (hereinafter referred to as a T-shaped resonator). According to an embodiment, multiple resonators may be arranged in series in one direction. In this case, a particular resonator may cause coupling with another particular resonator that is not adjacent.

[0079] According to one embodiment, filter 600 may include a band 611 for magnetic coupling between adjacent resonators. According to another embodiment, filter 600 may include bands 616 and 617 for cross-coupling between non-adjacent resonators. The non-adjacent resonators are connected by the arrangement of these bands, allowing the resonant circuit of filter 600 to generate the desired cross-coupling.

[0080] Figure 6bExamples of coupling connections in a filter with a suspension structure according to various embodiments of the present disclosure are shown. The resonant circuit of filter 600 may include multiple resonators. Each resonator may be represented by an RLC combination (a combination configured by using at least one of a resistor (R), an inductor (L), and a capacitor (C). A wired connection may be represented as an inductor (L).

[0081] Reference Figure 6b Multiple resonators can be arranged in series in one direction. In this case, the coupling between adjacent resonators can be referred to as electrical coupling. Electrical coupling between adjacent resonators can form a capacitive load.

[0082] According to the implementation, the stripline can be positioned between non-adjacent resonators. When the stripline is positioned between non-adjacent resonators, the coupling between the non-adjacent resonators can be referred to as magnetic cross-coupling 660. The magnetic cross-coupling between non-adjacent resonators can form an inductive load.

[0083] According to the implementation, the stripline can be positioned between adjacent resonators. When the stripline is positioned between adjacent resonators, the coupling between adjacent resonators can be referred to as magnetic coupling 670. Magnetic coupling between adjacent resonators can form an inductive load. Although not in Figure 6b As shown in the figure, but as mentioned above, adjacent resonators can also form coupled loads.

[0084] If passed Figure 6a and Figure 6b The inductive or capacitive load formed in the resonant circuit of the suspension plate can vary depending on the arrangement of the additional bands. The load characteristics of the resonant circuit affect the performance of the filter 600. Specifically, the pass coefficient can vary based on coupling performance, and in particular, cross-coupling can be associated with the appearance of notch filters. The appearance of notch filters, indicating low pass coefficients, enhances the skirt characteristics in the boundary frequency band.

[0085] Figure 7 Examples of filter performance based on band arrangement in filters with suspension structures according to various embodiments of the present disclosure are shown.

[0086] Reference Figure 7 In the first example 710, the first resonator, the second resonator, and the third resonator can be connected in series. The first and second resonators that are adjacent to each other can be connected by a strip, and the first and third resonators that are not adjacent to each other can also be connected by a strip. An inductive load can be formed between the first and second resonators by a strip (although not shown, an effective capacitive connection can also exist between the first and second resonators).

[0087] In the second example 720, the first, second, and third resonators can be connected in series, and the first and third resonators, which are not adjacent to each other, can be connected by a band. Skirt characteristics can appear in the high-frequency band. A capacitive load can be formed between two adjacent resonators. An inductive load can be formed between the first and third resonators, which are not adjacent to each other.

[0088] In the third example 730, the first, second, third, and fourth resonators can be connected in series, and the first and fourth resonators, which are not adjacent to each other, can be connected by a band. A capacitive load can be formed between two adjacent resonators. An inductive load can be formed between the first and third resonators, which are not adjacent to each other. By arranging the four resonators with a band, a skirt characteristic appears on both sides relative to the passband.

[0089] Figure 8 The functional configuration of an electronic device including a filter with a suspension structure according to various embodiments of the present disclosure is illustrated. Electronic device 810 may be... Figure 1a One of the base station 110 or terminal 120. According to an embodiment, the electronic device 810 may be an MMU. Embodiments of this disclosure include not only... Figures 1a to 7 The antenna structure mentioned includes, but is not limited to, the electronic device containing the antenna structure. The electronic device 801 may include filters having suspension structures in the input and output paths of the RF signals.

