Vehicle-mounted thermal management system and method and vehicle

Abstract

The invention discloses a vehicle-mounted heat management system and method and a vehicle, and belongs to the technical field of vehicle-mounted heat management, the vehicle-mounted heat management system comprises a refrigerator system and an air conditioning system, the refrigerator system comprises a semiconductor module and a cold storage module, the semiconductor module is used for heat exchange with a refrigerator, and the cold storage module is used for storing and releasing cold energy; the air conditioning system comprises the heat exchanger assembly, the heat exchanger assembly is connected with the semiconductor module and the cold storage module in a heat exchange mode, the refrigerator system does not need to be provided with an independent compressor and a refrigerating loop, heat exchange with the air conditioning system is achieved by arranging the semiconductor module and the cold storage module, and therefore the cooling capacity of the air conditioning system can be used for the refrigerator system; deep coupling of the refrigerator system and the air conditioning system is achieved, the refrigerator system can flexibly utilize refrigeration of the compressor and the cooling capacity of the cold storage module under different working conditions, and therefore the refrigerator system is suitable for various use scenes.

Description

Technical Field

[0001] This application relates to the field of vehicle thermal management technology, and in particular to a vehicle thermal management system, method and vehicle. Background Technology

[0002] Most car refrigerators are independent refrigeration systems. Car refrigerator systems mainly include two types: compressor-type car refrigerators and semiconductor-type car refrigerators. Compressor-type car refrigerators have strong cooling capacity, but the system cost is high and they also bring additional energy consumption and noise problems. Semiconductor-type car refrigerator systems usually work based on the Peltier effect, have a relatively simple structure, no freezing function, and a slow cooling speed. Summary of the Invention

[0003] A vehicle-mounted thermal management system, method, and vehicle are provided to solve the technical problems of the aforementioned vehicle-mounted refrigerator, such as high energy consumption, noise, lack of refrigeration function, and slow cooling speed.

[0004] Firstly, an on-board thermal management system is provided, comprising:

[0005] The refrigerator system includes a semiconductor module and a cold storage module. The semiconductor module is used for heat exchange with the refrigerator, and the cold storage module is used for storing and releasing cold energy. An air conditioning system, comprising a heat exchanger assembly, which is connected to a semiconductor module and a cold storage module for heat exchange.

[0006] In some embodiments, the heat exchanger assembly includes a first heat exchanger, which is respectively attached to the semiconductor module and the cold storage module.

[0007] In some embodiments, the semiconductor module and the cold storage module are respectively disposed on both sides of the first heat exchanger and are attached to the first heat exchanger.

[0008] In some embodiments, the air conditioning system includes a compressor, and the heat exchanger assembly includes a condenser and an evaporator, wherein the compressor, condenser and evaporator are arranged in series. The inlet of the first heat exchanger is connected to the outlet of the condenser, and the outlet of the first heat exchanger is connected to the inlet of the compressor.

[0009] In some embodiments, the semiconductor module has a hot end and a cold end, one of which is used for heat exchange with a refrigerator, and the other of which is used for heat exchange with a heat exchanger assembly.

[0010] In some embodiments, the vehicle thermal management system further includes an air-cooling duct and a first fan, the first fan being used to guide outside air to the hot end for cooling through the air-cooling duct.

[0011] In some embodiments, the vehicle thermal management system further includes a second fan and a third fan, wherein the second fan is used to cool the hot end and the third fan is used to cool the condenser.

[0012] In some embodiments, the refrigerator system includes a first valve body disposed between the outlet end of the condenser and the inlet end of the first heat exchanger; The air conditioning system includes a second valve body, which is located between the outlet end of the condenser and the inlet end of the evaporator.

[0013] In some embodiments, the vehicle thermal management system includes a battery heat exchanger, which is connected in parallel with an evaporator.

[0014] Secondly, this application also provides an in-vehicle thermal management method, applied to the above-mentioned in-vehicle thermal management system, including determining the current working mode of the in-vehicle thermal management system when the in-vehicle thermal management system is detected to meet the preset working mode switching conditions; the working mode is one of a first working mode, a second working mode, and a third working mode; In the first working mode, the refrigerator system and the air conditioning system work simultaneously, and the hot end of the semiconductor module exchanges heat with the heat exchanger of the air conditioning system. In the second working mode, the refrigerator system operates, and the cold storage module exchanges heat with the refrigerator system. In the third operating mode, the hot end of the semiconductor module exchanges heat with the outside air.

