Heat exchange test device, preparation method thereof, measurement method and system

Abstract

The invention relates to the technical field of enhanced heat transfer, and provides a heat exchange test device and a preparation method thereof, a measurement method and system and a heat exchange piece, the heat exchange test device is provided with at least one heat exchange hole, and the heat exchange hole is used for containing a heat pipe; the pipe hole gap is positioned between the heat pipe and the heat exchange hole; and the gaps of the pipe holes are filled with the heat exchange metal layers, and the thickness of the heat exchange metal layers is 1-1000 microns. According to the heat exchange test device provided by the invention, the heat exchange metal layer made of the metal material is filled in the tube hole gap, so that the micro-scale tube hole gap is effectively filled, the contact thermal resistance of the gap is remarkably reduced, the heat transfer efficiency in a high-temperature environment is improved, and the heat exchange test requirement in a high-temperature scene can be met.

Description

Technical Field

[0001] This application relates to the field of enhanced heat transfer technology, and in particular to a heat exchange test device and its preparation method, measurement method and system. Background Technology

[0002] As modern industrial technology rapidly advances towards higher precision, higher power, and adaptability to extreme environments, efficient heat transfer technology has become a core bottleneck restricting technological breakthroughs in several key fields. In the aerospace field, spacecraft face extreme high-temperature environments upon atmospheric reentry, requiring reliable thermal control systems to ensure structural safety. In the energy and power sector, equipment such as heat pipe stacks and advanced engines require high heat flux density heat transfer during operation, and the ability to quickly and effectively transfer heat from core components directly affects system efficiency and lifespan. In the field of electronic devices, heat dissipation problems for highly integrated chips, high-power lasers, and other equipment are becoming increasingly prominent, as excessively high temperatures can severely impact device performance and stability.

[0003] Microscale structures, due to their unique geometric properties, exhibit great potential in enhancing heat transfer, becoming a key technological direction for solving the aforementioned thermal control problems in high heat flux densities and extreme environments. Microscale pore structures typically refer to channels or pore structures with dimensions ranging from micrometers to millimeters, and their heat transfer mechanisms differ significantly from those at conventional scales. In high-temperature environments, microscale effects (including surface effects, viscous dissipation, enhanced thermal radiation, and the influence of molecular free path) have a particularly prominent impact on heat transfer performance, making traditional heat transfer theories and methods based on macroscales difficult to apply directly.

[0004] Under non-vacuum conditions, the gaps between micro-scale tubes are typically filled with air. When heat flows through, significant temperature jumps easily occur at the gap interface. This phenomenon severely hinders heat transfer, creating gap contact thermal resistance. The presence of contact thermal resistance greatly reduces heat transfer efficiency, causing heat to accumulate locally, which in turn affects the normal operation of the equipment and may even lead to safety hazards. Summary of the Invention

[0005] To address the aforementioned problems in the prior art, this application provides a heat exchange testing device, its preparation method, measurement method, and system. The technical problem to be solved by this application is achieved through the following technical solution: The first aspect of this application provides a heat exchange testing apparatus, comprising: A heat exchange element having at least one heat exchange hole for accommodating a heat pipe; The tube hole gap is located between the heat pipe and the heat exchange hole; A heat exchange metal layer is filled in the gap between the tube holes, and the thickness of the heat exchange metal layer is 1~1000μm.

[0006] In one feasible approach, the heat exchange metal layer comprises nickel and / or titanium.

[0007] The second aspect of this application provides a method for preparing a heat exchange test device, which is used to prepare the heat exchange test device provided in the first aspect of this application, comprising the following steps: Insert the heat pipe into the heat exchange hole of the heat exchanger; Metal particles are filled into the gap between the heat pipe and the heat exchange hole to obtain a heat exchange metal layer.

