Heat dissipation system and method of mobile terminal

Abstract

The embodiment of the invention provides a heat dissipation system and method for a mobile terminal, and the system comprises a processor, a mainboard which is installed on the mainboard, an internal heat dissipation device which is disposed on the processor or installed on the mainboard and is used for absorbing the heat generated by the processor, and a detection device which is installed on the mainboard and is used for detecting the heat generated by the processor. The detection device is used for detecting the installation state of an external heat dissipation device of a rear shell of the mobile terminal, the position adjusting device is installed on a mainboard, and the internal heat dissipation device is arranged on the position adjusting device or communicated with the position adjusting device and used for controlling whether to make contact with the rear shell or not according to the detection result of the detection device so that heat can be transmitted to the rear shell. According to the invention, the problem that the internal heat conduction device and the external heat conduction device cannot be flexibly combined for use in the prior art is solved, and the effect of improving the heat dissipation efficiency is further achieved.

Description

Technical Field

[0001] The embodiments of the present invention relate to the field of communications, and more specifically, to a heat dissipation system and method for a mobile terminal. Background Technology

[0002] There are generally two ways to dissipate heat from mobile devices: one is to use an internal heat dissipation device to dissipate the heat generated by the processor, and the other is to use an external heat dissipation device installed on the back of the device to quickly remove heat from the surface. These two methods are relatively simple and cannot flexibly combine internal and external heat dissipation devices. Summary of the Invention

[0003] This invention provides a heat dissipation system and method for a mobile terminal, at least solving the problem in related technologies where it is impossible to flexibly combine internal and external heat dissipation devices.

[0004] According to an embodiment of the present invention, a heat dissipation system for a mobile terminal is provided, comprising: a processor, a motherboard, the processor being mounted on the motherboard, an internal heat dissipation device, the internal heat dissipation device being disposed on the processor or mounted on the motherboard for absorbing heat generated by the processor, a detection device, the detection device being mounted on the motherboard for detecting the installation status of the external heat dissipation device of the rear shell of the mobile terminal, and a position adjustment device, the position adjustment device being mounted on the motherboard, the internal heat dissipation device being disposed on the position adjustment device or connected to the position adjustment device, for controlling whether to contact the rear shell according to the detection result of the detection device, so as to transfer heat to the rear shell.

[0005] According to another embodiment of the present invention, a heat dissipation method for a mobile terminal is provided, comprising: detecting the installation status of an external heat dissipation device on the rear shell of the mobile terminal; when the external heat dissipation device is installed on the rear shell, transferring heat to the rear shell for dissipation through the external heat dissipation device; and when the external heat dissipation device is not installed on the rear shell, not transferring heat to the rear shell for dissipation through an internal heat dissipation device.

[0006] According to yet another embodiment of the present invention, an electronic device is also provided, the electronic device including the steps in any of the above method embodiments.

[0007] According to yet another embodiment of the present invention, a computer-readable storage medium is also provided, wherein a computer program is stored in the computer-readable storage medium, wherein the computer program is configured to perform the steps in any of the above method embodiments when it is run.

[0008] According to yet another embodiment of the present invention, an electronic device is also provided, including a memory and a processor, wherein the memory stores a computer program and the processor is configured to run the computer program to perform the steps in any of the above method embodiments.

[0009] According to yet another embodiment of the present invention, a computer program product is also provided, comprising a computer program that, when executed by a processor, implements the steps in any of the above method embodiments.

[0010] Through the above embodiments of the present invention, since a position adjustment device is installed on the motherboard of the mobile terminal, the position adjustment device can control whether to contact the back cover according to the result detected by the detection device. When in contact with the back cover, heat is dissipated through an external heat dissipation device, and when not in contact with the back cover, heat is dissipated through an internal heat dissipation device. Therefore, the problem of not being able to flexibly combine the internal heat conduction device and the external heat conduction device in related technologies can be solved, and the effect of flexibly combining the internal heat conduction device and the external heat conduction device can be achieved, thereby improving the heat dissipation efficiency. Attached Figure Description

[0011] Figure 1 This is a schematic diagram of the external heat dissipation device according to an embodiment of the present invention;

[0012] Figure 2 This is a schematic diagram of the heat dissipation system structure of a mobile terminal according to an embodiment of the present invention (I);

[0013] Figure 3 This is a schematic diagram (II) of the heat dissipation system structure of a mobile terminal according to an embodiment of the present invention;

[0014] Figure 4 This is a schematic diagram of the liquid-cooled heat conduction device according to an embodiment of the present invention;

[0015] Figure 5 This is a schematic diagram (iii) of the heat dissipation system structure of a mobile terminal according to an embodiment of the present invention;

[0016] Figure 6 This is a schematic diagram (four) of the heat dissipation system structure of a mobile terminal according to an embodiment of the present invention;

[0017] Figure 7 This is a schematic diagram (a) of the magnetic fastening device according to an embodiment of the present invention;

[0018] Figure 8 This is a schematic diagram (II) of the magnetic fastening device according to an embodiment of the present invention;

