Chip testing equipment and chip testing method
By designing a linkage mechanism and a closing mechanism, the cumbersome chip adsorption and detachment issues in chip testing equipment are solved, achieving efficient testing and equipment protection, and improving equipment durability and operational safety.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- SHENZHEN RONGWEI PRECISION ELECTRONICS CO LTD
- Filing Date
- 2026-01-29
- Publication Date
- 2026-05-12
- Estimated Expiration
- Not applicable · inactive patent
AI Technical Summary
Existing chip testing equipment involves a cumbersome process of removing the chip after testing, which leads to frequent start-stop cycles of the vacuum pump, reducing testing efficiency and shortening equipment lifespan.
A chip testing device was designed, which uses a linkage mechanism to control the tester to press and contact the chip only at the detection position, and maintains separation during the transfer process. Combined with the design of the closing mechanism and isolation plate, the suction force of the pick-up tube on the chip is released, reducing friction and wear.
It improves testing efficiency, protects chips and testers, extends equipment durability, and enhances operational safety and reliability.
Smart Images
Figure CN122017526A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of chip testing technology, and in particular to a chip testing device and a chip testing method. Background Technology
[0002] Chips are the carriers of information processing, storage and transmission. Their performance and quality directly determine the overall efficiency and reliability of electronic products. In order to ensure that the functions of chips leaving the factory meet the design specifications, chip testing has become an indispensable key link in the integrated circuit industry chain. Chip testing refers to applying specific electrical signal excitation to the chip through special testing equipment after the chip manufacturing is completed, and monitoring its output response, so as to determine whether the chip has defects and whether its performance meets the standards.
[0003] To ensure testing stability, chip testing often uses vacuum adsorption fixation. However, the adsorption needs to be removed after each test, which forces the vacuum pump to start and stop frequently. This repetitive working state not only reduces testing efficiency but also easily leads to premature wear of the vacuum pump equipment and shortens its service life. Therefore, this application proposes a chip testing device and a chip testing method. Summary of the Invention
[0004] The purpose of this invention is to address the problem in the prior art where removing the chip after testing is cumbersome, and to propose a chip testing device and chip testing method.
[0005] In a first aspect, the present invention provides a chip testing device, including a motor installed inside a processing table, a turntable drivenly connected to the output end of the motor, a connecting frame installed on the top of the processing table, two sets of guide rods fixedly connected to the outside of the connecting frame, a horizontal plate slidably connected to the outside of the guide rods, and a tester fixedly connected inside the horizontal plate, and further including: At least four sets of straws are fixed inside the turntable. Hollow recesses are fixed to the outside of the straws. Multiple sets of adsorption holes are opened at the top of the straws. An adsorption mechanism for adsorbing chips is provided around the straws. The robotic arm is mounted on the top of the processing table. The output end of the robotic arm is equipped with a suction cup, and a dust removal mechanism is set around the suction cup to blow away impurities on the chip surface. A buffer mechanism is used to reduce the impact force generated when the dust removal mechanism moves downward; An isolation plate is slidably connected inside the hollow recess. A closing mechanism is provided around the isolation plate to buffer the operation of the mechanism, causing the isolation plate to block the internal channel of the suction tube and release the adsorption mechanism from the chip.
[0006] Optionally, the adsorption mechanism includes a vacuum pump, a transmission tube, a concave plate, and a connecting ring plate. The vacuum pump is installed at the top of the processing table. The transmission tube is fixedly connected to the output end of the vacuum pump. The end of the transmission tube away from the vacuum pump is fixedly connected to the inside of the concave plate. The concave plate is fixedly connected to the top of the processing table. The connecting ring plate is rotatably connected to the inner wall of the concave plate, and the inside of the connecting ring plate is fixedly connected to the outside of the suction tube.
[0007] Optionally, the dust removal mechanism includes a piston tube, a support frame, a piston rod, a piston plate, an air pipe, and a spring. The piston tube is disposed on the outside of the suction cup. The support frame is fixed between the piston tube and the suction cup. The piston rod is fixed to the bottom end of the piston plate. The piston plate is slidably connected to the inner wall of the piston tube. The air pipe is fixed inside the piston tube and the interior of the piston tube are interconnected. The spring is fixed between the inner wall of the piston tube and the piston plate.
[0008] Optionally, the buffer mechanism includes a buffer plate, two sets of guide rods, two springs, and a pressure rod. The two sets of guide rods are fixed to the top of the turntable, and the two sets of guide rods slide through both ends of the buffer plate. The springs are sleeved on the outside of the guide rods and fixed between the turntable and the buffer plate. The pressure rod is fixed to the bottom of the buffer plate.
