Main control substrate heat dissipation system and temperature control method of main control substrate

Abstract

The invention belongs to the technical field of intelligent household appliances, and particularly relates to a main control substrate heat dissipation system and a temperature control method of a main control substrate. The system comprises a heat pump unit, a heat dissipation unit and a main control substrate, the heat dissipation unit comprises a heat dissipation pipeline; the main control substrate is arranged at a position close to the heat dissipation pipeline; a first water inlet and a first water outlet of the heat dissipation pipeline are respectively communicated with a waterway circulation loop of the heat pump unit; circulating water enters the heat dissipation pipeline through the first water inlet, exchanges heat generated by the master control substrate and flows back to the waterway circulation loop from the first water outlet. According to the method, the working temperature of a master control substrate is obtained; under the condition that the working temperature exceeds the preset temperature threshold value and the first overtemperature duration exceeds the first preset duration, the water valve is adjusted to the initial opening degree; and determining a control strategy of the water valve and adjusting the opening degree of the water valve according to the reacquired working temperature of the main control substrate, the environment temperature and the preset temperature threshold value so as to reduce the working temperature of the main control substrate and improve the heat dissipation efficiency of the system.

Description

Technical Field

[0001] This application belongs to the field of smart home appliance technology, specifically relating to a heat dissipation system for a main control board and a temperature control method for the main control board. Background Technology

[0002] As a highly efficient energy conversion and regulation device, the stable operation of a heat pump system highly depends on the precise coordination of its core control unit. In existing technologies, heat pump systems are equipped with a main control board, which carries various electrical components to achieve precise control of system operation.

[0003] However, the electrical components on the main control board generate heat during operation. The accumulation of heat will cause the component temperature to rise, which will reduce the component's working efficiency, shorten its lifespan, and in severe cases, may even damage the main control board. Summary of the Invention

[0004] This application provides a heat dissipation system for a main control board and a temperature control method for the main control board, in order to solve the technical problem that the heat generated by the operation of electrical components on the main control board leads to an increase in component temperature, thereby reducing component efficiency, shortening component lifespan, and in severe cases, easily causing damage to the main control board.

[0005] In a first aspect, this application provides a heat dissipation system for a main control board, the heat dissipation system for the main control board includes: a heat pump unit, a heat dissipation unit and a main control board;

[0006] The heat dissipation unit includes heat dissipation pipes; the main control board is located close to the heat dissipation pipes.

[0007] The heat pump unit includes a water circulation loop; the first inlet and the first outlet of the heat dissipation pipe are respectively connected to the main pipe section of the water circulation loop;

[0008] The circulating water in the water circulation loop enters the heat dissipation pipe through the first inlet, exchanges heat with the main control board, and flows back to the water circulation loop from the first outlet.

[0009] In one possible implementation, the water circulation loop includes: a second water inlet, a first water pump, a first heat exchanger, and a second water outlet; the heat dissipation unit further includes: a water valve;

[0010] The water circulation loop is configured sequentially along the water flow direction as a second inlet, a first water pump, a first heat exchanger, and a second outlet; the second outlet is connected to the second inlet via a return pipe section.

[0011] The water valve is connected in series to the heat dissipation pipe and is located in the pipe section near the first water inlet;

[0012] The first water pump is used to power the flow of circulating water; the water valve is used to regulate the water flow in the heat dissipation pipes.

[0013] In one possible implementation, the heat dissipation unit further includes: a second water pump;

[0014] The second water pump is connected in series to the heat dissipation pipe and is located between the water valve and the first water inlet;

[0015] The second water pump is used to increase the flow rate of the circulating water in the heat dissipation pipes.

[0016] In one possible implementation, the first outlet is located between the outlet side of the first heat exchanger and the second outlet.

[0017] The circulating water in the water circulation loop enters the heat dissipation pipe through the first inlet, flows through the water valve, exchanges heat with the heat generated by the main control board, and flows back from the first outlet of the heat dissipation pipe to the second outlet of the water circulation loop.

[0018] In one possible implementation, the first outlet is located in the main pipeline section between the first water pump and the second inlet;

[0019] The circulating water in the water circulation loop enters the heat dissipation pipe through the first inlet, flows through the water valve, exchanges heat with the heat generated by the main control board, and flows back from the first outlet of the heat dissipation pipe to the second inlet of the water circulation loop.

[0020] In one possible implementation, the heat dissipation unit further includes: a heat-conducting component;

[0021] The heat-conducting components are positioned between the heat dissipation pipes and the main control board.

[0022] Thermal conductive components are used to enhance the heat exchange efficiency between the heat dissipation pipes and the main control board.

[0023] In one possible implementation, the heat dissipation unit further includes: a first temperature sensor, a second temperature sensor, and a third temperature sensor;

[0024] The first temperature sensor is attached to the surface of the main control board; the second temperature sensor is attached to the outer wall of the main pipeline section between the first water pump and the first water inlet; the third temperature sensor is located in the external environment area of ​​the main control board's heat dissipation system.

[0025] The first temperature sensor, the second temperature sensor, and the third temperature sensor are respectively connected to the main control board for communication.

[0026] The first temperature sensor is used to collect the operating temperature of the main control board; the second temperature sensor is used to collect the inlet water temperature of the heat dissipation pipes; and the third temperature sensor is used to collect the ambient temperature of the external environment where the heat dissipation system of the main control board is located.

[0027] Secondly, this application provides a temperature control method for a main control substrate, applied to a heat dissipation system for a main control substrate as described in the first aspect and various possible implementations of the first aspect, the method comprising:

[0028] The operating temperature of the main control board is obtained through the first temperature sensor;

[0029] When the operating temperature exceeds the preset temperature threshold and the first over-temperature duration exceeds the first preset duration, the control water valve is adjusted to the initial opening. The first over-temperature duration is used to indicate the length of time that the operating temperature of the main control board exceeds the preset temperature threshold.

[0030] The operating temperature is re-acquired, and the ambient temperature of the main control board is obtained through a third temperature sensor.

[0031] Based on the new operating temperature, preset temperature threshold, and ambient temperature, the control strategy for the water valve is determined, and the opening degree of the water valve is adjusted according to the control strategy.

[0032] In one possible implementation, the control strategy for the water valve is determined based on the new operating temperature, a preset temperature threshold, and the ambient temperature, including:

[0033] When the new operating temperature is lower than the preset temperature threshold but higher than the ambient temperature, the control strategy is determined to be the first control strategy, which is used to indicate the opening degree of the water valve.

[0034] When the new operating temperature is not less than the preset temperature threshold and is greater than the ambient temperature, the control strategy is determined to be the second control strategy, which is used to indicate an increase in the opening degree of the water valve.

[0035] When the new operating temperature is less than the preset temperature threshold and not greater than the ambient temperature, the second over-temperature duration of the new operating temperature is determined, and the control strategy of the water valve is determined based on the second over-temperature duration. The second over-temperature duration is used to represent the continuous duration of the new operating temperature not less than the preset temperature threshold and not greater than the ambient temperature.