[0019] Figure 9 This is a schematic diagram (iii) of the magnetic fastening device structure according to an embodiment of the present invention;

[0020] Figure 10 This is a schematic diagram (four) of the magnetic fastening device according to an embodiment of the present invention;

[0021] Figure 11 This is a schematic diagram of the hydraulic fixing device according to an embodiment of the present invention;

[0022] Figure 12 This is a schematic diagram of the spring-type fixing device according to an embodiment of the present invention;

[0023] Figure 13 This is a schematic diagram of the structure of the electric motor type fixing device according to an embodiment of the present invention;

[0024] Figure 14 This is a flowchart of a heat dissipation method for a mobile terminal according to an embodiment of the present invention. Detailed Implementation

[0025] The embodiments of the present invention will be described in detail below with reference to the accompanying drawings and examples.

[0026] It should be noted that the terms "first," "second," etc., in the specification, claims, and drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

[0027] This embodiment provides a heat dissipation system for a mobile terminal, including:

[0028] Processor and motherboard; the processor is installed on the motherboard.

[0029] Internal heat dissipation device, which is located in the processor or mounted on the motherboard, is used to absorb the heat generated by the processor;

[0030] The detection device is mounted on the motherboard and is used to detect the installation status of the external heat dissipation device on the back cover of the mobile terminal.

[0031] The position adjustment device is mounted on the motherboard. The internal heat dissipation device is located on or connected to the position adjustment device. It is used to control whether to contact the back cover according to the detection result of the detection device so that heat can be transferred to the back cover.

[0032] In one exemplary embodiment, the system may include an external heat dissipation device for absorbing heat. Figure 1 This is a schematic diagram of the external heat dissipation device according to an embodiment of the present invention, as shown below. Figure 1 As shown, the external heat dissipation device is installed on the back cover of the mobile terminal and may include a fan, a magnet, and a heat-conducting plate.

[0033] In one exemplary embodiment, the internal heat dissipation device may be a graphite sheet (also referred to as a graphite thermal conductive sheet), which is attached to the surface of the processor and the surface of the position adjustment device. Figure 2 This is a schematic diagram (I) of the heat dissipation system structure of a mobile terminal according to an embodiment of the present invention, as shown below. Figure 2 As shown, the graphite sheet serves as an internal heat dissipation device.

[0034] Figure 2 The left side shows the position adjustment device in contact with the back cover. In this case, the mobile terminal can dissipate heat through the external heat dissipation device on the back cover (the external heat dissipation device is located on...). Figure 2 Not shown in the text, can be combined Figure 1 The external heat dissipation device (shown) utilizes heat conduction between the graphite sheet and the metal area of ​​the back cover, resulting in rapid heat transfer. The metal area on the back cover effectively transfers heat from the internal graphite sheet to the outer surface of the metal area, and then the external heat dissipation device quickly conducts the heat from the processor to the outside of the terminal for heat dissipation. At this point, the temperature difference between the outside of the metal casing and the surface of the processor is greater, and more heat is conducted from the processor to the outside of the metal casing through the graphite sheet.

[0035] Figure 2 The image on the right shows the position adjustment device not in contact with the back cover. In this case, the mobile terminal dissipates heat through the graphite sheet. Heat transfer between the graphite sheet and the metal area of ​​the back cover occurs via convection and radiation, which is relatively slow. Therefore, the metal area on the back cover does not effectively transfer heat from the internal graphite sheet to its outer surface, preventing internal heat conduction that could burn the user. In this configuration, the processor's heat is conducted through the graphite sheet to its entire surface, where it dissipates. The heat is primarily dissipated within the terminal casing, thus lowering the processor's temperature.

[0036] In one exemplary embodiment, the internal heat dissipation device is a liquid cooling heat conduction device (also referred to as a liquid heat conduction device), which is installed on the motherboard on the side opposite to the processor, and is connected to the position adjustment device. Figure 3 This is a schematic diagram (II) of the heat dissipation system structure of a mobile terminal according to an embodiment of the present invention, as shown below. Figure 3 As shown, the liquid cooling heat conduction device serves as the internal heat dissipation device.

[0037] Figure 3The left side shows the position adjustment device not in contact with the back cover. In this case, the mobile terminal can dissipate heat through the liquid cooling heat conduction device. Heat transfer between the liquid cooling heat conduction device and the metal area of ​​the back cover is via convection and radiation, which is relatively slow. Therefore, the metal area on the back cover will not effectively transfer heat from the internal liquid cooling heat conduction device to its outer surface, preventing internal heat conduction that could burn the user. At this time, the processor's heat is conducted to the entire surface of the liquid cooling heat conduction device through the liquid cooling heat conduction device, where the heat dissipates. The heat is primarily dissipated within the terminal casing, thus reducing the processor's temperature.

