Integrated copper alloy radiator with air cooling cooperating with vapor chamber and preparation method of integrated copper alloy radiator

Abstract

The invention discloses an integrated copper alloy radiator with air cooling cooperating with a vapor chamber and a preparation method of the integrated copper alloy radiator. The radiator comprises a vapor chamber base body, a capillary structure arranged in the vapor chamber base body and an air cooling assembly arranged on the lower bottom face of the vapor chamber base body. A vacuum cavity is formed in the vapor chamber base body, and a liquid injection pipe communicated with the vacuum cavity is arranged at the end of the vapor chamber base body. The capillary structure is arranged at the inner top of the vacuum cavity. The air cooling assembly comprises an air guide cover arranged on the lower bottom face of the vapor chamber base body and air cooling fins arranged in the air guide cover. The vapor chamber base body, the capillary structure and the air cooling assembly are of an integrated structure formed by metallurgical bonding, the contact thermal resistance between the base and the fins and between the vapor chamber and the base in a traditional radiator is thoroughly eliminated, the shortest and most smooth heat conduction path from a heat source to air is achieved, and the heat dissipation effect of the radiator is improved.

Description

Technical Field

[0001] This invention relates to the field of radiator technology, specifically to an integrated copper alloy radiator with air-cooled heat exchange plate and its preparation method. Background Technology

[0002] With the rapid development of high-performance computing chips and high-power-density semiconductor devices, their heat flux density has approached or even exceeded the limits of traditional heat dissipation technologies. Current mainstream heat dissipation solutions, such as copper-base heat pipe finned radiators or traditional vapor chamber air coolers, are typically assembled from multiple components (base, heat pipes / vapor chamber, fins) through welding, riveting, or through-fin processes. These processes inevitably introduce contact thermal resistance, becoming a bottleneck in the heat dissipation chain. Simultaneously, constrained by traditional processing techniques (such as extrusion, stamping, and brazing), the design freedom of the radiator's geometry (especially the internal capillary structure and external three-dimensional airflow channels) is low, making it difficult to achieve optimal matching with heat source distribution and airflow field.

[0003] 3D printing technology has made it possible to manufacture complex three-dimensional structures, but current research focuses on aluminum, stainless steel or simple conformal cooling channels, failing to fully realize the potential of 3D printing in high thermal conductivity materials, irregularly shaped vacuum cavities, and simultaneous topology optimization of internal and external structures.

[0004] Therefore, there is an urgent need for an integrated heat dissipation solution that can completely eliminate interfacial thermal resistance, minimize the heat transfer path, and be customized and efficiently designed according to the heat dissipation scenario. Summary of the Invention

[0005] To address the aforementioned technical problems, this invention provides an integrated copper alloy radiator with air-cooled heat spreader and its preparation method.

[0006] The technical solution of this invention is as follows: an integrated copper alloy heat sink with air cooling and heat spreader, comprising a heat spreader substrate, capillary structures and air cooling fins disposed inside the heat spreader substrate; a vacuum cavity is disposed inside the heat spreader substrate; a liquid injection pipe communicating with the inside of the vacuum cavity is disposed at the end of the heat spreader substrate; wherein, the heat spreader substrate is 70mm long, 21mm wide, and 7.7mm high; the vacuum cavity is 0.65mm high; and the inner diameter of the liquid injection pipe is 2.5mm. Several capillary structures are provided, and each capillary structure is equidistantly distributed at the top of the vacuum cavity along the length of the vacuum cavity. The capillary structure is a three-dimensional porous network structure. The air-cooled assembly includes an air guide shroud located on the bottom surface of the heat spreader substrate and several air-cooled fins evenly distributed inside the air guide shroud. The air-cooled fins are wavy.

[0007] Furthermore, the air-cooled fins include several first heat dissipation fins and second heat dissipation fins; the first heat dissipation fins and second heat dissipation fins have the same structure, with a first heat dissipation channel provided on the first heat dissipation fins and a second heat dissipation channel provided on the second heat dissipation fins; the first heat dissipation fins and second heat dissipation fins are arranged alternately, and the first heat dissipation channels and second heat dissipation channels are interlaced; wherein, the length of the first heat dissipation fins and the second heat dissipation fins is 70mm, the width is 1.6mm, and the wall thickness is 2.85mm; Explanation: Outside air first enters the first heat dissipation channel on the first heat dissipation fin, and then is diverted through the second heat dissipation channel on the second heat dissipation fin, realizing heat exchange between the outside air and the heat transferred by the phase change working fluid. At the same time, since the first and second heat dissipation channels are intertwined, the heat exchange time between the outside air and the air-cooled fins is prolonged, the heat exchange contact surface between the outside air and the air-cooled fins is increased, and the heat exchange efficiency of the radiator is improved.