[0036] In one possible implementation, the control strategy for the water valve is determined based on the second overheat duration, including:

[0037] If the second overheating time does not exceed the second preset time, the control strategy is determined to be the third control strategy. The third control strategy is used to indicate that the opening of the water valve is reduced according to the preset step size.

[0038] If the second over-temperature duration exceeds the second preset duration, the control strategy is determined to be the fourth control strategy, which is used to instruct the main control board to stop operating.

[0039] Thirdly, this application provides a temperature control device for a main control substrate, comprising:

[0040] The acquisition module is used to acquire the operating temperature of the main control board through the first temperature sensor.

[0041] The processing module is used to control the water valve to adjust to the initial opening degree when the operating temperature exceeds the preset temperature threshold and the first over-temperature duration exceeds the first preset duration. The first over-temperature duration is used to indicate the continuous duration for which the operating temperature of the main control board exceeds the preset temperature threshold.

[0042] The acquisition module is also used to reacquire the operating temperature and to acquire the ambient temperature of the main control board via a third temperature sensor.

[0043] The processing module is also used to determine the control strategy of the water valve based on the new operating temperature, preset temperature threshold and ambient temperature, and adjust the opening degree of the water valve according to the control strategy.

[0044] In one possible implementation, the processing module is further configured to determine a first control strategy when the new operating temperature is less than a preset temperature threshold but greater than the ambient temperature. The first control strategy is used to indicate the degree of opening of the water valve.

[0045] The processing module is also used to determine the control strategy as a second control strategy when the new operating temperature is not less than the preset temperature threshold and is greater than the ambient temperature. The second control strategy is used to indicate an increase in the opening degree of the water valve.

[0046] The processing module is also used to determine the second over-temperature duration of the new operating temperature when the new operating temperature is lower than the preset temperature threshold and not higher than the ambient temperature, and to determine the control strategy of the water valve based on the second over-temperature duration. The second over-temperature duration is used to represent the continuous duration of the new operating temperature not being lower than the preset temperature threshold and not higher than the ambient temperature.

[0047] In one possible implementation, the processing module is further configured to determine a third control strategy if the second overheating duration does not exceed a second preset duration. The third control strategy is used to instruct the opening of the water valve to be reduced according to a preset step size.

[0048] The processing module is also used to determine the control strategy as a fourth control strategy when the second over-temperature duration exceeds the second preset duration. The fourth control strategy is used to instruct the main control board to stop operating.

[0049] Fourthly, this application provides an electronic device, comprising:

[0050] The processor, and the memory that is in communication with the processor;

[0051] The memory stores instructions that the computer executes;

[0052] The processor executes computer execution instructions stored in memory to implement the temperature control method of the main control board as described in the second aspect and various possible implementations of the second aspect.

[0053] Fifthly, this application provides a computer storage medium storing computer execution instructions, which are executed by a processor to implement a temperature control method for a main control substrate as described in the second aspect and various possible implementations of the second aspect above.

[0054] In a sixth aspect, this application provides a computer program product, including a computer program that, when executed by a processor, implements a temperature control method for a main control substrate as described in the second aspect and various possible implementations of the second aspect.

[0055] The present application provides a heat dissipation system and a temperature control method for a main control board. The system includes a heat pump unit, a heat dissipation unit, and a main control board. The heat dissipation unit includes heat dissipation pipes. The main control board is positioned close to the heat dissipation pipes. The heat pump unit includes a water circulation loop. The first inlet and the first outlet of the heat dissipation pipes are respectively connected to the water circulation loop. The circulating water in the water circulation loop enters the heat dissipation pipes through the first inlet, exchanges heat with the heat generated by the main control board, and flows back to the water circulation loop from the first outlet, thereby dissipating heat from the main control board. The method obtains the operating temperature of the main control board through a first temperature sensor. When the operating temperature exceeds a preset temperature threshold and the first over-temperature duration exceeds a first preset duration, the water valve is controlled to adjust to the initial opening. The operating temperature of the main control board is re-obtained, and the ambient temperature of the main control board is obtained through a third temperature sensor. Based on the new operating temperature, the preset temperature threshold, and the ambient temperature, a control strategy for the water valve is determined, and the opening of the water valve is adjusted according to the control strategy. This method uses a water pump to drive water circulation and a water valve to regulate the flow rate, achieving a dynamic balance between efficient heat dissipation and condensation risk control of the main control board. This significantly improves the heat dissipation efficiency of the main control board and extends the life of electrical components. At the same time, it avoids surface condensation while reducing the temperature, eliminating the risk of short circuits or corrosion on the main control board. Attached Figure Description

[0056] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0057] Figure 1 This is a schematic diagram of the heat dissipation system of the main control board provided in this application. Figure 1 ;

[0058] Figure 2 This is a schematic diagram of the heat dissipation system of the main control board provided in this application. Figure 2 ;

[0059] Figure 3 This is a schematic diagram of the heat dissipation system of the main control board provided in this application. Figure 3 ;

[0060] Figure 4 This is a schematic flowchart of the temperature control method for the main control substrate provided in this application;

[0061] Figure 5 This is a schematic diagram of the temperature control device of the main control board provided in this application;

[0062] Figure 6 This is a schematic diagram of the structure of the electronic device provided in this application.

[0063] Figure label:

[0064] 101 - Heat dissipation unit;

[0065] 102 - Main control board;

[0066] 103 - Four-way valve;

[0067] 104 - Second heat exchanger;

[0068] 105 - Electronic expansion valve;

[0069] 106 - Compressor;

[0070] 107 - Gas-liquid separator;

[0071] 201 - Heat dissipation piping;

[0072] 202 - First Water Pump;

[0073] 203 - First heat exchanger;

[0074] 204-Water Valve;

[0075] 205 - Second water pump;

[0076] 301 - First temperature sensor;

[0077] 302 - Second temperature sensor;

[0078] A - First water inlet;

[0079] B - First outlet;

[0080] C - Second water inlet;

[0081] D - Second outlet.

[0082] The accompanying drawings illustrate specific embodiments of this application, which will be described in more detail below. These drawings and descriptions are not intended to limit the scope of the concept in any way, but rather to illustrate the concepts of this application to those skilled in the art through reference to particular embodiments. Detailed Implementation

[0083] To make the objectives, technical solutions, and advantages of this application clearer, the technical solutions of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0084] In the description of the embodiments of this application, it should be understood that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, an indirect connection through an intermediate medium, or the internal communication between two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0085] The terms "first," "second," "third," "fourth," etc. (if present) in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that embodiments of the invention described herein can be implemented, for example, in orders other than those illustrated or described herein.

[0086] In this application, the terms "exemplary" or "for example" are used to indicate examples, illustrations, or descriptions. Any embodiment or design described as "exemplary" or "for example" in this application should not be construed as being more preferred or advantageous than other embodiments or designs. Specifically, the use of terms such as "exemplary" or "for example" is intended to present the relevant concepts in a specific manner.

[0087] It should be noted that the user information (including but not limited to user device information, user personal information, etc.) and data (including but not limited to data used for analysis, data stored, data displayed, etc.) involved in this application are all information and data authorized by the user or fully authorized by all parties. Furthermore, the collection, use and processing of the relevant data must comply with relevant laws, regulations and standards, and corresponding operation entry points are provided for users to choose to authorize or refuse.

