Microstructure holographic anti-counterfeiting UV plate making method and system

Abstract

The invention relates to the technical field of anti-counterfeit printing, in particular to a microstructure holographic anti-counterfeit UV plate making method and system.The method comprises the steps that the focusing depth and the installation position of a target layout image are collected through a target CCD camera, a light path positioning model is constructed, and accurate mapping of image pixel microstructure coordinates and physical positions in a three-dimensional plate making coordinate system is achieved; the layout range and the micro-unit size of the UV printing plate are determined by combining the depth characteristics of the microstructure in the target range and the light path positioning model; and based on a light path positioning model with aberration correction, each micro-unit is accurately projected to a target layout image, and a corresponding holographic anti-counterfeiting UV printing plate is generated. According to the method, through combination of depth perception, coordinate mapping and aberration correction, automatic positioning and self-adaptive division of microstructure plate making are realized, projection definition and curing consistency are improved, the problems of positioning deviation, pattern distortion and edge blurring in traditional plate making are solved, and the precision, identification degree and anti-counterfeiting performance of holographic anti-counterfeiting patterns are improved.

Description

Technical Field

[0001] This invention relates to the field of anti-counterfeiting printing technology, and in particular to a microstructure holographic anti-counterfeiting UV plate-making method and system. Background Technology

[0002] In the field of anti-counterfeiting printing, microstructure holographic UV plate-making technology is widely used because it can generate micron-level three-dimensional anti-counterfeiting patterns. Its core lies in achieving an unreplicable optical anti-counterfeiting effect through precise control of the exposure and shaping of the UV resin layer. However, traditional plate-making relies on manual adjustment of the optical system and lacks a dynamic calibration mechanism based on CCD autofocus. This results in a large deviation between the mapping of pixel coordinates and the actual physical position of the microstructure, making it difficult to meet micron-level precision requirements. Especially when processing three-dimensional microstructures with height differences, pattern distortion caused by focus shift is prone to occur. Furthermore, existing methods do not fully incorporate the depth characteristics of the microstructure (such as the maximum height difference and the distance between the camera and the plate) to calculate the effective area of ​​the plate. They often use a fixed grid to divide micro-units, causing microstructures in the edge areas to fail due to exceeding the actual exposure range, or causing uneven curing energy due to a mismatch between unit size and structural depth, affecting the consistency of the anti-counterfeiting pattern.

[0003] In addition, traditional UV plate making does not incorporate optical system aberrations (such as distortion and chromatic aberration) into the projection model, and the LED curing process lacks dynamic energy compensation that is linked to the depth of the microstructure. This results in problems such as blurred edges and loss of three-dimensional layers in the microstructure during projection curing, reducing the recognizability and anti-counterfeiting properties of holographic anti-counterfeiting.

[0004] The above content is only used to help understand the technical solution of the present invention and does not represent an admission that the above content is prior art. Summary of the Invention

[0005] The main objective of this invention is to provide a microstructure holographic anti-counterfeiting UV plate-making method and system, aiming to solve the technical problems of traditional microstructure holographic UV plate-making technology, which relies on manual optical adjustment, lacks a CCD automatic focusing dynamic calibration mechanism, does not combine microstructure depth features to calculate the plate area and fixedly divide micro units, does not incorporate optical system aberrations into the projection model, and lacks dynamic energy compensation in the LED curing process linked with the microstructure depth. These problems result in large deviations between pixel coordinates and physical positions, pattern distortion, uneven curing energy, and reduced holographic anti-counterfeiting recognition and anti-replication properties.

[0006] To achieve the above objectives, the present invention provides a microstructure holographic anti-counterfeiting UV plate-making method, the method comprising the following steps: Based on the focus depth of the target CCD camera acquiring the target plate image and the installation position of the target CCD camera, an optical path positioning model corresponding to the target CCD camera is obtained; the target CCD camera is a focusing module installed on a UV plate-making device; the optical path positioning model is used to indicate the mapping relationship between the microstructure coordinates of pixels in the target plate image and the physical position of the corresponding anti-counterfeiting microstructure in the three-dimensional plate-making coordinate system; the target plate image is obtained by the target CCD camera capturing a holographic anti-counterfeiting UV printing plate within the target range; Based on the depth characteristics of the anti-counterfeiting microstructure within the target range and the optical path positioning model, the plate area and micro-unit size corresponding to the UV printing plate are obtained; the depth characteristics of the anti-counterfeiting microstructure within the target range are determined based on the initial distance between the target CCD camera and the plate, the maximum height difference of the microstructure within the target range, and the reference position of the target CCD camera in the three-dimensional plate-making coordinate system; Based on the optical path positioning model with aberration correction corresponding to the target CCD camera, each micro-unit of the UV printing plate is projected onto the target plate image to obtain the holographic anti-counterfeiting UV printing plate corresponding to the target plate image; the micro-unit is obtained by dividing the plate area based on the size of the micro-unit.

[0007] Optionally, the step of obtaining the optical path positioning model corresponding to the target CCD camera based on the focus depth of the target image acquired by the target CCD camera and the installation position of the target CCD camera includes: Based on the focus depth of the target CCD camera acquiring the target image of the plate, the optical path calibration matrix is ​​obtained; Based on the installation position of the target CCD camera, obtain the reference coordinates of the target CCD camera in the three-dimensional plate-making coordinate system; The optical path positioning model is obtained based on the intrinsic parameter matrix of the target CCD camera, the optical path calibration matrix, and the reference coordinates of the target CCD camera in the three-dimensional plate-making coordinate system.

[0008] Optionally, obtaining the plate area and micro-unit size corresponding to the UV printing plate based on the depth features of the anti-counterfeiting microstructure within the target range and the optical path positioning model includes: Based on the optical path positioning model, the microstructure coordinates of the four boundary points of the target image and the maximum and minimum depth values ​​of the microstructure within the target area are calculated to obtain the image range. The micro-unit size is obtained based on the optical path positioning model, the average depth value of the microstructure within the target range, and the layout range.

[0009] Optionally, the step of calculating the microstructure coordinates of the four boundary points of the target image and the maximum and minimum depth values ​​of the microstructures within the target area based on the optical path positioning model to obtain the image range includes: Based on the optical path positioning model, the microstructure coordinates of the four boundary points of the target plate image and the maximum and minimum depth values ​​of the microstructure within the target range are calculated to obtain the physical coordinates of the corresponding eight structural points in the three-dimensional plate-making coordinate system. Obtain the first target coordinates corresponding to the minimum X-axis coordinate and the minimum Y-axis coordinate of the eight structural points in the three-dimensional plate-making coordinate system, and the second target coordinates corresponding to the maximum X-axis coordinate and the maximum Y-axis coordinate. The area on the printing plate plane corresponding to the rectangle whose diagonal lines are the points corresponding to the first target coordinates and the second target coordinates is determined as the plate area.

[0010] Optionally, obtaining the micro-unit size based on the optical path positioning model, the average depth value of the microstructure within the target range, and the layout range includes: A reference structure point is determined based on the first target coordinates and the average depth value, and also based on the second target coordinates and the average depth value, respectively. Based on the optical path positioning model and the coordinates of each reference structure point in the three-dimensional plate-making coordinate system, the microstructure coordinates corresponding to each reference structure point are obtained; The micro-unit size is obtained based on the first target coordinates, the second target coordinates, and the micro-structure coordinates corresponding to the two reference structural points.

[0011] Optionally, obtaining the micro-unit size based on the first target coordinates, the second target coordinates, and the micro-structure coordinates corresponding to the two reference structural points includes: Based on the minimum value of the X-axis coordinate, the maximum value of the X-axis coordinate, and the pixel span in the X-axis direction of the microstructure coordinates corresponding to the two reference structural points, the physical size of the micro-unit in the X-axis direction is obtained; Based on the minimum value of the Y-axis coordinate, the maximum value of the Y-axis coordinate, and the pixel span in the Y-axis direction of the microstructure coordinates corresponding to the two reference structural points, the physical size of the micro-unit in the Y-axis direction is obtained.

[0012] Optionally, the step of projecting each micro-unit of the UV printing plate onto the target plate image based on the optical path positioning model with aberration correction corresponding to the target CCD camera, and obtaining the holographic anti-counterfeiting UV printing plate corresponding to the target plate image, includes: The printing plate area is divided based on the micro-unit size to generate each micro-unit of the UV printing plate; Based on the optical path positioning model with aberration correction, each micro-unit is projected onto the target image to obtain the floating-point focusing coordinates corresponding to the micro-unit. The floating-point focusing coordinates are dynamically compensated by an LED light curing module to obtain the UV curing energy value of each micro-unit. Based on the UV curing energy value, the microstructure resin layer is exposed in different regions to form a holographic anti-counterfeiting microstructure with depth coding, thereby obtaining a holographic anti-counterfeiting UV printing plate corresponding to the target plate image.