[0008] Furthermore, a guide plate is provided at the bottom of the vacuum chamber, and several guide plates are equidistantly distributed along the length of the vacuum chamber; each guide plate has several inverted U-shaped protrusions equidistantly distributed. Explanation: The inverted U-shaped protrusions on the guide plate can guide the flow of the phase change working fluid, which helps to improve the smoothness of the flow.

[0009] Furthermore, the inverted U-shaped protrusions on adjacent guide vanes are staggered; Note: The above settings help to extend the flow path of the phase change working fluid and improve its heat transfer effect.

[0010] Furthermore, each inverted U-shaped protrusion is provided with a flow guide hole; Explanation: By setting flow guide holes, the phase change working fluid can flow in different directions inside the vacuum chamber, which helps to improve the temperature uniformity of the phase change working fluid in various regions inside the vacuum chamber.

[0011] Furthermore, the height difference between the inverted U-shaped protrusions on two adjacent guide plates is 1~3mm; Note: By setting inverted U-shaped protrusions of different heights, it is beneficial to reduce the temperature difference between different areas inside the vacuum chamber and avoid overheating in local areas of the heat spreader substrate.

[0012] Furthermore, the heat spreader substrate, capillary structure, and air-cooled fins are all made of copper alloy material, and the copper alloy material adopts spherical powder suitable for laser powder bed melting process, and its composition is one of Cu, CuCr, CuCrZr, and CuCrNb, with a thermal conductivity of 350~400W / m·K. Note: The heat spreader substrate, capillary structure, and air-cooling fins made of copper alloy have good thermal conductivity. Moreover, the heat spreader substrate, capillary structure, and air-cooling fins are integrally formed by 3D printing technology, which reduces the contact thermal resistance at the connection points of various components.

[0013] This invention also provides a method for preparing an integrated copper alloy heat sink with air-cooled heat exchange plate, comprising the following steps: S1: Construct an integrated 3D digital model of the radiator and perform pre-processing for printing; S2: A laser powder bed melting process is used to melt copper alloy powder under a protective atmosphere and print it layer by layer to obtain a heat sink blank with an unsealed vacuum cavity; the heat sink blank includes a heat spreader substrate, capillary structure and air cooling components; S3: After printing, the heat sink blank is removed from the substrate using a wire cutting device, and the heat sink blank is then cleaned and dried. S4: Vacuum the vacuum chamber through the injection pipe to achieve a vacuum level of 0.3~0.5Pa; then inject the phase change working fluid into the vacuum chamber through the injection pipe. S5: Use a resistance welding machine to seal the injection pipe.

[0014] Furthermore, in step S2, the laser power of the laser powder bed melting process is 360~420W, the scanning speed is 600~700mm / s, and the powder layer thickness is 25~35μm.

[0015] Furthermore, in step S4, the phase change working fluid is a fluid, preferably ultrapure water.

[0016] The working principle of the heat sink of the present invention is as follows: In this system, a computer chip is fixed to the upper surface of a heat spreader substrate. The heat generated during the chip's operation is transferred to the vacuum chamber. Inside the vacuum chamber, a phase change medium undergoes evaporation and condensation under capillary action when heated. This phase change medium then transfers the heat from the computer chip to the air-cooling fins. An external cooling fan blows air into the air-cooling channels. Outside air first enters the first cooling channel on the first heat dissipation fin and is then diverted through the second cooling channel on the second heat dissipation fin, achieving heat exchange between the outside air and the heat transferred by the phase change medium. Simultaneously, the interlacing of the first and second cooling channels obstructs the flow of outside air through the air-cooling fins, prolonging the heat exchange time and increasing the contact area between the outside air and the air-cooling fins, thereby improving the heat exchange efficiency of the radiator.

[0017] Compared with the prior art, the beneficial effects of the present invention are reflected in the following aspects: First, the heat exchanger of the present invention has a metallurgically integrated structure consisting of a heat exchange plate substrate, capillary structure and air-cooling component, which completely eliminates the contact thermal resistance between the base and fins and between the heat exchange plate and the base in traditional heat exchangers, and realizes the shortest and smoothest heat conduction path from the heat source to the air. Secondly, this invention significantly improves the circulation capability of phase change working fluid through 3D printed capillary structures. The freely designable three-dimensional air duct perfectly matches the fan airflow, maximizing the convective heat transfer coefficient. The internal and external systems work together to achieve a unified high-efficiency heat dissipation and high-efficiency heat equalization. Third, this invention has extreme design freedom and customization capabilities, enabling the creation of irregularly shaped cavities, non-uniform fins, and complex internal flow channels that cannot be processed by traditional processes, truly achieving "tailor-made" solutions and providing optimal heat dissipation solutions for specific electronic devices.