[0015] Thirdly, embodiments of this application also provide a vehicle including the aforementioned vehicle thermal management system.

[0016] The vehicle-mounted thermal management system in this application includes a refrigerator system and an air conditioning system. The refrigerator system includes a semiconductor module and a cold storage module. The semiconductor module is used for heat exchange with the refrigerator, and the cold storage module is used for storing and releasing cold energy. The air conditioning system includes a heat exchanger assembly, which is connected to the semiconductor module and the cold storage module for heat exchange. The refrigerator system does not need to have a separate compressor and refrigeration circuit. Instead, it achieves heat exchange with the air conditioning system by setting up the semiconductor module and the cold storage module. This allows the cold energy of the air conditioning system to be used in the refrigerator system, realizing a deep coupling between the refrigerator system and the air conditioning system. This enables the refrigerator system to flexibly utilize the compressor refrigeration and the cold energy of the cold storage module under different operating conditions, thereby adapting to various usage scenarios. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] To gain a more complete understanding of this application and its beneficial effects, the following description will be provided in conjunction with the accompanying drawings, wherein the same reference numerals in the following description denote the same parts.

[0019] Figure 1 A schematic diagram of a first vehicle-mounted thermal management system provided as an exemplary embodiment of this application; Figure 2 A schematic diagram of a second vehicle-mounted thermal management system provided as an exemplary embodiment of this application; Figure 3 A schematic diagram of a third vehicle-mounted thermal management system provided as an exemplary embodiment of this application; Figure 4 This is a schematic diagram of a fourth vehicle-mounted thermal management system provided as an exemplary embodiment of this application.

[0020] Explanation of reference numerals in the attached figures: 100. Refrigerator system; 110. Semiconductor module; 120. Cold storage module; 130. First valve body; 140. One-way valve; 200. Air conditioning system; 210. Heat exchanger assembly; 211. First heat exchanger; 212. Condenser; 213. Evaporator; 220. Compressor; 230. Second valve body; 240. Third valve body; 300. Air-cooled aisle; 310. First fan; 400. Second fan; 500. Third fan; 600. Battery heat exchanger. Detailed Implementation

[0021] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the protection scope of this application.

[0022] In the embodiments of this application, "at least one" refers to one or more; "multiple" refers to two or more. In the description of this application, the terms "first," "second," "third," etc., are used only for the purpose of distinguishing descriptions and should not be construed as indicating or implying relative importance, nor should they be construed as indicating or implying order.

[0023] References such as “one embodiment” or “some embodiments” as described in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the terms “comprising,” “including,” “having,” and variations thereof, as used in this specification, mean “including, but not limited to,” unless otherwise specifically emphasized.

[0024] The applicant noted that the vehicle-mounted refrigerator system 100 mainly includes two types: compressor-type vehicle-mounted refrigerators 220 and semiconductor-type vehicle-mounted refrigerators. Compressor-type refrigerators 220 typically employ an independent refrigeration circuit, and their structure includes a dedicated compressor 220, condenser 212, evaporator 213, and corresponding control valves. While this type of solution has strong cooling capacity and can achieve both refrigeration and freezing functions, its system structure is complex, with numerous components, resulting in high manufacturing and layout costs. It also introduces additional energy consumption and noise issues, hindering overall vehicle cost control and system integration. Semiconductor-type vehicle-mounted refrigerators typically operate based on the Peltier effect, have a relatively simple structure, and do not require refrigerant or a compressor 220. However, their cooling efficiency is limited by the temperature difference across the semiconductor module 110. When the hot end of the semiconductor cannot effectively dissipate heat, the cooling capacity of the cold end decreases significantly, resulting in slow cooling speed and limited temperature difference. This typically only meets refrigeration needs and is insufficient for stable freezing.

[0025] In view of this, this application provides an in-vehicle thermal management system, which includes a refrigerator system 100 and an air conditioning system 200. The refrigerator system 100 includes a semiconductor module 110 and a cold storage module 120. The semiconductor module 110 is used for heat exchange with the refrigerator, and the cold storage module 120 is used for storing and releasing cold energy. The air conditioning system 200 includes a heat exchanger assembly 210, which is connected to the semiconductor module 110 and the cold storage module 120 for heat exchange. The refrigerator system 100 does not need to set up a separate compressor 220 and refrigeration circuit. Instead, it achieves heat exchange with the air conditioning system 200 by setting up the semiconductor module 110 and the cold storage module 120. This allows the cold energy of the air conditioning system 200 to be used in the refrigerator system 100, realizing deep coupling between the refrigerator system 100 and the air conditioning system 200. This enables the refrigerator system 100 to flexibly utilize the refrigeration of the compressor 220 and the cold energy of the cold storage module 120 under different operating conditions, thereby adapting to various usage scenarios.

