Substrate resistance heating device and pulse laser deposition system

Abstract

The invention discloses a substrate resistance heating device and a pulse laser deposition system, the substrate resistance heating device comprises a base, the base is provided with a mounting position with an opening in the front side, the left side and the right side of the mounting position are respectively provided with a conductive part, and the conductive parts are connected with copper wires; the resistance heating structure comprises a mounting part and a substrate, the mounting part is inserted into the mounting position, the mounting part can move front and back and can be taken out from the front side of the mounting position, the substrate is arranged on the mounting part and is made of a conductive material, and when the mounting part is inserted into the mounting position, a conductive path is formed between the substrate and the conductive parts on the left side and the right side. The device is simple in structure, low in cost, low in energy loss, high in heating speed and convenient to install and operate.

Description

Technical Field

[0001] This invention relates to the field of coating equipment technology, and in particular to a substrate resistance heating device and a pulsed laser deposition system. Background Technology

[0002] Pulsed laser coating systems, as a novel type of coating equipment, have a wide range of applications. They can be used to prepare thin films of various materials such as metals, semiconductors, oxides, nitrides, carbides, borides, silicides, sulfides, and fluorides. The laser emitted from the laser enters the coating cavity through the laser window in the pulsed laser coating system, bombarding the target material. This causes the target material to evaporate or even ionize, moving towards the substrate to form a thin film. In the pulsed laser coating process, the substrate stage typically needs to heat the substrate to a very high temperature (e.g., 700°C). Common substrate heating methods mainly utilize heaters, including radiation heating and contact conduction heating. These heating methods all require heaters, involve heat transfer, result in heat loss, have high costs, complex structures, and require highly skilled assembly personnel. Summary of the Invention

[0003] This invention aims to solve at least one of the technical problems existing in the prior art. To this end, this invention proposes a substrate resistance heating device that has low energy loss, fast heating speed, low cost, and is convenient to use and install.

[0004] The present invention also proposes a pulsed laser deposition system having the above-mentioned substrate resistance heating device.

[0005] According to a first aspect of the present invention, a substrate resistance heating apparatus includes: The base has a mounting position with a front opening, and conductive parts are respectively provided on the left and right sides of the mounting position, and copper wires are connected to the conductive parts. A resistance heating structure includes a mounting part and a substrate. The mounting part is inserted into the mounting position and can move back and forth and can be removed from the front side of the mounting position. The substrate is disposed on the mounting part and is made of conductive material. When the mounting part is inserted into the mounting position, a conductive path is formed between the substrate and the conductive parts on the left and right sides.

[0006] The substrate resistance heating device according to embodiments of the present invention has at least the following beneficial effects: In this embodiment, since the substrate is made of conductive material, the mounting part only needs to be inserted into the mounting position on the base to form a conductive path between the substrate and the two conductive parts on the left and right sides of the base. Then, the power supply is connected through a copper wire, and the substrate can be directly heated by resistance using current to generate high temperature. Compared with the traditional method of heating the substrate by a heater, this embodiment has a simple structure, low cost, less energy loss, and fast heating speed. In addition, the resistance heating structure is installed on the base in a plug-in manner through the mounting part, which is convenient to use and install.

[0007] According to some embodiments of the present invention, the base is provided with two female electrode heads, and the conductive parts on the left and right sides are respectively connected to the two female electrode heads through the copper wires.

[0008] According to some embodiments of the present invention, the conductive part is provided with an elastic part, the elastic part is elastic, and the elastic part abuts against the mounting part downward to restrict the forward and backward movement of the mounting part.

[0009] According to some embodiments of the present invention, the elastic portion includes a first segment and a second segment, the first segment extending backward and downward at an angle, and the second segment connected to the rear end of the first segment and extending backward and upward at an angle.

[0010] According to some embodiments of the present invention, the mounting portion is provided with clamping assemblies on the left and right sides of the substrate, the clamping assemblies include a lower clamping plate and an upper clamping plate, the lower clamping plate is horizontally arranged, and the upper clamping plate is detachably arranged on the upper side of the lower clamping plate and can cooperate with the lower clamping plate to clamp and fix the substrate.