[0038] Figure 3 The right side shows the position adjustment device in contact with the back cover. In this case, the mobile terminal can dissipate heat through an external heat dissipation device (the external heat dissipation device is located in...). Figure 3 Not shown in the text, can be combined Figure 1 The external heat dissipation device (shown) uses heat conduction between the liquid cooling heat conduction device and the metal area of ​​the rear shell, resulting in relatively fast heat transfer. The metal area on the rear shell can effectively transfer the heat from the internal liquid cooling heat conduction device to the outer surface of the metal area, and then the external heat dissipation device quickly conducts the heat from the processor to the outside of the terminal for heat dissipation. At this time, the temperature difference between the outside of the metal shell and the surface of the processor is greater, and more heat is conducted from the processor to the outside of the metal shell through the liquid cooling heat conduction device.

[0039] In one exemplary embodiment, the liquid cooling heat transfer device includes a liquid cooling pump and a liquid circulation pipe. The liquid cooling pump draws heated liquid from near the processor into the pump, and then pumps the liquid back into the liquid circulation pipe. Through liquid circulation within the pipe, heat near the processor is transferred to other locations for heat dissipation. Figure 4 This is a schematic diagram of the liquid-cooled heat conduction device according to an embodiment of the present invention, as shown below. Figure 4 As shown, Figure 4 The left side is a front view of the liquid-cooled heat conduction device. Figure 4 The right side view is of the liquid-cooled heat conduction device.

[0040] In one exemplary embodiment, the detection device is a Hall effect device, which is used to detect whether an external heat dissipation device containing a magnet is installed on the rear cover.

[0041] Figure 5 This is a schematic diagram (iii) of the heat dissipation system structure of a mobile terminal according to an embodiment of the present invention. Figure 5 As shown, Figure 5Taking a liquid-cooled heat dissipation device as an internal heat dissipation device as an example, or alternatively, an internal heat dissipation device consisting of graphite sheets, a Hall effect sensor is mounted on the motherboard. The external heat dissipation device contains a magnet. This Hall effect sensor can detect whether an external heat dissipation device containing a magnet is installed on the back cover. When the external heat dissipation device is installed on the back cover, the magnet in the external heat dissipation device approaches the Hall effect sensor on the motherboard, and the Hall effect sensor detects the change in magnetic field. The Hall effect sensor sends a message to the processor indicating that the external heat dissipation device is installed. Upon receiving this message, the processor changes the position of the device, adjusting its state from non-contact to contact with the back cover. When the external heat dissipation device is removed from the back cover, the Hall effect sensor detects the change in magnetic field. The Hall effect sensor sends a message to the processor indicating that the external heat dissipation device has been removed, and upon receiving this message, the processor changes its state from contact with the back cover to non-contact.

[0042] In one exemplary embodiment, the detection device is a near-field communication (NFC) coil, which is used to detect whether an external heat dissipation device containing the NFC coil is installed on the back cover.

[0043] Figure 6 This is a schematic diagram (four) of the heat dissipation system structure of a mobile terminal according to an embodiment of the present invention, as shown below. Figure 6 As shown, Figure 6 Taking a liquid-cooled heat dissipation device as an internal heat dissipation device as an example, or alternatively, an internal graphite sheet heat dissipation device, an NFC coil is installed on the motherboard, and an external heat dissipation device includes an NFC coil. The NFC coil inside the terminal device can detect whether an external heat dissipation device containing an NFC coil is installed on the back cover. When the external heat dissipation device is installed on the back cover, the NFC coil on the mobile terminal side recognizes the NFC coil of the external heat dissipation device and sends a message to the processor indicating that the external heat dissipation device is installed. Upon receiving the message, the processor changes the position of the device, changing from a state of non-contact with the back cover to a state of contact with the back cover. When the external heat dissipation device is removed from the back cover, the NFC coil on the mobile terminal side can no longer recognize the NFC coil of the external heat dissipation device and sends a message to the processor indicating that the external heat dissipation device has been removed. Upon receiving the message, the processor changes from a state of contact with the back cover to a state of non-contact with the back cover.

[0044] In one exemplary embodiment, the position adjustment device includes one of the following: a magnetic fixing device, a hydraulic fixing device, a spring fixing device, and an electric motor fixing device.

[0045] In an exemplary embodiment, the magnetic fastening device includes a magnet, a magnetic material, and a central column. An internal heat dissipation device is attached to the surface of the magnet. The magnet is hollow and sheet-like. The bottom of the magnetic fastening device is made of magnetic material. The central column is mounted on the magnetic material. The hollow area of ​​the magnet is fitted onto the columnar object. The magnet in the magnetic fastening device moves up and down along the central column according to the attraction of the magnetic material or the attraction of the magnet in the external heat dissipation device to control whether it contacts the back shell.

[0046] Figure 7 This is a schematic diagram (I) of the magnetic fixing device according to an embodiment of the present invention, as shown below. Figure 7 As shown, the internal heat dissipation device is a graphite sheet, which is attached to the surface of the magnet. The magnetic material at the bottom is, for example, an iron sheet. Figure 7 The left side view is a sectional view of the magnetic fastening device. Figure 7 The right side shows a front cross-sectional view of the magnetic fixing device. When an external heat dissipation device is installed on the rear shell of the terminal, the magnet in the position adjustment device is attracted by the magnet on the external heat dissipation device and moves closer to the external heat dissipation device, allowing the magnet to contact the rear shell for heat conduction. When there is no external heat dissipation device on the rear shell, it is attracted by the iron plate in the position adjustment device and adheres to the iron plate at the bottom. The attraction between the magnet in the external heat dissipation device and the magnet in the position adjustment device is greater than the attraction between the iron plate and the magnet in the position adjustment device.

