Plate cylinder
By forming a concave portion on the outer circumference of the cylindrical surface of the printing plate cylinder and a convex portion and a gap portion on the inner circumference, combined with a DLC cover layer, the problem of transferability caused by frictional heat is solved, and efficient transfer of the printing plate cylinder is achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- MURATA MFG CO LTD
- Filing Date
- 2025-11-06
- Publication Date
- 2026-05-12
AI Technical Summary
The frictional heat generated when the printing cylinder and the squeegee slide in contact causes changes in the viscosity of the paste, affecting the transfer properties.
Multiple recesses are formed on the outer circumferential surface of the cylindrical surface of the printing cylinder, and multiple protrusions and gaps are formed on the inner circumferential surface. A low-friction coefficient DLC cover layer is used in combination to suppress the generation of frictional heat.
By suppressing the effects of frictional heat, the transferability of the printing cylinder is improved, changes in paste viscosity are prevented, and the transfer effect is ensured.
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Figure CN122008683A_ABST
Abstract
Description
Technical Field
[0001] This disclosure relates to printing plate cylinders. Background Technology
[0002] For example, Japanese Patent Application Publication No. 2023-140689 (Patent Document 1) discloses a generally cylindrical printing cylinder with multiple recesses formed on its outer peripheral surface. This printing cylinder is used as a gravure printing plate for printing pastes used in electronic components. For example, in the manufacture of multilayer ceramic capacitors, firstly, the printing cylinder is filled with paste by immersing it in a paste tank containing paste that serves as the internal electrode. Next, excess paste filling the recesses is scraped away by sliding a squeegee against the outer peripheral surface of the printing cylinder. Then, an appropriate amount of paste filling the recesses is transferred onto a green sheet.
[0003] Existing technical documents
[0004] Patent documents
[0005] Patent Document 1: Japanese Patent Application Publication No. 2023-140689 Summary of the Invention
[0006] The problem the invention aims to solve
[0007] Here, when the excess paste is scraped off with a squeegee as described above, the squeegee slides into contact with the outer peripheral surface of the printing cylinder, thereby generating frictional heat on that surface. If the viscosity and other properties of the paste filling the recesses change due to this frictional heat, a problem such as reduced transferability may occur.
[0008] Therefore, this disclosure was made to solve the above-mentioned problems, and its purpose is to provide a printing cylinder that improves transferability by suppressing the effects of frictional heat generated between the cylinder and the squeegee.
[0009] Solution for solving the problem
[0010] The printing cylinder based on this disclosure includes: a core having a cylindrical or cylindrical shape; and a cylindrical surface portion covering the peripheral surface of the core. The cylindrical surface portion has an inner peripheral surface facing the peripheral surface and an outer peripheral surface located on the side opposite to the inner peripheral surface. A plurality of recesses are formed on the outer peripheral surface. A plurality of protrusions are formed on the inner peripheral surface.
[0011] The effects of the invention
[0012] According to this disclosure, a printing cylinder can be provided that improves transferability by suppressing the effects of frictional heat generated between the cylinder and the squeegee. Attached Figure Description
[0013] Figure 1 This is a schematic diagram of a gravure printing apparatus having an intaglio printing plate cylinder according to an embodiment.
[0014] Figure 2 is Figure 1 a perspective view of the intaglio printing plate cylinder shown in
[0015] Figure 3 is to Figure 1 a schematic enlarged view of a part of the printing pattern of the intaglio printing plate cylinder shown in
[0016] Figure 4 is Figure 3 a schematic cross-sectional view of the printing pattern shown in
[0017] Figure 5 is a schematic view of the cylindrical surface layer portion shown when viewed from the inner circumferential surface side Figure 4 in
[0018] Figure 6 is a flowchart showing a method for manufacturing a stacked electronic component using the Figure 1 intaglio printing plate cylinder shown in
[0019] Figure 7 a schematic cross-sectional view of a part of the intaglio printing plate cylinder of a modified example, enlarged
[0020] Description of Reference Numerals
[0021] 1, gravure printing apparatus; 10, 10A, intaglio printing plate cylinder; 11, core portion; 11a, peripheral surface; 12, cylindrical surface layer portion; 12a, outer peripheral surface; 12b, inner peripheral surface; 13, base material; 14, plating layer; 15, covering layer; 20, support roller; 30, paste tank; 31, functional paste; 40, doctor blade; 50, green sheet; 50a, dielectric sheet; 51, electrode pattern; 100, printing pattern; 110, dike portion; 111, longitudinal dike portion; 112, transverse dike portion; 120, recessed portion; 210, protruding portion; 220, gap portion; N, nip portion; OP, opening surface. Detailed Description of Embodiment
[0022] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings. In addition, in the following embodiments, the same or common parts are denoted by the same reference numerals in the drawings, and their description will not be repeated.