[0011] According to some embodiments of the present invention, the mounting part is provided with a base plate, and a set of mounting posts are respectively provided on the left and right sides of the upper surface of the base plate. Each set of mounting posts includes at least two mounting posts arranged at intervals. The upper clamping plate and the lower clamping plate are provided with through holes adapted to the mounting posts, and the mounting posts in the same set are sleeved through the through holes. The mounting posts are fitted with a first insulating sleeve on the lower side of the lower clamping plate and are threaded with a locking nut on the upper side of the upper clamping plate.

[0012] According to some embodiments of the present invention, both the upper clamping plate and the lower clamping plate are made of conductive material, the conductive part is provided with an elastic part, the elastic part is elastic, and the elastic part abuts against the upper surface of the lower clamping plate.

[0013] According to some embodiments of the present invention, the left and right sides of the mounting position are respectively provided with limiting grooves, the limiting grooves extend front and back and have an open front end, the rear side of the mounting position is provided with a limiting protrusion, the left and right ends of the mounting part are respectively embedded in the limiting grooves on the left and right sides, and the rear end of the mounting part abuts against the limiting protrusion.

[0014] According to some embodiments of the present invention, the front end of the limiting groove is provided with a chamfer.

[0015] According to a second aspect of the present invention, a pulsed laser deposition system includes the substrate resistance heating device described above.

[0016] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0017] The present invention will be further described below with reference to the accompanying drawings and embodiments, wherein: Figure 1 This is an axial view of the substrate resistance heating device according to an embodiment of the present invention; Figure 2 This is a top view of the substrate resistance heating device according to an embodiment of the present invention; Figure 3 This is a front view of the substrate resistance heating device according to an embodiment of the present invention; Figure 4 This is an exploded view of the substrate resistance heating device according to an embodiment of the present invention; Figure 5 This is an exploded view of the resistance heating structure according to an embodiment of the present invention; Figure 6 This is an exploded view of the connection structure between the conductive part and the base in an embodiment of the present invention.

[0018] Icon labels: Base 100, mounting position 101, limiting groove 102, limiting protrusion 103, electrode female head 110, electrode connecting seat 120, insulating gasket 130, upper pressure plate 140, lower pressure plate 150; Conductive part 200, elastic part 201, conductive body 202, copper wire 210; The resistance heating structure 300, mounting part 310, base plate 311, mounting column 312, first insulating sleeve 313, locking nut 314, second insulating sleeve 315, handle 316, base plate 320, lower clamping plate 330, and upper clamping plate 340. Detailed Implementation

[0019] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0020] In the description of this invention, it should be understood that the orientation descriptions, such as up, down, etc., are based on the orientation or positional relationship shown in the drawings and are only for the convenience of describing this invention and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this invention.

[0021] In the description of this invention, "multiple" refers to two or more. The use of "first" and "second" is for distinguishing technical features only and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features or their sequential relationship.

[0022] In the description of this invention, unless otherwise explicitly defined, terms such as "set up," "install," and "connect" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this invention in conjunction with the specific content of the technical solution.

[0023] In pulsed laser coating processes, the substrate stage typically needs to heat the substrate 320 to a very high temperature (e.g., 700℃). Common methods for heating the substrate 320 mainly involve using heaters, including radiation heating and contact conduction heating. These heating methods all require heaters, and since they are all heat transfer methods, there is heat loss, high cost, and complex structure, which requires high technical skills from assembly personnel.

[0024] In response to this problem, the present invention proposes a substrate resistance heating device and a pulsed laser deposition system, which can effectively solve the above-mentioned problems.

[0025] The following reference Figures 1 to 6 A substrate resistance heating apparatus and a pulsed laser deposition system according to embodiments of the present invention are described.

[0026] A substrate resistance heating device according to one embodiment of the present invention includes: a base 100 and a resistance heating structure 300.

[0027] The base 100 has a mounting position 101 with a front opening. Conductive portions 200 are provided on both the left and right sides of the mounting position 101. In this embodiment, one conductive portion 200 is provided on each of the left and right sides. Each conductive portion 200 is connected to a copper wire 210. Clearly, the conductive portions 200 are made of conductive material, and they can be connected to a power source via the copper wire 210. It is conceivable that the conductive portions 200 could be made of tantalum, which not only has excellent conductivity but also withstands high temperatures. The resistance heating structure 300 includes a mounting part 310 and a substrate 320. The mounting part 310 is inserted into the mounting position 101 and can move back and forth and be removed from the front side of the mounting position 101. That is, the mounting part 310 is detachably mounted in the mounting position 101 for easy assembly and disassembly. The substrate 320 is disposed on the mounting part 310 and is made of conductive material. When the mounting part 310 is inserted into the mounting position 101, the substrate 320 interacts with the left and right sides. A conductive path for current to pass through is formed between the conductive parts 200. In this embodiment, the mounting part 310 is provided with a conductive structure, which contacts the substrate 320 and the conductive parts 200. Obviously, when the mounting part 310 is inserted into the mounting position 101, the conductive parts 200 are connected to the power supply through the copper wire 210, so that the substrate 320 can be energized to use the current to resistively heat the substrate 320 and generate high temperature. The substrate 320 can be made of metal.