[0018] Fourth, the preparation method of the present invention simplifies the manufacturing process of the radiator, reduces material waste and subsequent machining, and achieves lightweight design while ensuring strength through structural topology optimization. Attached Figure Description

[0019] Figure 1 This is a longitudinal sectional view of the heat sink of the present invention; Figure 2 This is a distribution diagram of the capillary structure, air-cooling component, and guide plate of the present invention inside the heat spreader substrate; Figure 3 This is a schematic diagram of the capillary structure of the present invention; Figure 4 This is a diagram showing the distribution of the capillary structure of the present invention inside the vacuum cavity; Figure 5 This is a schematic diagram of the structure of the air-cooled fins of the present invention; Figure 6 This is a diagram showing the positional relationship between the first heat dissipation fin and the second heat dissipation fin of the present invention; Figure 7 This is a diagram showing the distribution of the first and second heat dissipation fins of the present invention inside the air-cooling channel; Figure 8 This is a distribution diagram of the guide plate of the present invention inside the vacuum cavity; Figure 9 This is a schematic diagram of the structure of the guide plate of the present invention; Among them, 1-heat spreader substrate, 10-vacuum cavity, 11-liquid injection pipe, 2-capillary structure, 3-air-cooling component, 30-air guide shroud, 31-air-cooling fin, 310-first heat dissipation fin, 3100-first heat dissipation channel, 311-second heat dissipation fin, 3110-second heat dissipation channel, 4-flow guide plate, 40-inverted U-shaped protrusion, 41-flow guide hole. Detailed Implementation

[0020] Example 1 like Figure 1 , 2 The diagram shows an integrated copper alloy heat sink with a combined air-cooled and heat-spreading plate, comprising a heat-spreading plate substrate 1, a capillary structure 2 disposed inside the heat-spreading plate substrate 1, and an air-cooling assembly 3 disposed on the lower surface of the heat-spreading plate substrate 1; a vacuum chamber 10 is disposed inside the heat-spreading plate substrate 1, and a liquid injection pipe 11 communicating with the interior of the vacuum chamber 10 is disposed at the end of the heat-spreading plate substrate 1; wherein, the heat-spreading plate substrate 1 is 70mm long, 21mm wide, and 7.7mm high; the vacuum chamber 10 has a height of 0.65mm; the inner diameter of the liquid injection pipe 11 is 2.5mm; the heat-spreading plate substrate 1, the capillary structure 2, and the air-cooling assembly 3 are all made of copper alloy material, and the copper alloy material adopts spherical powder suitable for laser powder bed melting process, its composition is Cu, and its thermal conductivity is 380W / m·K; like Figure 3 , 4 As shown, there are 5 capillary structures 2. Each capillary structure 2 is equidistantly distributed at the top of the vacuum cavity 10 along the length direction of the vacuum cavity 10. The capillary structure 2 is a three-dimensional porous mesh structure. like Figure 2 , 7 As shown, the air-cooled assembly 3 includes an air guide shroud 30 disposed on the bottom surface of the heat spreader base 1 and four air-cooled fins 31 equidistantly distributed inside the air guide shroud 30. The air-cooled fins 31 are wavy.

[0021] Example 2 This embodiment describes a method for preparing an integrated copper alloy heat sink with a combined air-cooling and heat-spreading plate, based on the integrated copper alloy heat sink with a combined air-cooling and heat-spreading plate of Embodiment 1, including the following steps: S1: Construct an integrated 3D digital model of the radiator and perform pre-processing for printing; Specifically, during the modeling process, SolidWorks modeling software was used to draw a substrate that matches the heat source and to reserve mounting holes. The substrate is a solid structure. Then, a vacuum cavity 10 and a capillary structure 2 were designed inside the substrate, and an air-cooling component 3 was designed on the outside. The liquid injection tube 11 was directly generated on the model to ensure that all structures are single solids. All edges and corners of the solids were rounded with R0.5mm to prevent stress concentration during printing. After modeling, the structure was optimized through simulation. During the printing preprocessing, the model was first imported into Magics slicing software, and then defects such as broken surfaces, holes, and non-manifold edges were repaired. S2: A laser powder bed melting process is used to melt copper alloy powder under a protective atmosphere and print it layer by layer to obtain a heat sink blank with an unsealed vacuum cavity 10; the laser power of the laser powder bed melting process is 360W, the scanning speed is 600mm / s, and the powder layer thickness is 25μm; the heat sink blank includes a heat spreader substrate 1, a capillary structure 2, and an air-cooling component 3. S3: After printing, the heat sink blank is removed from the substrate using a wire cutting device, and the heat sink blank is then cleaned and dried. S4: Vacuum chamber 10 is evacuated through injection pipe 11 to achieve a vacuum level of 0.3 Pa inside vacuum chamber 10; then phase change working fluid is injected into vacuum chamber 10 through injection pipe 11; wherein, phase change working fluid is ultrapure water, and the injection amount of phase change working fluid is calculated based on the porosity of capillary structure 2. The porosity is calculated as follows: =1-πd 2 / 4P 2 ; P = 1 / mesh count; in: Porosity d: Diameter of the wire in the braided mesh; P: The pitch corresponding to the mesh count of the woven mesh; The method for calculating the injection volume is as follows: m= ×Vwick×p; in: m: Injection volume; Vwick: Total volume of capillary structure p: Density of the phase change working fluid; S5: The injection tube 11 is sealed using a resistance welding machine; the welding current of the resistance welding machine is 9KA and the welding time is 100ms.