[0009] Optionally, the closing mechanism includes a triangular block, two sets of guide rods, and a spring. The triangular block is located at the bottom of the pressure rod and is fixedly connected to the end of the isolation plate away from the straw. Both sets of guide rods are fixedly connected to the outside of the straw and slide through the isolation plate. The isolation plate is L-shaped, and the spring is fixedly connected between the straw and the isolation plate.
[0010] Optionally, the elastic potential energy of spring one is greater than the sum of the elastic potential energies of springs two and spring three.
[0011] Optionally, four sets of connecting rods are fixedly connected to the top of the turntable, and a trapezoidal block is fixedly connected to the end of each of the four sets of connecting rods away from the turntable. A linkage mechanism that cooperates with the trapezoidal block is provided on the outer side of the horizontal plate. The linkage mechanism is used to drive the tester to move down and fit the chip when the chip arrives below the tester.
[0012] Optionally, the linkage mechanism includes a connecting ball, a side rod, and two sets of springs. The connecting ball is attached to the bottom end of the trapezoidal block, the side rod is fixed between the connecting ball and the horizontal plate, and the two sets of springs are respectively sleeved on the outside of the two sets of guide rods. The springs are fixed between the horizontal plate and the connecting frame.
[0013] Optionally, both the pressure bar and the triangular block are made of polyoxymethylene.
[0014] Secondly, the present invention provides a chip testing method, applied to the chip testing equipment described in the first aspect, the method comprising the following steps: S1. Place the chip evenly on the turntable and start the motor to drive the turntable to rotate. The rotation of the turntable will move the chip. S2. When the chip moves to the bottom of the tester, the turntable drives the trapezoidal block to squeeze the linkage mechanism through the connecting rod. S3. The linkage mechanism is driven by force to move the tester downward, so that the tester is in contact with the chip, a specific electrical signal is applied to the chip to excite it, and its output response is monitored, thereby determining whether the chip has defects and whether its performance meets the standards.
[0015] Compared with the prior art, this application includes at least one of the following beneficial technical effects: This invention, through the structural design of the linkage mechanism, enables the linkage mechanism to control the tester to only press and contact the chip at the detection position, while maintaining separation during the transfer process. This mechanism avoids continuous friction between the chip and the tester during chip transport, ensuring contact during testing and effectively reducing unnecessary wear, thereby protecting the chip and the tester and improving the durability of the equipment.
[0016] Furthermore, through the structural design of the closing mechanism and the isolation plate, the closing mechanism controls the isolation plate, blocking the negative pressure channel of the suction tube when the robotic arm grasps the chip. This design effectively relieves the suction force of the suction tube on the chip, making the robotic arm grasp the chip more smoothly and avoiding the chip being pulled and damaged by suction forces from both sides at the same time, thus significantly improving the safety and reliability of the transfer operation. Attached Figure Description
[0017] Figure 1 This is a schematic diagram of the overall structure of a chip testing device. Figure 2 This is a cross-sectional view of the processing table; Figure 3 This is a cross-sectional view of the concave plate; Figure 4 This is a structural schematic diagram of the robotic arm and the connecting ring plate. Figure 5 for Figure 4 A magnified structural diagram at point A; Figure 6 for Figure 4 A magnified structural diagram at point B; Figure 7 This is a schematic diagram of the trapezoidal block and the connecting sphere. Figure 8 This is a schematic diagram of the structure of the straw and the adsorption hole.
[0018] Reference numerals: 1. Processing table; 2. Motor; 3. Turntable; 4. Connecting frame; 6. Guide rod one; 7. Horizontal plate; 8. Tester; 9. Suction tube; 10. Adsorption hole; 11. Robotic arm; 12. Suction cup; 13. Isolation plate; 14. Vacuum pump; 15. Transmission pipe; 16. Concave plate; 17. Connecting ring plate; 18. Piston tube; 19. Support frame; 20. Piston rod; 21. Piston plate; 22. Air pipe; 23. Spring one; 24. Buffer plate; 25. Guide rod two; 26. Spring two; 27. Pressure rod; 28. Triangular block; 29. Guide rod three; 30. Spring three; 31. Connecting rod; 32. Trapezoidal block; 33. Connecting ball; 34. Side rod; 35. Spring four. Detailed Implementation
[0019] To make the objectives, features, and advantages of this invention more apparent and understandable, the technical solutions of the embodiments of this invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the embodiments described below are only some embodiments of this invention, and not all embodiments. Based on the embodiments of this invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this invention.
