Heat dissipation mechanism
By using a modular heat dissipation mechanism that utilizes vapor chambers, pillars, capillary structures, and phase change cycles of fins, the problem of adapting laptop cooling mechanisms to different models and requirements has been solved, achieving efficient heat dissipation and ease of manufacturing.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- ASUSTEK COMPUTER INC
- Filing Date
- 2024-11-12
- Publication Date
- 2026-05-12
AI Technical Summary
Existing laptop cooling systems are ill-suited to different models and cooling requirements, leading to increased manufacturing and design costs.
It adopts a modular heat dissipation mechanism, including a heat spreader, columns, capillary structure, working fluid and fins, and achieves efficient heat dissipation through phase change cycle. The number and size of columns and fins can be adjusted according to requirements.
It enables flexible adaptation to different laptop models and heat dissipation requirements, and improves the design and manufacturing convenience and applicability of the heat dissipation mechanism.
Smart Images
Figure CN122018653A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to a heat dissipation mechanism. Background Technology
[0002] Electronic devices generate a significant amount of heat during operation. If this heat cannot be effectively dissipated, internal electronic components may overheat, leading to malfunctions or crashes. Therefore, electronic devices are typically equipped with appropriate cooling systems to ensure that components operate within their default temperature range.
[0003] Taking laptops as an example, they are equipped with a cooling system consisting of heat pipes, fans, and heat sinks. However, with the rapid development of technology, the product update rate of laptops is also increasing. Every year, there are numerous models designed for different needs, which means that the cooling systems within these models also need to be adjusted according to the specific model or requirements. This can easily increase the burden and cost of manufacturing the cooling system.
[0004] Therefore, how to provide a modular heat dissipation mechanism to facilitate manufacturing and meet the different models and requirements mentioned above is a problem that relevant technical personnel need to consider and solve. Summary of the Invention
[0005] This invention relates to a heat dissipation mechanism suitable for laptops. The heat dissipation mechanism provides modular components, allowing it to be adjusted to suit different models or needs.
[0006] According to an embodiment of the present invention, a heat dissipation mechanism is suitable for a laptop computer, the laptop computer including at least one heat source, and the heat dissipation mechanism including a vapor chamber, a plurality of pillars, capillary structures, a working fluid, a plurality of first fins, and at least one fan. The vapor chamber has opposing first and second surfaces, forming a first chamber between the first and second surfaces. The second surface is in thermal contact with the heat source. The pillars are formed by projecting outwards from the second surface. Each pillar has a second chamber, which communicates with the first chamber and forms a closed cavity with the first chamber. The capillary structures are disposed on the inner walls of the first and second chambers. The working fluid fills the first and second chambers. The first fins are located on the second surface and are stacked on top of each other on the pillars, each first fin surrounding at least a portion of the pillar. The fan is disposed within the laptop computer and has at least one air outlet facing the first fins.
[0007] Based on the above, in the heat dissipation mechanism of the laptop computer in this case, a basic structure is formed by a vapor chamber with a first chamber and multiple pillars with a second chamber. The second surface of the vapor chamber is used for thermal contact with the heat source of the laptop computer, and multiple first fins are respectively fitted onto the pillars located on the second surface. Then, capillary structures are arranged on the inner wall surfaces of the vapor chamber and the inner wall surfaces of the pillars, and working fluid is filled in them. In this way, the capillary structure can extend from the first chamber to the second chamber, which means that the working fluid in the first chamber can absorb heat from the heat source and change from liquid to vapor. It is then transferred from the first chamber to the second chamber, and gradually dissipated by the fan airflow due to the stacked first fins on the outside of the pillars. It then changes from vapor to liquid in the second chamber, so as to flow back to the first chamber along the capillary structure.
[0008] Based on the above, since the second chamber stands on top of the first chamber like a chimney, it is conducive to the transmission of the working fluid in a gaseous state. When the working fluid in a liquid state flows back to the first chamber of the heat exchange plate along the capillary structure, the working fluid forms a heat dissipation cycle between the heat exchange plate and the column due to the phase change, so as to achieve the effect of heat dissipation of the heat source.