[0026] The vehicle-mounted thermal management system, method, and vehicle of this application will be described in detail below with reference to the accompanying drawings. Unless otherwise specified, the features of the following embodiments and implementations can be combined with each other.

[0027] Please see Figure 4This application provides an in-vehicle thermal management system, including a refrigerator system 100 and an air conditioning system 200. The air conditioning system 200 can be the vehicle's existing air conditioning system, typically including a compressor 220, a condenser 212, and an evaporator 213, connected in series to form a refrigeration circuit. The refrigerator system 100 no longer has a separate compressor 220 and refrigeration circuit; instead, it exchanges heat with the air conditioning system 200 through a semiconductor module 110 and a cold storage module 120. Specifically, the refrigerator system 100 includes a semiconductor module 110 and a cold storage module 120. The semiconductor module 110 exchanges heat with the refrigerator, and the cold storage module 120 stores and releases cold energy. The air conditioning system 200 includes a heat exchanger assembly 210, which is connected to both the semiconductor module 110 and the cold storage module 120 for heat exchange. This configuration allows the cooling capacity of the air conditioning system 200 to be used in the refrigerator system 100, achieving deep coupling between the refrigerator system 100 and the air conditioning system 200. This enables the refrigerator system 100 to flexibly utilize the cooling capacity of the compressor 220 and the cold storage module 120 under different operating conditions, thus adapting to various usage scenarios.

[0028] In some embodiments, the semiconductor module 110 has a hot end and a cold end. One of the hot end and the cold end is used for heat exchange with the refrigerator, and the other of the hot end and the cold end is used for heat exchange with the heat exchanger assembly 210. The semiconductor module 110 operates based on the Peltier effect. After being energized, it forms a significant temperature difference at its two ends, with one end being the heat-absorbing end and the other end being the heat-releasing end. By changing the polarity of the supply electrode of the semiconductor module 110, the functions of its cold end and hot end are interchanged, so that the cold end, which was originally used for cooling, becomes the hot end, exchanging heat with the inside of the refrigerator, thereby realizing the heating function of the refrigerator. By reasonably arranging the positional relationship of the semiconductor module 110 between the refrigerator and the heat exchanger assembly 210, and coordinating with the operating states of different heat exchangers in the air conditioning system 200, the refrigerator's cooling or heating functions can be realized. When the cold end is located inside the refrigerator, it exchanges heat with the refrigerator, and the evaporator 213 exchanges heat with the hot end. The evaporator 213 continuously removes the heat generated by the hot end through the absorption of heat by refrigerant evaporation, keeping the hot end at a low temperature, thereby ensuring that the cold end has a stable cooling capacity. When the hot end is inside the refrigerator, it exchanges heat with the refrigerator. The condenser 212 exchanges heat with the cold end. The condenser 212 raises the temperature of the cold end through the process of refrigerant condensation and heat release, so as to avoid the cold end temperature being too low and affecting the working stability of the semiconductor module 110.

[0029] In some embodiments, the cold storage module 120 stores a refrigerant, and the cold storage module 120 forms a heat exchange path with the hot end of the semiconductor module 110. For example, the cold storage module 120 and the semiconductor module 110 are directly attached or connected through a heat exchange pipeline. When the air conditioning system 200 is working, the refrigerant absorbs and stores the cold energy from the heat exchanger assembly 210; after the air conditioning stops, the refrigerant can release the cold energy to cool the hot end of the semiconductor module 110 and maintain the cooling effect at the cold end.

