Circuit board lamination positioning and pressing device based on conical surface guiding

Abstract

The invention relates to the field of integrated circuit manufacturing, in particular to a circuit board lamination positioning and pressing device based on conical surface guiding, which comprises a laminating table, a hydraulic rod is arranged on the upper end surface of the laminating table, a hydraulic cylinder is arranged at the upper end of the hydraulic rod, an upper pressing plate is fixedly connected to the lower end of the hydraulic rod, and a laminating platform is arranged in the laminating table. A lower pressing plate is arranged on the upper end face of the laminating platform, the horizontal projection of the lower pressing plate is completely located in the laminating range of the upper pressing plate, a hydraulic hole is formed in the upper end face of the lower pressing plate and arranged in the circumferential direction of the lower pressing plate, a hydraulic cavity is formed in the lower end in the hydraulic hole, a pressing block is arranged in the hydraulic hole, a through hole is formed in the center of the pressing block, and a conical face column is arranged in the through hole. The upper pressing plate is provided with a locking hole, the locking hole is matched with the conical surface column, the positioning effect is continuously enhanced in the whole pressing process, the layer deviation problem of circuit board lamination pressing is fundamentally reduced, and the alignment precision and the pressing stability of the upper pressing plate and the lower pressing plate are greatly improved.

Description

A circuit board stacking positioning and pressing device based on conical surface guidance Technical Field

[0001] This invention relates to the field of integrated circuit manufacturing, specifically to a circuit board stacking positioning and pressing device based on conical surface guidance. Background Technology

[0002] Circuit board stacking positioning and pressing equipment is an indispensable core piece of equipment in integrated circuit manufacturing. Due to its high-precision positioning and high-temperature and high-pressure bonding characteristics, it is widely used in high-end electronic manufacturing fields such as mobile phones, computers, servers, and automotive electronics. Its structural design and positioning accuracy directly determine the interlayer alignment accuracy and electrical performance of multilayer boards. During use, it is necessary to ensure that the materials of each layer are accurately aligned and the pressing pressure is uniform to avoid defects such as layer misalignment and uneven board thickness. In the production of high-end products such as high-density interconnect boards and rigid-flex boards, the requirements for positioning accuracy and pressing uniformity are even more stringent. The ease of operation and accuracy stability of traditional equipment can no longer meet the production needs.

[0003] To address the aforementioned issues, existing technologies offer several solutions. For instance, patent application CN202110809982.9 discloses a multilayer board laminating device and its processing method. This application outlines the following solution: a matching structure consisting of positioning pins, lateral support templates, metal spring sheets, and multiple sets of hydraulic cylinder push rods is designed within the laminating device. Basic positioning is achieved through the positioning pins. The first hydraulic cylinder push rod drives the lateral support body for lateral positioning. The second hydraulic cylinder push rod acts on the metal spring sheet to correct the pressing plane. Simultaneously, vacuum extraction allows the silicone diaphragm to complete pressing under pressure difference. Based on the uniformity analysis results of the previous batch of pressing, the second hydraulic cylinder push rod is adjusted in sections to improve pressing accuracy and uniformity. However, this solution has certain limitations in practical use: the rigid top block of the lateral support body generates concentrated stress on the edge of the PCB board during lateral positioning, especially for thin boards, rigid-flex boards, or high-density boards. This can easily lead to board edge deformation, delamination, or circuit misalignment, affecting the accuracy of subsequent drilling, electroplating, and other processes. In addition, the repeated deformation of metal fragments under high temperature and high pressure will cause uneven stress release in the laminated materials, exacerbating the risk of interlayer misalignment. Summary of the Invention

[0004] The purpose of this invention is to provide a circuit board stacking positioning and pressing device based on conical surface guidance, so as to solve the problem of accuracy and stability of traditional equipment, and at the same time solve the problem of aggravated misalignment under high temperature and high pressure in the existing technology.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a circuit board stacking positioning and pressing device based on conical surface guidance, comprising a laminating table, a hydraulic rod provided on the upper end face of the laminating table, a hydraulic cylinder provided on the upper end of the hydraulic rod, an upper pressure plate fixedly connected to the lower end of the hydraulic rod, a laminating platform provided inside the laminating table, a lower pressure plate provided on the upper end face of the laminating platform, the horizontal projection of the lower pressure plate being completely within the pressing range of the upper pressure plate, a hydraulic hole provided on the upper end face of the lower pressure plate, the hydraulic hole being arranged circumferentially along the lower pressure plate, a hydraulic cavity provided at the lower end of the hydraulic hole, the hydraulic cavity being filled with hydraulic oil, a pressure block provided inside the hydraulic hole, the pressure block sliding against the hydraulic hole. The pressure block is dynamically connected, with its lower end extending into the hydraulic cavity. A through hole is provided at the center of the pressure block, and a hydraulic chamber is provided below the through hole, communicating with the hydraulic cavity. A conical column is provided inside the through hole, with a clearance fit between the conical column and the through hole. A conical section is provided at the upper end of the conical column, with a taper of 1:2. The conical section extends out of the through hole. The lower end of the conical column extends into the hydraulic cavity, and a limit ring is provided at the lower end of the conical column. The limit ring is slidably connected to the hydraulic cavity, and the cross-sectional area of ​​the limit ring is the same as that of the hydraulic cavity. The upper pressure plate is provided with a locking hole that is aligned with the position of the conical column, and the diameter of the locking hole is adapted to the size of the conical column.