[0022] Example 3 The difference between this embodiment and Embodiment 1 is that: like Figure 5 , 6 As shown, the air-cooled fin 31 includes a first heat dissipation fin 310 and two second heat dissipation fins 311; the first heat dissipation fin 310 and the second heat dissipation fin 311 have the same structure, and each has two of each; the first heat dissipation fin 310 is provided with a first heat dissipation channel 3100, and the second heat dissipation fin 311 is provided with a second heat dissipation channel 3110; the first heat dissipation fin 310 and the second heat dissipation fin 311 are arranged alternately, and the first heat dissipation channel 3100 and the second heat dissipation channel 3110 are interleaved; wherein, the length of the first heat dissipation fin 310 and the second heat dissipation fin 311 is 70mm, the width is 1.6mm, and the wall thickness is 2.85mm.

[0023] Example 4 The difference between this embodiment and Embodiment 3 is that: like Figure 2 , 8 As shown in Figure 9, a guide plate 4 is provided at the bottom of the vacuum chamber 10. Seven guide plates 4 are equidistantly distributed along the length of the vacuum chamber 10. Each guide plate 4 has several inverted U-shaped protrusions 40 equidistantly distributed. The inverted U-shaped protrusions 40 on two adjacent guide plates 4 are staggered. Each inverted U-shaped protrusion 40 is provided with a guide hole 41. The height difference between the inverted U-shaped protrusions 40 on two adjacent guide plates 4 is 1 mm. The heat spreader substrate 1, capillary structure 2 and air-cooled fins 3 are all made of copper alloy material. The copper alloy material adopts spherical powder suitable for laser powder bed melting process. Its composition is CuCr and its thermal conductivity is 360 W / m·K.

[0024] Example 5 This embodiment describes a method for preparing an integrated copper alloy heat sink with a combined air-cooling and heat-spreading plate, based on the integrated copper alloy heat sink with a combined air-cooling and heat-spreading plate of Embodiment 4, including the following steps: S1: Construct an integrated 3D digital model of the radiator and perform pre-processing for printing; Specifically, during the modeling process, SolidWorks modeling software was used to draw a substrate that matches the heat source and to reserve mounting holes. The substrate is a solid structure. Then, a vacuum cavity 10, a capillary structure 2, and a flow guide plate 4 were designed inside the substrate, and an air-cooling component 3 was designed on the outside. The liquid injection pipe 11 was directly generated on the model to ensure that all structures are single solids. All edges and corners of the solids were rounded with R0.5mm to prevent stress concentration during printing. After modeling, the structure was optimized through simulation. During the printing preprocessing, the model was first imported into Magics slicing software, and then defects such as broken surfaces, holes, and non-manifold edges were repaired. S2: A laser powder bed melting process is used to melt copper alloy powder under a protective atmosphere and print it layer by layer to obtain a heat sink blank with an unsealed vacuum cavity 10; the laser power of the laser powder bed melting process is 420W, the scanning speed is 700mm / s, and the powder layer thickness is 35μm; the heat sink blank includes a heat spreader substrate 1, a capillary structure 2, an air-cooling component 3, and a flow guide plate 4. S3: After printing, the heat sink blank is removed from the substrate using a wire cutting device, and the heat sink blank is then cleaned and dried. S4: Vacuum chamber 10 is evacuated through injection pipe 11 to achieve a vacuum level of 0.5 Pa inside vacuum chamber 10; then phase change working fluid is injected into vacuum chamber 10 through injection pipe 11; wherein, phase change working fluid is ultrapure water, and the injection amount of phase change working fluid is calculated based on the porosity of capillary structure 2. The porosity is calculated as follows: =1-πd 2 / 4P2 ; P = 1 / mesh count in: Porosity d: Diameter of the wire in the braided mesh; P: The pitch corresponding to the mesh count of the woven mesh; The method for calculating the injection volume is as follows: m= ×Vwick×p; in: m: Injection volume; Vwick: Total volume of capillary structure p: Density of the phase change working fluid; S5: The injection tube 11 is sealed using a resistance welding machine; the welding current of the resistance welding machine is 9KA and the welding time is 100ms.