[0020] In the description of this invention, it should be understood that the terms "upper," "lower," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. It should be noted that when a component is considered to be "connected" to another component, it can be directly connected to the other component or there may be a component positioned centrally in the connection.
[0021] The technical solution of the present invention will be further described below with reference to the accompanying drawings and specific embodiments.
[0022] like Figure 1 and Figure 2As shown, the chip testing equipment proposed in this invention includes a motor 2 installed inside a processing table 1. The output end of the motor 2 is connected to a turntable 3 for placing chips. First, the chips are evenly placed on the turntable 3. Then, the motor 2 runs, driving the turntable 3 to rotate, which in turn moves the chips. A connecting frame 4 is installed at the top of the processing table 1. Two sets of guide rods 6 are fixed to the outside of the connecting frame 4. A horizontal plate 7 is slidably connected to the outside of the guide rods 6. Under the action of gravity, the horizontal plate 7 is located at the bottom of the outside of the guide rods 6. A tester 8 for testing chips is fixed inside the horizontal plate 7. When the chip moves to the bottom of the tester 8, the tester 8 adheres to the chip and applies a specific electrical signal to the chip, and monitors its output response to determine whether the chip has defects and whether its performance meets the standards. It should be noted that the tester 8 is a conventional technology in existing chip measurement, which is mature and will not be elaborated further.
[0023] As one implementation method, such as Figure 2 and Figure 3 As shown, the testing equipment includes at least four sets of suction tubes 9 fixed inside the turntable 3. Hollow recesses are fixed to the outside of the suction tubes 9. When the chip is laid on the turntable 3, the bottom end of the chip is in contact with the top end of the suction tube 9. Multiple sets of suction holes 10 are opened at the top end of the suction tube 9. A suction mechanism for adsorbing the chip is provided around the suction tube 9. The suction mechanism creates a negative pressure inside the suction tube 9 and adsorbs the chip through the multiple sets of suction holes 10. When the suction mechanism is running, it will adsorb and fix the chip above the suction tube 9, thereby avoiding the problem of chip shaking affecting the measurement results when the turntable 3 moves the chip or when the tester 8 tests the chip. Furthermore, such as Figure 4 , Figure 5 and Figure 6As shown, the testing equipment also includes a robotic arm 11 mounted on top of the processing table 1. A suction cup 12 is installed at the output end of the robotic arm 11. After the chip testing is completed, the robotic arm 11 moves, causing the suction cup 12 to move vertically downwards to grip the chip. A dust removal mechanism is provided around the suction cup 12 to blow away impurities from the chip surface. The dust removal mechanism removes impurities from the chip surface as the suction cup 12 moves downwards. The suction cup 12 moves downwards, causing the dust removal mechanism to move synchronously. A buffer mechanism is used to reduce the impact force generated when the dust removal mechanism moves downwards. During operation, the dust removal mechanism will contact and collide with the buffer mechanism. The buffer mechanism will deform under stress, and the elastic potential energy generated by the deformation of the buffer mechanism will reduce the impact force on the dust removal mechanism. The impact force generated when the structure moves downward improves the service life of the dust removal mechanism. After the buffer mechanism deforms to its limit distance, the dust removal mechanism will generate wind force, which will blow towards the chip surface. Under the action of the wind force, the fine dust on the chip surface will be removed from the chip surface. Then, when the suction cup 12 contacts the chip, the clean chip can improve the stability of the suction cup 12 when adsorbing and grasping the chip. Finally, the robotic arm 11 will use the suction cup 12 to grasp the tested chip to the designated position. The designated position depends on the actual situation. It should be noted that the suction cup 12 is existing technology and the technology is mature. The adsorption force generated by the suction cup 12 is greater than the adsorption force generated by the adsorption mechanism on the chip by the robotic arm 11.