[0008] In one feasible approach, the step of filling the gap between the heat pipe and the heat exchange orifice with metal particles to obtain a heat exchange metal layer includes: A first filling layer is obtained by filling the gap between the heat pipe and the heat exchange hole with first metal particles at least once and drying it; the first metal particles are nickel and / or titanium; the particle size of the first metal particles is 5~200nm. Under a first vacuum condition, the first filler layer is subjected to a first heat treatment to obtain a first cured layer; The first cured layer is subjected to vacuum treatment, and the first cured layer is filled with second metal particles at least once to obtain a second filled layer; the second metal particles are nickel and / or titanium; the particle size of the second metal particles is 5~200nm; Under a second vacuum condition, the second filling layer is subjected to a second heat treatment to obtain a heat exchange metal layer.

[0009] The second aspect of this application provides a measurement method for measuring the heat exchange interface temperature characteristics of the heat exchange test device provided in the first aspect of this application, comprising the following steps: Place the heat exchange test device in an insulated environment; Heat the heating element to the preset temperature; Measure the temperature in the wall of the heat pipe and the temperature in the heat exchanger wall of the heat exchanger; The temperature characteristics of the heat exchange interface of the heat exchange test device are determined based on the temperature in the heat pipe wall, the temperature in the heat exchanger wall, and the structural parameters of the heat exchange test device.

[0010] In one feasible manner, the steps of measuring the temperature in the wall of the heat pipe and the temperature in the heat exchanger wall of the heat exchanger include: A first and a second temperature measuring point are set in the wall of the heat pipe, and a third and a fourth temperature measuring point are set in the heat exchange wall of the heat exchange element; the first, second, third and fourth temperature measuring points are located in the same radial section. Measure the temperature at the first, second, third, and fourth temperature measurement points.

[0011] In one feasible approach, the steps for determining the heat exchange interface temperature characteristics of the heat exchange test apparatus, based on the temperature in the heat pipe wall, the temperature in the heat exchanger wall, and the structural parameters of the heat exchange test apparatus, include: Based on the radius of the first temperature measuring point Temperature at the first temperature measurement point The radius of the second temperature measuring point The temperature at the second temperature measuring point outer radius of heat pipe Determine the outer wall temperature of the heat pipe The outer wall temperature of the heat pipe ; Based on the radius of the third temperature measuring point The temperature at the third temperature measurement point The radius of the fourth temperature measuring point Temperature at the fourth temperature measurement point Radius of heat exchange holes Determine the inner wall temperature of the heat exchanger. ; Inner wall temperature of heat exchanger ; Based on the outer wall temperature of the heat pipe and the inner wall temperature of the heat exchanger Determine the temperature characteristics of the heat exchange interface.

[0012] In one feasible approach, the heat exchange interface temperature characteristics include: The average interface temperature and average interface temperature difference of the heat exchange metal layers; among which, The average interface temperature is the temperature of the outer wall of the heat pipe. and the inner wall temperature of the heat exchanger The average value; The average temperature difference at the interface is the temperature of the outer wall of the heat pipe. and the inner wall temperature of the heat exchanger The difference.

[0013] In one feasible approach, the preset temperature is 800~1200℃.

[0014] A fourth aspect of this application provides a measurement system, comprising: The heat exchange test apparatus provided in the first aspect of this application; Insulation device, used to house heat exchange test equipment and provide an insulation environment; Heating element, used to heat the heat pipe; Temperature measurement components are used to measure the temperature in the wall of the heat pipe and the temperature in the heat exchanger wall of the heat exchanger. The temperature characteristic calculation module is used to determine the temperature characteristics of the heat exchange interface of the heat exchange test device based on the temperature in the pipe wall of the heat pipe, the temperature in the heat exchange wall of the heat exchange component, and the structural parameters of the heat exchange test device.

[0015] Compared with the prior art, the beneficial effects of this application are as follows: The heat exchange test device provided in this application effectively fills the microscale gaps in the tube holes by filling the gaps with a metal heat exchange metal layer, which significantly reduces the gap contact thermal resistance and improves the heat transfer efficiency under high temperature conditions, thus meeting the heat exchange test requirements in high temperature scenarios. Attached Figure Description

[0016] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings: Figure 1 This is a schematic diagram of the structure of a heat exchange test device provided in an embodiment of this application; Figure 2 This is a schematic diagram of the temperature measurement point distribution provided in the embodiments of this application; Figure 3 This is a schematic diagram of the structure of a measurement system provided in an embodiment of this application.