[0030] In some embodiments, refer to Figure 1 The heat exchanger assembly 210 includes a first heat exchanger 211, which is attached to both the semiconductor module 110 and the cold storage module 120. Specifically, the semiconductor module 110 and the cold storage module 120 are respectively disposed on both sides of the first heat exchanger 211 and attached to it. The first heat exchanger 211 can be a direct cooling plate, which plays a role in heat transfer. On the one hand, the semiconductor module 110 continuously generates heat during operation. This heat is directly conducted to the wall of the first heat exchanger 211 through the interface between the semiconductor module 110 and the first heat exchanger 211, and then carried away by the refrigerant inside the first heat exchanger 211, thereby achieving effective cooling of the hot end of the semiconductor. On the other hand, during the charging and cooling phase, the cold storage module 120 itself needs to be cooled to store cold energy. Similarly, the cold storage module 120 transfers its own heat to the first heat exchanger 211 through the interface with the first heat exchanger 211. The low-temperature refrigerant flowing through the first heat exchanger 211 carries away the heat, thus completing the charging process of the cold storage module 120. During the cooling phase of the cold storage module 120, the cold energy stored inside the cold storage module 120 can be transferred back to the first heat exchanger 211 through the interface, and then further used to cool the hot end of the semiconductor module 110.

[0031] In some embodiments, refer to Figure 1 The air conditioning system 200 includes a compressor 220, and the heat exchanger assembly 210 includes a condenser 212 and an evaporator 213, which are connected in series. The vehicle thermal management system includes a battery heat exchanger 600, which is connected in parallel with the evaporator 213. The inlet end of the first heat exchanger 211 is connected to the outlet end of the condenser 212, and the outlet end of the first heat exchanger 211 is connected to the inlet end of the compressor 220.

[0032] In some embodiments, during refrigeration operation, compressor 220 compresses low-temperature, low-pressure gaseous refrigerant into high-temperature, high-pressure gaseous refrigerant and delivers it to condenser 212. The high-temperature, high-pressure refrigerant exchanges heat with the outside air in condenser 212, releasing heat and gradually condensing into high-pressure liquid refrigerant. The refrigerant at the outlet of condenser 212 is split through a pipeline, with one path entering the first heat exchanger 211. As the liquid refrigerant flows in the first heat exchanger 211, it transfers cooling energy to the semiconductor module 110 and the cold storage module 120, which are attached to it. After absorbing heat, its temperature rises, and it then enters the inlet of compressor 220 from the outlet of the first heat exchanger 211, completing one refrigerant cycle. The other portion of the refrigerant can enter evaporator 213 or a battery heat exchanger 600 connected in parallel with evaporator 213 via a control valve. In evaporator 213, the refrigerant absorbs heat from the air inside the vehicle and undergoes a phase change evaporation, thereby cooling the passenger compartment. In battery heat exchanger 600, the refrigerant absorbs heat generated by the power battery, achieving battery cooling management. During heating operation, the air conditioning system 200 switches operating conditions, causing the condenser 212 and evaporator 213 to functionally switch roles. The high-temperature refrigerant releases heat in the heat exchanger inside the vehicle, thereby heating the passenger compartment, while the refrigerant continues to circulate according to the predetermined circuit.

[0033] In some embodiments, when the vehicle's air conditioning system 200 and refrigerator system 100 need to operate simultaneously under high ambient temperatures, the vehicle thermal management system enters a first operating mode. For example, when the ambient temperature is above 10°C, the air conditioning system 200 and refrigerator system 100 operate simultaneously. The air conditioning system 200 runs, and the low-temperature refrigerant output from the condenser 212 cools the hot end of the semiconductor module 110 via the first heat exchanger 211. The semiconductor module 110 utilizes the Peltier effect to further reduce the temperature of the cold end, thereby achieving the refrigerator's refrigeration or freezing function. At this time, the vehicle's air conditioning system 200 cools the vehicle interior while also providing heat dissipation for the refrigerator system 100.

[0034] In some embodiments, when the vehicle is parked or the air conditioning system 200 does not need to operate continuously, but it is still desirable to maintain a low-temperature environment in the refrigerator, the vehicle thermal management system can enter a second operating mode. In this mode, the refrigerator system 100 operates independently. The cold storage module 120 completes charging through the first heat exchanger 211. When the compressor 220 stops working, the cold storage module 120 can release the stored cold energy to cool the hot end of the semiconductor module 110. This configuration maintains a low-temperature state inside the refrigerator and reduces energy consumption.

[0035] In some embodiments, the vehicle thermal management system further includes a cooling duct 300 and a first fan 310. The first fan 310 is used to guide outside air to the hot end through the cooling duct 300 for cooling. Under low ambient temperature conditions, the vehicle thermal management system can enter a third operating mode. For example, when the ambient temperature is below 10°C, in this mode, the cooling circuit of the air conditioning system 200 is not working, and the hot end of the semiconductor module 110 exchanges heat with the outside air through the cooling duct 300. The first fan 310 is used to guide the low-temperature outside air to the hot end of the semiconductor module 110 for cooling, thereby allowing the cold end of the semiconductor module 110 to continue providing cooling capacity to the refrigerator.