[0028] The substrate resistance heating device with the above-described structure, since the substrate 320 is made of conductive material, only requires inserting the mounting part 310 into the mounting position 101 on the base 100 to form a conductive path between the substrate 320 and the two conductive parts 200 on the left and right sides of the base 100. Then, by connecting the power supply through the copper wire 210, the current can be used to directly heat the substrate 320 resistance, causing the substrate 320 to generate a high temperature. Compared with the traditional method of heating the substrate 320 through a heater, this embodiment has a simple structure, low cost, low energy loss, and fast heating speed. In addition, the resistance heating structure 300 is installed on the base 100 in a plug-in manner through the mounting part 310, making it convenient to use and install.

[0029] Reference Figure 1 , Figure 3 and Figure 6 As shown, in some embodiments of the present invention, the base 100 is provided with an electrode connector 120 at its bottom, and the electrode connector 120 is provided with two female electrode connectors 110. The conductive part 200 on the left is connected to one of the female electrode connectors 110 through a copper wire 210, and the conductive part 200 on the right is connected to the other female electrode connector 110 through a copper wire 210, so as to form a conductive path between the female electrode connector 110 and the conductive part 200. It can be understood that in the pulsed laser deposition system, a substrate stage is provided for carrying the substrate 320. In this embodiment, the female electrode connector 110 is provided on the base 100, so a male electrode connector adapted to the female electrode connector 110 can be provided on the substrate stage. The male electrode connector is connected to the power supply, so that the substrate resistance heating device of this embodiment can be designed as a pluggable device for quick installation.

[0030] Reference Figure 1 , Figure 3 and Figure 6As shown, in some embodiments of the present invention, the conductive part 200 is provided with an elastic part 201. The elastic part 201 is elastic and abuts against the mounting part 310 downward to press the mounting part 310 against the base 100. This uses friction to limit the forward and backward movement of the mounting part 310, thereby positioning the mounting part 310 and preventing the mounting part 310 from moving freely and causing the conductive path between the substrate 320 and the conductive part 200 to be broken. Obviously, using the elastic part 201 to elastically abut against the mounting part 310 to limit the mounting part 310 is more convenient for assembling and disassembling the mounting part 310 than using fasteners to fix the mounting part 310 to the base 100.

[0031] Reference Figure 3 , Figure 4 and Figure 6 As shown, in some embodiments of the present invention, the elastic part 201 includes a first segment and a second segment. The first segment extends backward and downward at an angle, and the second segment is connected to the rear end of the first segment and extends backward and upward at an angle. That is, a V-shaped structure with the opening facing upward is formed between the first segment and the second segment. The first segment and the second segment are both sheet-like structures. The bottom end of the V-shaped structure abuts against the mounting part 310 with the bottom facing downward. Obviously, setting the elastic part 201 as a V-shaped structure can ensure that the elastic part 201 has a certain elasticity, and at the same time, it can also avoid the elastic part 201 from deforming arbitrarily due to excessive stiffness. In some specific embodiments, the conductive part 200 is further provided with a conductive body 202, which is detachably disposed on the base 100. One end of the elastic part 201 is connected to the conductive body 202, and the elastic part 201 and the conductive body 202 are configured as an integral structure. The copper wire 210 is connected to the conductive body 202. Insulating pads 130 are respectively provided on the upper and lower sides of the conductive body 202. An upper pressure plate 140 is provided on the upper side of the upper insulating pad 130, and a lower pressure plate 150 is provided on the lower side of the lower insulating pad 130. The upper pressure plate 140, the insulating pad 130, the conductive body 202, and the lower pressure plate 150 are locked and fixed to the base 100 by vertically arranged screws to realize the detachable installation of the conductive body 202. It is conceivable that the insulating pad 130 can be made of ceramic material.

