High-efficiency multi-station converter calibration system based on serial-to-parallel conversion architecture

Abstract

The invention discloses a high-efficiency multi-station converter calibration system based on a serial-to-parallel conversion architecture. The system comprises an upper computer, a power supply module, a code pattern generator, a serial-to-parallel conversion module and a multi-station calibration board, the multi-station calibration plate is provided with a plurality of groups of stations for placing ADC chips to be calibrated, and each group of stations is provided with a reference temperature measurement chip for providing reference temperature for the group of ADC chips to be calibrated; the upper computer is in communication connection with the code pattern generator and is used for controlling the code pattern generator to generate a control signal; the code pattern generator is connected with the serial-to-parallel conversion module and the reference temperature measurement chip through a serial communication interface, and sends a generated control signal to the serial-to-parallel conversion module or the reference temperature measurement chip; and the serial-parallel conversion module is connected with each to-be-calibrated ADC chip on the multi-station calibration plate and is used for converting the received control signal into a parallel control signal so as to configure, read and write the plurality of to-be-calibrated ADC chips at the same time or in a time-sharing manner.

Description

High-efficiency multi-station converter calibration system based on serial-to-parallel conversion architecture Technical Field

[0001] This invention relates to the field of digital-to-analog converter calibration technology, and in particular to a high-efficiency multi-station converter calibration system based on a serial-to-parallel conversion architecture. Background Technology

[0002] With the rapid development of integrated circuit technology, data acquisition and signal processing technologies have also made significant progress. Signals such as temperature, pressure, and acceleration in daily life are analog quantities. To facilitate processing, they need to be further converted into digital quantities that the signal processing system can recognize. In data acquisition and signal processing systems, the analog-to-digital converter (ADC) is a key component for converting analog quantities to digital quantities, playing a crucial role in many industries such as automotive electronics, wireless communication, and defense. The performance and accuracy of this component directly determine the quality of the aforementioned products.

[0003] Traditional ADC temperature measurement chip calibration systems require numerous peripheral devices, and some calibration processes also require manual intervention. Furthermore, inaccurate temperature reference temperatures or excessively long waiting times for ambient temperature stabilization when calibrating multiple chips can lead to reduced calibration efficiency and poor calibration results. Therefore, a highly integrated calibration system with simple operation steps is needed that can continuously calibrate multiple chips without interruption, thereby improving calibration efficiency. Summary of the Invention

[0004] The technical problem solved by this invention is to overcome the shortcomings of the prior art and provide a high-efficiency multi-station converter calibration system based on a serial-to-parallel conversion architecture, which reduces calibration steps, effectively reduces the calibration time of multiple temperature measurement chips, and improves calibration efficiency.

[0005] The technical solution of this invention is as follows: A high-efficiency multi-station converter calibration system based on a serial-to-parallel conversion architecture is provided, comprising: a host computer, a power module, a pattern generator, a serial-to-parallel conversion module, and a multi-station calibration board. The multi-station calibration board is provided with multiple stations for placing ADC chips to be calibrated. Each station is equipped with a reference temperature measuring chip to provide a reference temperature for that group of ADC chips. The host computer is communicatively connected to the pattern generator and is used to control the pattern generator to generate control signals. The pattern generator is connected to the serial-to-parallel conversion module and the reference temperature measuring chip through a communication interface, and sends the generated control signals to the serial-to-parallel conversion module or the reference temperature measuring chip. The serial-to-parallel conversion module is connected to each ADC chip to be calibrated on the multi-station calibration board and is used to convert the received control signals into parallel control signals to simultaneously or time-divisionally configure and read / write multiple ADC chips to be calibrated. The power module is used to supply power to the multi-station calibration board.

[0006] Furthermore, the communication interface is an I2C interface.

[0007] Furthermore, the control signal generated by the code generator includes: I2C code, used to acquire the output code value D of the reference temperature sensing chip. REF And convert to reference temperature T REF The SPI control code is sent to the ADC chip to be calibrated via a serial-to-parallel conversion module. This is used to configure the operating mode of the ADC chip and to read its output code value D. ACT And convert it to the actual temperature T. ACT Calibration code, used to determine the reference temperature T. REF The actual temperature T of the actual output of the ADC chip to be calibrated ACT The generated data is sent to the ADC chip to be calibrated via a serial-to-parallel conversion module to achieve the calibration of the ADC chip.