[0024] Furthermore, such as Figure 4 , Figure 5 , Figure 6 and Figure 8 As shown, the testing device also includes a partition plate 13 slidably connected inside the hollow recess. In the initial state, the partition plate 13 is located inside the hollow recess, and the partition plate 13 does not seal the inside of the straw 9 (e.g., Figure 8 As shown, the protruding part on the outside of the straw 9 is a hollow recess, which is used to place the isolation plate 13. The hollow recess fits tightly with the isolation plate 13, and the hollow recess is connected to the inside of the straw 9, so there is no risk of air leakage. The suction force generated inside the straw 9 can normally adsorb the chip through the adsorption hole 10. The isolation plate 13 is provided with a closing mechanism on its periphery. The closing mechanism is used to buffer the operation of the mechanism, causing the isolation plate 13 to block the internal channel of the straw 9, so that the negative pressure inside the straw 9 cannot be transmitted to the adsorption hole 10, thus releasing the adsorption of the chip. During operation, the buffer mechanism squeezes the closing mechanism, and the closing mechanism, under force, moves the isolation plate 13, causing the isolation plate 13 to block the internal channel of the straw 9. At this time, the negative pressure generated by the straw 9 is blocked by the isolation plate 13, and the negative pressure air cannot be adsorbed through the adsorption hole 10 to adsorb the chip. When the robotic arm 11 drives the suction cup 12 to grab the chip in this area, it does not need to overcome the adsorption force applied to the chip by the original adsorption hole 10, making the suction cup 12 grab more easily, and also avoiding the situation where the chip is pulled by negative pressure adsorption on both sides, causing damage.
[0025] As one implementation method, such as Figure 3 and Figure 4 As shown, the adsorption mechanism includes a vacuum pump 14, a transfer pipe 15, a concave plate 16, and a connecting ring plate 17. The adsorption mechanism is described in detail below: Vacuum pump 14 is installed at the top of processing table 1. Transmission pipe 15 is fixedly connected to the output end of vacuum pump 14. The end of transmission pipe 15 away from vacuum pump 14 is fixedly connected to the inside of concave plate 16. Concave plate 16 is fixedly connected to the top of processing table 1. When vacuum pump 14 is running, it draws air from inside concave plate 16 through transmission pipe 15, forming a negative pressure chamber inside concave plate 16. Connecting ring plate 17 is rotatably connected to the inner wall of concave plate 16, and the inside of connecting ring plate 17 is fixedly connected to the outside of suction pipe 9. Connecting ring plate 17 is made of rubber, which can seal the top of the inner wall of concave plate 16. Connecting ring plate 17 can also rotate synchronously with suction pipe 9. When negative pressure is generated inside concave plate 16, the negative pressure air will adsorb the chip through suction pipe 9 and multiple sets of adsorption holes 10, so that the chip is firmly fixed on the top of turntable 3, improving the stability of chip transfer and chip testing.
[0026] Furthermore, such as Figure 4 , Figure 5 and Figure 6 As shown, the dust removal mechanism includes a piston tube 18, a support frame 19, a piston rod 20, a piston plate 21, an air pipe 22, and a spring 23. The dust removal mechanism is described in detail below: The piston tube 18 is located on the outside of the suction cup 12, and the support frame 19 is fixed between the piston tube 18 and the suction cup 12. When the robotic arm 11 moves the suction cup 12 downward, the suction cup 12 will move the piston tube 18 vertically downward through the support frame 19. The piston rod 20 is fixed to the bottom end of the piston plate 21. As the piston tube 18 continues to move downward, the piston rod 20 will contact the buffer mechanism. Even after the buffer mechanism deforms to its limit distance, the piston tube 18 is still in a downward state. The piston plate 21 is slidably connected to the inner wall of the piston tube 18. At this time, the piston rod 20 is blocked by the buffer mechanism and remains stationary. As the piston tube 18 moves downward, the top of its inner side will continuously approach the piston plate 21. The piston plate 21 then compresses the air inside the piston tube 18. Fixed inside the piston tube 18, the air pipe 22 is connected to the inside of the piston tube 18. The air inside the piston tube 18 is discharged through the air pipe 22. Since the opening of the air pipe 22 is located in the direction of the chip, the air discharged from the air pipe 22 blows towards the chip surface to remove dust from the chip. Spring 23 is fixed between the inner wall of the piston tube 18 and the piston plate 21. When the piston tube 18 moves downward, the piston tube 18 will also work with the piston plate 21 to squeeze the spring 23, causing the spring 23 to deform under force and generate elastic potential energy. When the suction cup 12 grabs the chip, the robotic arm 11 drives the suction cup 12 to move upward, and the spring 23 will release the elastic potential energy, pushing the piston plate 21 downward and returning it to its initial position along the inside of the piston tube 18 (e.g., ...). Figure 5 (as shown), thus facilitating the next dust removal operation.