[0006] A hydraulic rod is installed on the upper surface of the laminating table, with a hydraulic cylinder at the upper end and an upper pressure plate at the lower end. A lower pressure plate is installed on the laminating platform inside the laminating table, ensuring that the horizontal projection of the lower pressure plate is completely within the pressing range of the upper pressure plate. A hydraulic hole is circumferentially opened on the upper surface of the lower pressure plate, and a hydraulic cavity is provided at the lower end of the hydraulic hole. A pressure block is installed inside the hydraulic hole, slidably connected to it and extending to the hydraulic cavity at its lower end. A through hole is opened in the center of the pressure block, and a hydraulic chamber communicating with the hydraulic cavity is located on the lower side of the through hole. A conical column is installed inside the through hole, with a 1:2 taper section at the upper end of the column extending out of the through hole. The lower end of the conical column extends to the hydraulic cavity, and a limiting ring with a slidable connection to the hydraulic cavity and a cross-sectional area matching the hydraulic cavity is provided. Simultaneously, a locking hole with a diameter matching the position of the conical column is opened on the upper pressure plate. The cooperation between the hydraulic cylinder and the hydraulic rod provides a stable hydraulic driving force for the pressing action of the upper pressure plate. The position of the lower pressure plate ensures that the upper pressure plate... When pressed, the pressure block can completely cover the lower pressure plate, ensuring that the entire circuit board stack can be compressed. The circumferential layout of the hydraulic holes ensures that the positioning and pressing force is evenly distributed along the circumference of the lower pressure plate. The sliding connection between the pressure block and the hydraulic holes, together with the conical column and the locking hole of the upper pressure plate, realizes the basic positioning of the circuit board stack. The 1:2 tapered section at the upper end of the conical column acts as a guide, improving the accuracy of the alignment of the circuit board stack, the upper pressure plate, and the lower pressure plate. The limiting ring not only makes the movement of the conical column in the hydraulic cavity more stable, but also limits the movement stroke of the conical column, preventing its excessive displacement from affecting the positioning and pressing effect. The connection between the hydraulic cavity and the hydraulic chamber provides a hydraulic transmission basis for the movement of the pressure block and the conical column, ensuring the coordination of the movement of each component. The whole system realizes stable hydraulic drive and precise alignment and guidance of the upper and lower pressure plates during the pressing of the circuit board stack, structurally reducing the basic layer misalignment problem caused by uneven force and alignment deviation during pressing.

[0007] Preferably, the lower end face of the upper pressure plate is provided with a floating hole, the floating hole is coaxial with and connected to the locking hole, a bushing is provided in the floating hole, the bushing includes a metal layer and a rubber layer, the metal layer is installed at the center of the bushing, the inner side of the rubber layer wraps the metal layer, the outer side of the rubber layer fits against the floating hole, a sealing groove is provided on the side of the limiting ring, and a sealing ring is provided in the sealing groove.

[0008] By setting a floating hole coaxially connected to the locking hole on the lower end face of the upper pressure plate, and assembling a composite bushing with a metal layer at its center, a rubber layer inside the metal layer, and a tightly fitted outer side to the floating hole, and simultaneously creating a sealing groove and embedding a sealing ring on the side of the limiting ring at the lower end of the conical column, this structural design, relying on the elastic deformation capability of the bushing's rubber layer and the clearance fit between the conical column and the pressure block's through hole, can effectively adapt to the extrusion deformation and positional displacement of the conical column caused by the thermal expansion of the circuit board during the pressing process. This provides a reasonable radial floating margin for the conical column and avoids the problems caused by rigid structures. The design addresses issues such as component jamming, plate deformation, or loss of alignment accuracy. On the other hand, the metal layer at the center of the bushing ensures the structural strength and basic accuracy of the guide positioning, while the rubber layer buffers the rigid collision when the conical column is inserted into the upper pressure plate, reducing component wear and positioning deviation. The cooperation between the sealing groove and the sealing ring on the limiting ring enables effective sealing of the hydraulic cavity, preventing hydraulic oil leakage and ensuring the pressure stability of the hydraulic transmission and the precise control of the floating and lifting movements of the conical column. Ultimately, the structure simultaneously achieves adaptive floating compensation during the pressing process, high-precision guide positioning, and stable sealing of the hydraulic system.