[0008] Furthermore, the power module adopts an LDO power supply, which is connected to the multi-station calibration board via a ribbon cable. The output terminal of the LDO power supply is connected to the input terminal of the relay. The control signal generated by the code generator also includes a relay control code, which is used to control the relay, switch the voltage required for calibration, and detect the actual temperature output of the ADC chip to be calibrated under different voltages.

[0009] Furthermore, each workstation includes eight ADC chip workstations to be calibrated, with the reference temperature measuring chip located in the middle of these eight workstations.

[0010] This invention also provides a high-efficiency multi-station converter calibration method based on a serial-to-parallel conversion architecture. Using the aforementioned calibration system, the method includes the following steps: S1, mounting multiple ADC chips to be calibrated on the multi-station calibration board and powering on the system; S2, the host computer controls the code generator to select and lock the operating modes of all ADC chips to be calibrated; S3, the host computer controls the code generator to generate SPI control codes, and through the serial-to-parallel conversion module, configures and reads the output code value D of the specified ADC chip to be calibrated. ACT And convert it to the actual temperature T. ACT S4. The host computer controls the code generator to generate I2C code and reads the output code value D of the corresponding reference temperature measuring chip. REF And convert to reference temperature T REF S5. The host computer, based on the reference temperature T REF and actual temperature T ACTS6. Calculate the calibration code of the ADC chip to be calibrated by taking the difference between the reference temperature and the actual temperature of the ADC chip to be calibrated; S7. Write the calibration code into the calibration register of the ADC chip to be calibrated to complete a single calibration of the chip; S8. Remeasure the actual temperature of the calibrated ADC chip to be calibrated and calculate the difference between it and the reference temperature. Determine whether the difference is within the preset qualified range. If yes, the calibration is considered successful and proceed to step S8; otherwise, return to step S5 and regenerate the calibration code for calibration; S9. Determine whether all ADC chips to be calibrated have been calibrated. If no, return to step S3; otherwise, the calibration process ends.

[0011] Further, step S3 includes: sequentially configuring the ADC chip to be calibrated to internal temperature measurement mode and external temperature measurement mode, and reading the output code value of the ADC chip to be calibrated in both modes to obtain the actual temperature in internal mode and the actual temperature in external mode; in step S5, calculating the internal mode calibration code and the external mode calibration code of the ADC chip to be calibrated for the internal temperature measurement mode and the external temperature measurement mode respectively; in step S6, writing the internal mode calibration code and the external mode calibration code into the corresponding calibration registers respectively; in step S7, determining whether the calculated difference in the internal temperature measurement mode and the external temperature measurement mode is within their respective preset qualified ranges.

[0012] Furthermore, in step S7, the remeasurement is performed in a high and low temperature chamber within the range of -55℃ to 125℃.

[0013] Furthermore, prior to step S6, the method further includes: the host computer generating a relay control code to control the relay connected to the power module, changing the power supply voltage to the voltage required for calibration.

[0014] The advantages of this invention compared with the prior art are: (1) This invention is based on a high-efficiency multi-station converter calibration system for serial-to-parallel conversion, which is different from the traditional calibration system which requires the cooperation of multiple peripheral devices. It can simplify the calibration system to the greatest extent and is conducive to the later system expansion and maintenance.

[0015] (2) The present invention is a high-efficiency multi-station converter calibration system based on serial-to-parallel conversion. Unlike traditional calibration systems that require manual cooperation, the entire system can achieve complete automation from power-on to calibration completion.

[0016] (3) The high-efficiency multi-station converter calibration system based on serial-to-parallel conversion of the present invention is different from the traditional calibration system which can only install one chip for calibration at a time and needs to re-stabilize the temperature after each calibration, wasting a lot of time. This system can continuously calibrate multiple chips at a time, eliminating the step of replacing chips after calibration and greatly shortening the overall calibration time.