[0009] Furthermore, since the first fins are mounted on the pillars in a nested manner, the size and number of the pillars, as well as the size and number of the first fins, can be increased or decreased according to heat dissipation requirements. Simply put, when heat dissipation requirements increase, using more or longer pillars and first fins can correspondingly improve heat dissipation capacity. In this way, the modular structure formed by the pillars and fins can effectively accommodate different laptop models and different heat dissipation needs, and can meet these needs with simple additions and subtractions, thereby improving the convenience and applicability of laptop cooling mechanisms in design and manufacturing. Attached Figure Description
[0010] Figure 1 This is a schematic diagram of some components of a laptop computer according to an embodiment of this case;
[0011] Figure 2 yes Figure 1 Exploded view of the heat dissipation mechanism;
[0012] Figure 3 This is a partial cross-sectional view of the heat dissipation mechanism;
[0013] Figure 4 It corresponds Figure 3 A cross-sectional view of a specific part;
[0014] Figure 5 This is a cross-sectional view of the heat dissipation mechanism from another perspective;
[0015] Figure 6This is an exploded view of the column and fins in another embodiment of this case;
[0016] Figure 7 This is a top view of the heat dissipation mechanism;
[0017] Figure 8 This is a top view of the heat dissipation mechanism according to another embodiment of this case. Detailed Implementation
[0018] Reference will now be made in detail to exemplary embodiments of the invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same component reference numerals are used in the drawings and description to denote the same or similar parts.
[0019] Figure 1 This is a schematic diagram of some components of a laptop computer according to an embodiment of this case. Cartesian coordinates XYZ are provided herein to facilitate component description. Please refer to... Figure 1 In this embodiment, the laptop computer 10 includes a casing 11 and an electronic board 200 and a heat dissipation mechanism 100 disposed within the casing 11. The electronic board 200 is, for example, a motherboard, on which heat sources 210 and 220 are disposed, such as a central processing unit and a display chip. The heat dissipation mechanism 100 includes a vapor chamber 110, multiple pillars 120, multiple first fins 150, and at least one fan (taking two fans, namely a first fan 161 and a second fan 162, as an example). The vapor chamber 110 is a closed cavity with opposing first surfaces S1 and second surfaces S2, and the second surface S2 is in thermal contact with the heat sources 210 and 220. The pillars 120 are respectively erected on the second surface S2 of the vapor chamber 110, and the first fins 150 are sleeved on the pillars 120. In another embodiment, both the first surface S1 and the second surface S2 are in thermal contact with the heat sources, but this embodiment is not limited to this.
[0020] like Figure 1 As shown, in this embodiment, the columns 120 are arranged along the X-axis on one side of the heat spreader 110. Taking the columns 120 and the first fin 150 as reference points, the first fan 161 and the second fan 162 are located on the same side of the columns 120 and the first fin 150, and are opposite to the heat dissipation holes 11a of the housing 11, separated by the columns 120 and the first fin 150. The first fan 161 and the second fan 162 generate airflow that flows out from the first air outlet 161a and the second air outlet 162a, respectively, and blows towards the columns 120 and the first fin 150, and then exits the housing 11 through the heat dissipation holes 11a to dissipate heat from the columns 120 and the first fin 150.