[0047] In one exemplary embodiment, the magnetic fastening device includes a liquid bladder, a magnetic material, and a central column. The top of the liquid bladder is a magnet, and an internal heat dissipation device is connected to the liquid bladder. The liquid bladder is hollow, and the bottom of the magnetic fastening device is made of magnetic material. The central column is mounted on the magnetic material, and the hollow area of ​​the liquid bladder is fitted onto the columnar object. The magnet at the top of the liquid bladder moves up and down along the central column according to the attraction of the magnetic material or the attraction of the magnet in the external heat dissipation device to control whether it contacts the rear shell.

[0048] Figure 8 This is a schematic diagram (II) of the magnetic fastening device according to an embodiment of the present invention, as shown below. Figure 8 As shown, the internal heat dissipation device is a liquid cooling system. The liquid in the liquid cooling system can be connected to the liquid in the liquid bladder through pipes. The top of the liquid bladder is a magnet, and the magnetic material at the bottom is, for example, an iron sheet. The support column is used to support the liquid bladder. Figure 8 The left side view is a sectional view of the magnetic fastening device. Figure 8The right side shows a front cross-sectional view of the magnetic fixing device. When an external heat dissipation device is installed on the rear shell of the terminal, the magnet in the position adjustment device is attracted by the magnet on the external heat dissipation device and moves closer to the external heat dissipation device, allowing the magnet to contact the rear shell for heat conduction. When there is no external heat dissipation device on the rear shell, it is attracted by the iron plate in the position adjustment device and adheres to the iron plate at the bottom. The attraction between the magnet in the external heat dissipation device and the magnet in the position adjustment device is greater than the attraction between the iron plate and the magnet in the position adjustment device.

[0049] In one exemplary embodiment, the magnetic fastening device includes a magnet, a magnetic material, and a sidewall frame. An internal heat dissipation device is attached to the surface of the magnet. The bottom of the magnetic fastening device is made of magnetic material, and the sidewall frame is mounted on the magnetic material. The magnet in the magnetic fastening device moves up and down along the sidewall frame according to the attraction of the magnetic material or the attraction of the magnet in the external heat dissipation device to control whether it contacts the rear shell.

[0050] Figure 9 This is a schematic diagram (iii) of the magnetic fastening device structure according to an embodiment of the present invention. Figure 9 As shown, the internal heat dissipation device is a graphite sheet, which is attached to the surface of the magnet. Figure 9 (Not shown in the image), the magnetic material at the bottom is, for example, an iron sheet. Figure 9 The left side view is a sectional view of the magnetic fastening device. Figure 9 The right side shows a front cross-sectional view of the magnetic fixing device. When an external heat dissipation device is installed on the rear shell of the terminal, the magnet in the position adjustment device is attracted by the magnet on the external heat dissipation device and moves closer to the external heat dissipation device, allowing the magnet to contact the rear shell for heat conduction. When there is no external heat dissipation device on the rear shell, it is attracted by the iron plate in the position adjustment device and adheres to the iron plate at the bottom. The attraction between the magnet in the external heat dissipation device and the magnet in the position adjustment device is greater than the attraction between the iron plate and the magnet in the position adjustment device.

[0051] In one exemplary embodiment, the magnetic fastening device includes a liquid bladder, a magnetic material, and a sidewall frame. The top of the liquid bladder is a magnet, and an internal heat dissipation device is connected to the liquid bladder. The bottom of the magnetic fastening device is made of magnetic material, and the sidewall frame is mounted on the magnetic material. The magnet at the top of the liquid bladder moves up and down along the sidewall frame according to the attraction of the magnetic material or the attraction of the magnet in the external heat dissipation device to control whether it contacts the rear shell.

[0052] Figure 10 This is a schematic diagram (fourth) of the magnetic fixing device according to an embodiment of the present invention, as shown below. Figure 10 As shown, the internal heat dissipation device is a liquid cooling system. The liquid in the liquid cooling system can be connected to the liquid in the liquid bladder through pipes. The magnetic material at the bottom is an iron sheet, and the support column is used to support the liquid bladder. Figure 10 The left side shows the magnetic fastening device not in contact with the back cover. Figure 10 The right side shows the magnetic fixing device in contact with the back cover. When an external heat dissipation device is installed on the terminal's back cover, the magnet in the position adjustment device is attracted by the magnet on the external heat dissipation device and moves closer to the external heat dissipation device, allowing the magnet to contact the back cover for heat conduction. When there is no external heat dissipation device on the back cover, it is attracted by the iron plate in the position adjustment device and adheres to the iron plate at the bottom. The attraction between the magnet in the external heat dissipation device and the magnet in the position adjustment device is greater than the attraction between the iron plate and the magnet in the position adjustment device.