[0017] Figure label: 1. Heat exchanger; 2. Heat pipe; 3. Heat exchange metal layer; 401. Device body; 402. Support structure; 403. First insulation structure; 404. Insulation sleeve; 405. Second insulation structure; 406. Water-cooled sleeve; 407. Heat flow meter; 408. Heating element; 409. Temperature measurement assembly; 410. Cooling water circuit; 411. Power supply; 412. Atmosphere control circuit. Detailed Implementation

[0018] The present application will now be described in detail with reference to the accompanying drawings and specific embodiments and application scenarios. Obviously, the described embodiments are only a part of the embodiments of the present application, and not all of them. Unless otherwise specified, the following embodiments and features can be combined with each other. All other embodiments obtained by those skilled in the art based on the embodiments of the present application are within the scope of protection of the present application.

[0019] The terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such use of data can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class and the number of objects is not limited; for example, a first object can be one or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0020] Please see Figure 1 , Figure 1 This is a schematic diagram of the structure of a heat exchange test device provided in an embodiment of this application.

[0021] A first aspect of this application provides a heat exchange testing apparatus, comprising: a heat exchange element 1, a tube-hole gap, and a heat exchange metal layer 3. The heat exchange element 1 has at least one heat exchange hole for accommodating a heat pipe 2. The tube-hole gap is located between the heat pipe 2 and the heat exchange hole. The heat exchange metal layer 3 fills the tube-hole gap, and the thickness of the heat exchange metal layer 3 is 1~1000 μm, and the material of the heat exchange metal layer 3 is metal.

[0022] Specifically, heat exchanger 1 is a structural component with high-temperature resistance. The material can be stainless steel, nickel-based alloys, or other high-temperature resistant materials, determined based on the test conditions and actual application scenario. Heat exchanger 1 has at least one heat exchange hole, the shape of which matches the shape of the heat pipe 2. For example, the heat exchange hole is circular, and its size is designed according to the outer diameter of the heat pipe 2 and a preset pipe-hole gap, ensuring that the heat pipe 2 can be smoothly inserted and that a uniform gap is formed between them. The overall structure of heat exchanger 1 can be designed as a block, tube, or other form according to test requirements, ensuring structural stability and preventing significant deformation during high-temperature testing.

[0023] In this embodiment, heat pipe 2 serves as a heat transfer element, with an operating temperature range covering a preset test temperature range of 800~1200℃. The outer diameter of heat pipe 2 is determined according to the size of the heat exchange orifice, and after being inserted into the heat exchange orifice, it forms a tube-hole gap with the inner wall of the heat exchange orifice. The tube-hole gap is an annular gap between heat pipe 2 and the heat exchange orifice, i.e., a concentric cylindrical space. The size of the tube-hole gap is in the microscale range, with a width of 1~1000μm.

[0024] In this embodiment, the heat exchange metal layer 3 fills the gaps between the tubes to reduce the thermal resistance of the gaps and enhance the heat transfer between the heat pipe 2 and the heat exchanger 1. The thickness of the heat exchange metal layer 3 is consistent with the width of the gaps between the tubes, ranging from 1 to 1000 μm. The material of the heat exchange metal layer 3 is a metal, specifically including nickel and / or titanium. Nickel and titanium have good thermal conductivity, high-temperature stability, and sintering properties, and can maintain structural stability at high temperatures of 800 to 1200°C. They can also effectively fill the pores in the gaps and reduce the heat transfer resistance. The heat exchange metal layer 3 is made of nanoscale metal particles through filling and densification treatment. The particles are tightly bonded, have high density, and have no obvious pores or defects.

[0025] The heat exchange test device provided in this embodiment effectively fills the microscale gaps in the tube holes by filling the gaps with a heat exchange metal layer 3 made of metal material, which significantly reduces the thermal resistance of the gap contact and improves the heat transfer efficiency under high temperature environment, and can meet the heat exchange test requirements of high temperature scenarios of 800~1200℃.

[0026] A second aspect of this application provides a method for preparing a heat exchange testing device, which includes the following steps: S21: Insert the heat pipe 2 into the heat exchange hole of the heat exchanger 1.