[0009] Preferably, a guide cone surface is provided at the center of the bushing, the taper of the guide cone surface is 1:1, and the guide cone surface is connected to the locking hole.

[0010] By setting a guide cone surface with a 1:1 taper at the center of the bushing and connecting it to the locking hole, a precise guide channel is formed before the cone-shaped column is inserted into the locking hole, thanks to the cone surface structure and connecting design of the guide cone surface. The 1:1 taper provides better adaptability and can effectively correct the insertion direction of the cone-shaped column, compensating for slight positional deviations between the cone-shaped column and the locking hole. This allows the cone-shaped column to slide into the locking hole more smoothly and accurately. At the same time, it forms a double cone-shaped guide fit with the 1:2 taper cone surface section at the upper end of the cone-shaped column, further improving the alignment accuracy between the upper and lower pressure plates. This avoids positioning errors caused by cone-shaped column insertion deviations, ensuring the positioning accuracy during circuit board stacking and lamination. Structurally, it reduces layer misalignment problems caused by alignment deviations, while making the insertion process of the cone-shaped column smoother, reducing collision wear between components, and improving the stability and service life of the device's positioning action.

[0011] Preferably, a spring is provided inside the hydraulic chamber, and the spring is connected to the bottom of the hydraulic chamber and the lower end face of the pressure block, respectively.

[0012] By installing a spring inside the hydraulic chamber and connecting its two ends to the bottom of the hydraulic chamber and the lower end face of the pressure block, respectively, the core technology relies on the elastic restoring characteristics of the spring. After the circuit board lamination operation is completed and the hydraulic pressure inside the hydraulic chamber is released, the pressure block, which is slidably connected to the hydraulic hole, can be quickly and accurately reset to its initial position before the start of the pressing operation. This ensures the consistency of the initial position of the pressure block when the device continuously performs pressing operations, effectively improving the continuous production efficiency of the device. At the same time, the elastic support of the spring can buffer the motion impact brought by the hydraulic transmission during the lifting and lowering of the pressure block, reduce the collision and wear between the pressure block and the hydraulic hole and the inner wall of the hydraulic chamber, extend the service life of the components, and also help constrain the sliding trajectory of the pressure block, avoiding problems such as jamming and radial movement during the movement of the pressure block.

[0013] Preferably, the lower pressure plate is symmetrically provided with positioning holes on its side, and the upper pressure plate is provided with positioning posts at the positions corresponding to the positioning holes. When the upper pressure plate is pressed down, the positioning posts cooperate with the positioning holes. The lower end of the positioning post is provided with a positioning cone surface, and the taper of the positioning cone surface is 1:1.

[0014] By symmetrically setting positioning holes on the side of the lower pressure plate, and simultaneously fitting positioning pins at corresponding positions on the upper pressure plate, a precise fit is achieved between the positioning pins and positioning holes when the upper pressure plate is pressed down. A 1:1 taper is provided at the lower end of the positioning pins. The symmetrical positioning hole layout on the side of the lower pressure plate ensures more even positioning force, preventing unilateral tilting of the lower pressure plate. The fit between the positioning pins and positioning holes provides basic alignment and limiting for the upper and lower pressure plates, effectively restricting their relative displacement during pressing. The 1:1 taper... The tapered positioning cone surface plays a precise guiding and correcting role when the positioning post is inserted into the positioning hole. It can compensate for slight positional deviations between the upper and lower pressure plates, allowing the positioning post to slide into the positioning hole more smoothly and accurately. At the same time, the positioning cone surface can also form a multi-cone guiding fit with the 1:1 guide cone surface of the bushing and the 1:2 cone surface section of the cone-shaped post, which further significantly improves the overall alignment accuracy of the upper and lower pressure plates. Structurally, it further strengthens the positioning effect and reduces the layer misalignment problem caused by alignment deviation during the lamination of circuit boards.

[0015] Preferably, the upper end face of the pressure block is provided with a buffer layer, the buffer layer is made of silicone rubber, the thickness of the buffer layer is 0.5-1mm, and the outer surface of the buffer layer is treated with anti-scratch treatment.