[0053] In one exemplary embodiment, the hydraulic fixing device includes a retractable liquid bladder and a liquid compression pump. The hydraulic fixing device is mounted on the main board. The top of the liquid bladder is made of thermally conductive material, and an internal heat dissipation device is attached to the surface of the thermally conductive material. The liquid compression pump is used to draw or press liquid into the liquid bladder to control whether it contacts the rear shell.

[0054] In one exemplary embodiment, the hydraulic fixing device includes a retractable liquid bladder and a liquid compression pump. The hydraulic fixing device is mounted on the main board. The top of the liquid bladder is made of thermally conductive material, and an internal heat dissipation device is connected to the liquid bladder. The liquid compression pump is used to draw or press liquid into the liquid bladder to control whether it contacts the rear shell.

[0055] Figure 11 This is a schematic diagram of the hydraulic fixing device according to an embodiment of the present invention, as shown below. Figure 11 As shown, when the internal heat dissipation device is a graphite sheet, the graphite sheet can be attached to the surface of the thermally conductive material. Figure 11 (Not shown), when the internal heat dissipation device is a liquid cooling device, the liquid in the liquid cooling device can be connected to the liquid in the liquid bladder through pipes. Figure 11 (Not shown), supporting the liquid bladder. Figure 11 The left side shows the liquid capsule in a compressed state. Figure 11 The right side shows the liquid bladder in its extended state. The liquid compression pump can draw or pressurize liquid into the hydraulic fixing device, compressing and extending the device depending on the liquid content. When the liquid bladder is compressed, the heat-conducting material at the top of the bladder does not contact the rear shell. When the liquid bladder is extended, the heat-conducting material at the top of the bladder contacts the rear shell, thus dissipating heat through it.

[0056] In one exemplary embodiment, the spring-loaded retaining device includes a spring, a retractable liquid bladder, the spring-loaded retaining device being mounted on the motherboard, the top of the liquid bladder being a thermally conductive material, an internal heat dissipation device being attached to the surface of the thermally conductive material, and the spring being used to contract or extend to control whether it contacts the rear shell.

[0057] In one exemplary embodiment, the spring-loaded fixing device includes a spring and a retractable liquid bladder mounted on the motherboard. The top of the liquid bladder is made of a thermally conductive material, and an internal heat dissipation device is connected to the liquid bladder. The spring is used to contract or extend to control whether it contacts the rear shell.

[0058] Figure 12 This is a schematic diagram of the spring-type fixing device according to an embodiment of the present invention, as shown below. Figure 12 As shown, when the internal heat dissipation device is a graphite sheet, the graphite sheet can be attached to the surface of the thermally conductive material. Figure 12 (Not shown), when the internal heat dissipation device is a liquid cooling device, the liquid in the liquid cooling device can be connected to the liquid in the liquid bladder through pipes. Figure 12 (Not shown), supporting the liquid bladder. Figure 12 The left side shows the liquid capsule in a compressed state. Figure 12 The right side shows the liquid bladder in its extended state. When the spring is in the contracted state, the spring-loaded retaining device holds the top of the liquid bladder in place, preventing it from contacting the rear shell. When an external heat dissipation device is installed on the rear shell, the magnet of the external heat dissipation device attracts the thermally conductive material (such as a sheet of iron or a magnet) on the top of the liquid bladder, allowing the material to contact the rear shell for heat conduction.

[0059] In one exemplary embodiment, the electric motor type fixing device includes an electric motor, a telescopic lever arm, and a telescopic liquid bladder. The electric motor type fixing device is mounted on a motherboard. The top of the liquid bladder is made of thermally conductive material, and an internal heat dissipation device is attached to the surface of the thermally conductive material. The electric motor is used to retract or extend the lever arm to control whether it contacts the rear shell.

[0060] In one exemplary embodiment, the electric motor type fixing device includes an electric motor, a telescopic lever arm, and a telescopic liquid bladder. The electric motor type fixing device is mounted on the main board. The top of the liquid bladder is made of thermally conductive material, and an internal heat dissipation device is connected to the liquid bladder. The electric motor is used to retract or extend the lever arm to control whether it contacts the rear shell.

[0061] Figure 13 This is a schematic diagram of the structure of the electric motor type fixing device according to an embodiment of the present invention, as shown below. Figure 13 As shown, when the internal heat dissipation device is a graphite sheet, the graphite sheet can be attached to the surface of the thermally conductive material. Figure 13 (Not shown), when the internal heat dissipation device is a liquid cooling device, the liquid in the liquid cooling device can be connected to the liquid in the liquid bladder through pipes. Figure 13 Not shown), supporting the liquid bladder ( Figure 13 (Not shown). Figure 13 The left side shows the liquid capsule in a compressed state. Figure 13 The right side shows the liquid bladder in its extended state. The electric motor can extend or retract the lever arm based on received signals (e.g., signals from a processor). When the electric motor lever arm is retracted, it keeps the top heat-conducting material away from the rear shell. When the electric motor lever arm is extended, it brings the top heat-conducting material into contact with the rear shell, thereby dissipating heat through the rear shell.