[0021] Figure 2 yes Figure 1 Exploded view of the heat dissipation mechanism. Figure 3 This is a partial cross-sectional view of the heat dissipation mechanism. Figure 4 It corresponds Figure 3A cross-sectional view of a specific section. Please also refer to... Figures 2 to 4 In this embodiment, the heat spreader 110 is divided into an evaporation zone A1 and a condensation zone A2, wherein heat sources 210 and 220 (such as...) Figure 1 As shown, the electronic board 200 is secured to the vapor chamber A1 by screws 180 passing through the vapor chamber 110, while the column 120 and the first fin 150 are located in the condensation zone A2. The first fan 161 and the second fan 162 are arranged along the X-axis on opposite sides of the vapor chamber A1 of the vapor chamber 110 (so that the heat sources 210 and 220 are substantially located between the first fan 161 and the second fan 162), and the first fan 161 and the second fan 162 are, for example, centrifugal fans, which draw in air axially (Z-axis) and generate airflow that is blown out from the first air outlet 161a and the second air outlet 162a towards the condensation zone A2. Figure 2 and Figure 3 As shown, the first fin 150 is parallel to the heat spreader 110 and parallel to the airflow direction (e.g., Figure 3 (The arrow shown is wide), therefore, as Figure 3 As shown, the airflow blown out from the second air outlet 162a can smoothly pass through the channel 151 formed by the first fin 150 and be blown out from the first fin 150. Furthermore, the heat dissipation mechanism 100 also includes a second fin group 170, which is disposed on the first surface S1 of the heat spreader 110. The first fin 150 and the second fin group 170 are located on opposite surfaces of the heat spreader 110. Here, the plurality of second fins of the second fin group 170 are perpendicular to the heat spreader 110, but what remains unchanged is that these second fins of the second fin group 170 are still parallel to the direction of airflow, so as to facilitate the airflow blown out from the second fan 162 to pass through the channel 171 of the second fin group 170 and be blown out.
[0022] Figure 4 It corresponds Figure 3 A specific local cross-sectional view, which is equivalent to a frontal view from the Y-axis. Figure 3 The components shown. Figure 5 This is a cross-sectional view of the heat dissipation mechanism from another perspective, which is equivalent to viewing it from the X-axis. Figure 1 The heat dissipation mechanism is 100. Please also refer to... Figure 2 , Figure 4 and Figure 5In this embodiment, the heat exchange plate 110 has a first chamber 111 formed between the first surface S1 and the second surface S2, and each column 120 has a second chamber 121, with each of the second chambers 121 communicating with the first chamber 111. The heat dissipation mechanism 100 also includes a capillary structure 130 and a working fluid 140, wherein the capillary structure 130 is continuously arranged along the inner wall surface of the heat exchange plate 110 and the inner wall surface of the column 120, and the working fluid 140 fills the first chamber 111 and the second chamber 121. Accordingly, the liquid working fluid 142 absorbs heat from the heat sources 210 and 220 in the evaporation zone A1 of the heat exchange plate 110, undergoes a phase change and is converted into a vaporized working fluid 141, which is then transported to the condensation zone A2 where the column 120 and the first fin 150 are provided. Because the airflow from the first fan 161 and the second fan 162 dissipates heat from the first fin 150, the working fluid 141 flowing to the condensation zone A2 gradually cools and transforms into a liquid working fluid 142 in the second chamber 121, and is then transported back to the evaporation zone A1 via the capillary structure 130 to form a complete phase change cycle. Here, the vapor chamber 110, the column 120, the capillary structure 130, and the working fluids 140 (141, 142) constitute an integrated vapor chamber structure VC, that is, the first chamber 111 and the second chamber 121 form a closed cavity, so as to achieve the effect of dissipating heat from the heat sources 210 and 220 through the phase change of the working fluid 140.
[0023] Figure 6 This is an exploded view of the column and fins according to another embodiment of this case. Please refer to... Figure 6 And compare Figure 2 or Figure 3 In this embodiment, each first fin 150 and first fin 150A is substantially at least a portion surrounding the pillar 120, and these first fins 150 and first fin 150A are divided into multiple first fin groups, and each first fin group is fitted with at least one pillar 120. Figure 2 or Figure 3 As shown, the first fin group, distinguished by the first fin 150, is fitted onto the two pillars 120, while Figure 6 The first fin assembly formed by the first fin 150A shown is fitted onto only one pillar 120. There is no limitation on the number of pillars 120 that the first fin 150 or first fin 150A needs to be fitted onto; the first fins 150 and first fin 150A can be modularized according to requirements, but there is no limitation on the number of each modularized first fin 150 or first fin 150A and the number of pillars 120 they are fitted onto. For example, when it is necessary to improve heat dissipation efficiency, it can be done as follows: Figure 6 As shown, each column 120 is fitted with a set of first fins 150A. Conversely... Figure 2 or Figure 3If it is necessary to simplify the assembly process of the first fin 150 and the column 120 or if excessive heat dissipation is not required, multiple (two or more) columns 120 can be nested within the first fin group formed by the first fin 150. Here, the connection between the first fin 150, the first fin 150A and the column 120, and the connection between the column 120 and the heat spreader 110 can be achieved by welding.