[0013] Furthermore, to achieve the above objectives, the present invention also provides a microstructure holographic anti-counterfeiting UV plate-making system, the system comprising: The optical path calibration module is used to obtain the optical path positioning model corresponding to the target CCD camera based on the focusing depth of the target plate image acquired by the target CCD camera and the installation position of the target CCD camera; the target CCD camera is a focusing module installed on the UV plate-making equipment; the optical path positioning model is used to indicate the mapping relationship between the microstructure coordinates of pixels in the target plate image and the physical position of the anti-counterfeiting microstructure corresponding to the pixel in the three-dimensional plate-making coordinate system; the target plate image is obtained by the target CCD camera capturing a holographic anti-counterfeiting UV printing plate within the target range; The plate demarcation module is used to obtain the plate area and micro-unit size corresponding to the UV printing plate based on the depth characteristics of the anti-counterfeiting microstructures within the target area and the optical path positioning model; the depth characteristics of the anti-counterfeiting microstructures within the target area are determined based on the initial distance between the target CCD camera and the plate, the maximum height difference of the microstructures within the target area, and the reference position of the target CCD camera in the three-dimensional plate-making coordinate system; The projection curing module is used to project each micro-unit of the UV printing plate onto the target plate image based on the optical path positioning model with aberration correction corresponding to the target CCD camera, and obtain the holographic anti-counterfeiting UV printing plate corresponding to the target plate image; the micro-unit is obtained by dividing the plate area based on the size of the micro-unit.

[0014] Furthermore, to achieve the above objectives, the present invention also provides a microstructure holographic anti-counterfeiting UV plate-making device, the device comprising: a memory, a processor, and a microstructure holographic anti-counterfeiting UV plate-making program stored in the memory and executable on the processor, the microstructure holographic anti-counterfeiting UV plate-making program being configured to implement the steps of the microstructure holographic anti-counterfeiting UV plate-making method as described above.

[0015] In addition, to achieve the above objectives, the present invention also provides a medium storing a microstructure holographic anti-counterfeiting UV plate-making program, wherein when the microstructure holographic anti-counterfeiting UV plate-making program is executed by a processor, it implements the steps of the microstructure holographic anti-counterfeiting UV plate-making method as described above.

[0016] This invention provides a microstructure holographic anti-counterfeiting UV plate-making method. The method constructs a high-precision optical path positioning model by combining the focusing depth of the target CCD camera with its installation position. This achieves precise mapping between the pixel microstructure coordinates in the target plate image and their physical positions in the three-dimensional plate-making coordinate system, effectively overcoming the positioning deviation caused by traditional manual focusing and significantly improving the spatial consistency between microstructure imaging and plate-making. Based on microstructure depth features (including the initial distance between the CCD and the plate, the maximum height difference of the microstructure, and the camera's reference position), the effective range of the plate and the micro-unit size are dynamically calculated, avoiding edge failure and energy unevenness problems caused by fixed grid division. This makes the micro-unit division more closely match the actual structural distribution, improving the integrity and uniformity of the anti-counterfeiting pattern. The method also introduces aberration-related features. The corrected optical path positioning model models and compensates for aberrations such as distortion and chromatic aberration in the optical system, ensuring that the micro-units maintain geometric fidelity when projected onto the target image, reducing edge blurring and deformation, and improving the clarity and three-dimensionality of the holographic pattern. By accurately projecting the micro-units based on the corrected optical path model, combined with depth features, UV exposure energy control can be further linked to achieve on-demand exposure, avoiding insufficient or excessive curing due to inaccurate focusing or projection distortion, thus improving the quality of microstructure forming and the recognizability of anti-counterfeiting features. The entire plate-making process relies on automatic CCD acquisition and model driving, reducing human intervention, improving the automation and repeatability of the plate-making process, and is suitable for high-precision, large-volume anti-counterfeiting UV printing plate production, enhancing the anti-counterfeiting label's resistance to copying and security. Attached Figure Description

[0017] Figure 1 This is a flowchart illustrating an embodiment of the microstructure holographic anti-counterfeiting UV plate-making method of the present invention.

[0018] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0019] It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

[0020] Reference Figure 1 , Figure 1 This is a flowchart illustrating an embodiment of the microstructure holographic anti-counterfeiting UV plate-making method of the present invention, which presents an embodiment of the microstructure holographic anti-counterfeiting UV plate-making method of the present invention.

[0021] In one embodiment, the microstructure holographic anti-counterfeiting UV plate-making method includes: Step S100: Based on the focusing depth of the target CCD camera acquiring the target plate image and the installation position of the target CCD camera, obtain the optical path positioning model corresponding to the target CCD camera; the target CCD camera is a focusing module installed on the UV plate-making equipment; the optical path positioning model is used to indicate the mapping relationship between the microstructure coordinates of the pixels in the target plate image and the physical position of the anti-counterfeiting microstructure corresponding to the pixels in the three-dimensional plate-making coordinate system; the target plate image is obtained by the target CCD camera capturing a holographic anti-counterfeiting UV printing plate within the target range.

[0022] The target CCD camera can be a charge-coupled device (CCD) imaging device installed in the focusing module of the UV plate-making equipment, used to acquire images of the anti-counterfeiting printing plate surface. It is understood that the target CCD camera receives reflected light from the UV printing plate surface through an optical lens, generates a digital image sequence through photoelectric conversion, and its focusing capability is controlled by an automatic focusing drive mechanism. In this embodiment, the target CCD camera can include, but is not limited to, a linear CCD camera, an area CCD camera, or a multispectral CCD camera. The optical path positioning model can be a mathematical function model that establishes the mapping relationship between pixel coordinates and the physical point positions in the three-dimensional plate-making coordinate system. Its purpose is to achieve a nonlinear coordinate correspondence between two-dimensional image pixels and three-dimensional physical structures. It is understood that the optical path positioning model is obtained based on the focusing depth and installation position parameters of the CCD camera, combined with geometric optics principles, mapping the image plane coordinates to three-dimensional spatial coordinates through a pinhole model or distortion correction model. For example, the optical path positioning model can adopt an ideal pinhole projection model, a perspective projection model, or an affine projection model. The depth of focus can be the axial distance between the lens of the CCD camera and the surface of the object being photographed when the image is clear. It is obtained by the autofocus module searching for the optimal imaging position in real time. The mounting position can be the spatial coordinates and attitude angle of the target CCD camera in the three-dimensional plate-making coordinate system. It is obtained through mechanical calibration during equipment assembly or by measurement with a laser tracker. Furthermore, "obtaining the optical path positioning model corresponding to the target CCD camera based on the depth of focus of the target plate image acquired by the target CCD camera and the mounting position of the target CCD camera" can be achieved by using the depth of focus as a Z-axis reference value, combined with the mounting position parameters, and using a geometric projection formula to convert the image pixel coordinates into three-dimensional spatial coordinates. Further, this operation can be performed by using a pinhole camera model + linear transformation, combined with a calibration plate to obtain the intrinsic parameter matrix, to achieve a rigid transformation from pixels to spatial points, thereby establishing a reversible mapping relationship between the image plane and physical space.

[0023] Step S200: Based on the depth features and optical path positioning model of the anti-counterfeiting microstructures within the target range, obtain the plate area and micro-unit size corresponding to the UV printing plate; the depth features of the anti-counterfeiting microstructures within the target range are determined based on the initial distance between the target CCD camera and the plate, the maximum height difference of the microstructures within the target range, and the reference position of the target CCD camera in the three-dimensional plate-making coordinate system.

[0024] The depth characteristics of the anti-counterfeiting microstructures within the target area can be determined based on the initial distance between the target CCD camera and the printing plate, the maximum height difference of the microstructures within the target area, and the reference position of the target CCD camera in the three-dimensional printing plate coordinate system. The initial distance is the nominal axial distance between the CCD camera lens reference plane and the UV printing plate surface in an unfocused state, obtained through mechanical positioning of the equipment or measurement by a laser rangefinder. The maximum height difference is the vertical distance between the highest and lowest points of the microstructures within the target area, calculated by reconstructing the three-dimensional morphology from the target plate image using multi-focus image stacking or structured light scanning. The reference position can be the coordinates of a reference point of the target CCD camera in the three-dimensional printing plate coordinate system, typically obtained by calibrating the principal point of the camera lens or the sensor center in the equipment coordinate system. The printing plate area can be the actual boundary of the region on the UV printing plate where microstructures can be effectively formed, determined through geometric calculation based on the initial distance, maximum height difference, and camera reference position, defining the physical area capable of clear imaging and effective exposure. The micro-unit size can be the planar geometric scale of a single micro-unit used to divide the printing plate area. It is obtained by calculating the focusing depth gradient of a local region based on depth features, making the micro-unit size inversely proportional to the height difference. Furthermore, based on the depth features and optical path positioning model of the anti-counterfeiting microstructure within the target area, obtaining the printing plate area and micro-unit size corresponding to the UV printing plate can be achieved by calculating the boundary of the focusable area based on the initial distance, maximum height difference, and reference position, and dynamically adjusting the micro-unit division density according to the height difference gradient. Further, this operation can be further enhanced by constructing a height-focusing depth mapping table using depth features, setting an effective focusing threshold, and cropping the pixel area in the image that satisfies clear imaging as the printing plate area. This enables intelligent cropping of the effective printing plate area and structural adaptation of the micro-unit size.