[0062] In one exemplary embodiment, the position adjustment device is used to transfer heat to the rear housing when the detection device detects that an external heat dissipation device is installed on the rear housing, so as to dissipate heat through the external heat dissipation device.

[0063] In one exemplary embodiment, the position adjustment device is configured to not contact the rear housing when the detection device detects that no external heat dissipation device is installed on the rear housing, so as to dissipate heat through the internal heat dissipation device.

[0064] In one exemplary embodiment, the system may include a temperature sensor for detecting the temperature of the processor, so that the processor adjusts the heat dissipation rate of the internal heat dissipation device and / or the heat dissipation rate of the external heat dissipation device based on the temperature information.

[0065] In one exemplary embodiment, the system includes one of the following:

[0066] When the internal heat dissipation device is a graphite sheet, the processor is used to transmit the processor's temperature information to the external heat dissipation device via Bluetooth in order to adjust the fan speed of the external heat dissipation device.

[0067] When the internal heat dissipation device is a graphite sheet and the detection device is an NFC coil, the detection device is used to transmit temperature information to the external heat dissipation device containing the NFC coil in order to adjust the fan rotation speed of the external heat dissipation device.

[0068] When the internal heat dissipation device is a liquid cooling heat conduction device, the processor is used to adjust the liquid circulation speed of the liquid cooling heat conduction device according to the temperature information, and / or transmit the temperature information to the external heat dissipation device via Bluetooth to adjust the fan rotation speed of the external heat dissipation device.

[0069] When the internal heat dissipation device is a liquid cooling heat conduction device and the detection device is an NFC coil, the processor is used to adjust the liquid circulation speed of the liquid cooling heat conduction device according to the temperature information, and / or transmit the temperature information to the external heat dissipation device containing the NFC coil through the NFC coil to adjust the fan rotation speed of the external heat dissipation device.

[0070] In one exemplary embodiment, when transmitting temperature information via Bluetooth, the processor first needs to pair with the external heat dissipation device via Bluetooth, and then send the temperature information to the external heat dissipation device via Bluetooth.

[0071] In one exemplary embodiment, when the internal heat dissipation device is a graphite sheet, the external heat dissipation device can be configured with a temperature and fan rotation speed curve. The higher the temperature, the faster the fan rotation speed. The external heat dissipation device adjusts the fan rotation speed based on the temperature information transmitted by the processor and the configured curve.

[0072] In one exemplary embodiment, when the internal heat dissipation device is a liquid-cooled heat conduction device, the processor can set the liquid circulation speed of the liquid cooling device according to a temperature curve. The higher the temperature, the faster the liquid circulation speed. The processor adjusts the liquid circulation speed of the liquid cooling heat conduction device based on the set curve and the obtained temperature information. The processor can also transmit the obtained temperature information to an external heat dissipation device. The external heat dissipation device can set a temperature and fan rotation speed curve. The higher the temperature, the faster the fan rotation speed. The external heat dissipation device can adjust the fan rotation speed based on the temperature information transmitted by the processor and the set curve.

[0073] It should be noted that the mobile terminal can transmit data to the external heat dissipation device in ways not limited to those described above. Other methods may also be used, such as Wi-Fi, USB data, metal contacts, etc.

[0074] Through the above embodiments, since a position adjustment device is set inside the mobile terminal, the position adjustment device can control whether it is in contact with the back cover. When it is in contact with the back cover, it can dissipate heat through an external heat dissipation device, and when it is not in contact with the back cover, it can dissipate heat through an internal heat dissipation device. This solves the problem in related technologies that it is not possible to flexibly combine internal and external heat dissipation devices, improves the heat dissipation efficiency of the mobile terminal, and also enhances the user experience of using the mobile terminal.

[0075] Figure 14 This is a flowchart of a heat dissipation method for a mobile terminal according to an embodiment of the present invention, such as... Figure 14 As shown, the process includes the following steps:

[0076] Step S1402: Detect the installation status of the external heat dissipation device on the back cover of the mobile terminal;

[0077] Step S1404: When an external heat dissipation device is installed on the rear shell, heat is transferred to the rear shell so as to dissipate heat through the external heat dissipation device.

[0078] In step S1406, if no external heat dissipation device is installed on the rear shell, heat is not transferred to the rear shell, and heat is dissipated through the internal heat dissipation device.

[0079] In one exemplary embodiment, the method further includes:

[0080] Get the processor temperature;

[0081] Adjust the heat dissipation rate of the internal heat dissipation device according to the temperature, and / or transfer the temperature to the external heat dissipation device to adjust the heat dissipation rate of the external heat dissipation device.

[0082] Through the above steps, depending on the installation status of the external heat dissipation device on the back cover of the mobile terminal, heat is transferred to the back cover when it is installed, so that heat can be dissipated through the external heat dissipation device; when it is not installed, heat is not transferred to the back cover, so that heat can be dissipated through the internal heat dissipation device. This solves the problem in related technologies that cannot flexibly combine internal and external heat conduction devices, improves the heat dissipation efficiency of the mobile terminal, and also enhances the user experience of using the mobile terminal.