[0088] CPU: Central Processing Unit, or CPU for short, is the core of a computer system for computation and control, and is the final execution unit for information processing and program execution.

[0089] As a highly efficient energy conversion and regulation device, the stable operation of a heat pump system depends heavily on the precise coordination of its core control unit.

[0090] In existing technologies, heat pump systems are equipped with a main control board, which carries various electrical components to achieve precise control of system operation. Heat pump systems are widely used in building heating, cooling, and industrial temperature regulation, and their core function is to achieve efficient energy transfer through thermodynamic cycles.

[0091] In a heat pump system, the main control board acts as the control center, responsible for coordinating the operation of key components such as the compressor, fan, and electronic expansion valve, and monitoring system parameters such as temperature and pressure in real time.

[0092] The main control board is usually composed of highly integrated electronic components (such as CPU, sensors, relays, etc.), and its operational stability directly affects the efficiency and lifespan of the heat pump system.

[0093] However, the electrical components on the main control board generate a lot of heat due to continuous operation. If the heat dissipation is insufficient, the component temperature may exceed the safety threshold, resulting in reduced component efficiency, shortened component lifespan, and in severe cases, damage to the main control board.

[0094] In addition, the main control board is often installed in a closed or semi-closed electrical control box, and the limited ventilation further aggravates the heat dissipation problem. At the same time, in low temperature and high humidity environments (such as winter heating mode), if the surface temperature of the main control board is lower than the ambient dew point temperature, condensation may occur, which may cause short circuits or corrosion risks.

[0095] To address the aforementioned problems, this application provides a main control board heat dissipation system and a main control board temperature control method. The main control board heat dissipation system uses the user-side water circulation in a heat pump system (such as water from underfloor heating or fan coil units) as the heat dissipation medium. A water pump drives the water circulation, and water valves regulate the flow rate to achieve heat dissipation for the main control board. The main control board temperature control method is applied to this heat dissipation system. Multiple temperature sensors installed in the system dynamically adjust the water valve opening based on the dynamic relationship between the main control board's operating temperature and the ambient temperature, achieving precise temperature control of the main control board. This reduces the main control board temperature while preventing surface condensation. This method, through the combination of circulating water heat dissipation and control logic, achieves a dynamic balance between efficient heat dissipation and condensation risk control of the main control board, significantly improving the heat dissipation efficiency of the main control board and extending the lifespan of electrical components. Simultaneously, it reduces temperature while preventing surface condensation, eliminating the risk of short circuits or corrosion on the main control board.

[0096] The technical solution of this application and how the technical solution of this application solves the above-mentioned technical problems are described in detail below with specific embodiments. These specific embodiments can be combined with each other, and the same or similar concepts or processes may not be described again in some embodiments. The embodiments of this application will now be described with reference to the accompanying drawings.

[0097] Figure 1 This is a schematic diagram of the heat dissipation system of the main control board provided in this application. Figure 1 ; Figure 2 This is a schematic diagram of the heat dissipation system of the main control board provided in this application. Figure 2 ; Figure 3 This is a schematic diagram of the heat dissipation system of the main control board provided in this application. Figure 3 .

[0098] Reference Figure 1 As shown in the figure, this application provides a heat dissipation system for a main control board (not shown in the figure), including a heat pump unit (not shown in the figure), a heat dissipation unit 101 and a main control board 102.

[0099] The heat dissipation unit 101 includes a heat dissipation pipe 201; the main control board 102 is located close to the heat dissipation pipe 201; the heat pump unit includes a water circulation loop; the first water inlet A and the first water outlet B of the heat dissipation pipe 201 are respectively connected to the main pipe section of the water circulation loop.

[0100] In this application, the heat pump unit includes a refrigerant circulation loop and a water circulation loop; the refrigerant circulation loop includes a four-way valve 103, a second heat exchanger 104, an electronic expansion valve 105, a compressor 106, a gas-liquid separator 107, and a first heat exchanger 203; the water circulation loop includes a second water inlet C, a first water pump 202, a first heat exchanger 203, and a second water outlet D.

[0101] The refrigerant circulation loop switches the refrigerant flow direction through the four-way valve 103, and works in conjunction with the compressor 106, the second heat exchanger 104, the electronic expansion valve 105, the gas-liquid separator 107 and the first heat exchanger 203 to achieve heat transfer in either cooling or heating mode.

[0102] The water circulation loop uses the first heat exchanger 203 as the core component for energy exchange. When the heat pump unit is in heating mode, the first water pump 202 drives the circulating water medium to circulate in the loop. When the circulating water flows through the first heat exchanger 203, it absorbs the heat released by the high-temperature refrigerant in the refrigerant circulation loop. The heated water is then transported to the terminal heat dissipation devices such as underfloor heating through the second outlet D to provide indoor heating. The water that has released heat and cooled down flows back to the upstream of the first water pump 202 through the second inlet C, forming a closed loop circulation of the circulating water.

[0103] The first heat exchanger 203 is the only heat exchange interface between the refrigerant circulation loop and the water circulation loop. Through its internal independent refrigerant and water channels, it achieves heat transfer between the two media without mixing, ensuring both the high-efficiency heat exchange characteristics of the refrigerant circulation loop and meeting the stable energy supply requirements at the end of the water circulation loop. When the heat pump unit is in heating mode, the first heat exchanger 203 can convert the low-grade heat energy absorbed from the outside in the refrigerant circulation loop into usable high-grade heating heat energy in the water circulation loop. When the heat pump unit is in cooling mode, the first heat exchanger 203 can transfer the heat absorbed from the indoor environment in the water circulation loop to the refrigerant circulation loop, and then the refrigerant circulation loop discharges it to the outdoor environment through the second heat exchanger 104 (outdoor side heat exchanger).

[0104] The circulating water in the water circulation loop is powered by the first water pump 202. It enters the heat dissipation pipe 201 through the first water inlet A, exchanges heat with the heat generated by the main control board 102, and flows back to the water circulation loop from the first water outlet B, thereby achieving heat dissipation of the main control board 102.

[0105] Understandably, the circulating water in the heat dissipation pipe 201 serves as a heat exchange medium, exchanging heat with the main control board 102. In other words, the heat generated when the main control board 102 is working is transferred to the pipe wall of the heat dissipation pipe 201 through heat conduction. When the circulating water flows in the heat dissipation pipe 201, the heat from the pipe wall is transferred to the circulating water, causing the water temperature to rise. The heated circulating water is then transported to the water circulation loop along the pipe, thus forming a closed loop.

[0106] For example, the first water pump 202 draws circulating water from the water circulation loop (such as water used in underfloor heating or fan coil units) and delivers the circulating water to the heat dissipation pipe 201 of the heat dissipation unit 101. The heat dissipation pipe 201 extends to the bottom of the main control board 102 and contacts the surface of the main control board 102 to achieve heat exchange. That is, a portion of the heat dissipation pipe 201 is in contact with the main control board 102. After the circulating water in the heat dissipation pipe 201 exchanges heat with the heat generated by the main control board 102, the circulating water flows back from the first outlet B to the water circulation loop, thereby achieving heat dissipation of the main control board 102.