[0023] (Embodiment)
[0024] <A. Schematic Structure of Intaglio Printing Plate Cylinder and Gravure Printing Apparatus>
[0025] Figure 1 This is a schematic diagram of a gravure printing apparatus having an intaglio printing plate cylinder according to an embodiment. Figure 2 is Figure 1 A perspective view of the plate cylinder shown. First, refer to Figure 1 and Figure 2 to describe the schematic structures of the plate cylinder 10 of the present embodiment and the intaglio printing apparatus 1 including the plate cylinder 10.
[0026] As Figure 1 and Figure 2 shown, the intaglio printing apparatus 1 includes a plate cylinder 10, a support roller 20, a paste tank 30, and a squeegee 40.
[0027] The plate cylinder 10 has an overall cylindrical shape. The plate cylinder 10 is configured to be rotatable in the direction of arrow AR1 in Figure 1 . A plurality of printing patterns 100 are provided on the outer peripheral surface 12a of the cylindrical surface portion 12 of the plate cylinder 10. The cylindrical surface portion 12 will be described in detail later. In Figure 2 , two of the plurality of printing patterns 100 are shown.
[0028] The support roller 20 has a cylindrical or tubular shape. The support roller 20 is configured to be rotatable in the direction of arrow AR2 in Figure 1 (i.e., the direction opposite to the rotation direction of the plate cylinder 10).
[0029] The plate cylinder 10 and the support roller 20 are disposed opposite to each other so as to form a nip portion N. The green sheet 50 passes through the nip portion N in such a manner that the dielectric sheet 50a is sandwiched by the nip portion N.
[0030] A functional paste 31 for electronic components is stored in the paste tank 30. A part of the plate cylinder 10 is immersed in the functional paste 31. When performing intaglio printing using the plate cylinder 10, by rotating the plate cylinder 10, the functional paste 31 is filled in a plurality of recesses 120 (refer to Figure 3 ) described later. In the present embodiment, a conductive paste is used as the functional paste 31. In addition, a dielectric paste may be used instead of the conductive paste.
[0031] The squeegee 40 is disposed at a position downstream of the paste tank 30 in the rotation direction of the plate cylinder 10. The squeegee 40 contacts the plate cylinder 10 with a predetermined pressure. The squeegee 40 scrapes off the excess portion of the functional paste 31 filled in the recesses 120.
[0032] The plate cylinder 10 in a state where an appropriate amount of the functional paste 31 is retained after passing through the squeegee 40 transfers the functional paste 31 filled in the recesses 120 to the green sheet 50 at the nip portion N. Thereby, an electrode pattern 51 corresponding to the printing pattern 100 is printed on the green sheet 50.
[0033] <B. Detailed Structure of the Plate Cylinder>
[0034] Figure 3 It is Figure 1 A magnified schematic diagram of a portion of the printed pattern on the printing cylinder shown. Figure 4 It is along Figure 3 A schematic cross-sectional view of line IV-IV in the diagram. Figure 5 Viewed from the inner circumferential side Figure 4 A schematic diagram of the cylindrical surface layer is shown. Next, refer to... Figures 3 to 5 And the aforementioned Figure 1 and Figure 2 The detailed structure of the printing cylinder 10 is explained below.