[0083] It should be noted that the method in this embodiment can be applied to electronic devices with the aforementioned system.

[0084] Through the above description of the embodiments, those skilled in the art can clearly understand that the methods according to the above embodiments can be implemented by means of software plus necessary general-purpose hardware platforms. Of course, they can also be implemented by hardware, but in many cases the former is a better implementation method. Based on this understanding, the technical solution of the present invention, in essence, or the part that contributes to the prior art, can be embodied in the form of a software product. This computer software product is stored in a storage medium (such as ROM / RAM, magnetic disk, optical disk) and includes several instructions to cause a terminal device (which may be a mobile phone, computer, server, or network device, etc.) to execute the methods of the various embodiments of the present invention.

[0085] Embodiments of the present invention also provide an electronic device, which includes the system of any of the above embodiments.

[0086] Embodiments of the present invention also provide a computer-readable storage medium storing a computer program, wherein the computer program is configured to perform the steps in any of the above method embodiments when executed.

[0087] In one exemplary embodiment, the aforementioned computer-readable storage medium may include, but is not limited to, various media capable of storing computer programs, such as a USB flash drive, read-only memory (ROM), random access memory (RAM), portable hard disk, magnetic disk, or optical disk.

[0088] Embodiments of the present invention also provide an electronic device including a memory and a processor, the memory storing a computer program and the processor being configured to run the computer program to perform the steps in any of the above method embodiments.

[0089] In one exemplary embodiment, the electronic device may further include a transmission device and an input / output device, wherein the transmission device is connected to the processor and the input / output device is connected to the processor.

[0090] Specific examples in this embodiment can be found in the examples described in the above embodiments and exemplary implementations, and will not be repeated here.

[0091] It is obvious to those skilled in the art that the modules or steps of the present invention described above can be implemented using general-purpose computing devices. They can be centralized on a single computing device or distributed across a network of multiple computing devices. They can be implemented using computer-executable program code, and thus can be stored in a storage device for execution by a computing device. In some cases, the steps shown or described can be performed in a different order than those described herein, or they can be fabricated as separate integrated circuit modules, or multiple modules or steps can be fabricated as a single integrated circuit module. Thus, the present invention is not limited to any particular combination of hardware and software.

[0092] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention can have various modifications and variations. Any modifications, equivalent substitutions, improvements, etc., made within the principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A heat dissipation system for a mobile terminal, characterized in that, include: Processor and motherboard, wherein the processor is mounted on the motherboard; An internal heat dissipation device, which is located on the processor or mounted on the motherboard, is used to absorb the heat generated by the processor. A detection device, which is mounted on the motherboard, is used to detect the installation status of the external heat dissipation device on the back cover of the mobile terminal. A position adjustment device is mounted on the motherboard, and an internal heat dissipation device is located on or connected to the position adjustment device. The device is used to control whether to contact the rear shell according to the detection result of the detection device, so that the heat is transferred to the rear shell.

2. The system according to claim 1, characterized in that, The internal heat dissipation device is a graphite sheet, which is attached to the surface of the processor and the surface of the position adjustment device; or, The internal heat dissipation device is a liquid cooling heat conduction device, which is installed on the motherboard on the side opposite to the processor, and is connected to the position adjustment device.

3. The system according to claim 1, characterized in that, The detection device is a Hall effect device, used to detect whether the rear shell is equipped with an external heat dissipation device containing a magnet; or, The detection device is a near-field communication (NFC) coil, which is used to detect whether the back cover is equipped with an external heat dissipation device containing an NFC coil.

4. The system according to claim 1, characterized in that, The position adjustment device includes one of the following: Magnetic fixing devices, hydraulic fixing devices, spring fixing devices, and electric motor fixing devices.

5. The system according to claim 4, characterized in that, The magnetic fastening device includes a magnet, a magnetic material, and a central column. The internal heat dissipation device is attached to the surface of the magnet. The magnet is hollow and sheet-like. The bottom of the magnetic fastening device is the magnetic material. The central column is mounted on the magnetic material. The hollow area of ​​the magnet is fitted onto the columnar object. The magnet in the magnetic fastening device moves up and down along the central column according to the attraction of the magnetic material or the attraction of the magnet in the external heat dissipation device to control whether it contacts the back shell. or, The magnetic fixing device includes a liquid bladder, a magnetic material, and a central column. The top of the liquid bladder is a magnet. The internal heat dissipation device is connected to the liquid bladder. The liquid bladder is hollow. The bottom of the magnetic fixing device is the magnetic material. The central column is mounted on the magnetic material. The hollow area of ​​the liquid bladder is fitted onto the columnar object. The magnet at the top of the liquid bladder moves up and down along the central column according to the attraction of the magnetic material or the attraction of the magnet in the external heat dissipation device to control whether it contacts the rear shell.