[0016] By setting a buffer layer on the upper surface of the pressure block, using silicone rubber as the buffer layer material and precisely setting its thickness to 0.5–1 mm, and applying an anti-scratch treatment to the outer surface of the buffer layer, the elastic properties of silicone rubber provide flexible buffering protection when the pressure block contacts the circuit board, avoiding squeezing damage to the circuit board caused by the hard contact of the pressure block. The precise thickness of 0.5–1 mm ensures a good buffering effect without affecting the accuracy of the pressing and the effectiveness of pressure transmission due to excessive thickness. The anti-scratch treatment effectively prevents scratches and wear caused by friction between the buffer layer and the circuit board surface during the pressing process, protecting the circuit and substrate of the circuit board from damage, ensuring the appearance integrity of the circuit board and its electrical performance for subsequent use. Overall, it provides reliable surface protection for the lamination of circuit boards and effectively improves the yield of the pressed products.

[0017] Preferably, the volume ratio of the hydraulic chamber to the hydraulic room is 1:2, the initial height of the pressure block extending out of the hydraulic hole is 3-5 mm, the length of the conical column is 15-17 mm, and the initial height of the conical column extending out of the through hole is 3-5 mm.

[0018] By precisely designing a 1:2 volume ratio between the hydraulic chamber and the hydraulic reservoir, and simultaneously calibrating suitable parameters such as an initial block height of 3-5mm, a conical column length of 15-17mm, and an initial conical column protrusion height of 3-5mm from the through hole, the precise transmission of hydraulic oil and stroke linkage are achieved based on the 1:2 volume ratio. This allows the conical column to rise 2mm simultaneously for every 1mm decrease in the block height. During pressing, the block can be fully pressed down from its initial height until it is flush with the lower pressure plate and retracts into the hydraulic chamber. This compresses the hydraulic oil, transmits pressure to the hydraulic reservoir, and pushes the conical column upward. The initial protrusion height of 3-5mm for the conical column allows for proper stacking. The circuit board material is initially positioned, and its 15-17mm length provides sufficient travel to ensure that the conical column reaches its maximum extension when the pressure block is fully pressed down. This achieves coordinated positioning and pressing actions during the pressing process. The initial extension completes the basic positioning of the circuit board stack, and the linkage between the pressure block's downward movement and the conical column's upward movement further enhances the positioning effect during the pressing stage. This ensures the alignment accuracy of the circuit board stack throughout the pressing process, making the pressing action of the pressure block and the positioning action of the conical column coordinated and controllable, and significantly improving the positioning accuracy and pressing stability of the circuit board stack pressing.

[0019] Preferably, the bottom of the lower pressure plate is provided with a positioning rib, and the upper end face of the lamination platform is provided with a guide rail adapted to the positioning rib. The outer wall of the positioning rib and the inner wall of the guide rail are both treated with frosted anti-slip treatment.

[0020] By setting positioning ribs at the bottom of the lower platen and corresponding guide rails on the upper surface of the lamination platform, and by applying a frosted anti-slip treatment to both the outer wall of the positioning ribs and the inner wall of the guide rails, the mating structure of the positioning ribs and the matching guide rails enables precise installation positioning and horizontal limiting of the lower platen. This fundamentally fixes the position of the lower platen on the lamination platform, ensuring the accuracy of the alignment of the upper and lower platens. The frosted anti-slip treatment on the contact surfaces effectively increases the contact friction, further improving the installation stability of the lower platen during the lamination process. This prevents the lower platen from slipping or shifting due to pressure impacts or hydraulic transmission forces during lamination, ensuring the position of the lower platen remains fixed throughout the lamination process. This, in turn, ensures the overall positioning accuracy of the circuit board lamination. At the same time, the mating structure of the ribs and guide rails makes the disassembly and adjustment of the lower platen more convenient. The frosted treatment also reduces wear caused by relative friction between the two, extending the service life of the components.

[0021] Preferably, an expansion layer is provided on the outer side of the conical column, the expansion layer having a thickness of 0.1 to 0.3 mm, the expansion layer being made of zinc, and the conical column being made of chromium-manganese steel.

[0022] By using chromium-manganese steel to construct the conical column and simultaneously applying a precisely 0.1–0.3 mm thick zinc expansion layer to its outer surface, the chromium-manganese steel material endows the conical column with excellent structural strength and wear resistance. This effectively resists impacts and wear during repeated positioning, insertion, and hydraulic transmission, ensuring structural stability and extending the column's service life. This design is suitable for the long-term, high-precision operation requirements of the device. The zinc expansion layer exhibits slight expansion under high-temperature conditions; its precise thickness of 0.1–0.3 mm ensures moderate expansion under high-temperature pressing conditions, allowing for a tight fit against the upper pressure plate. The inner wall of the locking hole significantly improves the tightness and fit between the conical column and the locking hole, further enhancing the stability of the alignment of the upper and lower pressure plates. This prevents the conical column from loosening or shifting during the pressing process, thus affecting the alignment accuracy. It also allows for a tight fit with the inner wall of the processing hole of the circuit board stack, providing radial restraint and fastening for the stacked circuit board layers. This effectively suppresses slippage and misalignment between circuit board layers during the pressing process, further solidifying the alignment accuracy of the stack pressing. At the same time, this thickness design prevents components from jamming due to excessive expansion, ensuring smooth insertion, removal, and reset of the conical column within the locking hole and the circuit board processing hole after the pressing operation is completed.