Claims

1. An integrated copper alloy radiator with air-cooled and heat-spreading heat exchange plates, characterized in that, It includes a heat spreader substrate (1), a capillary structure (2) disposed inside the heat spreader substrate (1), and an air-cooling assembly (3) disposed on the bottom surface of the heat spreader substrate (1); a vacuum chamber (10) is disposed inside the heat spreader substrate (1); and a liquid injection pipe (11) communicating with the inside of the vacuum chamber (10) is disposed at the end of the heat spreader substrate (1). The capillary structure (2) is provided in several parts, and each capillary structure (2) is equidistantly distributed on the inner top of the vacuum cavity (10) along the length direction of the vacuum cavity (10), and the capillary structure (2) is a three-dimensional porous mesh structure. The air-cooled assembly (3) includes an air guide shroud (30) disposed on the bottom surface of the heat spreader base (1) and several air-cooled fins (31) equidistantly distributed inside the air guide shroud (30); the air-cooled fins (31) are wavy.

2. The integrated copper alloy radiator with air-cooled heat spreader according to claim 1, characterized in that, The air-cooled fins (31) include several first heat dissipation fins (310) and second heat dissipation fins (311); the first heat dissipation fins (310) and the second heat dissipation fins (311) have the same structure, the first heat dissipation fins (310) are provided with a first heat dissipation channel (3100), and the second heat dissipation fins (311) are provided with a second heat dissipation channel (3110); the first heat dissipation fins (310) and the second heat dissipation fins (311) are arranged at intervals, and the first heat dissipation channel (3100) and the second heat dissipation channel (3110) are interleaved.

3. The integrated copper alloy radiator with air-cooled heat spreader according to claim 1, characterized in that, The bottom of the vacuum cavity (10) is provided with a guide plate (4), and several guide plates (4) are equidistantly distributed along the length of the vacuum cavity (10); each guide plate (4) has several inverted U-shaped protrusions (40) equidistantly distributed.

4. The integrated copper alloy radiator with air-cooled heat exchange plate according to claim 3, characterized in that, The inverted U-shaped protrusions (40) on two adjacent guide plates (4) are interlocked.

5. The integrated copper alloy radiator with air-cooled heat exchange plate according to claim 3, characterized in that, Each of the inverted U-shaped protrusions (40) is provided with a flow guide hole (41).

6. The integrated copper alloy radiator with air-cooled heat spreader according to claim 3, characterized in that, The height difference between the inverted U-shaped protrusions (40) on two adjacent guide plates (4) is 1~3mm.

7. The integrated copper alloy radiator with air-cooled heat exchange plate according to claim 1, characterized in that, The heat spreader substrate (1), capillary structure (2) and air-cooling component (3) are all made of copper alloy material, and the copper alloy material is spherical powder suitable for laser powder bed melting process, and its composition is one of Cu, CuCr, CuCrZr and CuCrNb, and its thermal conductivity is 350~400W / m·K.

8. The method for preparing an integrated copper alloy heat sink with air-cooled heat exchange plate as described in claim 1, characterized in that, Includes the following steps: S1: Construct an integrated 3D digital model of the radiator and perform pre-processing for printing; S2: Using laser powder bed melting process, copper alloy powder is melted under protective atmosphere and printed layer by layer to obtain a heat sink blank with an unsealed vacuum cavity (10); the heat sink blank includes a heat spreader substrate (1), capillary structure (2) and air cooling component (3). S3: After printing, the heat sink blank is removed from the substrate using a wire cutting device, and the heat sink blank is then cleaned and dried. S4: Vacuum the vacuum chamber (10) through the injection pipe (11) to achieve a vacuum level of 0.3~0.5 Pa; then inject the phase change working fluid into the vacuum chamber (10) through the injection pipe (11); S5: The injection tube (11) is sealed using a resistance welding machine.

9. The integrated copper alloy radiator with air-cooled heat spreader according to claim 1, characterized in that, Each of the inverted U-shaped protrusions (40) is provided with a flow guide groove (41).

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