[0107] The main control board heat dissipation system provided in this application embodiment provides a heat dissipation unit 101 that is attached to the main control board 102 and connected to the water circulation loop. The first water pump 202 in the water circulation loop provides power to the circulating water in the heat dissipation pipe 201, so that the circulating water flows through the main control board 102 to dissipate heat from the main control board 102, thereby reducing the temperature of the main control board 102 and improving the heat dissipation efficiency of the main control board 102.

[0108] Continue to refer to Figure 1 As shown, in one possible implementation, the heat dissipation unit 101 further includes a water valve 204.

[0109] The water circulation loop is configured sequentially along the water flow direction as the second inlet C, the first water pump 202, the first heat exchanger 203, and the second outlet D; the second outlet D is connected to the second inlet C through a return pipe section.

[0110] Water valve 204 is connected in series to heat dissipation pipe 201 and is located in the pipe section near the first water inlet A.

[0111] The first water pump 202 is used to provide power for the flow of circulating water. The first water pump 202 can be, for example, a centrifugal pump, a gear pump or a positive displacement pump; the water valve 204 is used to regulate the water flow of the heat dissipation pipe 201. The water valve 204 can be, for example, an electric regulating valve or a solenoid valve.

[0112] In this embodiment, the main control board 102 is communicatively connected to the water valve 204. The water valve 204 can receive and execute the opening adjustment command sent by the main control board 102 to adjust its own opening size, that is, to adjust the water flow rate in the heat dissipation pipe 201, thereby realizing the adjustment of the heat dissipation of the main control board 102. The water valve 204 has a built-in execution and feedback module, which can adjust its own opening size after receiving the command and send the current opening status back to the main control board 102, forming a closed-loop control with bidirectional communication.

[0113] Specifically, water valve 204 is the core of flow control in the water circulation loop. Its opening degree determines the amount of water flowing through the section of the heat exchange pipe 201 that is in contact with the main control board 102 for heat exchange per unit time. The larger the opening degree of water valve 204, the larger the flow cross-sectional area of ​​the circulating water in the heat exchange pipe 201, and the greater the water flow rate through the heat exchange surface of the main control board 102 per unit time. As the heat dissipation medium, the greater the flow rate of the circulating water, the more heat it can remove from the surface of the main control board 102 per unit time, thus increasing the heat dissipation of the main control board 102. The smaller the opening degree of water valve 204, the smaller the water flow rate per unit time, and the less heat is removed, thus reducing the heat dissipation of the main control board 102.

[0114] Adjusting the opening of water valve 204 essentially changes the total amount of heat carried away by the circulating water from the main control board 102 per unit time through flow regulation. Specifically, the opening of water valve 204 includes: large opening, medium opening, and small opening. When water valve 204 is at a large opening, the circulating water in the corresponding heat dissipation pipe 201 has a high flow rate. At this time, the heat dissipation in the heat dissipation pipe 201 per unit time increases, and the heat generated by the operation of the main control board 102 is quickly carried away, thereby achieving rapid heat dissipation of the main control board 102. When water valve 204 is at a medium opening, the circulating water in the corresponding heat dissipation pipe 201 has a medium flow rate. At this time, the heat dissipation per unit time in the heat dissipation pipe 201 is moderate (compared to the heat dissipation corresponding to a large opening). The rate at which the main control board 102 generates heat matches the heat dissipation rate of the heat dissipation pipe 201, which can achieve constant temperature control of the main control board 102. When the water valve 204 is at a small opening, the circulating water in the corresponding heat dissipation pipe 201 is at a low flow rate. At this time, the heat dissipation per unit time in the heat dissipation pipe 201 decreases, the heat dissipation rate of the main control board 102 generates heat slows down, and the generated heat cannot be carried away in time, which easily leads to heat accumulation and causes the temperature of the main control board 102 to rise.

[0115] Reference Figure 2 As shown, in one possible implementation, the heat dissipation unit 101 further includes a second water pump 205.

[0116] The second water pump 205 is connected in series to the heat dissipation pipe 201 and is located between the water valve 204 and the first water inlet A.

[0117] The second water pump 205 is used to increase the flow rate of circulating water in the heat dissipation pipe 201. The second water pump 205 can be, for example, a micro booster water pump, a DC circulating water pump, or a small shielded water pump.

[0118] Understandably, since the opening of water valve 204 has an upper limit, when water valve 204 is adjusted to the maximum opening, the water flow rate of circulating water in heat dissipation pipe 201 reaches the maximum value limited by water valve 204, and the water flow rate also reaches the peak value at the same time, and cannot be further improved by adjusting the opening of water valve 204.

[0119] Therefore, by using the second water pump 205 connected in series with the water valve 204, the flow rate of the circulating water in the heat dissipation pipe 201 can be regulated in a coordinated manner. When the water valve 204 is not at its maximum opening, the flow rate can be regulated by adjusting the opening of the water valve 204. When the water valve 204 is opened to its maximum opening, and the flow rate of the water in the heat dissipation pipe 201 is still insufficient to meet the high-load heat dissipation requirements of the main control board 102, the added second water pump 205 is started. The boosting effect of the second water pump 205 breaks through the opening bottleneck of the water valve 204, further increasing the flow rate of the circulating water in the heat dissipation pipe 201, increasing the flow rate of the water in the heat dissipation pipe 102, and improving the heat exchange rate between the heat dissipation pipe 102 and the main control board 102, ensuring the heat dissipation effect and operational stability of the main control board 102 under high-power conditions. Through the coordinated control of the second water pump 205 and the water valve 204, the precise regulation of the water flow rate is ensured, avoiding heat dissipation failure or increased energy consumption due to insufficient or excessive flow.

[0120] In one possible implementation, the heat dissipation unit 101 further includes a heat-conducting component (not shown in the figure).

[0121] A heat-conducting component is disposed between the heat dissipation pipe 201 and the main control board 102; the heat-conducting component is used to enhance the heat exchange efficiency between the heat dissipation pipe 201 and the main control board 102.

[0122] In some embodiments, the thermal conductive component is at least one of thermally conductive silicone sheet, thermally conductive metal sheet or thermally conductive adhesive, and the thermal conductive component is closely attached to the outer wall surface of the heat dissipation pipe 201 and the surface of the main control substrate 102.

[0123] In this embodiment, the air thermal resistance between the heat dissipation pipe 201 and the main control substrate 102 is eliminated by setting the heat conduction component, which significantly improves the heat conduction efficiency and thus improves the heat dissipation efficiency of the main control substrate 102.

[0124] In one possible implementation, the heat dissipation unit 101 further includes a first temperature sensor 301, a second temperature sensor 302, and a third temperature sensor (not shown in the figure).

[0125] The first temperature sensor 301 is attached to the surface of the main control board 102; the second temperature sensor 302 is attached to the outer wall of the main pipeline section between the first water pump 202 and the first water inlet A; the third temperature sensor is located in the external environment area of ​​the heat dissipation system of the main control board; the first temperature sensor 301, the second temperature sensor 302 and the third temperature sensor are respectively connected to the main control board 102 in communication.