[0036] In some embodiments, refer to Figure 2 and Figure 3 The vehicle thermal management system also includes a second fan 400 and a third fan 500. The second fan 400 is used to cool the hot end, and the third fan 500 is used to cool the condenser 212. Specifically, the second fan 400 is used to assist in cooling the hot end of the semiconductor module 110, and the third fan 500 is used to dissipate heat from the condenser 212, in order to adapt to different vehicle layout conditions and heat dissipation requirements.

[0037] In some embodiments, refer to Figure 1 The refrigerator system 100 includes a first valve body 130, which is located between the outlet end of the condenser 212 and the inlet end of the first heat exchanger 211. The air conditioning system 200 includes a second valve body 230, which is located between the outlet end of the condenser 212 and the inlet end of the evaporator 213. By controlling different valve bodies, the refrigerant can be switched between different circuits to meet the needs of various operating modes. The first valve body 130 can be a safety-optimized thermostatic expansion valve or an electronic expansion valve. Using a thermostatic expansion valve results in a simpler structure and lower cost; using an electronic expansion valve allows for more precise control strategies.

[0038] In some embodiments, refer to Figure 1 The air conditioning system 200 includes a third valve body 240, which is located between the outlet end of the condenser 212 and the inlet end of the battery heat exchanger 600. By controlling the first valve body 130, the second valve body 230 and the third valve body 240, the refrigerant can be switched between different circuits to meet the needs of multiple working modes.

[0039] In some embodiments, refer to Figure 1The refrigerator system 100 includes a one-way valve 140, which guides the refrigerant flow along the outlet end of the condenser 212, through the first heat exchanger 211, and towards the inlet end of the compressor 220. It is understood that the refrigerator system 100 does not always operate synchronously with the air conditioning system 200; rather, it operates under various conditions, including simultaneous operation of the air conditioner and refrigerator, independent operation of the refrigerator system 100, and operation when the air conditioner is off. By limiting the refrigerant flow in a predetermined direction using the one-way valve 140, reverse flow of the refrigerant due to pressure difference is prevented when the compressor 220 stops or a partial circuit is closed, ensuring the stable operation of the vehicle thermal management system.

[0040] In some embodiments, this application also provides an in-vehicle thermal management method, applied to the above-mentioned in-vehicle thermal management system, including determining the current working mode of the in-vehicle thermal management system when the in-vehicle thermal management system is detected to meet preset working mode switching conditions; the working mode is one of a first working mode, a second working mode, and a third working mode; In the first operating mode, the refrigerator system 100 and the air conditioning system 200 operate simultaneously, with the hot end of the semiconductor module 110 exchanging heat with the heat exchanger of the air conditioning system 200. When the ambient temperature is high, and it is detected that the vehicle's air conditioning system 200 and refrigerator system 100 need to operate simultaneously, the vehicle thermal management system enters the first operating mode. For example, when the ambient temperature is above 10°C, the air conditioning system 200 and refrigerator system 100 operate simultaneously. The air conditioning system 200 runs, and the low-temperature refrigerant output from the condenser 212 cools the hot end of the semiconductor module 110 via the first heat exchanger 211. The semiconductor module 110 utilizes the Peltier effect to further reduce the temperature of the cold end, thereby achieving the refrigerator's refrigeration or freezing function. At this time, the vehicle's air conditioning system 200, while cooling the vehicle interior, also provides heat dissipation conditions for the hot end of the refrigerator system 100.

[0041] In the second operating mode, the refrigerator system 100 operates, and the cold storage module 120 exchanges heat with the refrigerator system 100. When the vehicle is parked or the air conditioning system 200 does not need to run continuously, but it is still desirable to maintain a low-temperature environment in the refrigerator, the vehicle thermal management system can enter the second operating mode. In this mode, the refrigerator system 100 operates independently. The cold storage module 120 completes charging and cooling through the first heat exchanger 211. When the compressor 220 stops working, the cold storage module 120 can release the stored cold energy to cool the hot end of the semiconductor module 110. This setup maintains a low-temperature state inside the refrigerator and reduces energy consumption.