[0090] Reference Figure 8 The illustration shows an exemplary functional configuration of an electronic device 810. The electronic device 810 may include an antenna unit 811, a filter unit 812, a radio frequency (RF) processing unit 813, and a controller 814.

[0091] Antenna unit 811 may include multiple antennas. The antennas perform the function of transmitting and receiving signals via a wireless channel. Antennas may include conductors formed on a substrate (e.g., a PCB) or radiators formed by conductive patterns. Antennas may radiate up-converted signals over the wireless channel or acquire signals radiated by another device. Each antenna may be referred to as an antenna element or antenna component. In some embodiments, antenna unit 811 may include an antenna array in which multiple antenna elements are formed. Antenna unit 811 may be electrically connected to filter unit 812 via RF signal lines. Antenna unit 811 may be mounted on a PCB including multiple antenna elements. The PCB may include multiple RF signal lines connecting the respective antenna elements and filters of filter unit 812. RF signal lines may be referred to as a feed network. Antenna unit 811 may provide received signals to filter unit 812 or may radiate signals provided from filter unit 812 into the air.

[0092] Filter unit 812 can perform filtering to transmit a signal at a desired frequency. Filter unit 812 can selectively identify frequencies by forming a resonance. According to various embodiments, filter unit 812 may include a resonator with a suspension structure according to various embodiments of the present disclosure. Filter unit 812 may include a plate filter, wherein air gaps are formed at the upper and lower portions. Filter unit 812 may include a resonator substrate in the filter as a suspended air band structure. According to embodiments, the resonator substrate may be a plate on which a plurality of T-shaped resonators are formed. Filter unit 812 may include at least one of a bandpass filter, a low-pass filter, a high-pass filter, or a band-stop filter. That is, filter unit 812 may include RF circuitry for obtaining a signal for a frequency band to be transmitted or received. According to various embodiments, filter unit 812 may be electrically connected to antenna unit 811 and RF processing unit 813.

[0093] RF processing unit 813 may include multiple RF paths. An RF path can be a unit of a path traversed by a signal received by an antenna or a signal radiated by an antenna. At least one RF path may be referred to as an RF chain. An RF chain may include multiple RF components. RF components may include amplifiers, mixers, oscillators, digital-to-analog converters (DACs), analog-to-digital converters (ADCs), etc. For example, RF processing unit 813 may include an upconverter that upconverts a baseband digital transmit signal to a transmit frequency, and a digital-to-analog converter (DAC) that converts the upconverted digital transmit signal into an analog RF transmit signal. The upconverter and DAC may form part of a transmission path. The transmission path may also include a power amplifier (PA) or a coupler (or combiner). Furthermore, for example, RF processing unit 813 may include an analog-to-digital converter (ADC) that converts an analog RF receive signal into a digital receive signal, and a downconverter that converts the digital receive signal into a baseband digital receive signal. The ADC and downconverter may form part of a receive path. The receive path may also include a low-noise amplifier (LNA) or a coupler (or distributor). The RF components of the RF processing unit may be implemented on a PCB. Base station 810 may include a structure in which antenna unit 811, filter unit 812, and RF processing unit 813 are stacked in the order mentioned above. The antenna and RF components of the RF processing unit can be implemented on a PCB, and the filters can be repeatedly connected between PCBs to form multiple layers.

[0094] Controller 814 controls the overall operation of electronic device 810. Controller 814 may include various modules for performing communication. Controller 814 may include at least one processor, such as a modem. Controller 814 may include modules for digital signal processing. For example, controller 814 may include a modem. When transmitting data, controller 814 generates complex symbols by encoding and modulating the transmitted bit stream. Furthermore, for example, when receiving data, controller 814 recovers the received bit stream by demodulating and decoding the baseband signal. Controller 814 can perform the functions of the protocol stack required by the communication standard.