[0025] Step S300: Based on the optical path positioning model with aberration correction corresponding to the target CCD camera, project each micro-unit of the UV printing plate onto the target plate image to obtain the holographic anti-counterfeiting UV printing plate corresponding to the target plate image; the micro-unit is obtained by dividing the plate area based on the size of the micro-unit.

[0026] The aberration-corrected optical path positioning model can be an enhanced spatial mapping model that incorporates optical system distortion and chromatic aberration compensation functions based on the basic optical path positioning model. This model is obtained by acquiring imaging data of multiple known geometric patterns using a calibration plate, fitting radial distortion coefficients, tangential distortion coefficients, and chromatic aberration shift parameters, and constructing a nonlinear correction function. Micro-units can be local regions divided into areas of a specified size on the printing plate, with each area corresponding to an independent UV exposure control unit. These micro-units are obtained by regularly or adaptively dividing the printing plate area into grids based on the micro-unit size. Furthermore, based on the aberration-corrected optical path positioning model corresponding to the target CCD camera, projecting each micro-unit of the UV printing plate onto the target plate image can be achieved by back-mapping the expected morphology of each micro-unit to the image space using a corrected projection model, generating a corrected exposure mask. This operation can further ensure that the projected geometry of the microstructure in the image space is consistent with the physical design by applying a distortion compensation function to each micro-unit in the image space and then generating a corresponding UV intensity distribution template through inverse projection transformation.

[0027] Taking the batch UV plate-making of high-security anti-counterfeiting labels as an example, the microstructure holographic anti-counterfeiting UV plate-making method in this embodiment can be as follows: When printing companies produce high-security currency anti-counterfeiting labels, the surface of the printing plate contains complex three-dimensional relief microstructures with a height difference of up to 15 micrometers. After the system is started, the CCD camera first measures the initial distance between the lens and the printing plate, then automatically focuses and acquires multi-layer images to reconstruct the maximum height difference and morphological distribution of the microstructure. Based on this, the system dynamically divides the edge gradient area and the center effective area. The micro-unit size shrinks to 5 micrometers in the height difference area and expands to 20 micrometers in the flat area. At the same time, the system obtains distortion and color difference parameters through a calibration plate, constructs a corrected optical path model, and projects the design pattern in reverse into the image space to generate a compensated exposure mask. During the exposure stage, the UVLED array compensates for energy according to the micro-unit depth, increasing the exposure by 50% in the height difference area and decreasing it by 30% in the flat area. The entire process requires no manual intervention, completing the synchronous plate-making of hundreds of printing plates. All microstructure edges are clear, the three-dimensional layers are complete, and there are no edge failures or uneven energy phenomena.

[0028] This embodiment provides a microstructure holographic anti-counterfeiting UV plate-making method. It constructs an optical path positioning model by acquiring the focusing depth and installation position of a target CCD camera, achieving precise mapping between pixel coordinates and three-dimensional physical positions. Based on the initial distance, maximum height difference, and reference position, it dynamically calculates the plate area and micro-unit size, ensuring the micro-unit division conforms to the actual structural depth distribution. An optical path positioning model with distortion and color difference correction is introduced to compensate for imaging geometric distortion. The corrected model accurately projects micro-units and links them with UV exposure energy control, achieving differentiated curing based on depth heterogeneity. These steps, by establishing a reversible correlation between image space and physical space, eliminating edge failures caused by fixed grids, eliminating optical system distortion interference, and achieving synchronous matching of curing depth and hardness, can improve the consistency of anti-counterfeiting pattern imaging and its resistance to replication.

[0029] In one embodiment, based on the focus depth of the target CCD camera's captured image of the target panel and the installation position of the target CCD camera, an optical path positioning model corresponding to the target CCD camera is obtained, including: The optical path calibration matrix is ​​obtained by acquiring the focus depth of the target plate image using the target CCD camera.

[0030] The optical path calibration matrix can be a numerical matrix used to compensate for imaging plane offset and nonlinear distortion of pixel coordinates caused by changes in depth of field. It is generated by acquiring multiple sets of images of known geometric patterns at different focusing depths, calculating the deviation between pixel coordinates and theoretical spatial positions, fitting a calibration function, and discretizing it into matrix form. It is understood that the optical path calibration matrix can be generated by fitting multiple sets of pixel error data acquired in the focusing depth variation experiment, and stored in polynomial or lookup table form. In this embodiment, the optical path calibration matrix can be one or more of the following, including but not limited to a focusing depth-pixel offset matrix, a focusing depth-distortion coefficient matrix, and a focusing depth-scale scaling matrix.

[0031] This operation can be achieved by acquiring standard pattern images at multiple depths of focus, calculating the deviation between pixel coordinates and theoretical positions at each depth, fitting a calibration function, and discretizing it into a matrix. Furthermore, this operation can be further performed by capturing images at five equally spaced depths of focus using a checkerboard pattern, performing sub-pixel localization of corner points in each image, calculating their offset vectors relative to the ideal positions, and constructing a three-dimensional calibration matrix through polynomial interpolation. This allows for a dynamic response of the optical path model to changes in depth of field, overcoming the limitations of traditional static calibration and improving the adaptability of coordinate mapping to structures at different heights.

[0032] Based on the installation position of the target CCD camera, obtain the reference coordinates of the target CCD camera in the three-dimensional plate-making coordinate system.

[0033] The reference coordinates can be the spatial coordinates of a reference point of the target CCD camera in a three-dimensional plate-making coordinate system, determined by measuring the three-dimensional position and attitude angles of the camera mounting base using a laser tracker or a high-precision mechanical calibration system. It can be understood that the reference coordinates can be combined with the three-dimensional spatial coordinates and attitude angle measurement results of the camera mounting base to determine its absolute coordinates in the device coordinate system. In this embodiment, the reference coordinates can be one or more of the following, including but not limited to optical center reference coordinates, sensor center reference coordinates, and mechanical mounting point reference coordinates.

[0034] This operation can be performed by measuring the three-dimensional spatial coordinates and attitude angles of the camera mounting base using a mechanical calibration system, and using these as reference points. Furthermore, this operation can be performed by using a laser tracker to spatially locate three known marker points on the camera housing while the device is stationary, and then calculating the camera center coordinates using a three-point positioning algorithm. This establishes a rigid body relationship between the image coordinate system and the physical plate-making space, ensuring global consistency of coordinate transformations.

[0035] Based on the intrinsic parameter matrix of the target CCD camera, the optical path calibration matrix, and the reference coordinates of the target CCD camera in the three-dimensional plate-making coordinate system, the optical path positioning model is obtained.

[0036] The intrinsic parameter matrix can be a set of parameters describing the inherent optical and imaging characteristics of the target CCD camera, including focal length, principal point coordinates, pixel aspect ratio, and lens distortion coefficient. It is solved using the Zhang Zhengyou calibration method or a nonlinear optimization algorithm, obtained by capturing images from multiple viewpoints with a calibration board. Understandably, the intrinsic parameter matrix, combined with focal length, principal point coordinates, and distortion coefficient parameters, serves as the fundamental projection function of the optical path positioning model, providing a mathematical transformation relationship between pixel coordinates and the ideal pinhole model.

[0037] This operation can be achieved by using the intrinsic parameter matrix as the basic projection function, the optical path calibration matrix as the focus depth correction term, and the reference coordinates as the origin of the coordinate system transformation, combining them into a complete pixel-to-spatial coordinate mapping model. Furthermore, this operation can be further enhanced by constructing a hierarchical transformation chain: pixel coordinates → normalized coordinates (inverse intrinsic parameter transformation) → correction coordinates (optical path calibration matrix correction) → world coordinates (reference coordinate translation and rotation), thereby forming a globally adaptive optical path positioning model that achieves precise mapping from sub-micron pixels to physical space.

[0038] Taking the intelligent plate-making of highly dynamic microstructure anti-counterfeiting printing plates as an example, the microstructure holographic anti-counterfeiting UV plate-making method in this embodiment can be as follows: When preparing high-security anti-counterfeiting labels with complex stepped micro-reliefs, the height difference on the printing plate surface continuously varies between 5 and 25 micrometers. The system first acquires standard grid images of the camera at 5 focusing depths, calculates the pixel coordinate offset at each depth, and generates an optical path calibration matrix related to the focusing depth. Subsequently, the system accurately obtains the reference coordinates of the camera in the device coordinate system through a laser tracker and completes the high-precision calibration of the intrinsic parameter matrix. The three are integrated to construct a dynamic optical path positioning model, realizing sub-micrometer-level mapping from any pixel to three-dimensional space. During the plate-making process, the system automatically calls the corresponding calibration matrix according to the current imaging focusing depth to ensure that the microstructure boundary can be accurately located in areas with high and low height differences. In the projection stage, the model reverses the designed 3D relief structure to the image space and superimposes distortion and color difference compensation to generate a high-fidelity exposure mask. The UV light source outputs energy according to the depth linkage of the micro-units, enhancing exposure in areas with high height differences and reducing power in flat areas. The entire process requires no manual focusing, the error in a single plate-making process is less than 0.5 micrometers, and the sharpness of the pattern edges and the three-dimensional layering are significantly better than traditional methods.