[0032] Reference Figure 1 , Figure 3 and Figure 5As shown, in some embodiments of the present invention, the mounting part 310 is provided with clamping components on the left and right sides of the substrate 320 respectively. The clamping components include a lower clamping plate 330 and an upper clamping plate 340. The lower clamping plate 330 is horizontally arranged, and the upper clamping plate 340 is detachably arranged on the upper side of the lower clamping plate 330 and can cooperate with the lower clamping plate 330 to clamp and fix the substrate 320. In this way, the substrate 320 can be detachably installed, which facilitates the replacement of the substrate 320. When it is necessary to replace the substrate 320, it is only necessary to remove the upper clamping plate 340. In some specific embodiments, the mounting part 310 is provided with a base plate 311, which is inserted into the mounting position 101. A set of mounting posts 312 is provided on the left and right sides of the upper surface of the base plate 311. Each set of mounting posts 312 includes at least two posts arranged at intervals. The upper clamping plate 340 and the lower clamping plate 330 are both provided with through holes adapted to the mounting posts 312. The upper clamping plate 340 is fitted onto the mounting posts 312 in the same group through its through holes, and the lower clamping plate 330 is also fitted onto the mounting posts 312 in the same group through its through holes. A first insulating sleeve 313 is fitted onto the mounting post 312. The first insulating sleeve 313 is located below the lower clamping plate 330 to support the lower clamping plate 330 and form insulation between the lower clamping plate 330 and the base plate 311. A locking nut is threaded onto the upper side of the upper clamping plate 340 of the mounting post 312. 314. The upper clamping plate 340 is locked by the locking nut 314, so that the upper clamping plate 340 cooperates with the lower clamping plate 330 to clamp the substrate 320, thus realizing the detachable installation of the substrate 320. The structure is simple and easy to disassemble and assemble. Obviously, in order to avoid the lower clamping plate 330 and the upper clamping plate 340 from contacting the mounting post 312, the first insulating sleeve 313 can be set in a stepped shape and partially extend into the through hole of the lower clamping plate 330 and the upper clamping plate 340. Furthermore, a second insulating sleeve 315 is also sleeved on the mounting post 312, and the second insulating sleeve 315 is located between the locking nut 314 and the upper clamping plate 340. It is conceivable that the first insulating sleeve 313 and the second insulating sleeve 315 can be made of ceramic material. In addition, the base plate 311 and the mounting post 312 are an integral structure and can be made of titanium alloy, which can withstand high temperature.

[0033] Reference Figure 1 , Figure 3 and Figure 5As shown, in some embodiments of the present invention, both the upper clamping plate 340 and the lower clamping plate 330 are made of conductive material, specifically tantalum, which not only has excellent conductivity but also can withstand high temperatures. The conductive part 200 is provided with an elastic part 201, which is elastic and abuts against the upper surface of the lower clamping plate 330. Thus, by abutting against the lower clamping plate 330, the elastic part 201 forms a conductive path for current to pass through between the conductive part 200 and the substrate 320. In this embodiment, the lower clamping plate 330 is the conductive structure described above. Furthermore, the elastic part 201 and the upper clamping plate 340 are staggered in the left-right direction to avoid interference between the upper clamping plate 340 and the elastic part 201 when the upper clamping plate 340 is disassembled. It is understood that the lower clamping plate 330 is horizontally positioned, meaning its upper surface is horizontal, and the elastic part 201 abuts against the upper surface of the lower clamping plate 330. Thus, when the resistance heating structure 300 is assembled onto or removed from the base 100, the elastic part 201 and the lower clamping plate 330 form a relative displacement on the upper surface of the lower clamping plate 330, resulting in low resistance during assembly and disassembly. In some embodiments, the elastic part 201 includes a first segment and a second segment, forming an upward-opening V-shaped structure between the first and second segments. The bottom end of this V-shaped structure abuts against the upper surface of the lower clamping plate 330. The V-shaped structure design allows for smoother insertion of the mounting part 310 into the mounting position 101. During the movement of the mounting part 310, the lower clamping plate 330 can automatically push the elastic part 201 upwards, making operation convenient and quick.