[0017] (4) The present invention is a high-efficiency multi-station converter calibration system based on serial-to-parallel conversion. Unlike traditional calibration systems and methods which have poor adaptability, the present invention can be applied to a variety of temperature measurement chips, and the calibration system has strong adaptability and high portability. Attached Figure Description

[0018] Figure 1 is a schematic diagram of the calibration system of the present invention; Figure 2 is a flowchart of the calibration method of the present invention. Detailed Implementation

[0019] To better understand the technical solution of the present invention, the specific embodiments of the present invention are described below.

[0020] As shown in Figure 1, the high-efficiency multi-station converter calibration system based on serial-to-parallel conversion architecture proposed in this invention includes a host computer, a power module, a relay, a code generator, a serial-to-parallel conversion module, and a multi-station calibration board; the multi-station calibration board is equipped with an ADC chip to be calibrated, a serial-to-parallel conversion module, and a reference temperature measuring chip.

[0021] The serial-to-parallel conversion module on the multi-station calibration board is connected to the chip pins. The chips to be calibrated are placed in 64 stations, with eight chips in each group. The reference temperature measuring chip is placed in the middle of the eight chips to be calibrated to provide a reference temperature for calibrating the chips under test.

[0022] The power module, using an LDO module, is mainly used to power the multi-station calibration board. It is connected to the multi-station calibration board via a ribbon cable. The LDO output is connected to the relay input to provide different voltages to the reference temperature measurement chip.

[0023] The code generator uses FT series chips and two channels to generate SPI control codes and relay control codes. It adopts I2C communication mode and is connected to the serial-to-parallel conversion module on the multi-station calibration board via a ribbon cable.

[0024] The host computer controls a pattern generator to produce SPI control codes. These codes are used to configure the operating mode of the ADC chip to be calibrated and to check the functionality of the chip's register read / write functions. The pattern generator sends the generated SPI control codes to the serial-to-parallel conversion module via I2C, which in turn generates SPI signals to control multiple ADC chips to be calibrated. The host computer can also control the pattern generator to generate corresponding data codes, write data to the ADC chips to be calibrated, configure the operating mode, and then read specific registers of the chip to acquire the output temperature code, converting it into real-time temperature. It can also obtain the temperature of a reference temperature sensor chip via I2C communication as a calibration benchmark. Furthermore, it can control relays to switch the voltage required for calibration of the ADC chips to be calibrated and detect the output temperature values ​​under different voltages. The host computer uses the temperature acquired by the reference temperature sensor chip as a reference temperature, calculates the required calibration temperature, and controls the pattern generator to generate calibration codes to calibrate the ADC chips to be calibrated. Afterward, it remeasures the difference between the calibrated temperature of the ADC chip and the reference temperature, and judges the calibration effect based on the set acceptable range.

[0025] The method for the host computer to obtain the calibration code of the ADC chip to be calibrated is as follows: (1) At 25℃, the host computer controls the code generator to send the I2C code to collect the output code value D of the reference temperature measuring chip. REF And convert to reference temperature T REF .

[0026] (2) At 25℃, the host computer controls the code generator to generate SPI code, and through the serial-to-parallel conversion chip, configures the working mode of the corresponding ADC chip to be calibrated and reads its output code value D. ACT And convert it into a temperature value T. ACT .

[0027] (3) Based on the reference temperature T REF and the actual temperature value T output by the ADC chip to be calibrated ACT Calculate the calibration code analog value T D Based on the acceptable ranges D1 and D2 for the different internal and external modes, determine whether the temperature needs to be increased or decreased.

[0028] (4) The calculated calibration code analog value T D Convert it into binary code to obtain the calibration code of the temperature measuring chip.

[0029] (5) The generated calibration code is written into a specific calibration register in the ADC chip to be calibrated by controlling the code generator through the host computer, thereby realizing the calibration of the ADC chip to be calibrated.

[0030] In step (1), the host computer calculates the reference temperature T using the following formula. REF :TREF = D REF ×0.0078125 or T REF = (D) REF -32768)×0.0078125-256; In step (2), the host computer calculates the actual temperature T using the following formula. ACT :T ACT = D ACT / 4 or T ACT = (D) ACT – 1024) / 4; In the above process, the system judges the calibration effect based on the difference between the calibrated temperature and the actual temperature. Since there will be a certain error when the temperature is collected, the calibration is considered successful if the difference is within the set range.