[0126] The first temperature sensor 301 is used to collect the operating temperature of the main control board 102; the second temperature sensor 302 is used to collect the inlet water temperature of the heat dissipation pipe 201; and the third temperature sensor is used to collect the ambient temperature of the external environment where the heat dissipation system of the main control board is located.

[0127] For example, the first temperature sensor 301, the second temperature sensor 302, and the third temperature sensor acquire the real-time temperature Tm and ambient temperature Ta of the main control board 102 in real time, and transmit the data to the main control board 102 through the communication connection channel with the main control board 102. The main control board 102 outputs an opening control command to the water valve 204 based on the comparison result of the real-time temperature Tm with the critical temperature Tcri and the ambient temperature Ta, and adjusts the opening of the water valve 204 to change the water flow rate of the circulating water in the heat dissipation pipe 201. Specifically, when the real-time temperature Tm exceeds the critical temperature Tcri, the opening of the water valve 204 increases to enhance heat dissipation; when the real-time temperature Tm is close to the ambient dew point temperature, the opening of the water valve 204 decreases to avoid condensation on the surface of the main control board 102. The synergistic effect of the first water pump 202 and the water valve 204 ensures that the circulating water forms a stable heat exchange channel at the bottom of the main control board 102, thereby realizing the dynamic temperature regulation of the main control board 102.

[0128] Continue to refer to Figure 2 As shown, in one possible implementation, the first outlet B is located between the outlet side of the first heat exchanger 203 and the second outlet D.

[0129] The circulating water in the water circulation loop enters the heat dissipation pipe 201 through the first inlet A, flows through the water valve 204, exchanges heat with the heat generated by the main control board 102, and flows back from the first outlet B of the heat dissipation pipe 201 to the second outlet D of the water circulation loop.

[0130] For example, the first inlet A and the first outlet B are respectively located on the inlet side and outlet side of the first heat exchanger 203. That is, in the water circuit before the circulating water in the water circuit exchanges heat with the refrigerant circulation circuit through the first heat exchanger 203, a branch of circulating water is drawn out and heats the main control board 102 through the heat dissipation pipe 201. The circulating water after heat dissipating the main control board 102 is introduced into the water circuit after the circulating water in the water circuit exchanges heat with the refrigerant circulation circuit through the first heat exchanger 203 through the heat dissipation pipe 201.

[0131] Reference Figure 3 As shown, in one possible implementation, the first outlet B is located in the main pipeline section between the first water pump 202 and the second inlet C.

[0132] The circulating water in the water circulation loop enters the heat dissipation pipe 201 through the first inlet A, flows through the water valve 204, exchanges heat with the heat generated by the main control board 102, and flows back from the first outlet B of the heat dissipation pipe 201 to the second inlet C of the water circulation loop.

[0133] For example, the first inlet A and the first outlet B are both located on the inlet side of the first heat exchanger 203, and respectively on the outlet side and inlet side of the first water pump 202; that is, before the circulating water in the water circulation loop exchanges heat with the refrigerant circulation loop through the first heat exchanger 203, a branch of circulating water is drawn out in the water path after the circulating water flows through the first water pump 202, and the main control board 102 is cooled through the heat dissipation pipe 201, and the circulating water after cooling the main control board 102 is introduced into the inlet side of the first water pump 202 through the heat dissipation pipe 201.

[0134] In one possible implementation, the heat dissipation pipes 102 close to the main control board 102 can be configured as a multi-layer parallel pipe structure, and each layer of pipes corresponds to an independent control water valve.

[0135] For example, the multi-layer parallel pipeline structure can be water pipes distributed parallel to the surface of the main control substrate 102 to form a multi-layer heat dissipation channel, specifically, it can be two or three layers of copper pipes stacked together.

[0136] In another possible implementation, multiple layers of parallel water pipes are distributed along the surface of the main control substrate 102, with each layer of water pipes independently connected to the water circulation loop.

[0137] For example, the upper water pipe covers the high-heat area of ​​the main control board 102, and the lower water pipe covers the low-heat area; the second water pump 205 drives the circulating water to flow synchronously in each layer of water pipes, and the multi-layer structure increases the contact area between the circulating water and the main control board 102, forming a multi-path heat exchange; the heat dissipation efficiency of different areas of the main control board 102 is optimized through the multi-layer water pipe structure.

[0138] Figure 4 This is a schematic flowchart illustrating the temperature control method for the main control substrate provided in an embodiment of this application. The executing entity in this embodiment can be, for example, the main control substrate 102 in the main control substrate heat dissipation system. Figure 4 As shown, the temperature control method for the main control board provided in this embodiment includes:

[0139] S401: Obtain the operating temperature of the main control board through the first temperature sensor.

[0140] The operating temperature refers to the real-time actual temperature of the heat-generating area of ​​the main control board 102 during actual operation.

[0141] Understandably, the operating temperature is a temperature parameter that reflects the actual thermal state of the main control board 102 during operation; for example, the operating temperature can be the surface temperature of the main heat-generating components such as power devices, chips, and capacitors on the main control board 102, or the operating area temperature of the copper foil of the printed circuit on the main control board 102.

[0142] For example, the operating temperature of the main control board 102 is obtained as 55°C by the first temperature sensor 301 disposed on the main control board 102. This application embodiment does not impose any special restrictions on the placement of the first temperature sensor 301.

[0143] S402: When the operating temperature exceeds the preset temperature threshold and the first over-temperature duration exceeds the first preset duration, control the water valve to adjust to the initial opening degree.

[0144] The preset temperature threshold is the temperature value used to determine whether to dissipate heat from the main control board 102. The preset temperature threshold can be, for example, 50°C. The first over-temperature duration is used to indicate the duration for which the operating temperature of the main control board 102 exceeds the preset temperature threshold. The first preset duration can be, for example, 1 minute. The initial opening degree can be, for example, 30%.

[0145] In this embodiment, the water valve 204 is initially closed, and there is no circulating water in the water circulation loop. By determining the relationship between the operating temperature of the main control board 102 and a preset temperature threshold, it can be determined whether the main control board 102 needs to be cooled. Specifically, if the operating temperature does not exceed the preset temperature threshold, the current operating temperature of the main control board 102 is normal and will not damage its components. In this case, the main control board 102 does not need to be cooled and can maintain its current operating state. If the operating temperature exceeds the preset temperature threshold, the main control board 102 is cooled. The duration of the temperature threshold (first over-temperature duration) is determined, that is, whether the first over-temperature duration exceeds the first preset duration is compared. When the operating temperature exceeds the preset temperature threshold and the first over-temperature duration exceeds the first preset duration, the main control board 102 is in an over-temperature state (the operating temperature remains high for a long period of time), which can easily lead to a decrease in component performance, a shortened lifespan, or even permanent damage. At this time, it is necessary to use the heat dissipation unit 101 in the heat dissipation system of the main control board to dissipate heat from the main control board 102, that is, to dissipate heat from the main control board 102 by adjusting the opening of the water valve 204.

[0146] Understandably, when the operating temperature exceeds the preset temperature threshold, the main control board 102 records the continuous duration of the operating temperature exceeding the preset temperature threshold, thereby obtaining the first over-temperature duration.