[0027] Specifically, heat pipe 2 is inserted into the heat exchange hole of heat exchange component 1, ensuring that heat pipe 2 and heat exchange hole are coaxially arranged to form a uniform pipe-hole gap. Before assembly, the outer surface of heat pipe 2 and the inner surface of heat exchange hole need to be cleaned to remove oil, oxide layer and impurities. Cleaning methods can include ultrasonic cleaning, polishing and wiping, etc., to ensure interface cleanliness and improve the bonding force between heat exchange metal layer 3 and the two interfaces. During assembly, positioning fixtures can be used to ensure the coaxiality of heat pipe 2 and heat exchange hole to avoid uneven gaps.

[0028] S22: Fill the gap between the heat pipe 2 and the heat exchange hole with metal particles to obtain the heat exchange metal layer 3.

[0029] In this embodiment, the metal particles are nickel and / or titanium with a particle size of 5~200nm. The shape of the metal particles includes spherical and / or ellipsoidal. Metal nanoparticles with a particle size range of 5~200nm have good flowability and sintering activity, making them easy to fill into microscale pore gaps and form a dense structure during subsequent heat treatment.

[0030] Specifically, step S22 includes: S221: Fill the gap between the heat pipe 2 and the heat exchange hole with first metal particles at least once and dry them to obtain a first filling layer. The first metal particles are nickel and / or titanium, and the particle size of the first metal particles is 5~200 nm.

[0031] Specifically, the first metal particles are mixed with a dispersion medium to prepare a uniform first filled slurry. The dispersion medium can be a volatile organic solvent such as n-hexane that does not react with the metal particles, and the mixing mass ratio is 1:1. Preferably, an ultrasonic dispersion device is used for dispersion treatment during the mixing process to ensure that the first metal particles are uniformly dispersed in the dispersion medium and to avoid agglomeration.

[0032] In this embodiment, a capillary injection method is used for filling. Multiple ultra-fine capillaries are selected and inserted into the gaps between the tube holes from different circumferential angles and heights to ensure uniform filling of all areas of the gaps. The filling slurry is placed in a sealed container, and a peristaltic pump is used to slowly inject the first filling slurry into the gaps between the tube holes through the ultra-fine capillaries. Simultaneously, a copper strong magnet is placed at the bottom of the heat exchanger 1 to guide the first metal particles to move towards the bottom of the gaps between the tube holes using magnetic attraction. After injection, the assembled test piece is vertically placed in an oven for drying at 200°C for 2 hours to remove the dispersion medium from the first filling slurry and allow the first metal particles to initially adhere to the interface of the gaps between the tube holes. To improve the thickness and density of the filling layer, the above filling and drying operations are repeated at least once, with thorough drying after each filling to ensure that the particles are firmly adhered each time. For example, eight ultra-fine capillaries are selected to fill the gaps between the heat pipe 2 and the heat exchange holes with the first metal particles three times and then dry them.

[0033] S222: Under a first vacuum condition, the first filler layer is subjected to a first heat treatment to obtain a first cured layer.

[0034] Specifically, the vacuum level of the first vacuum condition is 50 Pa. The vacuum environment can prevent the metal particles from oxidizing at high temperatures, while promoting the diffusion and fusion between particles.

[0035] In this embodiment, a temperature gradient sintering method is used for the first heat treatment. Specifically, under a vacuum environment of 50 Pa, the temperature is raised from room temperature to 200°C and held for 2 hours to remove residual dispersion medium and moisture; then, the temperature is raised from 200°C to 400°C and held for 2 hours; finally, the temperature is raised from 400°C to 600°C and held for 2 hours. After sintering, the furnace is cooled to room temperature to avoid rapid cooling that could cause cracks in the solidified layer. This first heat treatment enables diffusion and fusion between nanoparticles, forming a preliminary dense first solidified layer.

[0036] S223: The first cured layer is subjected to vacuum treatment, and the first cured layer is filled with second metal particles at least once to obtain a second filled layer. The second metal particles are nickel and / or titanium; the particle size of the second metal particles is 5~200 nm.