[0031] As shown in Figure 2, this invention also proposes a calibration method for a high-efficiency multi-station converter calibration system based on a serial-to-parallel conversion architecture, including the following steps: (1) Install the temperature measuring chip to be calibrated on the calibration board to be calibrated, and after ensuring that the connection of each module of the system is correct, power on the entire system through the host computer control power supply module; (2) The host computer controls the code generator to generate SPI control code to select the chip to lock all chips in SPI mode; (3) The host computer controls the code generator to generate SPI control code and sends it to the chip under test through the serial-to-parallel conversion chip, and then reads the register of the chip to be calibrated to determine whether the SPI mode is locked. If it is normal, proceed to step (4); otherwise, skip the subsequent steps, select the chip under test at the next position and repeat step (3); (4) The host computer controls the SPI control code to generate SPI control code to select the chip to be calibrated and send ... (5) The host computer generates an SPI control code to configure the temperature measurement mode of the ADC chip to be calibrated to the internal temperature measurement mode; (6) The host computer generates an SPI control code to read a specific register and obtain the actual temperature under the internal temperature measurement mode; (7) The host computer generates an SPI control code to configure the temperature measurement mode of the ADC chip to be calibrated to the external temperature measurement mode; (8) The host computer generates an I2C code to read the output code of the reference temperature measuring chip and obtain the reference temperature through calculation; (9) The host computer calculates the calibration code of the chip under test based on the measured internal and external actual temperatures and the reference temperature.

[0032] (10) The host computer controls the relay to switch the power supply voltage to the voltage required for calibration; (11) The host computer controls the code generator to generate the calibration code and write it into the calibration register of the corresponding ADC chip to be calibrated according to the calibration code of the ADC chip to be calibrated calculated in step (9); (12) After the chip to be calibrated completes a single calibration, the host computer controls the high and low temperature chamber to remeasure the actual temperature in the internal mode and the external mode, as well as the reference temperature, in the range of -55℃ to 125℃; (13) The host computer calculates the difference between the two modes according to the temperature measurement results and judges the calibration result according to the preset range. If the calibration results in both modes meet the preset qualified range, then go to step (14); otherwise go to step (9) to generate a new calibration code for calibration. After the two calibrations are completed, if it is qualified, go to step (14); if it is not qualified, then the chip calibration fails and go to step (14); (14) Determine whether all chips have completed calibration. If yes, the calibration ends and the host computer controls the relay to power off. Otherwise, change the sequence number and go to step (3) to calibrate the next chip.

[0033] It is understood that this invention has been described through embodiments, and those skilled in the art will recognize that various changes or equivalent substitutions can be made to these features and embodiments without departing from the spirit and scope of this invention. Contents not described in detail in this specification are well-known to those skilled in the art.

Claims

1. A high-efficiency multi-station converter calibration system based on a serial-to-parallel conversion architecture, characterized in that, include: The system comprises a host computer, a power module, a pattern generator, a serial-to-parallel conversion module, and a multi-station calibration board. The multi-station calibration board has multiple stations for placing ADC chips to be calibrated. Each station is equipped with a reference temperature sensor chip to provide a reference temperature for the ADC chips in that station. The host computer is communicatively connected to the pattern generator and is used to control the pattern generator to generate control signals. The pattern generator is connected to the serial-to-parallel conversion module and the reference temperature sensor chip via a communication interface, sending the generated control signals to the serial-to-parallel conversion module or the reference temperature sensor chip. The serial-to-parallel conversion module is connected to each ADC chip to be calibrated on the multi-station calibration board and is used to convert the received control signals into parallel control signals to simultaneously or time-divisionally configure and read / write multiple ADC chips to be calibrated. The power module is used to supply power to the multi-station calibration board.

2. The high-efficiency multi-station converter calibration system based on a serial-to-parallel conversion architecture according to claim 1, characterized in that: The communication interface is an I2C interface.