[0147] For example, if the current operating temperature is 55°C, and the operating temperature recorded by the main control board 102 exceeds the preset temperature threshold of 50°C for a continuous duration of 2 minutes, it can be determined that the operating temperature exceeds the preset temperature threshold, and the first over-temperature duration of 2 minutes exceeds the first preset duration of 1 minute. At this time, the opening of the water valve is adjusted to the initial opening of 20%, so that circulating water flows into the heat dissipation pipe 201 where the water valve is located, thereby starting to dissipate heat from the main control board 102.

[0148] S403: Reacquire the operating temperature and obtain the ambient temperature of the main control board through the third temperature sensor.

[0149] Among them, ambient temperature refers to the real-time temperature parameter of the environment in which the main control board 102 is located.

[0150] In this embodiment, the heat dissipation process of the main control board 102 is composed of water cooling of the heat dissipation pipe 201 and natural heat dissipation of the surrounding environment. That is, during the heat dissipation process of the main control board 102, part of the heat is forcibly carried away by the water cooling pipe 201 (active heat dissipation), and the other part is naturally dissipated to the surrounding environment through thermal radiation and thermal convection (passive heat dissipation). The efficiency of natural heat dissipation is determined by the temperature difference between the operating temperature of the main control board 102 and the ambient temperature. The ambient temperature affects the proportion of heat dissipation in the overall heat dissipation process.

[0151] When the main control board 102 needs to dissipate heat, when the ambient temperature is low, the temperature difference between the operating temperature of the main control board 102 and the ambient temperature is large, resulting in high natural heat dissipation efficiency and the ability to remove a large amount of heat from the main control board 102. When the ambient temperature is high, the temperature difference between the operating temperature of the main control board 102 and the ambient temperature is small, resulting in a significant reduction in natural heat dissipation efficiency, and even almost no heat can be dissipated naturally. The total heat dissipation almost entirely relies on forced cooling via water channels. When the ambient temperature is close to the operating temperature of the main control board 102, natural heat dissipation is basically ineffective, and the heat generated by the operation of the main control board 102 is prone to accumulate, leading to continuous or even aggravated overheating of the main control board 102.

[0152] For example, the operating temperature is re-acquired as 50°C, and the ambient temperature of the main control board 102 is obtained as 35°C through the third temperature sensor.

[0153] In one possible implementation, the operating temperature is reacquired by using the first temperature sensor 301 after the water valve 204 has been running at its initial opening for a certain period of time (e.g., 5 minutes). Furthermore, the new operating temperature is acquired at a preset frequency, which may be, for example, 5 minutes.

[0154] This application does not impose any special restrictions on the preset frequency for obtaining new operating temperatures.

[0155] S404: Based on the new operating temperature, preset temperature threshold and ambient temperature, determine the control strategy of the water valve, and adjust the opening degree of the water valve according to the control strategy.

[0156] Understandably, the control strategy refers to the specific opening adjustment scheme of the water valve 204. The new operating temperature can reflect the heat dissipation effect after the water valve 204 in the heat dissipation unit 101 is adjusted to the initial opening, thereby assisting the heat dissipation direction of the main control board 102. For example, if the new operating temperature is still much higher than the preset temperature threshold, it indicates that the current heat dissipation intensity is insufficient, and a control strategy to increase the opening of the water valve 204 needs to be formulated to improve the heat dissipation efficiency of the heat dissipation pipe 201. If the new operating temperature is close to the preset temperature threshold, it indicates that the current heat dissipation effect is good, and a control strategy to maintain / fine-tune the opening of the water valve 204 needs to be formulated. By adjusting the opening through real-time feedback, the heat dissipation intensity of the water circuit can be accurately matched with the actual heat generation of the main control board 102, avoiding insufficient or excessive heat dissipation.

[0157] In this embodiment, by comparing the new operating temperature with the preset temperature threshold, it can be determined whether the heat dissipation efficiency of the heat dissipation pipe 201 needs to be maintained, increased, or decreased. By comparing the new operating temperature with the ambient temperature, it can be determined whether there is a possibility of condensation on the main control board 102, thereby avoiding condensation on the main control board 102 due to excessive heat dissipation intensity.

[0158] Based on the new operating temperature, the preset temperature threshold, and the ambient temperature, the relationship between the new operating temperature and the preset temperature threshold, as well as the relationship between the new operating temperature and the ambient temperature, is compared to determine whether the current main control board 102 is in an overheating state and whether there is a possibility of condensation on the main control board 102. In this way, the control strategy of the water valve 204 is determined, and the opening degree of the water valve 204 is adjusted according to the control strategy.

[0159] For example, the main control board 102 sends an opening adjustment command to the water valve 204 through a weak current communication link according to the currently determined control strategy. The stepper / servo motor built into the water valve 204 drives the valve stem to change the flow cross-sectional area of ​​the valve core, thereby achieving precise control of the water flow to match the actual heat dissipation requirements of the main control board 102.

[0160] In one possible implementation, if the new operating temperature is less than a preset temperature threshold but greater than the ambient temperature, the control strategy is determined to be a first control strategy; if the new operating temperature is not less than the preset temperature threshold but greater than the ambient temperature, the control strategy is determined to be a second control strategy; if the new operating temperature is not less than the preset temperature threshold but not greater than the ambient temperature, a second over-temperature duration of the new operating temperature is determined, and the control strategy for the water valve is determined based on the second over-temperature duration.

[0161] The first control strategy is used to indicate the opening degree of the water valve 204; the second control strategy is used to indicate the opening degree of the water valve 204; and the second over-temperature duration is used to indicate the duration of continuous operation when the new operating temperature is not less than the preset temperature threshold and not greater than the ambient temperature.

[0162] When the new operating temperature is lower than the preset temperature threshold but higher than the ambient temperature, it indicates that the water valve 204 is operating at its initial opening, which effectively dissipates heat from the main control board 102. The operating temperature of the main control board 102 is within a safe range and condensation does not occur. At this time, the heat pump unit and the heat dissipation unit 101 operate normally, maintaining the opening of the water valve 204 unchanged (first control strategy), which is determined as the control strategy for the water valve 204. When the new operating temperature is not lower than the preset temperature threshold but higher than the ambient temperature, it indicates that the water valve 204 is operating at its initial opening, which is less effective at dissipating heat from the main control board 102. It fails to achieve the ideal heat dissipation effect for the main control board 102, and the operating temperature of the main control board 102 remains high (over-temperature state). Since the new operating temperature is higher than the ambient temperature, condensation will not occur on the main control board 102. At this time, it is necessary to increase the opening of the water valve 204 (second control strategy), which is determined as the control strategy for the water valve 204.

[0163] When the new operating temperature is lower than the preset temperature threshold and not higher than the ambient temperature, it indicates that the main control board 102 is in a safe state and the heat dissipation pipe 201 has achieved the ideal heat dissipation effect. At this time, the duration of the main control board 102 in this state is determined, that is, the second over-temperature duration of the new operating temperature is determined, and the control strategy of the water valve 204 is determined based on the second over-temperature duration. Furthermore, when the new operating temperature is lower than the preset temperature threshold and not higher than the ambient temperature, the control strategy of the water valve 204 is determined for the purpose of preventing condensation.