[0023] Compared with the prior art, the beneficial effects of the present invention are as follows: 1. Through the linkage structure of hydraulically driven pressure block and conical column, combined with the 1:2 volume ratio of hydraulic chamber and hydraulic room, the 1:2 taper of conical column, and the multi-conical guide design of bushing 1:1 guide conical surface and positioning column 1:1 positioning conical surface, the deformation, delamination and line offset problems caused by concentrated stress on the board edge are avoided, and the pressing and positioning actions are synchronized and linked. The positioning effect is continuously enhanced throughout the pressing process. The multiple conical surfaces can accurately correct the slight position deviation of the components, reduce the layer deviation problem of circuit board stacking pressing from the root, and greatly improve the alignment accuracy and pressing stability of the upper and lower pressure plates.

[0024] 2. The design incorporates a metal and rubber composite bushing, positioning ribs on the bottom of the lower pressure plate, anti-slip guide rails, and a silicone rubber anti-scratch buffer layer on the upper surface of the pressure block. Combined with the design of the limiting ring sealing groove and sealing ring, the elastic deformation of the bushing rubber layer provides radial floating margin for the conical column, adapting to the thermal expansion deformation of the circuit board, avoiding component jamming and board deformation. The ribs and guide rails fix the position of the lower pressure plate to prevent slippage during pressing. The buffer layer prevents damage to the circuit board during pressing, and the sealing ring ensures stable hydraulic transmission while buffering component collisions and extending the service life of the device.

[0025] 3. By using chromium-manganese steel, the strength and wear resistance of the conical column structure are greatly improved, making it suitable for long-term high-precision operation. The zinc expansion layer expands moderately under the high temperature of pressing, closely adhering to the hole wall to strengthen positioning and suppress interlayer slippage of the circuit board. The spring can drive the pressure block to quickly and accurately reset after pressing, effectively improving production efficiency and product yield. Attached Figure Description

[0026] Figure 1 is a structural schematic diagram of the circuit board stack positioning and pressing device based on conical surface guidance according to the present invention; Figure 2 is a front view of the hydraulic rod and the upper pressure plate; Figure 3 is a cross-sectional view of AA in Figure 2; Figure 4 is an enlarged view of B in Figure 3; Figure 5 is a front view of the lower pressure plate; Figure 6 is a cross-sectional view of CC in Figure 5; Figure 7 is an enlarged view of D in Figure 6; Figure 8 is a front view of the circuit board stack positioning and pressing device based on conical surface guidance during pressing operation according to the present invention; Figure 9 is a cross-sectional view of EE in Figure 8; Figure 10 is an enlarged view of F in Figure 9; Figure 11 is a structural schematic diagram of the conical column.

[0027] In the diagram: 1. Laminating table; 101. Laminating platform; 102. Guide rail; 2. Hydraulic rod; 201. Hydraulic cylinder; 202. Upper pressure plate; 203. Locking hole; 204. Floating hole; 205. Positioning post; 206. Positioning cone surface; 3. Lower pressure plate; 301. Hydraulic hole; 302. Hydraulic chamber; 303. Positioning hole; 304. Positioning rib; 4. Pressure block; 401. Through hole; 402. Hydraulic chamber; 403. Spring; 404. Buffer layer; 5. Conical post; 501. Conical section; 502. Limiting ring; 503. Sealing groove; 504. Expansion layer; 6. Bushing; 601. Metal layer; 602. Rubber layer; 603. Guide cone surface; 7. Sealing ring. Detailed Implementation