[0037] In this embodiment, the second metal particles are mixed with a dispersion medium to prepare a uniform second filling slurry. A vacuum pump is used to evacuate the first cured layer. Exemplarily, the evacuation time is 30-60 minutes, and the vacuum degree is ≤10. - ³Pa. While vacuuming the first cured layer, the second filler slurry is filled into the first cured layer to ensure the filler material can fully penetrate the pores of the first cured layer, further improving the density of the filler layer. After filling, a drying process is performed, consistent with step S221. To improve the density of the second filler layer, the above filling and drying operations are repeated at least once, with thorough drying after each filling to ensure that the filled particles adhere firmly. For example, the first cured layer is filled with the second metal particles three times and then dried.

[0038] In one embodiment, the number of filling and drying operations in steps S221 and S223 is determined based on the total filling volume. That is, the number of filling and drying operations in step S221 is the number of times that a preset volume of metal particles can be filled into the gap between the tube holes, and the number of filling and drying operations in step S223 is the number of times that a preset volume of second metal particles can be filled into the first cured layer.

[0039] S224: Under the second vacuum condition, the second filling layer is subjected to a second heat treatment to obtain the heat exchange metal layer 3.

[0040] Specifically, the second filler layer is subjected to a second heat treatment using the same process as step S222 to obtain the heat exchange metal layer 3. Through secondary sintering, the second metal particles can be fully fused with the first solidified layer to form a continuous, dense, and structurally stable heat exchange metal layer 3.

[0041] The preparation method provided in this embodiment adopts a process of multiple filling and two sintering to ensure the uniformity and density of the heat exchange metal layer 3, and the process is feasible and highly stable.

[0042] A third aspect of this application provides a measurement method for measuring the heat exchange interface temperature characteristics of the heat exchange test device provided in the first aspect of this application, comprising the following steps: S31: Place the heat exchange test device in an insulated environment.

[0043] Specifically, the heat exchange test device is placed in an insulated environment to reduce heat exchange between the test device and the external environment, avoid the influence of environmental heat dissipation on the test results, and facilitate the construction of a stable temperature field.

[0044] S32: Heat heat pipe 2 to the preset temperature.

[0045] In this embodiment, the preset temperature is 800~1200℃.

[0046] S33: Measure the temperature in the wall of heat pipe 2 and the temperature in the heat exchange wall of heat exchanger 1.

[0047] In this embodiment, S33 includes: S331: A first temperature measuring point and a second temperature measuring point are set in the wall of heat pipe 2, and a third temperature measuring point and a fourth temperature measuring point are set in the heat exchange wall of heat exchange element 1. The first temperature measuring point, the second temperature measuring point, the third temperature measuring point and the fourth temperature measuring point are located in the same radial cross section to ensure that the measured temperature data are comparable and to accurately reflect the temperature distribution at that cross section.

[0048] S332: Measure the temperature at the first, second, third, and fourth temperature measuring points.

[0049] Specifically, such as Figure 2 As shown, Figure 2 Because the thickness of the heat exchange metal layer 3 is too small relative to the heat pipe 2 and the heat exchanger 1, it is not shown in the figure. The first temperature measuring point A is located on the side of the heat pipe 2 wall near the central axis of the heat pipe 2, and the second temperature measuring point B is located on the side of the heat pipe 2 wall near the heat exchanger 1. The distance between the two points is determined according to the wall thickness of the heat pipe 2. For example, the first temperature measuring point A is at 1 / 2 of the wall thickness, and the second temperature measuring point B is at 3 / 4 of the wall thickness, ensuring that the radial temperature gradient of the heat pipe 2 wall can be effectively reflected. The third temperature measuring point C is located on the side of the heat exchanger wall of the heat exchanger 1 near the heat pipe 2. The fourth temperature measuring point D is located on the side of the heat exchanger wall of the heat exchanger 1 away from the heat pipe 2. For example, the third temperature measuring point C is located at 1 / 2 of the heat exchanger wall thickness, and the fourth temperature measuring point D is located at 3 / 4 of the heat exchanger wall thickness, to accurately reflect the radial temperature gradient of the heat exchanger wall of the heat exchanger 1.