[0039] This embodiment obtains the optical path calibration matrix based on the focusing depth of the target plate image acquired by the target CCD camera, obtains the reference coordinates by combining the installation position of the target CCD camera, and then constructs an optical path positioning model based on the intrinsic parameter matrix, the optical path calibration matrix, and the reference coordinates. The optical path calibration matrix dynamically responds to changes in depth of field, the intrinsic parameter matrix provides a basic projection reference, and the reference coordinates complete the coordinate system alignment. The three are integrated to form a differentiable and iterative global mapping model, thereby achieving the following technical effects: For the first time in the field of UV plate making, a dynamic calibration mechanism driven by focusing depth is realized, completely getting rid of the static defects of traditional fixed calibration; It supports real-time adaptive mapping and serves as the projection basis with aberration correction, so that micro-units still maintain geometric fidelity in complex morphological regions; It supports dynamic calculation of micro-unit size and plate range, implemented under precise spatial coordinate constraints, eliminating edge failure and energy imbalance; Finally, it achieves "form-energy" synergy between projection and exposure control, so that the consistency of microstructure forming, edge sharpness, and three-dimensional layering meet industrial-grade precision requirements, providing core algorithm support for fully automated, highly repeatable anti-counterfeiting printing plate production.

[0040] In one embodiment, based on the depth features and optical path positioning model of the anti-counterfeiting microstructures within the target area, the plate area and micro-unit size corresponding to the UV printing plate are obtained, including: Based on the optical path positioning model, the microstructure coordinates of the four boundary points of the target image and the maximum and minimum depth values ​​of the microstructure within the target area are calculated to obtain the image range.

[0041] The microstructure coordinates of the four boundary points of the target page image can be the three-dimensional physical coordinates corresponding to the four corner pixels of the target page image, transformed by the optical path positioning model. It can be understood that the microstructure coordinates of the four boundary points of the target page image can be used to accurately define the actual projected boundaries of the image coverage area in physical space, serving as the geometric basis for page area cropping. Furthermore, the microstructure coordinates of the four boundary points of the target page image can include, but are not limited to, one or more of the following: upper left boundary point coordinates, upper right boundary point coordinates, lower right boundary point coordinates, and lower left boundary point coordinates.

[0042] The maximum depth value can be the highest absolute position value of all microstructure points within the target area along the Z-axis in the three-dimensional plate-making coordinate system. It can be understood that the maximum depth value, combined with the minimum depth value, can define the three-dimensional height range of the microstructure, used to determine the effective Z-axis boundary of the plate area. Furthermore, the maximum depth value can be one or more of the following: a local maximum depth value, a global maximum depth value, or a regional peak depth value.

[0043] The minimum depth value can be the lowest absolute position value of all microstructure points within the target area along the Z-axis in the three-dimensional plate-making coordinate system. It can be understood that the minimum depth value, together with the maximum depth value, constitutes a depth range interval used to determine the start and end planes of the effective exposure area. Furthermore, the minimum depth value can be, but is not limited to, one or more of the following: local minimum depth value, global minimum depth value, and regional valley depth value.

[0044] Based on the optical path localization model, the microstructure coordinates of the four boundary points of the target image and the maximum and minimum depth values ​​of the microstructures within the target area are calculated. Obtaining the image's extent involves mapping the four corner pixels of the image to three-dimensional spatial coordinates using the optical path localization model, forming a quadrilateral bounding box. Combining the maximum and minimum depth values, the Z-axis interval where the microstructures effectively exist is determined. Within this interval, the region overlapping the bounding box in three-dimensional space is extracted as the image's extent. Furthermore, this operation can be performed using a three-dimensional polygon clipping algorithm. The planar quadrilateral formed by the four corner mapping points intersects with a parallel plane defined by the maximum / minimum depth values, outputting a set of vertices for the effective three-dimensional region. This allows for non-rectangular, adaptive clipping of the image's extent, ensuring that only the effective exposure area of ​​the actually existing microstructures is retained.

[0045] The micro-unit size is obtained based on the optical path positioning model, the average depth value of the microstructure within the target range, and the area of ​​the plate.

[0046] The average depth value can be the arithmetic mean height of all microstructure points within the target area along the Z-axis in the three-dimensional plate-making coordinate system. It can be understood that the average depth value reflects the overall height trend of the local structure, serving as a benchmark for adaptive adjustment of micro-unit dimensions. Furthermore, the average depth value can include, but is not limited to, one or more of the following: local average depth value, global average depth value, and weighted average depth value.

[0047] Based on the optical path positioning model, the average depth value of the microstructure within the target area, and the layout area, the micro-unit size can be obtained by using the layout area as the effective region and calculating the gradient response of local structural height changes in conjunction with the average depth value. The micro-unit size can then be set as a function output that is non-linearly inversely proportional to the average depth value. Furthermore, this operation can be performed by substituting the average depth value into a preset size-depth mapping function, such as d_unit = k / (d_avg + ε), where k is a scaling factor and ε is a smoothing constant, outputting the corresponding micro-unit side length. This allows the micro-unit size to dynamically change with the local average structural height, using smaller units in high average depth areas to improve morphological resolution and larger units in low average depth areas to improve exposure efficiency.

[0048] Taking the high-precision automated plate-making of complex embossed anti-counterfeiting printing plates as an example, the microstructure holographic anti-counterfeiting UV plate-making method in this embodiment can be as follows: When manufacturing banknote anti-counterfeiting printing plates with irregular three-dimensional embossed patterns, the microstructures on the plate surface exhibit a non-uniform distribution with a high center and low edges. The system first maps the four corner pixels of the target plate image to three-dimensional space through an optical path positioning model to obtain the coordinates of the quadrilateral boundary points, and simultaneously extracts the maximum depth value (18μm) and minimum depth value (2μm) of the microstructures within the region. Based on this, the system retains only the physical region with Z coordinates between 2μm and 18μm, and cuts out the non-rectangular, effective exposure area that fits the embossed outline, excluding invalid areas with no edge structure. Subsequently, the average depth value of this region is calculated to be 11μm, and the microunit size is obtained as 1.3mm according to the preset function d_unit = 15 / (d_avg + 1). In the central region with a higher average depth, the local average depth reaches 16 μm, corresponding to a micro-unit size reduced to 0.9 mm; in the low-depth edge region, the average depth is 5 μm, and the micro-unit size increases to 2.1 mm. This adaptive partitioning ensures improved resolution in areas of height difference and reduced exposure time in flat areas. Combined with aberration-corrected projection and on-demand energy compensation, the resulting relief structure exhibits sharp edges, distinct layers, and no over- or under-curing, with overall consistency superior to traditional fixed-mesh schemes.

[0049] This embodiment calculates the microstructure coordinates of the four boundary points of the target image and the maximum and minimum depth values ​​of the microstructures within the target area using an optical path positioning model to obtain the image area. It also obtains the micro-unit size based on the optical path positioning model, the average depth value of the microstructures within the target area, and the image area. The former enables non-rectangular, adaptive cropping of the image area, ensuring that only the effective exposure area of ​​the actual microstructure is retained. The latter allows the micro-unit size to spatially adapt to the average height gradient of the local structure, thereby eliminating the invalid exposure and edge failure problems caused by traditional fixed rectangular area division. It also improves the resolution of areas with height differences and the exposure efficiency of flat areas, forming a closed-loop plate-making system integrating "morphology perception—spatial partitioning—energy control," significantly improving the integrity, uniformity, and three-dimensional layer fidelity of microstructure formation.

[0050] In one embodiment, based on an optical path positioning model, the microstructure coordinates of the four boundary points of the target image and the maximum and minimum depth values ​​of the microstructures within the target area are calculated to obtain the image area, including: Based on the optical path positioning model, the microstructure coordinates of the four boundary points of the target plate image and the maximum and minimum depth values ​​of the microstructure within the target range are calculated to obtain the physical coordinates of the corresponding eight structural points in the three-dimensional plate-making coordinate system.

[0051] The eight structural points can be eight three-dimensional spatial coordinate points generated by mapping the pixel coordinates of the four boundary points of the target plate image with the maximum and minimum depth values ​​of the microstructure through an optical path positioning model. Further, the eight structural points can include, but are not limited to, one or more of the following: a set of high points on the boundary, a set of low points below the boundary, and extreme depth pairs at corner points. In this embodiment, each boundary point corresponds to a two-dimensional pixel coordinate in the image. By combining the maximum and minimum depth values ​​with the optical path positioning model, the two extreme physical points on the Z-axis at that location are calculated, forming four sets × two depths = eight three-dimensional points. This operation can map the image pixel coordinates to three-dimensional space through the optical path positioning model, thereby achieving a complete spatial representation of the three-dimensional contour of the microstructure at the edge of the printing plate. Furthermore, this operation can be achieved by using a dual-depth mapping method or a parametric projection equation, thus providing high-precision geometric input for subsequent accurate definition of the effective exposure area.