[0164] In some embodiments, if the new operating temperature is not lower than a preset temperature threshold and not higher than the ambient temperature, it indicates that the ambient temperature of the current main control board 102 is abnormal and is an abnormal situation. At this time, the main control board 102 can be controlled to stop operating, and the heat pump unit can also stop operating.

[0165] In one possible implementation, if the second overheat duration does not exceed the second preset duration, the control strategy is determined to be the third control strategy; if the second overheat duration exceeds the second preset duration, the control strategy is determined to be the fourth control strategy.

[0166] The third control strategy is used to instruct the opening of the water valve 204 to be reduced by a preset step size, and the preset step size can be, for example, 5%; the fourth control strategy is used to instruct the main control board 102 to stop operating, and the second preset duration can be, for example, 30 minutes.

[0167] If the second overheating duration does not exceed the second preset duration, it indicates that the main control board 102 has achieved the expected heat dissipation effect, but has not been in a low temperature state for a long time. At this time, there is a possibility that condensation will occur on the main control board 102, and the opening of the water valve 204 needs to be reduced according to the preset step size (third control strategy), which is determined as the control strategy of the water valve 204. If the second overheating duration exceeds the second preset duration, it indicates that the main control board 102 has achieved the expected heat dissipation effect and has been in a low temperature state for a long time. At this time, the possibility that condensation will occur on the main control board 102 increases, and the main control board 102 needs to be controlled to stop operation (fourth control strategy), which is determined as the control strategy of the water valve 204.

[0168] For example, if the operating temperature of the main control board 102 re-acquired this time is Tm, the preset temperature threshold is Tcri, and the ambient temperature is Tao; if Tm < Tcri and Tm > Tao, the first control strategy is determined to be the current control strategy of the water valve 204, so as to control the heat pump unit and the main control board 102 to operate normally, and the valve opening of the water valve 204 remains unchanged; if Tm ≥ Tcri and Tm > Tao, the second control strategy is determined to be the current control strategy of the water valve 204, so as to increase the valve opening of the water valve 204 and improve the heat dissipation efficiency; if Tm < Tcri and Tm ≥ Tao, and the second over-temperature duration does not exceed 30 minutes, the third control strategy is determined to be the current control strategy of the water valve 204. The control strategy 4 is to gradually reduce the valve opening of water valve 204 to close it with a 5% compensation. When Tm < Tcri and Tm ≥ Tao, and the second over-temperature duration exceeds 30 minutes, the fourth control strategy is determined as the current control strategy for water valve 204 to control the heat pump unit and the main control board 102 to shut down and prevent condensation from forming on the main control board 102. When Tm ≥ Tcri and Tm < Tao, it indicates that the ambient temperature is too high, which is an abnormal situation (unconventional state). At this time, the heat pump unit and the main control board 102 are shut down, and all components in the current main control board heat dissipation system are checked to avoid component damage that could lead to inaccurate temperature data and thus reduce heat dissipation efficiency.

[0169] The temperature control method for the main control board provided in this embodiment obtains the operating temperature of the main control board 102 through a first temperature sensor; when the operating temperature exceeds a preset temperature threshold and the first over-temperature duration exceeds a first preset duration, the water valve 204 is controlled to adjust to its initial opening; the operating temperature is then obtained again, and the ambient temperature of the main control board 102 is obtained through a third temperature sensor; based on the new operating temperature, the preset temperature threshold, and the ambient temperature, a control strategy for the water valve 204 is determined, and the opening of the water valve 204 is adjusted according to the control strategy. This method drives water circulation through a water pump and regulates the flow rate using the water valve 204, achieving a dynamic balance between efficient heat dissipation and condensation risk control of the main control board 102, significantly improving the heat dissipation efficiency of the main control board and extending the life of electrical components; at the same time, it avoids surface condensation while reducing the temperature, eliminating the risk of short circuit or corrosion of the main control board 102.

[0170] Figure 5 This is a schematic diagram of the temperature control device for the main control board provided in this application. Figure 5 As shown, this application provides a temperature control device for a main control substrate. The temperature control device 500 for the main control substrate includes:

[0171] The acquisition module 501 is used to acquire the operating temperature of the main control board through the first temperature sensor.

[0172] The processing module 502 is used to control the water valve to adjust to the initial opening degree when the operating temperature exceeds the preset temperature threshold and the first over-temperature duration exceeds the first preset duration. The first over-temperature duration is used to indicate the continuous duration for which the operating temperature of the main control board exceeds the preset temperature threshold.

[0173] The acquisition module 501 is also used to reacquire the operating temperature and acquire the ambient temperature of the main control board through the third temperature sensor.

[0174] The processing module 502 is also used to determine the control strategy of the water valve based on the new operating temperature, the preset temperature threshold and the ambient temperature, and adjust the opening degree of the water valve according to the control strategy.

[0175] In one possible implementation, the processing module 502 is further configured to determine a first control strategy when the new operating temperature is less than a preset temperature threshold but greater than the ambient temperature. The first control strategy is used to indicate the degree of opening of the water valve.

[0176] The processing module 502 is also used to determine the control strategy as a second control strategy when the new operating temperature is not less than the preset temperature threshold and is greater than the ambient temperature. The second control strategy is used to indicate an increase in the opening degree of the water valve.

[0177] The processing module 502 is further configured to determine the second over-temperature duration of the new operating temperature when the new operating temperature is less than the preset temperature threshold and not greater than the ambient temperature, and to determine the control strategy of the water valve based on the second over-temperature duration. The second over-temperature duration is used to represent the continuous duration of the new operating temperature being not less than the preset temperature threshold and not greater than the ambient temperature.

[0178] In one possible implementation, the processing module 502 is further configured to determine a third control strategy if the second overheat duration does not exceed a second preset duration. The third control strategy is used to instruct the opening degree of the water valve to be reduced according to a preset step size.

[0179] The processing module 502 is further configured to determine the control strategy as a fourth control strategy when the second over-temperature duration exceeds the second preset duration. The fourth control strategy is used to instruct the main control board to stop operating.

[0180] Figure 6 A schematic diagram of the structure of the electronic device provided in this application. Figure 6 As shown, this application provides an electronic device 600, which includes: a receiver 601, a transmitter 602, a processor 603, and a memory 604.

[0181] Receiver 601 is used to receive instructions and data;

[0182] Transmitter 602 is used to send commands and data;

[0183] Memory 604 is used to store instructions executed by the computer;

[0184] The processor 603 is used to execute computer execution instructions stored in the memory 604 to implement the various steps of the temperature control method of the main control substrate in the above embodiments. For details, please refer to the relevant descriptions in the foregoing embodiments of the temperature control method of the main control substrate.

[0185] Optionally, the memory 604 can be either standalone or integrated with the processor 603.

[0186] When the memory 604 is set up independently, the electronic device also includes a bus for connecting the memory 604 and the processor 603.

[0187] This application also provides a computer-readable storage medium storing computer-executable instructions, which, when executed by a processor, implement a temperature control method for the main control board as described in the above-described electronic device.