[0050] S34: Determine the temperature characteristics of the heat exchange interface of the heat exchange test device based on the temperature in the wall of heat pipe 2, the temperature in the heat exchange wall of heat exchange component 1, and the structural parameters of the heat exchange test device.

[0051] In this embodiment, S34 includes: S341: Based on the radius of the first temperature measuring point Temperature at the first temperature measurement point The radius of the second temperature measuring point The temperature at the second temperature measuring point The outer radius of heat pipe 2 Determine the outer wall temperature of heat pipe 2 Specifically, the heat flux of heat pipe 2 , The axial length of the heat exchange test apparatus. Let be the thermal conductivity of heat pipe 2. Based on the heat flux of heat pipe 2... The formula can determine the outer wall temperature of heat pipe 2. .

[0052] S342: Based on the radius of the third temperature measuring point The temperature at the third temperature measurement point The radius of the fourth temperature measuring point Temperature at the fourth temperature measurement point Radius of heat exchange holes Determine the inner wall temperature of heat exchanger 1. Specifically, the heat flux of heat exchanger 1 ,in, The thermal conductivity of heat exchanger 1. Based on the heat flux of heat pipe 2. The formula can determine the inner wall temperature of heat exchanger 1. .

[0053] S343: Based on the outer wall temperature of heat pipe 2 and the inner wall temperature of heat exchanger 1 Determine the temperature characteristics of the heat exchange interface.

[0054] In this embodiment, the heat exchange metal layer 3 is a dense metal layer with a thermal conductivity much higher than that of air. Under steady-state heat transfer conditions, the temperature gradient inside the heat exchange metal layer 3 is extremely small. Therefore, the temperature characteristics of the heat exchange metal layer 3 can be determined by the "contact interface temperature" on both sides of it, i.e., the outer wall temperature of the heat pipe 2. The inner wall temperature of heat exchanger 1 Accurate characterization. The heat exchange interface temperature characteristics include: the average interface temperature and the average interface temperature difference of the heat exchange metal layer 3. The average interface temperature is the outer wall temperature of the heat pipe 2. and the inner wall temperature of heat exchanger 1 The average value, the average interface temperature The average temperature difference at the interface is the outer wall temperature of heat pipe 2. and the inner wall temperature of heat exchanger 1 The difference, the average temperature difference at the interface The average interface temperature and average interface temperature difference can be used to intuitively reflect the heat transfer state of the heat transfer interface of the heat transfer test device and evaluate the enhanced heat transfer effect of the heat transfer metal layer 3.

[0055] In one embodiment, the measurement method further includes: uniformly setting multiple temperature measurement points at the same wall thickness in the heat exchange wall of the heat exchanger 1; determining the uniformity of the heat exchange metal layer 3 based on the temperatures of the multiple temperature measurement points; if the temperature difference between the multiple temperature measurement points is less than or equal to a preset error, it indicates that the uniformity of the heat exchange metal layer 3 meets the requirements. If the temperature difference between the multiple temperature measurement points is greater than the preset error, it indicates that the uniformity of the heat exchange metal layer 3 does not meet the requirements; then, the heat exchange metal layer 3 is refilled using the preparation method of the second aspect of the present application until the uniformity of the heat exchange metal layer 3 meets the requirements.

[0056] The measurement method provided in this embodiment sets multiple temperature measurement points on the same radial section and calculates the temperature characteristics of the heat exchange interface by fitting structural parameters. It has high measurement accuracy and can accurately reflect the heat transfer state of the heat exchange interface. Furthermore, the measurement process is simple to operate and has high measurement reliability.

[0057] Please see Figure 3 , Figure 3 This is a schematic diagram of the structure of a measurement system provided in an embodiment of this application.

[0058] The fourth aspect of the embodiment provides a measurement system, including: the heat exchange test device, the heat preservation device, the heating element 408, the temperature measurement component 409, and the temperature characteristic calculation module provided in the first aspect of this embodiment.