[0028] Please refer to Figures 1 to 11. This invention provides a circuit board stacking positioning and pressing device based on a conical surface guide. The technical solution is as follows: Specifically, please refer to Figures 1 to 11. A circuit board stacking positioning and pressing device based on a conical surface guide includes a laminating table 1. A hydraulic rod 2 is provided on the upper end surface of the laminating table 1. A hydraulic cylinder 201 is provided on the upper end of the hydraulic rod 2. An upper pressure plate 202 is fixedly connected to the lower end of the hydraulic rod 2. A laminating platform 101 is provided inside the laminating table 1. A lower pressure plate 3 is provided on the upper end surface of the laminating platform 101. The horizontal projection of the lower pressure plate 3 is completely within the pressing range of the upper pressure plate 202. The bottom of the lower pressure plate 3 is provided with a positioning rib 304. The upper end face of the lamination platform 101 is provided with a guide rail 102 that is adapted to the positioning rib 304. The outer wall of the positioning rib 304 and the inner wall of the guide rail 102 are both treated with frosted anti-slip treatment. The lower pressure plate 3 is symmetrically provided with positioning holes 303 on its side. The upper pressure plate 202 is provided with a positioning post 205 at the position corresponding to the positioning hole 303. When the upper pressure plate 202 is pressed down, the positioning post 205 cooperates with the positioning hole 303. The lower end of the positioning post 205 is provided with a positioning cone surface 206 with a taper of 1:1. The upper end face of the lower pressure plate 3 is provided with a hydraulic... A hydraulic hole 301 is provided around the lower pressure plate 3. A hydraulic cavity 302 is provided at the lower end of the hydraulic hole 301, filled with hydraulic oil. A pressure block 4 is provided inside the hydraulic hole 301, slidingly connected to the hydraulic hole 301. The initial extension height of the pressure block 4 beyond the hydraulic hole 301 is 3mm. A buffer layer 404 is provided on the upper surface of the pressure block 4. The buffer layer 404 is made of silicone rubber and has a thickness of 0.5mm. The outer surface of the buffer layer 404 is scratch-resistant. The lower end of the pressure block 4 extends into the hydraulic cavity 302, which contains... A spring 403 is provided, which is connected to the bottom of the hydraulic chamber 302 and the lower end face of the pressure block 4. A through hole 401 is provided at the center of the pressure block 4, and a hydraulic chamber 402 is provided below the through hole 401. The hydraulic chamber 402 is connected to the hydraulic chamber 302, and the volume ratio of the hydraulic chamber 302 to the hydraulic chamber 402 is 1:2. A conical column 5 is provided in the through hole 401, and the conical column 5 is clearance-fitted with the through hole 401. The length of the conical column 5 is 15mm, and the initial height of the conical column 5 extending out of the through hole 401 is 3mm. An expansion layer 504 is sleeved on the outside of the conical column 5, and the thickness of the expansion layer 504 is 0.The expansion layer 504 is made of zinc and the conical column 5 is made of chromium manganese steel. The upper end of the conical column 5 has a conical section 501 with a taper of 1:2, extending beyond the through hole 401. The lower end of the conical column 5 extends into the hydraulic cavity 302, and a limit ring 502 is provided at the lower end of the conical column 5. The limit ring 502 is slidably connected to the hydraulic cavity 302, and the cross-sectional area of ​​the limit ring 502 is the same as that of the hydraulic cavity 302. A sealing groove 503 is provided on the side of the limit ring 502, and a sealing ring 7 is provided inside the sealing groove 503. The upper pressure plate 202 is positioned relative to the conical column 5. A consistent locking hole 203 is provided, the diameter of which is adapted to the size of the conical column 5. A floating hole 204 is provided on the lower end face of the upper pressure plate 202. The floating hole 204 is coaxial with and connected to the locking hole 203. A bushing 6 is provided inside the floating hole 204. The bushing 6 includes a metal layer 601 and a rubber layer 602. The metal layer 601 is installed at the center of the bushing 6. A guide cone 603 with a taper of 1:1 is provided at the center of the bushing 6, and the guide cone 603 is connected to the locking hole 203. The inner side of the rubber layer 602 wraps around the metal layer 601, and the outer side of the rubber layer 602 is in contact with the floating hole 204.