[0034] Reference Figure 1 , Figure 4 and Figure 6 As shown, in some embodiments of the present invention, the base 100 is provided with a recess to form a mounting position 101. Limiting grooves 102 are provided on the left and right sides of the mounting position 101, extending forward and backward with an open front end. A limiting protrusion 103 is provided on the rear side of the mounting position 101. The left and right ends of the mounting part 310 are respectively embedded in the left and right limiting grooves 102, and the rear end of the mounting part 310 abuts against the limiting protrusion 103. This achieves the mounting and positioning of the mounting part 310, resulting in a simple and practical structure. Specifically, in this embodiment, the left and right ends of the base plate 311 of the mounting part 310 are respectively embedded in the left and right limiting grooves 102. The front end of the base plate 311 is provided with a handle 316 for the operator to hold, extending to the outside of the mounting position 101. Furthermore, the front end of the limiting groove 102 is chamfered to facilitate the insertion of the base plate 311 into the limiting groove 102 during assembly, saving operation time.

[0035] This invention also proposes a pulsed laser deposition system, including the aforementioned substrate resistance heating device. Furthermore, the pulsed laser deposition system also includes a substrate stage with a male electrode connector on it. The male electrode connector is adapted to the female electrode connector 110 of the substrate resistance heating device, and the male electrode connector is connected to a power supply. Since the pulsed laser deposition system of this embodiment includes the aforementioned substrate resistance heating device, it possesses at least all the beneficial effects of the substrate resistance heating device, which will not be elaborated upon here.

[0036] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. In addition, those skilled in the art can combine and integrate the different embodiments or examples described in this specification.

[0037] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present invention.

Claims

1. A substrate resistance heating device, characterized in that, include: The base has a mounting position with a front opening, and conductive parts are respectively provided on the left and right sides of the mounting position, and copper wires are connected to the conductive parts. A resistance heating structure includes a mounting part and a substrate. The mounting part is inserted into the mounting position and can move back and forth and can be removed from the front side of the mounting position. The substrate is disposed on the mounting part and is made of conductive material. When the mounting part is inserted into the mounting position, a conductive path is formed between the substrate and the conductive parts on the left and right sides.

2. The substrate resistance heating device according to claim 1, characterized in that: The base is provided with two female electrode connectors, and the conductive parts on the left and right sides are respectively connected to the two female electrode connectors through the copper wires.

3. The substrate resistance heating device according to claim 1, characterized in that: The conductive part is provided with an elastic part, which is elastic and abuts against the mounting part downward to restrict the forward and backward movement of the mounting part.

4. The substrate resistance heating device according to claim 3, characterized in that: The elastic portion includes a first segment and a second segment, the first segment extending backward and downward at an angle, and the second segment connected to the rear end of the first segment and extending backward and upward at an angle.

5. The substrate resistance heating device according to claim 1, characterized in that: The mounting part is provided with clamping components on the left and right sides of the substrate respectively. The clamping components include a lower clamping plate and an upper clamping plate. The lower clamping plate is horizontally arranged, and the upper clamping plate is detachably arranged on the upper side of the lower clamping plate and can cooperate with the lower clamping plate to clamp and fix the substrate.

6. The substrate resistance heating device according to claim 5, characterized in that: The mounting part is provided with a base plate, and a set of mounting posts is provided on the left and right sides of the upper surface of the base plate. Each set of mounting posts includes at least two mounting posts arranged at intervals. The upper clamping plate and the lower clamping plate are provided with through holes adapted to the mounting posts, and the mounting posts in the same set are sleeved through the through holes. The mounting posts are fitted with a first insulating sleeve on the lower clamping plate and a locking nut is threaded to the upper side of the upper clamping plate.

7. The substrate resistance heating device according to claim 5, characterized in that: Both the upper clamping plate and the lower clamping plate are made of conductive material. The conductive part is provided with an elastic part, which is elastic and abuts against the upper surface of the lower clamping plate.

8. The substrate resistance heating device according to claim 1, characterized in that: The mounting position is provided with limiting grooves on the left and right sides respectively. The limiting grooves extend forward and backward and have an open front end. The mounting position is provided with a limiting protrusion on the rear side. The left and right ends of the mounting part are respectively embedded in the limiting grooves on the left and right sides, and the rear end of the mounting part abuts against the limiting protrusion.

9. The substrate resistance heating device according to claim 8, characterized in that: The front end of the limiting groove is chamfered.

10. A pulsed laser deposition system, characterized in that, Includes the substrate resistance heating device according to any one of claims 1 to 9.

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