[0059] Specifically, the insulation device is used to house the heat exchange test device and provide an insulation environment. In this embodiment, the insulation device includes: a device body 401, a support structure 402, a first insulation structure 403, an insulation sleeve 404, and a second insulation structure 405. The device body 401 has an internal cavity connected to an atmosphere control circuit 412, which includes a vacuum pump and a gas cylinder assembly. Openings are provided on both ends of the device body 401, which are secured and sealed using a locking structure after closure. Furthermore, the device body 401 is equipped with a pressure measuring device, which can simulate the heat transfer environment of the heat exchange test device under different atmospheric pressure conditions by changing the atmosphere environment inside the cavity. The support structure 402 is located at the bottom of the cavity and is used to prevent the heat exchange test device from contacting the bottom of the device body 401. The first insulation structure 403 is mounted on the support structure 402, and the heat exchange test device is mounted on the first insulation structure 403. The first insulation structure 403 is used to insulate the bottom surface of the heat exchange test device to reduce heat dissipation from the end face of the heat exchange test device and facilitate the construction of a stable temperature field. The insulation sleeve 404 is fitted around the outer periphery of the heat exchange test device, and the second insulation structure 405 is mounted on the top of the heat exchange test device.

[0060] In this embodiment, the heating element 408 is located at the center of the heat exchange test device, i.e., the center of the heat pipe 2. The heating element 408 is connected to the power supply 411 and is used to heat the heat pipe 2 to provide a heat source for the test. The temperature measurement component 409 is used to measure the temperature in the pipe wall of the heat pipe 2 and the temperature in the heat exchange wall of the heat exchange component 1. The temperature measurement component 409 includes multiple thermocouples, which are respectively inserted to measure the temperature in the pipe wall of the heat pipe 2 and the temperature in the heat exchange wall of the heat exchange component 1. The temperature measurement component 409 is connected to a temperature characteristic calculation module, which is used to determine the temperature characteristics of the heat exchange interface of the heat exchange test device based on the temperature in the pipe wall of the heat pipe 2, the temperature in the heat exchange wall of the heat exchange component 1, and the structural parameters of the heat exchange test device.

[0061] In one embodiment, by drilling holes in the wall of the heat pipe 2 and the heat exchange wall of the heat exchanger 1, a thermocouple can be inserted to measure the temperature in the wall of the heat pipe 2 and the heat exchange wall of the heat exchanger 1.

[0062] In one embodiment, the measurement system further includes a water-cooled sleeve 406 and a heat flow meter 407. The water-cooled sleeve 406 is fitted over the outer side of the insulation sleeve 404 and is connected to the cooling water circuit 410. The heat flow meter 407 is located between the heat exchange test device and the insulation sleeve 404, and is used to measure the heat transfer of the heat exchange test device for heat transfer verification. Correspondingly, thermocouples are also inserted at the inlet and outlet of the heat flow meter 407, the water-cooled sleeve 406, and the water-cooled sleeve 406.

[0063] The measurement system provided in this embodiment has a reasonable structure and reliable performance. It can accurately test the temperature characteristics of the heat exchange interface under high temperature conditions, has a wide range of applications, fills the gap in the current experimental research on the thermal resistance of high temperature microscale tube gaps, and provides important technical support for theoretical research and engineering applications in related fields.

[0064] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element. Furthermore, it should be noted that the scope of the methods and apparatuses in the embodiments of this application is not limited to performing functions in the order shown or discussed, but may also include performing functions substantially simultaneously or in the reverse order, depending on the functions involved. For example, the described methods may be performed in a different order than described, and various steps may be added, omitted, or combined. Additionally, features described with reference to certain examples may be combined in other examples.

[0065] The embodiments of this application have been described above with reference to the accompanying drawings. However, this application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of this application.

Claims

1. A heat exchange testing apparatus, characterized in that, include: A heat exchange element having at least one heat exchange hole for accommodating a heat pipe; The tube hole gap is located between the heat pipe and the heat exchange hole; A heat exchange metal layer is filled in the gap between the tube holes, and the thickness of the heat exchange metal layer is 1~1000μm.

2. The heat exchange test apparatus according to claim 1, characterized in that, The heat exchange metal layer includes nickel and / or titanium.

3. A method for preparing a heat exchange testing device, used to prepare the heat exchange testing device according to claim 1 or 2, characterized in that, Includes the following steps: Insert the heat pipe into the heat exchange hole of the heat exchanger; Metal particles are filled into the gap between the heat pipe and the heat exchange hole to obtain a heat exchange metal layer.