[0052] Obtain the first target coordinates corresponding to the minimum X-axis coordinate and the minimum Y-axis coordinate of the eight structural points in the three-dimensional plate-making coordinate system.

[0053] The first target coordinate can be a three-dimensional spatial point corresponding to the minimum X-axis coordinate and the minimum Y-axis coordinate among the eight structural points. Further, the first target coordinate can be one or more of the following: the lower left reference point, the minimum projection corner point, and the starting boundary coordinates. In this embodiment, the coordinate is obtained by extracting the X and Y coordinates of all points from the three-dimensional coordinate set of the eight structural points, taking their minimum values, and combining them to form a two-dimensional projection reference point. This operation can be implemented using a sorting and filtering method or parallel extreme value calculation, thereby achieving the technical effect of accurately locating the lower left boundary of the layout area on the horizontal plane and ensuring that no effective microstructures are missed.

[0054] Obtain the second target coordinates corresponding to the maximum value of the X-axis coordinate and the maximum value of the Y-axis coordinate among the eight structural points in the three-dimensional plate-making coordinate system.

[0055] The second target coordinate can be a three-dimensional spatial point corresponding to the maximum X-axis coordinate and the maximum Y-axis coordinate among the eight structural points. Further, the second target coordinate can be one or more of the following: the upper right corner reference point, the maximum projection corner point, and the termination boundary coordinates. In this embodiment, the coordinate is obtained by extracting the X and Y coordinates of all points from the three-dimensional coordinate set of the eight structural points, taking their respective maximum values, and combining them into a two-dimensional projection reference point. This operation can be implemented using a maximum value extraction algorithm or vector operations, thereby achieving the technical effect of accurately locating the upper right boundary of the layout on the horizontal plane and ensuring complete coverage of all effective microstructures.

[0056] The area on the printing plate plane corresponding to the rectangle whose diagonal lines are the points corresponding to the first and second target coordinates is defined as the plate area.

[0057] The printing plate plane can be a two-dimensional plane containing the surface of the UV printing plate, with its normal direction aligned with the Z-axis of the three-dimensional plate-making coordinate system. Furthermore, this plane serves as a reference plane for the projection of the plate area, and all XY coordinates are projected and calculated on this plane. In this embodiment, the operation can be performed by treating the first and second target coordinates as the diagonal vertices of a rectangle, constructing a rectangular region on the printing plate plane (Z = constant). This operation can be implemented using a two-dimensional projection method or a boundary clipping method, thereby achieving the technical effect of transforming the plate area from a traditional fixed-view rectangle to a rectangle based on the circumscribed boundary of a real microstructure, ensuring a 1:1 match between the exposure area and the physical structural space.

[0058] ---Taking the intelligent layout definition of a non-uniform three-dimensional relief anti-counterfeiting printing plate as an example, the microstructure holographic anti-counterfeiting UV plate-making method in this embodiment can be as follows: When manufacturing a complex relief anti-counterfeiting printing plate with a high center and gradually decreasing edges, the system first uses an optical path positioning model to combine the four corner pixels of the image with the maximum depth value (18μm) and the minimum depth value (3μm) respectively, mapping out eight three-dimensional structural points (each corner point generates a high point and a low point). Among these points, the minimum X-axis value is extracted to be 12.5mm and the minimum Y-axis value is extracted to be 8.2mm, forming the first target coordinates (12.5, 8.2, Z); the maximum X-axis value is extracted to be 87.3mm and the maximum Y-axis value is extracted to be 61.8mm, forming the second target coordinates (87.3, 61.8, Z). Using these two coordinates as diagonals, a rectangular area is generated on the printing plate plane. This rectangle completely surrounds the XY projection of all microstructures, while the traditional method, because it is bounded by the image field of view, will have its rectangle extend to the unstructured area on the left and below (about 15% of the area is invalid). The new method uses this eight-point extreme value method to precisely crop the layout area to a region containing only effective microstructures, reducing the area by 18% without omitting any effective structures. Subsequent micro-unit sizes are adaptively divided based on this region and the average depth value, ensuring that each unit is located above the true structure, with no false exposures or missing edges.

[0059] This embodiment calculates the microstructure coordinates of four boundary points of the target plate image and the maximum and minimum depth values ​​of the microstructure within the target range based on an optical path positioning model, obtaining the physical coordinates of eight structural points in a three-dimensional plate-making coordinate system. Further, it constructs the first and second target coordinates by extracting the extreme coordinates of the X and Y axes. Finally, it determines the plate area on the printing plate plane using the two coordinates as diagonals, achieving the following technical effects: The optical path positioning model, combined with depth extreme values, reconstructs eight three-dimensional structural points, fully representing the three-dimensional contour boundaries of the microstructure; the extreme coordinates construct an circumscribed rectangle, eliminating invalid exposure or edge omissions caused by a fixed field of view in traditional methods; combined with subsequent adaptive zoning and energy linkage control, it achieves precise matching between the exposure area and the physical structure space, improving pattern integrity, three-dimensional layer fidelity, and anti-counterfeiting properties; simultaneously, through CCD image and model-driven operation, it achieves high precision, automation, and repeatability in the plate-making process, providing a core technological foundation for industrial-grade anti-counterfeiting printing plate production.

[0060] In one embodiment, the micro-unit size is obtained based on the optical path positioning model, the average depth value of the microstructure within the target range, and the area of ​​the display panel, including: A reference structure point is determined based on the coordinates and average depth of the first target, and also based on the coordinates and average depth of the second target. The reference structural point can be a representative three-dimensional point constructed from the first or second target coordinates and the average depth value at the diagonal endpoint of the page area, representing the typical microstructure morphology at that location. It can be understood that the reference structural point can use the first or second target coordinates as the XY plane position and the average depth value as the Z coordinate to form a three-dimensional point with both spatial position and structural depth characteristics. Furthermore, the reference structural point can include, but is not limited to, one or more of the following: a starting reference structural point, an ending reference structural point, and a diagonal reference structural point. In this embodiment, the reference structural point serves as a representative sample of the depth response within the page area, used to establish a bidirectional mapping between three-dimensional structural features and two-dimensional image microstructure coordinates, supporting the dynamic calculation of micro-unit dimensions.

[0061] Determining a reference structural point based on the first target coordinates and average depth value, and based on the second target coordinates and average depth value, can be achieved by combining the first target coordinates (X_min, Y_min) with the average depth value to form a three-dimensional point P1 = (X_min, Y_min, d_avg), and combining the second target coordinates (X_max, Y_max) with the average depth value to form a three-dimensional point P2 = (X_max, Y_max, d_avg). Furthermore, this operation can be implemented using fixed Z-interpolation or weighted depth interpolation, thereby constructing representative structural depth sample points at both diagonal ends of the page layout. This allows the calculation of micro-unit dimensions to no longer rely on global averaging, but instead introduces the joint features of spatial location and depth.

[0062] Based on the optical path positioning model and the coordinates of each reference structural point in the three-dimensional plate-making coordinate system, the microstructure coordinates corresponding to each reference structural point are obtained.

[0063] The coordinates of the reference structural point in the 3D plate-making coordinate system can be the X, Y, and Z three-dimensional spatial coordinates of the reference structural point, generated by combining the first target coordinates (X_min, Y_min) or the second target coordinates (X_max, Y_max) with the average depth value (d_avg), i.e., Z = d_avg. It can be understood that the coordinates of the reference structural point in the 3D plate-making coordinate system can be used as input to the optical path positioning model for reverse mapping to image space to obtain its corresponding pixel position. Furthermore, the coordinates of the reference structural point in the 3D plate-making coordinate system can include, but are not limited to, one or more of the following: starting point 3D coordinates, ending point 3D coordinates, and diagonal reference 3D coordinates.

[0064] The microstructure coordinates corresponding to the reference structural point can be the two-dimensional pixel coordinates of the reference structural point in the target image after back projection through the optical path positioning model. It can be understood that the microstructure coordinates corresponding to the reference structural point reflect the true projected position of the reference structural point in the imaging space, and are used to quantify the spatial gradient of the structural response within the image area. Furthermore, the microstructure coordinates corresponding to the reference structural point can include, but are not limited to, one or more of the following: starting microstructure coordinates, ending microstructure coordinates, and diagonally mapped pixels.

[0065] Based on the optical path positioning model and the coordinates of each reference structural point in the 3D plate-making coordinate system, obtaining the microstructure coordinates corresponding to each reference structural point can be achieved by inputting the 3D coordinates of the reference structural point into the inverse transformation function of the optical path positioning model, and outputting its pixel coordinate position in the target plate image. Furthermore, this operation can be implemented using analytical inverse projection or numerical iteration methods, thereby achieving precise backtracking of the 3D structural points to the 2D image space and establishing a quantitative correlation between structural depth features and image response positions.

[0066] The micro-unit size is obtained based on the coordinates of the first target, the coordinates of the second target, and the micro-structure coordinates corresponding to the two reference structural points.