6. The system according to claim 4, characterized in that, The magnetic fastening device includes a magnet, a magnetic material, and a sidewall frame. The internal heat dissipation device is attached to the surface of the magnet. The bottom of the magnetic fastening device is the magnetic material. The sidewall frame is mounted on the magnetic material. The magnet in the magnetic fastening device moves up and down along the sidewall frame according to the attraction of the magnetic material or the attraction of the magnet in the external heat dissipation device to control whether it contacts the back shell. or, The magnetic fixing device includes a liquid bladder, a magnetic material, and a sidewall frame. The top of the liquid bladder is a magnet. The internal heat dissipation device is connected to the liquid bladder. The bottom of the magnetic fixing device is the magnetic material. The sidewall frame is mounted on the magnetic material. The magnet at the top of the liquid bladder moves up and down along the sidewall frame according to the attraction of the magnetic material or the attraction of the magnet in the external heat dissipation device to control whether it contacts the rear shell.

7. The system according to claim 4, characterized in that, The hydraulic fixing device includes a retractable liquid bladder and a liquid compression pump. The hydraulic fixing device is mounted on the motherboard. The top of the liquid bladder is made of thermally conductive material. The internal heat dissipation device is attached to the surface of the thermally conductive material. The liquid compression pump is used to draw or press the liquid in the liquid bladder to control whether it contacts the rear shell. or, The hydraulic fixing device includes a retractable liquid bladder and a liquid compression pump. The hydraulic fixing device is mounted on the main board. The top of the liquid bladder is made of thermally conductive material. The internal heat dissipation device is connected to the liquid bladder. The liquid compression pump is used to draw or press the liquid in the liquid bladder to control whether it contacts the rear shell.

8. The system according to claim 4, characterized in that, The spring-type fixing device includes a spring and a retractable liquid bladder. The spring-type fixing device is mounted on the motherboard. The top of the liquid bladder is made of thermally conductive material. The internal heat dissipation device is attached to the surface of the thermally conductive material. The spring is used to contract or extend to control whether it contacts the rear shell. or, The spring-type fixing device includes a spring and a retractable liquid bladder. The spring-type fixing device is mounted on the motherboard. The top of the liquid bladder is made of thermally conductive material. The internal heat dissipation device is connected to the liquid bladder. The spring is used to contract or extend to control whether it contacts the rear shell.

9. The system according to claim 4, characterized in that, The electric motor type fixing device includes an electric motor, a telescopic rod arm, and a telescopic liquid bladder. The electric motor type fixing device is mounted on the main board. The top of the liquid bladder is made of thermally conductive material. The internal heat dissipation device is attached to the surface of the thermally conductive material. The electric motor is used to retract or extend the rod arm to control whether it contacts the rear shell. or, The electric motor-type fixing device includes an electric motor, a telescopic rod arm, and a telescopic liquid bladder. The electric motor-type fixing device is mounted on the main board. The top of the liquid bladder is made of thermally conductive material. The internal heat dissipation device is connected to the liquid bladder. The electric motor is used to retract or extend the rod arm to control whether it contacts the rear shell.

10. The system according to claim 1, characterized in that, The position adjustment device is used to transfer the heat to the rear shell when the detection device detects that the external heat dissipation device is installed on the rear shell, so as to dissipate heat through the external heat dissipation device.

11. The system according to claim 1, characterized in that, The position adjustment device is used to avoid contact with the rear shell when the detection device detects that the external heat dissipation device is not installed on the rear shell, so as to dissipate heat through the internal heat dissipation device.

12. The system according to claim 1, characterized in that, Including one of the following: When the internal heat dissipation device is a graphite sheet, the processor is used to transmit the processor's temperature information to the external heat dissipation device via Bluetooth in order to adjust the fan rotation speed of the external heat dissipation device. When the internal heat dissipation device is a graphite sheet and the detection device is an NFC coil, the detection device is used to transmit the temperature information to the external heat dissipation device containing the NFC coil in order to adjust the fan rotation speed of the external heat dissipation device. When the internal heat dissipation device is a liquid-cooled heat conduction device, the processor is used to adjust the liquid circulation speed of the liquid-cooled heat conduction device according to the temperature information, and / or transmit the temperature information to the external heat dissipation device via Bluetooth to adjust the fan rotation speed of the external heat dissipation device. When the internal heat dissipation device is a liquid-cooled heat conduction device and the detection device is an NFC coil, the processor is used to adjust the liquid circulation speed of the liquid-cooled heat conduction device according to the temperature information, and / or transmit the temperature information to an external heat dissipation device containing an NFC coil through the NFC coil to adjust the fan rotation speed of the external heat dissipation device.

13. A heat dissipation method for a mobile terminal, characterized in that, include: Inspect the installation status of the external heat dissipation device on the back cover of the mobile terminal; When the external heat dissipation device is installed on the rear shell, heat is transferred to the rear shell so that it can be dissipated through the external heat dissipation device. In the absence of the external heat dissipation device installed on the rear shell, the heat is not transferred to the rear shell, but is dissipated through the internal heat dissipation device.

14. An electronic device, characterized in that, The electronic device includes the system described in any one of claims 1 to 12.

15. A computer program product comprising a computer program that, when executed by a processor, implements the steps of the method of claim 13.

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