[0035] like Figures 1 to 5 As shown, the printing cylinder 10 includes a core portion 11 with a cylindrical shape and a cylindrical surface portion 12 covering the circumferential surface 11a of the core portion 11. The core portion 11 and the cylindrical surface portion 12 are separately constructed.
[0036] The core 11 is, for example, made of a metal roller. Iron or aluminum is preferably used as the material for the metal roller. The diameter of the core 11 is, for example, 30 mm or more and 200 mm or less. The width of the core 11 parallel to the axial direction is, for example, 200 mm or more and 1000 mm or less. Furthermore, the shape of the core 11 is not particularly limited to a cylindrical shape; it can also be cylindrical. In this case, the printing cylinder 10 also has an overall cylindrical shape.
[0037] The cylindrical surface portion 12 has an inner peripheral surface 12b facing the peripheral surface 11a of the core portion 11 and an outer peripheral surface 12a located on the side opposite to the side where the inner peripheral surface 12b is located.
[0038] The cylindrical surface portion 12 is fixed to the core portion 11, for example, by screws, while being inserted into the core portion 11. However, the method of fixing the cylindrical surface portion 12 to the core portion 11 is not particularly limited to this, and other fixing methods may also be used.
[0039] like Figure 4 As shown, the cylindrical surface layer 12 includes a substrate 13, a plating layer 14, and a cover layer 15. The substrate 13 forms the inner circumferential surface 12b of the cylindrical surface layer 12. The plating layer 14 covers the entire surface of one of the pair of main surfaces of the substrate 13, on the side opposite to the side facing the core 11. The cover layer 15 covers the entire surface of one of the pair of main surfaces of the plating layer 14, on the side opposite to the side facing the substrate 13.
[0040] The substrate 13 is formed into a generally cylindrical shape, for example, by rolling a plate member and welding the two ends of the plate member together. As the material of the substrate 13, a metal with nickel as its main component is preferred, but metals other than those with nickel as their main component, or materials other than metals, may also be used. In this embodiment, the substrate 13 is composed of a single plate member that has been rolled as described above.
[0041] The thickness of the substrate 13 is preferably 0.1 mm or more. This ensures sufficient strength of the cylindrical surface portion 12. On the other hand, the thickness of the substrate 13 is preferably 0.15 mm or less. This further improves the heat dissipation efficiency of the gap portion 220, which will be described later.
[0042] The material used for the plating layer 14 is, for example, a high-hardness material such as chromium. This increases the hardness of the outer peripheral surface 12a of the cylindrical surface portion 12.
[0043] The capping layer 15 is preferably made of DLC. DLC refers to a carbon-based material that combines the carbon-carbon bonds of both diamond and graphite (black lead). Compared with general materials, DLC has high hardness and low friction. For example, the hardness of DLC is higher than that of nickel, which is an example of a material constituting the substrate 13. In addition, the coefficient of friction of DLC is lower than that of nickel.
[0044] Therefore, by forming the cover layer 15 with DLC, the hardness of the outer peripheral surface 12a of the cylindrical surface portion 12 can be increased. This suppresses wear on the cylindrical surface portion 12 caused by sliding contact between the squeegee 40 and the printing cylinder 10. Furthermore, by forming the cover layer 15 with DLC, the coefficient of friction of the outer peripheral surface 12a of the cylindrical surface portion 12 can be reduced. This suppresses the residue of functional paste 31 in the recessed portion 120 after transfer.
[0045] like Figures 2 to 4 As shown, a plurality of recesses 120 are formed on the outer peripheral surface 12a of the cylindrical surface portion 12. Thus, a printed pattern 100 composed of a plurality of ridges 110 and a plurality of recesses 120 divided by them is provided on the outer peripheral surface 12a of the cylindrical surface portion 12.
[0046] The plurality of dikes 110 are arranged, for example, in a grid pattern. The plurality of dikes 110 include longitudinal dikes 111 extending circumferentially along the printing plate cylinder 10 and transverse dikes 112 extending in a direction parallel to the axial direction of the printing plate cylinder 10.