[0027] Furthermore, such as Figure 5 and Figure 6 As shown, the buffer mechanism includes a buffer plate 24, two sets of guide rods 25, a spring 26, and a pressure rod 27. The buffer mechanism is described in detail below: Both sets of guide rods 25 are fixed to the top of the turntable 3, and slide through both ends of the buffer plate 24. After the piston rod 20 moves down a certain distance, it will contact and squeeze the buffer plate 24. The buffer plate 24 will then move down along the outside of the guide rods 25, thereby reducing the impact force from the piston rod 20. The spring 26 is sleeved on the outside of the guide rods 25 and is fixed between the turntable 3 and the buffer plate 24. The downward movement of the buffer plate 24 will cooperate with the rotation... When spring 26 is compressed by piston rod 3, it deforms and generates elastic potential energy. The pressure rod 27 is fixed to the bottom end of buffer plate 24. When buffer plate 24 moves down, it also drives pressure rod 27 to move down synchronously. The downward movement of pressure rod 27 will drive the closing mechanism to operate. After piston rod 20 is released from the compression of buffer plate 24, spring 26 will release elastic potential energy, thereby pushing buffer plate 24 to move up and reset. The upward movement of buffer plate 24 will drive pressure rod 27 to move up and reset, releasing the control of the closing mechanism.
[0028] Among them, such as Figure 6 As shown, the closing mechanism includes a triangular block 28, two sets of guide rods 29, and a spring 30. The closing mechanism is described in detail below: Triangular block 28 is located at the bottom of pressure rod 27. Initially, the isolation plate 13 does not enclose the straw 9. When pressure rod 27 moves down and presses the inclined surface of triangular block 28, both pressure rod 27 and triangular block 28 are made of polyoxymethylene (POM), which has high rigidity and strength and is suitable for working scenarios requiring long-term wear in this embodiment. When triangular block 28 is subjected to force, it will move towards the straw 9. Triangular block 28 is fixed to the end of isolation plate 13 away from straw 9. The movement of triangular block 28 will cause isolation plate 13 to move synchronously. The two sets of guide rods 29 are fixed to the outside of the straw 9, and both sets of guide rods 29 slide through the isolation plate 13. As the isolation plate 13 moves along the outside of the guide rods 29 toward the straw 9, the isolation plate 13 gradually blocks the internal channel of the straw 9. When the pressure rod 27 moves down to its limit distance, the isolation plate 13 just completely seals the internal channel of the straw 9. At this time, the negative pressure air generated by the straw 9 cannot be adsorbed onto the bottom of the chip through the adsorption hole 10, thus facilitating the suction cup. The 12-pair chip-top gripping operation involves an L-shaped isolation plate 13. A spring 30 is fixed between the suction tube 9 and the isolation plate 13. As the isolation plate 13 moves towards the suction tube 9, it also compresses the spring 30, causing it to deform and generate elastic potential energy. When the pressure rod 27 releases its pressure on the triangular block 28, the spring 30 releases its elastic potential energy, pushing the isolation plate 13 to move in the opposite direction and reset. The reset of the isolation plate 13 then drives the triangular block... 28 is reset to facilitate the next pressing operation of the pressure rod 27 on the triangular block 28. It should be noted that the elastic potential energy of spring 1 23 is greater than the sum of the elastic potential energy of the two sets of springs 26 and 30. Moreover, the elastic potential energy of spring 1 23 is sufficient to overcome the weight of the triangular block 28 and the isolation plate 13, as well as the frictional force generated when the isolation plate 13 moves laterally. Therefore, it is ensured that when the piston rod 20 moves down to press the buffer plate 24, the elastic potential energy of spring 1 23 is sufficient to push the isolation plate 13 to block the internal channel of the suction tube 9.
[0029] As one implementation method, such as Figure 7As shown, four sets of connecting rods 31 are fixed to the top of the turntable 3. Trapezoidal blocks 32 are fixed to the ends of the four sets of connecting rods 31 away from the turntable 3. When the turntable 3 rotates, it drives the trapezoidal blocks 32 to move in a circular motion via the four sets of connecting rods 31. A linkage mechanism that cooperates with the trapezoidal blocks 32 is provided on the outer side of the horizontal plate 7. This linkage mechanism is used to move the tester 8 downwards to fit the chip when the chip arrives below it. Initially, under the action of the linkage mechanism, the tester 8 does not fit against the chip at its bottom, thus avoiding excessive friction between the tester 8 and the chip during chip transfer. When the chip moves with the turntable 3 to below the tester 8, the turntable 3... Simultaneously, the connecting rod 31 drives the trapezoidal block 32 to squeeze the linkage mechanism. The force on the linkage mechanism will cause the tester 8 to move downward. Finally, the limit distance of the linkage mechanism will cause the tester 8 to fit with the chip. The tester 8 will then test the chip. After the test is completed, the turntable 3 will continue to transfer the chip. Under the action of the rotation of the turntable 3, the trapezoidal block 32 will release from the squeezing of the linkage mechanism. The linkage mechanism will then move upward and reset. The upward movement of the linkage mechanism will cause the tester 8 to move upward, thereby ending the fit between the tester 8 and the chip. This avoids the tester 8 and the chip being damaged due to excessive friction time during the chip transfer process.