[0095] Figure 8 The functional configuration of electronic device 810, which is an apparatus utilizing the antenna structure of this disclosure, is shown. Not only can it use devices with… Figure 4 The suspended structure of the filter 400 shown can be used Figures 6a to 7 The filter shown is configured with an additional band structure and serves as the filter of the electronic device 810 of this disclosure. However, Figure 8 The example shown merely utilizes... Figures 1a to 7 The exemplary configurations of antenna structures according to various embodiments of this disclosure are described, but the embodiments of this disclosure are not limited to those described herein. Figure 8 The components of the equipment shown. Therefore, the antenna module including the antenna structure, other configured communication equipment, and the antenna structure itself can be understood as embodiments of this disclosure.

[0096] In this disclosure, base stations or MMUs for base stations have been described as examples of antenna filters and electronic devices including such antenna filters; however, various embodiments of this disclosure are not limited thereto. As antenna filters and electronic devices including such antenna filters according to various embodiments of this disclosure, wireless equipment performing the same functions as a base station, wireless equipment connected to a base station (e.g., TRP), terminal 120, and other communication equipment for 5G communication can be used. In this disclosure, antenna arrays formed by subarrays have been described as examples of structures of multiple antennas for communication in a multiple-input multiple-output (MIMO) environment; however, in some embodiments, beamforming can be easily modified.

[0097] In this disclosure, tolerance refers to the acceptable limits of a standard range. A standard range can be determined based on acceptable limits (i.e., tolerances) defined with reference to nominal dimensions. Cumulative tolerance, or tolerance accumulation, can refer to the cumulative acceptable limits of an assembly based on the acceptable limits of individual components when assembling multiple parts. Operational tolerance can refer to tolerances defined based on component machining. In cases where the filter includes a metal cavity resonator, a welded structure can be applied for simplification. However, during the manufacturing process, it may be necessary to manage tolerances separately due to assembly tolerances of components such as the resonator, tuning bolts for cross-coupling, and screws for fastening the resonator. This tolerance can lead to increased costs. Ceramic filters offer advantages in terms of SMD application and size, but suffer from limitations in performance (e.g., S-parameters), limiting their use to a limited range of communication equipment.

[0098] To address the aforementioned issues, this disclosure has already adopted... Figures 1a to 8 A filter with a suspension structure is described. Multiple resonators are arranged to form layers in the filter within the same layer to achieve performance indicated by S-parameters. Furthermore, the size of the filter with the suspension structure of this disclosure is reduced, thereby having the effect of connecting the filter to a corresponding antenna in an antenna array and mass-producing the filter. Whether this disclosure is embodied can be determined by identifying the board in which the resonators are formed between the PCB, which serves as the filter board, and the cover of the filter product. In other words, whether this disclosure is embodied can be determined by the presence of the resonant board with the suspension structure. Furthermore, whether this disclosure is embodied can be determined by identifying the series arrangement of multiple resonators (e.g., T-shaped resonators) on the resonant board. This is because the series arrangement can form multiple notches of small size S21 and can provide high skirt characteristics for the filter.

[0099] According to embodiments of this disclosure, a filter in a wireless communication system may include: a cover; a housing; a printed circuit board (PCB); and a resonant plate in which a plurality of resonators are formed on a single layer, the resonant plate being disposed between the cover and the PCB.

[0100] According to embodiments of this disclosure, each of the plurality of resonators may be a T-shaped resonant circuit.

[0101] According to embodiments of this disclosure, the plurality of resonators can be connected in series with each other.

[0102] According to embodiments of this disclosure, on the resonant plate, the area corresponding to the plurality of resonators can be occupied by conductors, and the area other than the plurality of resonators can be empty.

[0103] According to embodiments of this disclosure, the PCB, the resonant plate, and the cover can be arranged to be stacked sequentially with reference to a specific direction, the first surface of the resonant plate and the cover can be arranged to form a first air gap based on the specific direction, and the second surface of the resonant plate and the PCB can be arranged to form a second air gap based on the specific direction.

[0104] According to embodiments of this disclosure, the resonant plate may include an input port and an output port, as well as an RF signal line connecting the input port and the output port. The input port may be connected to one side of the housing, and the output port may be connected to the other side of the housing.