[0047] The plurality of recesses 120 may be arranged, for example, in a matrix configuration consisting of the row direction parallel to the axial direction and the column direction parallel to the circumferential direction. Alternatively, adjacent recesses 120 may be connected to each other by providing a notch in at least one of the longitudinal section 111 and the transverse section 112.
[0048] The printed pattern 100 has a generally rectangular shape. However, the shape of the printed pattern 100 is not particularly limited to a generally rectangular shape and can be appropriately changed according to the shape of the electrode pattern 51.
[0049] like Figure 4 As shown, the depth of the recess 120 (more specifically, the depth h of the cover layer 15 constituting the bottom surface of the recess 120 from the opening surface OP of the recess 120) is, for example, 5 μm or more and 30 μm or less. In this embodiment, the opening surface OP has a rectangular shape when viewed from the normal direction. Furthermore, the shape of the opening surface OP when viewed from the normal direction is not particularly limited to a rectangular shape and can be appropriately modified. For example, the recess 120 can be formed by etching the main surface of the substrate 13.
[0050] like Figure 4 as well as Figure 5 As shown, a plurality of protrusions 210 are formed on the inner circumferential surface 12b of the cylindrical surface portion 12. With this configuration, the influence of frictional heat generated between the squeegee 40 and the printing cylinder 10 can be suppressed, which will be described in detail later.
[0051] In this embodiment, a plurality of protrusions 210 are formed over the entire area of the inner peripheral surface 12b of the cylindrical surface portion 12. Alternatively, the plurality of protrusions 210 may be formed only on the inner peripheral surface 12b of the portion of the cylindrical surface portion 12 where the printed pattern 100 is provided.
[0052] A plurality of protrusions 210 and gaps 220 located between the protrusions 210 are provided on the inner circumferential surface 12b of the cylindrical surface portion 12. In this embodiment, when viewed radially from the core portion 11, the gaps 220 are arranged in a grid pattern over the entire range of the inner circumferential surface 12b of the cylindrical surface portion 12 (see, in particular, reference). Figure 5 ).
[0053] When viewed radially from the core 11, the protrusion 210 formed on the inner peripheral surface 12b of the cylindrical surface layer 12 is positioned to overlap with the recess 120 formed on the outer peripheral surface 12a of the cylindrical surface layer 12. In other words, when viewed radially from the core 11, the gap 220 on the inner peripheral surface 12b of the cylindrical surface layer 12 partially overlaps with the portion on the outer peripheral surface 12a of the cylindrical surface layer 12 where there are no multiple recesses 120.
[0054] The protrusion 210 abuts against the circumferential surface 11a of the core portion 11. This ensures the strength of the cylindrical surface portion 12, and as a result, suppresses deformation of the cylindrical surface portion 12 when the squeegee 40 slides into contact with the printing cylinder 10.
[0055] <Method for manufacturing a stacked electronic component>
[0056] Figure 6 is a flowchart showing a method for manufacturing a stacked electronic component using the Figure 1 printing plate cylinder shown. Next, referring to Figure 6 , an example of a method for manufacturing a stacked electronic component using the printing plate cylinder 10 of the present embodiment will be described.
[0057] As Figure 6 shown, first, in step T1, a green sheet 50 and a functional paste 31 are prepared. In the present embodiment, a conductive paste is used as the functional paste 31 for the internal electrodes. The green sheet 50 is formed of a dielectric paste obtained by kneading ceramic powder represented by barium titanate, a binder, a dispersant, a plasticizer, and the like. The functional paste 31 is obtained by kneading conductive powder, a solvent, a binder, ceramic powder, and the like. As the green sheet 50 and the functional paste 31, known materials can be used.
[0058] Next, in step T2, using the printing plate cylinder 10, the functional paste 31 (i.e., the conductive paste) is transferred onto the green sheet 50 in a predetermined pattern. Thereby, a dielectric sheet 50a having an electrode pattern 51 formed thereon is formed. In addition, the printing plate cylinder 10 can also be used for transferring the dielectric paste.