[0030] Furthermore, such as Figure 7 As shown, the linkage mechanism includes a connecting ball 33, a side rod 34, and two sets of springs 35. The linkage mechanism is described in detail below: The connecting ball 33 is attached to the bottom end of the trapezoidal block 32. Initially, the tester 8 is not attached to the chip at its bottom. When the turntable 3 moves the chip to below the tester 8, the turntable 3 will, through the connecting rod 31, cause the trapezoidal block 32 to be in a state of squeezing the connecting ball 33. The side rod 34 is fixed between the connecting ball 33 and the horizontal plate 7. When the connecting ball 33 is subjected to force, it will cause the side rod 34 to move down. The downward movement of the side rod 34 will cause the horizontal plate 7 to move down. The horizontal plate 7 will eventually cause the tester 8 to move down and attach to the chip, allowing the tester 8 to test the chip. Two sets of springs 35 are respectively sleeved on the outside of the two sets of guide rods 6. The springs 35 are fixed to the horizontal plate 7 and the connecting frame. Between 4, and when the horizontal plate 7 moves down, the horizontal plate 7 will also work with the connecting frame 4 to pull the spring 35, causing the spring 35 to deform under force and generate elastic potential energy. When the trapezoidal block 32 passes the connecting ball 33, the chip test is completed, and the turntable 3 continues to transfer the chip. The connecting ball 33 is squeezed by the trapezoidal block 32 and ends simultaneously. The spring 35 will release its elastic potential energy and pull the horizontal plate 7 to move up and reset. The upward movement of the horizontal plate 7 will cause the tester 8 to detach from the chip, thereby avoiding damage caused by long-term friction between the tester 8 and the chip when the chip moves. It should be noted that the maximum upward distance of the connecting ball 33 will not be higher than the top of the trapezoidal block 32.
[0031] A chip testing method, comprising the following steps: S1. First, place the chip evenly on the turntable 3. Start the motor 2 to drive the turntable 3 to rotate. The rotation of the turntable 3 will move the chip. S2. Subsequently, when the chip moves to the bottom of the tester 8, the turntable 3 drives the trapezoidal block 32 to squeeze the linkage mechanism via the connecting rod 31. S3. Finally, the linkage mechanism is driven by force to move the tester 8 downward, so that the tester 8 is in contact with the chip, a specific electrical signal is applied to the chip, and its output response is monitored, thereby determining whether the chip has defects and whether its performance meets the standards.
[0032] In this embodiment, the chip is first evenly placed on the turntable 3, with the bottom of the chip in contact with the top of the suction tube 9. The vacuum pump 14 draws air from the inside of the concave plate 16 through the transmission tube 15, creating a negative pressure chamber inside the concave plate 16. When a negative pressure is generated inside the concave plate 16, the negative pressure air will be adsorbed by the suction tube 9 and multiple sets of adsorption holes 10, firmly fixing the chip to the top of the turntable 3. Then, the motor 2 runs, driving the turntable 3 to rotate, which in turn moves the chip. Initially, the tester 8 is not in contact with the chip at its bottom. When the turntable 3 moves the chip to below the tester 8, the turntable 3 will, through the connecting rod 31, drive the trapezoidal block 32 to be squeezed. When the connecting ball 33 is pressed, the force on the connecting ball 33 will cause the side rod 34 to move down, and the side rod 34 will move down, which will cause the horizontal plate 7 to move down. The horizontal plate 7 will eventually cause the tester 8 to move down and fit with the chip. The tester 8 can then test the chip. When the horizontal plate 7 moves down, it will also work with the connecting bracket 4 to pull the spring 35, causing the spring 35 to deform under force and generate elastic potential energy. When the trapezoidal block 32 passes the connecting ball 33, the chip test is completed. The turntable 3 continues to transfer the chip. The pressure on the connecting ball 33 by the trapezoidal block 32 ends simultaneously. The spring 35 will then release its elastic potential energy, pulling the horizontal plate 7 up to reset. The upward movement of the horizontal plate 7 will cause the tester 8 to detach from the chip. After the chip testing is completed, the robotic arm 11 moves, causing the suction cup 12 to move vertically downwards to grasp the chip. The downward movement of the suction cup 12, via the support frame 19, causes the piston tube 18 to move vertically downwards. As the piston tube 18 continues to move downwards, the piston rod 20 contacts and presses against the buffer plate 24. The buffer plate 24, under pressure, moves downwards along the outer side of the guide rod 25, thus reducing the impact force from the piston rod 20. The downward movement of the buffer plate 24, in conjunction with