[0067] Based on the coordinates of the first target, the coordinates of the second target, and the microstructure coordinates corresponding to two reference structural points, the micro-unit size can be obtained by calculating the Euclidean distance between the first and second target coordinates in the XY plane as the diagonal length of the image plane, and calculating the pixel distance between the microstructure coordinates corresponding to the two reference structural points in the image as the depth response length. The ratio of these two distances is used as a scaling factor to dynamically adjust the side length of the micro-unit. Furthermore, this operation can be achieved by using a scaling method or a gradient response method, so that the micro-unit size is not only determined by the geometric range of the image plane, but also by the modulation of the response intensity of the local structure in the imaging space, achieving a collaborative adaptive partitioning of the spatial and depth dimensions.

[0068] Taking the intelligent micro-unit generation of a highly complex three-dimensional relief anti-counterfeiting printing plate as an example, the microstructure holographic anti-counterfeiting UV plate-making method in this embodiment can be as follows: When making a complex relief anti-counterfeiting printing plate with a central bulge and gently sloping edges, the plate area is defined by the first target coordinates (12.5mm, 8.2mm) and the second target coordinates (87.3mm, 61.8mm), and its diagonal physical length is 82.6mm. The system constructs reference structure points at both ends: P1 = (12.5, 8.2, 11μm), P2 = (87.3, 61.8, 11μm). Through inverse mapping of the optical path positioning model, the image pixel corresponding to P1 is obtained as (45, 38), and the pixel corresponding to P2 is obtained as (782, 590). The pixel distance between the two points in the image is 752 pixels. The system calculates the scale factor as 82.6mm / 752px = 0.11mm / px, and sets the basic unit size to 0.5mm. The final micro-unit size is 0.5mm × (752 / 826) = 0.45mm. In the central area of ​​the layout, where the structural height changes gradually and the reference point mapping pixel difference is small, the micro-unit size increases to 0.6mm. In areas with steep edge changes, where the reference point mapping pixel difference is large, the micro-unit size shrinks to 0.3mm. This mechanism allows the micro-units to automatically adapt to the local structural change rate, achieving sub-micron resolution in high-gradient areas and improving exposure efficiency in flat areas. Combined with precise layout cropping and energy linkage, the edges of the microstructure across the entire layout are sharp, without blurring or over-curing, achieving a consistency of 99.2%.

[0069] This embodiment determines reference structure points based on the coordinates of a first target and the average depth value, and also determines reference structure points based on the coordinates of a second target and the average depth value. It then obtains the corresponding microstructure coordinates based on the optical path positioning model and the 3D coordinates of the reference structure points. The micro-unit size is calculated based on the diagonal coordinates of the printing plate and the microstructure coordinates. By constructing 3D representative sample points at both ends of the diagonal of the printing plate area, establishing a bidirectional mapping relationship between the 3D structure and the 2D image, and dynamically adjusting the unit size by combining spatial and depth features, the technical effect of making the micro-unit size adapt to the local structural change rate can be achieved. This scheme overcomes the limitations of traditional uniform grid division. Through the collaborative calculation of spatial and depth responses, it ensures that the micro-units improve resolution in high-gradient regions and optimize efficiency in flat regions, fundamentally solving the problem of depth information loss or energy imbalance caused by fixed unit sizes. It forms a five-order closed-loop plate-making system, significantly improving the resolution consistency, energy uniformity, and three-dimensional layer fidelity of microstructure forming.

[0070] In one embodiment, the micro-unit size is obtained based on the first target coordinates, the second target coordinates, and the micro-structure coordinates corresponding to two reference structural points, including: Based on the minimum and maximum values ​​of the X-axis coordinates and the pixel span in the X-axis direction of the microstructure coordinates corresponding to the two reference structural points, the physical size of the micro-unit in the X-axis direction is obtained.

[0071] The minimum value of the X-axis coordinate can be the starting boundary of the page in the X direction of the 3D plate-making coordinate system, used together with the maximum value of the X-axis coordinate to form the physical length reference. It can be understood that the minimum value of the X-axis coordinate is obtained by extracting the X coordinates of eight structural points and taking the minimum value. Furthermore, the minimum value of the X-axis coordinate can include, but is not limited to, the left boundary X-coordinate, the initial X-extreme value, etc. The maximum value of the X-axis coordinate can be the ending boundary of the page in the X direction of the 3D plate-making coordinate system, used together with the minimum value of the X-axis coordinate to form the physical length reference. It can be understood that the maximum value of the X-axis coordinate is obtained by extracting the X coordinates of eight structural points and taking the maximum value. Furthermore, the maximum value of the X-axis coordinate can include, but is not limited to, the right boundary X-coordinate, the ending X-extreme value, etc.

[0072] The pixel span in the X-axis direction can be the difference in pixel coordinates between two reference structure points in the X-direction of the image, used to reflect the imaging response intensity and calibrate the scale. Understandably, the pixel span in the X-axis direction is obtained by calculating the absolute difference in column numbers between the two reference structure points. Furthermore, the pixel span in the X-axis direction can include, but is not limited to, the start-to-end X-pixel span, the left-to-right reference point X-span, etc. The physical size of the micro-unit in the X-axis direction can be the actual physical length of the micro-unit in the X-direction of the 3D plate-making coordinate system, used to ensure matching with the imaging response. Understandably, the physical size of the micro-unit in the X-axis direction is obtained by calculating the scaling factor between the physical span of the plate in the X-direction and the pixel span. Furthermore, the physical size of the micro-unit in the X-axis direction can include, but is not limited to, the local X-axis micro-unit size, the edge X-axis micro-unit size, etc.

[0073] Based on the minimum and maximum values ​​of the X-axis coordinates and the pixel span in the X-axis direction of the microstructure coordinates corresponding to the two reference structural points, the physical size of the micro-unit in the X-axis direction can be obtained by calculating the scaling factor between the physical span and the pixel span, and then multiplying it by the basic unit size. Furthermore, this operation can be implemented using a linear scaling method or a piecewise calibration method, thereby enabling dynamic compensation for optical distortion.

[0074] Based on the minimum and maximum values ​​of the Y-axis coordinates and the pixel span in the Y-axis direction of the microstructure coordinates corresponding to the two reference structural points, the physical size of the micro-unit in the Y-axis direction is obtained.

[0075] The minimum value of the Y-axis coordinate can be the starting boundary of the Y-direction of the layout in the 3D plate-making coordinate system, used together with the maximum value of the Y-axis coordinate to form the physical length reference. It can be understood that the minimum value of the Y-axis coordinate is obtained by extracting the Y-coordinates of eight structural points and taking the minimum value. Furthermore, the minimum value of the Y-axis coordinate can include, but is not limited to, the lower boundary Y-coordinate, the initial extreme Y-value, etc. The maximum value of the Y-axis coordinate can be the ending boundary of the Y-direction of the layout in the 3D plate-making coordinate system, used together with the minimum value of the Y-axis coordinate to form the physical length reference. It can be understood that the maximum value of the Y-axis coordinate is obtained by extracting the Y-coordinates of eight structural points and taking the maximum value. Furthermore, the maximum value of the Y-axis coordinate can include, but is not limited to, the upper boundary Y-coordinate, the ending extreme Y-value, etc.

[0076] The pixel span in the Y-axis direction can be the difference in pixel coordinates between two reference structure points in the Y-direction of the image, used to reflect the imaging response intensity and calibrate the scale. It is understood that the pixel span in the Y-axis direction is obtained by calculating the absolute difference in row numbers between the two reference structure points. Furthermore, the pixel span in the Y-axis direction can include, but is not limited to, the start-to-end Y-pixel span, the top-to-bottom reference point Y-span, etc. The physical size of a micro-unit in the Y-axis direction can be the actual physical length of the micro-unit in the Y-direction of the 3D plate-making coordinate system, used to compensate for non-uniform deformation of the optical system. It is understood that the physical size of a micro-unit in the Y-axis direction is obtained by calculating the scaling factor between the physical span of the plate in the Y-direction and the pixel span. Furthermore, the physical size of a micro-unit in the Y-axis direction can include, but is not limited to, the local Y-axis micro-unit size, the edge Y-axis micro-unit size, etc.

[0077] Based on the minimum and maximum values ​​of the Y-axis coordinates and the pixel span in the Y-axis direction of the microstructure coordinates corresponding to the two reference structural points, the physical size of the micro-unit in the Y-axis direction can be obtained by calculating the scaling factor between the physical span and the pixel span, and then multiplying it by the size of the basic unit. Furthermore, this operation can be achieved through global calibration or gradient calibration, thereby enabling adaptive correction of longitudinal non-uniform responses. Taking the non-uniform optical imaging compensation plate-making of high-precision anti-counterfeiting labels as an example, the microstructure holographic anti-counterfeiting UV plate-making method in this embodiment can be as follows: When making a three-dimensional relief anti-counterfeiting printing plate with a central bulge and gradually flattened edges, the physical length of the plate surface in the X direction is 74.8 mm, and in the Y direction it is 53.6 mm. The pixel span of the two reference structural points in the image is 682 pixels in the X direction and 495 pixels in the Y direction. The system calculates the X-axis conversion factor as 74.8mm / 682px = 0.1097mm / px and the Y-axis conversion factor as 53.6mm / 495px = 0.1083mm / px. If the basic unit is set to 0.5mm, the X-axis micro-unit size is 0.5 × (74.8 / 682) = 0.5 × 0.1097 / 0.1097 = 0.5mm. However, when the pixel span at the image edge is actually 610 pixels due to distortion, the X-axis size is automatically adjusted to 0.5 × (74.8 / 610) = 0.61mm to compensate for pixel density compression. Similarly, if the Y-axis pixel span is 550 pixels due to color difference, the Y-axis size is 0.5 × (53.6 / 550) = 0.487mm. Based on this, the system generates an asymmetric micro-unit mesh, which is denser in distorted areas and sparser in flat areas. By combining precise cutting with aberration correction projection, the final dimensional error after curing is controlled within ±0.8μm, which is better than ±5μm of the traditional method.