[0105] According to embodiments of this disclosure, the RF signal line can be connected to the plurality of resonators.

[0106] According to embodiments of this disclosure, the output port can be connected to the antenna element of an antenna array.

[0107] According to embodiments of this disclosure, the housing may include grooves formed therein to accommodate a resonant plate.

[0108] According to embodiments of this disclosure, the PCB may include one or more engagement slots for fastening to the housing.

[0109] According to embodiments of this disclosure, the structure connecting the cover, housing, and resonant plate can be mounted on a PCB using surface mount technology (SMT).

[0110] According to embodiments of this disclosure, the plurality of resonators may include one or more inductive loads and one or more capacitive loads, wherein the inductance value of each of the one or more inductive loads and the capacitance value of each of the one or more capacitive loads may be configured to allow RF signals of a specific frequency band to pass through.

[0111] According to embodiments of this disclosure, the inductance value of each of the one or more inductive loads and the capacitance value of each of the one or more capacitive loads can be configured to form a plurality of notches within a specified range from the specific frequency band.

[0112] According to embodiments of this disclosure, the arrangement of the plurality of resonators may be related to the magnitude of cross-coupling between non-adjacent resonators.

[0113] According to embodiments of this disclosure, a massive MIMO unit (MMU) device may include: at least one processor configured to process signals; a plurality of filters configured to filter signals; and an antenna array configured to radiate signals, wherein the plurality of filters may include filters configured by resonant plates arranged between a top cover and filter plates, wherein a plurality of resonators are formed on a single layer in the filter plates.

[0114] According to embodiments of this disclosure, each of the plurality of resonators may be a T-shaped resonant circuit.

[0115] According to embodiments of this disclosure, the plurality of resonators can be connected in series with each other.

[0116] According to embodiments of this disclosure, the resonant plate can be arranged to form a suspended air strip structure between the cover and the filter plate, and on the resonant plate, the area corresponding to the plurality of resonators can be occupied by conductors, while the area other than the plurality of resonators can be empty.

[0117] According to embodiments of this disclosure, the resonant plate may include an input port and an output port, the output port being connected to an antenna element of an antenna array.

[0118] According to embodiments of this disclosure, the filter can be mounted on a filter board using surface mount technology (SMT).

[0119] According to embodiments of the present disclosure, a method for manufacturing a filter in a wireless communication system may include: generating a resonant plate in which a plurality of resonators are formed on a single layer; connecting the resonant plate to a housing such that the housing, having a predetermined height, surrounds the resonant plate within a specific range of the predetermined height; and performing surface mount technology (SMT) to mount the structure connecting the resonant plate and the housing onto a PCB.

[0120] The methods based on the claims or embodiments disclosed in this disclosure can be implemented in hardware, software, or a combination of both.

[0121] When implemented in software, a computer-readable storage medium may be provided for storing one or more programs (software modules). One or more programs stored in the computer-readable storage medium are configured to be executed by one or more processors in an electronic device. One or more programs include instructions for allowing the electronic device to perform methods based on the claims or embodiments disclosed in this disclosure.

[0122] The program (software module or software) can be stored in random access memory, including non-volatile memory such as flash memory, read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), disk storage devices, compact disc-ROM (CD-ROM), digital versatile disc (DVD), or other forms of optical storage devices and magnetic tape cassettes. Optionally, the program can be stored in memory configured with all or some of these storage media. Furthermore, there can be multiple configured memories.

[0123] Furthermore, the program can be stored in an attachable storage device that can be accessed by the electronic device via a communication network such as the Internet, intranet, local area network (LAN), wide area network (WLAN), or storage area network (SAN), or via a communication network configured in combination with these networks. The storage device can access the device executing the embodiments of this disclosure via an external port. Additionally, an attached storage device on the communication network can access the device executing the embodiments of this disclosure.