[0059] Next, in step T3, a stacked sheet is produced by stacking a plurality of dielectric sheets. Specifically, first, a predetermined number of dielectric sheets for the outer layer without the printed electrode pattern are stacked. Next, the dielectric sheet 50a having the electrode pattern 51 printed thereon is sequentially stacked thereon. Then, a predetermined number of the above-mentioned dielectric sheets for the outer layer are stacked thereon.
[0060] Next, in step T4, a stacked block is produced. Specifically, by using a pressing device such as an isostatic press, the stacked sheet is pressed in the stacking direction.
[0061] Next, in step T5, a stacked chip is produced. Specifically, the stacked block is cut into a predetermined size using a cutting knife, thereby cutting out the stacked chip. At this time, the corners and edges of the stacked chip can also be rounded by barrel polishing or the like.
[0062] Next, in step T6, the stacked chip is fired. The firing temperature depends on the materials of the dielectric and the electrode pattern, and is, for example, 900°C or higher and 1300°C or lower.
[0063] Next, in step T7, an external electrode is formed. For example, by applying a conductive paste for the external electrode to both end faces of the stacked chip and sintering, a sintered layer is formed on both end faces. At this time, the sintering temperature is, for example, 700°C or higher and 900°C or lower.
[0064] Next, a plating layer is provided on the surface of the sintered layer as needed. Through the processes T1 to T7 described above, a multilayer electronic component is manufactured.
[0065] In addition, when the above multilayer electronic component is a piezoelectric component, the dielectric can be formed of a piezoelectric ceramic. As the piezoelectric ceramic, for example, there are PZT (lead zirconate titanate) - based ceramics and the like. When the multilayer electronic component is a thermistor, the dielectric can be formed of a semiconductor ceramic. As the semiconductor ceramic, for example, there are spinel - based ceramics and the like. When the multilayer electronic component is an inductor, the dielectric can be formed of a magnetic - body ceramic. In addition, in this case, the internal electrode becomes a coil - shaped conductor. As the magnetic - body ceramic, for example, there are ferrites and the like.
[0066] <D. Summary>
[0067] In the plate cylinder 10 of the present embodiment, as described above, a plurality of convex portions 210 are formed on the inner peripheral surface 12b of the cylindrical surface layer portion 12. By configuring like this, compared with the case where a plurality of convex portions 210 are not formed on the inner peripheral surface 12b, the surface area of the inner peripheral surface 12b can be increased. As a result, the heat dissipation efficiency of the cylindrical surface layer portion 12 can be improved.
[0068] In addition, in the plate cylinder 10 of the present embodiment, as described above, the gap portion 220 is located between the convex portions 210. Therefore, by making a cooling gas or fluid flow through the gap portion 220, a further improvement in the heat dissipation efficiency of the cylindrical surface layer portion 12 can be achieved. In other words, by making the gap portion 220 form a flow path for a cooling gas or fluid, a further improvement in the heat dissipation efficiency of the cylindrical surface layer portion 12 can be achieved.
[0069] In this way, by configuring like the plate cylinder 10 of the present embodiment, an improvement in the heat dissipation efficiency of the cylindrical surface layer portion 12 can be achieved, and further an improvement in the heat dissipation efficiency of the plate cylinder 10 can be achieved. As a result, an increase in the temperature of the plate cylinder 10 due to frictional heat generated by the sliding contact between the doctor blade 40 and the plate cylinder 10 is suppressed. Therefore, a situation where the transferability is reduced due to a change in characteristics such as the viscosity of the functional paste 31 filled in the recess 120 can be effectively suppressed.
[0070] Therefore, by configuring like the plate cylinder 10 of the present embodiment, it is possible to provide a plate cylinder in which the transferability is improved by suppressing the influence of frictional heat generated between the doctor blade.
[0071] Furthermore, in the printing cylinder 10 of this embodiment, as described above, when viewed radially from the core portion 11, the gap portion 220 on the inner circumferential surface 12b of the cylindrical surface portion 12 partially overlaps with the portion on the outer circumferential surface 12a of the cylindrical surface portion 12 where there are no plurality of recesses 120.