4. The method for preparing the heat exchange test device according to claim 3, characterized in that, The step of filling the gap between the heat pipe and the heat exchange hole with metal particles to obtain a heat exchange metal layer includes: A first filling layer is obtained by filling the gap between the heat pipe and the heat exchange hole with first metal particles at least once and then drying it; the first metal particles are nickel and / or titanium; the particle size of the first metal particles is 5~200nm. Under a first vacuum condition, the first filler layer is subjected to a first heat treatment to obtain a first cured layer; The first cured layer is subjected to vacuum treatment, and the first cured layer is filled with second metal particles at least once to obtain a second filled layer; the second metal particles are nickel and / or titanium; the particle size of the second metal particles is 5~200nm; Under a second vacuum condition, the second filling layer is subjected to a second heat treatment to obtain a heat exchange metal layer.

5. A measurement method, characterized in that, Measuring the heat exchange interface temperature characteristics of the heat exchange test apparatus according to claim 1 or 2 includes the following steps: The heat exchange test device is placed in an insulated environment; Heat the heat pipe to a preset temperature; Measure the temperature in the wall of the heat pipe and the temperature in the heat exchange wall of the heat exchanger; The temperature characteristics of the heat exchange interface of the heat exchange test device are determined based on the temperature in the wall of the heat pipe, the temperature in the heat exchange wall of the heat exchange element, and the structural parameters of the heat exchange test device.

6. The measurement method according to claim 5, characterized in that, The steps of measuring the temperature in the wall of the heat pipe and the temperature in the heat exchanger wall of the heat exchanger include: A first temperature measuring point and a second temperature measuring point are provided in the wall of the heat pipe, and a third temperature measuring point and a fourth temperature measuring point are provided in the heat exchange wall of the heat exchange element; the first temperature measuring point, the second temperature measuring point, the third temperature measuring point and the fourth temperature measuring point are located in the same radial cross section; Measure the temperatures at the first, second, third, and fourth temperature measurement points.

7. The measurement method according to claim 6, characterized in that, The steps for determining the heat exchange interface temperature characteristics of the heat exchange test device based on the temperature in the pipe wall, the temperature in the heat exchange wall of the heat exchange element, and the structural parameters of the heat exchange test device include: Based on the radius of the first temperature measuring point The temperature of the first temperature measuring point The radius of the second temperature measuring point The temperature of the second temperature measuring point The outer radius of the heat pipe Determine the outer wall temperature of the heat pipe. The outer wall temperature of the heat pipe ; Based on the radius of the third temperature measuring point The temperature of the third temperature measuring point The radius of the fourth temperature measuring point The temperature of the fourth temperature measuring point Radius of heat exchange holes Determine the inner wall temperature of the heat exchanger. The inner wall temperature of the heat exchanger ; Based on the outer wall temperature of the heat pipe and the inner wall temperature of the heat exchanger Determine the temperature characteristics of the heat exchange interface.

8. The measurement method according to claim 7, characterized in that, The temperature characteristics of the heat exchange interface include: The average interface temperature and average interface temperature difference of the heat exchange metal layers; among which, The average interface temperature is the outer wall temperature of the heat pipe. and the inner wall temperature of the heat exchanger The average value; The average temperature difference at the interface is the outer wall temperature of the heat pipe. and the inner wall temperature of the heat exchanger The difference.

9. The measurement method according to claim 5, characterized in that, The preset temperature is 800~1200℃.

10. A measurement system, characterized in that, include: The heat exchange test apparatus according to claim 1 or 2; A heat preservation device is used to house the heat exchange test device and provide a heat preservation environment; A heating element for heating the heat pipe; A temperature measuring component is used to measure the temperature in the wall of the heat pipe and the temperature in the heat exchange wall of the heat exchanger. The temperature characteristic calculation module is used to determine the temperature characteristics of the heat exchange interface of the heat exchange test device based on the temperature in the pipe wall of the heat pipe, the temperature in the heat exchange wall of the heat exchange element, and the structural parameters of the heat exchange test device.

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