[0124] In the specific embodiments described above, the elements included in this disclosure are expressed in a singular or plural form, depending on the specific implementation. However, for ease of explanation, the singular or plural form may be appropriately selected as suggested, and this disclosure is not limited to a single element or multiple elements. Elements expressed in a plural form may be configured in a singular form, or elements expressed in a singular form may be configured in a plural form.

[0125] While specific embodiments have been described in detail in this disclosure, those skilled in the art will understand that various changes may be made therein without departing from the spirit and scope of this disclosure. Therefore, the scope of this disclosure should not be limited by the described embodiments, but rather by the appended claims or their equivalents.

Claims

1. A filter in a wireless communication system, the filter comprising: build; The housing connected to the cover; A resonant plate includes an edge portion and a plurality of resonators connected to the edge portion, wherein the plurality of resonators includes a first resonator, a second resonator, and a third resonator, and wherein the plurality of resonators are surrounded by the edge portion; A first conductive line connects the first resonator to the second resonator; and The second conductive line connects the first resonator to the third resonator. The edge portion is connected to the housing, thereby fixing the resonant plate to the housing.

2. The filter according to claim 1, wherein, The second resonator is disposed between the first resonator and the third resonator, and The second resonator is capacitively connected to the third resonator.

3. The filter according to claim 2, wherein, The plurality of resonators also includes a fourth resonator. The first resonator is disposed between the fourth resonator and the second resonator, and The first resonator is capacitively connected to the fourth resonator.

4. The filter according to claim 1, wherein, The housing includes a first portion forming the side surface of the filter and a second portion forming the bottom surface of the filter. The first portion includes a groove for the resonator, and The edge portion of the resonant plate is inserted into the groove.

5. The filter according to claim 4, wherein, The second part of the housing, the resonant plate, and the cover are stacked sequentially in the first direction. The first air gap is formed between the first surface of the resonant plate and the cover. The second air gap is formed between the second surface of the resonant plate and the second portion.

6. The filter according to claim 1, wherein, The resonant plate also includes an input port and an output port, and The input port and the output port are integrally formed with the edge portion, such that the edge portion, the input port, and the output port together with the plurality of resonators form a single layer.

7. The filter according to claim 6, wherein, The input port is electrically connected to the first radio frequency line through the housing. The output port is electrically connected to the second radio frequency line via the housing, and The radio frequency signal is transmitted from the first radio frequency line to the second radio frequency line via the resonant plate.

8. The filter according to claim 7, wherein, The second radio frequency line is electrically connected to the antenna elements of the antenna array.

9. The filter according to claim 1, wherein, The edge portion has a rectangular shape, and wherein the edge portion is electrically connected to ground.

10. The filter according to claim 1, wherein, Each of the plurality of resonators is a T-shaped resonant circuit.

11. The filter according to claim 1, wherein, The arrangement of the plurality of resonators is related to the magnitude of the cross-coupling between the non-adjacent resonators among the plurality of resonators.

12. The filter according to claim 1, wherein, The first resonator is inductively connected to the second and third resonators, and the second resonator is capacitively connected to the third resonator, thereby forming a notch filter for radio frequency signals in a specific frequency band.

13. The filter according to claim 1, wherein, The edge portion forms the boundary of the resonant plate.

14. A large-scale multiple-input multiple-output unit device, comprising: At least one processor configured to process signals; Multiple filters are configured to filter the signal; as well as An antenna array, electrically connected to the plurality of filters and configured to radiate the signal. The filters among the plurality of filters include: build; The housing is connected to the cover; A resonant plate includes an edge portion and a plurality of resonators connected to the edge portion, wherein the plurality of resonators includes a first resonator, a second resonator, and a third resonator, and wherein the plurality of resonators are surrounded by the edge portion; A first conductive line connects the first resonator to the second resonator; and The second conductive line connects the first resonator to the third resonator. The edge portion is connected to the housing, thereby fixing the resonant plate to the housing.

15. The large-scale multiple-input multiple-output unit device according to claim 14, wherein, The second resonator is disposed between the first resonator and the third resonator, and The second resonator is capacitively connected to the third resonator.

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