[0078] This embodiment obtains the physical dimensions of micro-units in the X-axis direction based on the minimum and maximum values ​​of the X-axis coordinates and the pixel span in the X-axis direction, and obtains the physical dimensions of micro-units in the Y-axis direction based on the minimum and maximum values ​​of the Y-axis coordinates and the pixel span in the Y-axis direction. By dynamically adjusting the micro-unit dimensions through the ratio conversion between the physical span of the layout and the pixel span of the reference point, adaptive compensation of the micro-unit dimensions to the nonlinear response of the optical system can be achieved, eliminating dimensional distortion caused by distortion, ensuring that the dimensional error of the microstructure is controlled within the micrometer level after curing, and improving the technical effect of anti-counterfeiting pattern recognition and industrial precision. This mechanism, through a closed-loop process of three-dimensional shape boundary recognition, depth response modeling, imaging ratio calibration, dynamic generation of physical dimensions, geometrically faithful projection, and energy-linked curing, makes the micro-unit dimensions truly conform to the physical laws of optical imaging, achieving a high-fidelity, zero-failure, and fully uniform molding effect.

[0079] In one embodiment, based on the optical path positioning model with aberration correction corresponding to the target CCD camera, each micro-unit of the UV printing plate is projected onto the target plate image to obtain the holographic anti-counterfeiting UV printing plate corresponding to the target plate image, including: The printing plate is divided into micro-units based on the micro-unit size, generating each micro-unit of the UV printing plate.

[0080] The micro-unit size can be the physical specification of the smallest independently controllable exposure area on the UV printing plate surface, and can be used to discretize a continuous plate surface into operable units. Furthermore, this division can be achieved through regular grid division or irregular adaptive division, thereby achieving the technical effect of transforming the plate surface into a set of independently controllable micro-units.

[0081] Based on the optical path positioning model with aberration correction, each micro-unit is projected onto the target image to obtain the floating-point focusing coordinates corresponding to the micro-unit.

[0082] Floating-point focus coordinates can be continuous numerical coordinates output by an optical path positioning model with aberration correction, carrying sub-pixel-level spatial position and three-dimensional depth information, which can be used to overcome the limitations of traditional pixel discretization. Furthermore, these coordinates can be generated through analytical inverse projection or numerical sampling methods, thereby achieving the technical effect of high-precision continuous positioning of micro-units in image space. Floating-point focus coordinates can include, but are not limited to, high-precision projection coordinates, distortion-compensated coordinates, and depth-coupled coordinates.

[0083] The floating-point focusing coordinates are dynamically compensated by an LED light curing module to obtain the UV curing energy value of each micro-unit.

[0084] The LED curing module can be an ultraviolet light source system composed of independently controllable LED arrays and driving circuits, used to achieve high-precision, programmable UV energy projection onto micro-units. Furthermore, this module can precisely control the output power of each light-emitting unit through PWM modulation or current, thereby achieving microsecond-level response and spatially segmented illumination. The LED curing module can include, but is not limited to, single-point LED array modules, multi-channel zoned LED arrays, and adjustable-focus LED projection modules. The UV curing energy value can be a unit area light energy density value calculated individually for each micro-unit to drive photoresist curing, enabling on-demand exposure. Furthermore, this energy value can be calculated using linear or nonlinear compensation methods, ensuring that microstructures of different depths achieve matched curing depths.

[0085] By exposing the microstructure resin layer in different regions based on the UV curing energy value, a holographic anti-counterfeiting microstructure with depth coding is formed, thereby obtaining the holographic anti-counterfeiting UV printing plate corresponding to the target plate image.

[0086] The microstructure resin layer can be a UV-curable functional layer composed of photosensitive polymers coated on the surface of a UV printing plate, serving as a material carrier for microstructure molding. Furthermore, this resin layer can be formed into a uniform thin film through spin coating or spraying processes, achieving the technical effect of forming microstructure morphology after curing. The microstructure resin layer can include, but is not limited to, acrylate-based resin layers, epoxy-based photoresist layers, and nanocomposite photosensitive resin layers. Regional exposure can be achieved through unit-by-unit scanning exposure or parallel exposure arrays, thereby achieving the technical effect of precisely matching the curing depth of each microunit with its three-dimensional morphology.

[0087] Taking the deep-coded microstructure plate-making of high-security anti-counterfeiting labels as an example, the microstructure holographic anti-counterfeiting UV plate-making method in this embodiment can be as follows: When manufacturing banknote anti-counterfeiting labels with multi-layer relief structures, the height of the microstructure on the printing plate surface varies non-linearly between 0 and 22 μm. The system first generates 1200 micro-units based on adaptive partitioning, with the size of each unit dynamically varying between 0.3 and 1.2 mm. Through an optical path model with aberration correction, the center of each micro-unit is projected as a floating-point focusing coordinate (e.g., x = 456.72, y = 389.15), accurate to the 0.01 pixel level. Based on the Z depth of this coordinate mapping being 18.4 μm, the system substitutes it into the non-linear compensation function: energy = 1.2 × exp(0.08 × Z), calculating the UV curing energy value to be 5.72 J / cm²; in another flat region (Z = 3.1 μm), the energy value is 1.58 J / cm². The LED curing module independently adjusts the light intensity of each micro-unit, using 120% of the rated power in the high-difference zone and 40% in the low-difference zone. After exposure, the resin layer cures to a depth of 19μm in the high-difference zone and 3.5μm in the low-difference zone, perfectly matching the designed height. The resulting microstructure exhibits a clear phase difference under laser interference, displaying dynamic color changes, and its internal energy gradient cannot be replicated by 3D printing or molding. The overall yield is improved to 99.5%, and the repeatability reaches ±0.3μm.

[0088] This embodiment divides the printing plate area into micro-units based on the micro-unit size to generate each micro-unit of the UV printing plate. A light path positioning model with aberration correction projects each micro-unit onto the target printing plate image to obtain floating-point focus coordinates. An LED curing module dynamically compensates for the light intensity of these floating-point focus coordinates to obtain the UV curing energy value. Based on this UV curing energy value, the microstructure resin layer is exposed in sections to form a holographic anti-counterfeiting microstructure with depth coding. This ensures that the curing depth of each micro-unit is precisely matched to its three-dimensional height, forming an optical structure with a three-dimensional phase difference. By discretizing the continuous printing plate into independently controllable exposure units, achieving high-precision continuous positioning of micro-units in image space, dynamically linking microstructure depth with UV energy output, and forming a three-dimensional structure through photosensitive resin curing, this method overcomes the curing unevenness problem caused by fixed energy in traditional methods, improving the three-dimensional layering and anti-counterfeiting properties of the holographic pattern. This solution constructs a microstructure UV plate-making system based on continuous spatial modeling and deep linkage energy control through a four-order closed loop of shape perception, high-precision projection, energy adaptive compensation, and deep encoding solidification, which significantly enhances the technical barriers and credibility of anti-counterfeiting labels in high-security scenarios.

[0089] Furthermore, to achieve the above objectives, the present invention also provides a microstructure holographic anti-counterfeiting UV plate-making system, the system comprising: The optical path calibration module is used to obtain the optical path positioning model corresponding to the target CCD camera based on the focusing depth of the target plate image acquired by the target CCD camera and the installation position of the target CCD camera; the target CCD camera is a focusing module installed on the UV plate-making equipment; the optical path positioning model is used to indicate the mapping relationship between the microstructure coordinates of pixels in the target plate image and the physical position of the anti-counterfeiting microstructure corresponding to the pixel in the three-dimensional plate-making coordinate system; the target plate image is obtained by the target CCD camera capturing a holographic anti-counterfeiting UV printing plate within the target range; The plate demarcation module is used to obtain the plate area and micro-unit size corresponding to the UV printing plate based on the depth characteristics of the anti-counterfeiting microstructures within the target area and the optical path positioning model; the depth characteristics of the anti-counterfeiting microstructures within the target area are determined based on the initial distance between the target CCD camera and the plate, the maximum height difference of the microstructures within the target area, and the reference position of the target CCD camera in the three-dimensional plate-making coordinate system; The projection curing module is used to project each micro-unit of the UV printing plate onto the target plate image based on the optical path positioning model with aberration correction corresponding to the target CCD camera, and obtain the holographic anti-counterfeiting UV printing plate corresponding to the target plate image; the micro-unit is obtained by dividing the plate area based on the size of the micro-unit.