[0042] In the third operating mode, the hot end of the semiconductor module 110 exchanges heat with the outside air. Under low ambient temperature conditions, the vehicle thermal management system can enter the third operating mode. For example, when the ambient temperature is below 10°C, in this mode, the cooling circuit of the air conditioning system 200 is not operational, and the hot end of the semiconductor module 110 exchanges heat with the outside air through the air-cooling channel 300. The first fan 310 guides the low-temperature outside air to the hot end of the semiconductor module 110 to cool it, thereby allowing the cold end of the semiconductor module 110 to continue providing cooling capacity to the refrigerator.

[0043] In some embodiments, this application provides a vehicle including the above-described on-board thermal management system. The vehicle provided in this embodiment can be a new energy vehicle; specifically, it can be a pure electric vehicle, a series hybrid electric vehicle, a parallel hybrid electric vehicle, or a series-parallel hybrid electric vehicle. This application does not specifically limit the specific type of vehicle.

[0044] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0045] The above are merely preferred embodiments of this application and are not intended to limit this application in any way. Although this application has disclosed preferred embodiments as above, it is not intended to limit this application. Any person skilled in the art can make some modifications or alterations to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the technical solution of this application. Any simple modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of this application without departing from the scope of the technical solution of this application shall still fall within the scope of the technical solution of this application.

Claims

1. A vehicle-mounted thermal management system, characterized in that, include: A refrigerator system, comprising a semiconductor module and a cold storage module, wherein the semiconductor module is used for heat exchange with the refrigerator and the cold storage module is used for storing and releasing cold energy; An air conditioning system, the air conditioning system including a heat exchanger assembly, the heat exchanger assembly being heat-exchangingly connected to the semiconductor module and the cold storage module respectively.

2. The vehicle-mounted thermal management system according to claim 1, characterized in that, The heat exchanger assembly includes a first heat exchanger, which is respectively attached to the semiconductor module and the cold storage module.

3. The vehicle-mounted thermal management system according to claim 2, characterized in that, The semiconductor module and the cold storage module are respectively disposed on both sides of the first heat exchanger and are attached to the first heat exchanger.

4. The vehicle-mounted thermal management system according to claim 2, characterized in that, The air conditioning system includes a compressor, and the heat exchanger assembly includes a condenser and an evaporator, wherein the compressor, the condenser, and the evaporator are connected in series. The inlet end of the first heat exchanger is connected to the outlet end of the condenser, and the outlet end of the first heat exchanger is connected to the inlet end of the compressor.

5. The vehicle-mounted thermal management system according to claim 4, characterized in that, The semiconductor module has a hot end and a cold end, one of which is used for heat exchange with the refrigerator, and the other of which is used for heat exchange with the heat exchanger assembly.

6. The vehicle-mounted thermal management system according to claim 5, characterized in that, The vehicle-mounted thermal management system also includes an air-cooling channel and a first fan, the first fan being used to guide outside air to the hot end through the air-cooling channel for cooling.

7. The vehicle-mounted thermal management system according to claim 5, characterized in that, The vehicle-mounted thermal management system further includes a second fan and a third fan, wherein the second fan is used to cool the hot end and the third fan is used to cool the condenser.

8. The vehicle-mounted thermal management system according to claim 4, characterized in that, The refrigerator system includes a first valve body, which is disposed between the outlet end of the condenser and the inlet end of the first heat exchanger; The air conditioning system includes a second valve body, which is disposed between the outlet end of the condenser and the inlet end of the evaporator.

9. The vehicle-mounted thermal management system according to claim 4, characterized in that, The vehicle thermal management system includes a battery heat exchanger, which is connected in parallel with the evaporator.

10. A vehicle thermal management method, applied to a vehicle thermal management system as described in any one of claims 1 to 9, characterized in that, This includes determining the current operating mode of the vehicle thermal management system when the system detects that it meets preset operating mode switching conditions; the operating mode is one of a first operating mode, a second operating mode, and a third operating mode. In the first working mode, the refrigerator system and the air conditioning system work simultaneously, and the hot end of the semiconductor module exchanges heat with the heat exchanger of the air conditioning system. In the second working mode, the refrigerator system operates, and the cold storage module exchanges heat with the refrigerator system; In the third operating mode, the hot end of the semiconductor module exchanges heat with the outside air.

11. A vehicle, characterized in that, Includes the vehicle thermal management system as described in any one of claims 1 to 9.

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