[0029] Working Principle: Please refer to Figures 1 to 11. When performing the stacking and positioning pressing operation on the circuit board manufactured for integrated circuits, the circuit board stack is placed on the upper end of the lower pressure plate 3 on the lamination platform 101 within the lamination table 1. The positioning protrusion 304 at the bottom of the lower pressure plate 3 is adapted and engaged with the guide rail 102 of the lamination platform 101. The frosted and non-slip contact surfaces of the two form a firm fixation. The pressure block 4 initially extends 3mm beyond the hydraulic hole 301, and the conical column 5 initially extends 3mm beyond the through hole 401, forming a preliminary circumferential positioning of the circuit board stack. The silicone rubber buffer layer 404 at the upper end of the pressure block 4 makes flexible contact with the circuit board stack to avoid damage to the board due to hard contact. The hydraulic cylinder 201 at the upper end of the lamination table 1 is activated. Hydraulic cylinder 201 drives hydraulic rod 2 to move upper pressure plate 202 downward. Positioning post 205 at the lower end of upper pressure plate 202 is pressed down accordingly. The 1:1 taper positioning cone surface 206 on the lower side of positioning post 205 is precisely guided and engaged with the positioning hole 303 on the side of lower pressure plate 3, correcting the initial alignment deviation of upper pressure plate 202 and lower pressure plate 3, and realizing basic alignment limit. As upper pressure plate 202 continues to press down, the 1:2 taper cone section 501 at the upper end of cone column 5 contacts the 1:1 taper guide cone surface 603 at the center of upper pressure plate 202 bushing 6. The double cone surface guide further precisely corrects the positional deviation between components, allowing cone column 5 to smoothly slide into the locking hole 203 of upper pressure plate 202. After pressing down to contact the circuit board stack, continued force pushes the pressure block 4 downward along the hydraulic hole 301 and compresses the spring 403 in the hydraulic chamber 302. The lower end of the pressure block 4 squeezes the hydraulic oil in the hydraulic chamber 302. The hydraulic oil transmits pressure through the connected hydraulic chamber 402. Since the volume ratio of the hydraulic chamber 302 to the hydraulic chamber 402 is 1:2, the conical column 5 rises 2mm simultaneously for every 1mm the pressure block 4 descends. The limiting ring 502 at the lower end of the conical column 5 slides smoothly along the hydraulic chamber 302. The sealing ring 7 in the sealing groove 503 of the limiting ring 502 ensures the sealing of the hydraulic chamber 302 and prevents hydraulic oil leakage. The high temperature conditions during the pressing process ensure that the 0.2mm thick zinc expansion layer 504 on the outer side of the conical column 5 is moderately coated. The expansion tightly fits the inner wall of the locking hole 203 and the processing hole wall of the circuit board stack, forming a radial fastening limit to suppress the slippage between circuit board layers. The rubber layer 602 of the bushing 6 undergoes elastic deformation with the slight displacement of the conical column 5, providing radial floating margin to adapt to the thermal expansion deformation of the circuit board. The metal layer 601 of the bushing 6 ensures the strength of the guide structure and avoids component jamming or board deformation. When the pressure block 4 retracts into the hydraulic hole 301 and the upper end face of the pressure block 4 is flush with the upper end face of the lower pressure plate 3, the conical column 5 reaches its maximum extension, completing the full pressing of the circuit board stack. The cooperation of multiple conical guides and hydraulic linkage continuously enhances the positioning effect and reduces the problem of layer misalignment of circuit board stacks from the root.

[0030] After the circuit board lamination operation is completed, the hydraulic cylinder 201 is depressurized, the hydraulic rod 2 loses its hydraulic driving force, and the compressed spring 403 in the hydraulic chamber 302 releases its elastic restoring force, pushing the pressure block 4 upward along the hydraulic hole 301 to slide back to its original position. During the resetting process of the pressure block 4, hydraulic oil flows back to the hydraulic chamber 302, causing the conical column 5 to slide downward synchronously. The conical column 5 disengages from the locking hole 203 and the circuit board lamination processing hole, and the expansion layer 504 returns to its initial state as the temperature decreases. The pressure block 4 is reset to extend out of the hydraulic hole 301 under the action of the spring 403. At the initial position of 3mm outward, the conical column 5 also returns to its initial state of extending 3mm outward from the through hole 401. The hydraulic rod 2 drives the upper pressure plate 202 to return upward, and the positioning column 205 disengages from the positioning hole 303, completing one circuit board stacking positioning and pressing operation. The limiting ring 502 always slides smoothly along the hydraulic cavity 302, the sealing ring 7 keeps the hydraulic cavity 302 sealed, and the rubber layer 602 of the bushing 6 elastically resets. All components return to their initial state, and the next circuit board stacking and pressing operation can be carried out, realizing continuous production of the device.

[0031] The specific embodiment of the present invention has been described in detail above with reference to the accompanying drawings, but the present invention is not limited to the embodiments described above. For those skilled in the art, various changes, modifications, substitutions, and variations made to these embodiments without departing from the principles and ideas of the present invention should still fall within the protection scope of the present invention.