[0024] Figure 7 This is a top view of the heat dissipation mechanism. Please refer to it. Figure 7 And compare Figure 1 or Figure 2 In this embodiment, in addition to achieving the required heat dissipation effect by having their first air outlet 161a and second air outlet 162a directly facing a portion of the first fin 150 and the column 120, the first fan 161 and the second fan 162, in order to accommodate the configuration of other system components within the laptop 10 and the heat that may accumulate therein, in this embodiment, the column 120 and the first fin 150 are arranged along the X-axis to facilitate the corresponding heat dissipation holes 11a of the casing 11 (e.g., ...). Figure 1 Therefore, in this embodiment, there are also pillars 120 and first fins 150 that are not directly opposite the first fan 161 and the second fan 162. Furthermore, the first fan 161 and the second fan 162 also have a first auxiliary air outlet 161b and a second auxiliary air outlet 162b, which are opposite each other separated by heat sources 210 and 220, and both face the evaporation area A1 of the heat spreader 110. In this way, part of the airflow from the first fan 161 and the second fan 162 will be blown from the first auxiliary air outlet 161b and the second auxiliary air outlet 162b to the evaporation area A1 and the heat sources 210 and 220 thereon, and then accumulate in the casing 11 and blown in the positive Y-axis direction toward the aforementioned pillar 120 and first fins 150 that are not directly opposite the first fan 161 and the second fan 162, and discharged from the casing 11 through the heat dissipation hole 11a. Simultaneously, these airflows can further dissipate heat from the columns 120 and the first fins 150 that are not directly opposite the first fan 161 and the second fan 162. For example... Figure 1 and Figure 7 As shown, the first fins 150 located in the middle section, not directly facing the first fan 161 and the second fan 162, have a shorter dimension along the Y-axis and do not completely surround the column 120. They can further aid in heat conduction by contacting the longer first fins 150. In this way, additional heat dissipation pathways are provided for the interior of the laptop 10.
[0025] Figure 8 This is a top view of a heat dissipation mechanism according to another embodiment of this case. Please refer to... Figure 8Unlike the previous embodiments, the heat dissipation mechanism of this embodiment includes a first fan 161, a second fan 162, and a third fan 163, which are respectively disposed on three different side edges of the evaporation zone A1 adjacent to the heat spreader 110. The first fan 161 and the second fan 162 have the same structural features and configuration as in the previous embodiments, and will not be described again here. The third fan 163 in this embodiment only has a third air outlet 163a (without a secondary air outlet), facing the evaporation zone A1 and the condensation zone A2, and is opposite to the condensation zone A2 across the evaporation zone A1. Here, the third fan 163 can provide an auxiliary effect to the airflow of the first fan 161 and the second fan 162, that is, actively driving the airflow blown from the first secondary air outlet 161b and the second secondary air outlet 162b toward the evaporation zone A1 and the heat sources 210 and 220 to the column 120 and the first fin 150 located in the middle section, and at the same time, it can also increase the heat dissipation efficiency of the evaporation zone A1 and the heat sources 210 and 220 thereon.
[0026] In summary, in the above embodiments of this case, the column with the second chamber is vertically disposed on the heat spreader plate with the first chamber, and the first chamber and the second chamber are interconnected and continuously formed on the inner wall of the heat spreader plate and the inner wall of the column in a capillary structure. Then, the first chamber and the second chamber are filled with a working fluid that can undergo a phase change in response to temperature. In this way, when a heat source comes into contact with the heat spreader plate, the working fluid inside can absorb heat from the heat source and change phase to a vapor state. Then, when the working fluid reaches the condensation zone, due to the airflow on the column and the first fin, the working fluid in the condensation zone will dissipate heat and change phase to a liquid state, and return to the condensation zone along the capillary structure, thereby forming a phase change cycle of the working fluid.