[0188] This application also provides a computer program product, including a computer program that, when executed by a processor, implements the temperature control method of the main control substrate in any of the foregoing embodiments.

[0189] It will be understood by those skilled in the art that all or some of the steps, systems, or apparatuses disclosed above, and their functional modules / units, can be implemented as software, firmware, hardware, or suitable combinations thereof. In hardware implementations, the division between functional modules / units mentioned in the above description does not necessarily correspond to the division of physical components; for example, a physical component may have multiple functions, or a function or step may be performed collaboratively by several physical components. Some or all physical components may be implemented as software executed by a processor, such as a central processing unit, digital signal processor, or microprocessor, or as hardware, or as an integrated circuit, such as an application-specific integrated circuit (ASIC). Such software may be distributed on a computer-readable medium, which may include computer storage media (or non-transitory media) and communication media (or transient media). As is known to those skilled in the art, the term computer storage media includes volatile and non-volatile, removable and non-removable media implemented in any method or technology for storing information (such as computer-readable instructions, data structures, program modules, or other data). Computer storage media include, but are not limited to, RAM, ROM, EEPROM, flash memory or other memory technologies, CD-ROM, digital versatile disc (DVD) or other optical disc storage, magnetic cartridges, magnetic tape, disk storage or other magnetic storage devices, or any other medium that can be used to store desired information and can be accessed by a computer. Furthermore, it is well known to those skilled in the art that communication media typically contain computer-readable instructions, data structures, program modules, or other data in modulated data signals such as carrier waves or other transmission mechanisms, and may include any information delivery medium.

[0190] The technical solutions of this application have been described above with reference to the preferred embodiments shown in the accompanying drawings. However, it is readily understood by those skilled in the art that the scope of protection of this application is obviously not limited to these specific embodiments. The above embodiments are only used to illustrate the technical solutions of this application and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. These modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A heat dissipation system for a main control board, characterized in that, The main control board heat dissipation system includes: a heat pump unit, a heat dissipation unit, and a main control board; The heat dissipation unit includes heat dissipation pipes; the main control board is positioned close to the heat dissipation pipes. The heat pump unit includes a water circulation loop; the first inlet and the first outlet of the heat dissipation pipe are respectively connected to the main pipe section of the water circulation loop. The circulating water in the water circulation loop enters the heat dissipation pipe through the first inlet, exchanges heat with the heat generated by the main control board, and flows back to the water circulation loop from the first outlet.

2. The heat dissipation system for the main control board according to claim 1, characterized in that, The water circulation loop includes: a second water inlet, a first water pump, a first heat exchanger, and a second water outlet; the heat dissipation unit also includes: a water valve; The water circulation loop is configured sequentially along the water flow direction as the second inlet, the first water pump, the first heat exchanger, and the second outlet; the second outlet is connected to the second inlet via a return pipe section. The water valve is connected in series to the heat dissipation pipe and is located in the pipe section near the first water inlet. The first water pump is used to provide power for the flow of circulating water; the water valve is used to regulate the water flow rate of the heat dissipation pipe.

3. The heat dissipation system for the main control board according to claim 2, characterized in that, The heat dissipation unit also includes: a second water pump; The second water pump is connected in series to the heat dissipation pipe and is located between the water valve and the first water inlet; The second water pump is used to increase the flow rate of the circulating water in the heat dissipation pipe.

4. The heat dissipation system for the main control board according to claim 2 or 3, characterized in that, The first water outlet is located between the water outlet side of the first heat exchanger and the second water outlet; The circulating water in the water circulation loop enters the heat dissipation pipe through the first inlet, flows through the water valve, exchanges heat with the heat generated by the main control board, and flows back from the first outlet of the heat dissipation pipe to the second outlet of the water circulation loop.

5. The heat dissipation system for the main control board according to claim 2 or 3, characterized in that, The first outlet is located on the main pipeline section between the first water pump and the second inlet; The circulating water in the water circulation loop enters the heat dissipation pipe through the first inlet, flows through the water valve, exchanges heat with the heat generated by the main control board, and flows back from the first outlet of the heat dissipation pipe to the second inlet of the water circulation loop.

6. The heat dissipation system for the main control board according to claim 1, characterized in that, The heat dissipation unit further includes: a heat-conducting component; The heat-conducting component is disposed between the heat dissipation pipe and the main control substrate; The thermal conductive component is used to enhance the heat exchange efficiency between the heat dissipation pipeline and the main control substrate.

7. The heat dissipation system for the main control board according to claim 2 or 3, characterized in that, The heat dissipation unit further includes: a first temperature sensor, a second temperature sensor, and a third temperature sensor; The first temperature sensor is attached to the surface of the main control board; the second temperature sensor is attached to the outer wall of the main pipeline section between the first water pump and the first water inlet; the third temperature sensor is located in the external environment area of ​​the main control board's heat dissipation system. The first temperature sensor, the second temperature sensor, and the third temperature sensor are respectively communicatively connected to the main control board. The first temperature sensor is used to collect the operating temperature of the main control board; the second temperature sensor is used to collect the inlet water temperature of the heat dissipation pipe; and the third temperature sensor is used to collect the ambient temperature of the external environment where the heat dissipation system of the main control board is located.

8. A method for temperature control of a main control board, characterized in that, Applied to the heat dissipation system of the main control board as described in claims 1-7, the method includes: The operating temperature of the main control board is obtained through the first temperature sensor; When the operating temperature exceeds a preset temperature threshold and the first over-temperature duration exceeds a first preset duration, the water valve is adjusted to the initial opening. The first over-temperature duration is used to indicate the length of time that the operating temperature of the main control board exceeds the preset temperature threshold. The operating temperature is re-acquired, and the ambient temperature of the main control board is obtained through a third temperature sensor. Based on the new operating temperature, preset temperature threshold, and ambient temperature, a control strategy for the water valve is determined, and the opening degree of the water valve is adjusted according to the control strategy.

9. The method according to claim 8, characterized in that, The process of determining the control strategy for the water valve based on the new operating temperature, preset temperature threshold, and ambient temperature includes: When the new operating temperature is less than a preset temperature threshold but greater than the ambient temperature, the control strategy is determined to be the first control strategy, which is used to indicate the degree of opening of the water valve. If the new operating temperature is not less than a preset temperature threshold and is greater than the ambient temperature, the control strategy is determined to be the second control strategy, which is used to indicate increasing the opening of the water valve. When the new operating temperature is less than a preset temperature threshold and not greater than the ambient temperature, a second over-temperature duration is determined for the new operating temperature, and a control strategy for the water valve is determined based on the second over-temperature duration. The second over-temperature duration represents the continuous duration for which the new operating temperature is not less than the preset temperature threshold and not greater than the ambient temperature.

10. The method according to claim 9, characterized in that, The step of determining the control strategy for the water valve based on the second over-temperature duration includes: If the second overheating time does not exceed the second preset time, the control strategy is determined to be the third control strategy, which is used to instruct the opening of the water valve to be reduced according to a preset step size; If the second over-temperature duration exceeds the second preset duration, the control strategy is determined to be the fourth control strategy, which is used to instruct the main control board to stop operating.

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