Claims

1. A circuit board stacking positioning and pressing device based on conical surface guidance, comprising a laminating table (1), wherein a hydraulic rod (2) is provided on the upper end surface of the laminating table (1), a hydraulic cylinder (201) is provided on the upper end of the hydraulic rod (2), and an upper pressure plate (202) is fixedly connected to the lower end of the hydraulic rod (2), characterized in that, The laminating platform (1) is provided with a laminating platform (101). A lower pressure plate (3) is provided on the upper surface of the laminating platform (101). The horizontal projection of the lower pressure plate (3) is completely within the pressing range of the upper pressure plate (202). A hydraulic hole (301) is provided on the upper surface of the lower pressure plate (3). The hydraulic hole (301) is arranged circumferentially along the lower pressure plate (3). A hydraulic cavity (302) is provided at the lower end of the hydraulic hole (301). The hydraulic cavity (302) is filled with hydraulic oil. A pressure block (4) is provided in the hydraulic hole (301). The pressure block (4) is slidably connected to the hydraulic hole (301). The lower end of the pressure block (4) extends into the hydraulic cavity (302). A through hole (401) is provided at the center of the pressure block (4). A hydraulic chamber (402) is provided below the through hole (401). 402) is connected to the hydraulic cavity (302). A conical column (5) is provided in the through hole (401). The conical column (5) is clearance-fitted with the through hole (401). A conical section (501) is provided at the upper end of the conical column (5). The taper of the conical section (501) is 1:

2. The conical section (501) extends out of the through hole (401). The lower end of the conical column (5) extends into the hydraulic cavity (302). A limit ring (502) is provided at the lower end of the conical column (5). The limit ring (502) is slidably connected to the hydraulic cavity (302). The cross-sectional area of ​​the limit ring (502) is the same as that of the hydraulic cavity (302). The upper pressure plate (202) is provided with a locking hole (203) that is consistent with the position of the conical column (5). The diameter of the locking hole (203) is adapted to the size of the conical column (5).

2. The circuit board stacking positioning and pressing device based on conical surface guidance according to claim 1, characterized in that, The lower end face of the upper pressure plate (202) is provided with a floating hole (204). The floating hole (204) is coaxial with and connected to the locking hole (203). A bushing (6) is provided in the floating hole (204). The bushing (6) includes a metal layer (601) and a rubber layer (602). The metal layer (601) is installed at the center of the bushing (6). The inner side of the rubber layer (602) wraps the metal layer (601). The outer side of the rubber layer (602) fits against the floating hole (204). A sealing groove (503) is provided on the side of the limiting ring (502). A sealing ring (7) is provided in the sealing groove (503).

3. The circuit board stacking positioning and pressing device based on conical surface guidance according to claim 2, characterized in that, The bushing (6) has a guide cone surface (603) at its center. The taper of the guide cone surface (603) is 1:1, and the guide cone surface (603) is connected to the locking hole (203).

4. The circuit board stacking positioning and pressing device based on conical surface guidance according to claim 1, characterized in that, A spring (403) is provided inside the hydraulic chamber (302), and the spring (403) is connected to the bottom of the hydraulic chamber (302) and the lower end face of the pressure block (4) respectively.

5. The circuit board stacking positioning and pressing device based on conical surface guidance according to claim 2, characterized in that, The lower pressure plate (3) is symmetrically provided with positioning holes (303) on its side. The upper pressure plate (202) is provided with positioning pins (205) at the positions corresponding to the positioning holes (303). When the upper pressure plate (202) is pressed down, the positioning pins (205) cooperate with the positioning holes (303). The lower end of the positioning pins (205) is provided with a positioning cone surface (206), and the taper of the positioning cone surface (206) is 1:

1.

6. The circuit board stacking positioning and pressing device based on conical surface guidance according to claim 1, characterized in that, The upper end face of the pressure block (4) is provided with a buffer layer (404), the buffer layer (404) is made of silicone rubber, and the thickness of the buffer layer (404) is 0.5-1mm. The outer surface of the buffer layer (404) is treated with anti-scratch treatment.

7. The circuit board stacking positioning and pressing device based on conical surface guidance according to claim 1, characterized in that, The volume ratio of the hydraulic chamber (302) to the hydraulic room (402) is 1:

2. The initial height of the pressure block (4) extending out of the hydraulic hole (301) is 3-5 mm. The length of the conical column (5) is 15-17 mm. The initial height of the conical column (5) extending out of the through hole (401) is 3-5 mm.

8. The circuit board stacking positioning and pressing device based on conical surface guidance according to claim 5, characterized in that, The bottom of the lower pressure plate (3) is provided with a positioning rib (304), and the upper end face of the lamination platform (101) is provided with a guide rail (102) adapted to the positioning rib (304). The outer wall of the positioning rib (304) and the inner wall of the guide rail (102) are both treated with frosted anti-slip treatment.

9. The circuit board stacking positioning and pressing device based on conical surface guidance according to claim 2, characterized in that, An expansion layer (504) is provided on the outer side of the conical column (5). The expansion layer (504) has a thickness of 0.1 to 0.3 mm and is made of zinc. The conical column (5) is made of chromium manganese steel.

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