[0090] Other embodiments or specific implementations of the microstructure holographic anti-counterfeiting UV plate-making system described in this invention can be referred to the above-mentioned method embodiments, and will not be repeated here.

[0091] Furthermore, to achieve the above objectives, the present invention also provides a microstructure holographic anti-counterfeiting UV plate-making device, the device comprising: a memory, a processor, and a microstructure holographic anti-counterfeiting UV plate-making program stored in the memory and executable on the processor, the microstructure holographic anti-counterfeiting UV plate-making program being configured to implement the steps of the microstructure holographic anti-counterfeiting UV plate-making method as described above.

[0092] In addition, to achieve the above objectives, the present invention also provides a medium storing a microstructure holographic anti-counterfeiting UV plate-making program, wherein when the microstructure holographic anti-counterfeiting UV plate-making program is executed by a processor, it implements the steps of the microstructure holographic anti-counterfeiting UV plate-making method as described above.

[0093] The above are merely preferred embodiments of the present invention and do not limit the scope of the patent. Any equivalent structural or procedural transformations made based on the description and drawings of the present invention, or direct or indirect applications in other related technical fields, are similarly included within the scope of patent protection of the present invention.

Claims

1. A method for fabricating a microstructure holographic anti-counterfeiting UV plate, characterized in that, The method includes: Based on the focus depth of the target CCD camera acquiring the target plate image and the installation position of the target CCD camera, an optical path positioning model corresponding to the target CCD camera is obtained; the target CCD camera is a focusing module installed on a UV plate-making device; the optical path positioning model is used to indicate the mapping relationship between the microstructure coordinates of pixels in the target plate image and the physical position of the corresponding anti-counterfeiting microstructure in the three-dimensional plate-making coordinate system; the target plate image is obtained by the target CCD camera capturing a holographic anti-counterfeiting UV printing plate within the target range; Based on the depth characteristics of the anti-counterfeiting microstructure within the target range and the optical path positioning model, the plate area and micro-unit size corresponding to the UV printing plate are obtained; the depth characteristics of the anti-counterfeiting microstructure within the target range are determined based on the initial distance between the target CCD camera and the plate, the maximum height difference of the microstructure within the target range, and the reference position of the target CCD camera in the three-dimensional plate-making coordinate system; Based on the optical path positioning model with aberration correction corresponding to the target CCD camera, each micro-unit of the UV printing plate is projected onto the target plate image to obtain the holographic anti-counterfeiting UV printing plate corresponding to the target plate image; the micro-unit is obtained by dividing the plate area based on the size of the micro-unit.

2. The microstructure holographic anti-counterfeiting UV plate-making method as described in claim 1, characterized in that, The step of obtaining the optical path positioning model corresponding to the target CCD camera based on the focus depth of the target image acquired by the target CCD camera and the installation position of the target CCD camera includes: Based on the focus depth of the target CCD camera acquiring the target image of the plate, the optical path calibration matrix is ​​obtained; Based on the installation position of the target CCD camera, obtain the reference coordinates of the target CCD camera in the three-dimensional plate-making coordinate system; The optical path positioning model is obtained based on the intrinsic parameter matrix of the target CCD camera, the optical path calibration matrix, and the reference coordinates of the target CCD camera in the three-dimensional plate-making coordinate system.

3. The microstructure holographic anti-counterfeiting UV plate-making method as described in claim 1, characterized in that, The process of obtaining the plate area and micro-unit size corresponding to the UV printing plate based on the depth features of the anti-counterfeiting microstructure within the target range and the optical path positioning model includes: Based on the optical path positioning model, the microstructure coordinates of the four boundary points of the target image and the maximum and minimum depth values ​​of the microstructure within the target area are calculated to obtain the image range. The micro-unit size is obtained based on the optical path positioning model, the average depth value of the microstructure within the target range, and the layout range.

4. The microstructure holographic anti-counterfeiting UV plate-making method as described in claim 3, characterized in that, The process of calculating the microstructure coordinates of the four boundary points of the target image and the maximum and minimum depth values ​​of the microstructures within the target area based on the optical path positioning model to obtain the image range includes: Based on the optical path positioning model, the microstructure coordinates of the four boundary points of the target plate image and the maximum and minimum depth values ​​of the microstructure within the target range are calculated to obtain the physical coordinates of the corresponding eight structural points in the three-dimensional plate-making coordinate system. Obtain the first target coordinates corresponding to the minimum X-axis coordinate and the minimum Y-axis coordinate of the eight structural points in the three-dimensional plate-making coordinate system, and the second target coordinates corresponding to the maximum X-axis coordinate and the maximum Y-axis coordinate. The area on the printing plate plane corresponding to the rectangle whose diagonal lines are the points corresponding to the first target coordinates and the second target coordinates is determined as the plate area.

5. The microstructure holographic anti-counterfeiting UV plate-making method as described in claim 4, characterized in that, The step of obtaining the micro-unit size based on the optical path positioning model, the average depth value of the microstructure within the target range, and the layout range includes: A reference structure point is determined based on the first target coordinates and the average depth value, and also based on the second target coordinates and the average depth value, respectively. Based on the optical path positioning model and the coordinates of each reference structure point in the three-dimensional plate-making coordinate system, the microstructure coordinates corresponding to each reference structure point are obtained; The micro-unit size is obtained based on the first target coordinates, the second target coordinates, and the micro-structure coordinates corresponding to the two reference structural points.

6. The microstructure holographic anti-counterfeiting UV plate-making method as described in claim 5, characterized in that, The step of obtaining the micro-unit size based on the first target coordinates, the second target coordinates, and the micro-structure coordinates corresponding to the two reference structural points includes: Based on the minimum value of the X-axis coordinate, the maximum value of the X-axis coordinate, and the pixel span in the X-axis direction of the microstructure coordinates corresponding to the two reference structural points, the physical size of the micro-unit in the X-axis direction is obtained; Based on the minimum value of the Y-axis coordinate, the maximum value of the Y-axis coordinate, and the pixel span in the Y-axis direction of the microstructure coordinates corresponding to the two reference structural points, the physical size of the micro-unit in the Y-axis direction is obtained.

7. The microstructure holographic anti-counterfeiting UV plate-making method according to any one of claims 1 to 6, characterized in that, The optical path positioning model with aberration correction based on the target CCD camera projects each micro-unit of the UV printing plate onto the target plate image to obtain the holographic anti-counterfeiting UV printing plate corresponding to the target plate image, including: The printing plate area is divided based on the micro-unit size to generate each micro-unit of the UV printing plate; Based on the optical path positioning model with aberration correction, each micro-unit is projected onto the target image to obtain the floating-point focusing coordinates corresponding to the micro-unit. The floating-point focusing coordinates are dynamically compensated by an LED light curing module to obtain the UV curing energy value of each micro-unit. Based on the UV curing energy value, the microstructure resin layer is exposed in different regions to form a holographic anti-counterfeiting microstructure with depth coding, thereby obtaining a holographic anti-counterfeiting UV printing plate corresponding to the target plate image.

8. A microstructure holographic anti-counterfeiting UV plate-making system, characterized in that, The system includes: The optical path calibration module is used to obtain the optical path positioning model corresponding to the target CCD camera based on the focusing depth of the target plate image acquired by the target CCD camera and the installation position of the target CCD camera; the target CCD camera is a focusing module installed on the UV plate-making equipment; the optical path positioning model is used to indicate the mapping relationship between the microstructure coordinates of pixels in the target plate image and the physical position of the anti-counterfeiting microstructure corresponding to the pixel in the three-dimensional plate-making coordinate system; the target plate image is obtained by the target CCD camera capturing a holographic anti-counterfeiting UV printing plate within the target range; The plate demarcation module is used to obtain the plate area and micro-unit size corresponding to the UV printing plate based on the depth characteristics of the anti-counterfeiting microstructures within the target area and the optical path positioning model; the depth characteristics of the anti-counterfeiting microstructures within the target area are determined based on the initial distance between the target CCD camera and the plate, the maximum height difference of the microstructures within the target area, and the reference position of the target CCD camera in the three-dimensional plate-making coordinate system; The projection curing module is used to project each micro-unit of the UV printing plate onto the target plate image based on the optical path positioning model with aberration correction corresponding to the target CCD camera, and obtain the holographic anti-counterfeiting UV printing plate corresponding to the target plate image; the micro-unit is obtained by dividing the plate area based on the size of the micro-unit.

9. A microstructure holographic anti-counterfeiting UV plate-making device, characterized in that, The device includes: a memory, a processor, and a microstructure holographic anti-counterfeiting UV plate-making program stored in the memory and executable on the processor, the microstructure holographic anti-counterfeiting UV plate-making program being configured to implement the steps of the microstructure holographic anti-counterfeiting UV plate-making method as described in any one of claims 1 to 8.

10. A medium, characterized in that, The medium stores a microstructure holographic anti-counterfeiting UV plate-making program, which, when executed by a processor, implements the steps of the microstructure holographic anti-counterfeiting UV plate-making method as described in any one of claims 1 to 8.

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