3. The high-efficiency multi-station converter calibration system based on a serial-to-parallel conversion architecture according to claim 1, characterized in that: The control signals generated by the code generator include: I2C code, used to acquire the output code value D of the reference temperature sensing chip. REF And convert to reference temperature T REF The SPI control code is sent to the ADC chip to be calibrated via a serial-to-parallel conversion module. This is used to configure the operating mode of the ADC chip and to read its output code value D. ACT And convert it to the actual temperature T. ACT Calibration code, used to determine the reference temperature T. REF The actual temperature T of the actual output of the ADC chip to be calibrated ACT The generated data is sent to the ADC chip to be calibrated via a serial-to-parallel conversion module to achieve the calibration of the ADC chip.

4. The high-efficiency multi-station converter calibration system based on a serial-to-parallel conversion architecture according to claim 1, characterized in that: The power module uses an LDO power supply, which is connected to the multi-station calibration board via a ribbon cable. The output terminal of the LDO power supply is connected to the input terminal of the relay. The control signal generated by the code generator also includes a relay control code, which is used to control the relay, switch the voltage required for calibration, and detect the actual temperature output of the ADC chip to be calibrated under different voltages.

5. The high-efficiency multi-station converter calibration system based on a serial-to-parallel conversion architecture according to claim 1, characterized in that: Each workstation includes eight ADC chip workstations to be calibrated, with the reference temperature measuring chip located in the middle of these eight workstations.

6. A high-efficiency multi-station converter calibration method based on a serial-to-parallel conversion architecture, characterized in that: The calibration system as described in any one of claims 1 to 5 includes the following steps: S1, installing multiple ADC chips to be calibrated on the multi-station calibration board, and powering on the system; S2, the host computer controls the code generator to select and lock the operating mode of all ADC chips to be calibrated; S3, the host computer controls the code generator to generate SPI control codes, and configures and reads the output code value D of the specified ADC chip to be calibrated through the serial-to-parallel conversion module. ACT And convert it to the actual temperature T. ACT S4. The host computer controls the code generator to generate I2C code and reads the output code value D of the corresponding reference temperature measuring chip. REF And convert to reference temperature T REF S5. The host computer, based on the reference temperature T REF and actual temperature T ACT S6. Calculate the calibration code of the ADC chip to be calibrated by taking the difference between the reference temperature and the actual temperature of the ADC chip to be calibrated; S7. Write the calibration code into the calibration register of the ADC chip to be calibrated to complete a single calibration of the chip; S8. Remeasure the actual temperature of the calibrated ADC chip to be calibrated and calculate the difference between it and the reference temperature. Determine whether the difference is within the preset qualified range. If yes, the calibration is considered successful and proceed to step S8; otherwise, return to step S5 and regenerate the calibration code for calibration; S9. Determine whether all ADC chips to be calibrated have been calibrated. If no, return to step S3; otherwise, the calibration process ends.

7. The high-efficiency multi-station converter calibration method based on serial-to-parallel conversion architecture according to claim 6, characterized in that: Step S3 includes: sequentially configuring the ADC chip to be calibrated to internal temperature measurement mode and external temperature measurement mode, and reading the output code value of the ADC chip to be calibrated in both modes to obtain the actual temperature in internal mode and the actual temperature in external mode; in step S5, calculating the internal mode calibration code and the external mode calibration code of the ADC chip to be calibrated for the internal temperature measurement mode and the external temperature measurement mode respectively; in step S6, writing the internal mode calibration code and the external mode calibration code into the corresponding calibration registers respectively; in step S7, determining whether the calculated difference in internal temperature measurement mode and external temperature measurement mode is within their respective preset qualified range.

8. The high-efficiency multi-station converter calibration method based on serial-to-parallel conversion architecture according to claim 6, characterized in that: In step S7, the remeasurement is performed in a high and low temperature chamber within the range of -55℃ to 125℃.

9. The high-efficiency multi-station converter calibration method based on serial-to-parallel conversion architecture according to claim 6, characterized in that: Before step S6, the method further includes: the host computer generating a relay control code to control the relay connected to the power module to change the power supply voltage to the voltage required for calibration.

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