[0072] Therefore, directly below the embankment 110 on the outer peripheral surface 12a of the cylindrical surface layer 12, where frictional heat is particularly concentrated due to the sliding contact of the scraper 40, a gap portion 220, as described above, is provided to significantly improve heat dissipation efficiency. As a result, the effects of the aforementioned frictional heat are particularly mitigated, and the reduction in transferability caused by the change in the properties of the functional paste 31 is more effectively suppressed.
[0073] Furthermore, in the above-described embodiment, the example shown is that the protrusion 210 formed on the inner peripheral surface 12b of the cylindrical surface portion 12 abuts against the peripheral surface 11a of the core portion 11. However, the protrusion 210 may not necessarily abut against the peripheral surface 11a. In other words, a gap may be provided between the protrusion 210 and the peripheral surface 11a.
[0074] Furthermore, in this embodiment described above, the plating layer 14 is shown to cover the entire surface of one main surface of the substrate 13. However, the plating layer 14 may also cover only a portion of the aforementioned main surface of the substrate 13. In this case, the plating layer 14 preferably selectively covers the portion of the aforementioned main surface of the substrate 13 that constitutes the printed pattern 100. Similarly, in this embodiment described above, the cover layer 15 is shown to cover the entire surface of one main surface of the plating layer 14. However, the cover layer 15 may also cover only a portion of the aforementioned main surface of the plating layer 14. In this case, the cover layer 15 preferably selectively covers the portion of the aforementioned main surface of the plating layer 14 that constitutes the printed pattern 100.
[0075] Furthermore, in the above embodiment, the substrate 13 is illustrated as being covered by the plating layer 14 and the cover layer 15, but the substrate 13 may not necessarily be covered by them.
[0076] (Variation example)
[0077] Figure 7 This is a schematic cross-sectional view enlarged from a portion of the printing cylinder in the modified example. Specifically, Figure 7 The modified printing plate cylinder is similar to the one described above. Figure 4 The corresponding schematic sectional view. See below for reference. Figure 7 The printing plate cylinder 10A based on the modified embodiment described above will be described.
[0078] like Figure 7As shown, in the printing cylinder 10A of this modified example, when viewed radially from the core 11, only a portion of the gap 220 on the inner circumferential surface 12b of the cylindrical surface portion 12 overlaps with the portion on the outer circumferential surface 12a of the cylindrical surface portion 12 where there are no plurality of recesses 120.
[0079] With this configuration, an effect comparable to that described in the above embodiments can be obtained, and the printing cylinder can be configured to improve transferability by suppressing the effect of frictional heat generated between it and the squeegee.
[0080] (Other methods, etc.)
[0081] The characteristic structures shown in the above-described embodiments and variations of this disclosure can, of course, be combined with each other without departing from the spirit of the invention.
[0082] The embodiments and variations disclosed herein are illustrative in all respects and are not restrictive. The scope of the invention is defined by the claims and includes all modifications within the meaning and scope equivalent to the claims.
Claims
1. A printing plate cylinder, wherein, have: The core, which has a cylindrical or cylindrical shape; and A cylindrical surface portion covers the circumferential surface of the core portion and has an inner circumferential surface facing the circumferential surface and an outer circumferential surface located on the side opposite to the inner circumferential surface. Multiple recesses are formed on the outer peripheral surface. Multiple protrusions are formed on the inner circumferential surface.
2. The printing cylinder according to claim 1, wherein, When viewed radially from the core, at least a portion of the gaps between the protrusions on the inner circumferential surface overlaps with portions on the outer circumferential surface where the plurality of recesses are not present.
3. The printing cylinder according to claim 1 or 2, wherein, The printing cylinder is used for gravure printing of functional pastes used in electronic components. The plurality of recesses on the outer peripheral surface constitute a printed pattern.
4. The printing cylinder according to any one of claims 1 to 3, wherein, The cylindrical surface portion contains at least one of nickel, chromium, and DLC.
5. The printing cylinder according to any one of claims 1 to 4, wherein, The cylindrical surface portion includes a substrate constituting the inner circumferential surface. The substrate is composed of a single component.
6. The printing cylinder according to claim 5, wherein, The thickness of the substrate is 0.1 mm or more and 0.15 mm or less.