[0027] Since the second chamber stands above the first chamber like a chimney, it facilitates the transport of the working fluid, which is in a gaseous state due to heat absorption. Combined with the working fluid, which is in a liquid state, flowing back to the first chamber of the heat spreader along the capillary structure, the working fluid forms a heat dissipation cycle between the heat spreader and the column due to the phase change, thereby achieving the effect of heat dissipation from the heat source.
[0028] Furthermore, since the fins are mounted on the pillars in a nested manner, the size and number of the pillars, as well as the size and number of the first fins, can be adjusted to meet different heat dissipation requirements without the need for redeveloping and manufacturing new molds. Simply put, when heat dissipation demands increase, using more or longer pillars and first fins can correspondingly improve heat dissipation capacity. In this way, the modular structure formed by the pillars and first fins can effectively accommodate different laptop models and different heat dissipation requirements, and these requirements can be met through simple additions and subtractions, thus improving the design and manufacturing convenience and applicability of laptop cooling systems.
[0029] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.
Claims
1. A heat dissipation mechanism, characterized in that, Suitable for laptop computers, the laptop computer includes at least one heat source, the heat dissipation mechanism includes: A heat spreader has a first side and a second side facing each other, a first chamber is formed between the first side and the second side, and the second side is adapted to contact the at least one heat source; Multiple columns are formed by protruding outward from the second surface, each column having a second chamber, and the second chambers are respectively connected to the first chamber and together with the first chamber form a closed cavity; Capillary structures are disposed on the walls of the first chamber and the second chamber; Working fluid is filled in the first chamber and the second chamber; A plurality of first fins are located on the second surface and are stacked on top of each other on the plurality of pillars, each first fin surrounding at least a portion of the pillar; and At least one fan is configured inside the laptop, the fan having at least one air outlet facing the plurality of first fins.
2. The heat dissipation mechanism according to claim 1, characterized in that, The plurality of first fins are parallel to the heat spreader.
3. The heat dissipation mechanism according to claim 1, characterized in that, The plurality of columns are arranged axially in the condensation zone of the heat spreader, the at least one heat source is in contact with the evaporation zone of the heat spreader, and the at least one fan is located next to the evaporation zone of the heat spreader with the fan's outlet facing the condensation zone.
4. The heat dissipation mechanism according to claim 3, characterized in that, The number of the at least one fan is two, located next to the evaporation zone of the heat spreader, and the at least one heat source is located between the two fans.
5. The heat dissipation mechanism according to claim 4, characterized in that, Each of the two fans has a secondary air outlet, which is opposite to each other and both face the evaporation zone of the heat spreader.
6. The heat dissipation mechanism according to claim 1, characterized in that, The plurality of first fins are divided into a plurality of first fin groups, and each first fin group is fitted with at least one of the columns.
7. The heat dissipation mechanism according to claim 1, characterized in that, It also includes a second fin group disposed on the first surface of the heat exchange plate, wherein the plurality of first fins and the second fin group are located on opposite surfaces of the heat exchange plate.
8. The heat dissipation mechanism according to claim 7, characterized in that, The second fins of the second fin group are perpendicular to the heat exchange plate.
9. The heat dissipation mechanism according to claim 1, characterized in that, The at least one fan includes a first fan, a second fan, and a third fan, which are respectively adjacent to three different side edges of the evaporation zone of the heat spreader. The first fan has a first air outlet and a first secondary air outlet, the second fan has a second air outlet and a second secondary air outlet, and the third fan has a third air outlet. The first air outlet and the second air outlet each face the condensation zone of the heat spreader. The first secondary air outlet and the second secondary air outlet are opposite to each other across the heat spreader and the heat source on it. The third air outlet faces the evaporation zone and the condensation zone, and is opposite to the condensation zone across the evaporation zone.