the turntable 3, compresses the spring 26. The spring 26 deforms under pressure, generating elastic potential energy. The downward movement of the buffer plate 24 also causes the pressure rod 27 to move downwards simultaneously. When the pressure rod 27 moves downwards and presses against the inclined surface of the triangular block 28, the force on the triangular block 28 will move towards the suction tube 9. As the triangular block 28 moves, it causes the isolation plate 13 to move synchronously. As the isolation plate 13 moves along the outside of the guide rod 29 towards the straw 9, it gradually blocks the internal channel of the straw 9. When the pressure rod 27 moves to its maximum distance, the isolation plate 13 completely seals the internal channel of the straw 9. At this point, the negative pressure air generated by the straw 9 cannot be used to adsorb the bottom of the chip through the suction hole 10. That is, the internal negative pressure of the straw 9 cannot be transmitted to the inside of the suction hole 10, and the suction hole 10 cannot generate negative pressure to continue adsorbing the chip. This facilitates the gripping of the top of the chip by the suction cup 12. It should be noted that the chip will not completely cover all the suction holes 10 (e.g., ...). Figure 8As shown, a few adsorption holes 10 are exposed. Under normal adsorption conditions, the adsorption holes 10 covered by the chip are sufficient to meet the requirements for chip adsorption. When the isolation plate 13 blocks the internal channel of the straw 9, the adsorption holes 10 not covered by the chip can discharge or discharge air, so that the air pressure inside the straw 9 and above the isolation plate 13 is equal to the external air pressure. When the isolation plate 13 moves towards the straw 9, the isolation plate 13 will also cooperate with the straw 9 to squeeze the spring 30, causing the spring 30 to deform and generate elastic potential energy. After the isolation plate 13 completely seals the internal channel of the straw 9, the piston tube 18 is still in the downward state. As the piston tube 18 moves downward, its inner top will continuously approach the piston plate 21. The piston plate 21 will squeeze the air inside the piston tube 18. The air inside the piston tube 18 will then be discharged through the air pipe 22. Since the opening of the air pipe 22 is located at the chip location, Air discharged from the air tube 22 blows onto the chip surface to remove dust. When the piston tube 18 moves downward, it works with the piston plate 21 to compress the spring 23, causing the spring 23 to deform and generate elastic potential energy. After the suction cup 12 grabs the chip, the robotic arm 11 moves the suction cup 12 upward, and the spring 23 releases its elastic potential energy, pushing the piston plate 21 downward and returning it to its initial position along the inside of the piston tube 18. After the piston rod 20 releases its pressure on the buffer plate 24, the spring 26 releases its elastic potential energy, thereby pushing the buffer plate 24 upward to reset. The upward movement of the buffer plate 24 will drive the pressure rod 27 upward to reset, releasing the pressure on the triangular block 28. The spring 30 releases its elastic potential energy, thereby pushing the isolation plate 13 to move in the opposite direction and reset. The reset of the isolation plate 13 will drive the triangular block 28 to reset, facilitating the next pressure operation of the pressure rod 27 on the triangular block 28.
[0033] The above-described embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.
Claims
1. A chip testing device, comprising a motor (2) installed inside a processing table (1), a turntable (3) being drivenly connected to the output end of the motor (2), a connecting frame (4) being installed on the top of the processing table (1), two sets of guide rods (6) being fixedly connected to the outside of the connecting frame (4), a horizontal plate (7) being slidably connected to the outside of the guide rods (6), and a tester (8) being fixedly connected inside the horizontal plate (7), characterized in that, Also includes: At least four sets of straws (9) are fixed inside the turntable (3). Hollow recesses are fixed to the outside of the straws (9). Multiple sets of adsorption holes (10) are opened at the top of the straws (9). An adsorption mechanism for adsorbing chips is provided around the straws (9). A robotic arm (11) is installed on the top of the processing table (1). A suction cup (12) is installed at the output end of the robotic arm (11). A dust removal mechanism for blowing away impurities on the chip surface is provided around the suction cup (12). A buffer mechanism is used to reduce the impact force generated when the dust removal mechanism moves downward; The isolation plate (13) is slidably connected inside the hollow recess. A closing mechanism is provided around the isolation plate (13) to buffer the operation of the mechanism, thereby blocking the internal channel of the suction tube (9) and releasing the adsorption mechanism from the chip.
2. The chip testing equipment according to claim 1, characterized in that, The adsorption mechanism includes a vacuum pump (14), a transmission pipe (15), a concave plate (16), and a connecting ring plate (17). The vacuum pump (14) is installed at the top of the processing table (1). The transmission pipe (15) is fixedly connected to the output end of the vacuum pump (14). The end of the transmission pipe (15) away from the vacuum pump (14) is fixedly connected to the inside of the concave plate (16). The concave plate (16) is fixedly connected to the top of the processing table (1). The connecting ring plate (17) is rotatably connected to the inner wall of the concave plate (16), and the inside of the connecting ring plate (17) is fixedly connected to the outside of the suction tube (9).
3. The chip testing equipment according to claim 1, characterized in that, The dust removal mechanism includes a piston tube (18), a support frame (19), a piston rod (20), a piston plate (21), an air pipe (22), and a spring (23). The piston tube (18) is located on the outside of the suction cup (12). The support frame (19) is fixed between the piston tube (18) and the suction cup (12). The piston rod (20) is fixed to the bottom end of the piston plate (21). The piston plate (21) is slidably connected to the inner wall of the piston tube (18). The air pipe (22) is fixed inside the piston tube (18). The air pipe (22) and the interior of the piston tube (18) are connected. The spring (23) is fixed between the inner wall of the piston tube (18) and the piston plate (21).
4. The chip testing equipment according to claim 3, characterized in that, The buffer mechanism includes a buffer plate (24), two sets of guide rods (25), a spring (26), and a pressure rod (27). The two sets of guide rods (25) are fixed to the top of the turntable (3), and the two sets of guide rods (25) slide through both ends of the buffer plate (24). The spring (26) is sleeved on the outside of the guide rods (25), and the spring (26) is fixed between the turntable (3) and the buffer plate (24). The pressure rod (27) is fixed to the bottom of the buffer plate (24).
5. The chip testing equipment according to claim 4, characterized in that, The closing mechanism includes a triangular block (28), two sets of guide rods (29) and a spring (30). The triangular block (28) is located at the bottom of the pressure rod (27) and is fixed to the end of the isolation plate (13) away from the straw (9). Both sets of guide rods (29) are fixed to the outside of the straw (9) and slide through the isolation plate (13). The isolation plate (13) is L-shaped. The spring (30) is fixed between the straw (9) and the isolation plate (13).
6. The chip testing equipment according to claim 5, characterized in that, The elastic potential energy of spring one (23) is greater than the sum of the elastic potential energies of the two sets of spring two (26) and spring three (30).
7. The chip testing equipment according to claim 1, characterized in that, Four sets of connecting rods (31) are fixed to the top of the turntable (3). A trapezoidal block (32) is fixed to the end of each of the four sets of connecting rods (31) away from the turntable (3). A linkage mechanism that cooperates with the trapezoidal block (32) is provided on the outside of the horizontal plate (7). The linkage mechanism is used to drive the tester (8) to move down and fit the chip when the chip arrives below the tester (8).
8. The chip testing equipment according to claim 7, characterized in that, The linkage mechanism includes a connecting ball (33), a side rod (34), and two sets of springs (35). The connecting ball (33) is attached to the bottom end of the trapezoidal block (32). The side rod (34) is fixed between the connecting ball (33) and the horizontal plate (7). The two sets of springs (35) are respectively sleeved on the outside of the two sets of guide rods (6). The springs (35) are fixed between the horizontal plate (7) and the connecting frame (4).
9. A chip testing device according to claim 5, characterized in that, Both the pressure bar (27) and the triangular block (28) are made of polyoxymethylene.
10. A chip testing method, applied to the chip testing equipment according to any one of claims 1-9, characterized in that, The method includes the following steps: S1. Place the chip evenly on the turntable (3) and start the motor (2) to drive the turntable (3) to rotate. The rotation of the turntable (3) will drive the chip to move. S2. When the chip moves to the bottom of the tester (8), the turntable (3) drives the trapezoidal block (32) to squeeze the linkage mechanism through the connecting rod (31); S3. The linkage mechanism is driven by force to move the tester (8) down, so that the tester (8) is in contact with the chip, a specific electrical signal is applied to the chip, and its output response is monitored, so as to determine whether the chip has defects and whether its performance meets the standards.